CA2241100A1 - Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production - Google Patents
Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production Download PDFInfo
- Publication number
- CA2241100A1 CA2241100A1 CA002241100A CA2241100A CA2241100A1 CA 2241100 A1 CA2241100 A1 CA 2241100A1 CA 002241100 A CA002241100 A CA 002241100A CA 2241100 A CA2241100 A CA 2241100A CA 2241100 A1 CA2241100 A1 CA 2241100A1
- Authority
- CA
- Canada
- Prior art keywords
- component
- metalization
- cover
- shielding
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02913—Measures for shielding against electromagnetic fields
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Abstract
An SW component with electrically conductive structures (3) on a substrate (1), sealed against environmental influences by a cap-like cover (2), on which there is a metallised coating (6) for r.f. screening.
Description
FI L E, ~ I r ~ r r ~ l R~!SLA ,~
Description Electrical component, in particular an SAW component operating with surface acoustic waves, as well as a method for its production The present invention relates to an electrical component, in particular an SAW component operating with surface acoustic waves as claimed in the preamble of patent claim 1, and to a method for its production.
The prior international Patent Application W0 95/30276 discloses encapsulation for electronic components having a cap which seals component structures on a substrate, in the case of which the cap is formed by a cover which is provided on the substrate and, in areas of the component structures, has recesses which accomodate them. Such encapsulation protects the component structures against environmental influences so that electronic components encapsulated in such a manner can be reused directly, possibly without any further casing.
If such components are fitted in a ceramic casing and the casing is sealed with glass solder for cost reasons, then this does not provide effective RF shielding since the cover is then composed of ceramic and there is no conductive connection to the cover. The situation with a plastic casing is analogous.
The SAW filter according to DE-A-3 138 743, which is enclosed in a metallic casing that is closed in a sealed manner on all sides, avoids the above disadvantages.
The present invention is based on the object of specifying an effective RF shielding for electronic components of the type under discussion.
REPLACEMENT SHEET
This object is achieved according to the invention in the case of an electronic component of the type mentioned initially by the feature in the descriptive part of patent claim 1.
A method for producing such an electrical component is specified in patent claims 4 and 5.
Developments both with respect to the electronic component and with respect to the method for producing it are the subject matter of appropriate dependent claims.
The invention is explained in the following text with reference to the embodiments in the drawing, in which:
Fig. 1 shows a schematic illustration of an SAW component with shielding according to the invention;
Fig. 2 shows a schematic partial illustration of the component according to Fig. 1, in a plan view;
Fig. 3 shows a schematic illustration and plan view of an SAW
component which is suitable for SMD mounting and has RF
shielding according to the invention; and Fig. 4 shows a schematic illustration of an SAW component which is suitable for flipchip mounting and has RF shielding accordlng to the invention.
According to Fig. 1, an SAW component in principle comprises a piezoelectric substrate 1 and, provided on this substrate, conductive structures 3 which may be, for example, electrode fingers of interdigital converters, resonators or reflectors.
As already described in the PCT Patent Application cited initially, the electrically conductive structures 3 are covered by a cap 2 which protects the structures against REPLACEMENT SHEET
environmental influences. The component, together with the cover 2 and the substrate l, is both directly reusable as a "casing", or can be fitted in a casing.
Metalization 6 which is used for RF shielding is provided on the cap 2, is formed by a material layer sequence of TiW, Cu or Ni and Au and is conductively connected to a connecting surface 4 - pad - via a through-plated hole 5 which passes through a window 7 in the cap 2. The metalization 6 which is used for RF shielding can be connected to ground via this pad 4.
Fig. 2 shows as a detail a part of the component according to Fig. l with the pad 4 and the through-plated hole 5, as well as the metalization 6 which covers the surface.
Fig. 3 shows a plan view of one embodiment of an RF shielded component which is suitable for SMD mounting. In this case, metalization 8 which can be soldered is provided on the surface of the cap 2 according to Figure l and is conductively connected to a pad 4 via the through-plated hole 5. The metalization 6 which is used for RF shielding is provided such that it is electrically isolated from this multilayer metalization 8 which can be soldered.
Fig. 4 shows a schematic illustration of one embodiment, which is provided with RF shielding, of an SAW component which is suitable for flipchip mounting. In the case of this embodiment, in which identical elements to those in the embodiment according to Fig. l have the same reference symbols, a bump 9 is provided in the window 7 and is soldered on the substrate surface to a pad, which is not illustrated per se. The component can be mounted in an electrical circuit via such bumps 9.
REPLACEMENT SHEET
In the case of the multilayer metalization 6 which is used for RF shielding, the titanium and tungsten layer ensures the adhesion capability on the cover 2, the nickel layer ensures the soldering capability, and the gold layer ensures oxidation protection. The layer thicknesses of titanium/tungsten are preferably less than O.l mm, that of nickel is about l mm and that of gold is about O.l mm. The metalization 6 can be produced in such a manner that a thin metallic layer is initially vapor-deposited onto the cover 2 and is then reinforced electrochemically.
A particularly cost-effective variant comprises vapor-deposition of a layer sequence of TiW, Cu or Ni and Au, whose overall thickness is less than lO mm, preferably being equal to 0.3 mm, with this layer being structured by pulsed laser radiation and non-electrical reinforcement with Cu. The through-plated hole 5 is also produced at the same time.
Finally, Au can be deposited with a thickness of O.l mm for passivation.
Since the through-plated holes 5 are produced on a substrate wafer which contains a multiplicity of components, they can also be positioned such that some of the through-plated hole is in each case associated with a component system, that is to say one through-plated hole is sufficient for two component systems.
The reliability can likewise be improved ~y designing the through-plated holes to be redundant, that is to say by allocating two through-plated holes to one pad.
REPLACEMENT SHEET
Description Electrical component, in particular an SAW component operating with surface acoustic waves, as well as a method for its production The present invention relates to an electrical component, in particular an SAW component operating with surface acoustic waves as claimed in the preamble of patent claim 1, and to a method for its production.
The prior international Patent Application W0 95/30276 discloses encapsulation for electronic components having a cap which seals component structures on a substrate, in the case of which the cap is formed by a cover which is provided on the substrate and, in areas of the component structures, has recesses which accomodate them. Such encapsulation protects the component structures against environmental influences so that electronic components encapsulated in such a manner can be reused directly, possibly without any further casing.
If such components are fitted in a ceramic casing and the casing is sealed with glass solder for cost reasons, then this does not provide effective RF shielding since the cover is then composed of ceramic and there is no conductive connection to the cover. The situation with a plastic casing is analogous.
The SAW filter according to DE-A-3 138 743, which is enclosed in a metallic casing that is closed in a sealed manner on all sides, avoids the above disadvantages.
The present invention is based on the object of specifying an effective RF shielding for electronic components of the type under discussion.
REPLACEMENT SHEET
This object is achieved according to the invention in the case of an electronic component of the type mentioned initially by the feature in the descriptive part of patent claim 1.
A method for producing such an electrical component is specified in patent claims 4 and 5.
Developments both with respect to the electronic component and with respect to the method for producing it are the subject matter of appropriate dependent claims.
The invention is explained in the following text with reference to the embodiments in the drawing, in which:
Fig. 1 shows a schematic illustration of an SAW component with shielding according to the invention;
Fig. 2 shows a schematic partial illustration of the component according to Fig. 1, in a plan view;
Fig. 3 shows a schematic illustration and plan view of an SAW
component which is suitable for SMD mounting and has RF
shielding according to the invention; and Fig. 4 shows a schematic illustration of an SAW component which is suitable for flipchip mounting and has RF shielding accordlng to the invention.
According to Fig. 1, an SAW component in principle comprises a piezoelectric substrate 1 and, provided on this substrate, conductive structures 3 which may be, for example, electrode fingers of interdigital converters, resonators or reflectors.
As already described in the PCT Patent Application cited initially, the electrically conductive structures 3 are covered by a cap 2 which protects the structures against REPLACEMENT SHEET
environmental influences. The component, together with the cover 2 and the substrate l, is both directly reusable as a "casing", or can be fitted in a casing.
Metalization 6 which is used for RF shielding is provided on the cap 2, is formed by a material layer sequence of TiW, Cu or Ni and Au and is conductively connected to a connecting surface 4 - pad - via a through-plated hole 5 which passes through a window 7 in the cap 2. The metalization 6 which is used for RF shielding can be connected to ground via this pad 4.
Fig. 2 shows as a detail a part of the component according to Fig. l with the pad 4 and the through-plated hole 5, as well as the metalization 6 which covers the surface.
Fig. 3 shows a plan view of one embodiment of an RF shielded component which is suitable for SMD mounting. In this case, metalization 8 which can be soldered is provided on the surface of the cap 2 according to Figure l and is conductively connected to a pad 4 via the through-plated hole 5. The metalization 6 which is used for RF shielding is provided such that it is electrically isolated from this multilayer metalization 8 which can be soldered.
Fig. 4 shows a schematic illustration of one embodiment, which is provided with RF shielding, of an SAW component which is suitable for flipchip mounting. In the case of this embodiment, in which identical elements to those in the embodiment according to Fig. l have the same reference symbols, a bump 9 is provided in the window 7 and is soldered on the substrate surface to a pad, which is not illustrated per se. The component can be mounted in an electrical circuit via such bumps 9.
REPLACEMENT SHEET
In the case of the multilayer metalization 6 which is used for RF shielding, the titanium and tungsten layer ensures the adhesion capability on the cover 2, the nickel layer ensures the soldering capability, and the gold layer ensures oxidation protection. The layer thicknesses of titanium/tungsten are preferably less than O.l mm, that of nickel is about l mm and that of gold is about O.l mm. The metalization 6 can be produced in such a manner that a thin metallic layer is initially vapor-deposited onto the cover 2 and is then reinforced electrochemically.
A particularly cost-effective variant comprises vapor-deposition of a layer sequence of TiW, Cu or Ni and Au, whose overall thickness is less than lO mm, preferably being equal to 0.3 mm, with this layer being structured by pulsed laser radiation and non-electrical reinforcement with Cu. The through-plated hole 5 is also produced at the same time.
Finally, Au can be deposited with a thickness of O.l mm for passivation.
Since the through-plated holes 5 are produced on a substrate wafer which contains a multiplicity of components, they can also be positioned such that some of the through-plated hole is in each case associated with a component system, that is to say one through-plated hole is sufficient for two component systems.
The reliability can likewise be improved ~y designing the through-plated holes to be redundant, that is to say by allocating two through-plated holes to one pad.
REPLACEMENT SHEET
Claims (5)
1. An electrical component, in particular an SAW component operating with surface acoustic waves, in the case of which electrically conductive structures (3) which are applied on a substrate (1) are encapsulated, sealed against environmental influences, by a cover (2) in the form of a cap, and the SAW
component has on the cover (2) metalization (6) as RF
shielding, characterized in that the metalization (6) is formed by a material layer sequence of titanium/tungsten, copper or nickel and gold.
component has on the cover (2) metalization (6) as RF
shielding, characterized in that the metalization (6) is formed by a material layer sequence of titanium/tungsten, copper or nickel and gold.
2. The electrical component as claimed in claim 1, characterized in that the titanium/tungsten or copper has a layer thickness of less than 0.1 mm, the nickel has a layer thickness of about 1 mm, and the gold has a layer thickness of about 0.1 mm.
3. The electrical component as claimed in claim 1, characterized in that the metalization (6) is electrically connected to a ground connecting surface (4) - pad - by means of a through-plated hole (5) through a window (7) in the cover (2).
4. A method for producing an SAW component as claimed in claims 1 to 3, in which electrically conductive structures (3) which are applied on a substrate (1) are encapsulated, sealed against environmental influences, by a cover (2) in the form of a cap, and the SAW component has, as RF shielding on the cover (2), metalization (6) with a material layer sequence of TiW, Cu or Ni and Au, characterized in that the layer sequences of the metalization (6) are initially vapor-deposited and are then reinforced non-electrically or electrochemically.
5. The method as claimed in claim 4, characterized in that the metalizations (6) are produced by vapor deposition of a layer sequence of TiW, Cu or Ni and Au, structuring by pulsed laser radiation, and non-electrical reinforcement with Cu.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19548062A DE19548062A1 (en) | 1995-12-21 | 1995-12-21 | Electrical component, in particular component working with surface acoustic waves - SAW component - and a method for its production |
| DE19548062.7 | 1995-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2241100A1 true CA2241100A1 (en) | 1997-07-03 |
Family
ID=7780970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002241100A Abandoned CA2241100A1 (en) | 1995-12-21 | 1996-12-16 | Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0868776B1 (en) |
| JP (1) | JP3268581B2 (en) |
| KR (1) | KR19990072152A (en) |
| CA (1) | CA2241100A1 (en) |
| DE (2) | DE19548062A1 (en) |
| WO (1) | WO1997023949A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6685168B1 (en) | 1998-02-17 | 2004-02-03 | Epcos Aktiengesellschaft | Surface acoustic wave component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19806818C1 (en) | 1998-02-18 | 1999-11-04 | Siemens Matsushita Components | Method for producing an electronic component, in particular an SAW component working with acoustic surface waves |
| JP2004222244A (en) | 2002-12-27 | 2004-08-05 | Toshiba Corp | Thin film piezoelectric resonator and manufacturing method thereof |
| CN101901799A (en) * | 2009-05-25 | 2010-12-01 | 晟铭电子科技股份有限公司 | Integrated circuit packaging structure and packaging method |
| JP2011023929A (en) * | 2009-07-15 | 2011-02-03 | Panasonic Corp | Acoustic wave device and electronic apparatus using the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478694A (en) * | 1977-12-05 | 1979-06-22 | Matsushima Kogyo Co Ltd | Crystal vibrator |
| JPS5797998U (en) * | 1980-12-04 | 1982-06-16 | ||
| DE3138743A1 (en) * | 1981-09-29 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | Surface acoustic wave filter and the like, mounted in a tight casing |
| JPS6373993U (en) * | 1986-11-01 | 1988-05-17 | ||
| US5212115A (en) * | 1991-03-04 | 1993-05-18 | Motorola, Inc. | Method for microelectronic device packaging employing capacitively coupled connections |
| JPH0794619A (en) * | 1993-09-20 | 1995-04-07 | Hitachi Ltd | Hybrid integrated circuit device |
| JPH07249877A (en) * | 1994-03-10 | 1995-09-26 | Murata Mfg Co Ltd | Electronic component |
-
1995
- 1995-12-21 DE DE19548062A patent/DE19548062A1/en not_active Withdrawn
-
1996
- 1996-12-16 KR KR1019980704491A patent/KR19990072152A/en not_active Application Discontinuation
- 1996-12-16 CA CA002241100A patent/CA2241100A1/en not_active Abandoned
- 1996-12-16 WO PCT/DE1996/002408 patent/WO1997023949A1/en not_active Application Discontinuation
- 1996-12-16 EP EP96946080A patent/EP0868776B1/en not_active Expired - Lifetime
- 1996-12-16 DE DE59602914T patent/DE59602914D1/en not_active Expired - Fee Related
- 1996-12-16 JP JP52320897A patent/JP3268581B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6685168B1 (en) | 1998-02-17 | 2004-02-03 | Epcos Aktiengesellschaft | Surface acoustic wave component |
Also Published As
| Publication number | Publication date |
|---|---|
| DE59602914D1 (en) | 1999-09-30 |
| EP0868776B1 (en) | 1999-08-25 |
| JP3268581B2 (en) | 2002-03-25 |
| WO1997023949A1 (en) | 1997-07-03 |
| JPH11502974A (en) | 1999-03-09 |
| EP0868776A1 (en) | 1998-10-07 |
| KR19990072152A (en) | 1999-09-27 |
| DE19548062A1 (en) | 1997-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |