CA1160515A - Method to synthesize and produce thin films by spray pyrolysis - Google Patents
Method to synthesize and produce thin films by spray pyrolysisInfo
- Publication number
- CA1160515A CA1160515A CA000395405A CA395405A CA1160515A CA 1160515 A CA1160515 A CA 1160515A CA 000395405 A CA000395405 A CA 000395405A CA 395405 A CA395405 A CA 395405A CA 1160515 A CA1160515 A CA 1160515A
- Authority
- CA
- Canada
- Prior art keywords
- film
- solute
- dopant
- substrate
- constituent element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 44
- 239000010409 thin film Substances 0.000 title claims description 3
- 238000005118 spray pyrolysis Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000470 constituent Substances 0.000 claims abstract description 29
- 230000003647 oxidation Effects 0.000 claims abstract description 22
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 22
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 150000003839 salts Chemical class 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 230000008859 change Effects 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 61
- 230000008569 process Effects 0.000 claims description 42
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 28
- 239000002019 doping agent Substances 0.000 claims description 22
- 239000003638 chemical reducing agent Substances 0.000 claims description 15
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 14
- 235000019253 formic acid Nutrition 0.000 claims description 14
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 239000000725 suspension Substances 0.000 claims description 7
- 229910004613 CdTe Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 150000007524 organic acids Chemical group 0.000 claims description 5
- 229910052714 tellurium Inorganic materials 0.000 claims description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 5
- 239000007900 aqueous suspension Substances 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910007709 ZnTe Inorganic materials 0.000 claims description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000006872 improvement Effects 0.000 claims description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910002899 Bi2Te3 Inorganic materials 0.000 claims description 2
- -1 GaxAl1 As Chemical compound 0.000 claims description 2
- 230000004075 alteration Effects 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 150000002484 inorganic compounds Chemical class 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 abstract description 21
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- 229910001868 water Inorganic materials 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- PHFQLYPOURZARY-UHFFFAOYSA-N chromium trinitrate Chemical compound [Cr+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PHFQLYPOURZARY-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- ZMFWDTJZHRDHNW-UHFFFAOYSA-N indium;trihydrate Chemical compound O.O.O.[In] ZMFWDTJZHRDHNW-UHFFFAOYSA-N 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical group C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- QFDUTPNKBRXHTC-UHFFFAOYSA-N zinc diazide Chemical compound [Zn++].[N-]=[N+]=[N-].[N-]=[N+]=[N-] QFDUTPNKBRXHTC-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical class [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- PLLZRTNVEXYBNA-UHFFFAOYSA-L cadmium hydroxide Chemical compound [OH-].[OH-].[Cd+2] PLLZRTNVEXYBNA-UHFFFAOYSA-L 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 1
- UQMZPFKLYHOJDL-UHFFFAOYSA-N zinc;cadmium(2+);disulfide Chemical compound [S-2].[S-2].[Zn+2].[Cd+2] UQMZPFKLYHOJDL-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1678—Heating of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/283—Borides, phosphides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/287—Chalcogenides
- C03C2217/288—Sulfides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/287—Chalcogenides
- C03C2217/289—Selenides, tellurides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/112—Deposition methods from solutions or suspensions by spraying
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Photovoltaic Devices (AREA)
- Chemically Coating (AREA)
Abstract
Abstract of the Disclosure Forming a film by spraying onto a heated substrate an atomized solution containing the appropriate salt of a constituent element of the film and an agent in sufficient amount to change the oxidation state of at least one solute element of the spray solution after contacting the heated substrate.
The film thus formed may be used in photovoltaic devices or in the formation of a solar-heat absorbing panel.
The film thus formed may be used in photovoltaic devices or in the formation of a solar-heat absorbing panel.
Description
Background of the Invention The invention relates to spray pyrolysis, which involves forming a film by spraying onto a heated substrate an atomized solution containing the appropriate salts of the constituent element (e.g., Te) of the film compound.
The chemical reaction occurs upon spraying on the heated substrate, and the non-constituent elements of the salts are removed by volatilization along with the Solvent, typically water. For example, United States Patent No. 3,148,084 discloses, along with other examples, the formation of CdS by spray pyrolysis according to the following equation:
CdC12 + H2NC(=S)NH2 + CdS with dispersed Cu +
Cu+~ -~ volatile products The resistivity of the film is then lowered by a post-deposition annealing step.
Before the conception of the invention claimed herein, Messrs. Steven A. Lis and Harvey B. Serreze proposed using H2 in the ambient gas and/or spray gas to act as a reducing agent to convert impurities to a volatile form and to also allow the use of Te in a different oxidation state in the starting material than it is in the film. Our attempts to implement that proposal were unsuccess-ful.
Summary of the Invention We have discovered that by adding an agent directly to the spray solu-tion we could cause a variety of desirable oxidation/reduction reactions to oc-cur when the spray solution contacted the heated substrate.
In accordance with the present invention, there is provided in the process of making a thin film comprising preparing a first solution with first solute elements including a salt of a first constituent element of said film and spraying said solution onto a heated substrate to form a first film on said sub-strate, the solute and solvent elements not constituting said film forming vola-tile reaction products after contacting said heated substrate, the improvement wherein said solution also includes an agent in sufficient amount to change the oxidation state of at least one said solute element after contacting said heated substrate.
The invention also further comprises attaching external electrical connections to said substrate to form a photovoltaic device.
Furthermore the invention provides after said spraying of said first solution onto said substrate, spraying a second solution with second solute ele-ments including a third salt different from said salt of a first constituen~
element and an agent in sufficient amount to change at least one said second solute element after contacting said first film on said heated substrate, to result in a multilayered structure with a second film of composition different from said first film.
In preferred embodiments the oxidation/reduction reaction involves reducing a constituent element of the film; this constituent element is telluri-um, and the film is cadmium telluride; the salts used in the spray solution are ~NH4)2TeO4 and Cd(OH)2; the substrate is maintained at a temperature between 325 and 550C (preferably between 370 and 425C); inert spray and ambient gasses are used; a dopant ("dopant" being used herein in the sense defined at p. 372 of Kittel, Introduction to Solid State Physics, 4th ed., John Wiley ~ Sons) material is also placed in the spray solution, and it changes in oxidation state after contacting the heated substrate; and the dopant is copper. In another preferred embodiment the film is ZnCdS with an indium dopant, and the dopant is also added to the spray solution and changes in oxidation state after contacting the heated substrate. In other preferred embodiments the oxidation/reduction reaction in-volves converting an impurity to a volatile form, and in yet another preferred embodiment, more of one constituent element of a film is used than is necessary 116~515 to react with another constituent element of the film, and the excess causes an alteration in the conductivity of the film. Further, in preferred embodiments, the reducing agent is a highly soluble (i.e., greater than 1 M) organic acid (preferably formic or acetic acid); the solubility of these acîds in the solvent allows increasing the strength of reducing agent to levels allowing the forma-tion of products of increased purity. Moreover, in preferred embodiments, the concentration of the reducing agent is much greater than a stoichiometric amount (i.e., greater than 10 times and preferably greater than 900 times the stoichio-metric amount), unexpectedly resulting in the formation of a high purity film.
A preferred application for films made according to the invention is used in photovoltaic devices, and a most preferred use is a multilayer device having a graphite covered CdTe layer on a CdZnS layer on an indium tin oxide coated substrate. Another highly preferred application is a solar-heat absorb-ing panel with an A1203-Ag film, the oxidation/reduction reaction being the re-duction of the Ag to the metallic, heat-absorbing state.
The invention allows using a starting material in a different oxidation state than it is in the film, and this is particularly advantageous when it is desired to have a film element in a state that is highly insoluble in the spray solution. Also, the production of high purity films is made possible by convert-ing impurities to volatile form so that they do not become part of the film.
Dopants can be easily included in the film to alter its electrical conductivity without the requirement of a post-deposition annealing step, and the film's electrical characteristics can also be changed by using an amount of one consti-tuent element that is greater than the amount necessary to react with another constituent element. Finally, the invention permits the use of spray pyrolysis to produce a wide variety of films including preparing CdTe, CdZnS, Ag, Cr, i2Te3, ZnTe) HgxCdl_xTe, ZnxCdl_xS, CdS, CdSe, ZnS, ZnSe, GaAs, Ga All As, 1 1605~5 InP, BN, Ni-Co-Cr alloys, Zn3P2, and ZnSnP2 films.
Preferred Embodiments The preferred embodiments of the invention will now be described.
Drawings Figure 1 is an elevation of a photovoltaic device made according to the invention.
Figure 2 is a diagrammatic fragmentary vertical sectional view of a solar-heat absorbing panel made according to the invention.
Figure 3 is a diagrammatic representation of the spraying apparatus and heating means useful for making the devices of Figures 1 and 2 according to the invention.
Structure and Apparatus Referring to the embodiment of Figure 1, the~e is shown photovoltaic device 10 comprising glass substrate 12, layer of indium tin oxide 14 (approxi-ma~ely 1000 Angstroms thick) thereon, layer 16 of sprayed cadmium zinc sulfide (1000 to 2000 Angstroms thick~ thereon, layer 17 of sprayed cadmium telluride (2500 to 5000 Angstroms thick) thereon, layer 18 of Aquadag (a dried graphite-in-water suspension) thereon, wire 20 attached to indium tin oxide layer 14 and wire 24 connected to the Aquadag by silver paint patch 22.
In the embodiment of Figure 2 there is shown solar-heat absorbing panel 25 comprising glass substrate 26 and layer 28 ~1000-2000 Angstroms thick) of A1203-Ag cermet thereon. Dots 29 represent regions of metallic silver dis-persed throughout the A1203.
Referring to Figure 3, there is shown spraying and heating apparatus 30 having air-tight enclosure 32. Spray nozzle 34 (1/4 J with a 1050 SS fluid cap available from Spraying Systems Company~ is supplied by solution bottle 36 and source of nitrogen spray gas 38. The gas flow is regulated by valve 40, and l 1 60515 the pressure is monitored from gauge 42. Substrates 44 (e.g., substrate 12 and layer 14 or substrate 26) are heated by heater 46 through tin bath 48. Nozzle 34 is located 12" above substrates 44. External means controls the temperature of heater 46, and the heater is mounted within enclosure 32 on insulating block 50. Access to the heater is provided by pass-through 52 (shown diagrammatical-ly), and valve 54 regulates supply of nitrogen purge gas through the interior of box 32. Heat shields 56 are used tG shield the solution and nozzle control apparatus 34, 36, 40 from high temperatures and the vapors from the heating apparatus below it.
Manufacture _, In making the photovoltaic device of Figure 1, films 16 and 17 are sprayed onto indium tin oxide coated glass (substrate 12 and layer 14 of the Figure 1 device, available from Pittsburg Plate Glass Inc.) using the Figure 3 apparatus. First spray solution I ror layer 16 and spray solution II for layer 17 are prepared by making aqueous solutions including the ingredients set forth in the following table at the indicated concentrations.
Table 1 Solution I
Concentration in Ingredient Solution (M) CdC12.2.5 H2O 0.0167 ZnC12 0.0083 Thiourea 0.025 In(OH)3 0.00025 Formic Acid 9.62 l 16~515 Solution II
Concentration in Ingredient Cd~OH)2 0.021 ( 4)2 e4 0.085 Cu++ 0.00064 Formic Acid 9.62 The cadmium hydroxide is prepared by dissolving 20 gm of reagent grade Cd~N03)2 in 100 ml distilled H20 and *itrating this with a saturated NaOH solu-tion to complete precipitation of Cd(OH)2. The precipitate is filtered, washed several times with H20 and dried at 80C for 16 hours.
The copper stock solution is prepared by etching copper shot (99% pure, available from Fisher Scientific Co), dissolving it in a slight excess of con-centrated nitric acid, and diluting it to 0.05 M.
All chemicals are reagent grade and obtained from Fisher Scientific Company, except for In(OH)3, which is ultra pure and obtained from the Alpha Division of Ventron Corp., Danvers, MA, and the (NH4)2TeO4, which is obtained inpowdered form from Ventron.
In spite of the fact that a large amount of reducing agent is used, the Te in Solution II remains in the +6 oxidation state, allowing a higher con-centration of Te than would be possible if Te were in the highly insoluble -2 state.
The spray chamber within box 32 is purged using nitrogen gas. The volume of the chamber is displaced three times with the nitrogen, and then the chamber is flushed continuously for five minutes more. The indium tin oxide coated glass substrates are cleaned by vapor degreasing with reagent grade tri-chloroethylene, and placed On the heated molten tin bath 48 and brought to a - 116~351S
temperature between 325 and 550CJ (preferably between 370 and ~2~C, and most preferably of 400C). Thirty-five ml of solution I is sprayed onto the heated substrates with nozzle 34, the spray gas flowing at 2.0 ml/min at a pressure of 10 to 12 psi, the liquid being pumped from bottle 30 by siphoning. The spray is discontinued by stopping the fluid flow from container 36. This results in the formation of layer 16 of ZnCdS on top of layer 14, the following reaction occur-ring on the heated substrate:
CdCl2 + ZnCl2 + ZnCdS doped with NC~=S)NH2 + -- ~ In + volatile reaction (1 In(OH)3 + reducing products agent The indium is apparently reduced from the +3 state to metallic indium upon spraying on the substrate, and this metallic dopant makes the layer more conduc-tive without the necessity of a post-deposition annealing step.
Immediately following the spraying of solution I, 200 ml of solution II is sprayed onto substrates 44 under the same spray and temperature conditions, the following reaction occurring on the heated substrate:
Cd(OH)2 + (NH4)2TeO4 CdTe doped with Cu +
+ Cu++ + ~ volatile reaction (2) Reducing agent products The tellurium is reduced to the -2 state, allowing it to combine with the cadmi-um. The Cu is apparently reduced to metallic copper, thereby making the layer more conductive. Again, a post-deposition annealing step is not required.
The presence of the reducing agent in high concentration in both solu-tions I and II also induces removal of impurities by converting them to volatile reaction products, and nitrogen, an inert element, is used as both the spray and ambient gas to a~oid the extraneous introduction of impurities from the at-mosphere.
The substrates are removed from the heater within three minutes after spraying of solution II. The substrates are cooled in the purged atmosphere for l 1 60515 five minutes, and then removed from the chamber through pass-through 52.
The Aquadag-E suspension (25% graphite in water; available from Acheson Golloids Company) is applied to the upper surface of the sprayed sub-strates with a wood applicator and dried at room temperature. Silver paint 25 is applied to the surface of the Aquadag-E layer 18, and copper wire lead 24 is attached to the paint 25 for external electrical connection. The silver paint should be dried for several hours at room temperature. A second copper lead 20 is coTmected directly to the indium tin oxide 12 using indium solder after scraping off some of layers 16 and 17.
The cadmium concentration in the solution II is greater than that necessary to react with the tellurium because cadmium has been found to be more volatile than the tellurium during spraying onto the heated substrate.
Formic acid is a particularly useful reducing agent, as it is highly soluble in aqueous solutions, and this allows increasing the concentration of the reducing agent to the high concentrations that have been found necessary to obtain the desired, virtually complete oxidation/reduction reactions occurring on the heated substrate surface. Acetic acid is a highly preferred alternative.
In general, it is preferred that the reducing agent be a highly-water-soluble organic acid.
The formic acid concentration should be greater than 1 M and also greater than ten times the stoichiometric amolmt to cause the desired oxidation/
reduction reactions to occur upon contacting the heated substrate.
The A1203-Ag cermet of Figure 2 is made by the same procedure as the Figure 1 device by spraying solution III (Table 2~ onto glass substrate 26, us-ing the same spray, temperature, and nozzle conditions described above.
1 1 6t~515 Table 2 Solution III
Concentration in Ingredients Solution (M) Al(NO3)3.9H2O 0.003 AgNO3 0.0015 Formic acid 9.62 Once again the chemicals are all reagent grade and are available from Fisher Sientific Company.
Examples of other solutions which can be sprayed with the Figure 3 apparatus are presented in the following table:
Table 3 Concentration in Solution Ingredients Solution (M) IV Bi(C2H3O2)3 0.01 (N 4)2Te4 0.0150 Formic acid 9.62 V Zn(N3)2 0.21 ( 4)2 e ~ 0.21 Formic acid 9.62 VI AgNO3 0.1 Formic acid 9.62 VII Cr(NO3)3 0.1 Formic acid 9.62 The reactions appear to be as follows:
The chemical reaction occurs upon spraying on the heated substrate, and the non-constituent elements of the salts are removed by volatilization along with the Solvent, typically water. For example, United States Patent No. 3,148,084 discloses, along with other examples, the formation of CdS by spray pyrolysis according to the following equation:
CdC12 + H2NC(=S)NH2 + CdS with dispersed Cu +
Cu+~ -~ volatile products The resistivity of the film is then lowered by a post-deposition annealing step.
Before the conception of the invention claimed herein, Messrs. Steven A. Lis and Harvey B. Serreze proposed using H2 in the ambient gas and/or spray gas to act as a reducing agent to convert impurities to a volatile form and to also allow the use of Te in a different oxidation state in the starting material than it is in the film. Our attempts to implement that proposal were unsuccess-ful.
Summary of the Invention We have discovered that by adding an agent directly to the spray solu-tion we could cause a variety of desirable oxidation/reduction reactions to oc-cur when the spray solution contacted the heated substrate.
In accordance with the present invention, there is provided in the process of making a thin film comprising preparing a first solution with first solute elements including a salt of a first constituent element of said film and spraying said solution onto a heated substrate to form a first film on said sub-strate, the solute and solvent elements not constituting said film forming vola-tile reaction products after contacting said heated substrate, the improvement wherein said solution also includes an agent in sufficient amount to change the oxidation state of at least one said solute element after contacting said heated substrate.
The invention also further comprises attaching external electrical connections to said substrate to form a photovoltaic device.
Furthermore the invention provides after said spraying of said first solution onto said substrate, spraying a second solution with second solute ele-ments including a third salt different from said salt of a first constituen~
element and an agent in sufficient amount to change at least one said second solute element after contacting said first film on said heated substrate, to result in a multilayered structure with a second film of composition different from said first film.
In preferred embodiments the oxidation/reduction reaction involves reducing a constituent element of the film; this constituent element is telluri-um, and the film is cadmium telluride; the salts used in the spray solution are ~NH4)2TeO4 and Cd(OH)2; the substrate is maintained at a temperature between 325 and 550C (preferably between 370 and 425C); inert spray and ambient gasses are used; a dopant ("dopant" being used herein in the sense defined at p. 372 of Kittel, Introduction to Solid State Physics, 4th ed., John Wiley ~ Sons) material is also placed in the spray solution, and it changes in oxidation state after contacting the heated substrate; and the dopant is copper. In another preferred embodiment the film is ZnCdS with an indium dopant, and the dopant is also added to the spray solution and changes in oxidation state after contacting the heated substrate. In other preferred embodiments the oxidation/reduction reaction in-volves converting an impurity to a volatile form, and in yet another preferred embodiment, more of one constituent element of a film is used than is necessary 116~515 to react with another constituent element of the film, and the excess causes an alteration in the conductivity of the film. Further, in preferred embodiments, the reducing agent is a highly soluble (i.e., greater than 1 M) organic acid (preferably formic or acetic acid); the solubility of these acîds in the solvent allows increasing the strength of reducing agent to levels allowing the forma-tion of products of increased purity. Moreover, in preferred embodiments, the concentration of the reducing agent is much greater than a stoichiometric amount (i.e., greater than 10 times and preferably greater than 900 times the stoichio-metric amount), unexpectedly resulting in the formation of a high purity film.
A preferred application for films made according to the invention is used in photovoltaic devices, and a most preferred use is a multilayer device having a graphite covered CdTe layer on a CdZnS layer on an indium tin oxide coated substrate. Another highly preferred application is a solar-heat absorb-ing panel with an A1203-Ag film, the oxidation/reduction reaction being the re-duction of the Ag to the metallic, heat-absorbing state.
The invention allows using a starting material in a different oxidation state than it is in the film, and this is particularly advantageous when it is desired to have a film element in a state that is highly insoluble in the spray solution. Also, the production of high purity films is made possible by convert-ing impurities to volatile form so that they do not become part of the film.
Dopants can be easily included in the film to alter its electrical conductivity without the requirement of a post-deposition annealing step, and the film's electrical characteristics can also be changed by using an amount of one consti-tuent element that is greater than the amount necessary to react with another constituent element. Finally, the invention permits the use of spray pyrolysis to produce a wide variety of films including preparing CdTe, CdZnS, Ag, Cr, i2Te3, ZnTe) HgxCdl_xTe, ZnxCdl_xS, CdS, CdSe, ZnS, ZnSe, GaAs, Ga All As, 1 1605~5 InP, BN, Ni-Co-Cr alloys, Zn3P2, and ZnSnP2 films.
Preferred Embodiments The preferred embodiments of the invention will now be described.
Drawings Figure 1 is an elevation of a photovoltaic device made according to the invention.
Figure 2 is a diagrammatic fragmentary vertical sectional view of a solar-heat absorbing panel made according to the invention.
Figure 3 is a diagrammatic representation of the spraying apparatus and heating means useful for making the devices of Figures 1 and 2 according to the invention.
Structure and Apparatus Referring to the embodiment of Figure 1, the~e is shown photovoltaic device 10 comprising glass substrate 12, layer of indium tin oxide 14 (approxi-ma~ely 1000 Angstroms thick) thereon, layer 16 of sprayed cadmium zinc sulfide (1000 to 2000 Angstroms thick~ thereon, layer 17 of sprayed cadmium telluride (2500 to 5000 Angstroms thick) thereon, layer 18 of Aquadag (a dried graphite-in-water suspension) thereon, wire 20 attached to indium tin oxide layer 14 and wire 24 connected to the Aquadag by silver paint patch 22.
In the embodiment of Figure 2 there is shown solar-heat absorbing panel 25 comprising glass substrate 26 and layer 28 ~1000-2000 Angstroms thick) of A1203-Ag cermet thereon. Dots 29 represent regions of metallic silver dis-persed throughout the A1203.
Referring to Figure 3, there is shown spraying and heating apparatus 30 having air-tight enclosure 32. Spray nozzle 34 (1/4 J with a 1050 SS fluid cap available from Spraying Systems Company~ is supplied by solution bottle 36 and source of nitrogen spray gas 38. The gas flow is regulated by valve 40, and l 1 60515 the pressure is monitored from gauge 42. Substrates 44 (e.g., substrate 12 and layer 14 or substrate 26) are heated by heater 46 through tin bath 48. Nozzle 34 is located 12" above substrates 44. External means controls the temperature of heater 46, and the heater is mounted within enclosure 32 on insulating block 50. Access to the heater is provided by pass-through 52 (shown diagrammatical-ly), and valve 54 regulates supply of nitrogen purge gas through the interior of box 32. Heat shields 56 are used tG shield the solution and nozzle control apparatus 34, 36, 40 from high temperatures and the vapors from the heating apparatus below it.
Manufacture _, In making the photovoltaic device of Figure 1, films 16 and 17 are sprayed onto indium tin oxide coated glass (substrate 12 and layer 14 of the Figure 1 device, available from Pittsburg Plate Glass Inc.) using the Figure 3 apparatus. First spray solution I ror layer 16 and spray solution II for layer 17 are prepared by making aqueous solutions including the ingredients set forth in the following table at the indicated concentrations.
Table 1 Solution I
Concentration in Ingredient Solution (M) CdC12.2.5 H2O 0.0167 ZnC12 0.0083 Thiourea 0.025 In(OH)3 0.00025 Formic Acid 9.62 l 16~515 Solution II
Concentration in Ingredient Cd~OH)2 0.021 ( 4)2 e4 0.085 Cu++ 0.00064 Formic Acid 9.62 The cadmium hydroxide is prepared by dissolving 20 gm of reagent grade Cd~N03)2 in 100 ml distilled H20 and *itrating this with a saturated NaOH solu-tion to complete precipitation of Cd(OH)2. The precipitate is filtered, washed several times with H20 and dried at 80C for 16 hours.
The copper stock solution is prepared by etching copper shot (99% pure, available from Fisher Scientific Co), dissolving it in a slight excess of con-centrated nitric acid, and diluting it to 0.05 M.
All chemicals are reagent grade and obtained from Fisher Scientific Company, except for In(OH)3, which is ultra pure and obtained from the Alpha Division of Ventron Corp., Danvers, MA, and the (NH4)2TeO4, which is obtained inpowdered form from Ventron.
In spite of the fact that a large amount of reducing agent is used, the Te in Solution II remains in the +6 oxidation state, allowing a higher con-centration of Te than would be possible if Te were in the highly insoluble -2 state.
The spray chamber within box 32 is purged using nitrogen gas. The volume of the chamber is displaced three times with the nitrogen, and then the chamber is flushed continuously for five minutes more. The indium tin oxide coated glass substrates are cleaned by vapor degreasing with reagent grade tri-chloroethylene, and placed On the heated molten tin bath 48 and brought to a - 116~351S
temperature between 325 and 550CJ (preferably between 370 and ~2~C, and most preferably of 400C). Thirty-five ml of solution I is sprayed onto the heated substrates with nozzle 34, the spray gas flowing at 2.0 ml/min at a pressure of 10 to 12 psi, the liquid being pumped from bottle 30 by siphoning. The spray is discontinued by stopping the fluid flow from container 36. This results in the formation of layer 16 of ZnCdS on top of layer 14, the following reaction occur-ring on the heated substrate:
CdCl2 + ZnCl2 + ZnCdS doped with NC~=S)NH2 + -- ~ In + volatile reaction (1 In(OH)3 + reducing products agent The indium is apparently reduced from the +3 state to metallic indium upon spraying on the substrate, and this metallic dopant makes the layer more conduc-tive without the necessity of a post-deposition annealing step.
Immediately following the spraying of solution I, 200 ml of solution II is sprayed onto substrates 44 under the same spray and temperature conditions, the following reaction occurring on the heated substrate:
Cd(OH)2 + (NH4)2TeO4 CdTe doped with Cu +
+ Cu++ + ~ volatile reaction (2) Reducing agent products The tellurium is reduced to the -2 state, allowing it to combine with the cadmi-um. The Cu is apparently reduced to metallic copper, thereby making the layer more conductive. Again, a post-deposition annealing step is not required.
The presence of the reducing agent in high concentration in both solu-tions I and II also induces removal of impurities by converting them to volatile reaction products, and nitrogen, an inert element, is used as both the spray and ambient gas to a~oid the extraneous introduction of impurities from the at-mosphere.
The substrates are removed from the heater within three minutes after spraying of solution II. The substrates are cooled in the purged atmosphere for l 1 60515 five minutes, and then removed from the chamber through pass-through 52.
The Aquadag-E suspension (25% graphite in water; available from Acheson Golloids Company) is applied to the upper surface of the sprayed sub-strates with a wood applicator and dried at room temperature. Silver paint 25 is applied to the surface of the Aquadag-E layer 18, and copper wire lead 24 is attached to the paint 25 for external electrical connection. The silver paint should be dried for several hours at room temperature. A second copper lead 20 is coTmected directly to the indium tin oxide 12 using indium solder after scraping off some of layers 16 and 17.
The cadmium concentration in the solution II is greater than that necessary to react with the tellurium because cadmium has been found to be more volatile than the tellurium during spraying onto the heated substrate.
Formic acid is a particularly useful reducing agent, as it is highly soluble in aqueous solutions, and this allows increasing the concentration of the reducing agent to the high concentrations that have been found necessary to obtain the desired, virtually complete oxidation/reduction reactions occurring on the heated substrate surface. Acetic acid is a highly preferred alternative.
In general, it is preferred that the reducing agent be a highly-water-soluble organic acid.
The formic acid concentration should be greater than 1 M and also greater than ten times the stoichiometric amolmt to cause the desired oxidation/
reduction reactions to occur upon contacting the heated substrate.
The A1203-Ag cermet of Figure 2 is made by the same procedure as the Figure 1 device by spraying solution III (Table 2~ onto glass substrate 26, us-ing the same spray, temperature, and nozzle conditions described above.
1 1 6t~515 Table 2 Solution III
Concentration in Ingredients Solution (M) Al(NO3)3.9H2O 0.003 AgNO3 0.0015 Formic acid 9.62 Once again the chemicals are all reagent grade and are available from Fisher Sientific Company.
Examples of other solutions which can be sprayed with the Figure 3 apparatus are presented in the following table:
Table 3 Concentration in Solution Ingredients Solution (M) IV Bi(C2H3O2)3 0.01 (N 4)2Te4 0.0150 Formic acid 9.62 V Zn(N3)2 0.21 ( 4)2 e ~ 0.21 Formic acid 9.62 VI AgNO3 0.1 Formic acid 9.62 VII Cr(NO3)3 0.1 Formic acid 9.62 The reactions appear to be as follows:
2 Bi(C2H3O2)3 + Bi2Te3 + volatile
3(NH4)2Teo4 + reaction products (4) reducing agent Zn(N3)2 ~ (NH4)2TeO4 ~ ZnTe ~ volatile + Formic acid reaction products (5) l 16~S15 AgNO3 + Formic acid ~ Ag -~ volatile reaction products (6) Cr(NO3)3 ~ Formic acid ~, Cr -~ volatile reaction products (7) A constituent element may itself be used as a source of metallic dopant by using an excess of the material in the spray. For example, the Cd portion of CdTe can be increased as is described in the following equation:
excess cd(OH)2 + -- ~ Cdl.olTe +
(NH4)2TeO4 volatile reaction (8) products In the above reaction, in order to maintain an excess of Cd in the film, a much larger excess of Cd salt must be used in the spray solution.
In all of the above examples, the presence of a reducing agent in a high concentration also serves to convert impurities to a volatile form.
Other Embodiments Other embodiments are within the following claims. For example the principles outlined above will find application in using an oxidizing agent when it is desired to have a film element in a higher oxidation state in the film than in the starting material. Also, other dopants will work. The solvent need not be water; methanol is a preferred alternative.
Finally, the principles outlined above will apply to making a large number of other films, e.g., HgXCdl xTe, ZnxCdl xS, CdS, CdSe, ZnS, ZnSe, GaAs, GaxAll xAs, InP, Bn, Ni-Co-Cr alloys, Zn3P2, and ZnSnP2.
excess cd(OH)2 + -- ~ Cdl.olTe +
(NH4)2TeO4 volatile reaction (8) products In the above reaction, in order to maintain an excess of Cd in the film, a much larger excess of Cd salt must be used in the spray solution.
In all of the above examples, the presence of a reducing agent in a high concentration also serves to convert impurities to a volatile form.
Other Embodiments Other embodiments are within the following claims. For example the principles outlined above will find application in using an oxidizing agent when it is desired to have a film element in a higher oxidation state in the film than in the starting material. Also, other dopants will work. The solvent need not be water; methanol is a preferred alternative.
Finally, the principles outlined above will apply to making a large number of other films, e.g., HgXCdl xTe, ZnxCdl xS, CdS, CdSe, ZnS, ZnSe, GaAs, GaxAll xAs, InP, Bn, Ni-Co-Cr alloys, Zn3P2, and ZnSnP2.
Claims (42)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In the process of making a thin film comprising preparing a first solution with first solute elements including a salt of a first constituent element of said film and spraying said solution onto a heated substrate to form a first film on said substrate, the solute and solvent elements not constituting said film forming volatile reaction products after contacting said heated substrate, the improvement wherein said solution also includes an agent in sufficient amount to change the oxidation state of at least one said solute element after contacting said heated substrate.
2. The process of claim 1 wherein said one solute element is a con-stituent element of said film.
3. The process of claim 1 wherein said agent is a reducing agent.
4. The process of claim 3 wherein said one solute element is said first constituent element and is tellurium, said solute element further comprising a salt of a second constituent element, said second constituent element being cadmium.
5. The process of claim 4 wherein said salt of said first constituent element is (NH4)2TeO4 and said salt of said second constituent element is Cd(OH)2.
6. The process of claim 1 wherein said substrate is maintained at a temperature between 325 and 550°C.
7. The process of claim 6 wherein said substrate is maintained at a temperature between 370 and
8. The process of claim 2 wherein said film comprises CdTe, Ag, Cr, Bi2Te3, CdZnS or ZnTe.
9. The process of claim 1 wherein said spraying step comprises spraying with an inert gas in a chamber having an ambient gas that is inert.
10. The process of claim 1 wherein said one solute element is a dopant said dopant changing in oxidation state after contacting said heated substrate.
11. The process of claim 10, wherein said dopant is In or Cu.
12. The improvement of claim 10 wherein said film is CdZnS and said dopant is In.
13. The process of claim 4 wherein another said solute element is a dopant, said dopant changing in oxidation state after contacting said heated substrate, said dopant being Cu.
14. The process of claim 1 wherein said one solute element is an im-purity that converts to a volatile form with said change in oxidation state.
15. The process of claim 1 wherein said film has a second constituent element, said first constituent element being greater in amount than necessary to react with said second constituent element, the excess of said one con-stituent element causing an alteration in conductivity of said film.
16. The process according to claim 4 which further comprises attaching external electrical connections to said substate to form a photovoltaic device.
17. The process of claim 16 wherein said substrate is glass coated with indium tin oxide.
18. The process of claim 1 further comprising, after said spraying of said first solution onto said substrate, spraying a second solution with second solute elements including a third salt different from said salt of a first constituent element and an agent in sufficient amount to change at least one said second solute element after contacting said first film on said heated substrate, to result in a multilayered structure with a second film of com-position different from said first film.
19. The process of claim 18 wherein said first film is ZnCdS.
20. The process of claim 19 wherein said second film is CdTe.
21. The process of claim 20 wherein said third salt is (NH4)TeO4.
22. The process of claim 21 wherein said first solution includes a first dopant which changes in oxidation state after contacting said heated substrate.
23. The process of claim 22 wherein said second solution includes a second dopant which changes in oxidation state after contacting said first film on said heated substrate.
24. The process of claim 23 wherein said first dopant is In and said second dopant is Cu.
25. The process according to claim 18 further comprising attaching a first external electrical connection to said first film and a second external electrical connection to said second film to form a photovoltaic device.
26. The process according to claim 20 further comprising attaching a first external electrical connection to said first film and a second external electrical connection to said second film to form a photo-voltaic device.
27. The process according to claim 24 further comprising attaching a first external electrical connection to said first film and a second external electrical connection to said second film to form a photovoltaic device.
28. The process according to claim 18 further comprising applying a layer of graphite-in-water suspension on top of said second film, allowing said suspension to dry, attaching a first electrical connection to said first film, and attaching a second electrical connection to said dried layer of graphite suspension to form a photovoltaic device, said substrate having a layer of indium tin oxide on the surface on which said first solution is sprayed.
29. The process according to claim 20 further comprising applying a layer of graphite-in-water suspension on top of said second film, allowing said suspension to dry, attaching a first electrical connection to said first film, and attaching a second electrical connection to said dried layer of graphite suspension to form a photovoltaic device, said substrate having a layer of indium tin oxide on the surface on which said first solution is sprayed.
30. The process according to claim 24 further comprising applying a layer of graphite-in-water suspension on top of said second film, allowing said suspension to dry, attaching a first electrical connection to said first film, and 14 .
attaching a second electrical connection to said dried layer of graphite suspension to form a photovoltaic device, said substrate having a layer of indium tin oxide on the surface on which said first solution is sprayed.
attaching a second electrical connection to said dried layer of graphite suspension to form a photovoltaic device, said substrate having a layer of indium tin oxide on the surface on which said first solution is sprayed.
31. The process of claim 3 wherein said film is A12O3 and said one solute element is Ag.
32. The process of claim 1 wherein said film comprises HgXCd1-xTe, ZnxCD1-xS, CdS, CdSe, ZnS, ZnSe, GaAs, GaxAl1 As, InP, BN, Ni-Co-Cr alloys, Zn3P2, or ZnSnP2.
33. The process of claim 1 wherein said agent is an organic acid with a solubility greater than 1 M in the solvent.
34. The process of claim 33 wherein said organic acid is formic acid.
The process of claim 33 wherein said organic acid is acetic acid.
36. The process of claim 3 wherein the concentration of said reducing agent is greater than 1 M and greater than 10 times the stoichiometric amount necessary to react with said one solute element.
37. The process of claim 36 wherein the concentration of said reducing agent is greater than 900 times the stoichiometric amount.
38. The process of claim 36 wherein said one solute element is a constituent element of said film.
39. The process of claim 36 wherein said one solute element is said first constituent element and is tellurium, said solute elements comprising a soluble inorganic compound of a second constituent element, said second constituent element being cadmium.
40. The process of claim 36 wherein said salt of said first constituent element is (NH4)2TeO4 and said soluble inorganic compound of said second constituent is Cd(OH)2.
41. The process of claim 36 wherein another said solute element is a dopant, said dopant changing in oxidation state after contacting said heated substrate.
42. The process of claim 36 wherein said one solute element is an im-purity that converts to a volatile form with said change in oxidation sate.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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US231,127 | 1981-02-03 | ||
US231,128 | 1981-02-03 | ||
US06/231,128 US4336285A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
US06/231,127 US4327119A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
US06/231,138 US4338362A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
US231,138 | 1981-02-03 |
Publications (1)
Publication Number | Publication Date |
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CA1160515A true CA1160515A (en) | 1984-01-17 |
Family
ID=27398157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000395405A Expired CA1160515A (en) | 1981-02-03 | 1982-02-02 | Method to synthesize and produce thin films by spray pyrolysis |
Country Status (2)
Country | Link |
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CA (1) | CA1160515A (en) |
FR (1) | FR2498951B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19743270A1 (en) * | 1997-09-30 | 1999-04-01 | Siemens Ag | Manufacturing process for a ceramic layer |
CN101098834B (en) * | 2004-12-16 | 2011-08-24 | 旭硝子欧洲玻璃公司 | Substrate with antimicrobial properties |
WO2006064060A1 (en) * | 2004-12-16 | 2006-06-22 | Glaverbel | Substrate with antimicrobial properties |
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NL282696A (en) * | 1961-08-30 | 1900-01-01 | ||
US3598657A (en) * | 1968-04-30 | 1971-08-10 | American Cyanamid Co | Method of platinization of a fuel cell electrode |
-
1982
- 1982-02-02 FR FR8201672A patent/FR2498951B1/en not_active Expired
- 1982-02-02 CA CA000395405A patent/CA1160515A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2498951A1 (en) | 1982-08-06 |
FR2498951B1 (en) | 1986-03-28 |
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