AU5769300A - Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards - Google Patents

Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards

Info

Publication number
AU5769300A
AU5769300A AU57693/00A AU5769300A AU5769300A AU 5769300 A AU5769300 A AU 5769300A AU 57693/00 A AU57693/00 A AU 57693/00A AU 5769300 A AU5769300 A AU 5769300A AU 5769300 A AU5769300 A AU 5769300A
Authority
AU
Australia
Prior art keywords
circuit boards
electrical characteristics
signal traces
layered circuit
adjusting electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57693/00A
Inventor
Istvan Novak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of AU5769300A publication Critical patent/AU5769300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU57693/00A 1999-06-29 2000-06-27 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards Abandoned AU5769300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34313299A 1999-06-29 1999-06-29
US09343132 1999-06-29
PCT/US2000/017618 WO2001001453A2 (en) 1999-06-29 2000-06-27 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards

Publications (1)

Publication Number Publication Date
AU5769300A true AU5769300A (en) 2001-01-31

Family

ID=23344839

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57693/00A Abandoned AU5769300A (en) 1999-06-29 2000-06-27 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards

Country Status (2)

Country Link
AU (1) AU5769300A (en)
WO (1) WO2001001453A2 (en)

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Publication number Priority date Publication date Assignee Title
US6741148B2 (en) * 2002-06-27 2004-05-25 Harris Corporation High efficiency coupled line filters
US6825743B2 (en) 2002-06-27 2004-11-30 Harris Corporation Substrate enhancement for improved signal characteristics on a discontinuous transmission line
US6737932B2 (en) 2002-06-27 2004-05-18 Harris Corporation Broadband impedance transformers
US6753814B2 (en) * 2002-06-27 2004-06-22 Harris Corporation Dipole arrangements using dielectric substrates of meta-materials
US6727785B2 (en) 2002-06-27 2004-04-27 Harris Corporation High efficiency single port resonant line
US6963259B2 (en) * 2002-06-27 2005-11-08 Harris Corporation High efficiency resonant line
US6750740B2 (en) * 2002-06-27 2004-06-15 Harris Corporation High efficiency interdigital filters
US6731244B2 (en) 2002-06-27 2004-05-04 Harris Corporation High efficiency directional coupler
US6838954B2 (en) 2002-06-27 2005-01-04 Harris Corporation High efficiency quarter-wave transformer
US6781486B2 (en) * 2002-06-27 2004-08-24 Harris Corporation High efficiency stepped impedance filter
US6794952B2 (en) * 2002-06-27 2004-09-21 Harris Corporation High efficiency low pass filter
US6842140B2 (en) * 2002-12-03 2005-01-11 Harris Corporation High efficiency slot fed microstrip patch antenna
US6982671B2 (en) 2003-02-25 2006-01-03 Harris Corporation Slot fed microstrip antenna having enhanced slot electromagnetic coupling
US6995711B2 (en) * 2003-03-31 2006-02-07 Harris Corporation High efficiency crossed slot microstrip antenna
US6791496B1 (en) * 2003-03-31 2004-09-14 Harris Corporation High efficiency slot fed microstrip antenna having an improved stub
US7006052B2 (en) 2003-05-15 2006-02-28 Harris Corporation Passive magnetic radome
US6975279B2 (en) 2003-05-30 2005-12-13 Harris Foundation Efficient radome structures of variable geometry
US6985118B2 (en) 2003-07-07 2006-01-10 Harris Corporation Multi-band horn antenna using frequency selective surfaces
US6992628B2 (en) 2003-08-25 2006-01-31 Harris Corporation Antenna with dynamically variable operating band
US7030834B2 (en) 2003-09-03 2006-04-18 Harris Corporation Active magnetic radome
US6990729B2 (en) 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US7088308B2 (en) 2003-10-08 2006-08-08 Harris Corporation Feedback and control system for radomes
US7196607B2 (en) 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
US7186922B2 (en) * 2004-04-28 2007-03-06 Infineon Technologies Ag Circuit board
US7158005B2 (en) 2005-02-10 2007-01-02 Harris Corporation Embedded toroidal inductor
JP5559265B2 (en) 2012-07-30 2014-07-23 ファナック株式会社 Power conversion device in which switching elements are connected in parallel and driven in parallel
US20220270989A1 (en) * 2021-02-24 2022-08-25 Intel Corporation Integrated circuit supports with microstrips

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0180974U (en) * 1987-11-20 1989-05-30
US5604017A (en) * 1990-04-12 1997-02-18 Arlon, Inc. Multi-dielectric laminates
JP2500235B2 (en) * 1991-02-07 1996-05-29 富士通株式会社 Thin film circuit board and manufacturing method thereof
JPH04352498A (en) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc Insulation paste for electromagnetic shield with high permeability
JPH05206591A (en) * 1992-01-28 1993-08-13 Hitachi Ltd Printed wiring board and manufacture thereof
JPH05299792A (en) * 1992-04-23 1993-11-12 Nitto Denko Corp High frequency circuit board
JPH06132418A (en) * 1992-10-14 1994-05-13 Mitsubishi Electric Corp High-frequency hybrid integrated circuit device
US5450286A (en) * 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
JPH06283909A (en) * 1993-03-24 1994-10-07 Nippon Chemicon Corp Circuit element for microstrip line
JPH06283907A (en) * 1993-03-24 1994-10-07 Nippon Chemicon Corp Microstrip line
JP2500783B2 (en) * 1993-09-02 1996-05-29 日本電気株式会社 Printed board
JPH0878940A (en) * 1994-09-01 1996-03-22 Hitachi Ltd Microstrip transmission line substrate, manufacture of the same and circuit module using the same
JPH09260797A (en) * 1996-03-22 1997-10-03 Sony Corp Wiring board

Also Published As

Publication number Publication date
WO2001001453A2 (en) 2001-01-04
WO2001001453A3 (en) 2001-07-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase