AU4020300A - Method and apparatus of a strong metal-ceramic braze bond - Google Patents

Method and apparatus of a strong metal-ceramic braze bond

Info

Publication number
AU4020300A
AU4020300A AU40203/00A AU4020300A AU4020300A AU 4020300 A AU4020300 A AU 4020300A AU 40203/00 A AU40203/00 A AU 40203/00A AU 4020300 A AU4020300 A AU 4020300A AU 4020300 A AU4020300 A AU 4020300A
Authority
AU
Australia
Prior art keywords
strong metal
braze bond
ceramic braze
ceramic
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU40203/00A
Inventor
Richard P. Malmgren
Thomas A. Santogrossi
Joseph H Schulman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alfred E Mann Foundation for Scientific Research
Advanced Bionics LLC
Original Assignee
Alfred E Mann Foundation for Scientific Research
Advanced Bionics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alfred E Mann Foundation for Scientific Research, Advanced Bionics LLC filed Critical Alfred E Mann Foundation for Scientific Research
Publication of AU4020300A publication Critical patent/AU4020300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/008Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating pressure combined with radiant energy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023Thermo-compression bonding
    • B23K20/026Thermo-compression bonding with diffusion of soldering material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/227Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/02Iron or ferrous alloys
    • B23K2103/04Steel or steel alloys
    • B23K2103/05Stainless steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/14Titanium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/18Dissimilar materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/18Dissimilar materials
    • B23K2103/26Alloys of Nickel and Cobalt and Chromium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Products (AREA)
AU40203/00A 1999-03-24 2000-03-22 Method and apparatus of a strong metal-ceramic braze bond Abandoned AU4020300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12585299P 1999-03-24 1999-03-24
US60125852 1999-03-24
PCT/US2000/007601 WO2000056677A1 (en) 1999-03-24 2000-03-22 Method and apparatus of a strong metal-ceramic braze bond

Publications (1)

Publication Number Publication Date
AU4020300A true AU4020300A (en) 2000-10-09

Family

ID=22421731

Family Applications (1)

Application Number Title Priority Date Filing Date
AU40203/00A Abandoned AU4020300A (en) 1999-03-24 2000-03-22 Method and apparatus of a strong metal-ceramic braze bond

Country Status (2)

Country Link
AU (1) AU4020300A (en)
WO (1) WO2000056677A1 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7120992B2 (en) 2002-06-28 2006-10-17 Advanced Bionics Corporation Method of making an electronic module
WO2004110555A1 (en) 2003-06-06 2004-12-23 Medtronic, Inc. Implantable medical device including a hermetic connector block extension
US8489196B2 (en) 2003-10-03 2013-07-16 Medtronic, Inc. System, apparatus and method for interacting with a targeted tissue of a patient
US7236834B2 (en) 2003-12-19 2007-06-26 Medtronic, Inc. Electrical lead body including an in-line hermetic electronic package and implantable medical device using the same
US7771838B1 (en) 2004-10-12 2010-08-10 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
US8329314B1 (en) 2004-10-12 2012-12-11 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a palladium braze
US8447402B1 (en) * 2006-03-31 2013-05-21 Alfred E. Mann Foundation For Scientific Research Zirconia to platinum assembly using a titanium connector
US7498516B1 (en) 2006-06-14 2009-03-03 Boston Scientific Neuromodulation Corporation Feedthru assembly
US20080103572A1 (en) 2006-10-31 2008-05-01 Medtronic, Inc. Implantable medical lead with threaded fixation
CA2882974C (en) 2012-08-31 2018-10-23 Alfred E. Mann Foundation For Scientific Research Feedback controlled coil driver for inductive power transfer
WO2014146019A2 (en) 2013-03-15 2014-09-18 Alfred E. Mann Foundation For Scientific Research High voltage monitoring successive approximation analog to digital converter
WO2014146016A2 (en) 2013-03-15 2014-09-18 Alfred E. Mann Foundation For Scientific Research Current sensing multiple output current stimulators with fast turn on time
EP2991726B1 (en) 2013-05-03 2018-07-25 Alfred E. Mann Foundation for Scientific Research Multi-branch stimulation electrode for subcutaneous field stimulation
CN105658276B (en) 2013-05-03 2018-10-02 艾尔弗雷德·E·曼科学研究基金会 Implantation material recharger is shaken hands system and method
CA2910943C (en) 2013-05-03 2021-10-26 Alfred E. Mann Foundation For Scientific Research High reliability wire welding for implantable devices
JP6503351B2 (en) 2013-07-29 2019-04-17 アルフレッド イー. マン ファウンデーション フォー サイエンティフィック リサーチ High efficiency magnetic link for implantable devices
AU2014296323B2 (en) 2013-07-29 2019-04-04 Alfred E. Mann Foundation For Scientific Research Microprocessor controlled class E driver
AU2015301400B2 (en) 2014-08-15 2020-05-28 Axonics Modulation Technologies, Inc. Systems and methods for neurostimulation electrode configurations based on neural localization
AU2015301401B2 (en) 2014-08-15 2020-01-16 Axonics Modulation Technologies, Inc. Electromyographic lead positioning and stimulation titration in a nerve stimulation system for treatment of overactive bladder
US9700731B2 (en) 2014-08-15 2017-07-11 Axonics Modulation Technologies, Inc. Antenna and methods of use for an implantable nerve stimulator
US10682521B2 (en) 2014-08-15 2020-06-16 Axonics Modulation Technologies, Inc. Attachment devices and associated methods of use with a nerve stimulation charging device
CN106999709B (en) 2014-08-15 2021-07-09 艾克索尼克斯股份有限公司 Integrated electromyography clinician programmer for use with an implantable neurostimulator
CN106659882A (en) 2014-08-15 2017-05-10 艾克索尼克斯调制技术股份有限公司 Implantable lead affixation structure for nerve stimulation to alleviate bladder dysfunction and other indications
JP6795490B2 (en) 2014-08-15 2020-12-02 アクソニクス モジュレーション テクノロジーズ インコーポレイテッド External pulse generator device and related methods for experimental nerve stimulation
CA2973191A1 (en) 2015-01-09 2016-07-14 Axonics Modulation Technologies, Inc. Attachment devices and associated methods of use with a nerve stimulation charging device
US9895546B2 (en) 2015-01-09 2018-02-20 Axonics Modulation Technologies, Inc. Patient remote and associated methods of use with a nerve stimulation system
CN107847731B (en) 2015-07-10 2019-06-28 艾克索尼克斯调制技术股份有限公司 The implantable nerve stimulator and application method of internal electronic equipment with no ASIC
US9517338B1 (en) 2016-01-19 2016-12-13 Axonics Modulation Technologies, Inc. Multichannel clip device and methods of use
US10195423B2 (en) 2016-01-19 2019-02-05 Axonics Modulation Technologies, Inc. Multichannel clip device and methods of use
US10603500B2 (en) 2016-01-29 2020-03-31 Axonics Modulation Technologies, Inc. Methods and systems for frequency adjustment to optimize charging of implantable neurostimulator
US10376704B2 (en) 2016-02-12 2019-08-13 Axonics Modulation Technologies, Inc. External pulse generator device and associated methods for trial nerve stimulation
JP2021513902A (en) 2018-02-22 2021-06-03 アクソニクス モジュレーション テクノロジーズ インコーポレイテッド Nerve Stimulation Leads and Usage for Experimental Nerve Stimulation
US11642537B2 (en) 2019-03-11 2023-05-09 Axonics, Inc. Charging device with off-center coil
US11848090B2 (en) 2019-05-24 2023-12-19 Axonics, Inc. Trainer for a neurostimulator programmer and associated methods of use with a neurostimulation system
US11439829B2 (en) 2019-05-24 2022-09-13 Axonics, Inc. Clinician programmer methods and systems for maintaining target operating temperatures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4991582A (en) * 1989-09-22 1991-02-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies
US5513793A (en) * 1994-10-07 1996-05-07 Advanced Bionics Corporation Brazeless ceramic-to-metal bond for use in implantable devices
US5738270A (en) * 1994-10-07 1998-04-14 Advanced Bionics Corporation Brazeless ceramic-to-metal bonding for use in implantable devices
US6011993A (en) * 1998-04-30 2000-01-04 Advanced Bionics Corporation Method of making implanted ceramic case with enhanced ceramic case strength

Also Published As

Publication number Publication date
WO2000056677A1 (en) 2000-09-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase