AU2857799A - System for cooling device in computer - Google Patents

System for cooling device in computer

Info

Publication number
AU2857799A
AU2857799A AU28577/99A AU2857799A AU2857799A AU 2857799 A AU2857799 A AU 2857799A AU 28577/99 A AU28577/99 A AU 28577/99A AU 2857799 A AU2857799 A AU 2857799A AU 2857799 A AU2857799 A AU 2857799A
Authority
AU
Australia
Prior art keywords
computer
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU28577/99A
Inventor
Ki-Oan Cheon
Kwang-Soon Lee
Mok-Hyoung Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KI OAN CHEON
MOK HYOUNG LEE
Original Assignee
KI OAN CHEON
MOK HYOUNG LEE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KI OAN CHEON, MOK HYOUNG LEE filed Critical KI OAN CHEON
Publication of AU2857799A publication Critical patent/AU2857799A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU28577/99A 1998-03-16 1999-03-15 System for cooling device in computer Abandoned AU2857799A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR988723 1998-03-16
KR1019980008723A KR19980019402A (en) 1998-03-16 1998-03-16 CPU COOLING DEVICE OF PC
PCT/KR1999/000118 WO1999047994A1 (en) 1998-03-16 1999-03-15 System for cooling device in computer

Publications (1)

Publication Number Publication Date
AU2857799A true AU2857799A (en) 1999-10-11

Family

ID=19534831

Family Applications (1)

Application Number Title Priority Date Filing Date
AU28577/99A Abandoned AU2857799A (en) 1998-03-16 1999-03-15 System for cooling device in computer

Country Status (6)

Country Link
EP (1) EP1062563A1 (en)
JP (1) JP2002517894A (en)
KR (2) KR19980019402A (en)
CN (1) CN1293774A (en)
AU (1) AU2857799A (en)
WO (1) WO1999047994A1 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000061442A (en) * 1999-03-26 2000-10-16 최은광 Computer cooling system mixing water cooling and air cooling
KR100468278B1 (en) * 1999-09-16 2005-01-27 현대중공업 주식회사 Heat pipe heat sink with conduction block
EP1158389A3 (en) * 2000-05-25 2002-11-13 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
WO2002017698A2 (en) * 2000-08-22 2002-02-28 Hb Innovation Ltd. Distributed thermal management system for electronic components
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
KR100440733B1 (en) * 2001-03-02 2004-07-19 주식회사 영동 Heat dissipating device for central processing unit in computer
KR20010069631A (en) * 2001-04-24 2001-07-25 김태국 Non direction plat type heat pump system
KR100438830B1 (en) * 2001-11-10 2004-07-05 삼성전자주식회사 Cooling device for computer
KR20030039206A (en) * 2001-11-12 2003-05-17 주식회사 다온테크 Improvement device of cooling fuction in cooling apparatus of radiator type
KR100441777B1 (en) * 2002-01-22 2004-07-23 성이제 Cooling system of computer central processing unit
KR20020028053A (en) * 2002-03-25 2002-04-15 (주)씨에스이 Cooling system using pc input/output port
KR20020028052A (en) * 2002-03-25 2002-04-15 (주)씨에스이 Pc cooling system and the control method
KR100939992B1 (en) * 2002-11-21 2010-02-03 삼성전자주식회사 Cooling Apparatus, and Electric-Electronic Equipment with the Cooling Apparatus
DE20309965U1 (en) * 2003-06-27 2003-09-04 Fujitsu Siemens Computers Gmbh Cooling a computer component
DE10360236A1 (en) * 2003-12-20 2005-07-28 Gerd Lukoschus Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate
DE102004020642A1 (en) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Cooling device for electronic microprocessors operates with a gravity cooling element with a flow of liquid expanding during heating and a radiator for contracting liquid
DE102004031251B4 (en) * 2004-06-29 2007-03-22 Sebastian Jaksch Device for liquid cooling of microprocessors in computer systems
KR100634997B1 (en) * 2004-07-14 2006-10-17 한국에너지기술연구원 Two-phase flow type refrigerating apparatus for Repeater
DE102005019437A1 (en) * 2005-01-25 2006-08-03 Axel Benner Computer e.g. personal computer, has functional components arranged in casing, and heat conductor extending between internal and external heat exchangers and dissipating heat generated by one componentcomponents components
CN100361045C (en) * 2005-07-08 2008-01-09 华硕电脑股份有限公司 Extended radiating device
TWI274985B (en) 2005-07-08 2007-03-01 Asustek Comp Inc Extendable cooling apparatus
KR101151712B1 (en) * 2005-07-11 2012-06-15 삼성전자주식회사 Cooling device for electric parts of cooling system and control method thereof
DE102006011331A1 (en) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Apparatus for cooling, in particular electronic components, gas coolers and evaporators
KR100851810B1 (en) * 2006-11-16 2008-08-13 한국생산기술연구원 Cooler For Water Cooling Device For Electronics by Using PCM
JP2010107153A (en) * 2008-10-31 2010-05-13 Toshiba Corp Evaporator and circulation type cooling device using the same
KR100934124B1 (en) * 2008-12-26 2009-12-29 에이스트로닉스 주식회사 Dust free and anti-vibration industrial computer
JP2011077346A (en) 2009-09-30 2011-04-14 Toshiba Corp Electronic device
CN102573397A (en) * 2010-12-23 2012-07-11 山特电子（深圳）有限公司 Heat transmission device as well as manufacturing and assembling method and equipment assembly of heat transmission device
CN102573396A (en) * 2010-12-23 2012-07-11 山特电子（深圳）有限公司 Cooling system and method for electronic equipment
US20130319639A1 (en) * 2011-02-22 2013-12-05 Nec Corporation Cooling device and method for making the same
JP6179145B2 (en) * 2013-03-18 2017-08-16 富士通株式会社 Electronic equipment system
JP2015207586A (en) * 2014-04-17 2015-11-19 富士通株式会社 Heat radiator, electronic apparatus, and base station device
CN105324005A (en) * 2014-07-25 2016-02-10 中兴通讯股份有限公司 Mobile terminal, method and device for realizing heat dissipation of mobile terminal
CN111031732A (en) * 2020-02-03 2020-04-17 重庆电子工程职业学院 Outdoor communication equipment mechanism convenient to move
KR102173535B1 (en) * 2020-06-01 2020-11-03 젝스컴퍼니 주식회사 Embedded board based on android enhenced real time response
KR102232902B1 (en) * 2020-06-24 2021-03-26 주식회사 에이치앤씨트랜스퍼 Electronic equipment device having cooling module and electronic equipment device assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144734A (en) * 1974-10-16 1976-04-16 Hitachi Ltd KUNENHIJIDOSEIGYO SOCHI
JPS5255065A (en) * 1975-10-30 1977-05-06 Shinko Electric Co Ltd Device for adjusting inter-electrode distance for use in electric dust collectors
JPS5848127A (en) * 1981-09-18 1983-03-22 Mitsubishi Electric Corp Cooling method of computer
JPS5886622A (en) * 1981-11-18 1983-05-24 Mitsubishi Electric Corp Computer
US5027254A (en) * 1989-11-09 1991-06-25 International Business Machines Corporation Apparatus for cooling electronics components
GB2241101A (en) * 1990-02-15 1991-08-21 Ibm Data storage system with device dependent flow of cooling air
JP2910127B2 (en) * 1990-03-01 1999-06-23 富士通株式会社 Cooling system
JPH04196395A (en) * 1990-11-28 1992-07-16 Hitachi Ltd Electronic computer and cooling device thereof
US5333460A (en) * 1992-12-21 1994-08-02 Carrier Corporation Compact and serviceable packaging of a self-contained cryocooler system
JPH09293985A (en) * 1996-04-25 1997-11-11 Canon Inc Electronic apparatus
JP3599490B2 (en) * 1996-07-19 2004-12-08 古河電気工業株式会社 Cooling structure of heating element of notebook type electronic equipment
KR19990061830A (en) * 1997-12-31 1999-07-26 윤종용 Heat dissipation structure of portable computer

Also Published As

Publication number Publication date
KR20010041932A (en) 2001-05-25
CN1293774A (en) 2001-05-02
KR19980019402A (en) 1998-06-05
EP1062563A1 (en) 2000-12-27
JP2002517894A (en) 2002-06-18
WO1999047994A1 (en) 1999-09-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase