AU2003286823A1 - Substrate processing apparatus and method - Google Patents

Substrate processing apparatus and method

Info

Publication number
AU2003286823A1
AU2003286823A1 AU2003286823A AU2003286823A AU2003286823A1 AU 2003286823 A1 AU2003286823 A1 AU 2003286823A1 AU 2003286823 A AU2003286823 A AU 2003286823A AU 2003286823 A AU2003286823 A AU 2003286823A AU 2003286823 A1 AU2003286823 A1 AU 2003286823A1
Authority
AU
Australia
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003286823A
Inventor
Naoaki Kobayashi
Kohsuke Ori
Kaori Tajima
Ryuta Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003286823A1 publication Critical patent/AU2003286823A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Treatment Of Fiber Materials (AREA)
AU2003286823A 2002-10-31 2003-10-30 Substrate processing apparatus and method Abandoned AU2003286823A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002318875A JP4105931B2 (en) 2002-10-31 2002-10-31 Object processing apparatus and method
JP2002-318875 2002-10-31
PCT/US2003/034758 WO2004041454A2 (en) 2002-10-31 2003-10-30 Substrate processing apparatus and method

Publications (1)

Publication Number Publication Date
AU2003286823A1 true AU2003286823A1 (en) 2004-06-07

Family

ID=32310348

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003286823A Abandoned AU2003286823A1 (en) 2002-10-31 2003-10-30 Substrate processing apparatus and method

Country Status (5)

Country Link
JP (1) JP4105931B2 (en)
KR (2) KR101094679B1 (en)
AU (1) AU2003286823A1 (en)
TW (1) TWI248109B (en)
WO (1) WO2004041454A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004046802B3 (en) * 2004-09-27 2006-04-27 Mafac Ernst Schwarz Gmbh & Co. Kg Maschinenfabrik Treatment device and method for the cleaning and / or drying treatment of workpieces
JP2006128238A (en) * 2004-10-27 2006-05-18 Aqua Science Kk Object treatment device and object treatment method
JP2007173277A (en) 2005-12-19 2007-07-05 Fujitsu Ltd Spin cleaning device and wafer cleaning method
JP4813430B2 (en) * 2007-07-12 2011-11-09 東京エレクトロン株式会社 Substrate cleaning apparatus, substrate cleaning method, and recording medium
US8360817B2 (en) 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
JP5634381B2 (en) * 2011-11-01 2014-12-03 東京エレクトロン株式会社 Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium
CN103700610B (en) * 2013-12-31 2017-01-25 北京七星华创电子股份有限公司 Device and method for improving wafer etching uniformity
CN104793385B (en) * 2015-04-23 2018-01-19 京东方科技集团股份有限公司 Stripping means, display base plate and the display device of ultra-thin substrate
CN110000141A (en) * 2019-04-22 2019-07-12 中信戴卡股份有限公司 A kind of mold automatic flushing device that cleaning solution recycles

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI86944C (en) * 1989-02-02 1992-10-26 Nokia Mobira Oy Method for washing circuit boards and a device has little use in the process
FI94271C (en) * 1992-11-03 1995-08-10 Valmet Paper Machinery Inc Method of cleaning rollers and roller cleaning device
US5269878A (en) * 1992-12-10 1993-12-14 Vlsi Technology, Inc. Metal patterning with dechlorinization in integrated circuit manufacture
DE19522525A1 (en) * 1994-10-04 1996-04-11 Kunze Concewitz Horst Dipl Phy Method and device for fine cleaning of surfaces
JP3320640B2 (en) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 Cleaning equipment
JPH11307492A (en) * 1998-04-20 1999-11-05 Tokyo Electron Ltd Substrate cleaning device
US6382849B1 (en) * 1999-06-09 2002-05-07 Tokyo Electron Limited Developing method and developing apparatus
US6634806B2 (en) * 2000-03-13 2003-10-21 Tokyo Electron Limited Substrate processing method and substrate processing apparatus

Also Published As

Publication number Publication date
JP2004153172A (en) 2004-05-27
KR20110105405A (en) 2011-09-26
TWI248109B (en) 2006-01-21
KR101252967B1 (en) 2013-04-15
WO2004041454A2 (en) 2004-05-21
TW200425223A (en) 2004-11-16
WO2004041454A3 (en) 2004-07-22
JP4105931B2 (en) 2008-06-25
KR101094679B1 (en) 2011-12-20
KR20050065668A (en) 2005-06-29

Similar Documents

Publication Publication Date Title
AU2003249616A1 (en) Substrate processing apparatus and related systems and methods
AU2003284605A1 (en) Plasma processing apparatus and plasma processing method
AU2003243016A1 (en) Plasma processing apparatus and plasma processing method
AU2003284683A1 (en) Plasma processing method and apparatus
AU2003284684A1 (en) Plasma processing apparatus and method
AU2003242104A1 (en) Processing device and processing method
AU2003284538A1 (en) Method of processing substrate and substrate processing apparatus
AU2003211351A1 (en) Plasma processing device and plasma processing method
AU2003266565A1 (en) Substrate processing apparatus
AU2003266564A1 (en) Substrate processing apparatus
AU2003259203A1 (en) Substrate processing apparatus
AU2003235587A1 (en) Processing device and processing method
AU2003211584A1 (en) Data processing apparatus and method thereof
AU2003303169A1 (en) Apparatus and method for processing streams
AU2003274737A1 (en) Information processing method and information processing apparatus
AU2003242422A1 (en) Substrate processing device and substrate processing method
AU2003284598A1 (en) Plasma processing apparatus and plasma processing method
EP1536460A4 (en) Substrate processing device and substrate processing method
AU2002354143A1 (en) Substrate processing method and substrate processing apparatus
AU2003234811A1 (en) Substrate processing device, substrate processing method, and developing device
AU2003284537A1 (en) Substrate processing method and substrate processing device
EP1532668A4 (en) Substrate processing apparatus and substrate processing method
AU2003261790A1 (en) Plasma processing method and plasma processing device
AU2003247165A1 (en) Laser processing method and laser processing apparatus
AU2003222219A1 (en) Web processing method and apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase