AU2002223889A1 - Thermoelectric devices - Google Patents

Thermoelectric devices

Info

Publication number
AU2002223889A1
AU2002223889A1 AU2002223889A AU2388902A AU2002223889A1 AU 2002223889 A1 AU2002223889 A1 AU 2002223889A1 AU 2002223889 A AU2002223889 A AU 2002223889A AU 2388902 A AU2388902 A AU 2388902A AU 2002223889 A1 AU2002223889 A1 AU 2002223889A1
Authority
AU
Australia
Prior art keywords
thermoelectric devices
thermoelectric
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002223889A
Inventor
Given Not
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2002223889A1 publication Critical patent/AU2002223889A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2002223889A 2000-12-07 2001-11-23 Thermoelectric devices Abandoned AU2002223889A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/731,999 US6467275B1 (en) 2000-12-07 2000-12-07 Cold point design for efficient thermoelectric coolers
US09731999 2000-12-07
PCT/GB2001/005194 WO2002047179A1 (en) 2000-12-07 2001-11-23 Thermoelectric devices

Publications (1)

Publication Number Publication Date
AU2002223889A1 true AU2002223889A1 (en) 2002-06-18

Family

ID=24941772

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002223889A Abandoned AU2002223889A1 (en) 2000-12-07 2001-11-23 Thermoelectric devices

Country Status (9)

Country Link
US (1) US6467275B1 (en)
EP (1) EP1340268A1 (en)
JP (2) JP4700896B2 (en)
KR (1) KR100634175B1 (en)
CN (1) CN1493090A (en)
AU (1) AU2002223889A1 (en)
IL (1) IL156323A0 (en)
TW (1) TW521141B (en)
WO (1) WO2002047179A1 (en)

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US20030118804A1 (en) * 2001-05-02 2003-06-26 3M Innovative Properties Company Sample processing device with resealable process chamber
US6712258B2 (en) * 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
US6889468B2 (en) 2001-12-28 2005-05-10 3M Innovative Properties Company Modular systems and methods for using sample processing devices
US20040018729A1 (en) * 2002-02-11 2004-01-29 Ghoshal Uttam Shyamalindu Enhanced interface thermoelectric coolers with all-metal tips
US6598403B1 (en) * 2002-04-11 2003-07-29 International Business Machines Corporation Nanoscopic thermoelectric refrigerators
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20050150535A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor
US8642353B2 (en) * 2004-05-10 2014-02-04 The Aerospace Corporation Microfluidic device for inducing separations by freezing and associated method
US7694694B2 (en) * 2004-05-10 2010-04-13 The Aerospace Corporation Phase-change valve apparatuses
US7721762B2 (en) * 2004-06-24 2010-05-25 The Aerospace Corporation Fast acting valve apparatuses
US7650910B2 (en) * 2004-06-24 2010-01-26 The Aerospace Corporation Electro-hydraulic valve apparatuses
US7686040B2 (en) * 2004-06-24 2010-03-30 The Aerospace Corporation Electro-hydraulic devices
US7305839B2 (en) * 2004-06-30 2007-12-11 General Electric Company Thermal transfer device and system and method incorporating same
US20060068611A1 (en) * 2004-09-30 2006-03-30 Weaver Stanton E Jr Heat transfer device and system and method incorporating same
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7260939B2 (en) * 2004-12-17 2007-08-28 General Electric Company Thermal transfer device and system and method incorporating same
US7498507B2 (en) * 2005-03-16 2009-03-03 General Electric Company Device for solid state thermal transfer and power generation
US7763210B2 (en) 2005-07-05 2010-07-27 3M Innovative Properties Company Compliant microfluidic sample processing disks
US7754474B2 (en) 2005-07-05 2010-07-13 3M Innovative Properties Company Sample processing device compression systems and methods
US7323660B2 (en) * 2005-07-05 2008-01-29 3M Innovative Properties Company Modular sample processing apparatus kits and modules
EP2107944B1 (en) * 2006-12-22 2013-03-27 3M Innovative Properties Company Enhanced sample processing devices, systems and methods
CN101568385B (en) 2006-12-22 2012-08-15 3M创新有限公司 Thermal transfer methods and structures for microfluidic systems
KR20090118305A (en) * 2008-05-13 2009-11-18 삼성전자주식회사 A method and apparatus for electric charge using a plurality of thermoelectric generator
WO2009150725A1 (en) * 2008-06-11 2009-12-17 崔 炳奎 Method for controlling electron heat exchanging element, control device, heat exchanging module, and water cleaner using module
USD638951S1 (en) 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD638550S1 (en) 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
US8834792B2 (en) 2009-11-13 2014-09-16 3M Innovative Properties Company Systems for processing sample processing devices
USD667561S1 (en) 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
JP2013511702A (en) * 2009-11-20 2013-04-04 ネッシー ガーテゥボー ゲーエムベーハー Thermal analysis system and thermal analysis method
US9168523B2 (en) 2011-05-18 2015-10-27 3M Innovative Properties Company Systems and methods for detecting the presence of a selected volume of material in a sample processing device
BR112013027990B1 (en) 2011-05-18 2020-11-03 Diasorin S.P.A. valve structure in a sample processing device and method for operating valves in a sample processing device
EP2709761B1 (en) 2011-05-18 2019-08-14 DiaSorin S.p.A. Systems and methods for volumetric metering on a sample processing device
US20150207055A1 (en) 2012-08-21 2015-07-23 Mahito Mabuchi Thermoelectric conversion element including, in thermoelectric material, spaces or bridging spaces such that heat transfer amounts are reduced and working substance flow is equal to or greater than those of original thermoelectric material
US10982883B1 (en) * 2014-08-06 2021-04-20 Ambassador Asset Management Limited Partnership Portable active temperature controlled container comprising a cool sink
KR101806661B1 (en) 2016-01-26 2017-12-07 현대자동차주식회사 Apparatus for manufacuring the thermoelectric module
CN108565332B (en) * 2018-04-26 2021-01-05 东华大学 Vacuum thermal electric tube

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DE3404137A1 (en) 1984-02-07 1985-08-08 Reinhard Dr. 7101 Flein Dahlberg Thermoelectric configuration having foreign-layer contacts
DE3404138A1 (en) * 1984-02-07 1985-08-08 Reinhard Dr. 7101 Flein Dahlberg Thermoelectric configuration having constriction resistors
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US5415699A (en) * 1993-01-12 1995-05-16 Massachusetts Institute Of Technology Superlattice structures particularly suitable for use as thermoelectric cooling materials
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US6060657A (en) * 1998-06-24 2000-05-09 Massachusetts Institute Of Technology Lead-chalcogenide superlattice structures
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IL145350A0 (en) * 1999-03-11 2002-06-30 Eneco Inc Hybrid thermionic energy converter and method
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US6348650B1 (en) * 1999-03-24 2002-02-19 Ishizuka Electronics Corporation Thermopile infrared sensor and process for producing the same
US6444896B1 (en) * 1999-08-27 2002-09-03 Massachusetts Institute Of Technology Quantum dot thermoelectric materials and devices
WO2001017035A1 (en) * 1999-08-27 2001-03-08 Massachusetts Institute Of Technology Quantum dot thermoelectric materials and devices

Also Published As

Publication number Publication date
WO2002047179A1 (en) 2002-06-13
JP4493706B2 (en) 2010-06-30
KR20030059301A (en) 2003-07-07
JP2004515927A (en) 2004-05-27
TW521141B (en) 2003-02-21
CN1493090A (en) 2004-04-28
JP2009021593A (en) 2009-01-29
IL156323A0 (en) 2004-01-04
US6467275B1 (en) 2002-10-22
KR100634175B1 (en) 2006-10-16
EP1340268A1 (en) 2003-09-03
JP4700896B2 (en) 2011-06-15

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