AU2001289080A1 - Highly efficient capacitor structures with enhanced matching properties - Google Patents
Highly efficient capacitor structures with enhanced matching propertiesInfo
- Publication number
- AU2001289080A1 AU2001289080A1 AU2001289080A AU8908001A AU2001289080A1 AU 2001289080 A1 AU2001289080 A1 AU 2001289080A1 AU 2001289080 A AU2001289080 A AU 2001289080A AU 8908001 A AU8908001 A AU 8908001A AU 2001289080 A1 AU2001289080 A1 AU 2001289080A1
- Authority
- AU
- Australia
- Prior art keywords
- vertical plates
- vertical
- capacitor structure
- terminal
- vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Discharge Lamp (AREA)
Abstract
The present specification discloses highly efficient capacitor structures. One embodiment of the present invention is referred to herein as a vertical parallel plate (VPP) structure. In accordance with this embodiment, a capacitor structure comprises a plurality of vertical plates. The vertical plates are substantially parallel to each other, and each vertical plate comprises multiple conducting strips. These conducting strips are substantially parallel to each other and are connected to each other by one or more vias. The vertical plates are alternately connected to each other, creating a first portion of the vertical plates and a second portion of the vertical plates, such that the first portion of the vertical plates forms a first terminal of the capacitor structure, and the second portion of the vertical plates forms a second terminal of the capacitor structure. Either slotted vias or individual vias can be used to connect the conducting strips. Another embodiment of the present invention is referred to herein as a vertical bars (VB) structure. In accordance with this embodiment of the present invention, a capacitor structure comprises a plurality of rows of vertical bars, wherein within each row, the vertical bars are parallel to each other, and each vertical bar comprises multiple conducting patches. These conducting patches are connected to each other by one or more vias. The rows of vertical bars form a first direction and a second direction, wherein the second direction is orthogonal to the first direction. In the first direction, the vertical bars are alternately connected to each other, creating a first portion of the vertical plates and a second portion of the vertical plates. The first portion of the vertical plates forms a section of the first terminal of the capacitor structure, and the second portion of the vertical plates forms a section of the second terminal of the capacitor structure. In the second direction, the vertical bars are alternately connected to each other, creating a third portion of the vertical plates and a fourth portion of the vertical plates. The third portion of the vertical plates forms a remaining section of the first terminal of the capacitor structure, and the fourth portion of the vertical plates forms a remaining section of the second terminal of the capacitor structure. Either slotted vias or individual vias can be used to connect the conducting strips.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23265100P | 2000-09-14 | 2000-09-14 | |
US60/232,651 | 2000-09-14 | ||
US09/927,761 US6690570B2 (en) | 2000-09-14 | 2001-08-09 | Highly efficient capacitor structures with enhanced matching properties |
US09/927,761 | 2001-08-09 | ||
PCT/US2001/028693 WO2002027770A2 (en) | 2000-09-14 | 2001-09-14 | Highly efficient capacitor structures with enhanced matching properties |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001289080A1 true AU2001289080A1 (en) | 2002-04-08 |
Family
ID=26926203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001289080A Abandoned AU2001289080A1 (en) | 2000-09-14 | 2001-09-14 | Highly efficient capacitor structures with enhanced matching properties |
Country Status (9)
Country | Link |
---|---|
US (2) | US6690570B2 (en) |
EP (1) | EP1319245B1 (en) |
JP (1) | JP2004511899A (en) |
KR (1) | KR100864122B1 (en) |
CN (1) | CN1459123A (en) |
AT (1) | ATE396496T1 (en) |
AU (1) | AU2001289080A1 (en) |
DE (1) | DE60134159D1 (en) |
WO (1) | WO2002027770A2 (en) |
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AU2002314614A1 (en) * | 2002-06-03 | 2003-12-19 | Telefonaktiebolaget L.M. Ericsson | A capacitor device formed on a substrate, integrated circuit com prising such a device and method for manufacturing a capacitor device |
TW548779B (en) * | 2002-08-09 | 2003-08-21 | Acer Labs Inc | Integrated capacitor and method of making same |
CA2395900A1 (en) * | 2002-08-12 | 2004-02-12 | Christopher Andrew Devries | Matched vertical capacitors |
US7095072B2 (en) * | 2003-01-16 | 2006-08-22 | Nec Electronics Corporation | Semiconductor device with wiring layers forming a capacitor |
US6934143B2 (en) | 2003-10-03 | 2005-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-metal capacitor structure |
US6949781B2 (en) * | 2003-10-10 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co. Ltd. | Metal-over-metal devices and the method for manufacturing same |
JP3954561B2 (en) * | 2003-11-27 | 2007-08-08 | 沖電気工業株式会社 | Multilayer power supply line of semiconductor integrated circuit and layout method thereof |
JP2005183567A (en) * | 2003-12-18 | 2005-07-07 | Matsushita Electric Ind Co Ltd | Manufacturing method for semiconductor integrated circuit, shared mask for forming via-hole, and semiconductor integrated circuit |
US7259956B2 (en) * | 2003-12-19 | 2007-08-21 | Broadcom Corporation | Scalable integrated circuit high density capacitors |
JP4615962B2 (en) * | 2004-10-22 | 2011-01-19 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
US7009832B1 (en) * | 2005-03-14 | 2006-03-07 | Broadcom Corporation | High density metal-to-metal maze capacitor with optimized capacitance matching |
JP2006261455A (en) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | Semiconductor device and mim caspacitor |
TWI258865B (en) * | 2005-03-29 | 2006-07-21 | Realtek Semiconductor Corp | Longitudinal plate capacitor structure |
US20060261439A1 (en) * | 2005-05-17 | 2006-11-23 | Chih-Fu Chien | Capacitor structure |
KR100695989B1 (en) * | 2005-06-30 | 2007-03-15 | 매그나칩 반도체 유한회사 | Flux capacitor of semiconductor devices |
TWI269321B (en) * | 2005-07-27 | 2006-12-21 | Ind Tech Res Inst | Symmetrical capacitor |
US8294505B2 (en) | 2005-08-23 | 2012-10-23 | International Business Machines Corporation | Stackable programmable passive device and a testing method |
DE102005045056B4 (en) * | 2005-09-21 | 2007-06-21 | Infineon Technologies Ag | Integrated circuit arrangement with multiple conductive structure layers and capacitor |
DE102005045059B4 (en) * | 2005-09-21 | 2011-05-19 | Infineon Technologies Ag | Integrated circuit arrangement with several Leitstrukturlagen and coil and method for manufacturing |
DE102005046734B4 (en) * | 2005-09-29 | 2011-06-16 | Infineon Technologies Ag | Semiconductor device with integrated capacitance structure |
DE102005047409A1 (en) * | 2005-10-04 | 2007-04-12 | Infineon Technologies Ag | Semiconductor component has several strip elements forming electrodes intermeshing with one another and of which at least one strip element has a non-constant cross-section |
US8536677B2 (en) * | 2005-10-04 | 2013-09-17 | Infineon Technologies Ag | Capacitor structure |
KR100731078B1 (en) * | 2005-12-30 | 2007-06-22 | 동부일렉트로닉스 주식회사 | Mom capacitor |
US7585722B2 (en) * | 2006-01-10 | 2009-09-08 | International Business Machines Corporation | Integrated circuit comb capacitor |
US7645675B2 (en) * | 2006-01-13 | 2010-01-12 | International Business Machines Corporation | Integrated parallel plate capacitors |
US20070181973A1 (en) * | 2006-02-06 | 2007-08-09 | Cheng-Chou Hung | Capacitor structure |
JP5259054B2 (en) * | 2006-02-14 | 2013-08-07 | 富士通セミコンダクター株式会社 | Capacity cell, and capacity |
US7456462B1 (en) * | 2006-03-07 | 2008-11-25 | Alvand Technologies, Inc. | Fabricated U-shaped capacitor for a digital-to-analog converter |
US7446365B1 (en) | 2006-03-07 | 2008-11-04 | Alvand Technologies, Inc. | Fabricated layered capacitor for a digital-to-analog converter |
US7411270B2 (en) * | 2006-04-03 | 2008-08-12 | Freescale Semiconductor, Inc. | Composite capacitor and method for forming the same |
US7466534B2 (en) * | 2006-06-06 | 2008-12-16 | International Business Machines Corporation | High capacitance density vertical natural capacitors |
US9177908B2 (en) * | 2007-04-30 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Limited | Stacked semiconductor capacitor structure |
US20090014832A1 (en) * | 2007-07-09 | 2009-01-15 | Peter Baumgartner | Semiconductor Device with Reduced Capacitance Tolerance Value |
EP2203931B1 (en) * | 2007-11-02 | 2015-11-25 | Ipdia | Multilayer capactive structure and method of producing the same |
US8014125B2 (en) * | 2007-11-26 | 2011-09-06 | Ati Technologies Ulc | Chip capacitor |
US8138539B2 (en) * | 2007-11-29 | 2012-03-20 | Infineon Technologies Ag | Semiconductor devices and methods of manufacture thereof |
US20090160019A1 (en) * | 2007-12-20 | 2009-06-25 | Mediatek Inc. | Semiconductor capacitor |
US20100090308A1 (en) * | 2008-10-10 | 2010-04-15 | Charu Sardana | Metal-oxide-metal capacitors with bar vias |
JP5540006B2 (en) * | 2008-11-21 | 2014-07-02 | ザイリンクス インコーポレイテッド | Shielding for integrated capacitors |
US7994609B2 (en) * | 2008-11-21 | 2011-08-09 | Xilinx, Inc. | Shielding for integrated capacitors |
US7944732B2 (en) * | 2008-11-21 | 2011-05-17 | Xilinx, Inc. | Integrated capacitor with alternating layered segments |
US7956438B2 (en) * | 2008-11-21 | 2011-06-07 | Xilinx, Inc. | Integrated capacitor with interlinked lateral fins |
US8362589B2 (en) * | 2008-11-21 | 2013-01-29 | Xilinx, Inc. | Integrated capacitor with cabled plates |
US7994610B1 (en) | 2008-11-21 | 2011-08-09 | Xilinx, Inc. | Integrated capacitor with tartan cross section |
US8207592B2 (en) * | 2008-11-21 | 2012-06-26 | Xilinx, Inc. | Integrated capacitor with array of crosses |
KR101024652B1 (en) * | 2008-12-09 | 2011-03-25 | 매그나칩 반도체 유한회사 | Capacitor structures |
US20100232085A1 (en) | 2009-03-12 | 2010-09-16 | Mediatek Inc. | Electronic devices with floating metal rings |
KR101595788B1 (en) | 2009-03-18 | 2016-02-22 | 삼성전자주식회사 | Capacitor structure and method of manufacturing the capacitor structure |
US8242579B2 (en) * | 2009-05-25 | 2012-08-14 | Infineon Technologies Ag | Capacitor structure |
US8378450B2 (en) * | 2009-08-27 | 2013-02-19 | International Business Machines Corporation | Interdigitated vertical parallel capacitor |
TW201110167A (en) * | 2009-09-04 | 2011-03-16 | Novatek Microelectronics Corp | Metal-oxide-metal capacitor having low parasitic capacitor |
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US8653844B2 (en) | 2011-03-07 | 2014-02-18 | Xilinx, Inc. | Calibrating device performance within an integrated circuit |
CN102820279B (en) * | 2011-06-10 | 2015-06-17 | 台湾积体电路制造股份有限公司 | Vertically mutual crossing semiconductor capacitor |
US8759893B2 (en) * | 2011-09-07 | 2014-06-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Horizontal interdigitated capacitor structure with vias |
US8941974B2 (en) | 2011-09-09 | 2015-01-27 | Xilinx, Inc. | Interdigitated capacitor having digits of varying width |
DE102011053536B4 (en) | 2011-09-12 | 2019-06-19 | X-Fab Semiconductor Foundries Ag | Semiconductor device with a metallization system |
US20130320494A1 (en) * | 2012-06-01 | 2013-12-05 | Qualcomm Incorporated | Metal finger capacitors with hybrid metal finger orientations in stack with unidirectional metal layers |
US9123719B2 (en) * | 2012-06-26 | 2015-09-01 | Broadcom Corporation | Metal-oxide-metal capacitor |
US9450041B2 (en) * | 2012-11-28 | 2016-09-20 | Marvell World Trade Ltd. | Stackable high-density metal-oxide-metal capacitor with minimum top plate parasitic capacitance |
CN104425441B (en) * | 2013-09-04 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of MOM capacitor |
US9270247B2 (en) | 2013-11-27 | 2016-02-23 | Xilinx, Inc. | High quality factor inductive and capacitive circuit structure |
CN103995028B (en) * | 2014-06-04 | 2017-01-11 | 江南大学 | Capacitive lampblack concentration sensor |
US9524964B2 (en) | 2014-08-14 | 2016-12-20 | Xilinx, Inc. | Capacitor structure in an integrated circuit |
KR20180126914A (en) * | 2017-05-19 | 2018-11-28 | 에스케이하이닉스 주식회사 | Semiconductor memory device having capacitor |
EP3703124A4 (en) * | 2017-12-29 | 2020-11-11 | Huawei Technologies Co. Ltd. | Capacitor |
US10615113B2 (en) | 2018-06-13 | 2020-04-07 | Qualcomm Incorporated | Rotated metal-oxide-metal (RTMOM) capacitor |
KR20200077672A (en) | 2018-12-20 | 2020-07-01 | 삼성전자주식회사 | High efficient capacitor structure |
WO2020260747A1 (en) | 2019-06-28 | 2020-12-30 | Corehw Semiconductor Oy | A capacitor structure and a chip antenna |
CN110323334B (en) * | 2019-07-09 | 2023-03-24 | 四川中微芯成科技有限公司 | Structure and method for using parasitic capacitor as ADC capacitor |
US11715594B2 (en) | 2021-05-27 | 2023-08-01 | International Business Machines Corporation | Vertically-stacked interdigitated metal-insulator-metal capacitor for sub-20 nm pitch |
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US5208725A (en) | 1992-08-19 | 1993-05-04 | Akcasu Osman E | High capacitance structure in a semiconductor device |
US5583359A (en) * | 1995-03-03 | 1996-12-10 | Northern Telecom Limited | Capacitor structure for an integrated circuit |
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JPH1065101A (en) | 1996-08-22 | 1998-03-06 | Sony Corp | Semiconductor device |
US5978206A (en) | 1997-09-30 | 1999-11-02 | Hewlett-Packard Company | Stacked-fringe integrated circuit capacitors |
US6822312B2 (en) | 2000-04-07 | 2004-11-23 | Koninklijke Philips Electronics N.V. | Interdigitated multilayer capacitor structure for deep sub-micron CMOS |
US6570210B1 (en) | 2000-06-19 | 2003-05-27 | Koninklijke Philips Electronics N.V. | Multilayer pillar array capacitor structure for deep sub-micron CMOS |
-
2001
- 2001-08-09 US US09/927,761 patent/US6690570B2/en not_active Expired - Lifetime
- 2001-09-14 EP EP01968869A patent/EP1319245B1/en not_active Expired - Lifetime
- 2001-09-14 JP JP2002531469A patent/JP2004511899A/en not_active Withdrawn
- 2001-09-14 CN CN01815650A patent/CN1459123A/en active Pending
- 2001-09-14 KR KR1020037003814A patent/KR100864122B1/en active IP Right Grant
- 2001-09-14 AT AT01968869T patent/ATE396496T1/en not_active IP Right Cessation
- 2001-09-14 WO PCT/US2001/028693 patent/WO2002027770A2/en active Application Filing
- 2001-09-14 DE DE60134159T patent/DE60134159D1/en not_active Expired - Lifetime
- 2001-09-14 AU AU2001289080A patent/AU2001289080A1/en not_active Abandoned
-
2003
- 2003-04-24 US US10/422,284 patent/US20030206389A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE60134159D1 (en) | 2008-07-03 |
WO2002027770A3 (en) | 2003-02-27 |
US20030206389A1 (en) | 2003-11-06 |
CN1459123A (en) | 2003-11-26 |
EP1319245B1 (en) | 2008-05-21 |
US20020093780A1 (en) | 2002-07-18 |
JP2004511899A (en) | 2004-04-15 |
WO2002027770A2 (en) | 2002-04-04 |
EP1319245A2 (en) | 2003-06-18 |
ATE396496T1 (en) | 2008-06-15 |
KR100864122B1 (en) | 2008-10-16 |
KR20030036792A (en) | 2003-05-09 |
US6690570B2 (en) | 2004-02-10 |
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