AU2001288073A1 - Method of measuring image characteristics and exposure method - Google Patents

Method of measuring image characteristics and exposure method

Info

Publication number
AU2001288073A1
AU2001288073A1 AU2001288073A AU8807301A AU2001288073A1 AU 2001288073 A1 AU2001288073 A1 AU 2001288073A1 AU 2001288073 A AU2001288073 A AU 2001288073A AU 8807301 A AU8807301 A AU 8807301A AU 2001288073 A1 AU2001288073 A1 AU 2001288073A1
Authority
AU
Australia
Prior art keywords
image characteristics
measuring image
exposure
exposure method
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288073A
Inventor
Masahiko Okumura
Hiroki Okuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2001288073A1 publication Critical patent/AU2001288073A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2001288073A 2000-09-21 2001-09-20 Method of measuring image characteristics and exposure method Abandoned AU2001288073A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-286515 2000-09-21
JP2000286515 2000-09-21
PCT/JP2001/008177 WO2002025711A1 (en) 2000-09-21 2001-09-20 Method of measuring image characteristics and exposure method

Publications (1)

Publication Number Publication Date
AU2001288073A1 true AU2001288073A1 (en) 2002-04-02

Family

ID=18770427

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288073A Abandoned AU2001288073A1 (en) 2000-09-21 2001-09-20 Method of measuring image characteristics and exposure method

Country Status (5)

Country Link
JP (1) JPWO2002025711A1 (en)
KR (1) KR20030033067A (en)
CN (1) CN1462471A (en)
AU (1) AU2001288073A1 (en)
WO (1) WO2002025711A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2950147B1 (en) * 2003-04-10 2017-04-26 Nikon Corporation Environmental system including vaccum scavenge for an immersion lithography apparatus
KR100806036B1 (en) * 2003-11-13 2008-02-26 동부일렉트로닉스 주식회사 Exposure method for semiconductor wafer
EP1724816A4 (en) * 2004-02-13 2007-10-24 Nikon Corp Exposure method and system, and device production method
KR101604564B1 (en) * 2006-09-01 2016-03-17 가부시키가이샤 니콘 Mobile body driving method, mobile body driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method
JP5006762B2 (en) * 2007-11-05 2012-08-22 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP5404216B2 (en) 2009-07-02 2014-01-29 キヤノン株式会社 Exposure method, exposure apparatus, and device manufacturing method
NL2008924A (en) * 2011-06-22 2013-01-02 Asml Netherlands Bv System and method to ensure source and image stability.
US8703368B2 (en) * 2012-07-16 2014-04-22 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography process
CN103439869B (en) * 2013-09-02 2016-01-27 上海华力微电子有限公司 The method of measurement pattern density
CN107187057A (en) * 2017-05-17 2017-09-22 合肥蔚星光电科技有限公司 A kind of scaling method of projection lens enlargement ratio
CN108896550B (en) * 2018-03-30 2021-10-22 湖北工程学院 Facial mask printing quality detection method and system
CN111254066B (en) * 2018-12-03 2023-05-05 长春长光华大智造测序设备有限公司 Imaging adjusting device and high-throughput gene sequencer
JP7361599B2 (en) * 2019-12-26 2023-10-16 キヤノン株式会社 Exposure equipment and article manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3506155B2 (en) * 1995-02-21 2004-03-15 株式会社ニコン Projection exposure equipment
JPH1012515A (en) * 1996-06-20 1998-01-16 Nikon Corp Projection aligner
JPH10261563A (en) * 1997-03-18 1998-09-29 Nikon Corp Projection aligner method and device
JPH10289864A (en) * 1997-04-11 1998-10-27 Nikon Corp Projection exposing device
JPH10312958A (en) * 1997-05-13 1998-11-24 Hitachi Ltd Fabrication of semiconductor integrated circuit device
JPH11176733A (en) * 1997-12-15 1999-07-02 Nikon Corp Exposure method and aligner

Also Published As

Publication number Publication date
CN1462471A (en) 2003-12-17
WO2002025711A1 (en) 2002-03-28
JPWO2002025711A1 (en) 2004-01-29
KR20030033067A (en) 2003-04-26

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