AU2001281624A1 - Distributed thermal management system for electronic components - Google Patents

Distributed thermal management system for electronic components

Info

Publication number
AU2001281624A1
AU2001281624A1 AU2001281624A AU8162401A AU2001281624A1 AU 2001281624 A1 AU2001281624 A1 AU 2001281624A1 AU 2001281624 A AU2001281624 A AU 2001281624A AU 8162401 A AU8162401 A AU 8162401A AU 2001281624 A1 AU2001281624 A1 AU 2001281624A1
Authority
AU
Australia
Prior art keywords
management system
electronic components
thermal management
distributed thermal
distributed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281624A
Inventor
Jeffrey R. Brown
Howard R. Harrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HB Innovation Ltd
Original Assignee
HB Innovation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HB Innovation Ltd filed Critical HB Innovation Ltd
Publication of AU2001281624A1 publication Critical patent/AU2001281624A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2001281624A 2000-08-22 2001-08-22 Distributed thermal management system for electronic components Abandoned AU2001281624A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22668900P 2000-08-22 2000-08-22
US60/226,689 2000-08-22
PCT/CA2001/001167 WO2002017698A2 (en) 2000-08-22 2001-08-22 Distributed thermal management system for electronic components

Publications (1)

Publication Number Publication Date
AU2001281624A1 true AU2001281624A1 (en) 2002-03-04

Family

ID=22849988

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281624A Abandoned AU2001281624A1 (en) 2000-08-22 2001-08-22 Distributed thermal management system for electronic components

Country Status (2)

Country Link
AU (1) AU2001281624A1 (en)
WO (1) WO2002017698A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408224B2 (en) * 2004-01-29 2010-02-03 富士通株式会社 Housing with heat dissipation function
EP2117288A1 (en) * 2008-05-07 2009-11-11 3M Innovative Properties Company Heat-management system for a cabinet containing electronic equipment
DE102018105768B3 (en) 2018-03-13 2019-07-04 Apelsin Enterprises GmbH Cabinet for installation of IT, EDP, network and / or telecommunication systems

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812733A (en) * 1987-10-27 1989-03-14 Richard Tobey Computer element performance enhancer
DE19527674C2 (en) * 1995-07-31 2000-11-02 Anceram Gmbh & Co Kg Cooling device
KR19980019402A (en) * 1998-03-16 1998-06-05 천기완 CPU COOLING DEVICE OF PC

Also Published As

Publication number Publication date
WO2002017698A2 (en) 2002-02-28
WO2002017698A8 (en) 2002-04-11
WO2002017698A3 (en) 2002-09-06

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