WO2001045230A1
(en)
*
|
1999-12-16 |
2001-06-21 |
Mcandrews Enterprises Inc. |
Spare bus power plant
|
US6995685B2
(en)
|
2001-09-25 |
2006-02-07 |
Landis+Gyr, Inc. |
Utility meter power arrangements and methods
|
US6819226B2
(en)
*
|
2002-05-28 |
2004-11-16 |
Smartsynch, Incorporated |
Systems and methods for energy storage in land-based telemetry applications
|
FR2847715B1
(en)
*
|
2002-11-25 |
2005-03-11 |
Commissariat Energie Atomique |
INTEGRATED CIRCUIT COMPRISING SERIES CONNECTED SUBASSEMBLIES
|
US8013611B2
(en)
|
2006-07-14 |
2011-09-06 |
Reserve Power Cell, Llc |
Vehicle battery product and battery monitoring system
|
US7567057B2
(en)
*
|
2003-08-11 |
2009-07-28 |
Reserve Power Cell, Llc |
Multiple battery management system, auxiliary battery attachment system, and network controlled multiple battery system
|
US7339347B2
(en)
|
2003-08-11 |
2008-03-04 |
Reserve Power Cell, Llc |
Apparatus and method for reliably supplying electrical energy to an electrical system
|
US8525314B2
(en)
|
2004-11-03 |
2013-09-03 |
Tessera, Inc. |
Stacked packaging improvements
|
US7598700B2
(en)
*
|
2005-03-30 |
2009-10-06 |
Reserve Power Cell, Llc |
Tamper resistant battery and battery warranty and performance tracking system
|
US7573235B2
(en)
*
|
2005-09-26 |
2009-08-11 |
The Unites States Of America As Repsented By The Secretary Of The Navy |
Battery charger and power reduction system and method
|
US8058101B2
(en)
|
2005-12-23 |
2011-11-15 |
Tessera, Inc. |
Microelectronic packages and methods therefor
|
US8558508B2
(en)
*
|
2007-06-08 |
2013-10-15 |
C & C Power, Inc. |
Battery system and management method
|
US20100289335A1
(en)
*
|
2009-05-12 |
2010-11-18 |
Radhakrishna Togare |
Active back up auto changeover voltage bus
|
JP5307675B2
(en)
*
|
2009-09-28 |
2013-10-02 |
京セラ株式会社 |
Portable electronic devices
|
CN102118043B
(en)
*
|
2009-12-31 |
2013-12-04 |
比亚迪股份有限公司 |
Solar charger for charging power battery
|
CN102148531A
(en)
*
|
2010-02-10 |
2011-08-10 |
西安锐信科技有限公司 |
Power supply method, device and system for storage batteries
|
CN101895148B
(en)
*
|
2010-05-25 |
2012-07-04 |
海能达通信股份有限公司 |
Dual-power stable-switching device and method
|
EP2579425B1
(en)
|
2010-05-25 |
2018-04-11 |
Hytera Communications Corp., Ltd. |
Smooth switching device and method for double power supplies
|
US8558712B2
(en)
*
|
2010-06-03 |
2013-10-15 |
C&C Power, Inc. |
Battery system and management method
|
US9159708B2
(en)
|
2010-07-19 |
2015-10-13 |
Tessera, Inc. |
Stackable molded microelectronic packages with area array unit connectors
|
US8482111B2
(en)
|
2010-07-19 |
2013-07-09 |
Tessera, Inc. |
Stackable molded microelectronic packages
|
WO2012029221A1
(en)
*
|
2010-08-31 |
2012-03-08 |
パナソニック株式会社 |
Battery power supply device and battery power supply system
|
KR101075241B1
(en)
|
2010-11-15 |
2011-11-01 |
테세라, 인코포레이티드 |
Microelectronic package with terminals on dielectric mass
|
US20120146206A1
(en)
|
2010-12-13 |
2012-06-14 |
Tessera Research Llc |
Pin attachment
|
US20120153900A1
(en)
*
|
2010-12-20 |
2012-06-21 |
Nexergy, Inc. |
Two-way switching regulator
|
WO2012145839A1
(en)
*
|
2011-04-29 |
2012-11-01 |
Fournier Paul W |
Integration of a service cabinet into a street furniture
|
KR101128063B1
(en)
|
2011-05-03 |
2012-04-23 |
테세라, 인코포레이티드 |
Package-on-package assembly with wire bonds to encapsulation surface
|
US8404520B1
(en)
|
2011-10-17 |
2013-03-26 |
Invensas Corporation |
Package-on-package assembly with wire bond vias
|
TWI515995B
(en)
*
|
2012-01-06 |
2016-01-01 |
鴻海精密工業股份有限公司 |
Battery charging system and method
|
US8946757B2
(en)
|
2012-02-17 |
2015-02-03 |
Invensas Corporation |
Heat spreading substrate with embedded interconnects
|
US8372741B1
(en)
|
2012-02-24 |
2013-02-12 |
Invensas Corporation |
Method for package-on-package assembly with wire bonds to encapsulation surface
|
US9349706B2
(en)
|
2012-02-24 |
2016-05-24 |
Invensas Corporation |
Method for package-on-package assembly with wire bonds to encapsulation surface
|
JP5849799B2
(en)
*
|
2012-03-19 |
2016-02-03 |
富士通株式会社 |
Power circuit
|
US8835228B2
(en)
|
2012-05-22 |
2014-09-16 |
Invensas Corporation |
Substrate-less stackable package with wire-bond interconnect
|
US9391008B2
(en)
|
2012-07-31 |
2016-07-12 |
Invensas Corporation |
Reconstituted wafer-level package DRAM
|
US9502390B2
(en)
|
2012-08-03 |
2016-11-22 |
Invensas Corporation |
BVA interposer
|
US9966618B2
(en)
*
|
2012-12-09 |
2018-05-08 |
United Technologies Corporation |
Flow battery with voltage-limiting device
|
US8878353B2
(en)
|
2012-12-20 |
2014-11-04 |
Invensas Corporation |
Structure for microelectronic packaging with bond elements to encapsulation surface
|
US9136254B2
(en)
|
2013-02-01 |
2015-09-15 |
Invensas Corporation |
Microelectronic package having wire bond vias and stiffening layer
|
US8749193B1
(en)
*
|
2013-05-10 |
2014-06-10 |
Inpower Llc |
Battery protection circuit for multiple battery power supply and charging system
|
US20150001943A1
(en)
*
|
2013-06-28 |
2015-01-01 |
General Electric Company |
System with dual battery back-up and related methods of operation
|
US8883563B1
(en)
|
2013-07-15 |
2014-11-11 |
Invensas Corporation |
Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
|
US9023691B2
(en)
|
2013-07-15 |
2015-05-05 |
Invensas Corporation |
Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
|
US9034696B2
(en)
|
2013-07-15 |
2015-05-19 |
Invensas Corporation |
Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
|
US9167710B2
(en)
|
2013-08-07 |
2015-10-20 |
Invensas Corporation |
Embedded packaging with preformed vias
|
US9685365B2
(en)
|
2013-08-08 |
2017-06-20 |
Invensas Corporation |
Method of forming a wire bond having a free end
|
JP2015050842A
(en)
*
|
2013-09-02 |
2015-03-16 |
ソニー株式会社 |
Power storage system, power storage controller and power storage control method
|
US20150076714A1
(en)
|
2013-09-16 |
2015-03-19 |
Invensas Corporation |
Microelectronic element with bond elements to encapsulation surface
|
EP2869427B1
(en)
*
|
2013-10-31 |
2019-04-17 |
ResMed Paris SAS |
An apparatus for treating a respiratory disorder with a power source connection
|
US9082753B2
(en)
|
2013-11-12 |
2015-07-14 |
Invensas Corporation |
Severing bond wire by kinking and twisting
|
US9087815B2
(en)
|
2013-11-12 |
2015-07-21 |
Invensas Corporation |
Off substrate kinking of bond wire
|
US9263394B2
(en)
|
2013-11-22 |
2016-02-16 |
Invensas Corporation |
Multiple bond via arrays of different wire heights on a same substrate
|
US9583456B2
(en)
|
2013-11-22 |
2017-02-28 |
Invensas Corporation |
Multiple bond via arrays of different wire heights on a same substrate
|
US9379074B2
(en)
|
2013-11-22 |
2016-06-28 |
Invensas Corporation |
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
|
US9583411B2
(en)
|
2014-01-17 |
2017-02-28 |
Invensas Corporation |
Fine pitch BVA using reconstituted wafer with area array accessible for testing
|
US9214454B2
(en)
|
2014-03-31 |
2015-12-15 |
Invensas Corporation |
Batch process fabrication of package-on-package microelectronic assemblies
|
US10381326B2
(en)
|
2014-05-28 |
2019-08-13 |
Invensas Corporation |
Structure and method for integrated circuits packaging with increased density
|
US9646917B2
(en)
|
2014-05-29 |
2017-05-09 |
Invensas Corporation |
Low CTE component with wire bond interconnects
|
US9412714B2
(en)
|
2014-05-30 |
2016-08-09 |
Invensas Corporation |
Wire bond support structure and microelectronic package including wire bonds therefrom
|
JP6242008B2
(en)
*
|
2014-06-25 |
2017-12-06 |
Fdk株式会社 |
Uninterruptible power system
|
US9768625B2
(en)
*
|
2014-07-04 |
2017-09-19 |
Makita Corporation |
Battery pack, and method for controlling the same
|
US10295608B2
(en)
|
2014-07-18 |
2019-05-21 |
Phoenix Broadband Technologies, Llc |
Non-intrusive correlating battery monitoring system and method
|
US9735084B2
(en)
|
2014-12-11 |
2017-08-15 |
Invensas Corporation |
Bond via array for thermal conductivity
|
US10110053B2
(en)
|
2014-12-31 |
2018-10-23 |
Club Car Llc |
Battery powered system and method for charging
|
US9888579B2
(en)
|
2015-03-05 |
2018-02-06 |
Invensas Corporation |
Pressing of wire bond wire tips to provide bent-over tips
|
US9530749B2
(en)
|
2015-04-28 |
2016-12-27 |
Invensas Corporation |
Coupling of side surface contacts to a circuit platform
|
US9502372B1
(en)
|
2015-04-30 |
2016-11-22 |
Invensas Corporation |
Wafer-level packaging using wire bond wires in place of a redistribution layer
|
US9761554B2
(en)
|
2015-05-07 |
2017-09-12 |
Invensas Corporation |
Ball bonding metal wire bond wires to metal pads
|
US9490222B1
(en)
|
2015-10-12 |
2016-11-08 |
Invensas Corporation |
Wire bond wires for interference shielding
|
US10490528B2
(en)
|
2015-10-12 |
2019-11-26 |
Invensas Corporation |
Embedded wire bond wires
|
US10332854B2
(en)
|
2015-10-23 |
2019-06-25 |
Invensas Corporation |
Anchoring structure of fine pitch bva
|
US10181457B2
(en)
|
2015-10-26 |
2019-01-15 |
Invensas Corporation |
Microelectronic package for wafer-level chip scale packaging with fan-out
|
AU2015252152B2
(en)
*
|
2015-11-06 |
2018-05-17 |
Terence W. Mills |
Power supply systems and methods
|
US9911718B2
(en)
|
2015-11-17 |
2018-03-06 |
Invensas Corporation |
‘RDL-First’ packaged microelectronic device for a package-on-package device
|
US9659848B1
(en)
|
2015-11-18 |
2017-05-23 |
Invensas Corporation |
Stiffened wires for offset BVA
|
US9984992B2
(en)
|
2015-12-30 |
2018-05-29 |
Invensas Corporation |
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
|
US11128158B2
(en)
*
|
2016-03-09 |
2021-09-21 |
Servato Corp. |
Battery management system and related techniques for adaptive, dynamic control of battery charging
|
US9935075B2
(en)
|
2016-07-29 |
2018-04-03 |
Invensas Corporation |
Wire bonding method and apparatus for electromagnetic interference shielding
|
US10299368B2
(en)
|
2016-12-21 |
2019-05-21 |
Invensas Corporation |
Surface integrated waveguides and circuit structures therefor
|
KR20210024127A
(en)
*
|
2018-06-28 |
2021-03-04 |
스냅 인코포레이티드 |
Regulated power supplies
|
US11056698B2
(en)
|
2018-08-02 |
2021-07-06 |
Raytheon Technologies Corporation |
Redox flow battery with electrolyte balancing and compatibility enabling features
|
US11183854B1
(en)
*
|
2019-05-20 |
2021-11-23 |
Amazon Technologies, Inc. |
Recharging of backup battery units using intermittent charging cycles
|
US11066162B2
(en)
*
|
2019-10-09 |
2021-07-20 |
Kitty Hawk Corporation |
Short takeoff and landing vehicle with forward swept wings
|
JP2021191041A
(en)
*
|
2020-05-26 |
2021-12-13 |
Fdk株式会社 |
Backup power supply device
|
CN111934422A
(en)
*
|
2020-06-18 |
2020-11-13 |
华电电力科学研究院有限公司 |
Method for online monitoring and automatic switching and reversing rotation of charging module
|
AU2021332250A1
(en)
*
|
2020-08-25 |
2023-05-11 |
Polymaterials App Llc |
Smart thermal management system to prevent thermal runaway in rechargeable batteries
|
CN112421732B
(en)
*
|
2020-11-30 |
2023-03-24 |
杭州智仝科技有限公司 |
Energy storage method and system based on heterogeneous battery architecture
|
US11271226B1
(en)
|
2020-12-11 |
2022-03-08 |
Raytheon Technologies Corporation |
Redox flow battery with improved efficiency
|
US11655024B1
(en)
*
|
2022-05-25 |
2023-05-23 |
Kitty Hawk Corporation |
Battery systems with power optimized energy source and energy storage optimized source
|