AU2001275984A1 - Self-assembled electrical networks - Google Patents
Self-assembled electrical networksInfo
- Publication number
- AU2001275984A1 AU2001275984A1 AU2001275984A AU7598401A AU2001275984A1 AU 2001275984 A1 AU2001275984 A1 AU 2001275984A1 AU 2001275984 A AU2001275984 A AU 2001275984A AU 7598401 A AU7598401 A AU 7598401A AU 2001275984 A1 AU2001275984 A1 AU 2001275984A1
- Authority
- AU
- Australia
- Prior art keywords
- self
- electrical networks
- assembled electrical
- assembled
- networks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95121—Active alignment, i.e. by apparatus steering
- H01L2224/95122—Active alignment, i.e. by apparatus steering by applying vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95145—Electrostatic alignment, i.e. polarity alignment with Coulomb charges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21957000P | 2000-07-20 | 2000-07-20 | |
US60/219,570 | 2000-07-20 | ||
US22610500P | 2000-08-17 | 2000-08-17 | |
US60/226,105 | 2000-08-17 | ||
PCT/US2001/022680 WO2002009175A2 (en) | 2000-07-20 | 2001-07-19 | Self-assembled electrical networks |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001275984A1 true AU2001275984A1 (en) | 2002-02-05 |
Family
ID=26914023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001275984A Abandoned AU2001275984A1 (en) | 2000-07-20 | 2001-07-19 | Self-assembled electrical networks |
Country Status (4)
Country | Link |
---|---|
US (2) | US7007370B2 (en) |
EP (1) | EP1323190A2 (en) |
AU (1) | AU2001275984A1 (en) |
WO (1) | WO2002009175A2 (en) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002009175A2 (en) * | 2000-07-20 | 2002-01-31 | President And Fellows Of Harvard College | Self-assembled electrical networks |
US7601406B2 (en) * | 2002-06-13 | 2009-10-13 | Cima Nanotech Israel Ltd. | Nano-powder-based coating and ink compositions |
US6878643B2 (en) * | 2002-12-18 | 2005-04-12 | The Regents Of The University Of California | Electronic unit integrated into a flexible polymer body |
US7342311B2 (en) * | 2004-09-13 | 2008-03-11 | Lawrence Livermore National Security, Llc | Electronic unit integrated into a flexible polymer body |
WO2006071806A2 (en) | 2004-12-27 | 2006-07-06 | Quantum Paper, Inc. | Addressable and printable emissive display |
US9153163B2 (en) * | 2005-03-11 | 2015-10-06 | The Invention Science Fund I, Llc | Self assembly of elements for displays |
US8334819B2 (en) * | 2005-03-11 | 2012-12-18 | The Invention Science Fund I, Llc | Superimposed displays |
US8390537B2 (en) * | 2005-03-11 | 2013-03-05 | The Invention Science Fund I, Llc | Method of assembling displays on substrates |
US7662008B2 (en) * | 2005-04-04 | 2010-02-16 | Searete Llc | Method of assembling displays on substrates |
US8860635B2 (en) * | 2005-04-04 | 2014-10-14 | The Invention Science Fund I, Llc | Self assembling display with substrate |
US8711063B2 (en) | 2005-03-11 | 2014-04-29 | The Invention Science Fund I, Llc | Self assembly of elements for displays |
US7977130B2 (en) | 2006-08-03 | 2011-07-12 | The Invention Science Fund I, Llc | Method of assembling displays on substrates |
US7990349B2 (en) * | 2005-04-22 | 2011-08-02 | The Invention Science Fund I, Llc | Superimposed displays |
US20060202944A1 (en) * | 2005-03-11 | 2006-09-14 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Elements for self assembling displays |
US8300007B2 (en) * | 2005-03-11 | 2012-10-30 | The Invention Science Fund I, Llc | Self assembling display with substrate |
US7625780B2 (en) * | 2005-03-15 | 2009-12-01 | Regents Of The University Of Minnesota | Fluidic heterogeneous microsystems assembly and packaging |
WO2007061448A2 (en) * | 2005-05-18 | 2007-05-31 | President And Fellows Of Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
KR101300442B1 (en) * | 2005-06-10 | 2013-08-27 | 시마 나노 테크 이스라엘 리미티드 | Enhanced transparent conductive coatings and methods for making them |
US7504331B2 (en) * | 2005-07-27 | 2009-03-17 | Palo Alto Research Center Incorporated | Method of fabricating self-assembled electrical interconnections |
US7525194B2 (en) * | 2005-07-27 | 2009-04-28 | Palo Alto Research Center Incorporated | System including self-assembled interconnections |
US7662708B2 (en) * | 2005-07-27 | 2010-02-16 | Palo Alto Research Center Incorporated | Self-assembled interconnection particles |
US7531371B2 (en) * | 2006-02-21 | 2009-05-12 | Rather John D G | Multisurfaced microdevice system array and a method of producing the array |
US7774929B2 (en) * | 2006-03-14 | 2010-08-17 | Regents Of The University Of Minnesota | Method of self-assembly on a surface |
US20100186226A1 (en) * | 2006-06-23 | 2010-07-29 | University Of Washington, The | Fluidic self-assembly for system integration |
WO2008086090A1 (en) * | 2007-01-05 | 2008-07-17 | University Of Washington | Self-assembled heterogeneous integrated optical analysis system |
US9419179B2 (en) | 2007-05-31 | 2016-08-16 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US8877101B2 (en) | 2007-05-31 | 2014-11-04 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a light emitting, power generating or other electronic apparatus |
US9425357B2 (en) | 2007-05-31 | 2016-08-23 | Nthdegree Technologies Worldwide Inc. | Diode for a printable composition |
US8133768B2 (en) | 2007-05-31 | 2012-03-13 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system |
US8846457B2 (en) | 2007-05-31 | 2014-09-30 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
US9018833B2 (en) | 2007-05-31 | 2015-04-28 | Nthdegree Technologies Worldwide Inc | Apparatus with light emitting or absorbing diodes |
US8415879B2 (en) | 2007-05-31 | 2013-04-09 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US8809126B2 (en) | 2007-05-31 | 2014-08-19 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
US8395568B2 (en) | 2007-05-31 | 2013-03-12 | Nthdegree Technologies Worldwide Inc | Light emitting, photovoltaic or other electronic apparatus and system |
US8889216B2 (en) | 2007-05-31 | 2014-11-18 | Nthdegree Technologies Worldwide Inc | Method of manufacturing addressable and static electronic displays |
US9343593B2 (en) | 2007-05-31 | 2016-05-17 | Nthdegree Technologies Worldwide Inc | Printable composition of a liquid or gel suspension of diodes |
US8674593B2 (en) | 2007-05-31 | 2014-03-18 | Nthdegree Technologies Worldwide Inc | Diode for a printable composition |
US8852467B2 (en) | 2007-05-31 | 2014-10-07 | Nthdegree Technologies Worldwide Inc | Method of manufacturing a printable composition of a liquid or gel suspension of diodes |
US9534772B2 (en) | 2007-05-31 | 2017-01-03 | Nthdegree Technologies Worldwide Inc | Apparatus with light emitting diodes |
US8579434B2 (en) | 2007-11-07 | 2013-11-12 | University Of Washington Through Its Center For Commercialization | Free-standing two-sided device fabrication |
US8049183B1 (en) | 2007-11-09 | 2011-11-01 | Carnegie Mellon University | Apparatuses and methods for control and self-assembly of particles into adaptable monolayers |
US7874474B2 (en) * | 2008-01-22 | 2011-01-25 | University Of Washington | Self-assembly of elements using microfluidic traps |
US8127477B2 (en) | 2008-05-13 | 2012-03-06 | Nthdegree Technologies Worldwide Inc | Illuminating display systems |
US7992332B2 (en) | 2008-05-13 | 2011-08-09 | Nthdegree Technologies Worldwide Inc. | Apparatuses for providing power for illumination of a display object |
US20120135237A1 (en) * | 2009-04-28 | 2012-05-31 | The Johns Hopkins University | Self-assembly of lithographically patterned polyhedral nanostructures and formation of curving nanostructures |
US20130176750A1 (en) * | 2011-09-02 | 2013-07-11 | The Procter & Gamble Company | Light emitting apparatus |
US9809001B2 (en) | 2010-10-19 | 2017-11-07 | Massachusetts Institute Of Technology | Flexural digital material construction and transduction |
US9690286B2 (en) | 2012-06-21 | 2017-06-27 | Massachusetts Institute Of Technology | Methods and apparatus for digital material skins |
US9566758B2 (en) | 2010-10-19 | 2017-02-14 | Massachusetts Institute Of Technology | Digital flexural materials |
EP2758458A4 (en) | 2011-07-10 | 2015-10-21 | Harvard College | Compositions and methods for self-assembly of polymers with complementary macroscopic and microscopic scale units |
US20140145522A1 (en) * | 2011-11-04 | 2014-05-29 | Massachusetts Institute Of Technology | Electromagnetic Digital Materials |
US9506485B2 (en) | 2011-11-04 | 2016-11-29 | Massachusetts Institute Of Technology | Hierarchical functional digital materials |
WO2015084422A1 (en) | 2013-12-05 | 2015-06-11 | Massachusetts Institute Of Technology | Object of additive manufacture with encoded predicted shape change |
FR3017475B1 (en) * | 2014-02-12 | 2016-03-04 | Commissariat Energie Atomique | METHOD FOR DETERMINING A SELF-ASSEMBLING PATTERN OF A BLOCK COPOLYMER |
WO2016057853A1 (en) | 2014-10-08 | 2016-04-14 | Massachusetts Institute Of Technology | Self-transforming structures |
US11052597B2 (en) | 2016-05-16 | 2021-07-06 | Massachusetts Institute Of Technology | Additive manufacturing of viscoelastic materials |
US10549505B2 (en) | 2017-01-12 | 2020-02-04 | Massachusetts Institute Of Technology | Active lattices |
US10633772B2 (en) | 2017-01-12 | 2020-04-28 | Massachusetts Institute Of Technology | Active woven materials |
CA3059108A1 (en) | 2017-04-04 | 2018-10-11 | Massachusetts Institute Of Technology | Additive manufacturing in gel-supported environment |
CN113164265A (en) | 2018-11-12 | 2021-07-23 | 奥索冰岛有限公司 | Medical devices comprising filament-based structures |
US11883306B2 (en) | 2019-11-12 | 2024-01-30 | Ossur Iceland Ehf | Ventilated prosthetic liner |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4016456A (en) * | 1975-09-05 | 1977-04-05 | The United States Of America As Represented By The Secretary Of The Navy | Multielectrode grid for aligning polarized particles such as asbestos |
US4499607A (en) * | 1982-09-13 | 1985-02-12 | Higgins David M | Geometrically-integrated architecture of microcircuits for high-speed computers |
US5075253A (en) * | 1989-04-12 | 1991-12-24 | Advanced Micro Devices, Inc. | Method of coplanar integration of semiconductor IC devices |
DE3924454A1 (en) * | 1989-07-24 | 1991-02-07 | Cornelis P Prof Dr Hollenberg | THE APPLICATION OF DNA AND DNA TECHNOLOGY FOR THE CONSTRUCTION OF NETWORKS FOR USE IN CHIP CONSTRUCTION AND CHIP PRODUCTION (DNA CHIPS) |
IL98753A0 (en) | 1990-10-10 | 1992-07-15 | Yeda Res & Dev | Process for the production of composite organic-inorganic superlattices |
US5355577A (en) * | 1992-06-23 | 1994-10-18 | Cohn Michael B | Method and apparatus for the assembly of microfabricated devices |
US5793115A (en) | 1993-09-30 | 1998-08-11 | Kopin Corporation | Three dimensional processor using transferred thin film circuits |
US5900160A (en) | 1993-10-04 | 1999-05-04 | President And Fellows Of Harvard College | Methods of etching articles via microcontact printing |
US5512131A (en) | 1993-10-04 | 1996-04-30 | President And Fellows Of Harvard College | Formation of microstamped patterns on surfaces and derivative articles |
US6180239B1 (en) | 1993-10-04 | 2001-01-30 | President And Fellows Of Harvard College | Microcontact printing on surfaces and derivative articles |
US5776748A (en) | 1993-10-04 | 1998-07-07 | President And Fellows Of Harvard College | Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor |
US5545291A (en) * | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
US5824186A (en) * | 1993-12-17 | 1998-10-20 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
EP0812434B1 (en) | 1995-03-01 | 2013-09-18 | President and Fellows of Harvard College | Microcontact printing on surfaces and derivative articles |
JP3415850B2 (en) | 1995-08-04 | 2003-06-09 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Surface or thin layer modification by lithography |
US6355198B1 (en) | 1996-03-15 | 2002-03-12 | President And Fellows Of Harvard College | Method of forming articles including waveguides via capillary micromolding and microtransfer molding |
US6001232A (en) | 1996-09-04 | 1999-12-14 | The Research Foundation Of State University Of New York | Separation medium for capillary electrophoresis |
US6507989B1 (en) * | 1997-03-13 | 2003-01-21 | President And Fellows Of Harvard College | Self-assembly of mesoscale objects |
IL121312A (en) * | 1997-07-14 | 2001-09-13 | Technion Res & Dev Foundation | Microelectronic components, their fabrication and electronic networks comprising them |
WO2001095375A1 (en) * | 2000-06-06 | 2001-12-13 | The Penn State Research Foundation | An electro-fluidic assembly process for integration of electronic devices onto a substrate |
WO2002009175A2 (en) | 2000-07-20 | 2002-01-31 | President And Fellows Of Harvard College | Self-assembled electrical networks |
US7253091B2 (en) * | 2001-09-28 | 2007-08-07 | Hrl Laboratories, Llc | Process for assembling three-dimensional systems on a chip and structure thus obtained |
US6974604B2 (en) * | 2001-09-28 | 2005-12-13 | Hrl Laboratories, Llc | Method of self-latching for adhesion during self-assembly of electronic or optical components |
-
2001
- 2001-07-19 WO PCT/US2001/022680 patent/WO2002009175A2/en active Application Filing
- 2001-07-19 EP EP01953546A patent/EP1323190A2/en not_active Withdrawn
- 2001-07-19 AU AU2001275984A patent/AU2001275984A1/en not_active Abandoned
- 2001-07-19 US US09/909,420 patent/US7007370B2/en not_active Expired - Lifetime
-
2006
- 2006-02-13 US US11/352,923 patent/US7724541B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20020064909A1 (en) | 2002-05-30 |
US7007370B2 (en) | 2006-03-07 |
US7724541B2 (en) | 2010-05-25 |
EP1323190A2 (en) | 2003-07-02 |
US20060191125A1 (en) | 2006-08-31 |
WO2002009175A3 (en) | 2003-05-01 |
WO2002009175A2 (en) | 2002-01-31 |
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