AU2001251172A1 - Laser system and method for single pass micromachining of multilayer workpieces - Google Patents

Laser system and method for single pass micromachining of multilayer workpieces

Info

Publication number
AU2001251172A1
AU2001251172A1 AU2001251172A AU5117201A AU2001251172A1 AU 2001251172 A1 AU2001251172 A1 AU 2001251172A1 AU 2001251172 A AU2001251172 A AU 2001251172A AU 5117201 A AU5117201 A AU 5117201A AU 2001251172 A1 AU2001251172 A1 AU 2001251172A1
Authority
AU
Australia
Prior art keywords
micromachining
laser system
single pass
multilayer workpieces
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251172A
Inventor
Spencer Barrett
Corey M. Dunsky
Ho W. Lo
Raman Sudhakar
Ken Whiteman
Donald R. Wilt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of AU2001251172A1 publication Critical patent/AU2001251172A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
AU2001251172A 2000-03-30 2001-03-30 Laser system and method for single pass micromachining of multilayer workpieces Abandoned AU2001251172A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19358100P 2000-03-30 2000-03-30
US60193581 2000-03-30
PCT/US2001/010391 WO2001074529A2 (en) 2000-03-30 2001-03-30 Laser system and method for single pass micromachining of multilayer workpieces

Publications (1)

Publication Number Publication Date
AU2001251172A1 true AU2001251172A1 (en) 2001-10-15

Family

ID=22714215

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251172A Abandoned AU2001251172A1 (en) 2000-03-30 2001-03-30 Laser system and method for single pass micromachining of multilayer workpieces

Country Status (4)

Country Link
US (1) US6407363B2 (en)
AU (1) AU2001251172A1 (en)
TW (1) TW504425B (en)
WO (1) WO2001074529A2 (en)

Families Citing this family (256)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001007195A1 (en) * 1999-07-23 2001-02-01 Heidelberg Instruments Mikrotechnik Gmbh Method of producing microbore holes
US7723642B2 (en) 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US7671295B2 (en) * 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US20030222324A1 (en) * 2000-01-10 2003-12-04 Yunlong Sun Laser systems for passivation or link processing with a set of laser pulses
US20060141681A1 (en) * 2000-01-10 2006-06-29 Yunlong Sun Processing a memory link with a set of at least two laser pulses
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US6696008B2 (en) * 2000-05-25 2004-02-24 Westar Photonics Inc. Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation
JP4320926B2 (en) * 2000-06-16 2009-08-26 パナソニック株式会社 Laser drilling method and apparatus
JP4659300B2 (en) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
TW503143B (en) * 2000-10-06 2002-09-21 Hitachi Via Mechanics Ltd Method and apparatus for drilling printed wiring boards
JP4134503B2 (en) * 2000-10-11 2008-08-20 松下電器産業株式会社 Method for manufacturing circuit-formed substrate
US6864459B2 (en) * 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US6781090B2 (en) * 2001-03-12 2004-08-24 Electro Scientific Industries, Inc. Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
US6806440B2 (en) * 2001-03-12 2004-10-19 Electro Scientific Industries, Inc. Quasi-CW diode pumped, solid-state UV laser system and method employing same
US20070173075A1 (en) * 2001-03-29 2007-07-26 Joohan Lee Laser-based method and system for processing a multi-material device having conductive link structures
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
DE10125397B4 (en) * 2001-05-23 2005-03-03 Siemens Ag Method for drilling microholes with a laser beam
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
US20030099452A1 (en) * 2001-11-28 2003-05-29 Borrelli Nicholas F. Manipulating the size of waveguides written into substrates using femtosecond laser pulses
US6627844B2 (en) * 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
EP1769872A3 (en) * 2001-12-20 2007-04-11 Hewlett-Packard Company Method of laser machining a fluid slot
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
TW564196B (en) * 2002-01-11 2003-12-01 Electro Scient Ind Inc Simulated laser spot enlargement
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
US6756563B2 (en) * 2002-03-07 2004-06-29 Orbotech Ltd. System and method for forming holes in substrates containing glass
CN1328002C (en) * 2002-03-12 2007-07-25 浜松光子学株式会社 Cutting method for workpiece
EP3664131A3 (en) 2002-03-12 2020-08-19 Hamamatsu Photonics K. K. Substrate dividing method
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
US6884962B2 (en) * 2002-03-18 2005-04-26 Hitachi Via Mechanics, Ltd. Beam or wave front
US6951995B2 (en) * 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US7563695B2 (en) * 2002-03-27 2009-07-21 Gsi Group Corporation Method and system for high-speed precise laser trimming and scan lens for use therein
WO2003082507A2 (en) 2002-03-28 2003-10-09 Gsi Lumonics Corporation Method and system for high-speed, precise micromachining an array of devices
US6842293B1 (en) * 2002-04-13 2005-01-11 Yusong Yin Beam expander
DE10251480B4 (en) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina A method of drilling holes by means of a laser beam in an electrical circuit substrate
US20040017430A1 (en) * 2002-07-23 2004-01-29 Yosuke Mizuyama Laser processing method and laser processing apparatus
DE10262053A1 (en) * 2002-09-05 2004-08-12 Daimlerchrysler Ag Process for the laser processing of coated metal sheets
TWI520269B (en) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
GB0300105D0 (en) * 2003-01-03 2003-02-05 Cambridge Display Tech Ltd Ablation methods & apparatus
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
FR2852250B1 (en) * 2003-03-11 2009-07-24 Jean Luc Jouvin PROTECTIVE SHEATH FOR CANNULA, AN INJECTION KIT COMPRISING SUCH ANKLE AND NEEDLE EQUIPPED WITH SUCH ANKLE
EP1609559B1 (en) * 2003-03-12 2007-08-08 Hamamatsu Photonics K. K. Laser beam machining method
US6909735B2 (en) * 2003-04-10 2005-06-21 Hitachi Via Mechanics, Ltd. System and method for generating and controlling multiple independently steerable laser beam for material processing
US20040251243A1 (en) * 2003-04-10 2004-12-16 Lizotte Todd E. System and method for generating and controlling multiple independently steerable laser beams for material processing
DE10317363B3 (en) * 2003-04-15 2004-08-26 Siemens Ag Laser-powered hole boring machine for manufacture of substrates for electrical switching circuits has scanning system with oscillating mirrors and focusing lens
WO2004096483A1 (en) * 2003-04-25 2004-11-11 Nitto Denko Corporation Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
DE10324439B4 (en) * 2003-05-28 2008-01-31 Lasertec Gmbh Method and device for producing a die
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US20050167405A1 (en) * 2003-08-11 2005-08-04 Richard Stoltz Optical ablation using material composition analysis
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
US20050263497A1 (en) * 2004-03-26 2005-12-01 Lehane Christopher J System for laser drilling of shaped holes
WO2011123205A1 (en) 2010-03-30 2011-10-06 Imra America, Inc. Laser-based material processing apparatus and methods
US7302309B2 (en) * 2004-04-26 2007-11-27 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
US7020582B1 (en) 2004-04-28 2006-03-28 Altera Corporation Methods and apparatus for laser marking of integrated circuit faults
US7133186B2 (en) * 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing transducers to modulate different axes
WO2005121889A2 (en) * 2004-06-07 2005-12-22 Electro Scientific Industries, Inc. Aom modulation techniques for improving laser system performance
US7935941B2 (en) * 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US7629234B2 (en) * 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US7687740B2 (en) * 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7633034B2 (en) * 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7435927B2 (en) * 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7425471B2 (en) * 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US8148211B2 (en) * 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US20060000816A1 (en) * 2004-06-30 2006-01-05 Matsushita Electric Industrial Co., Ltd. System for and method of zoom processing
US7352784B2 (en) * 2004-07-20 2008-04-01 Jds Uniphase Corporation Laser burst boosting method and apparatus
DE102004040068B4 (en) * 2004-08-18 2018-01-04 Via Mechanics, Ltd. Method for laser drilling a multilayered workpiece
US7396706B2 (en) * 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
KR20070089150A (en) * 2004-12-09 2007-08-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Multiple-wavelength laser micromachining of semiconductor devices
JP4854061B2 (en) * 2005-01-14 2012-01-11 日東電工株式会社 Manufacturing method of laser processed product and protective sheet for laser processing
JP4873863B2 (en) * 2005-01-14 2012-02-08 日東電工株式会社 Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing
US20060179722A1 (en) * 2005-02-02 2006-08-17 Spindler Robert G Edge treatment for glass panes
JP4988160B2 (en) 2005-02-08 2012-08-01 日産自動車株式会社 Laser welding apparatus, laser welding system, and laser welding method
TWI382795B (en) * 2005-03-04 2013-01-11 Hitachi Via Mechanics Ltd A method of opening a printed circuit board and an opening device for a printed circuit board
TWI307613B (en) * 2005-03-29 2009-03-11 Phoenix Prec Technology Corp Circuit board formed conductor structure method for fabrication
EP1716962B1 (en) * 2005-04-29 2009-02-18 Trumpf Werkzeugmaschinen GmbH + Co. KG Device with an adaptive mirror for modifying the focus characteristics of a laser working machine
US20060261051A1 (en) * 2005-05-19 2006-11-23 Mark Unrath Synthetic pulse repetition rate processing for dual-headed laser micromachining systems
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
JP2007036143A (en) * 2005-07-29 2007-02-08 Disco Abrasive Syst Ltd Machining method of semiconductor wafer
GB0518843D0 (en) * 2005-09-15 2005-10-26 Plastic Logic Ltd A method of forming interconnects using a process of lower ablation
JP5030512B2 (en) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 Laser processing method
EP1931495A4 (en) * 2005-10-03 2009-08-26 Aradigm Corp Method and system for laser machining
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US20070215575A1 (en) * 2006-03-15 2007-09-20 Bo Gu Method and system for high-speed, precise, laser-based modification of one or more electrical elements
JP5203573B2 (en) * 2006-03-23 2013-06-05 ミヤチテクノス株式会社 Laser processing equipment
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
WO2007118939A1 (en) 2006-04-19 2007-10-25 Arcelor France Method of producing a welded part having very high mechanical properties from a rolled and coated sheet
CN101432093B (en) * 2006-04-28 2012-06-20 通快机床两合公司 Laser processing equipment and laser processing method
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
TWI298613B (en) * 2006-05-19 2008-07-01 Foxconn Advanced Tech Inc Method for manufacturing via holes used in printed circuit boards
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP4960043B2 (en) * 2006-08-31 2012-06-27 日立ビアメカニクス株式会社 Laser processing method and laser processing apparatus
US7633035B2 (en) * 2006-10-05 2009-12-15 Mu-Gahat Holdings Inc. Reverse side film laser circuit etching
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
JP2008159686A (en) * 2006-12-21 2008-07-10 Nippon Mektron Ltd Method for manufacturing printed wiring board incorporating capacitors
US20090061251A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by additive deposition
US20090061112A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by subtractive deposition
WO2009035421A1 (en) * 2007-09-14 2009-03-19 Laserresearch (S) Pte Ltd Single laser system for manufacture of thin film solar cell
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
EP2252426A4 (en) * 2008-03-21 2014-08-06 Imra America Inc Laser-based material processing methods and systems
US8237080B2 (en) * 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
US8124911B2 (en) * 2008-03-31 2012-02-28 Electro Scientific Industries, Inc. On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
DE112009001200B4 (en) * 2008-06-04 2016-03-10 Mitsubishi Electric Corp. Laser processing method and laser processing apparatus therefor
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
JP5383342B2 (en) * 2008-08-01 2014-01-08 キヤノン株式会社 Processing method
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
TWI460040B (en) * 2009-01-11 2014-11-11 Orbotech Ltd Method for laser drilling of holes in a substrate with varying simultaneity
TWI523720B (en) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
TWI417017B (en) * 2009-07-30 2013-11-21 Unimicron Technology Corp Base material of wiring board and method for drilling thereof
JP5148717B2 (en) * 2009-08-03 2013-02-20 東芝機械株式会社 Pulse laser processing apparatus and pulse laser processing method
US8211731B2 (en) * 2010-06-07 2012-07-03 Sunpower Corporation Ablation of film stacks in solar cell fabrication processes
US8642448B2 (en) 2010-06-22 2014-02-04 Applied Materials, Inc. Wafer dicing using femtosecond-based laser and plasma etch
US8884184B2 (en) 2010-08-12 2014-11-11 Raydiance, Inc. Polymer tubing laser micromachining
US9120181B2 (en) 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
US9023461B2 (en) * 2010-10-21 2015-05-05 Electro Scientific Industries, Inc. Apparatus for optically laser marking articles
KR101908002B1 (en) * 2010-10-22 2018-12-19 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Laser processing systems and methods for beam dithering and skiving
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
US8648277B2 (en) * 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
US8557682B2 (en) 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-layer mask for substrate dicing by laser and plasma etch
US8912077B2 (en) 2011-06-15 2014-12-16 Applied Materials, Inc. Hybrid laser and plasma etch wafer dicing using substrate carrier
US9129904B2 (en) 2011-06-15 2015-09-08 Applied Materials, Inc. Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
US9126285B2 (en) 2011-06-15 2015-09-08 Applied Materials, Inc. Laser and plasma etch wafer dicing using physically-removable mask
US8557683B2 (en) 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
US8507363B2 (en) 2011-06-15 2013-08-13 Applied Materials, Inc. Laser and plasma etch wafer dicing using water-soluble die attach film
US8703581B2 (en) 2011-06-15 2014-04-22 Applied Materials, Inc. Water soluble mask for substrate dicing by laser and plasma etch
US8598016B2 (en) 2011-06-15 2013-12-03 Applied Materials, Inc. In-situ deposited mask layer for device singulation by laser scribing and plasma etch
US8759197B2 (en) 2011-06-15 2014-06-24 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
US9029242B2 (en) 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
US8951819B2 (en) 2011-07-11 2015-02-10 Applied Materials, Inc. Wafer dicing using hybrid split-beam laser scribing process with plasma etch
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
WO2013058169A1 (en) * 2011-10-20 2013-04-25 旭硝子株式会社 Method for forming through holes in insulating substrate and method for manufacturing insulating substrate for interposer
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
US8652940B2 (en) 2012-04-10 2014-02-18 Applied Materials, Inc. Wafer dicing used hybrid multi-step laser scribing process with plasma etch
US8946057B2 (en) 2012-04-24 2015-02-03 Applied Materials, Inc. Laser and plasma etch wafer dicing using UV-curable adhesive film
JP5950674B2 (en) * 2012-04-25 2016-07-13 株式会社ディスコ Optical axis checking jig
KR101744039B1 (en) 2012-05-25 2017-06-07 쉴로 인더스트리즈 인코포레이티드 Sheet metal piece having weld notch and method of forming the same
US8969177B2 (en) 2012-06-29 2015-03-03 Applied Materials, Inc. Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
EP2866966A4 (en) 2012-06-29 2016-07-13 Shiloh Ind Inc Welded blank assembly and method
US9048309B2 (en) 2012-07-10 2015-06-02 Applied Materials, Inc. Uniform masking for wafer dicing using laser and plasma etch
US8940619B2 (en) 2012-07-13 2015-01-27 Applied Materials, Inc. Method of diced wafer transportation
US8859397B2 (en) 2012-07-13 2014-10-14 Applied Materials, Inc. Method of coating water soluble mask for laser scribing and plasma etch
US8845854B2 (en) 2012-07-13 2014-09-30 Applied Materials, Inc. Laser, plasma etch, and backside grind process for wafer dicing
US8993414B2 (en) 2012-07-13 2015-03-31 Applied Materials, Inc. Laser scribing and plasma etch for high die break strength and clean sidewall
CN103582329B (en) * 2012-07-24 2016-08-03 富泰华工业（深圳）有限公司 Housing and manufacture method thereof
WO2014022681A1 (en) 2012-08-01 2014-02-06 Gentex Corporation Assembly with laser induced channel edge and method thereof
US9159574B2 (en) 2012-08-27 2015-10-13 Applied Materials, Inc. Method of silicon etch for trench sidewall smoothing
US10149390B2 (en) 2012-08-27 2018-12-04 Mycronic AB Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
US9252057B2 (en) 2012-10-17 2016-02-02 Applied Materials, Inc. Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
WO2014085818A1 (en) * 2012-11-30 2014-06-05 Shiloh Industries, Inc. Method of forming a weld notch in a sheet metal piece
US10211175B2 (en) * 2012-11-30 2019-02-19 International Business Machines Corporation Stress-resilient chip structure and dicing process
DE102012111771B4 (en) 2012-12-04 2020-12-03 Ewag Ag Method for machining a workpiece using a laser machining device for manufacturing a cutting tool
US8975162B2 (en) 2012-12-20 2015-03-10 Applied Materials, Inc. Wafer dicing from wafer backside
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
US8980726B2 (en) 2013-01-25 2015-03-17 Applied Materials, Inc. Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
US9620379B2 (en) 2013-03-14 2017-04-11 Applied Materials, Inc. Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch
MX2015012678A (en) 2013-03-14 2016-02-16 Shiloh Ind Inc Welded blank assembly and method.
KR102166134B1 (en) * 2013-03-15 2020-10-16 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Laser emission-based control of beam positioner
CN103264227B (en) * 2013-04-11 2015-05-13 温州大学 Method of removing metal film covering surface of polymer substrate by direct laser etching
US8883614B1 (en) 2013-05-22 2014-11-11 Applied Materials, Inc. Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach
US9105710B2 (en) 2013-08-30 2015-08-11 Applied Materials, Inc. Wafer dicing method for improving die packaging quality
US9224650B2 (en) 2013-09-19 2015-12-29 Applied Materials, Inc. Wafer dicing from wafer backside and front side
JP5760060B2 (en) * 2013-09-27 2015-08-05 株式会社茨城技研 Metal film forming method, metal film forming product manufacturing method and manufacturing apparatus
US9460966B2 (en) 2013-10-10 2016-10-04 Applied Materials, Inc. Method and apparatus for dicing wafers having thick passivation polymer layer
US9041198B2 (en) 2013-10-22 2015-05-26 Applied Materials, Inc. Maskless hybrid laser scribing and plasma etching wafer dicing process
US9312177B2 (en) 2013-12-06 2016-04-12 Applied Materials, Inc. Screen print mask for laser scribe and plasma etch wafer dicing process
US9299614B2 (en) 2013-12-10 2016-03-29 Applied Materials, Inc. Method and carrier for dicing a wafer
US9293304B2 (en) 2013-12-17 2016-03-22 Applied Materials, Inc. Plasma thermal shield for heat dissipation in plasma chamber
US8927393B1 (en) 2014-01-29 2015-01-06 Applied Materials, Inc. Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
US9018079B1 (en) 2014-01-29 2015-04-28 Applied Materials, Inc. Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
US9012305B1 (en) 2014-01-29 2015-04-21 Applied Materials, Inc. Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
US9299611B2 (en) 2014-01-29 2016-03-29 Applied Materials, Inc. Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
US8991329B1 (en) 2014-01-31 2015-03-31 Applied Materials, Inc. Wafer coating
US9236284B2 (en) 2014-01-31 2016-01-12 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
US9130030B1 (en) 2014-03-07 2015-09-08 Applied Materials, Inc. Baking tool for improved wafer coating process
US20150255349A1 (en) 2014-03-07 2015-09-10 JAMES Matthew HOLDEN Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes
US9275902B2 (en) 2014-03-26 2016-03-01 Applied Materials, Inc. Dicing processes for thin wafers with bumps on wafer backside
US9076860B1 (en) 2014-04-04 2015-07-07 Applied Materials, Inc. Residue removal from singulated die sidewall
US8975163B1 (en) 2014-04-10 2015-03-10 Applied Materials, Inc. Laser-dominated laser scribing and plasma etch hybrid wafer dicing
US8932939B1 (en) 2014-04-14 2015-01-13 Applied Materials, Inc. Water soluble mask formation by dry film lamination
US8912078B1 (en) 2014-04-16 2014-12-16 Applied Materials, Inc. Dicing wafers having solder bumps on wafer backside
US8999816B1 (en) 2014-04-18 2015-04-07 Applied Materials, Inc. Pre-patterned dry laminate mask for wafer dicing processes
US8912075B1 (en) 2014-04-29 2014-12-16 Applied Materials, Inc. Wafer edge warp supression for thin wafer supported by tape frame
US9159621B1 (en) 2014-04-29 2015-10-13 Applied Materials, Inc. Dicing tape protection for wafer dicing using laser scribe process
US8980727B1 (en) 2014-05-07 2015-03-17 Applied Materials, Inc. Substrate patterning using hybrid laser scribing and plasma etching processing schemes
US9112050B1 (en) 2014-05-13 2015-08-18 Applied Materials, Inc. Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
US9034771B1 (en) 2014-05-23 2015-05-19 Applied Materials, Inc. Cooling pedestal for dicing tape thermal management during plasma dicing
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
US9130057B1 (en) 2014-06-30 2015-09-08 Applied Materials, Inc. Hybrid dicing process using a blade and laser
US9165832B1 (en) 2014-06-30 2015-10-20 Applied Materials, Inc. Method of die singulation using laser ablation and induction of internal defects with a laser
US9142459B1 (en) 2014-06-30 2015-09-22 Applied Materials, Inc. Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
US9093518B1 (en) 2014-06-30 2015-07-28 Applied Materials, Inc. Singulation of wafers having wafer-level underfill
US9349648B2 (en) 2014-07-22 2016-05-24 Applied Materials, Inc. Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
US9196498B1 (en) 2014-08-12 2015-11-24 Applied Materials, Inc. Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
US9117868B1 (en) 2014-08-12 2015-08-25 Applied Materials, Inc. Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing
PL3180823T3 (en) * 2014-08-13 2022-08-08 Ipg Photonics Corporation Multibeam fiber laser system, method and use
US10433413B2 (en) * 2014-08-15 2019-10-01 Unimicron Technology Corp. Manufacturing method of circuit structure embedded with heat-dissipation block
US9281244B1 (en) 2014-09-18 2016-03-08 Applied Materials, Inc. Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
US9177861B1 (en) 2014-09-19 2015-11-03 Applied Materials, Inc. Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
US11195756B2 (en) 2014-09-19 2021-12-07 Applied Materials, Inc. Proximity contact cover ring for plasma dicing
US9196536B1 (en) 2014-09-25 2015-11-24 Applied Materials, Inc. Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
US9130056B1 (en) 2014-10-03 2015-09-08 Applied Materials, Inc. Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
US9245803B1 (en) 2014-10-17 2016-01-26 Applied Materials, Inc. Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
US10692765B2 (en) 2014-11-07 2020-06-23 Applied Materials, Inc. Transfer arm for film frame substrate handling during plasma singulation of wafers
US9159624B1 (en) 2015-01-05 2015-10-13 Applied Materials, Inc. Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
US9330977B1 (en) 2015-01-05 2016-05-03 Applied Materials, Inc. Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
US9355907B1 (en) 2015-01-05 2016-05-31 Applied Materials, Inc. Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
US9601375B2 (en) 2015-04-27 2017-03-21 Applied Materials, Inc. UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
DE102015212444A1 (en) * 2015-06-12 2016-12-15 Schuler Automation Gmbh & Co. Kg Method and device for producing a sheet metal blank
US9721839B2 (en) 2015-06-12 2017-08-01 Applied Materials, Inc. Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
US9478455B1 (en) 2015-06-12 2016-10-25 Applied Materials, Inc. Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber
WO2016207659A1 (en) * 2015-06-24 2016-12-29 University Of Dundee Method of, and apparatus for, laser blackening of a surface, wherein the laser has a specific power density and/or a specific pulse duration
GB201603991D0 (en) 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
WO2017044646A1 (en) * 2015-09-09 2017-03-16 Electro Scientific Industries, Inc. Laser processing apparatus, methods of laser-processing workpieces and related arrangements
JP6671145B2 (en) * 2015-10-30 2020-03-25 株式会社レーザーシステム Method for manufacturing processed resin substrate and laser processing apparatus
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
CN108367389B (en) 2015-11-23 2020-07-28 恩耐公司 Laser processing method and apparatus
US10518358B1 (en) 2016-01-28 2019-12-31 AdlOptica Optical Systems GmbH Multi-focus optics
GB2556313B (en) * 2016-02-10 2020-12-23 Flexenable Ltd Semiconductor patterning
US9972575B2 (en) 2016-03-03 2018-05-15 Applied Materials, Inc. Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
US9852997B2 (en) 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
US9793132B1 (en) 2016-05-13 2017-10-17 Applied Materials, Inc. Etch mask for hybrid laser scribing and plasma etch wafer singulation process
IT201600070259A1 (en) * 2016-07-06 2018-01-06 Adige Spa Process of laser processing of a metal material with control of the position of the optical axis of the laser with respect to a flow of assistance gas, as well as a machine and computer program for carrying out such a process.
IT201600070441A1 (en) * 2016-07-06 2018-01-06 Adige Spa Process for laser processing of a metal material with high-dynamic control of the axes of movement of the laser beam along a predetermined processing path, as well as a machine and computer program for carrying out such a process.
WO2018047823A1 (en) * 2016-09-09 2018-03-15 三菱電機株式会社 Laser machining device
US10663767B2 (en) 2016-09-29 2020-05-26 Nlight, Inc. Adjustable beam characteristics
US10730785B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Optical fiber bending mechanisms
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
US11158540B2 (en) 2017-05-26 2021-10-26 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
US10363629B2 (en) 2017-06-01 2019-07-30 Applied Materials, Inc. Mitigation of particle contamination for wafer dicing processes
CN111182998B (en) * 2017-09-29 2022-06-21 株式会社钟化 Graphite laminate processed product, method for producing same, and laser cutting device for graphite laminate processed product
WO2019100067A1 (en) * 2017-11-20 2019-05-23 Ipg Photonics Corporation System and method laser for processing of materials
CN111226359B (en) * 2017-12-07 2022-07-15 极光先进雷射株式会社 Laser irradiation system and method for manufacturing electronic device
US10535561B2 (en) 2018-03-12 2020-01-14 Applied Materials, Inc. Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
US11355394B2 (en) 2018-09-13 2022-06-07 Applied Materials, Inc. Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment
JP2020066015A (en) * 2018-10-23 2020-04-30 株式会社ディスコ Laser processing method
US10624213B1 (en) * 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture
US11011424B2 (en) 2019-08-06 2021-05-18 Applied Materials, Inc. Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
US11342226B2 (en) 2019-08-13 2022-05-24 Applied Materials, Inc. Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process
US10903121B1 (en) 2019-08-14 2021-01-26 Applied Materials, Inc. Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
US11600492B2 (en) 2019-12-10 2023-03-07 Applied Materials, Inc. Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process
JP7386073B2 (en) 2019-12-24 2023-11-24 ビアメカニクス株式会社 Laser processing equipment and laser processing method
US11211247B2 (en) 2020-01-30 2021-12-28 Applied Materials, Inc. Water soluble organic-inorganic hybrid mask formulations and their applications
JP7471861B2 (en) * 2020-02-27 2024-04-22 Tdk株式会社 Thin film capacitor and circuit board incorporating the same
US11804416B2 (en) * 2020-09-08 2023-10-31 UTAC Headquarters Pte. Ltd. Semiconductor device and method of forming protective layer around cavity of semiconductor die
CN114888430B (en) * 2022-06-29 2024-05-17 中国航发动力股份有限公司 Method and system for processing temperature-measuring blind hole of blade
DE102022117909A1 (en) 2022-07-18 2024-01-18 Trumpf Laser- Und Systemtechnik Gmbh Beam guiding device for guiding an energy beam and manufacturing device for the additive manufacturing of components from a powder material with such a beam guiding device

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2368054A1 (en) 1976-10-13 1978-05-12 Comp Generale Electricite METHOD FOR INCREASING THE ILLUMINATION PRODUCED BY A LASER BEAM
US4091274A (en) 1976-12-22 1978-05-23 United Technologies Corporation Active laser mirror system
US4387966A (en) 1980-07-09 1983-06-14 Rockwell International Corporation Wide bandwidth optical modal deformation sensor
EP0048917B1 (en) 1980-09-30 1985-12-27 CARLO ERBA STRUMENTAZIONE S.p.A. A method and apparatus for volumetrically controlled and reproducible introduction of small amounts of liquid samples into chromatographic analysis systems
US4592058A (en) 1984-08-10 1986-05-27 The United States Of America As Represented By The Secretary Of The Army Frequency stabilized laser
US4634420A (en) 1984-10-31 1987-01-06 United Sonics Incorporated Apparatus and method for removing tissue mass from an organism
DE3502025A1 (en) 1985-01-23 1986-07-24 Diehl GmbH & Co, 8500 Nürnberg DEFORMABLE MIRROR
US4655563A (en) 1985-11-25 1987-04-07 Itek Corporation Variable thickness deformable mirror
US4750818A (en) 1985-12-16 1988-06-14 Cochran Gregory M Phase conjugation method
US4725144A (en) 1986-02-25 1988-02-16 R & D Associates Optic element testing method and apparatus
US4674848A (en) 1986-03-17 1987-06-23 Itek Corporation Laser mirror having a cooled, deformable surface
US5051571A (en) 1986-12-02 1991-09-24 Hughes Aircraft Company Cascaded adaptive optics system
US4862029A (en) 1987-02-11 1989-08-29 Tosoh Corporation Actuator
US4825062A (en) 1987-10-29 1989-04-25 Kaman Aerospace Corporation Extendable large aperture phased array mirror system
US4967063A (en) 1988-06-16 1990-10-30 The Aerospace Corporation Charge controlled adaptive-optics system
US4875764A (en) 1988-07-29 1989-10-24 Eastman Kodak Company Assembly for correction of distortions of a mirror
US4940318A (en) 1988-11-03 1990-07-10 Itek Corporation Gradient membrane deformable mirror having replaceable actuators
US4923302A (en) 1989-02-02 1990-05-08 Litton Systems, Inc. Method and apparatus for calibrating deformable mirrors having replaceable actuators
DE3916264A1 (en) 1989-05-18 1990-11-22 Diehl Gmbh & Co DEVICE FOR RADIATION IN LASER WORKPIECE PROCESSING
US4906087A (en) 1989-06-16 1990-03-06 Litton Systems, Inc. Magneto-retractive deformable mirror
US5073687A (en) 1989-06-22 1991-12-17 Canon Kabushiki Kaisha Method and apparatus for working print board by laser
US5063280A (en) 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
WO1991004584A1 (en) 1989-09-08 1991-04-04 Massachusetts Institute Of Technology Miniature actuator
JPH0710482B2 (en) 1989-09-27 1995-02-08 豊田工機株式会社 Non-circular creation device
JPH03128187A (en) 1989-10-12 1991-05-31 Yoshizawa Kogyo Kk Laser cutting device
US4934803A (en) 1989-10-12 1990-06-19 Litton Systems, Inc. Differential pressure deformable mirror
DD288933A5 (en) * 1989-10-30 1991-04-11 Friedrich-Schiller-Universitaet,De METHOD FOR LASER MATERIAL PROCESSING WITH DYNAMIC FOCUSING
JPH03174995A (en) 1989-12-01 1991-07-30 Amada Co Ltd Machining head in laser beam machining apparatus
US5229889A (en) 1991-12-10 1993-07-20 Hughes Aircraft Company Simple adaptive optical system
US5208818A (en) 1991-12-12 1993-05-04 Creo Products Inc. Laser system for recording data patterns on a planar substrate
JPH05208288A (en) 1992-01-16 1993-08-20 Hitachi Ltd Laser beam machining method and device therefor
DE4208229A1 (en) 1992-03-14 1993-09-16 Krupp Industrietech ADJUSTABLE TELESCOPIC MIRROR
US5210653A (en) 1992-06-08 1993-05-11 Schell John D External actuator for a deformable mirror
US5396364A (en) 1992-10-30 1995-03-07 Hughes Aircraft Company Continuously operated spatial light modulator apparatus and method for adaptive optics
KR970003007B1 (en) 1993-05-21 1997-03-13 대우전자 주식회사 Optical path regulating apparatus and the driving method
DE69415484T2 (en) * 1993-06-04 1999-06-24 Seiko Epson Corp DEVICE AND METHOD FOR LASER PROCESSING
JP3366069B2 (en) 1993-09-27 2003-01-14 ファナック株式会社 Piercing control method
US5453594A (en) 1993-10-06 1995-09-26 Electro Scientific Industries, Inc. Radiation beam position and emission coordination system
DE4338390C2 (en) 1993-11-10 2001-06-13 Bodenseewerk Geraetetech Scene simulator, especially for testing infrared sensors in homing heads
JP3175463B2 (en) * 1994-02-24 2001-06-11 三菱電機株式会社 Laser cutting method
DE9407288U1 (en) * 1994-05-02 1994-08-04 Trumpf Gmbh & Co Laser cutting machine with focus position adjustment
US5914507A (en) 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
DE9409869U1 (en) 1994-06-17 1995-10-12 Diehl Gmbh & Co Deformable mirror, in particular for a laser beam material processing device
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
EP0710551B1 (en) 1994-08-24 1997-03-19 Schablonentechnik Kufstein Aktiengesellschaft Apparatus for the production of a stencil printing master
US5790156A (en) 1994-09-29 1998-08-04 Tektronix, Inc. Ferroelectric relaxor actuator for an ink-jet print head
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
FR2732081B1 (en) 1995-03-24 1997-05-16 Giat Ind Sa JACK SUPPORTING HEAVY AND FRAGILE STRUCTURES, SUCH AS A TELESCOPE MIRROR
JP3138613B2 (en) 1995-05-24 2001-02-26 三菱電機株式会社 Laser processing equipment
US5610707A (en) 1995-07-07 1997-03-11 Lockheed Missiles & Space Co., Inc. Wavefront sensor for a staring imager
US5768007A (en) 1995-09-11 1998-06-16 Texas Instruments Incorporated Phase matched reset for digital micro-mirror device
JPH1039243A (en) 1996-07-22 1998-02-13 Minolta Co Ltd Laser beam scanning optical device
US6256283B1 (en) * 1996-10-01 2001-07-03 Matsushita Electric Industrial Co., Ltd. Optical pickup having a common light beam path for passing either of a plurality of kinds of light beams
US5731047A (en) 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
US5849125A (en) 1997-02-07 1998-12-15 Clark; Stephen E. Method of manufacturing flextensional transducer using pre-curved piezoelectric ceramic layer
US6180914B1 (en) * 1998-02-17 2001-01-30 Advanced Foliar Technologies, Inc. Laser marking of foliage and cigars
US6191382B1 (en) * 1998-04-02 2001-02-20 Avery Dennison Corporation Dynamic laser cutting apparatus
GB9811557D0 (en) 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
FR2781707B1 (en) 1998-07-30 2000-09-08 Snecma METHOD FOR MACHINING BY EXCIMER LASER OF HOLES OR SHAPES WITH VARIABLE PROFILE
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

Also Published As

Publication number Publication date
WO2001074529A2 (en) 2001-10-11
US20010045419A1 (en) 2001-11-29
WO2001074529A3 (en) 2002-05-30
TW504425B (en) 2002-10-01
US6407363B2 (en) 2002-06-18

Similar Documents

Publication Publication Date Title
AU2001251172A1 (en) Laser system and method for single pass micromachining of multilayer workpieces
AU2002346597A1 (en) System and method for laser micro- machining
AU2002327565A1 (en) Laser micromachining and methods and systems of same
AU2002215319A1 (en) Method and apparatus for reducing laser speckle
AU2001226312A1 (en) Method and system for generating a set of search terms
AU2002311597A1 (en) Multi-beam micro-machining system and method
EP1168299B8 (en) Method and system for preselection of suitable units for concatenative speech
AU2001294118A1 (en) Method and apparatus for precision laser surgery
AU5786600A (en) Combined laser and plasma-arc processing torch and method
GB0214419D0 (en) Laser beam machining apparatus and laser beam machining method
AU2001257572A1 (en) Method and system for account activation
AU2002353990A1 (en) System and method for implementing employee stock plans
AU2002307768A1 (en) System and method for phytomonitoring
AU2002245067A1 (en) System and method for collimating and redirecting beams
AU2001280758A1 (en) Laser radar system and method
AU2002319739A1 (en) System and method for the interactive trading of derivatives
AU2001272963A1 (en) System and method for least work publishing
AU2001250208A1 (en) A method and system for laser drilling
AU2001232285A1 (en) Laser condensing apparatus and laser machining apparatus
AU2001265416A1 (en) Method and apparatus for beam forming
AU2002324704A1 (en) System and method for precise positioning of microcomponents
AU2001241186A1 (en) Method for precisely machining microstructure
AU2001286136A1 (en) Method and system for elimination of acoustic feedback
AU2003261895A1 (en) Method of laser beam machining and laser beam machining apparatus
AU2002233930A1 (en) System and methods for laser assisted deposition