AU2001245478A1 - Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it - Google Patents
Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from itInfo
- Publication number
- AU2001245478A1 AU2001245478A1 AU2001245478A AU4547801A AU2001245478A1 AU 2001245478 A1 AU2001245478 A1 AU 2001245478A1 AU 2001245478 A AU2001245478 A AU 2001245478A AU 4547801 A AU4547801 A AU 4547801A AU 2001245478 A1 AU2001245478 A1 AU 2001245478A1
- Authority
- AU
- Australia
- Prior art keywords
- conductive adhesive
- anisotropically conductive
- adhesive composition
- epoxy resin
- film formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Abstract
To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000088552A JP2001279215A (en) | 2000-03-24 | 2000-03-24 | Adhesive composition having anisotropic conductivity and adhesive film having anisotropic conductivity formed from the same |
JP2000-88552 | 2000-03-24 | ||
PCT/US2001/007234 WO2001072919A2 (en) | 2000-03-24 | 2001-03-07 | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001245478A1 true AU2001245478A1 (en) | 2001-10-08 |
Family
ID=18604418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001245478A Abandoned AU2001245478A1 (en) | 2000-03-24 | 2001-03-07 | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1272586B1 (en) |
JP (1) | JP2001279215A (en) |
KR (1) | KR20030076928A (en) |
AT (1) | ATE268370T1 (en) |
AU (1) | AU2001245478A1 (en) |
DE (1) | DE60103634T2 (en) |
TW (1) | TWI252247B (en) |
WO (1) | WO2001072919A2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7053133B2 (en) | 2001-05-29 | 2006-05-30 | Hiroaki Yamaguchi | Ultraviolet activatable adhesive film |
JP2002363506A (en) * | 2001-05-29 | 2002-12-18 | Three M Innovative Properties Co | Ultraviolet activating adhesive film |
KR100527990B1 (en) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | Paste for circuit connection, anisotropic conductive paste and uses thereof |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
US7235593B2 (en) * | 2003-08-04 | 2007-06-26 | Rensselaer Polytechnic Institute | Command-cure adhesives |
JP2005325312A (en) * | 2004-05-17 | 2005-11-24 | Hitachi Chem Co Ltd | Adhesive composition, film-type adhesive agent and circuit connecting material using the same and connection structure of circuit material and its preparation method |
JP4872220B2 (en) * | 2005-03-04 | 2012-02-08 | 住友金属鉱山株式会社 | Conductive adhesive |
JP5011804B2 (en) * | 2005-09-06 | 2012-08-29 | 日立化成工業株式会社 | Circuit connection material, connection body and circuit member connection method |
KR100727742B1 (en) * | 2005-12-17 | 2007-06-13 | 제일모직주식회사 | Resin formulation of anisotropic conductive adhesive used blocked isocyanate and connection structure using the same |
DE102005062181A1 (en) * | 2005-12-23 | 2007-07-05 | Electrovac Ag | Composite material, preferably multi-layered material, useful e.g. as printed circuit board, comprises two components, which are adjacent to each other and connected to a surface by an adhesive compound, which is a nano-fiber material |
KR100934553B1 (en) | 2007-11-16 | 2009-12-29 | 제일모직주식회사 | Method for producing an anisotropic conductive film and an anisotropic conductive film produced thereby |
JP5636156B2 (en) * | 2008-07-28 | 2014-12-03 | デクセリアルズ株式会社 | Method of applying anisotropic conductive adhesive film resin solution |
JP6438305B2 (en) * | 2014-01-14 | 2018-12-12 | 積水化学工業株式会社 | Photocurable conductive material, connection structure, and method of manufacturing connection structure |
JP6518101B2 (en) * | 2014-03-26 | 2019-05-22 | 積水化学工業株式会社 | PHOTO-CURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE |
JP6518100B2 (en) * | 2014-03-26 | 2019-05-22 | 積水化学工業株式会社 | PHOTO-CURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE |
JP7273283B2 (en) * | 2018-09-10 | 2023-05-15 | デクセリアルズ株式会社 | adhesive composition |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5667893A (en) * | 1992-10-09 | 1997-09-16 | Minnesota Mining And Manufacturing Company | Substrate coated or impregnated with flexible epoxy composition |
DE19534594B4 (en) * | 1995-09-19 | 2007-07-26 | Delo Industrieklebstoffe Gmbh & Co. Kg | Cationic curing, flexible epoxy resin compositions and their use for applying thin layers |
US5863970A (en) * | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
DE19648283A1 (en) * | 1996-11-21 | 1998-05-28 | Thera Ges Fuer Patente | Polymerizable compositions based on epoxides |
JPH11181391A (en) * | 1997-12-22 | 1999-07-06 | Nippon Kayaku Co Ltd | Adhesive composition, adhered body, adhering method, and production of optical disk |
-
2000
- 2000-03-24 JP JP2000088552A patent/JP2001279215A/en active Pending
-
2001
- 2001-03-07 AT AT01918397T patent/ATE268370T1/en not_active IP Right Cessation
- 2001-03-07 DE DE60103634T patent/DE60103634T2/en not_active Expired - Fee Related
- 2001-03-07 AU AU2001245478A patent/AU2001245478A1/en not_active Abandoned
- 2001-03-07 EP EP01918397A patent/EP1272586B1/en not_active Expired - Lifetime
- 2001-03-07 WO PCT/US2001/007234 patent/WO2001072919A2/en not_active Application Discontinuation
- 2001-03-07 KR KR1020027012524A patent/KR20030076928A/en not_active Application Discontinuation
- 2001-03-16 TW TW090106199A patent/TWI252247B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1272586A2 (en) | 2003-01-08 |
EP1272586B1 (en) | 2004-06-02 |
WO2001072919A2 (en) | 2001-10-04 |
DE60103634D1 (en) | 2004-07-08 |
DE60103634T2 (en) | 2005-07-07 |
TWI252247B (en) | 2006-04-01 |
JP2001279215A (en) | 2001-10-10 |
WO2001072919A3 (en) | 2002-01-31 |
ATE268370T1 (en) | 2004-06-15 |
KR20030076928A (en) | 2003-09-29 |
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