AU2001234750A1 - Vacuum package fabrication of microelectromechanical system devices with integrated circuit components - Google Patents

Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Info

Publication number
AU2001234750A1
AU2001234750A1 AU2001234750A AU3475001A AU2001234750A1 AU 2001234750 A1 AU2001234750 A1 AU 2001234750A1 AU 2001234750 A AU2001234750 A AU 2001234750A AU 3475001 A AU3475001 A AU 3475001A AU 2001234750 A1 AU2001234750 A1 AU 2001234750A1
Authority
AU
Australia
Prior art keywords
integrated circuit
circuit components
microelectromechanical system
system devices
vacuum package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234750A
Inventor
Roland W. Gooch
Thomas R. Schimert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/496,820 external-priority patent/US6521477B1/en
Priority claimed from US09/496,826 external-priority patent/US6479320B1/en
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of AU2001234750A1 publication Critical patent/AU2001234750A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
AU2001234750A 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components Abandoned AU2001234750A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/496,820 US6521477B1 (en) 2000-02-02 2000-02-02 Vacuum package fabrication of integrated circuit components
US09496820 2000-02-02
US09496826 2000-02-02
US09/496,826 US6479320B1 (en) 2000-02-02 2000-02-02 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
PCT/US2001/003371 WO2001056921A2 (en) 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Publications (1)

Publication Number Publication Date
AU2001234750A1 true AU2001234750A1 (en) 2001-08-14

Family

ID=27052296

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234750A Abandoned AU2001234750A1 (en) 2000-02-02 2001-02-01 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Country Status (5)

Country Link
EP (1) EP1272422A2 (en)
JP (1) JP2003531475A (en)
KR (1) KR20030023613A (en)
AU (1) AU2001234750A1 (en)
WO (1) WO2001056921A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPR245701A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM10)
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
AUPR245401A0 (en) 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM07)
US6744114B2 (en) * 2001-08-29 2004-06-01 Honeywell International Inc. Package with integrated inductor and/or capacitor
KR100442830B1 (en) 2001-12-04 2004-08-02 삼성전자주식회사 Low temperature hermetic sealing method having a passivation layer
US7026223B2 (en) 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
DE10214769A1 (en) * 2002-04-03 2003-10-16 Bosch Gmbh Robert Device and sensor for recording light signals and manufacturing process
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
EP1460037A1 (en) * 2003-03-18 2004-09-22 SensoNor asa A multi-layer device and method for producing the same
US6897469B2 (en) * 2003-05-02 2005-05-24 Athanasios J. Syllaios Sub-wavelength structures for reduction of reflective properties
US7045868B2 (en) * 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
US6774327B1 (en) * 2003-09-24 2004-08-10 Agilent Technologies, Inc. Hermetic seals for electronic components
US7034393B2 (en) 2003-12-15 2006-04-25 Analog Devices, Inc. Semiconductor assembly with conductive rim and method of producing the same
US7608534B2 (en) 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
US8217473B2 (en) 2005-07-29 2012-07-10 Hewlett-Packard Development Company, L.P. Micro electro-mechanical system packaging and interconnect
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
FI119729B (en) * 2005-11-23 2009-02-27 Vti Technologies Oy A method of making a microelectromechanical component and a microelectromechanical component
FI119728B (en) * 2005-11-23 2009-02-27 Vti Technologies Oy Process for manufacturing microelectromechanical component and microelectromechanical component
WO2007111072A1 (en) 2006-03-29 2007-10-04 Hamamatsu Photonics K.K. Method for manufacturing photoelectric converting device
US7884289B2 (en) 2006-04-13 2011-02-08 Nxp B.V. Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
KR100846569B1 (en) * 2006-06-14 2008-07-15 매그나칩 반도체 유한회사 Package of mems device and method for manufacturing the same
US8100012B2 (en) 2007-01-11 2012-01-24 Analog Devices, Inc. MEMS sensor with cap electrode
US20100327443A1 (en) * 2008-02-22 2010-12-30 Barun Electronics, Co., Ltd. Joining structure and a substrate-joining method using the same
US8618670B2 (en) 2008-08-15 2013-12-31 Qualcomm Incorporated Corrosion control of stacked integrated circuits
US8956904B2 (en) 2008-09-10 2015-02-17 Analog Devices, Inc. Apparatus and method of wafer bonding using compatible alloy
US7981765B2 (en) 2008-09-10 2011-07-19 Analog Devices, Inc. Substrate bonding with bonding material having rare earth metal
US8809784B2 (en) * 2010-10-21 2014-08-19 Raytheon Company Incident radiation detector packaging
US8742570B2 (en) * 2011-09-09 2014-06-03 Qualcomm Mems Technologies, Inc. Backplate interconnect with integrated passives
KR101471386B1 (en) * 2012-12-21 2014-12-11 포항공과대학교 산학협력단 Wafer Level Hermetic Package and Wafer Level Hermetic Packaging Method
KR101450012B1 (en) * 2013-02-12 2014-10-15 한국과학기술원 MEMS package having capping member having different thickness, MEMS package having the same, MEMS wafer level package having the same, and method of manufacturing the same
US10329142B2 (en) * 2015-12-18 2019-06-25 Samsung Electro-Mechanics Co., Ltd. Wafer level package and method of manufacturing the same
JP7292077B2 (en) * 2018-07-11 2023-06-16 三菱電機株式会社 Package element manufacturing method and package element
CN117242567A (en) 2021-05-12 2023-12-15 三菱电机株式会社 Hermetically sealed component and component module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
EP0951069A1 (en) * 1998-04-17 1999-10-20 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
FR2780200B1 (en) * 1998-06-22 2003-09-05 Commissariat Energie Atomique DEVICE AND METHOD FOR FORMING A DEVICE HAVING A CONTROLLED ATMOSPHERE CAVITY

Also Published As

Publication number Publication date
EP1272422A2 (en) 2003-01-08
KR20030023613A (en) 2003-03-19
WO2001056921A3 (en) 2002-03-07
JP2003531475A (en) 2003-10-21
WO2001056921A2 (en) 2001-08-09

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