AU2000279154A1 - Self-aligned transition between a transmission line and a module - Google Patents
Self-aligned transition between a transmission line and a moduleInfo
- Publication number
- AU2000279154A1 AU2000279154A1 AU2000279154A AU7915400A AU2000279154A1 AU 2000279154 A1 AU2000279154 A1 AU 2000279154A1 AU 2000279154 A AU2000279154 A AU 2000279154A AU 7915400 A AU7915400 A AU 7915400A AU 2000279154 A1 AU2000279154 A1 AU 2000279154A1
- Authority
- AU
- Australia
- Prior art keywords
- transmission line
- module
- self
- transition
- aligned transition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000005540 biological transmission Effects 0.000 title abstract 7
- 230000007704 transition Effects 0.000 title abstract 4
- 238000000034 method Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Connection Structure (AREA)
- Optical Couplings Of Light Guides (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Microwave Amplifiers (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Electrotherapy Devices (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The invention relates to a method for forming a self-aligned transition between a transmission line ( 1 ) and a module ( 2 ) to be connected to said transmission line ( 1 ). The invention equally relates to such a module ( 2 ), to such a transmission line ( 1 ), to an intermediate element ( 5 ) possibly to be positioned between such a module ( 2 ) and such a transmission line ( 1 ), and finally to a system comprising such a transition. In order to enable a simple and precise connection of a transmission line ( 1 ) with some other module ( 2 ), it is proposed to use matching solder particles ( 8 ) and soldering pads on module ( 2 ) and transmission line ( 1 ) or intermediate element ( 5 ) respectively, and to apply a reflow treatment to the joined elements ( 1 ) and ( 2 ) or ( 5 ) and ( 2 ), thereby forming a self-aligning connection. The invention is to be applied particularly to waveguide-to-microstrip transitions.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2000/009799 WO2002029923A1 (en) | 2000-10-06 | 2000-10-06 | Self-aligned transition between a transmission line and a module |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000279154A1 true AU2000279154A1 (en) | 2002-04-15 |
Family
ID=8164117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000279154A Abandoned AU2000279154A1 (en) | 2000-10-06 | 2000-10-06 | Self-aligned transition between a transmission line and a module |
Country Status (8)
Country | Link |
---|---|
US (1) | US6940361B1 (en) |
EP (1) | EP1325533B1 (en) |
JP (1) | JP3930803B2 (en) |
CN (1) | CN100355147C (en) |
AT (1) | ATE312417T1 (en) |
AU (1) | AU2000279154A1 (en) |
DE (1) | DE60024684T2 (en) |
WO (1) | WO2002029923A1 (en) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100723635B1 (en) * | 2005-12-08 | 2007-06-04 | 한국전자통신연구원 | The planar transmission line to waveguide transition |
GB0718706D0 (en) | 2007-09-25 | 2007-11-07 | Creative Physics Ltd | Method and apparatus for reducing laser speckle |
WO2008069714A1 (en) * | 2006-12-05 | 2008-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A surface-mountable waveguide arrangement |
US11726332B2 (en) | 2009-04-27 | 2023-08-15 | Digilens Inc. | Diffractive projection apparatus |
US9335604B2 (en) | 2013-12-11 | 2016-05-10 | Milan Momcilo Popovich | Holographic waveguide display |
TWM371979U (en) * | 2009-08-06 | 2010-01-01 | Microelectronics Tech Inc | Wave guide and assembly of wave guide and pcb |
US10795160B1 (en) | 2014-09-25 | 2020-10-06 | Rockwell Collins, Inc. | Systems for and methods of using fold gratings for dual axis expansion |
US8233204B1 (en) | 2009-09-30 | 2012-07-31 | Rockwell Collins, Inc. | Optical displays |
US11320571B2 (en) | 2012-11-16 | 2022-05-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view with uniform light extraction |
US11300795B1 (en) | 2009-09-30 | 2022-04-12 | Digilens Inc. | Systems for and methods of using fold gratings coordinated with output couplers for dual axis expansion |
US8659826B1 (en) | 2010-02-04 | 2014-02-25 | Rockwell Collins, Inc. | Worn display system and method without requiring real time tracking for boresight precision |
WO2012136970A1 (en) | 2011-04-07 | 2012-10-11 | Milan Momcilo Popovich | Laser despeckler based on angular diversity |
WO2016020630A2 (en) | 2014-08-08 | 2016-02-11 | Milan Momcilo Popovich | Waveguide laser illuminator incorporating a despeckler |
EP2748670B1 (en) | 2011-08-24 | 2015-11-18 | Rockwell Collins, Inc. | Wearable data display |
US10670876B2 (en) | 2011-08-24 | 2020-06-02 | Digilens Inc. | Waveguide laser illuminator incorporating a despeckler |
US9715067B1 (en) | 2011-09-30 | 2017-07-25 | Rockwell Collins, Inc. | Ultra-compact HUD utilizing waveguide pupil expander with surface relief gratings in high refractive index materials |
US8634139B1 (en) | 2011-09-30 | 2014-01-21 | Rockwell Collins, Inc. | System for and method of catadioptric collimation in a compact head up display (HUD) |
US9599813B1 (en) | 2011-09-30 | 2017-03-21 | Rockwell Collins, Inc. | Waveguide combiner system and method with less susceptibility to glare |
US9366864B1 (en) | 2011-09-30 | 2016-06-14 | Rockwell Collins, Inc. | System for and method of displaying information without need for a combiner alignment detector |
US20150010265A1 (en) | 2012-01-06 | 2015-01-08 | Milan, Momcilo POPOVICH | Contact image sensor using switchable bragg gratings |
US9523852B1 (en) | 2012-03-28 | 2016-12-20 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
JP6238965B2 (en) | 2012-04-25 | 2017-11-29 | ロックウェル・コリンズ・インコーポレーテッド | Holographic wide-angle display |
US9933684B2 (en) * | 2012-11-16 | 2018-04-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view having a specific light output aperture configuration |
US9674413B1 (en) | 2013-04-17 | 2017-06-06 | Rockwell Collins, Inc. | Vision system and method having improved performance and solar mitigation |
WO2015015138A1 (en) | 2013-07-31 | 2015-02-05 | Milan Momcilo Popovich | Method and apparatus for contact image sensing |
US9244281B1 (en) | 2013-09-26 | 2016-01-26 | Rockwell Collins, Inc. | Display system and method using a detached combiner |
US10732407B1 (en) | 2014-01-10 | 2020-08-04 | Rockwell Collins, Inc. | Near eye head up display system and method with fixed combiner |
US9519089B1 (en) | 2014-01-30 | 2016-12-13 | Rockwell Collins, Inc. | High performance volume phase gratings |
US9244280B1 (en) | 2014-03-25 | 2016-01-26 | Rockwell Collins, Inc. | Near eye display system and method for display enhancement or redundancy |
US10359736B2 (en) | 2014-08-08 | 2019-07-23 | Digilens Inc. | Method for holographic mastering and replication |
US10241330B2 (en) | 2014-09-19 | 2019-03-26 | Digilens, Inc. | Method and apparatus for generating input images for holographic waveguide displays |
US9715110B1 (en) | 2014-09-25 | 2017-07-25 | Rockwell Collins, Inc. | Automotive head up display (HUD) |
US10088675B1 (en) | 2015-05-18 | 2018-10-02 | Rockwell Collins, Inc. | Turning light pipe for a pupil expansion system and method |
WO2016113534A1 (en) | 2015-01-12 | 2016-07-21 | Milan Momcilo Popovich | Environmentally isolated waveguide display |
US9632226B2 (en) | 2015-02-12 | 2017-04-25 | Digilens Inc. | Waveguide grating device |
US10126552B2 (en) | 2015-05-18 | 2018-11-13 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
US10247943B1 (en) | 2015-05-18 | 2019-04-02 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
US11366316B2 (en) | 2015-05-18 | 2022-06-21 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
US10108010B2 (en) | 2015-06-29 | 2018-10-23 | Rockwell Collins, Inc. | System for and method of integrating head up displays and head down displays |
EP3359999A1 (en) | 2015-10-05 | 2018-08-15 | Popovich, Milan Momcilo | Waveguide display |
US10598932B1 (en) | 2016-01-06 | 2020-03-24 | Rockwell Collins, Inc. | Head up display for integrating views of conformally mapped symbols and a fixed image source |
EP3433659A1 (en) | 2016-03-24 | 2019-01-30 | DigiLens, Inc. | Method and apparatus for providing a polarization selective holographic waveguide device |
EP3433658B1 (en) | 2016-04-11 | 2023-08-09 | DigiLens, Inc. | Holographic waveguide apparatus for structured light projection |
US11513350B2 (en) | 2016-12-02 | 2022-11-29 | Digilens Inc. | Waveguide device with uniform output illumination |
WO2018129398A1 (en) | 2017-01-05 | 2018-07-12 | Digilens, Inc. | Wearable heads up displays |
US10295824B2 (en) | 2017-01-26 | 2019-05-21 | Rockwell Collins, Inc. | Head up display with an angled light pipe |
JP6861588B2 (en) * | 2017-07-07 | 2021-04-21 | 株式会社フジクラ | Transmission line |
CN116149058A (en) | 2017-10-16 | 2023-05-23 | 迪吉伦斯公司 | System and method for multiplying image resolution of pixellated display |
US10914950B2 (en) | 2018-01-08 | 2021-02-09 | Digilens Inc. | Waveguide architectures and related methods of manufacturing |
KR20200108030A (en) | 2018-01-08 | 2020-09-16 | 디지렌즈 인코포레이티드. | System and method for high throughput recording of holographic gratings in waveguide cells |
WO2020023779A1 (en) | 2018-07-25 | 2020-01-30 | Digilens Inc. | Systems and methods for fabricating a multilayer optical structure |
CN113692544A (en) | 2019-02-15 | 2021-11-23 | 迪吉伦斯公司 | Method and apparatus for providing holographic waveguide display using integrated grating |
KR20210134763A (en) | 2019-03-12 | 2021-11-10 | 디지렌즈 인코포레이티드. | Holographic waveguide backlights and related manufacturing methods |
CN114207492A (en) | 2019-06-07 | 2022-03-18 | 迪吉伦斯公司 | Waveguide with transmission grating and reflection grating and method for producing the same |
EP4004646A4 (en) | 2019-07-29 | 2023-09-06 | Digilens Inc. | Methods and apparatus for multiplying the image resolution and field-of-view of a pixelated display |
US11442222B2 (en) | 2019-08-29 | 2022-09-13 | Digilens Inc. | Evacuated gratings and methods of manufacturing |
DE102020121855A1 (en) | 2020-08-20 | 2022-02-24 | Infineon Technologies Ag | Radio frequency devices and associated manufacturing processes |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485986A (en) * | 1990-07-30 | 1992-03-18 | Rohm Co Ltd | Printed circuit board |
US5793263A (en) * | 1996-05-17 | 1998-08-11 | University Of Massachusetts | Waveguide-microstrip transmission line transition structure having an integral slot and antenna coupling arrangement |
JP2003068928A (en) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | Mounting structure of wiring board for high frequency |
-
2000
- 2000-10-06 DE DE60024684T patent/DE60024684T2/en not_active Expired - Lifetime
- 2000-10-06 US US10/398,440 patent/US6940361B1/en not_active Expired - Fee Related
- 2000-10-06 EP EP00969440A patent/EP1325533B1/en not_active Expired - Lifetime
- 2000-10-06 WO PCT/EP2000/009799 patent/WO2002029923A1/en active IP Right Grant
- 2000-10-06 CN CNB008199477A patent/CN100355147C/en not_active Expired - Fee Related
- 2000-10-06 AT AT00969440T patent/ATE312417T1/en not_active IP Right Cessation
- 2000-10-06 AU AU2000279154A patent/AU2000279154A1/en not_active Abandoned
- 2000-10-06 JP JP2002533428A patent/JP3930803B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1325533A1 (en) | 2003-07-09 |
DE60024684D1 (en) | 2006-01-12 |
EP1325533B1 (en) | 2005-12-07 |
ATE312417T1 (en) | 2005-12-15 |
WO2002029923A1 (en) | 2002-04-11 |
CN1454402A (en) | 2003-11-05 |
US6940361B1 (en) | 2005-09-06 |
JP3930803B2 (en) | 2007-06-13 |
JP2004511155A (en) | 2004-04-08 |
CN100355147C (en) | 2007-12-12 |
DE60024684T2 (en) | 2006-06-22 |
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