ZA9401671B - Attaching an electronic circuit to a substrate. - Google Patents

Attaching an electronic circuit to a substrate.

Info

Publication number
ZA9401671B
ZA9401671B ZA9401671A ZA9401671A ZA9401671B ZA 9401671 B ZA9401671 B ZA 9401671B ZA 9401671 A ZA9401671 A ZA 9401671A ZA 9401671 A ZA9401671 A ZA 9401671A ZA 9401671 B ZA9401671 B ZA 9401671B
Authority
ZA
South Africa
Prior art keywords
attaching
substrate
electronic circuit
electronic
circuit
Prior art date
Application number
ZA9401671A
Inventor
Michael John Camille Marsh
Mark Harley Carson
Gideon Johannes Gouws
Mario Alphonso Marais
Trevor Meredith Hodson
Original Assignee
Csir
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ZA9301752 priority Critical
Application filed by Csir filed Critical Csir
Publication of ZA9401671B publication Critical patent/ZA9401671B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42Details of containers or of foldable or erectable container blanks
    • B65D5/4212Information or decoration elements, e.g. content indicators, or for mailing
    • B65D5/4233Cards, coupons, labels or the like formed separately from the container or lid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42Details of containers or of foldable or erectable container blanks
    • B65D5/44Integral, inserted or attached portions forming internal or external fittings not used, see subgroups
    • B65D5/52External stands or display elements for contents
    • B65D5/528Contents attached to or resting on the external surface of the container
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00Closures not otherwise provided for
    • B65D51/24Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
    • B65D51/245Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes provided with decoration, information or contents indicating devices, labels
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B31MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31BMAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/74Auxiliary operations
    • B31B50/81Forming or attaching accessories, e.g. opening devices, closures or tear strings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00Decoration means, markings, information elements, contents indicators
    • B65D2203/10Transponders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2211/00Anti-theft means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241Disposition
    • H01L2224/24151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/2919Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/0665Epoxy resin
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
ZA9401671A 1993-03-11 1994-03-10 Attaching an electronic circuit to a substrate. ZA9401671B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ZA9301752 1993-03-11

Publications (1)

Publication Number Publication Date
ZA9401671B true ZA9401671B (en) 1994-10-12

Family

ID=25582654

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA9401671A ZA9401671B (en) 1993-03-11 1994-03-10 Attaching an electronic circuit to a substrate.

Country Status (5)

Country Link
US (1) US5566441A (en)
EP (1) EP0615285A3 (en)
JP (1) JPH0722831A (en)
SG (1) SG63620A1 (en)
ZA (1) ZA9401671B (en)

Families Citing this family (294)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE4410732C2 (en) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg A method for arranging a at least one chip and a wire coil having transponder unit on a substrate and chip card with correspondingly arranged transponder unit
DE4444262C1 (en) * 1994-12-13 1996-04-18 Continental Ag Conveyor belt condition inductive monitoring system
DE19509233A1 (en) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh A method of producing electronic components containing plastic cards
US6362738B1 (en) 1998-04-16 2002-03-26 Motorola, Inc. Reader for use in a radio frequency identification system and method thereof
US6879809B1 (en) 1998-04-16 2005-04-12 Motorola, Inc. Wireless electrostatic charging and communicating system
US6252508B1 (en) 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6275681B1 (en) 1998-04-16 2001-08-14 Motorola, Inc. Wireless electrostatic charging and communicating system
US6107921A (en) 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6040773A (en) * 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6411213B1 (en) 1995-10-11 2002-06-25 Motorola, Inc. Radio frequency identification tag system using tags arranged for coupling to ground
US6611199B1 (en) 1995-10-11 2003-08-26 Motorola, Inc. Capacitively powered portable communication device and associated exciter/reader and related method
US6404339B1 (en) 1995-10-11 2002-06-11 Motorola, Inc. Radio frequency identification tag arranged with a printable display
US6282407B1 (en) 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
US6496112B1 (en) 1998-02-27 2002-12-17 Motorola, Inc. Radio frequency identification tag with a programmable circuit state
US5712643A (en) * 1995-12-05 1998-01-27 Cushcraft Corporation Planar microstrip Yagi Antenna array
WO1997021118A1 (en) * 1995-12-05 1997-06-12 Michel Bisson Contactless electronic transponder with printed loop antenna circuit
EP0812474A1 (en) * 1996-01-02 1997-12-17 Texas Instruments Incorporated Integrated system package
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
DE19616424A1 (en) * 1996-04-25 1997-10-30 Manfred Dr Michalk Electrically isolating material with electronic module
FR2748350B1 (en) * 1996-05-06 2000-07-13 Solaic Sa Electronic component in integrated circuit form for insertion in a warm substrate and processes for its manufacture
US5734418A (en) * 1996-07-17 1998-03-31 Welch Allyn, Inc. Endoscope with tab imager package
US6466131B1 (en) * 1996-07-30 2002-10-15 Micron Technology, Inc. Radio frequency data communications device with adjustable receiver sensitivity and method
ES2221027T3 (en) 1996-08-09 2004-12-16 Ferag Ag mobile electronic object that stored data can be read and / or recorded without contact.
US5745036A (en) * 1996-09-12 1998-04-28 Checkpoint Systems, Inc. Electronic article security system for store which uses intelligent security tags and transaction data
FR2756955B1 (en) * 1996-12-11 1999-01-08 Schlumberger Ind Sa A method of making an electronic circuit for a memory card without contact
FR2760225B1 (en) * 1997-02-28 1999-05-21 Smurfit Socar Sa Cardboard packaging undulates crew of a recording medium and information identification
NL1005914C2 (en) * 1997-04-28 1998-10-29 Sgt Exploitatie Bv Device for storing and / or handling of chemicals.
US6329213B1 (en) * 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
SE510861C2 (en) * 1997-07-11 1999-06-28 Ericsson Telefon Ab L M Device and method in electronic
US5963134A (en) 1997-07-24 1999-10-05 Checkpoint Systems, Inc. Inventory system using articles with RFID tags
US6025780A (en) * 1997-07-25 2000-02-15 Checkpoint Systems, Inc. RFID tags which are virtually activated and/or deactivated and apparatus and methods of using same in an electronic security system
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6054925A (en) * 1997-08-27 2000-04-25 Data Investments Limited High impedance transponder with improved backscatter modulator for electronic identification system
FR2768707B1 (en) * 1997-09-22 1999-10-29 Plastic Omnium Cie A transport and / or collection in molded plastic material having an identification device and method of manufacture
DE69722403D1 (en) 1997-09-23 2003-07-03 St Microelectronics Srl Banknote with an integrated circuit
EP0905640A1 (en) 1997-09-26 1999-03-31 Data Investments Limited Delayed reset mode model for electronic identification systems
SE512413C2 (en) * 1997-10-01 2000-03-13 Allgon Ab A method of manufacturing an antenna device and an antenna device
US6043745A (en) 1997-11-13 2000-03-28 Micron Technology, Inc. Electronic devices and methods of forming electronic devices
US7035818B1 (en) * 1997-11-21 2006-04-25 Symbol Technologies, Inc. System and method for electronic inventory
US7844505B1 (en) 1997-11-21 2010-11-30 Symbol Technologies, Inc. Automated real-time distributed tag reader network
US6002344A (en) * 1997-11-21 1999-12-14 Bandy; William R. System and method for electronic inventory
FR2772529B1 (en) * 1997-12-17 2000-02-04 Smurfit Worldwide Research Eur Subsrat provided with an electronic device
US6343019B1 (en) 1997-12-22 2002-01-29 Micron Technology, Inc. Apparatus and method of stacking die on a substrate
US6154136A (en) * 1998-02-26 2000-11-28 Van Eeden; Hendrik Lodewyk Free running RF identification system with increasing average inter transmission intervals
US5933121A (en) * 1998-04-07 1999-08-03 Harris Corporation Antenna array for sensing signals on conductors
NL1008929C2 (en) * 1998-04-20 1999-10-21 Vhp Ugchelen Bv From paper made substrate provided with an integrated circuit.
FR2778308B1 (en) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Process for the realization of an electronic component and electronic component
US6154137A (en) 1998-06-08 2000-11-28 3M Innovative Properties Company Identification tag with enhanced security
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6130613A (en) * 1998-06-09 2000-10-10 Motorola, Inc. Radio frequency indentification stamp and radio frequency indentification mailing label
US6091332A (en) * 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6246327B1 (en) 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6724895B1 (en) 1998-06-18 2004-04-20 Supersensor (Proprietary) Limited Electronic identification system and method with source authenticity verification
FR2780534B1 (en) * 1998-06-25 2002-08-16 Solaic Sa A method of making portable objects has electronic components and portable objects as obtained by said process
US6459588B1 (en) * 1998-07-08 2002-10-01 Dai Nippon Printing Co., Ltd. Noncontact IC card and fabrication method thereof
AU762495B2 (en) 1998-08-14 2003-06-26 3M Innovative Properties Company Application for a radio frequency identification system
BR9913043B1 (en) 1998-08-14 2012-10-02 processes for ordering a group of cluttered items having radio frequency identification elements, for using a hand held radio frequency identification device to read information from a radio frequency identification element, and for using a radio frequency identification device for identifying and locating items having a radio frequency identification element.
US6424262B2 (en) 1998-08-14 2002-07-23 3M Innovative Properties Company Applications for radio frequency identification systems
EP1105855B1 (en) 1998-08-14 2008-07-09 3M Innovative Properties Company Applications for radio frequency identification systems
US5987732A (en) * 1998-08-20 1999-11-23 Trw Inc. Method of making compact integrated microwave assembly system
DE19840220A1 (en) * 1998-09-03 2000-04-20 Fraunhofer Ges Forschung Transponder module and method for manufacturing the same
US6147605A (en) * 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
KR100437007B1 (en) 1998-09-11 2004-06-23 모토로라 인코포레이티드 Radio frequency identification tag apparatus and related method
US6114962A (en) * 1998-10-15 2000-09-05 Intermec Ip Corp. RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto
US6147604A (en) * 1998-10-15 2000-11-14 Intermec Ip Corporation Wireless memory device
US6480143B1 (en) 1998-11-09 2002-11-12 Supersensor (Proprietary) Limited Electronic identification system
EP1780664B1 (en) * 1998-11-30 2009-10-14 Hitachi, Ltd. Method of mounting electronic circuit chip
FR2787042B1 (en) * 1998-12-09 2001-03-09 Central Labo Europ biological analysis system comprising a control means matching between biological analysis equipment and a supplementary container.
JP4589375B2 (en) * 1998-12-17 2010-12-01 株式会社日立製作所 Semiconductor device
TW484101B (en) 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
GB2345196B (en) 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
JP2000295027A (en) 1999-02-01 2000-10-20 Supersensor Pty Ltd Hybrid antenna device used for electronic identification system
US6531964B1 (en) 1999-02-25 2003-03-11 Motorola, Inc. Passive remote control system
FR2790849B1 (en) * 1999-03-12 2001-04-27 Gemplus Card Int A manufacturing method for electronic device of the type contactless card
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
US6278413B1 (en) 1999-03-29 2001-08-21 Intermec Ip Corporation Antenna structure for wireless communications device, such as RFID tag
DE19921230B4 (en) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Method for handling thinned chips for insertion in chip cards
SE516749C2 (en) * 1999-05-27 2002-02-26 Repeat It Ab An antenna unit
DE29909681U1 (en) * 1999-06-02 1999-08-26 Cascades Arnsberg Gmbh sales packaging
FR2795234B1 (en) * 1999-06-15 2003-07-18 Gemplus Card Int Process for the manufacture of all or part of an electronic device material jet
FR2796183B1 (en) 1999-07-07 2001-09-28 A S K Ticket for contactless access and process for its manufacture
US6294839B1 (en) 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
EP1083519A3 (en) * 1999-09-09 2002-01-30 Supersensor (Proprietary) Limited Method of mounting RF transponders on containers
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6259369B1 (en) * 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
US6271793B1 (en) * 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
US6259408B1 (en) 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
FR2801708B1 (en) 1999-11-29 2003-12-26 A S K Method for producing a chip card without contact with a fibrous material antenna support
FR2801707B1 (en) * 1999-11-29 2002-02-15 A S K Method for manufacturing a hybrid chip card has contact-free contact with a fibrous material antenna support
FR2801709B1 (en) 1999-11-29 2002-02-15 A S K Smart card contactless or hybrid contact-contactless to limit the risk of fraud
SE0004353L (en) * 1999-12-06 2001-06-07 Greiner Bio One Gmbh Device in the form of a vessel and / or seal
SG106050A1 (en) * 2000-03-13 2004-09-30 Megic Corp Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
US6229442B1 (en) 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
AU5389201A (en) * 2000-04-13 2001-10-30 Int Paper Co Integrated package and rfid antenna
US6806812B1 (en) 2000-04-26 2004-10-19 Micron Technology, Inc. Automated antenna trim for transmitting and receiving semiconductor devices
DE20009865U1 (en) * 2000-06-05 2000-12-07 Cubit Electronics Gmbh Antenna arrangement for contactless transponder
US6369711B1 (en) * 2000-06-09 2002-04-09 Intermec Ip Corp Profile corrected label with RFID transponder and method for making same
US6457337B1 (en) 2000-06-14 2002-10-01 Motorola, Inc. Key, lock, and key and lock system
EP1168239A3 (en) * 2000-06-21 2003-10-01 PACHEM Papier - Chem. Produktions Gesellschaft m.b.H. & Co. KG Adhesive label
AUPQ873400A0 (en) * 2000-07-13 2000-08-03 Dolphin Advanced Technologies Pty Limited Improved gaming chip
US6483473B1 (en) * 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US7098850B2 (en) * 2000-07-18 2006-08-29 King Patrick F Grounded antenna for a wireless communication device and method
US6806842B2 (en) * 2000-07-18 2004-10-19 Marconi Intellectual Property (Us) Inc. Wireless communication device and method for discs
USRE43683E1 (en) 2000-07-18 2012-09-25 Mineral Lassen Llc Wireless communication device and method for discs
AU8293501A (en) * 2000-08-01 2002-02-13 First Usa Bank Na System and method for transponder-enabled account transactions
US6384727B1 (en) 2000-08-02 2002-05-07 Motorola, Inc. Capacitively powered radio frequency identification device
US6392544B1 (en) 2000-09-25 2002-05-21 Motorola, Inc. Method and apparatus for selectively activating radio frequency identification tags that are in close proximity
US6975834B1 (en) * 2000-10-03 2005-12-13 Mineral Lassen Llc Multi-band wireless communication device and method
DE60239124D1 (en) 2001-02-12 2011-03-24 Symbol Technologies Inc Architecture for radio frequency identification
US6842148B2 (en) 2001-04-16 2005-01-11 Skycross, Inc. Fabrication method and apparatus for antenna structures in wireless communications devices
US6859745B2 (en) * 2001-05-18 2005-02-22 Alcoa Closure Systems International Interactive information package
US6641052B2 (en) * 2001-06-07 2003-11-04 Procap Technologies System and method for authentication of the contents of containers
US6501382B1 (en) * 2001-06-11 2002-12-31 Timken Company Bearing with data storage device
US7032818B2 (en) * 2001-07-03 2006-04-25 Nestec S.A. Method and system of setting and/or controlling of a food product dispensing machine using a tag-type communication device
FR2827986B1 (en) * 2001-07-30 2004-04-02 Arjo Wiggins Sa Process for manufacturing an article having a fibrous layer and at least one electronic chip, and article thus obtained
DE10140286B4 (en) * 2001-08-16 2004-05-06 Panther Packaging Gmbh & Co. Kg A process for producing corrugated board provided with transponders and transponders provided with corrugated
US7137000B2 (en) 2001-08-24 2006-11-14 Zih Corp. Method and apparatus for article authentication
WO2003023705A1 (en) * 2001-09-13 2003-03-20 Alcoa Closure Systems International, Inc. Method of making interactive information closure
US20030061706A1 (en) * 2001-09-13 2003-04-03 Larry Smeyak Method of making interactive information closure and package
US6782601B2 (en) 2001-09-13 2004-08-31 Alcoa Closure Systems International Method of making interactive information closure
US6741212B2 (en) 2001-09-14 2004-05-25 Skycross, Inc. Low profile dielectrically loaded meanderline antenna
TW503496B (en) 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
TW544882B (en) 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW517361B (en) * 2001-12-31 2003-01-11 Megic Corp Chip package structure and its manufacture process
US20030235027A1 (en) * 2002-01-09 2003-12-25 Larry Smeyak Method of making interactive information closure and package
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
US7214569B2 (en) 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6777829B2 (en) * 2002-03-13 2004-08-17 Celis Semiconductor Corporation Rectifier utilizing a grounded antenna
US7009496B2 (en) * 2002-04-01 2006-03-07 Symbol Technologies, Inc. Method and system for optimizing an interrogation of a tag population
US7383864B2 (en) * 2002-04-03 2008-06-10 3M Innovative Properties Company Radio-frequency identification tag and tape applicator, radio-frequency identification tag applicator, and methods of applying radio-frequency identification tags
AU2003233033A1 (en) * 2002-04-24 2003-11-10 Marconi Intellectual Property (Us) Inc Manufacturing method for a wireless communication device and manufacturing apparatus
DE10229168A1 (en) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminate having a structure formed as an antenna electrically conductive layer
US7117581B2 (en) * 2002-08-02 2006-10-10 Symbol Technologies, Inc. Method for high volume assembly of radio frequency identification tags
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US6975206B2 (en) * 2002-08-30 2005-12-13 Intellectual Property, Llc Method for communication between central terminal and multiple transponders
US6667092B1 (en) 2002-09-26 2003-12-23 International Paper Company RFID enabled corrugated structures
US20040070504A1 (en) * 2002-10-14 2004-04-15 Brollier Brian W. Semi-covert RFID enabled containers
KR20060054169A (en) * 2002-10-25 2006-05-22 심볼테크놀로지스,인코포레이티드 Optimization of a binary tree traversal with secure communication
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7051429B2 (en) * 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
US20050005434A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
EP1699637B2 (en) 2003-08-01 2017-12-27 manroland web systems GmbH Method for further printing with electrical conductivity
DE10335230A1 (en) * 2003-08-01 2005-02-17 Man Roland Druckmaschinen Ag A process for producing RFID labels
US7017807B2 (en) * 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
US7068028B2 (en) * 2003-09-12 2006-06-27 Intellectual Property Llc Method and apparatus for metal target proximity detection at long distances
JP4489082B2 (en) * 2003-12-12 2010-06-23 キップ、ティモ・ダブリュKIPP, Timo, W. A device for electronically determining whether a tax has been paid on a product
US7061382B2 (en) * 2003-12-12 2006-06-13 Francis M. Claessens Apparatus for electronically verifying the authenticity of contents within a container
WO2005070143A2 (en) * 2004-01-12 2005-08-04 Symbol Technologies, Inc. Radio frequency identification tag inlay sortation and assembly
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
US7034689B2 (en) * 2004-01-28 2006-04-25 Bertrand Teplitxky Secure product packaging system
US7309014B2 (en) 2004-03-04 2007-12-18 Ethicon, Inc. Sterilizer cassette handling system with dual visual code reading
US20050196604A1 (en) * 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
WO2005093455A1 (en) * 2004-03-29 2005-10-06 Magellan Technology Pty Ltd. An article supply chain and/or authentication, monitoring, tracking and identification system, method and device
US20050224590A1 (en) * 2004-04-13 2005-10-13 John Melngailis Method and system for fabricating integrated circuit chips with unique identification numbers
US7114654B2 (en) 2004-04-15 2006-10-03 Printronix RFID encoder and verifier
US7114655B2 (en) 2004-04-15 2006-10-03 Printronix EPC data manager
US7446663B2 (en) * 2004-04-20 2008-11-04 Alcoa Closure Systems International, Inc. Method of forming an RF circuit assembly having multiple antenna portions
US7098794B2 (en) 2004-04-30 2006-08-29 Kimberly-Clark Worldwide, Inc. Deactivating a data tag for user privacy or tamper-evident packaging
US7948381B2 (en) 2004-04-30 2011-05-24 Binforma Group Limited Liability Company Reversibly deactivating a radio frequency identification data tag
US7302751B2 (en) * 2004-04-30 2007-12-04 Hewlett-Packard Development Company, L.P. Method of fabricating a rat's nest RFID antenna
US7336183B2 (en) 2004-04-30 2008-02-26 Kimberly-Clark Worldwide, Inc. Decommissioning an electronic data tag
US7151455B2 (en) 2004-04-30 2006-12-19 Kimberly-Clark Worldwide, Inc. Activating a data tag by load or orientation or user control
US20050274811A1 (en) * 2004-06-14 2005-12-15 Zercher J M Identification card utilizing an integrated circuit with a foil antenna
EP1761790A2 (en) * 2004-06-29 2007-03-14 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
JP4359198B2 (en) * 2004-06-30 2009-11-04 株式会社日立製作所 IC tag mounting substrate manufacturing method
US7229018B2 (en) * 2004-08-03 2007-06-12 Kurz Arthur A Manufacture of RFID tags and intermediate products therefor
EP1626375A1 (en) 2004-08-10 2006-02-15 Tuttoespresso S.p.a. Apparatus and method for dispensing machine control
US7187293B2 (en) 2004-08-17 2007-03-06 Symbol Technologies, Inc. Singulation of radio frequency identification (RFID) tags for testing and/or programming
US7126479B2 (en) * 2004-08-17 2006-10-24 Francis M. Claessens Metal container closure having integral RFID tag
US7253736B2 (en) * 2004-08-26 2007-08-07 Sdgi Holdings, Inc. RFID tag for instrument handles
US20060057762A1 (en) * 2004-09-13 2006-03-16 Shoei-Lai Chen Method of building electronic label for electronic device
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
FR2875995B1 (en) * 2004-09-24 2014-10-24 Oberthur Card Syst Sa Method for mounting an electronic component on a support, preferably mou, and electronic entity thus obtained, such as a passport
US20060092026A1 (en) * 2004-11-02 2006-05-04 Lawrence Daniel P Method of creating an RFID tag with substantially protected rigid electronic component
US20060099112A1 (en) * 2004-11-05 2006-05-11 Fitzco, Incorporated Biospecimen handling apparatus and method
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7417550B2 (en) 2004-12-20 2008-08-26 3M Innovative Properties Company Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
ES2262425B1 (en) * 2005-02-24 2007-11-16 Mobile Safe Data Services, Sl Capsule for bottles and bottle.
US20060292316A1 (en) * 2005-03-01 2006-12-28 Kevin Conwell Profile correction for RFID label with transponder
US20060223225A1 (en) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
DE102005018410C5 (en) * 2005-04-20 2016-03-24 Karl Knauer Kg Packaging with a high-gloss, metallic surface
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7722920B2 (en) * 2005-05-13 2010-05-25 University Of Pittsburgh-Of The Commonwealth System Of Higher Education Method of making an electronic device using an electrically conductive polymer, and associated products
US20070012773A1 (en) * 2005-06-07 2007-01-18 University Of Pittsburgh - Of The Commonwealth System Of Higher Education Method of making an electronic device using an electrically conductive polymer, and associated products
JP2006332094A (en) 2005-05-23 2006-12-07 Seiko Epson Corp Process for producing electronic substrate, process for manufacturing semiconductor device and process for manufacturing electronic apparatus
JP4500214B2 (en) * 2005-05-30 2010-07-14 株式会社日立製作所 Wireless IC tag and method of manufacturing wireless IC tag
US7651032B2 (en) * 2005-06-22 2010-01-26 Smurfit-Stone Container Enterprises, Inc. Methods and systems for in-line RFID transponder assembly
DE102005029489A1 (en) * 2005-06-24 2006-12-28 Man Roland Druckmaschinen Ag Direct integration of radio frequency identification (RFID) components e.g. RFID chips, RFID transponders, into folding boxes, by attaching RFID chips or RFID transponder to packaging during preparation, production or filling of packaging
FI20055420A0 (en) 2005-07-25 2005-07-25 Lk Products Oy Adjustable multiband antenna
US7893813B2 (en) * 2005-07-28 2011-02-22 Intermec Ip Corp. Automatic data collection device, method and article
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
DE102005041221A1 (en) * 2005-08-31 2007-03-01 Krones Ag Label manufacturing device for making labels used in containers e.g. bottles, has radio frequency identification (RFID) manufacturing unit for attaching RFID transponder to label during production of label
US8048510B2 (en) * 2005-09-21 2011-11-01 Whirlpool Corporation Liner with electrical pathways
US8199689B2 (en) 2005-09-21 2012-06-12 Intermec Ip Corp. Stochastic communication protocol method and system for radio frequency identification (RFID) tags based on coalition formation, such as for tag-to-tag communication
FI119009B (en) 2005-10-03 2008-06-13 Pulse Finland Oy Multiple-band antenna
FI118782B (en) 2005-10-14 2008-03-14 Pulse Finland Oy Adjustable antenna
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US7605708B2 (en) 2005-12-22 2009-10-20 Checkpoint Systems, Inc. Smart corrugated cardboard
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
US7342501B2 (en) * 2006-02-07 2008-03-11 Owens-Illinois Healthcare Packaging Inc. Closure and package with induction seal and RFID tag
US7388506B2 (en) 2006-02-07 2008-06-17 Rexam Healthcare Packaging Inc. Closure and package with induction seal and RFID tag
JP5034371B2 (en) 2006-02-10 2012-09-26 富士通株式会社 RFID tag manufacturing method and RFID tag
CN101385402B (en) 2006-02-13 2012-03-21 松下电器产业株式会社 Circuit board and process for producing the same
DE102006008948B3 (en) * 2006-02-23 2007-10-04 Mühlbauer Ag Method for applying and electrically contacting electronic components to a substrate web
DE102006025000A1 (en) * 2006-03-03 2007-09-06 Hamedani, Soheil Precious metal object with RFID identifier
EP1993170A4 (en) 2006-03-06 2011-11-16 Mitsubishi Electric Corp Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag
US8120461B2 (en) 2006-04-03 2012-02-21 Intermec Ip Corp. Automatic data collection device, method and article
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
US7772981B1 (en) 2006-05-08 2010-08-10 Rexam Closures And Containers Inc. Non-removable closure with integral RFID
US20080012687A1 (en) * 2006-06-29 2008-01-17 Rubinstein Walter M Container with embedded rfid tag
US8002173B2 (en) 2006-07-11 2011-08-23 Intermec Ip Corp. Automatic data collection device, method and article
US7973664B1 (en) 2006-08-04 2011-07-05 Rexam Healthcare Packaging Inc. Closure having RFID and foil
US7579955B2 (en) 2006-08-11 2009-08-25 Intermec Ip Corp. Device and method for selective backscattering of wireless communications signals
US7479887B2 (en) 2006-09-07 2009-01-20 Rexam Healthcare Packaging Inc. Closure and container package with RFID circuit
US20080068268A1 (en) * 2006-09-14 2008-03-20 Kowalewicz John V Low profile antenna
US7887755B2 (en) * 2006-09-20 2011-02-15 Binforma Group Limited Liability Company Packaging closures integrated with disposable RFID devices
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US20080074271A1 (en) * 2006-09-27 2008-03-27 Science Applications International Corporation Radio frequency transponders having three-dimensional antennas
JP4942440B2 (en) * 2006-09-29 2012-05-30 日本クラウンコルク株式会社 Cap with IC tag
US8820639B2 (en) 2006-11-03 2014-09-02 Assa Abloy Ab Security feature RFID card
EP1936544A1 (en) * 2006-12-21 2008-06-25 China Steel Corporation Radio frequency identification tag device having a metal substrate
US7581308B2 (en) * 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
FI20075269A0 (en) 2007-04-19 2007-04-19 Pulse Finland Oy Method and arrangement for antenna matching
WO2008143043A1 (en) * 2007-05-14 2008-11-27 Tateyama Kagaku Industry Co., Ltd. Wireless ic tag and method for manufacturing wireless ic tag
JP4674710B2 (en) 2007-05-14 2011-04-20 立山科学工業株式会社 Manufacturing method of wireless IC tag
EP2000957A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a radiofrequency transponder antenna with two terminal portions made on a single medium and device obtained
US8120484B2 (en) * 2007-06-14 2012-02-21 Rexam Healthcare Packaging Inc. Closure and package with RFID kernel tag and boost antenna
IL184260D0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
FR2918485B1 (en) * 2007-07-04 2010-09-10 Arjowiggins Licensing Sas Fibrous insert medium with antenna
US7696062B2 (en) 2007-07-25 2010-04-13 Northrop Grumman Systems Corporation Method of batch integration of low dielectric substrates with MMICs
FI120427B (en) 2007-08-30 2009-10-15 Pulse Finland Oy Adjustable multiband antenna
US20090058609A1 (en) * 2007-09-05 2009-03-05 Clayman Henry M Coupon provided with rfid tag and method of using the same
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8079132B2 (en) * 2008-03-11 2011-12-20 Henry Clayman Method for shielding RFID tagged discarded items in retail, manufacturing and wholesale industries
DE102008048961A1 (en) * 2008-09-25 2010-04-01 Contitech Luftfedersysteme Gmbh Identification device for an air spring
JP5195241B2 (en) * 2008-09-30 2013-05-08 凸版印刷株式会社 Heat-resistant IC tag strap
EP2200412A1 (en) * 2008-12-17 2010-06-23 TNO Institute of Industrial Technology Flexible electronic product and method for manufacturing the same
US8116897B2 (en) * 2009-02-20 2012-02-14 Henry Clayman Method for manufacturing multi-piece article using RFID tags
EP2461424B1 (en) * 2009-07-28 2015-12-16 Dexerials Corporation Production method for antenna device
US8752277B2 (en) * 2009-07-28 2014-06-17 Dexerials Corporation Method for producing antenna device
KR101079543B1 (en) * 2009-08-19 2011-11-02 삼성전기주식회사 Radio Frequency Identification Tag, Method and Mould for Manufacturing the same
FI20096134A0 (en) 2009-11-03 2009-11-03 Pulse Finland Oy Adjustable antenna
US9256767B2 (en) * 2009-11-11 2016-02-09 Hand Held Products, Inc. Tracking system
FI20096251A0 (en) 2009-11-27 2009-11-27 Pulse Finland Oy MIMO antenna
DE102009056122A1 (en) * 2009-11-30 2011-06-01 Smartrac Ip B.V. Method for contacting a chip
US8847833B2 (en) 2009-12-29 2014-09-30 Pulse Finland Oy Loop resonator apparatus and methods for enhanced field control
FI20105158A (en) 2010-02-18 2011-08-19 Pulse Finland Oy Shell radiator antenna
US9406998B2 (en) 2010-04-21 2016-08-02 Pulse Finland Oy Distributed multiband antenna and methods
EP2711173A3 (en) 2010-06-14 2016-03-23 Avery Dennison Corporation Method Of Manufacturing Conductive Structures
FI20115072A0 (en) 2011-01-25 2011-01-25 Pulse Finland Oy Multi-resonance antenna, antenna module and radio unit
US8648752B2 (en) 2011-02-11 2014-02-11 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US9673507B2 (en) 2011-02-11 2017-06-06 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US8618990B2 (en) 2011-04-13 2013-12-31 Pulse Finland Oy Wideband antenna and methods
FI125720B (en) 2011-05-19 2016-01-29 Tecnomar Oy Roll-to-roll mass production method for electrical bridges
US8866689B2 (en) 2011-07-07 2014-10-21 Pulse Finland Oy Multi-band antenna and methods for long term evolution wireless system
US9450291B2 (en) 2011-07-25 2016-09-20 Pulse Finland Oy Multiband slot loop antenna apparatus and methods
US9111166B2 (en) 2011-08-31 2015-08-18 Metrologic Instruments, Inc. Cluster computing of bar code data
US9123990B2 (en) 2011-10-07 2015-09-01 Pulse Finland Oy Multi-feed antenna apparatus and methods
US9531058B2 (en) 2011-12-20 2016-12-27 Pulse Finland Oy Loosely-coupled radio antenna apparatus and methods
US9484619B2 (en) 2011-12-21 2016-11-01 Pulse Finland Oy Switchable diversity antenna apparatus and methods
US9710745B1 (en) * 2012-02-09 2017-07-18 Dynamics Inc. Systems and methods for automated assembly of dynamic magnetic stripe communications devices
US8988296B2 (en) 2012-04-04 2015-03-24 Pulse Finland Oy Compact polarized antenna and methods
US9979078B2 (en) 2012-10-25 2018-05-22 Pulse Finland Oy Modular cell antenna apparatus and methods
US10069209B2 (en) 2012-11-06 2018-09-04 Pulse Finland Oy Capacitively coupled antenna apparatus and methods
US9647338B2 (en) 2013-03-11 2017-05-09 Pulse Finland Oy Coupled antenna structure and methods
US10079428B2 (en) 2013-03-11 2018-09-18 Pulse Finland Oy Coupled antenna structure and methods
US9634383B2 (en) 2013-06-26 2017-04-25 Pulse Finland Oy Galvanically separated non-interacting antenna sector apparatus and methods
WO2015066462A1 (en) * 2013-11-01 2015-05-07 Ppg Industries Ohio, Inc. Methods of transferring electrically conductive materials
US9680212B2 (en) 2013-11-20 2017-06-13 Pulse Finland Oy Capacitive grounding methods and apparatus for mobile devices
US9590308B2 (en) 2013-12-03 2017-03-07 Pulse Electronics, Inc. Reduced surface area antenna apparatus and mobile communications devices incorporating the same
US9350081B2 (en) 2014-01-14 2016-05-24 Pulse Finland Oy Switchable multi-radiator high band antenna apparatus
US9948002B2 (en) 2014-08-26 2018-04-17 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9973228B2 (en) 2014-08-26 2018-05-15 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9722308B2 (en) 2014-08-28 2017-08-01 Pulse Finland Oy Low passive intermodulation distributed antenna system for multiple-input multiple-output systems and methods of use
US9906260B2 (en) 2015-07-30 2018-02-27 Pulse Finland Oy Sensor-based closed loop antenna swapping apparatus and methods
EP3275794B1 (en) * 2016-07-27 2019-09-04 Philip Morris Products S.a.s. Improved container of consumer articles comprising an element of discernible thickness
GB2554952A (en) * 2016-10-17 2018-04-18 Parkside Flexibles Europe Ltd Electronic identifier for packaging
WO2019029816A1 (en) 2017-08-10 2019-02-14 Philip Morris Products S.A. Improved container of consumer articles comprising an element of discernible thickness

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1292380A (en) * 1969-04-02 1972-10-11 Unisearch Ltd Electronic surveillance systems
US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
DE2657182A1 (en) * 1976-12-17 1978-06-22 Martin Georg An apparatus for identifying an information-
DE3051195C2 (en) * 1980-08-05 1997-08-28 Gao Ges Automation Org Package for integrated circuit incorporated in identity cards
DE3122981C2 (en) * 1981-06-10 1989-08-31 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
DE3143915C2 (en) * 1981-11-05 1987-12-03 Brown, Boveri & Cie Ag, 6800 Mannheim, De
US4546357A (en) * 1983-04-11 1985-10-08 The Singer Company Furniture antenna system
FR2548409B1 (en) * 1983-06-29 1985-11-15 Sligos Method for manufacturing memory cards, memory cards and installation obtained
GB8420893D0 (en) * 1984-08-16 1984-09-19 Buttemer D A Transponder
JPS61147593A (en) * 1984-12-20 1986-07-05 Shinto Paint Co Ltd Flexible circuit board with conducting adhesive layer and manufacture thereof
JPS61182302A (en) * 1985-02-07 1986-08-15 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit
US4783646A (en) * 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
JPH074995B2 (en) * 1986-05-20 1995-01-25 株式会社東芝 Ic mosquitoes - de and a method of manufacturing the same
US4720690A (en) * 1986-07-14 1988-01-19 Harris Corporation Sculptured stripline interface conductor
JPS6386320A (en) * 1986-09-30 1988-04-16 Sumitomo Bakelite Co Double-side metal lined dielectric substrate for planar antenna
EP0268089B1 (en) * 1986-10-22 1991-08-28 Eta SA Fabriques d'Ebauches Passive transponder
JP2538587B2 (en) * 1987-03-23 1996-09-25 富士通テン 株式会社 Automobile tower mounting for a spin - mosquito -1 body shape antenna manufacturing method of
US4916808A (en) * 1988-02-22 1990-04-17 Harris Corporation Process for fabricating a sculptured stripling interface conductor
AU626013B2 (en) * 1988-07-04 1992-07-23 Sony Corporation A thin electronic device having an integrated circuit chip and a power battery and a method for producing same
JPH02214205A (en) * 1989-02-14 1990-08-27 Fujitsu Ltd Electronic circuit device
FR2650530B1 (en) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Process for the card body with graphic realization
EP0436497A3 (en) * 1990-01-05 1993-03-24 Trend Plastics, Inc. Gaming chip with implanted programmable identifier means and process for fabricating same
FR2664076A1 (en) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Method for manufacturing electronic memory card
SE465391B (en) * 1990-07-24 1991-09-02 Staffan Gunnarsson A device in vehicles Foer positionsangivning the automatic refueling
JPH04252523A (en) * 1991-01-28 1992-09-08 Mitsubishi Electric Corp Mobile radio equipment
DE4105869C2 (en) * 1991-02-25 2000-05-18 Edgar Schneider IC card and processes for their preparation
US5272596A (en) * 1991-06-24 1993-12-21 At&T Bell Laboratories Personal data card fabricated from a polymer thick-film circuit
JP2611582B2 (en) * 1991-09-09 1997-05-21 三菱電機株式会社 Electronic circuit integral planar antenna
JP3036171B2 (en) * 1991-11-08 2000-04-24 ソニー株式会社 Planar antenna
JP2601128B2 (en) * 1992-05-06 1997-04-16 松下電器産業株式会社 Manufacturing method and a circuit forming board of the circuit-forming board

Also Published As

Publication number Publication date
JPH0722831A (en) 1995-01-24
EP0615285A3 (en) 1996-09-18
US5566441A (en) 1996-10-22
SG63620A1 (en) 1999-03-30
EP0615285A2 (en) 1994-09-14

Similar Documents

Publication Publication Date Title
GB2236910B (en) A housing for electronic circuitry
GB2279512B (en) Electrical terminal pin for surface mounting on a substrate
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
AU636459B2 (en) Connector assembly for printed circuit boards
GB2308243B (en) Substrate for mounting an electronic component
AU587976B2 (en) A box-like electronic printed circuit board module
AU5524798A (en) A clock recovery circuit
IL109242D0 (en) Annular circuit components coupled with printed circuit board through-hole
AU7623091A (en) Electronic spreadsheet
AU6556394A (en) Annular circuit components coupled with printed circuit board through-hole
IL96558D0 (en) Printed circuit antenna
GR3022737T3 (en) Component of printed circuit boards.
AU3095592A (en) Electronic notepad
AU2359592A (en) Electronic direction finder
EP0242626A3 (en) Method for mounting electronic components on a substrate
AU2246392A (en) Electronic direction finder
EP0529350A3 (en) Electrical connector for mounting on a printed circuit board
GB9603621D0 (en) Electronic circuit board enclosure
EP0512543A3 (en) Electronic tag
EP0564955A3 (en) Edge connector for a printed circuit board
AU3492395A (en) Printed circuit board inductor
EP0244699A3 (en) Substrate for a printed circuit board
GB9425031D0 (en) Printed circuit board manufacture
JPS62272597A (en) Electronic circuit case
EP0545328A3 (en) Printed circuit board manufacturing process