ZA200109817B - Adhesive composition comprising thermoexpandable microcapsules. - Google Patents

Adhesive composition comprising thermoexpandable microcapsules.

Info

Publication number
ZA200109817B
ZA200109817B ZA200109817A ZA200109817A ZA200109817B ZA 200109817 B ZA200109817 B ZA 200109817B ZA 200109817 A ZA200109817 A ZA 200109817A ZA 200109817 A ZA200109817 A ZA 200109817A ZA 200109817 B ZA200109817 B ZA 200109817B
Authority
ZA
South Africa
Prior art keywords
microcapsules
adhesive composition
thermoexpandable
thermoexpandable microcapsules
adhesive
Prior art date
Application number
ZA200109817A
Other languages
English (en)
Inventor
Peter Stewart Bain
Giovanni Manfre
Original Assignee
Peter Stewart Bain
Giovanni Manfre
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10854522&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA200109817(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Peter Stewart Bain, Giovanni Manfre filed Critical Peter Stewart Bain
Publication of ZA200109817B publication Critical patent/ZA200109817B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Materials For Medical Uses (AREA)
ZA200109817A 1999-06-02 2001-11-29 Adhesive composition comprising thermoexpandable microcapsules. ZA200109817B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive

Publications (1)

Publication Number Publication Date
ZA200109817B true ZA200109817B (en) 2002-03-27

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200109817A ZA200109817B (en) 1999-06-02 2001-11-29 Adhesive composition comprising thermoexpandable microcapsules.

Country Status (20)

Country Link
EP (1) EP1185594B2 (ru)
JP (1) JP2003501544A (ru)
KR (1) KR100696436B1 (ru)
CN (1) CN1192070C (ru)
AT (1) ATE292168T1 (ru)
AU (1) AU4940200A (ru)
BR (1) BR0011128B1 (ru)
CZ (1) CZ20014260A3 (ru)
DE (1) DE60019109T3 (ru)
ES (1) ES2239007T5 (ru)
GB (2) GB9912694D0 (ru)
HK (1) HK1047446B (ru)
HU (1) HUP0202982A2 (ru)
MX (1) MXPA01012504A (ru)
PL (1) PL352210A1 (ru)
PT (1) PT1185594E (ru)
RU (1) RU2265636C2 (ru)
TR (1) TR200103487T2 (ru)
WO (1) WO2000075254A1 (ru)
ZA (1) ZA200109817B (ru)

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* Cited by examiner, † Cited by third party
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US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
US7901532B2 (en) 2003-04-01 2011-03-08 De-Bonding Limited Method and apparatus for bonding and debonding adhesive interface surfaces
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
RU2466019C2 (ru) * 2007-02-28 2012-11-10 Басф Се Способ получения композитных элементов на основе пенопластов на основе изоцианатов
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
JP5599391B2 (ja) * 2008-06-27 2014-10-01 グラベーテ アクチエンゲゼルシャフト 固定剤及び基材上に物品を固定する方法
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
EP2367619B1 (en) 2008-12-17 2017-04-05 Dow Corning Corporation Suspensions of silicate shell microcapsules for temperature controlled release
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR20180063959A (ko) 2016-12-02 2018-06-14 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
EP4222189A1 (en) 2020-09-30 2023-08-09 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres
EP4316854A1 (en) 2021-03-31 2024-02-07 DNP Fine Chemicals Co., Ltd. Nonaqueous ink composition, ink set, recording method using same, method for producing recorded matter, recorded matter, and inkjet recording device
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

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JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
ES2010290A6 (es) * 1987-06-12 1989-11-01 Teroson Gmbh Procedimiento y aparato para el curado por lo menos parcial de sellantes y adhesivos.
JP3057236B2 (ja) * 1990-07-01 2000-06-26 株式会社アルファ技研 ２―シアノアクリレート系組成物
JPH04292684A (ja) * 1991-03-19 1992-10-16 Asahi Corp 膨脹シーリング材
ES2093236T3 (es) * 1991-07-03 1996-12-16 Gurit Essex Ag Uniones adhesivas separables, procedimiento para su fabricacion y la utilizacion de dispositivos para separar tales uniones adhesivas.
JP2970963B2 (ja) † 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JP3405576B2 (ja) * 1993-11-12 2003-05-12 ダイセル化学工業株式会社 熱剥離性フィルム及び剥離方法
IT1269293B (it) * 1994-03-07 1997-03-26 Ppg Ind Italia S R L Composizione di adesivo per il riempimento di parti scatolate di scocche di veicoli
ES2146284T3 (es) * 1994-12-15 2000-08-01 Saint Gobain Performance Plast Adhesivo esponjoso sensible a la presion.
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JP3810911B2 (ja) * 1997-12-01 2006-08-16 日東電工株式会社 加熱剥離型粘着シート
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JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
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Also Published As

Publication number Publication date
CN1192070C (zh) 2005-03-09
EP1185594A1 (en) 2002-03-13
BR0011128A (pt) 2002-02-26
KR100696436B1 (ko) 2007-03-19
HK1047446A1 (en) 2003-02-21
KR20020034085A (ko) 2002-05-08
RU2265636C2 (ru) 2005-12-10
HUP0202982A2 (en) 2002-12-28
HK1047446B (zh) 2005-09-23
DE60019109T3 (de) 2010-01-14
DE60019109D1 (de) 2005-05-04
ES2239007T5 (es) 2009-06-02
GB9912694D0 (en) 1999-08-04
DE60019109T2 (de) 2006-02-02
EP1185594B1 (en) 2005-03-30
PL352210A1 (en) 2003-08-11
TR200103487T2 (tr) 2002-04-22
CN1354774A (zh) 2002-06-19
MXPA01012504A (es) 2003-10-14
AU4940200A (en) 2000-12-28
GB2365431A (en) 2002-02-20
ES2239007T3 (es) 2005-09-16
BR0011128B1 (pt) 2011-07-12
PT1185594E (pt) 2005-07-29
JP2003501544A (ja) 2003-01-14
GB0127411D0 (en) 2002-01-09
EP1185594B2 (en) 2009-02-25
WO2000075254A1 (en) 2000-12-14
CZ20014260A3 (cs) 2002-04-17
GB2365431B (en) 2003-12-17
ATE292168T1 (de) 2005-04-15

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