YU37241B - Programming matrix - Google Patents
Programming matrixInfo
- Publication number
- YU37241B YU37241B YU66477A YU66477A YU37241B YU 37241 B YU37241 B YU 37241B YU 66477 A YU66477 A YU 66477A YU 66477 A YU66477 A YU 66477A YU 37241 B YU37241 B YU 37241B
- Authority
- YU
- Yugoslavia
- Prior art keywords
- programming matrix
- programming
- matrix
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
- H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
YU66477A YU37241B (en) | 1977-03-14 | 1977-03-14 | Programming matrix |
DE19782809841 DE2809841A1 (en) | 1977-03-14 | 1978-03-07 | Programmable matrix system with metal plugs - has diodes plugging into split metallised holes to connect orthogonal conductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
YU66477A YU37241B (en) | 1977-03-14 | 1977-03-14 | Programming matrix |
Publications (2)
Publication Number | Publication Date |
---|---|
YU66477A YU66477A (en) | 1983-04-27 |
YU37241B true YU37241B (en) | 1984-08-31 |
Family
ID=25550908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
YU66477A YU37241B (en) | 1977-03-14 | 1977-03-14 | Programming matrix |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE2809841A1 (en) |
YU (1) | YU37241B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4799128A (en) * | 1985-12-20 | 1989-01-17 | Ncr Corporation | Multilayer printed circuit board with domain partitioning |
WO2001099480A2 (en) * | 2000-06-19 | 2001-12-27 | 3M Innovative Properties Company | Printed circuit board having inductive vias |
CN100399866C (en) * | 2004-08-11 | 2008-07-02 | 日月光半导体制造股份有限公司 | Circuit base board |
-
1977
- 1977-03-14 YU YU66477A patent/YU37241B/en unknown
-
1978
- 1978-03-07 DE DE19782809841 patent/DE2809841A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE2809841A1 (en) | 1978-09-21 |
YU66477A (en) | 1983-04-27 |
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