WO2026067412A1 - Endoscope host and endoscope system - Google Patents

Abstract

Provided are an endoscope host and an endoscope system. The endoscope host comprises a main board (60), a heat dissipation support (10), a heat conduction member (20), heat dissipation fins (40), and a fan (30). The main board (60) is provided with a heat-generating device (61). The heat dissipation support (10) is disposed on the main board (60) and is in contact with the heat-generating device (61) in a fitted manner. The heat conduction member (20) is disposed on the heat dissipation support (10). The heat dissipation fins (40) are disposed on the heat dissipation support (10) and are in contact with the heat conduction member (20) in a fitted manner. The fan (30) is disposed on the heat dissipation support (10), and an air outlet side of the fan (30) faces the heat dissipation fins (40). The endoscope host and the endoscope system utilize the heat conduction member (20) to accelerate the heat transfer efficiency between the heat dissipation support (10) and the heat dissipation fins (40), thereby avoiding the problem of low heat transfer efficiency caused by incomplete contact between the heat dissipation support (10) and the heat dissipation fins (40). Moreover, the heat dissipation fins (40) are utilized to increase the heat dissipation area, thereby improving the heat dissipation efficiency; the fan (30) is utilized to accelerate the air circulation in the heat dissipation fins (40), such that the heat of the heat dissipation fins (40) can be quickly discharged, thereby further improving the heat dissipation efficiency.

Description

Endoscope main unit and endoscope system Technical Field

This application relates to the field of endoscope technology, and in particular to an endoscope host.

Background Technology

An endoscope system is a commonly used medical device. When in use, the endoscope is inserted into the patient's body through natural orifices or surgical incisions. After the endoscope is inserted into the organ to be examined, the doctor can directly view images of lesions in the relevant area on the main unit's display screen, thereby making a medical diagnosis.

The chip inside the endoscope's main unit needs to process a large amount of image information in real time, resulting in a massive computational load. Consequently, the chip generates a significant amount of heat during operation, causing the temperature inside the endoscope to rise and affecting the normal operation of the chip itself and surrounding electronic components. Therefore, a heat dissipation system is typically designed to address the chip's heat generation. However, current heat dissipation systems for the chip are often inefficient, failing to dissipate heat from the endoscope in a timely manner, thus impacting the operational stability of the chip and surrounding electronic components.

Summary of the Invention

Therefore, it is necessary to provide an endoscope host and endoscope system to improve heat dissipation efficiency.

On one hand, this application provides an endoscope host, comprising:

A motherboard, wherein a heat-generating device is provided;

A heat sink bracket is mounted on the motherboard and fits snugly against the heat-generating device.

A heat-conducting component, wherein the heat-conducting component is disposed on the heat dissipation bracket;

Heat dissipation fins, wherein the heat dissipation fins are disposed on the heat dissipation bracket and are in close contact with the heat-conducting component; and

A fan is mounted on the heat sink bracket and the fan's exhaust side faces the heat sink fins.

The technical solution will be further explained below:

In one embodiment, the endoscope host further includes a shield, the shield having a first air inlet and a first air outlet, the first air inlet and the first air outlet being located on different surfaces of the shield, the motherboard, the heat dissipation bracket, the heat conduction component and the fan being located in the shield, the fan having its air inlet side facing the first air inlet and its air outlet side facing the first air outlet.

In one embodiment, the shielding cover includes an upper housing and a lower housing disposed opposite to each other along the height direction of the endoscope host, the main board is disposed in the lower housing, the first air inlet is disposed in the upper housing, and the first air outlet is located between the upper housing and the lower housing.

In one embodiment, the fan includes a shroud and a centrifugal impeller disposed within the shroud. The shroud has a second air inlet on the axial side corresponding to the centrifugal impeller to form the air inlet side, and a second air outlet on the circumferential side corresponding to the centrifugal impeller to form the air outlet side. The second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fins and the first air outlet.

In one embodiment, the heat dissipation fin has an air inlet end and an air outlet end, an air duct is formed inside the heat dissipation fin, the air duct passes through the air inlet end and the air outlet end, the air inlet end is connected to the air outlet side of the fan, and the air outlet end extends out of the shielding cover from the first air outlet.

In one embodiment, the heat dissipation bracket includes a heat absorption area attached to the heat-generating device and a heat dissipation area extending out of the heat-generating device, the heat-conducting element extends from the heat absorption area to the heat dissipation area, the fan is disposed in the heat absorption area, and the heat dissipation fins are disposed in the heat dissipation area.

In one embodiment, the number of heat-conducting elements is multiple, and the multiple heat-conducting elements are arranged at intervals on the heat dissipation bracket.

In one embodiment, the spacing between the heat-conducting elements in the heat dissipation zone is greater than the spacing between the heat-conducting elements in the heat absorption zone.

In one embodiment, the heat dissipation bracket has a groove on the side away from the heat-generating device, the heat-conducting element is disposed in the groove, and the surface of the heat-conducting element on the side away from the heat-generating device is flush with the surface of the heat dissipation bracket on the side away from the heat-generating device.

In one embodiment, the heat-conducting element is a heat pipe.

On the other hand, this application also provides an endoscope system, including the aforementioned endoscope host.

In the aforementioned endoscope host and system, a heatsink bracket is mounted on the motherboard, with the heat-generating components of the bracket in close contact. A heat-conducting component, heat sink fins, and a fan are then mounted on the heatsink bracket, with the heat sink fins in close contact with the heat-conducting component and the fan's exhaust side facing the heat sink fins. During operation, the heat generated by the heat-generating components is transferred through the heatsink bracket to the heat-conducting component, then from the heat-conducting component to the heat sink fins. The fan's exhaust side blows air onto the heat sink fins, carrying the heat away from the endoscope host, thus achieving heat dissipation. The use of the heat-conducting component accelerates the heat transfer efficiency between the heatsink bracket and the heat sink fins, avoiding the low heat transfer efficiency caused by incomplete contact between the bracket and fins. Simultaneously, the heat sink fins increase the heat dissipation area, improving efficiency, and the fan accelerates airflow within the fins, allowing heat to be quickly dissipated, further enhancing cooling efficiency.

Attached Figure Description

The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the various components are shown as examples only and not necessarily to scale. In the accompanying drawings:

Figure 1 is a schematic diagram of the structure of an endoscope host according to an embodiment.

Figure 2 is an exploded view of the endoscope main unit shown in Figure 1.

Figure 3 is a schematic diagram of the endoscope main unit shown in Figure 1 after the upper housing is hidden, from another perspective.

Explanation of reference numerals in the attached figures

10. Heat sink bracket; 11. Groove; 20. Heat-conducting component; 30. Fan; 31. Fan cover; 311. Second air inlet; 312. Second air outlet; 40. Heat sink fins; 42. Air duct; 421. Air inlet end; 422. Air outlet end; 50. Shielding cover; 51. Upper shell; 52. Lower shell; 53. First air inlet; 54. First air outlet; 60. Motherboard; 61. Heat-generating component.

Detailed Implementation

To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

As mentioned earlier, the current heat dissipation system for the chip in endoscope mainframes has poor heat dissipation efficiency, failing to dissipate heat from within the endoscope mainframe in a timely manner, thus affecting the operational stability of the chip itself and surrounding electronic components. Specifically, in traditional endoscope mainframes, the heat dissipation system typically includes a stacked heat sink support, heat sink fins, and a cooling fan. The heat sink support is mounted on the chip, and the heat sink fins are installed on the heat sink support using screws, etc. However, considering the structure of the heat sink fins themselves and the spatial layout within the endoscope mainframe, the heat sink fins cannot be completely fitted to the heat sink support, resulting in low heat conduction efficiency between the heat sink and the heat sink support. At the same time, because the shielding cover of the endoscope mainframe is relatively closed, the convection of hot air within the shielding cover is not smooth, making it difficult for heat to dissipate, resulting in insufficient heat dissipation.

Based on this, one embodiment of this application provides an endoscope host. Specifically, referring to Figures 1 to 3, the endoscope host of one embodiment includes a motherboard 60, a heat dissipation bracket 10, a heat-conducting component 20, a heat dissipation fin 40, and a fan 30. The motherboard 60 is provided with a heat-generating device 61. Exemplarily, the heat-generating device 61 can be a chip or other electronic device that generates heat during operation. The heat dissipation bracket 10 is disposed on the motherboard 60 and is in close contact with the heat-generating device 61. The heat-conducting component 20 is disposed on the heat dissipation bracket 10. The heat dissipation fin 40 is disposed on the heat dissipation bracket 10 and is in close contact with the heat-conducting component 20. The fan 30 is disposed on the heat dissipation bracket 10, and the exhaust side of the fan 30 faces the heat dissipation fin 40.

In the aforementioned endoscope host, a heat dissipation bracket 10 is mounted on the motherboard 60 and fitted snugly against the heat-generating device 61. A heat-conducting component 20, heat dissipation fins 40, and a fan 30 are then mounted on the heat dissipation bracket 10, with the heat dissipation fins 40 fitted snugly against the heat-conducting component 20, and the exhaust side of the fan 30 facing the heat dissipation fins 40. Thus, during operation, the heat generated by the heat-generating device 61 is transferred through the heat dissipation bracket 10 to the heat-conducting component 20, and then from the heat-conducting component 20 to the heat dissipation fins 40. The exhaust side of the fan 30 then blows air towards the heat dissipation fins 40, using the airflow to carry the heat away from the endoscope host, achieving heat dissipation. The placement of the heat-conducting component 20 significantly accelerates the heat transfer efficiency between the heat dissipation bracket 10 and the heat dissipation fins 40, avoiding the problem of low heat transfer efficiency caused by incomplete contact between the heat dissipation bracket 10 and the heat dissipation fins 40. Meanwhile, the heat dissipation fins 40 greatly increase the heat dissipation area and improve heat dissipation efficiency, while the fan 30 accelerates the airflow within the heat dissipation fins 40, allowing the heat from the heat dissipation fins 40 to be dissipated quickly, further improving heat dissipation efficiency.

Referring to Figure 1, optionally, in one embodiment, the endoscope host also includes a shielding cover 50. The shielding cover 50 can provide waterproof and dustproof protection for the electronic components inside the endoscope host, and also serves as electromagnetic shielding. Specifically, the shielding cover 50 has a first air inlet 53 and a first air outlet 54, and the first air inlet 53 and the first air outlet 54 are located on different surfaces of the shielding cover 50. The motherboard 60, heat sink bracket 10, heat conduction component 20, and fan 30 are all located in the shielding cover 50, with the air inlet side of the fan 30 facing the first air inlet 53 and the air outlet side of the fan 30 facing the first air outlet 54. In this way, during operation, cold air from the outside can enter the shielding cover 50 from the first air inlet 53 driven by the fan 30, carry away the heat from the heat sink 40 after flowing through it, and finally be discharged from the first air outlet 54, ensuring smooth airflow inside and outside the shielding cover 50, thereby improving heat dissipation efficiency. Meanwhile, since the first air inlet 53 and the first air outlet 54 are located on different surfaces of the shielding cover 50, the first air inlet 53 and the first air outlet 54 can be separated, preventing the mixing of hot and cold air and further improving the heat dissipation efficiency.

Referring to Figure 2, optionally, in one embodiment, the shielding cover 50 includes an upper housing 51 and a lower housing 52 disposed opposite each other along the height direction of the endoscope host. The main board 60 is disposed in the lower housing 52, the first air inlet 53 is disposed in the upper housing 51, and the first air outlet 54 is located between the upper housing 51 and the lower housing 52. That is, the first air inlet 53 is opened on the top surface of the shielding cover 50, and the first air outlet 54 is opened on the side of the shielding cover 50. This ensures that the air inlet direction and the air outlet direction of the shielding cover 50 are different and separated by a certain distance, further avoiding the mixing of hot and cold air, thereby improving heat dissipation efficiency.

Referring to Figure 3, in one embodiment, the fan 30 includes a shroud 31 and a centrifugal impeller (not shown) disposed within the shroud 31. The shroud 31 has a second air inlet 311 on the axial side corresponding to the centrifugal impeller to form an air intake side, and a second air outlet 312 on the circumferential side corresponding to the centrifugal impeller to form an air outlet side. The second air inlet 311 of the shroud 31 faces the first air inlet 53 of the shield 50, and the second air outlet 312 of the shroud 31 faces the heat dissipation fins 40 and the first air outlet 54 of the shield 50. In this embodiment, the fan 30 is an axially inlet and radially outlet centrifugal fan. Compared to the axially inlet and axially outlet axial fans used in traditional cooling systems, the fan 30 of this application ensures that the inlet and outlet directions are perpendicular. This makes it more suitable for the shield 50, which has a first air inlet 53 on the top and a first air outlet 54 on the side. This ensures that the incoming cold air is separated from the outgoing hot air, preventing the mixing of hot and cold air and thus improving heat dissipation efficiency. Furthermore, when using the centrifugal fan 30, the heat dissipation fins 40 can be disposed on the outer periphery of the fan 30, eliminating the need for the fan 30 and heat dissipation fins 40 to be stacked. This reduces the space occupied by the combination of the fan 30 and heat dissipation fins 40 in the height direction, thereby reducing the overall height of the endoscope host.

Referring to Figure 3, optionally, in one embodiment, the heat dissipation fin 40 has an air inlet end 421 and an air outlet end 422, and an air duct 42 is formed within the heat dissipation fin 40, extending through the air inlet end 421 and the air outlet end 422. Exemplarily, the heat dissipation fin 40 includes an outer cover with openings at both ends, and multiple fins are spaced apart within the outer cover, forming an air duct 42 between adjacent fins. Further, the air inlet end 421 is connected to the air outlet side of the fan 30, and the air outlet end 422 extends out of the shielding cover 50 from the first air outlet 54. Exemplarily, the opening of the air inlet end 421 of the heat dissipation fin 40 is aligned with the second air outlet 312 of the fan 30, and the opening of the air outlet end 422 of the heat dissipation fin 40 is located outside the shielding cover 50. In this way, the fan 30 sends cold air into the air duct 42 of the heat dissipation fin 40 through the opening of the air inlet 421 of the heat dissipation fin 40. The cold air exchanges heat with the fins in the air duct 42 to form hot air. The hot air is then directly discharged to the outside of the shield 50 through the opening of the air outlet 422 of the hot fin, preventing the hot air from flowing back into the shield 50, thereby further improving the heat dissipation effect.

Referring to Figure 3, optionally, in one embodiment, the heat dissipation bracket 10 includes a heat absorption area attached to the heat-generating device 61 and a heat dissipation area extending from the heat-generating device 61. A heat-conducting element 20 extends from the heat absorption area to the heat dissipation area. A fan 30 is disposed in the heat absorption area, and heat dissipation fins 40 are disposed in the heat dissipation area. Thus, the heat-conducting element 20 can exchange heat with the heat-generating device 61 in the heat absorption area, and then transfer the heat to the heat dissipation area for heat exchange with the heat dissipation fins 40. Furthermore, the fan 30, positioned in the heat absorption area, not only dissipates heat from the heat dissipation fins 40 in the adjacent heat dissipation area but also provides some heat dissipation for the heat-conducting element 20 in the heat absorption area, thereby further improving heat dissipation efficiency.

Referring again to Figure 3, there are multiple heat-conducting components 20, which are arranged at intervals on the heat dissipation bracket 10. For example, the number of heat-conducting components 20 can be two, three, four or more, etc., and there is no limitation here.

Furthermore, the spacing between the heat-conducting components 20 in the heat dissipation area is greater than the spacing between them in the heat absorption area. For example, the portions of each heat-conducting component 20 in the heat dissipation area are close to each other and arranged parallel to each other, resulting in a denser arrangement of the heat-conducting components 20 in the heat dissipation area. Conversely, the portions of each heat-conducting component 20 in the heat dissipation area are bent in different directions, resulting in a sparser arrangement of the heat-conducting components 20 in the heat dissipation area. Thus, in the heat dissipation area, the dense arrangement of the heat-conducting components 20 allows for heat exchange with more heat-conducting components 20 within the lower heat-generating device 61, improving heat absorption efficiency. In the heat dissipation area, the sparse arrangement of the heat-conducting components 20 makes it easier for the heat from the heat-conducting components 20 to dissipate and transfer to the heat dissipation fins 40, thereby improving heat dissipation efficiency.

Referring to Figure 3, a groove 11 is formed on the side of the heat sink bracket 10 facing away from the heat-generating device 61. The heat-conducting element 20 is disposed in the groove 11, and the surface of the heat-conducting element 20 facing away from the heat-generating device 61 is flush with the surface of the heat sink bracket 10 facing away from the heat-generating device 61. This ensures that the surface of the heat sink bracket 10 facing away from the heat-generating device 61 is flat, facilitating the installation of the heat dissipation fins 40 and the fan 30. In addition, the surface of the heat-conducting element 20 is flush with the surface of the heat sink bracket 10, so that the heat dissipation fins 40 can be in contact with the heat-conducting element 20 and also with the heat sink bracket 10. Thus, the heat dissipation bracket 10 can also directly transfer heat to the heat dissipation fins 40, further improving the heat dissipation efficiency.

Optionally, in one embodiment, the heat-conducting element 20 is a heat pipe. A heat pipe is a heat transfer element that relies on the phase change of its internal working liquid to achieve heat transfer. Heat transfer within the heat pipe mainly relies on the vapor-liquid phase change of the working liquid, resulting in very low thermal resistance and therefore high thermal conductivity. Compared to metals such as silver, copper, and aluminum, a heat pipe per unit weight can transfer several orders of magnitude more heat, thereby significantly enhancing the heat transfer efficiency between the heat sink 10 and the heat sink fins 40, and thus improving heat dissipation efficiency.

Another embodiment of this application provides an endoscope system. Specifically, one embodiment of the endoscope system includes the aforementioned endoscope host. Further, the endoscope system also includes an endoscope body, which is electrically connected to the endoscope host.

In the aforementioned endoscope system, a heat dissipation bracket 10 is mounted on the motherboard 60 of the endoscope host, and the bracket 10 is fitted in close contact with the heat-generating device 61. A heat-conducting element 20, heat dissipation fins 40, and a fan 30 are then mounted on the heat dissipation bracket 10, with the heat dissipation fins 40 fitted in close contact with the heat-conducting element 20, and the exhaust side of the fan 30 facing the heat dissipation fins 40. Thus, during operation, the heat generated by the heat-generating device 61 is transferred through the heat dissipation bracket 10 to the heat-conducting element 20, and then from the heat-conducting element 20 to the heat dissipation fins 40. The exhaust side of the fan 30 then blows air towards the heat dissipation fins 40, using the airflow to carry the heat away from the endoscope host, achieving heat dissipation. The placement of the heat-conducting element 20 significantly accelerates the heat transfer efficiency between the heat dissipation bracket 10 and the heat dissipation fins 40, avoiding the problem of low heat transfer efficiency caused by incomplete contact between the heat dissipation bracket 10 and the heat dissipation fins 40. Meanwhile, the heat dissipation fins 40 greatly increase the heat dissipation area and improve heat dissipation efficiency, while the fan 30 accelerates the airflow within the heat dissipation fins 40, allowing the heat from the heat dissipation fins 40 to be dissipated quickly, further improving heat dissipation efficiency.

The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims (11)

An endoscope main unit, characterized in that it comprises: A motherboard, wherein a heat-generating device is provided; A heat sink bracket is mounted on the motherboard and fits snugly against the heat-generating device. A heat-conducting component, wherein the heat-conducting component is disposed on the heat dissipation bracket; Heat dissipation fins, wherein the heat dissipation fins are disposed on the heat dissipation bracket and are in close contact with the heat-conducting component; and A fan is mounted on the heat sink bracket and the fan's exhaust side faces the heat sink fins. According to claim 1, the endoscope host further includes a shielding cover, the shielding cover having a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively located on different surfaces of the shielding cover, the motherboard, the heat dissipation bracket, the heat conduction component and the fan are all located in the shielding cover, and the air inlet side of the fan faces the first air inlet, and the air outlet side of the fan faces the first air outlet. According to claim 2, the endoscope host is characterized in that the shielding cover includes an upper shell and a lower shell disposed opposite to each other along the height direction of the endoscope host, the main board is disposed in the lower shell, the first air inlet is disposed in the upper shell, and the first air outlet is located between the upper shell and the lower shell. According to claim 2, the endoscope host is characterized in that the fan includes a fan shroud and a centrifugal impeller disposed in the fan shroud, the fan shroud having a second air inlet on the axial side of the centrifugal impeller to form the air inlet side, and the fan shroud having a second air outlet on the circumferential side of the centrifugal impeller to form the air outlet side, wherein the second air inlet faces the first air inlet, and the second air outlet faces the heat dissipation fins and the first air outlet. According to claim 2, the endoscope host is characterized in that the heat dissipation fin has an air inlet end and an air outlet end, an air duct is formed in the heat dissipation fin, the air duct passes through the air inlet end and the air outlet end, the air inlet end is connected to the air outlet side of the fan, and the air outlet end extends out of the shielding cover from the first air outlet. According to claim 1, the endoscope host is characterized in that the heat dissipation bracket includes a heat absorption area attached to the heat-generating device and a heat dissipation area extending out of the heat-generating device, the heat-conducting element extends from the heat absorption area to the heat dissipation area, the fan is disposed in the heat absorption area, and the heat dissipation fins are disposed in the heat dissipation area. According to claim 6, the endoscope host is characterized in that the number of heat-conducting elements is multiple, and the multiple heat-conducting elements are arranged at intervals on the heat dissipation bracket. According to the endoscope host according to claim 7, the heat-conducting element is arranged at a greater interval in the heat dissipation zone than the heat-conducting element is arranged at a greater interval in the heat absorption zone. According to claim 6, the endoscope host is characterized in that a groove is provided on the side of the heat dissipation bracket away from the heating device, the heat conduction element is disposed in the groove, and the surface of the heat conduction element on the side away from the heating device is flush with the surface of the heat dissipation bracket on the side away from the heating device. The endoscope host according to any one of claims 1-9 is characterized in that the heat-conducting component is a heat pipe. An endoscope system, characterized in that it comprises an endoscope host as described in any one of claims 1-10.