WO2026066969A1 - Power-module heat dissipation structure and on-board charger using same - Google Patents

Abstract

Provided in the present invention are a power-module heat dissipation structure and an on-board charger using same. The power-module heat dissipation structure comprises: a water channel base, which is connected to a housing of an on-board charger; a first three-dimensional water channel and a second three-dimensional water channel, which are spaced apart on the water channel base; an intermediate water channel, which is connected between the first three-dimensional water channel and the second three-dimensional water channel, wherein the water channel base, the first three-dimensional water channel, the intermediate water channel and the second three-dimensional water channel form a heat dissipation accommodating cavity by means of enclosing; at least one magnetic device, which is mounted in the heat dissipation accommodating cavity; and at least one power module, which is mounted on an outer wall of the first three-dimensional water channel and/or the second three-dimensional water channel. The power-module heat dissipation structure provided in the present invention has compact layout, thereby saving on the space in the housing for mounting the power module, the magnetic device and the water channels. The circuit connection layout between the power module and the magnetic device is simplified, thereby realizing the quick assembly of the charger and facilitating the assembly, disassembly and maintenance of the power module and the magnetic device. The magnetic device in the heat dissipation accommodating cavity and the power module on the outer wall of the water channel are respectively cooled by means of the three-dimensional water channels, thereby ensuring a heat dissipation effect.

Description

A power module heat dissipation structure and an on-board charger using the same. Technical Field

This invention relates to the field of on-board charger technology, and particularly to a power module heat dissipation structure and an on-board charger using the same.

Background Technology

An on-board charger (OBC) is a charger installed on an electric vehicle. As an important component of the vehicle's charging system, it rectifies AC power into DC power to charge the battery and converts the DC power output from the battery back into AC power for use by external electrical appliances. With the continuous increase in battery capacity and charging power, higher requirements are placed on the heat dissipation performance of the various unit modules inside the on-board charger.

Currently, the integrated heat dissipation solutions for power devices and other functional modules in on-board chargers (OBCs) typically involve directly distributing discrete power devices and magnetic components across an aluminum substrate on the surface of a three-dimensional cooling channel. This heat dissipation structure is bulky, requiring the power devices, magnetic components, and cooling channel to occupy a significant amount of space within the OBC housing. This reduces the space available for installing other functional modules, impacting overall performance. Furthermore, the discrete power and magnetic components result in complex circuit design and connection layouts, leading to complex assembly processes and reduced production efficiency for the on-board charger. Additionally, the discrete power devices are inconvenient to disassemble, maintain, upgrade, and update.

Summary of the Invention

This invention proposes a power module heat dissipation structure and an on-board charger using the same, in order to solve the technical problem that the power devices and magnetic devices of existing on-board chargers are separated on the surface of a three-dimensional water channel through an aluminum substrate, resulting in a large amount of space occupied in the vehicle.

To solve the above problems, the technical solution adopted by the present invention is as follows:

This invention provides a power module heat dissipation structure, comprising:

The waterway base is connected to the housing of the on-board charger;

The first and second three-dimensional waterways are spaced apart on the waterway base;

The intermediate waterway connects the first three-dimensional waterway and the second three-dimensional waterway;

A heat dissipation cavity is formed between the water channel base, the first three-dimensional water channel, the middle water channel, and the second three-dimensional water channel.

At least one magnetic component is mounted in a heat dissipation cavity;

At least one power module is installed on the outer wall of the first three-dimensional waterway and/or the second three-dimensional waterway.

Furthermore, the power module heat dissipation structure also includes:

Device locking bar, including:

The locking base is securely connected to the housing to match the power module;

The elastic pressure strip is installed on the locking base and presses the corresponding power module against the outer wall of the first or second three-dimensional water channel.

Preferably, the outer side wall and/or top wall of the first and second three-dimensional water channels are provided with at least one mounting hole, and the power module is provided with a connection hole that matches the mounting hole;

The power module is connected to the outer wall and/or top wall of the first or second three-dimensional water channel via connectors passing through corresponding connection holes and mounting holes.

Preferably, the power module is connected to the outer wall and/or top wall of the first or second three-dimensional water channel through a heat-conducting structural layer.

Preferably, the power module is connected to the outer wall and/or top wall of the first or second three-dimensional water channel through a thermal interface material layer.

Preferably, the thermally conductive structural layer is a thermosetting adhesive layer or a solder layer.

Furthermore, the power module heat dissipation structure also includes:

The water inlet is located at the end of the first three-dimensional waterway away from the middle waterway and is connected to the internal flow channel of the first three-dimensional waterway;

The outlet is located at the end of the second three-dimensional waterway away from the middle waterway and is connected to the internal flow channel of the second three-dimensional waterway.

Preferably, both the first and second three-dimensional water channels are rectangular parallelepipeds. The inlet is located on the top, side, end, or bottom surface of the first three-dimensional water channel away from the middle water channel, and the outlet is located on the top, side, end, or bottom surface of the second three-dimensional water channel away from the middle water channel.

Preferably, the first three-dimensional waterway includes:

The main body of the first waterway is located on the waterway base;

The first waterway cover plate is installed on the outer side or bottom surface of the first waterway body facing away from the second three-dimensional waterway.

The second three-dimensional waterway includes:

The second waterway body is arranged parallel and spaced apart from the first waterway body on the waterway base;

The second waterway cover plate is installed on the outer side or bottom surface of the second waterway body facing away from the first three-dimensional waterway.

Preferably, the outer side of the first waterway body facing away from the second three-dimensional waterway is provided with a first flow channel groove, one end of the first flow channel groove is connected to the water inlet, and the other end of the first flow channel groove is connected to the internal flow channel of the middle waterway.

The first waterway cover plate is installed on the outer side of the first waterway body and closes the first flow channel groove. Multiple heat dissipation fins are arranged at intervals on the side of the first waterway cover plate facing the first flow channel groove.

The outer side of the second waterway body is provided with a second flow channel groove. One end of the second flow channel groove is connected to the water outlet, and the other end of the second flow channel groove is connected to the internal flow channel of the middle waterway.

The second waterway cover plate is installed on the outer side of the second waterway body and closes the second flow channel groove. Multiple heat dissipation fins are arranged at intervals on the side of the second waterway cover plate facing the second flow channel groove.

Preferably, the heat dissipation fins are toothed fins, rectangular fins, or circular fins.

Preferably, the two sets of power modules are respectively installed at intervals on the outer walls of the first three-dimensional water channel and the second three-dimensional water channel, and the power modules are single-PIN devices and/or double-PIN devices.

The present invention also provides an on-board charger, including a housing and the aforementioned power module heat dissipation structure.

Compared with the prior art, the present invention has the following beneficial effects:

The power module heat dissipation structure provided by this invention can be directly installed inside the housing of the on-board charger. A heat dissipation cavity for accommodating magnetic components is designed in the middle area of the three-dimensional water channels on both sides of the water channel base. The power module is then detachably and quickly installed on the outer wall surface of the two-dimensional water channels using various methods. The corresponding pins of the magnetic components and the power module are then soldered to a circuit board installed inside the charger housing and located above the power module heat dissipation structure. This power module heat dissipation structure has a compact layout and small size, saving space within the OBC housing used for installing the power module, magnetic components, and three-dimensional water channels, and increasing space for installing other functional modules to improve overall performance. Furthermore, this power module heat dissipation structure simplifies the circuit design and connection layout of the power module and magnetic components, enabling rapid assembly of the on-board charger, improving production efficiency, and facilitating the disassembly, maintenance, upgrades, and replacements of the power module and magnetic components. Simultaneously, the interconnected three-dimensional water channels dissipate heat from the magnetic components in the heat dissipation cavity and the power module on the outer wall of the three-dimensional water channels, ensuring effective heat dissipation for stable operation of the on-board charger.

Attached Figure Description

To more clearly illustrate the technical solution proposed by this invention, the invention will be described in detail below with reference to embodiments and accompanying drawings. It should be understood that the embodiments and drawings described in the following detailed description and specification are merely some embodiments of this invention, and those skilled in the art can make changes to these drawings within the framework of this invention.

Figure 1 is a schematic diagram of the overall assembly structure of a first embodiment of the power module heat dissipation structure provided by the present invention;

Figure 2 is an exploded structural diagram of the heat dissipation structure of the power module in Figure 1.

Figure 3 is a schematic diagram of the overall assembly structure of Embodiment 2 of the power module heat dissipation structure provided by the present invention;

Figure 4 is a schematic diagram of the overall assembly structure of Embodiment 3 of the power module heat dissipation structure provided by the present invention;

Figure 5 is an exploded view of the overall heat dissipation structure of the power module in Figure 4.

Figure 6 is an exploded structural diagram of Embodiment 4 of the power module heat dissipation structure provided by the present invention;

Figure 7 is an exploded structural diagram of Embodiment 5 of the power module heat dissipation structure provided by the present invention;

Figure 8 is a schematic diagram of the overall assembly structure of Embodiment 6 of the power module heat dissipation structure provided by the present invention;

Figure 9 is an exploded structural diagram of Embodiment 6 of the power module heat dissipation structure provided by the present invention;

Figure 10 is a schematic diagram of the overall assembly structure of Embodiment 7 of the power module heat dissipation structure provided by the present invention;

Figure 11 is an exploded structural diagram of Embodiment 7 of the power module heat dissipation structure provided by the present invention;

Figure 12 is a schematic diagram of the overall assembly structure of Embodiment 8 of the power module heat dissipation structure provided by the present invention;

Figure 13 is a schematic diagram of the overall assembly structure of another embodiment of the power module heat dissipation structure in Example 8;

Figure 14 is a schematic diagram of the overall assembly structure of Embodiment 9 of the power module heat dissipation structure provided by the present invention;

Figure 15 is a schematic diagram of the overall assembly structure of Embodiment 10 of the power module heat dissipation structure provided by the present invention.

Figure 16 is a schematic diagram of the overall assembly structure of Embodiment 11 of the power module heat dissipation structure provided by the present invention;

Figure 17 is an exploded structural diagram of Embodiment 12 of the power module heat dissipation structure provided by the present invention.

Figure 18 is an exploded structural diagram of Embodiment 12 of the power module heat dissipation structure provided by the present invention.

Figure 19 is an enlarged structural schematic diagram of one embodiment of the second waterway cover plate in Figure 18;

Figure 20 is an enlarged structural schematic diagram of another embodiment of the second waterway cover in Figure 18;

Figure 21 is an enlarged structural schematic diagram of another embodiment of the second waterway cover in Figure 18.

The main markings in the attached figures are as follows:

1. Water channel base; 10. Screw; 11. Partition wall; 2. First three-dimensional water channel; 21. Inlet; 22. First water channel body; 23. First water channel cover; 3. Second three-dimensional water channel; 31. Outlet; 32. Second water channel body; 321. Second flow channel groove; 33. Second water channel cover; 4. Intermediate water channel; 5. Heat dissipation cavity; 6. Magnetic components; 7. Power module; 71. Single-PIN power module; 72. Dual-PIN power module; 73. Component locking strip; 731. Locking base; 732. Elastic pressure strip; 74. Connecting hole; 75. Thermally conductive structure layer; 76. Thermal interface material layer; 77. Pressure strip; 771. Welding foot; 8. Third water channel cover; 9. Heat dissipation fins; 91. Toothed fins; 92. Rectangular fins; 93. Circular fins.

The other markings in the diagram are as follows:

A. Outer wall; B. Top wall; C. Mounting hole; X. First horizontal direction; Y. Second horizontal direction.

Detailed Implementation

To make the technical problems, technical solutions and beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings 1-21 and embodiments.

Please refer to Figures 1 and 2. The power module heat dissipation structure provided by the present invention includes:

A water channel base 1 is connected to the housing of the on-board charger (not shown in the figure); a first three-dimensional water channel 2 and a second three-dimensional water channel 3 are spaced apart on the water channel base 1; an intermediate water channel 4 is connected between the first three-dimensional water channel 2 and the second three-dimensional water channel 3; a heat dissipation cavity 5 is formed between the water channel base 1, the first three-dimensional water channel 2, the intermediate water channel 4 and the second three-dimensional water channel 3; at least one magnetic device 6 is installed in the heat dissipation cavity 5; at least one power module 7 is installed on the outer wall of the first three-dimensional water channel 2 and/or the second three-dimensional water channel 3.

The first three-dimensional water channel 2, the intermediate water channel 4, and the second three-dimensional water channel 3 are provided with interconnected internal flow channels (not shown in the figure) for introducing external cooling water or coolant (not shown in the figure) into the power module heat dissipation structure. When the cooling water or coolant flows through the internal flow channels, it exchanges heat with the magnetic device 6 and the power module 7 connected to the water channel walls of the first three-dimensional water channel 2, the intermediate water channel 4, and the second three-dimensional water channel 3. After the heat exchange is completed, the cooling water or coolant flows out of the power module heat dissipation structure from the internal flow channels, exchanges heat with the outside environment again, and then flows back into the power module heat dissipation structure. This cycle is repeated to realize the heat dissipation function of the water channels for the power module heat dissipation structure.

In this embodiment, the power module heat dissipation structure can be manufactured as a separate module and detachably connected and installed inside the housing of the on-board charger, or it can be integrally set with the housing of the on-board charger, such as being directly embedded into the housing during the machining or die-casting process of the on-board charger housing.

Please refer to Figures 1 and 2, in Embodiment 1 of the power module heat dissipation structure provided by the present invention:

The power module heat dissipation structure also includes:

The device locking bar 73 includes: a locking base 731, which is fastened to the housing of the on-board charger to match the power module 7; and an elastic pressure bar 732, which is installed on the locking base 731 and presses the corresponding power module 7 against the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

Please refer to Figures 1 and 2. In a preferred embodiment of Example 1, the locking base 731 is a sheet metal part, which is fastened to the housing of the on-board charger by screws 10. The elastic pressure strips 732 are a pair of metal pressure strips that are spaced apart on the locking base 731 and integrally bent with the locking base 731. Under the torque of the locking screws 10, the elastic pressure strips 732 (the pair of metal pressure strips) gradually apply pressure to the power module 7 toward the first three-dimensional water channel 2 or the second three-dimensional water channel 3, so that the power module 7 is tightly pressed against the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

Please refer to Figure 3, in Embodiment 2 of the power module heat dissipation structure provided by the present invention:

The outer wall A of the first three-dimensional waterway 2 and the second three-dimensional waterway 3 is provided with at least one mounting hole C, and the power module 7 is provided with a connection hole 74 that matches the mounting hole C; the power module 7 is connected to the outer wall A of the first three-dimensional waterway 2 or the second three-dimensional waterway 3 through the corresponding connection hole 74 and the mounting hole C via a connector.

Please refer to Figures 4 and 5, in Embodiment 3 of the power module heat dissipation structure provided by the present invention:

The top wall B of the first three-dimensional waterway 2 and the second three-dimensional waterway 3 is provided with at least one mounting hole C. The power module 7 is provided with a connection hole 74 or a connection groove that matches the mounting hole C. The power module 7 is connected to the top wall B of the first three-dimensional waterway 2 or the second three-dimensional waterway 3 through the connection hole or the connection groove and the corresponding connection hole 74 and mounting hole C.

Please refer to Figures 3-5 together. As a preferred embodiment of both Embodiments 2 and 3, the mounting hole C is a threaded hole, the connecting hole 74 is a through hole for the screw 10 that matches the threaded hole, and the connector is a screw 10 that matches the threaded hole and the through hole for the screw 10.

In other embodiments of the power module heat dissipation structure provided by the present invention, the outer wall A and top wall B of the first three-dimensional water channel 2 and the second three-dimensional water channel 3 are each provided with at least one mounting hole C. The power module 7 is connected to the outer wall A and top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the corresponding connecting hole 74 and mounting hole C via a connector.

Please refer to Figure 6, in Embodiment 4 of the power module heat dissipation structure provided by the present invention:

The power module 7 is connected to the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the thermally conductive structure layer 75. The thermally conductive structure layer 75 can simultaneously fix the power module 7 to the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, reduce the interface thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, and improve the heat dissipation efficiency of the power module heat dissipation structure.

In one embodiment of Example 4, the thermally conductive structural layer 75 is a thermosetting adhesive layer coated between the power module 7 and the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

In one embodiment of Example 4, the thermally conductive structural layer 75 is a solder layer welded between the power module 7 and the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

Please refer to Figure 7, in Embodiment 5 of the power module heat dissipation structure provided by the present invention:

The power module 7 is connected to the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the thermally conductive structure layer 75. The thermally conductive structure layer 75 can simultaneously fix the power module 7 to the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, reduce the interface thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, and improve the heat dissipation efficiency of the power module heat dissipation structure.

In one embodiment of implementation five, the thermally conductive structural layer 75 is a thermosetting adhesive layer coated between the power module 7 and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

In one embodiment of Example 5, the heat-conducting structural layer 75 is a solder layer welded between the power module 7 and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

Please refer to Figures 8 and 9, in Embodiment Six of the power module heat dissipation structure provided by the present invention:

Press the pressure strip 77 onto the top surface of the outer wall A of the power module 7 facing away from the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and weld the welding feet 771 of the pressure strip 77 to the outer surface of the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, thereby pressing the power module 7 tightly onto the outer surface of the outer wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the pressure strip 77.

Please refer to Figures 10 and 11, in Embodiment Seven of the Power Module Heat Dissipation Structure provided by the present invention:

The pressure strip 77 is pressed onto the top surface of the top wall B of the power module 7 facing away from the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and the welding feet 771 of the pressure strip 77 are welded to the outer surface of the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, thereby pressing the power module 7 tightly onto the outer surface of the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the pressure strip 77.

Please refer to Figures 1-11. As a preferred embodiment common to Embodiments 1 to 7, the power module 7 is connected to the outer wall A and/or top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through a thermal interface material layer 76. That is, the power module 7 is coated with a thermal interface material layer 76 (thermal interface material, abbreviated as TIM) between the outer wall A and/or top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3. The thermal interface material layer 76 is used to reduce the interface thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, so as to further improve the heat dissipation efficiency of the power module heat dissipation structure.

In embodiments four and five, when the thermally conductive structural layer 75 is a solder layer or a thermosetting adhesive layer, it is not necessary to provide a thermal interface material layer 76.

Please refer to Figures 1 and 2. In this embodiment, the first three-dimensional waterway 2 and the second three-dimensional waterway 3 both extend back and forth along the first horizontal direction X; the middle waterway 4 extends along the second horizontal direction Y, which is perpendicular to the first horizontal direction X, and connects the first three-dimensional waterway 2 and the second three-dimensional waterway 3.

The power module heat dissipation structure also includes:

The inlet 21 is located at one end of the first three-dimensional waterway 2 in the first horizontal direction X, away from the intermediate waterway 4, and is connected to the internal flow channel of the first three-dimensional waterway 2; the outlet 31 is located at one end of the second three-dimensional waterway 3 in the first horizontal direction X, away from the intermediate waterway 4, and is connected to the internal flow channel of the second three-dimensional waterway 3.

Please refer to Figures 12 and 13, in Embodiment 8 of the power module heat dissipation structure provided by the present invention:

The power module 7 is provided in two groups, each group of power modules 7 includes multiple power modules 7, and the two groups of power modules 7 are respectively installed at intervals on the outer wall (outer wall A or top wall B) surface of the first three-dimensional water channel 2 and the second three-dimensional water channel 3. The power module 7 is a single-PIN device (i.e. a power module 7 with a single row of pins on one side) and/or a double-PIN device (i.e. a power module 7 with double rows of pins on both sides).

Please refer to Figure 12. As one embodiment of Example 8, the power module 7 is provided in two sets. Both sets of power modules 7 are dual-PIN devices (as shown in Figure 8), or both sets of power modules 7 are single-PIN power devices. The two sets of power modules 7 are respectively installed at intervals on the outer wall (outer wall A or top wall B) surface of the first three-dimensional waterway 2 and the second three-dimensional waterway 3.

Please refer to Figure 13. As one embodiment of Example 8, the power module 7 is provided in two sets. One set of power modules 7 is a dual-PIN device, which is installed at intervals on the outer wall (outer wall A or top wall B) surface of the first three-dimensional waterway 2 located on the right side (i.e., one end of the waterway base 1 in the second horizontal direction Y). The other set of power modules 7 is a single-PIN device, which is installed at intervals on the outer wall (outer wall A or top wall B) surface of the second three-dimensional waterway 3 located on the left side (i.e., the opposite end of the waterway base 1 in the second horizontal direction Y).

As another embodiment of Example 8 (not shown in the figure), a set of power modules 7 installed on the first three-dimensional water channel 2 on the right side can also be single-PIN devices, while another set of power modules 7 installed on the second three-dimensional water channel 3 on the left side is a double-PIN device.

In this embodiment, the power module 7 may use internal chips made of materials such as silicon, silicon carbide, and gallium nitride, depending on the actual application scenario.

Please refer to Figure 14, in Embodiment Nine of the power module heat dissipation structure provided by the present invention:

The power module 7 is provided in two sets. One set of power modules 7 is installed at intervals on the top wall B of the second three-dimensional water channel 3 located on the right side in any of the above embodiments 3 or 5. The other set of power modules 7 is installed at intervals on the outer side wall A of the first three-dimensional water channel 2 located on the left side in any of the above embodiments 1, 2, and 4, so as to realize the mixed layout of power modules on the top and side of the power module heat dissipation structure.

As another embodiment of Example 9 (not shown in the figure), a group of power modules 7 are installed at intervals on the top wall B of the first three-dimensional waterway 2 located on the left side in any manner as described in Examples 3 or 5 above; another group of power modules 7 are installed at intervals on the outer wall A of the second three-dimensional waterway 3 located on the right side in any manner as described in Examples 1, 2, and 4 above.

In other embodiments of the power module heat dissipation structure provided by the present invention (not shown in the figure), the power module 7 can also be installed on the outer wall surface of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 in a manner other than the above embodiments one to five.

Please refer to Figure 15, in Embodiment 10 of the power module heat dissipation structure provided by the present invention:

Both the first three-dimensional waterway 2 and the second three-dimensional waterway 3 are cuboid in shape. The internal flow channels of both the first three-dimensional waterway 2 and the second three-dimensional waterway 3 extend along the first horizontal direction X. The inlet 21 is located on the top surface of the first three-dimensional waterway 2 away from the intermediate waterway 4, and the outlet 31 is located on the top surface of the second three-dimensional waterway 3 away from the intermediate waterway 4. The intermediate waterway 4 is cuboid in shape and is perpendicular to the connection between the end of the first three-dimensional waterway 2 away from the inlet 21 and the end of the second three-dimensional waterway 3 away from the outlet 31. The internal flow channels of the intermediate waterway 4 connect the corresponding internal flow channels of the first three-dimensional waterway 2 and the second three-dimensional waterway 3 along the second horizontal direction Y, which is perpendicular to the first horizontal direction X.

Please refer to Figure 15. In one embodiment of Example 10, the first three-dimensional water channel 2 and the second three-dimensional water channel 3 are respectively located on the right and left sides of the water channel base 1. That is, the first three-dimensional water channel 2 and the second three-dimensional water channel 3 serve as the right three-dimensional water channel and the left three-dimensional water channel of the power module heat dissipation structure, respectively, and the middle water channel 4 serves as the transverse three-dimensional water channel connecting the first three-dimensional water channel 2 and the second three-dimensional water channel 3.

Cooling water or coolant enters the first three-dimensional water channel 2 located on the right side through the inlet 21. When flowing through the internal flow channel of the first three-dimensional water channel 2, it exchanges heat with the power module and the magnetic device 6 in the heat dissipation cavity 5 on the top or side of the first three-dimensional water channel 2 on the right side of the power module heat dissipation structure. Then, it enters the second three-dimensional water channel 3 on the left side through the internal flow channel of the middle water channel 4. When flowing through the internal flow channel of the second three-dimensional water channel 3, it exchanges heat with the power module and the magnetic device 6 in the heat dissipation cavity 5 on the top or side of the second three-dimensional water channel 3 on the left side of the power module heat dissipation structure. Finally, it flows out from the outlet 31.

In another embodiment of Example 10 (not shown in the figure), the first three-dimensional water channel 2 and the second three-dimensional water channel 3 are respectively located on the left and right sides of the water channel base 1. That is, the first three-dimensional water channel 2 and the second three-dimensional water channel 3 serve as the left and right three-dimensional water channels of the power module heat dissipation structure, respectively, and the middle water channel 4 serves as the transverse three-dimensional water channel connecting the first three-dimensional water channel 2 and the second three-dimensional water channel 3.

At this point, the flow direction of the cooling water or coolant changes from the right side of the power module's heat dissipation structure to the left side.

Please refer to Figure 16, in Embodiment Eleven of the Power Module Heat Dissipation Structure provided by the present invention:

The first three-dimensional waterway 2 and the second three-dimensional waterway 3 are both rectangular parallelepipeds. The inlet 21 is located on the bottom surface of the first three-dimensional waterway 2 at the end away from the middle waterway 4, and the outlet 31 is located on the bottom surface of the second three-dimensional waterway 3 at the end away from the middle waterway 4.

In other embodiments of the power module heat dissipation structure provided by the present invention (not shown in the figure), the water inlet 21 may also be provided on the side of the first three-dimensional water channel 2 in the cuboid shape away from the middle water channel 4, and the water outlet 31 may also be provided on the side of the second three-dimensional water channel 3 in the cuboid shape away from the middle water channel 4.

Please refer to Figures 17 and 18. In this embodiment, the first three-dimensional waterway 2 includes:

The first waterway body 22 is integrally formed on the waterway base 1; the first waterway cover plate 23 is detachably installed on the outer side or bottom surface of the first waterway body 22 facing away from the second three-dimensional waterway 3, and together with the first waterway body 22, forms a first flow channel cavity (not shown in the figure) which is part of the internal flow channel of the first three-dimensional waterway 2.

The second three-dimensional waterway 3 includes:

The second waterway body 32 is integrally formed and spaced parallel to the first waterway body 22 on the waterway base 1; the second waterway cover plate 33 is detachably installed on the outer side or bottom surface of the second waterway body 32 facing away from the first three-dimensional waterway 2, and together with the second waterway body 32, forms a second flow channel cavity (not shown in the figure) which is part of the internal flow channel of the second three-dimensional waterway 3.

Please refer to Figures 17-21 together, in Embodiment Twelve of the power module heat dissipation structure provided by the present invention:

The outer side of the first water channel body 22 facing away from the second three-dimensional water channel 3 is provided with a first flow channel groove (not shown in the figure). One end of the first flow channel groove is connected to the water inlet 21, and the opposite end of the first flow channel groove is connected to the internal flow channel of the intermediate water channel 4. The first water channel cover plate 23 is installed on the outer side of the first water channel body 22 and closes the first flow channel groove, so that the first water channel cover plate 23 and the first flow channel groove form the first flow channel cavity, which is part of the internal flow channel of the first three-dimensional water channel 2. A plurality of heat dissipation fins 9 are provided at intervals on the side of the first water channel cover plate 23 facing the first flow channel groove. When the first water channel cover plate 23 is installed on the outer side of the first water channel body 22 and closes the first flow channel groove, the heat dissipation fins 9 are surrounded in the first flow channel cavity formed inside the first flow channel groove. This increases the contact area between the cooling water or coolant flowing through the first flow channel cavity and the first water channel cover plate 23 on one side, improves the water channel flow resistance, and increases the liquid flow velocity flowing through the first flow channel cavity, thereby improving the heat dissipation efficiency of the first three-dimensional water channel 2.

The second waterway body 32 has a second flow channel groove 321 on its outer side facing away from the first three-dimensional waterway 2. One end of the second flow channel groove 321 is connected to the outlet 31, and the other end of the second flow channel groove 321 is connected to the internal flow channel of the intermediate waterway 4. The second waterway cover plate 33 is installed on the outer side of the second waterway body 32 and closes the second flow channel groove 321, so that the second waterway cover plate 33 and the second flow channel groove 321 form the above-mentioned second flow channel cavity, which is part of the internal flow channel of the second three-dimensional waterway 3. Furthermore, a plurality of heat dissipation fins 9 are spaced apart on the side of the second water channel cover plate 33 facing the second flow channel groove 321. When the second water channel cover plate 33 covers and is installed on the outer side of the second water channel body 32 and closes the second flow channel groove 321, the heat dissipation fins 9 are surrounded in the second flow channel cavity formed inside the second flow channel groove 321. This increases the contact area between the cooling water or coolant flowing through the second flow channel cavity and the second water channel cover plate 33 on one side, improves the flow resistance of the water channel, and increases the flow velocity of the liquid flowing through the second flow channel cavity, thereby improving the heat dissipation efficiency of the second three-dimensional water channel 3.

Please refer to Figures 1-16 together, in Embodiment Thirteen of the power module heat dissipation structure provided by the present invention:

The bottom surface of the water channel base 1, facing away from the first three-dimensional water channel 2 and the second three-dimensional water channel 3, is provided with a third flow channel groove (not shown in the figure). One end of the third flow channel groove is connected to the water inlet 21, and the other end of the third flow channel groove is connected to the water outlet 31. The power module heat dissipation structure also includes:

The third water channel cover plate 8 covers and is installed on the bottom surface of the water channel base 1, and closes the third flow channel groove, thereby forming a third flow channel cavity, which is a planar water channel provided on the water channel base 1, with the third water channel cover plate 8 and the third flow channel groove together. Multiple heat dissipation fins 9 are spaced apart on the side of the third water channel cover plate 8 facing the third flow channel groove. When the third water channel cover plate 8 covers and is installed on the bottom surface of the water channel base 1 and closes the third flow channel groove, the heat dissipation fins 9 are surrounded in the aforementioned third flow channel cavity formed inside the third flow channel groove. This increases the contact area between the cooling water or coolant flowing through the third flow channel cavity and the bottom side of the third water channel cover plate 8, and increases its liquid flow rate, thereby improving the heat dissipation efficiency of the planar water channel.

Please refer to Figures 1-18. As a preferred embodiment common to both Embodiments 12 and 13, the first waterway cover plate 23, the second waterway cover plate 33, and the third waterway cover plate 8 can be fastened to the corresponding outer walls of the first three-dimensional waterway 2, the second three-dimensional waterway 3, and the waterway base 1 by screws 10, and the connection is sealed by a sealing ring (not shown in the figure) or sealant (not shown in the figure) at the connection point; alternatively, the first waterway cover plate 23, the second waterway cover plate 33, and the third waterway cover plate 8 can be welded to the corresponding outer walls of the first three-dimensional waterway 2, the second three-dimensional waterway 3, and the waterway base 1, respectively.

Please refer to Figure 19. As a common implementation of Embodiments 12 and 13, the heat dissipation fin 9 is a toothed fin 91.

Please refer to Figure 20. As a common implementation of Embodiments 12 and 13, the heat dissipation fin 9 is a rectangular fin 92.

Please refer to Figure 21. As a common implementation of Embodiments 12 and 13, the heat dissipation fin 9 is a circular fin 93.

As a preferred embodiment in both Examples 12 and 13, the heat dissipation fin 9 is a Pin-Fin fin.

Please refer to Figures 1-18 together. As a common implementation method of embodiments one to thirteen, the intermediate water channel 4 is a three-dimensional water channel that is raised and installed on the water channel base 1. That is, the intermediate water channel 4 is a three-dimensional water channel located behind the magnetic device 6 at the end of the water channel base 1 away from the water inlet 21 and the water outlet 31. At this time, the overall water channel layout of the power module heat dissipation structure is: water inlet 21 - first three-dimensional water channel 2 - intermediate water channel 4 (three-dimensional water channel) - second three-dimensional water channel 3 - water outlet 31.

In other embodiments (not shown in the figure), the intermediate water channel 4 can also be an intermediate planar water channel installed in the water channel base 1. That is, the intermediate water channel 4 is a planar water channel located below the magnetic device 6 at the end of the water channel base 1 away from the inlet 21 and the outlet 31, and connected to the first three-dimensional water channel 2 and the second three-dimensional water channel 3 respectively. In this case, the overall water channel layout of the power module heat dissipation structure is: inlet 21 - first three-dimensional water channel 2 - intermediate water channel 4 (planar water channel) - second three-dimensional water channel 3 - outlet 31.

The present invention also provides an on-board charger, including a housing (not shown in the figure) and the power module heat dissipation structure described above.

Please refer to Figures 1 and 2. In this embodiment, the heat dissipation cavity 5 is divided into at least two chambers by at least one partition wall 11, which are used to install at least two magnetic devices 6 respectively. The magnetic devices 6 are connected to the inner surfaces of the first three-dimensional water channel 2, the second three-dimensional water channel 3 and/or the intermediate water channel 4 by thermally conductive adhesive.

In this embodiment, the power module heat dissipation structure further includes:

The circuit board (not shown in the figure) is installed inside the housing of the on-board charger and located above the heat dissipation structure of the power module. The pins of the magnetic device 6 and the power module 7 are electrically connected to the circuit board.

In a preferred embodiment, the circuit board is a PCB board, a power board, or a chip board.

The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art should understand that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims (13)

A power module heat dissipation structure, characterized in that it comprises: Waterway base (1), connected to the housing of the on-board charger; The first three-dimensional waterway (2) and the second three-dimensional waterway (3) are spaced apart on the waterway base (1); The intermediate waterway (4) connects the first three-dimensional waterway (2) and the second three-dimensional waterway (3); The water channel base (1), the first three-dimensional water channel (2), the intermediate water channel (4), and the second three-dimensional water channel (3) form a heat dissipation cavity (5); At least one magnetic device (6) is installed in the heat dissipation cavity (5); At least one power module (7) is installed on the outer wall of the first three-dimensional waterway (2) and/or the second three-dimensional waterway (3). The power module heat dissipation structure as described in claim 1, characterized in that it further comprises: Device locking bar (73), including: The locking base (731) is fastened to the housing in a matching manner with the power module (7); The elastic pressure strip (732) is installed on the locking base (731) and presses the corresponding power module (7) against the outer wall (A) of the first three-dimensional waterway (2) or the second three-dimensional waterway (3). The power module heat dissipation structure as described in claim 1 is characterized in that the outer side wall (A) and/or top wall (B) of the first three-dimensional water channel (2) and the second three-dimensional water channel (3) are provided with at least one mounting hole (C), and the power module (7) is provided with a connection hole (74) that matches the mounting hole (C); The power module (7) is connected to the outer wall (A) and/or top wall (B) of the first three-dimensional waterway (2) or the second three-dimensional waterway (3) via a connector passing through the corresponding connection hole (74) and mounting hole (C). The power module heat dissipation structure as described in claim 1 is characterized in that the power module (7) is connected to the outer wall (A) and/or top wall (B) of the first three-dimensional water channel (2) or the second three-dimensional water channel (3) through a heat-conducting structure layer (75). The power module heat dissipation structure as described in any one of claims 2-4 is characterized in that the power module (7) is connected to the outer wall (A) and/or top wall (B) of the first three-dimensional water channel (2) or the second three-dimensional water channel (3) through a thermal interface material layer (76). The power module heat dissipation structure as described in claim 4 is characterized in that the thermally conductive structure layer (75) is a thermosetting adhesive layer or a solder layer. The power module heat dissipation structure as described in any one of claims 1-4, characterized in that it further comprises: The inlet (21) is located at one end of the first three-dimensional waterway (2) away from the intermediate waterway (4) and is connected to the internal flow channel of the first three-dimensional waterway (2); The outlet (31) is located at one end of the second three-dimensional waterway (3) away from the middle waterway (4) and is connected to the internal flow channel of the second three-dimensional waterway (3). The power module heat dissipation structure as described in claim 7 is characterized in that the first three-dimensional water channel (2) and the second three-dimensional water channel (3) are both cuboid in shape, the water inlet (21) is located on the top surface, side surface, end surface or bottom surface of the first three-dimensional water channel (2) away from the middle water channel (4), and the water outlet (31) is located on the top surface, side surface, end surface or bottom surface of the second three-dimensional water channel (3) away from the middle water channel (4). The power module heat dissipation structure as described in claim 7, characterized in that the first three-dimensional water channel (2) comprises: The first waterway body (22) is disposed on the waterway base (1); The first waterway cover plate (23) covers the outer side or bottom surface of the first waterway body (22) facing away from the second three-dimensional waterway (3); The second three-dimensional waterway (3) includes: The second waterway body (32) is arranged parallel to and spaced apart from the first waterway body (22) on the waterway base (1); The second waterway cover (33) covers the outer side or bottom surface of the second waterway body (32) facing away from the first three-dimensional waterway (2). The power module heat dissipation structure as described in claim 9 is characterized in that the outer side of the first water channel body (22) facing away from the second three-dimensional water channel (3) is provided with a first flow channel groove, one end of the first flow channel groove is connected to the water inlet (21), and the other end of the first flow channel groove is connected to the internal flow channel of the intermediate water channel (4). The first waterway cover plate (23) is installed on the outer side of the first waterway body (22) and closes the first flow channel groove. The first waterway cover plate (23) has multiple heat dissipation fins (9) spaced apart on the side facing the first flow channel groove. The outer side of the second waterway body (32) is provided with a second flow channel groove (321). One end of the second flow channel groove (321) is connected to the water outlet (31), and the other end of the second flow channel groove (321) is connected to the internal flow channel of the middle waterway (4). The second waterway cover (33) is installed on the outer side of the second waterway body (32) and closes the second flow channel groove (321). The side of the second waterway cover (33) facing the second flow channel groove (321) is provided with multiple heat dissipation fins (9) at intervals. The power module heat dissipation structure as described in claim 10 is characterized in that the heat dissipation fins (9) are toothed fins (91), rectangular fins (92), or circular fins (93). The power module heat dissipation structure according to any one of claims 1-4 is characterized in that the two sets of power modules (7) are respectively installed at intervals on the outer walls of the first three-dimensional water channel (2) and the second three-dimensional water channel (3), and the power module (7) is a single-PIN device and/or a double-PIN device. An on-board charger includes a housing, characterized in that it further includes a power module heat dissipation structure as described in any one of claims 1-12.