WO2026019587A1

WO2026019587A1 - Replaceable heater terminal assemblies for substrate supports of substrate processing systems

Info

Publication number: WO2026019587A1
Application number: PCT/US2025/036600
Authority: WO
Inventors: Ju XUE; Slobodan Mitrovic; Sai LIU; Darrell EHRLICH; Roger LIE; Tsun Yin LAU; Aarthi RAMESH; Hassan Rezayat
Original assignee: Lam Research Corp
Current assignee: Lam Research Corp
Priority date: 2024-07-17
Filing date: 2025-07-07
Publication date: 2026-01-22
Anticipated expiration: 2027-01-17

Abstract

A heater terminal assembly for a substrate support of a substrate processing system includes: an insulator configured to screw into a base plate of the substrate support; a socket disposed within the insulator and configured to conduct electrical current for heating a heating element disposed in the substrate support; and a heater terminal disposed within the insulator and configured to move relative to the substrate support and maintain contact with the heating element. The heater terminal conducts electrical current between the socket and the heating element.

Description

REPLACEABLE HEATER TERMINAL ASSEMBLIES FOR SUBSTRATE SUPPORTS OF SUBSTRATE PROCESSING SYSTEMS

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63/672,683, filed on July 17, 2024. The entire disclosure of the application referenced above is incorporated herein by reference.

FIELD

[0002] The present disclosure relates to substrate supports of substrate processing systems, and more particularly to heater terminals of substrate supports.

BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] A process chamber of a substrate processing system includes one or more process stations for performing deposition and etch treatments on substrates such as semiconductor wafers. For example, deposition may be performed to deposit conductive film, dielectric film, or other types of film using chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), plasma enhance ALD (PEALD), and/or other deposition processes. As an example, etching may be performed to remove material from one or more layers and include atomic layer etching (ALE), high aspect ratio (HAR) etching, plasma etching, and/or other etch processes. During deposition, a substrate is arranged on a substrate support (e.g., a pedestal) and one or more precursor gases may be supplied to a process chamber using a gas distribution device (e.g., a showerhead) during one or more process steps. In a PECVD or PEALD process, plasma is used to activate chemical reactions within the process chamber during deposition. Additional examples of processes that may be performed on a substrate include, but are not limited to, dielectric etching, chemical etching, plasma etching, reactive ion etching, and cleaning processes. During the deposition and etching processes, gas mixtures are introduced into the process chamber via showerheads, and plasma is struck to activate chemical reactions. During the cleaning processes, gases may also be introduced via the showerheads. Prior to or during these processes one or more heat elements within the substrate support may be heated to adjust temperatures of the substrate being processed.

SUMMARY

[0005] A heater terminal assembly for a substrate support of a substrate processing system is disclosed. The heater terminal assembly includes: an insulator configured to screw into a base plate of the substrate support; a socket disposed within the insulator and configured to conduct electrical current for heating a heating element disposed in the substrate support; and a heater terminal disposed within the insulator and configured to move relative to the substrate support and maintain contact with the heating element. The heater terminal conducts electrical current between the socket and the heating element.

[0006] In other features, the heater terminal assembly further includes a hinge assembly including the heater terminal, a conductive element, and a hinge. The conductive element is connected to the socket. The heater terminal is not attached to the heating element and is configured to move via the hinge relative to the heating element and the conductive element.

[0007] In other features, the hinge is a ball hinge permitting movement rotation of the heater terminal about an X axis and a Y axis relative to the conductive element. In other features, the hinge assembly is conductive of electrical current between the socket and the heater terminal.

[0008] In other features, the heater terminal assembly further includes a pin assembly including the heater terminal and conducting electrical current between the socket and the heater terminal.

[0009] In other features, the pin assembly includes: a spring in contact with the socket; and a ball bearing. The heater terminal is implemented as a pin in contact with but not attached to the heating element.

[0010] In other features, the pin is formed of at least one of copper, aluminum, and electrically conductive material. In other features, the pin includes a nickel coating or a gold coating. [0011] In other features, the pin assembly includes: a conductive element in contact with the socket; and a ball bearing. The heating element is implemented as a pin in contact with but not attached to the heating element.

[0012] In other features, the pin is formed of at least one of copper, aluminum, and electrically conductive material. In other features, the pin includes a nickel coating or a gold coating.

[0013] In other features, the pin assembly includes: a spring in contact with the socket; and a ball bearing. The heater terminal is implemented as a pin having a bearing contact element in contact with and movable relative to the heating element.

[0014] In other features, the pin assembly includes a housing, a ball bearing, the heater terminal, and an inner cup. The heater terminal is implemented as a pin. At least a portion of the ball bearing and at least a portion of the pin are disposed in the inner cup. The inner cup is disposed within the housing. In other features, the pin assembly further includes a spring that is not disposed in the inner cup but is disposed within the housing.

[0015] In other features, a first gap exists between the inner cup and the housing. A second gap exists between the pin and the inner cup. Movement of the pin relative to the heating element is limited based on sizes of the first gap and the second gap.

[0016] In other features, the inner cup includes a hole. The pin extends through the hole. In other features, an outer diameter of the pin is less than a diameter of the hole to allow lateral movement of the pin relative to the housing and the inner cup.

[0017] In other features, the heater terminal assembly further includes an intermediary component in contact with the socket. The heater terminal is implemented as a spring in contact with the intermediary component and the heating element and conducting electrical current between the intermediary component and the heating element.

[0018] In other features, the heater terminal assembly further includes a guide tube disposed between i) the insulator and ii) the socket, the intermediary component, and the spring. In other features, the guide tube does not extend to and does not contact the heating element. In other features, the guide tube does extend to the heating element.

[0019] In other features, the heater terminal is implemented as a conductive element extending between the heating element and the socket and applying pressure on the heating element and the socket to maintain electrical contact between the heating element and the socket.

[0020] In other features, the socket includes a cup-shaped upper portion that holds a portion of the conductive element. In other features, the conductive element contacts but is not attached to the heating element.

[0021] In other features, the heater terminal assembly further includes: a conductive element in contact with the socket; and an intermediary element in contact with the conductive element. The heater terminal is implemented as a bearing contact element in contact with the intermediary element and the heating element.

[0022] In other features, the heater terminal assembly further includes: a conductive element in contact with the socket; and an intermediary element in contact with the conductive element and the heating element.

[0023] In other features, a substrate support is disclosed and includes: the heater terminal assembly; the base plate; and a top plate disposed on and adhered to the base plate via an adhesive layer. The heater terminal assembly screws into the base plate.

[0024] In other features, the heating element is disposed in the top plate, the adhesive layer, or the base plate. In other features, the heating element is laminated to a bottom of the top plate or to a top of the base plate.

[0025] In other features, the substrate support further includes a spring washer disposed between the heater terminal assembly and the base plate. In other features, the heater terminal assembly is not epoxied to the substrate support.

[0026] In other features, the substrate support further includes another insulator disposed between a portion of the top plate and the heater terminal, where the portion of the top plate is below the heating element.

[0027] In other features, a heater terminal assembly for a substrate support of a substrate processing system is disclosed. The heater terminal assembly includes: an insulator configured to screw into a base plate of the substrate support; a socket disposed within the insulator and configured to conduct electrical current for heating a heating element disposed in the substrate support; and a flexible connector disposed within the insulator and extending from the socket to a heater terminal attached to the heating element. The flexible connector is configured to conduct electrical current between the socket and the heater terminal, move relative to the socket and the heater terminal, and maintain contact with the socket and the heating element.

[0028] In other features, an upper portion of the socket is cupped to receive and maintain contact with the flexible connector. In other features, a lower portion of the heater terminal is cupped to receive and maintain contact with the flexible connector. In other features, the flexible connector is a spring.

[0029] In other features, a substrate support is disclosed and includes: the heater terminal assembly; the base plate; and a top plate disposed on and adhered to the base plate via an adhesive layer. The heater terminal assembly screws into the base plate.

[0030] In other features, the substrate support further includes the heater terminal, which is attached to the heating element. In other features, the heater terminal is soldered or brazed to the heating element.

[0031] In other features, the heating element is disposed in the top plate, the adhesive layer, or the base plate. In other features, the heating element is laminated to a bottom of the top plate or to a top of the base plate.

[0032] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0034] FIG. 1 is a functional block diagram of an example substrate processing system including a substrate support with heater terminal assemblies in accordance with the present disclosure;

[0035] FIG. 2 is a cross-sectional view of a substrate support including example heater terminal assemblies contacting a heating element embedded in a top plate of the substrate support in accordance with the present disclosure; [0036] FIG. 3 is a cross-sectional view of a substrate support including example heater terminal assemblies contacting a heating element disposed on a base plate of the substrate support in accordance with the present disclosure;

[0037] FIG. 4 is a cross-sectional view of a substrate support including example heater terminal assemblies contacting a heating element disposed below a top plate of the substrate support in accordance with the present disclosure;

[0038] FIG. 5 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a hinge in accordance with the present disclosure;

[0039] FIG. 6 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a ball hinge in accordance with the present disclosure;

[0040] FIG. 7 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a pin assembly in accordance with the present disclosure;

[0041] FIG. 8 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a pin assembly including a heater contact bearing in accordance with the present disclosure;

[0042] FIG. 9 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a flexible connecting spring in accordance with the present disclosure;

[0043] FIG. 10 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with another flexible connecting spring, an intermediary component and partial length guide tube in accordance with the present disclosure;

[0044] FIG. 11 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with another flexible connecting spring, intermediary component and a full length guide tube in accordance with the present disclosure;

[0045] FIG. 12 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a contact element shown in a shifted orientation in accordance with the present disclosure; [0046] FIG. 13 is a cross-sectional view of the portion of the substrate support of FIG. 12 showing the contact element in a nominal state;

[0047] FIG. 14 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a conductive element and a bearing contact element in accordance with the present disclosure;

[0048] FIG. 15 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a conductive element and a contact element in accordance with the present disclosure;

[0049] FIG. 16 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a pin assembly including a contact element in accordance with the present disclosure;

[0050] FIG. 17 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a pin assembly including a contact element and a deformation element in accordance with the present disclosure;

[0051] FIG. 18 is a cross-sectional view of a portion of a substrate support having an example heater terminal assembly with a pin assembly including a bearing contact element in accordance with the present disclosure;

[0052] In the drawings, reference numbers may be reused to identify similar and/or identical elements.

DETAILED DESCRIPTION

[0053] A substrate support (e.g., an electrostatic chuck) can include one or more heaters, referred to as heating elements. The heating elements may be wires, conductive traces, and/or other resistive heating elements. Each of the heaters can include a pair of heater terminals including a power terminal and a return (or ground) terminal. The heater terminals connect power lines providing power to the substrate support to the heating elements.

[0054] A heater terminal assembly can include a heater contact terminal, which contacts a heating element. The heating element is embedded in the substrate support. The heater contact terminal is disposed in the substrate support and is connected to a wire. The wire extends from the heater contact terminal to a socket, which receives a connector. The heater contact terminal, wire, and socket are disposed in a cavity of an insulator, which is threaded and screws into a base plate of the substrate support.

[0055] The heater terminal assembly has two types of connections. The first is between the heater contact terminal and the heating element. The heater contact terminal can be soldered to the heating element. The second is between the insulator and the base plate. The threads of the insulator are epoxied to threads of a base plate of the substrate support. The soldering of the heater contact terminal and the epoxying of the insulator are permanent fixations. Although these permanent fixations are capable of withstanding high temperature substrate processing applications, the permanent fixations minimize serviceability of the substrate support. Thus, when the heater terminal assembly fails, the substrate support is taken out of service and cannot be recovered.

[0056] As process temperatures increase and as temperature ranges during substrate processing become wider and wider, heater terminal connections are being exposed to a wider range of thermal cycling. This occurs while the heater terminal connections experience high levels of electrical current passing therethrough. As a result, the soldering joint of the heater contact terminal can experience cracking and/or failure and thus solder joint reliability issues causing the heating element to be intermittently active or disconnected. This can result in substrate support thermal nonuniformity and/or control failures.

[0057] In addition, a heater terminal assembly may have a heater terminal connected at a first end to a top plate of a substrate support and a socket connected at a second end to a base plate of the substrate support. The top plate may be formed of a different material than the base plate and thus may have different coefficients of expansion and experiences different levels of expansion and contraction. This can further cause cracking in heater terminal connections, which can further negatively affect heater terminal assembly reliability.

[0058] The examples set forth herein include heater terminal assemblies with i) heater contact terminals that are not soldered to heating elements and ii) insulators that are not epoxied to base plates of substrate supports. In some embodiments, the heater terminal assemblies including heater contact terminals that are not fixed to heating elements but rather are floating, stationary and/or movable relative to the heating elements while maintaining electrical contact with the heating elements. This occurs during thermal cycling of corresponding substrate supports.

[0059] In some embodiments, each heater terminal assembly includes one or more conductive elements that are deformable, flexible, movable, bendable, and/or compliant. These one or more conductive elements allow for expansion and contraction of substrate support and heater terminal assembly materials due to thermal cycling and electrical current flow without resulting in cracking and/or other material failures of the corresponding heater terminal assemblies. A heater contact terminal associated with each heater terminal assembly may be fixed to a heating element or may be able to slide, rotate and/or move relative to the heating element, plates and layers of the corresponding substrate support.

[0060] The examples disclosed herein provide heater terminal assemblies with increased reliability. The heater terminal assemblies and/or portions thereof are easily replaceable. This is because most if not all of the components of the heater terminal assemblies are not fixed permanently to substrate supports and the heater terminal assemblies can be unscrewed from the substrate supports. The heater terminal assemblies may be serviced and/or replaced during regular maintenance on the substrate supports. The examples minimize risk of connection degradation during thermal cycling due to expansion and contraction of substrate support materials, which can be different than expansion and contraction of heater contact terminal materials. The degradation can occur as a result of a mismatch between coefficients of thermal expansion of the different materials of the heater contact terminal and a plate or layer (e.g., top plate) of the substrate support on which the heater contact terminal is affixed. Some embodiments include heater contact terminals with lateral, horizontal and/or rotational mobility relative to heating elements and other conductive components and/or elements, thereby minimizing degradation of heater contact terminals and/or corresponding connections.

[0061] FIG. 1 shows a substrate processing system 100 including a substrate support 101 with heater terminal assemblies 102. The heater terminal assemblies 102 screw into a base plate 103 of the substrate support 101. Plugs 104 plug into the heater terminal assemblies and receive electrical current via power lines 105. The electrical current is supplied via the plugs 104 and the heater terminal assemblies 102 to a heating element 106. The heater terminal assemblies 102 circulate current to and from the heating element 106, which is embedded in the substrate support 101. The heating element 106 may be a resistive heating element having any pattern laterally across the substrate support. The heating element 106 may be disposed in any layer and/or plate of the substrate support 101. Some examples of the heater terminal assemblies 102 are shown in FIGs. 2-18.

[0062] The substrate processing system 100 includes a processing chamber 107 that encloses components of the substrate processing system 100. The processing chamber 107 may have and/or be connected to a facility plate 108. The substrate processing system 100 includes a first electrode and a second electrode. The substrate support 101 may be configured and implemented as or include the first electrode. A showerhead 112 may be configured and implemented as or include the second electrode. A substrate 118 is arranged on the substrate support 101 between the first electrode and the second electrode during processing.

[0063] The showerhead 112 introduces and distributes process gases. The substrate support may receive a backside (or bottom side) gas provided to the backside (or bottom) of the substrate 118. The showerhead 112 distributes gases to the front (or top) side of the substrate 118. The showerhead 112 includes a stem 121 that may receive processing fluids and directs the processing fluids through holes in a faceplate 129 of the showerhead 112, which in turn directs the fluids at the substrate 118.

[0064] The substrate support 101 includes a support shaft 130 that may receive backside gas, which is directed out holes in a top plate 132 of the substrate support 101 and directed at the substrate 118. The body of the substrate support 101 may be implemented as the second electrode and receive electrical current via the power lines 105. As an alternative, the second electrode may be conductive and embedded within a non-conductive portion of the substrate support. As another alternative, the substrate support 101 may include a conductive plate that acts as the second electrode.

[0065] A radio frequency (RF) generating system 126 generates and outputs an RF voltage to the first electrode 108 and/or the second electrode when plasma is used. In some examples, one of the first electrode and the second electrode may be DC grounded, AC grounded, or at a floating potential. For example, the RF generating system 126 may include one or more RF voltage generators (e.g., a capacitively- coupled plasma RF power generator, a bias RF power generator, and/or other RF power generator) such as an RF voltage generator 128 that generate RF voltages. The RF voltages are fed by one or more matching and distribution networks 131 to the second electrode and/or the first electrode. For example, as shown, the RF voltage generator 128 provides an RF and/or bias voltage to the second electrode. The second electrode may receive power alternatively or additionally from other power sources, such as the power source 134. In other examples, an RF voltage may be supplied to the first electrode or the first electrode may be connected to a ground reference.

[0066] An example gas delivery system 140 comprises one or more gas sources 144- 1 , 144-2, ..., and 144-N (collectively gas sources 144), where N is an integer greater than zero. The gas sources 144 supply one or more gases (e.g., precursors, inert gases, etc.) and mixtures thereof. Vaporized precursor may also be used. At least one of the gas sources 144 may contain gases used in the pre-treatment process of the present disclosure (e.g., NH3, N2, etc.). The gas sources 144 are connected by valves 148-1 , 148-2, ..., and 148-N (collectively valves 148) and mass flow controllers 152-1 , 152-2, ..., and 152-N (collectively mass flow controllers 152) to a manifold 154. An output of the manifold 154 is fed to the processing chamber 107. For example, the output of the manifold 154 may be fed to the pedestal and/or the showerhead 124.

[0067] In some examples, an optional ozone generator 156 may be provided between the mass flow controllers 152 and the manifold 154. In some examples, the substrate processing system 100 may comprise a liquid precursor delivery system 158. The liquid precursor delivery system 158 may be incorporated within the gas delivery system 140 as shown or may be external to the gas delivery system 140. The liquid precursor delivery system 158 is configured to provide precursors that are liquid and/or solid at room temperature via a bubbler, direct liquid injection, vapor draw, etc.

[0068] A valve 164 and pump 168 may be used to evacuate reactants from the processing chamber 107. A controller 172 may be used to control various components of the substrate processing system 100. For example only, the controller 172 may be used to control flow of process, carrier, and precursor gases, striking and extinguishing plasma, removal of reactants, monitoring of chamber parameters, etc. The controller 172 may receive measurement signals indicative of process parameters, conditions within the processing chamber 107, etc. via one or more sensors 174 arranged throughout the substrate processing system 100.

[0069] The following FIGs. 2-4 include example substrate supports with heater terminal assemblies. The heater terminal assemblies are provided as illustrative representative examples and are not drawn to scale and are actually narrower in width relative to the substrate supports than as shown. Although the substrate supports of FIGs. 2-4 are shown including heater terminal assemblies similar to that shown in FIGs. 12-13, the substrate supports may include any of the heater terminal assemblies disclosed herein, which extend to and contact the heating elements of the substrate supports of FIGs. 2-4. Although the heating elements of FIGs. 2-4 and 5-18 are shown in certain layers and/or plates of substrate supports, the heating elements may be in any layer and/or plate of the substrate supports. Any number of heating elements may be included in each layer and/or plate of a substrate support. A pair of heater terminal assemblies is provided for each heating element including a first heater terminal assembly to supply electrical current to the heating element and a second heater terminal assembly to return electrical current from the heating element.

[0070] FIG. 2 shows a substrate support 200 including example heater terminal assemblies 202 contacting a heating element 204 embedded in a top plate 206 of the substrate support 200. An adhesive layer 208 is disposed between the top plate 206 and a base plate 210 and bonds the top plate 206 to the base plate 210. The top plate 206 may be formed of a different material than the base plate 210. As an example, the top plate 206 may be formed of ceramic and the base plate 210 may be formed of aluminum. Plugs 212 extend through a facility plate and/or process chamber wall 214 and supply electrical current to the heater terminal assemblies 202. Each of the heater terminal assemblies 202 includes a series of conductive components and/or elements 220 that provide current from one of the plugs 212 to the heating element 204 or from the heating element 204 to one of the plugs 212. These conductive components and/or elements 220 are further described below with respect to FIGs. 5-18. The conductive components and/or elements 220 are disposed within one or more insulators 222 that electrically separate the conductive components and/or elements 220 from the plates 206, 210 and adhesive layer 208.

[0071] FIG. 3 shows a substrate support 300 including example heater terminal assemblies 302 contacting a heating element 304 disposed on a base plate 306 of the substrate support 300. A top plate 308 is disposed on the base plate 306 and adhered to the base plate 306 via an adhesive layer 310. The top plate 308 may be formed of a different material than the base plate 306. As an example, the top plate 308 may be formed of ceramic and the base plate 306 may be formed of aluminum. The heating element 304 is laminated via one or more lamination layers 311 . The lamination layers 311 may coat and/or cover the heating element 304. The heating element 304 may be laminated onto a top surface of the base plate 306. The heating element 304 may be embedded in a lamination material such that there are lamination layers above and below the heating element 304 as shown. This separates the heating element 304 from contacting the base plate 306. If the base plate is not electrically conductive and not implemented as an electrode, then the heating element 304 may be disposed on and contact the base plate 306 and a single lamination layer may be formed over the heating element 304.

[0072] Plugs 312 extend through a facility plate and/or process chamber wall 314 and supply electrical current to the heater terminal assemblies 302. Each of the heater terminal assemblies 302 includes a series of conductive components and/or elements 320 that provide current from one of the plugs 312 to the heating element 304 or from the heating element 304 to one of the plugs 312. These conductive components and/or elements 320 are further described below with respect to FIGs. 5-18. The conductive components and/or elements 320 are disposed within one or more insulators 322 that electrically separate the conductive components and/or elements 320 from the plates 306, 308 and adhesive layer 310.

[0073] FIG. 4 shows a substrate support 400 including example heater terminal assemblies 402 contacting a heating element 404 disposed below a top plate 406 of the substrate support 408. The top plate 406 is disposed on a base plate 408 and adhered to the base plate 408 via an adhesive layer 410. The top plate 406 may be formed of a different material than the base plate 408. As an example, the top plate 406 may be formed of ceramic and the base plate 408 may be formed of aluminum. The heating element 404 is laminated via one or more lamination layers 411 . The lamination layers 411 may coat and/or cover the heating element 404. The heating element 404 may be laminated onto a bottom surface of the top plate 406. The heating element 404 may be embedded in a lamination material such that there are lamination layers above and below the heating element 404 as shown. This separates the heating element 304 from contacting the top plate 406. If the top plate is not electrically conductive and not implemented as an electrode, then the heating element 404 may be disposed on and contact the base plate 408 and a single lamination layer may be formed over the heating element 404. [0074] Plugs 412 extend through a facility plate and/or process chamber wall 414 and supply electrical current to the heater terminal assemblies 402. Each of the heater terminal assemblies 402 includes a series of conductive components and/or elements 420 that provide current from one of the plugs 412 to the heating element 404 or from the heating element 404 to one of the plugs 412. These conductive components and/or elements 420 are further described below with respect to FIGs. 5-18. The conductive components and/or elements 420 are disposed within one or more insulators 422 that electrically separate the conductive components and/or elements 420 from the plates 406, 408 and adhesive layer 410.

[0075] FIG. 5 shows a portion 500 of a substrate support having an example heater terminal assembly 502. The substrate support includes a base plate 504, a top plate 506 disposed on and adhered to the base plate via an adhesive layer 508. The heater terminal assembly 502 electrically connects a plug 510 to a heating element 512. The heating element 512 is shown in this example being embedded in the top plate 506 but may be located in the adhesive layer 508 or in the base plate 504. The plug 510 may be a banana plug with spring like metal foils 511 that apply pressure on an interior of a socket 514. The plug 510 may be part of a connector 513, extend through a chamber wall or facility plate 515, and receives power as described above.

[0076] The heater terminal assembly 502 includes a series of conductive components including: the socket 514; and a hinge assembly 517 including a lower (or first) element 516, an upper T-shaped (or second) element 518, and hinge (or joint) 520. The second element 518 is a heater contact terminal. The hinge 520 may be a ball hinge, such as that shown in FIG. 6. The hinge 520 allows the second element 518 to shift relative to the first element 516 and thus slide laterally and/or horizontally relative to the heating element 512. The second element 518 may rotate about one or more axes, such as X and Y axes, relative to the first element 516, as represented by arrows 522. This movement of the second element 518 allows the second element 518 to maintain contact with the top plate 506 during thermal cycling of the substrate support. The hinge assembly 517 eliminates the need for a terminal to be soldered to the top plate.

[0077] The conductive components 514, 516, 518, 520 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The conductive components 514, 516, 518, 520 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc. [0078] The heater terminal assembly 502 further includes an insulator 530. The insulator 530 may be stepped as shown and includes a step 532 with threads 534. A spring washer 536 may be disposed on the step 532 and prevent the insulator 530 from unscrewing from the base plate 504. The spring washer 536 aids in maintaining contact between the insulator 530 and the base plate 504 and eliminates the need for epoxy, which allows the heater terminal assembly 502 to be unscrewed from the substrate support. The insulator 530 separates the conductive components from the base plate 504, which prevents electrical interaction and/or arcing between the conductive components 514, 516, 518, 520 and the base plate 504, which may be at a different voltage than the conductive components 514, 516, 518, 520. The conductive components 514, 516, 518, 520 may be at a first alternating current (AC) voltage and the base plate 504 may be at a second voltage (e.g., radio frequency (RF) voltage).

[0079] The top plate 506, the adhesive layer 508, and the insulator 530 may define an inner cavity 540. The conductive components 514, 516, 518, 520 are disposed in the inner cavity 540. In an embodiment, the inner cavity 540 is filled with air. In one embodiment, the inner cavity 540 is filled with a flexible insulative material.

[0080] FIG. 6 shows a portion 600 of a substrate support having an example heater terminal assembly 602. The heater terminal assembly 602 is an example of the heater terminal assembly 502 of FIG. 5 including a ball hinge 620. The substrate support includes the base plate 504, the top plate 506 and the adhesive layer 508. The heater terminal assembly 602 electrically connects the plug 510 to the heating element 512. The heater terminal assembly 602 includes conductive components including the socket 514 and the ball hinge 620. The ball hinge 620 includes a first element 616, a second element 618 with a spherically shaped end 622. The spherically shaped end 622 sits in a socket 624 of the first element 616 shaped to cover a portion of the spherically shaped end 622. The spherically shaped end 622 allows the second end 618 to rotate relative to the first element 616. The heater terminal assembly 602 further includes the insulator 530, the step 532, and spring washer 536.

[0081] FIG. 7 shows a portion 700 of a substrate support having an example heater terminal assembly 702. The substrate support includes a base plate 704, a top plate 706 disposed on and adhered to the base plate 704 via an adhesive layer 708, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 702 electrically connects a plug 710 to a heating element 712. The heating element 712 is shown in this example being embedded in the top plate 706 but may be located in the adhesive layer 708 or in the base plate 704. The plug 710 may be a banana plug with spring like metal foils 711 that apply pressure on an interior of a socket 714. The plug 710 may be part of a connector 713, extend through a chamber wall or facility plate 715, and receives power as described above.

[0082] The heater terminal assembly 702 includes a series of conductive components including: the socket 714; an intermediary element 717; and a floating reciprocating pin assembly 718 including housing 720, a spring 722, a ball bearing 724, and a pin 726 that is contact with the heating element 712. The ball bearing 724 is disposed on circular shaped member 723 (e.g., a ring or disc), which is disposed on the spring 722, and is in contact with the pin 726. The pin 726 is a heater contact element. In an embodiment, the pin 726 is a floating spring-loaded reciprocating pin, such as a pogo pin. The pin 726 has an angled bottom surface 725 that rides on the ball bearing 724. The spring 722 applies force on the ball bearing 724 and thus the pin 726 such that the pin 726 maintains electrical contact with the heating element 712. The spring 722 is disposed in the housing 720. The ball bearing 724 and a lower portion 727 of the pin 726 are disposed in an inner cup 728, which is in the housing 720. The pin 726 extends through a hole 729 in the inner cup 728. The lower portion 727 of the pin 726 is larger than the size of the hole 729, which keeps the bottom portion in the inner cup 728.

[0083] A first gap G1 exists between the inner cup 728 and a side wall 731 of the housing 720. A second gap G2 may exist between the lower portion 727 and a side wall 733 of the inner cup 728. The gaps G1 and G2 and inner diameter of the hole 729 are sized to allow the pin 726 to “float” and thus move laterally and/or horizontally relative to the heating element 712. In an embodiment, an outer diameter D1 of the portion of the pin 726 that extends through the hole 729 is less than an inner diameter of the hole 729 to allow lateral movement of the pin 726 relative to the housing 720 and inner cup 728. This may occur during thermal cycling of the substrate support.

[0084] The conductive components 714, 717, 722, 723, 724, 726 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The conductive components 714, 717, 722, 723, 724, 726 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc. [0085] The heater terminal assembly 702 further includes an insulator 730. The insulator 730 may be stepped as shown and includes a step 732 with threads 734. A spring washer 736 may be disposed on the step 732 and prevent the insulator 730 from unscrewing from the base plate 704. The insulator 730 separates the conductive components from the base plate 704, which prevents electrical interaction and/or arcing between the conductive components 714, 717, 722, 723, 724, 726 and the base plate 704, which may be at a different voltage than the conductive components 714, 717, 722, 723, 724, 726. The conductive components 714, 717, 722, 723, 724, 726 may be at a first AC voltage and the base plate 704 may be at a second voltage (e.g., RF voltage).

[0086] The top plate 706, the adhesive layer 708, and the insulator 730 may define an inner cavity 740. The conductive components 714, 717 and the floating pin assembly 718 are disposed in the inner cavity 740. In an embodiment, the inner cavity 740 is filled with air. In one embodiment, the inner cavity 740 is filled with a flexible insulative material.

[0087] FIG. 8 shows a portion 800 of a substrate support having an example heater terminal assembly 802 that is similar to the heater terminal assembly 702 of FIG. 7 but includes a pin assembly 818. The heater terminal assembly 802 electrically connects the plug 710 to the heating element 712. The pin assembly 818 includes a pin 826 having a heater contact bearing 850, which is held in a cupped end of the pin 826 and is able to rotate. The heater contact bearing 850 is a heater contact element. The heater contact bearing 850, in addition to the gaps G1 , G2 referred to with respect to FIG. 7, further aids in allowing the pin 726 to move laterally relative to the heating element 712. The heater terminal assembly 802 includes the socket 714, the intermediary component 717, the pin assembly 818, insulator 730 and spring washer 736. The pin assembly 818 includes the housing 720, spring 722, circular shaped member 723, ball bearing 724, cup 728, and pin 826.

[0088] FIG. 9 shows a portion 900 of a substrate support having an example heater terminal assembly 902. The substrate support includes a base plate 904, a top plate 906 disposed on and adhered to the base plate 904 via an adhesive layer 908, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 902 electrically connects a plug 910 to a heating element 912. The heating element 912 is shown in this example being embedded in the top plate 906 but may be located in the adhesive layer 908 or in the base plate 904. The plug 910 may be a banana plug with spring like metal foils 911 that apply pressure on an interior of a socket 914. The plug 910 may be part of a connector 913, extend through a chamber wall or facility plate 915, and receives power as described above.

[0089] The heater terminal assembly 902 includes a series of conductive components including: the socket 914; and a connecting spring 917. The connecting spring 917 is a heater contact element. A contact terminal 919 is in contact with and fixed to the heating element 912 and is in contact with the connecting spring 917. The socket 914 has an upper cupped end 920. The contact terminal 919 has a lower cupped end 922. The connecting spring 917 has ends that sit respectively in and contact the cupped ends 920, 922. The cupped ends 920, 922 keep the connecting spring 917 in contact with the cupped ends 920, 922 while allowing the connecting spring 917 to move laterally and/or horizontally relative to the cupped ends 920, 922 during thermal cycling of the substrate support. The contact terminal 919 may be soldered or brazed to the heating element 912.

[0090] The conductive components 914, 917, 919 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The conductive components 914, 917, 919 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc.

[0091] The heater terminal assembly 902 further includes an insulator 930. The insulator 930 may be stepped as shown and includes a step 932 with threads 934. A spring washer 936 may be disposed on the step 932 and prevent the insulator 930 from unscrewing from the base plate 904. The insulator 930 separates the conductive components from the base plate 904, which prevents electrical interaction and/or arcing between the conductive components 914, 917, 919 and the base plate 904, which may be at a different voltage than the conductive components 914, 917, 919. The conductive components 914, 917, 919 may be at a first AC voltage and the base plate 904 may be at a second voltage (e.g., RF voltage).

[0092] The top plate 906, the adhesive layer 908, and the insulator 930 may define an inner cavity 940. The conductive components 914, 917, 919 are disposed in the cavity 940. In an embodiment, the inner cavity 940 is filled with air. In one embodiment, the inner cavity 940 is filled with a flexible insulative material. [0093] FIGS. 10-11 show a portion 1000 of a substrate support having an example heater terminal assembly 1002. The substrate support includes a base plate 1004, a top plate 1006 disposed on and adhered to the base plate 1004 via an adhesive layer 1008, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 1002 electrically connects a plug 1010 to a heating element 1012. The heating element 1012 is shown in this example being embedded in the top plate 1006 but may be located in the adhesive layer 1008 or in the base plate 1004. The plug 1010 may be a banana plug with spring like metal foils 1011 that apply pressure on an interior of a socket 1014. The plug 1010 may be part of a connector 1013, extend through a chamber wall or facility plate 1015, and receives power as described above.

[0094] The heater terminal assembly 1002 includes a series of conductive components including the socket 1014, a connecting spring 1017, an intermediary component 1018, and a guide tube 1019. The connecting spring 1017 is in contact with and fixed to the heating element 1012 and thus is a heater contact element. The connecting spring 1017 is flexible, connected to the intermediary component 1018 and can move laterally and/or horizontally relative to the heating element 1012. The socket 1014 and intermediary component 1018 may be disposed in the guide tube 1019. The guide tube 1019 is an insulator and may extend a partial length of an inner cavity 1040 in which the connecting spring 1017 is disposed or a full length of the inner cavity 1040, as shown in FIG. 11. The guide tube 1019 contacts the connecting spring 1017, the intermediary component 1018 and the socket 1014. The guide tube 1019 may extend up to the heating element 1012. In FIG. 11 , the guide tube is designated 1019’. Electrical current passes through the socket 1014, the intermediary component 1018 and the spring 1017.

[0095] The conductive components 1014, 1017, 1018 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The conductive components 1014, 1017, 1018 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc.

[0096] The heater terminal assembly 1002 further includes an insulator 1030. The insulator 1030 may be stepped as shown and includes a step 1032 with threads 1034. A spring washer 1036 may be disposed on the step 1032 and prevent the insulator 1030 from unscrewing from the base plate 1004. The insulator 1030 separates the conductive components from the base plate 1004, which prevents electrical interaction and/or arcing between the conductive components 1014, 1017, 1018 and the base plate 1004, which may be at a different voltage than the conductive components 1014, 1017, 1018. The conductive components 1014, 1017, 1018 may be at a first AC voltage and the base plate 1004 may be at a second voltage (e.g., RF voltage).

[0097] The top plate 1006, the adhesive layer 1008, and the insulator 1030 may define the inner cavity 1040. The conductive components 1014, 1017, 1018 are disposed in the cavity 1040. In an embodiment, the inner cavity 1040 is filled with air. In one embodiment, the inner cavity 1040 is filled with a flexible insulative material.

[0098] The insulator 1030 may be referred to as a first outer insulator and the insulator 1019 may be referred to as a second insulator. A first insulator 1030 may be disposed in the base plate 1004 between the insulator 1019 and the base plate 1004.

[0099] FIGs. 12-13 show a portion 1200 of a substrate support having an example heater terminal assembly 1202. The substrate support includes a base plate 1204, a top plate 1206 disposed on and adhered to the base plate 1204 via an adhesive layer 1208, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 1202 electrically connects a plug 1210 to a heating element 1212. The heating element 1212 is shown in this example being embedded in the top plate 1206 but may be located in the adhesive layer 1208 or in the base plate 1204. The plug 1210 may be a banana plug with spring like metal foils 1211 that apply pressure on an interior of a socket 1214. The plug 1210 may be part of a connector 1213, extend through a chamber wall or facility plate 1215, and receives power as described above.

[0100] The heater terminal assembly 1202 includes a series of conductive components including: the socket 1214 and a contact element 1217 that is in contact with the heating element 1212. The contact element 1217 is a heater contact element. In an embodiment, the contact element 1217 is an element formed of electrical connection material, similar to or the same as a fuzz button™, as further described below. In FIG. 12 the contact element 1217 is in a shifted (or offset) orientation. In FIG. 13 the contact element 1217 is in a nominal (or upright) orientation. FIG. 12 illustrates how the contact element 1217 can flex and maintain contact with the heating element 1212. The contact element 1217 applies pressure vertically against the top plate 1206 and socket 1214. A bottom portion 1218 of the contact element 1217 is disposed in an upper cupped portion 1219 of the socket 1214. The contact element 1217 may be formed of electrically conductive material including copper, beryllium, gold, etc. (e.g., gold-plated beryllium copper). The electrically conductive material may be compressed into a dense sponge-like material, which may be cylindrically shaped. This holds true for each element referred to herein that may be implemented as a fuzz button™ and/or the like.

[0101] The socket 1214 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The socket 1214 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc.

[0102] The heater terminal assembly 1202 further includes an insulator 1230. The insulator 1230 may be stepped as shown and includes a step 1232 with threads 1234. A spring washer 1236 may be disposed on the step 1232 and prevent the insulator 1230 from unscrewing from the base plate 1204. The insulator 1230 separates the conductive components from the base plate 1204, which prevents electrical interaction and/or arcing between i) the socket 1214 and the contact element 1217 and ii) the base plate 1204, which may be at a different voltage than the socket 1214 and the contact element 1217. The socket 1214 and the contact element 1217 may be at a first AC voltage and the base plate 1204 may be at a second voltage (e.g., RF voltage).

[0103] The top plate 1206, the adhesive layer 1208, and the insulator 1230 may define an inner cavity 1240. The socket 1214 and the contact element 1217 are disposed in the cavity 1240. In an embodiment, the inner cavity 1240 is filled with air. In one embodiment, the inner cavity 1240 is filled with a flexible insulative material.

[0104] The heater terminal assembly 1202 may also include a cylindrically shaped insulator 1250 that is disposed between the top plate 1206 and an upper portion 1252 of the contact element 1217. The cylindrically shaped insulator 1250 separates the contact element 1217 from the top plate 1206.

[0105] FIG. 14 shows a portion 1400 of a substrate support having an example heater terminal assembly 1402. The substrate support includes a base plate 1404, a top plate 1406 disposed on and adhered to the base plate 1404 via an adhesive layer 1408, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 1402 electrically connects a plug 1410 to a heating element 1412. The heating element 1412 is shown in this example being embedded in the top plate 1406 but may be located in the adhesive layer 1408 or in the base plate 1404. The plug 1410 may be a banana plug with spring like metal foils 1411 that apply pressure on an interior of a socket 1414. The plug 1410 may be part of a connector 1413, extend through a chamber wall or facility plate 1415, and receives power as described above.

[0106] The heater terminal assembly 1402 includes a series of conductive components including: the socket 1414, a conductive element 1417, an intermediary element 1418, which may be T-shaped as shown, and a bearing contact element 1419. In an embodiment, the conductive element 1417 is an element formed of electrical connection material, similar to or the same as a fuzz button™. The intermediary element 1418 includes a base 1420 and a cupped upper segment 1421. The bearing contact element 1419 is in contact with the heating element 1412 and thus is a heater contact element. The conductive element 1417 applies pressure on the intermediary element 1418, which applies pressure on the bearing contact element 1419. The conductive element 1417 may be formed of electrically conductive material including copper, beryllium, gold, etc. (e.g., gold-plated beryllium copper). The material may be compressed into a dense sponge-like material, which may be cylindrically shaped. The conductive element 1417 and a portion of the base 1420 are disposed in and held by a cupped upper portion 1423 of the socket 1414.

[0107] The socket 1414 and the intermediary element 1418 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The socket 1414 and the intermediary element 1418 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc.

[0108] The heater terminal assembly 1402 further includes an insulator 1430. The insulator 1430 may be stepped as shown and includes a step 1432 with threads 1434. A spring washer 1436 may be disposed on the step 1432 and prevent the insulator 1430 from unscrewing from the base plate 1404. The insulator 1430 separates the conductive components 1414, 1417, 1418, 1419 from the base plate 1404, which prevents electrical interaction and/or arcing between i) the conductive components 1414, 1417, 1418, 1419 and ii) the base plate 1404, which may be at a different voltage than the conductive components 1414, 1417, 1418, 1419. The conductive components 1414, 1417, 1418, 1419 may be at a first AC voltage and the base plate 1404 may be at a second voltage (e.g., RF voltage).

[0109] The top plate 1406, the adhesive layer 1408, and the insulator 1430 may define an inner cavity 1440. The conductive elements 1414, 1417, 1418, 1419 are disposed in the inner 1440. In an embodiment, the inner cavity 1440 is filled with air. In one embodiment, the inner cavity 1440 is filled with a flexible insulative material.

[0110] The heater terminal assembly 1402 may also include a cylindrically shaped insulator 1450 that is disposed between i) the top plate 1406 and ii) the upper segment 1421 and the bearing contact element 1419. The cylindrically shaped insulator 1250 separates i) the top plate 1406 from ii) the upper segment 1421 and the bearing contact element 1419.

[0111] FIG. 15 shows a portion 1500 of a substrate support having an example heater terminal assembly 1502 that is similar to the heater terminal assembly 1402 of Fig. 14 except the bearing contact element 1419 is not included. The heater terminal assembly 1502 electrically connects the plug 1410 to the heating element 1412. The heater terminal assembly 1502 includes the socket 1414, the conductive component 1417, a contact element 1519, the insulator 1430, spring washer 1436 and the cylindrically shaped insulator 1450. The contact element 1519 may be T-shaped and be a non- compliant nonfixed contact element. The contact element 1519 is a heater contact element. An upper end of the contact element 1519 is flat and contacts the heating element 1512 and is able to move relative to the heating element 1512.

[0112] FIG. 16 shows a portion 1600 of a substrate support having an example heater terminal assembly 1602 that is similar to the heater terminal assembly 702 of FIG. 7, except the heater terminal assembly 1602 includes a different pin assembly 1618. The substrate support includes a base plate 1604, a top plate 1606 disposed on and adhered to the base plate 1604 via an adhesive layer 1608, similar to the plates 504, 506 and adhesive layer 508 of FIG. 5. The heater terminal assembly 702 electrically connects a plug 1610 to a heating element 1612. The heating element 612 is shown in this example being embedded in the top plate 1606 but may be located in the adhesive layer 1608 or in the base plate 1604. The plug 1610 may be a banana plug with spring like metal foils 1611 that apply pressure on an interior of a socket 1614. The plug 1610 may be part of a connector 1613, extend through a chamber wall or facility plate 1615, and receives power as described above.

[0113] The heater terminal assembly 1602 includes a series of conductive components including: the socket 1614; an intermediary element 1617; and the pin assembly 1618 including housing 1620, a spring 1622, a ball bearing 1624, and a pin 1626 that is contact with the heating element 1612. The pin 1626 is a heater contact element. The ball bearing 1624 is disposed on circular shaped member 1623 (e.g., a ring or disc), which is disposed on the spring 1622, and is in contact with the pin 1626. The pin 1626 has an angled bottom surface 1625 that rides on the ball bearing 1624. The spring 1622 applies force on the ball bearing 1624 and thus the pin 1626 such that the pin 1626 maintains electrical contact with the heating element 1612. The spring

1622, the ball bearing 1624, and the pin 1626 are disposed in the housing 1620. The pin 1626 extends through a hole 1629 in the housing 1620.

[0114] The conductive components 1614, 1617, 1622, 1623, 1624 may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The conductive components 1614, 1617, 1622,

1623, 1624 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc. The pin 1626 may be formed of electrically conductive material, as disclosed herein and may be implemented as a fuzz button™. The pin 1626 may apply force on the heating element 1612 due to the spring force of the spring 1622 or force from the pin 1626, which may be in a state of compression.

[0115] The heater terminal assembly 1602 further includes an insulator 1630. The insulator 1630 may be stepped as shown and includes a step 1632 with threads 1634. A spring washer 1636 may be disposed on the step 1632 and prevent the insulator 1630 from unscrewing from the base plate 1604. The insulator 1630 separates the conductive components from the base plate 1604, which prevents electrical interaction and/or arcing between the conductive components 1614, 1617, 1622, 1623, 1624, 1626 and the base plate 1604, which may be at a different voltage than the conductive components 1614, 1617, 1622, 1623, 1624, 1626. The conductive components 1614, 1617, 1622, 1623, 1624, 1626 may be at a first AC voltage and the base plate 1604 may be at a second voltage (e.g., RF voltage).

[0116] The top plate 1606, the adhesive layer 708, and the insulator 730 may define an inner cavity 1640. The conductive components 1614, 1617 and the pin assembly 1618 are disposed in the inner cavity 1640. In an embodiment, the inner cavity 1640 is filled with air. In one embodiment, the inner cavity 1640 is filled with a flexible insulative material.

[0117] FIG. 17 shows a portion 1700 of a substrate support having an example heater terminal assembly 1702 that is similar to the heater terminal assembly 1602 of FIG. 16 except the spring 1622 and circular shaped member 1623 are replaced with a deformation element 1722, which applies pressure on the ball bearing 1624. In an embodiment, the deformation element 1722 is an element formed of electrical connection material, similar to or the same as a fuzz button™. The substrate support includes the plates 1604, 1606 and adhesive layer 1608. The heater terminal assembly 1702 includes the socket 1614, the intermediary element 1617, and a pin assembly 1718. The pin assembly 1718 includes the deformation element 1722, the ball bearing 1624, and the pin 1626. The pin 1626 may be formed of electrically conductive material and be implemented as a fuzz button.

[0118] FIG. 18 shows a portion 1800 of a substrate support having an example heater terminal assembly 1802 that is similar to the heater terminal assembly 1602 of FIG. 16 except the contact element 1626 is replaced with an intermediary element 1827 and a bearing contact element 1829, which is in contact with the heating element 1612. The intermediary element 1827 and bearing contact element 1829 may be referred to as a pin. The substrate support includes the plates 1604, 1606 and adhesive layer 1608. The heater terminal assembly 1802 includes the socket 1614, the intermediary element 1617, and a pin assembly 1818. The pin assembly 1818 includes the spring 1622, the circular shaped member 1623, the ball bearing 1624, the intermediary element 1827, and the bearing contact element 1829.

[0119] The bearing contact element 1829 is a heater contact element and may be formed of copper, aluminum, one or more copper alloys, one or more aluminum alloys, and/or one or more other conductive materials. The bearing contact element 1829 may be coated with a conductive material such as nickel (Ni) plating, gold (Au) plating, etc.

[0120] The above-described examples include heater terminal assemblies that may be easily removed from substrate supports and serviced and/or replaced. The heater terminal assemblies include components and/or elements that are able to move relative to plates and layers of the substrate supports.

[0121] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and/or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0122] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0123] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and/or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and/or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and/or load locks connected to or interfaced with a specific system. [0124] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, non-transitory memory, and/or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and/or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or dies of a wafer.

[0125] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and/or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber. [0126] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and/or manufacturing of semiconductor wafers.

[0127] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and/or load ports in a semiconductor manufacturing factory.

Claims

CLAIMS What is claimed is:

1 . A heater terminal assembly for a substrate support of a substrate processing system, the heater terminal assembly comprising: an insulator configured to screw into a base plate of the substrate support; a socket disposed within the insulator and configured to conduct electrical current for heating a heating element disposed in the substrate support; and a heater terminal disposed within the insulator and configured to move relative to the substrate support and maintain contact with the heating element, wherein the heater terminal conducts electrical current between the socket and the heating element.

2. The heater terminal assembly of claim 1 , further comprising a hinge assembly comprising the heater terminal, a conductive element, and a hinge, wherein the conductive element is connected to the socket, and wherein the heater terminal is not attached to the heating element and is configured to move via the hinge relative to the heating element and the conductive element.

3. The heater terminal assembly of claim 2, wherein the hinge is a ball hinge permitting movement rotation of the heater terminal about an X axis and a Y axis relative to the conductive element.

4. The heater terminal assembly of claim 2, wherein the hinge assembly is conductive of electrical current between the socket and the heater terminal.

5. The heater terminal assembly of claim 1 , further comprising a pin assembly comprising the heater terminal and conducting electrical current between the socket and the heater terminal.

6. The heater terminal assembly of claim 5, wherein the pin assembly comprises: a spring in contact with the socket; and a ball bearing, wherein the heater terminal is implemented as a pin in contact with but not attached to the heating element.

7. The heater terminal assembly of claim 6, wherein the pin is formed of at least one of copper, aluminum, and electrically conductive material.

8. The heater terminal assembly of claim 6, wherein the pin comprises a nickel coating or a gold coating.

9. The heater terminal assembly of claim 5, wherein the pin assembly comprises: a conductive element in contact with the socket; and a ball bearing, wherein the heating element is implemented as a pin in contact with but not attached to the heating element.

10. The heater terminal assembly of claim 9, wherein the pin is formed of at least one of copper, aluminum, and electrically conductive material.

11 . The heater terminal assembly of claim 9, wherein the pin comprises a nickel coating or a gold coating.

12. The heater terminal assembly of claim 5, wherein the pin assembly comprises: a spring in contact with the socket; and a ball bearing, wherein the heater terminal is implemented as a pin having a bearing contact element in contact with and movable relative to the heating element.

13. The heater terminal assembly of claim 5, wherein: the pin assembly comprises a housing, a ball bearing, the heater terminal, and an inner cup, wherein the heater terminal is implemented as a pin; at least a portion of the ball bearing and at least a portion of the pin are disposed in the inner cup; and the inner cup is disposed within the housing.

14. The heater terminal assembly of claim 13, wherein the pin assembly further comprises a spring that is not disposed in the inner cup but is disposed within the housing.

15. The heater terminal assembly of claim 13, wherein: a first gap exists between the inner cup and the housing; a second gap exists between the pin and the inner cup; and movement of the pin relative to the heating element is limited based on sizes of the first gap and the second gap.

16. The heater terminal assembly of claim 13, wherein: the inner cup comprises a hole; and the pin extends through the hole.

17. The heater terminal assembly of claim 16, wherein an outer diameter of the pin is less than a diameter of the hole to allow lateral movement of the pin relative to the housing and the inner cup.

18. The heater terminal assembly of claim 1 , further comprising an intermediary component in contact with the socket, wherein the heater terminal is implemented as a spring in contact with the intermediary component and the heating element and conducting electrical current between the intermediary component and the heating element.

19. The heater terminal assembly of claim 18, further comprising a guide tube disposed between i) the insulator and ii) the socket, the intermediary component, and the spring.

20. The heater terminal assembly of claim 19, wherein the guide tube does not extend to and does not contact the heating element.

21 . The heater terminal assembly of claim 19, wherein the guide tube does extend to the heating element.

22. The heater terminal assembly of claim 1 , wherein the heater terminal is implemented as a conductive element extending between the heating element and the socket and applying pressure on the heating element and the socket to maintain electrical contact between the heating element and the socket.

23. The heater terminal assembly of claim 22, wherein the socket comprises a cupshaped upper portion that holds a portion of the conductive element.

24. The heater terminal assembly of claim 22, wherein the conductive element contacts but is not attached to the heating element.

25. The heater terminal assembly of claim 1 , further comprising: a conductive element in contact with the socket; and an intermediary element in contact with the conductive element, wherein the heater terminal is implemented as a bearing contact element in contact with the intermediary element and the heating element.

26. The heater terminal assembly of claim 1 , further comprising: a conductive element in contact with the socket; and an intermediary element in contact with the conductive element and the heating element.

27. A substrate support comprising: the heater terminal assembly of claim 1 ; the base plate; and a top plate disposed on and adhered to the base plate via an adhesive layer, wherein the heater terminal assembly screws into the base plate.

28. The substrate support of claim 27, wherein the heating element is disposed in the top plate, the adhesive layer, or the base plate.

29. The substrate support of claim 27, wherein the heating element is laminated to a bottom of the top plate or to a top of the base plate.

30. The substrate support of claim 27, further comprising a spring washer disposed between the heater terminal assembly and the base plate.

31. The substrate support of claim 27, wherein the heater terminal assembly is not epoxied to the substrate support.

32. The substrate support of claim 27, further comprising another insulator disposed between a portion of the top plate and the heater terminal, wherein the portion of the top plate is below the heating element.

33. A heater terminal assembly for a substrate support of a substrate processing system, the heater terminal assembly comprising: an insulator configured to screw into a base plate of the substrate support; a socket disposed within the insulator and configured to conduct electrical current for heating a heating element disposed in the substrate support; and a flexible connector disposed within the insulator and extending from the socket to a heater terminal attached to the heating element, wherein the flexible connector is configured to conduct electrical current between the socket and the heater terminal, move relative to the socket and the heater terminal, and maintain contact with the socket and the heating element.

34. The heater terminal assembly of claim 33, wherein an upper portion of the socket is cupped to receive and maintain contact with the flexible connector.

35. The heater terminal assembly of claim 33, wherein a lower portion of the heater terminal is cupped to receive and maintain contact with the flexible connector.

36. The heater terminal assembly of claim 33, wherein the flexible connector is a spring.

37. A substrate support comprising: the heater terminal assembly of claim 33; the base plate; and a top plate disposed on and adhered to the base plate via an adhesive layer, wherein the heater terminal assembly screws into the base plate.

38. The substrate support of claim 37, further comprising the heater terminal, which is attached to the heating element.

39. The substrate support of claim 38, wherein the heater terminal is soldered or brazed to the heating element.

40. The substrate support of claim 37, wherein the heating element is disposed in the top plate, the adhesive layer, or the base plate.

41 . The substrate support of claim 37, wherein the heating element is laminated to a bottom of the top plate or to a top of the base plate.