WO2025245673A1 - 耳机 - Google Patents

耳机

Info

Publication number
WO2025245673A1
WO2025245673A1 PCT/CN2024/095598 CN2024095598W WO2025245673A1 WO 2025245673 A1 WO2025245673 A1 WO 2025245673A1 CN 2024095598 W CN2024095598 W CN 2024095598W WO 2025245673 A1 WO2025245673 A1 WO 2025245673A1
Authority
WO
WIPO (PCT)
Prior art keywords
sidewall portion
earphone
wall portion
circuit board
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/095598
Other languages
English (en)
French (fr)
Inventor
李朝武
聂倩文
王冲
张旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shokz Co Ltd
Original Assignee
Shenzhen Shokz Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shokz Co Ltd filed Critical Shenzhen Shokz Co Ltd
Priority to PCT/CN2024/095598 priority Critical patent/WO2025245673A1/zh
Priority to EP24940997.0A priority patent/EP4738882A1/en
Priority to CN202480018286.8A priority patent/CN121464651A/zh
Publication of WO2025245673A1 publication Critical patent/WO2025245673A1/zh
Priority to US19/426,007 priority patent/US20260113561A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks

Definitions

  • This application relates to the technical field of electronic devices, specifically to a pair of headphones.
  • Headphones and smart glasses are widely used in daily life, working in conjunction with mobile phones, computers, and other terminal devices to provide users with an auditory feast.
  • Traditional headphones use mechanical buttons to generate control commands; however, with the increasing complexity of headphone control functions, simple mechanical buttons can no longer meet the growing control needs.
  • the earphone which includes a housing assembly.
  • the housing assembly includes a first housing, which includes a first sidewall portion and a second sidewall portion disposed opposite to each other and spaced apart.
  • the earphone also includes a deformable element and a sensor.
  • the deformable element is disposed between the first sidewall portion and the second sidewall portion.
  • the sensor is disposed in the bending area of the deformable element and generates a corresponding electrical signal when the bending degree of the bending area is greater than a preset bending threshold.
  • the deformable member has a plate-like region configured to laterally bend toward the main surface of the plate-like region under the compression of the first sidewall portion and the second sidewall portion, and the sensor is disposed on the plate-like region.
  • the deformable component is a circuit board
  • the sensor is mounted on the circuit board
  • the circuit board is equipped with a main control circuit that is electrically connected to the sensor.
  • the main control circuit performs corresponding control functions based on electrical signals.
  • the main surface of the circuit board is arranged along the interval direction, and the first sidewall portion and the second sidewall portion squeeze the opposite two side edges of the circuit board under the action of opposing extrusion force, so that the main surface of the circuit board is laterally bent, and the sensor is disposed on the main surface of the circuit board.
  • At least one of the first sidewall portion and the second sidewall portion maintains a first gap between itself and the side edge of its adjacent circuit board.
  • the first gap is set to be greater than the deformation of the first sidewall portion and the second sidewall portion when the opposing extrusion force is a first pressure threshold, and less than the deformation of the first sidewall portion and the second sidewall portion when the opposing extrusion force is a second pressure threshold, wherein the first pressure threshold is not less than 0.5 N, and the second pressure threshold is between 1 N and 5 N.
  • the housing assembly further includes a second housing that mates with the first housing along a preset mating direction, the mating direction being intersected with the spacing direction.
  • the second housing includes a third sidewall portion and a fourth sidewall portion that are opposite to each other and spaced apart along the spacing direction.
  • the third sidewall portion and the fourth sidewall portion are inserted between the first sidewall portion and the second sidewall portion along the mating direction and partially overlap.
  • a second gap is maintained between the first sidewall portion and the adjacent third sidewall portion, and between the second sidewall portion and the adjacent fourth sidewall portion, respectively.
  • the second gap is larger than the first gap.
  • the first housing further includes a first top wall connecting the first side wall and the second side wall
  • the second housing further includes a second top wall connecting the third side wall and the fourth side wall.
  • the first top wall and the second top wall are opposite to each other and spaced apart along the mating direction.
  • the circuit board is located between the first top wall and the second top wall. Along the mating direction, one edge of the circuit board further overlaps with the overlapping portion of the first side wall and the third side wall, and the other edge of the circuit board further overlaps with the overlapping portion of the second side wall and the fourth side wall.
  • the earphone further includes a circuit board disposed within the housing assembly, the deformable element being independent of the circuit board, and a main control circuit electrically connected to the sensor being disposed on the circuit board, the main control circuit performing corresponding control functions based on electrical signals.
  • the deformable member along the spacing direction, includes an arched portion and two abutting portions respectively connected to both ends of the arched portion and extending away from the arched portion.
  • the arched portion is arranged in a raised shape from both ends of the arched portion along the vertical direction of the spacing direction.
  • the sensor is disposed on the arched portion, and the two abutting portions abut against the first sidewall portion and the second sidewall portion respectively.
  • the senor is located in the middle of the arch along the spacing direction.
  • the deformable part is formed by bending a sheet or plate, and the arched part is arranged in a U-shape, U-shape or C-shape.
  • the headphones also include a speaker disposed within the housing assembly, the main surface of the circuit board overlapping the speaker along the axial direction of the speaker, and a deformable element disposed laterally to the speaker along the radial direction of the speaker, with the main surface of the deformable element intersecting the main surface of the circuit board.
  • the headphones further include an ear hook connected to the housing assembly, the ear hook being used to position the housing assembly in front of the user's auricle when worn, and a deformable element disposed radially along the speaker on the side of the speaker near the ear hook.
  • the headphones also include a speaker disposed within the housing assembly, wherein the main surface of the circuit board and the main surface of the deformable element overlap with the speaker along the axial direction of the speaker and overlap with each other.
  • the first housing further includes a first top wall portion connecting the first side wall portion and the second side wall portion, and the deformable element is the first top wall portion; or the housing assembly further includes a second housing portion cooperating with the first housing, and the deformable element is the second housing portion.
  • the housing assembly further includes a second housing that mates with the first housing
  • the earphone further includes a speaker disposed within the housing assembly and an ear hook connected to the housing assembly.
  • the ear hook is used to position the housing assembly in front of the user's auricle when worn.
  • the speaker at least partially... Or the entire structure may be located within the first housing.
  • the housing assembly includes a connecting end connected to the ear hook portion and a free end away from the connecting end.
  • the housing assembly further has a length direction, a width direction and a thickness direction orthogonal to each other, wherein the length direction is defined as the direction from the free end toward or away from the connecting end, the thickness direction is defined as the direction toward or away from the auricle in the wearing state, and the first sidewall portion and the second sidewall portion are spaced apart from each other along the width direction.
  • the dimensions of the first sidewall portion and the second sidewall portion along the length direction are larger than the dimensions along the thickness direction.
  • the beneficial effects of this application are as follows: By transmitting touch operations to the sensor through opposing compression of the first housing, the touch accuracy and anti-interference capability of the earphone's touch function can be effectively improved. Furthermore, the sensor is positioned on the curved area of the deformable component. This configuration allows the sensor to directly sense the deformation of the component, receiving touch operations from the user on the first and second sidewalls. With the same sensing accuracy, the sensor can detect finer deformations on the component, thereby effectively improving the earphone's touch sensitivity while also significantly reducing manufacturing costs.
  • Figure 1 is a schematic diagram of the front outline of the user's ear as described in this application;
  • Figure 2 is a structural schematic diagram of an embodiment of the earphone provided in this application.
  • Figure 3 shows a schematic diagram of the headphones in the wearing state as shown in Figure 2;
  • Figure 4 shows an exploded structure diagram of the earphone in the embodiment where the circuit board is used as a deformable component, as shown in Figure 2.
  • Figure 5 shows an exploded structural diagram of the earphone in an embodiment where a component independent of the circuit board is used as a deformable part.
  • Figure 6 shows an exploded structural diagram of the earphone embodiment shown in Figure 2, in which the second shell serves as a deformable component.
  • Figure 7 is a schematic diagram of one embodiment of the circuit board in Figure 2;
  • Figure 8 is a schematic cross-sectional view of the core module along the A1-A1 cutting direction in the embodiment of the earphone shown in Figure 2, where the circuit board is used as the deformable component.
  • FIG. 9 is a partial structural diagram of module B of the movement shown in Figure 8.
  • Figure 10 is a schematic diagram of the mechanism module shown in Figure 5 after the second housing has been removed;
  • Figure 11 is a schematic cross-sectional view of the core module along the A2-A2 cutting direction in the embodiment of the earphone shown in Figure 2, where the second shell is used as a deformable component.
  • the user's ear 100 may include physiological parts such as the external auditory canal 101, the concha 102, the cymba conchae 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, and the antitragus 108.
  • the external auditory canal 101 has a certain depth and extends to the tympanic membrane, for ease of description and in conjunction with Figure 1, unless otherwise specified, the external auditory canal 101 specifically refers to its entrance (i.e., the ear canal) away from the tympanic membrane.
  • the physiological parts such as the concha 102, the cymba conchae 103, and the triangular fossa 104 have a certain volume and depth; and the concha 102 is directly connected to the external auditory canal 101, meaning the aforementioned ear canal can be simply considered as being located at the bottom of the concha 102.
  • a simulator containing the head and its (left and right) ears can be manufactured based on ANSI:S3.36, S3.25 and IEC:60318-7 standards. Examples include the GRAS 45BC KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, to represent the scenario of most users wearing headphones 10.
  • the ear simulator can be any one of the GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG; taking HEAD Acoustics as an example, the ear simulator can be any one of the HMS II.3, HMS II.3LN, or HMS II.3LN HEC. Therefore, in this application, descriptions such as “the user is wearing the earphone 10," “the earphone 10 is in a wearing state,” and “in a wearing state” can refer to the earphone 10 being worn on the ears of the aforementioned simulator. Of course, due to individual differences among users, the earphone 10 may differ from the earphone 10 being worn on the ears of the aforementioned simulator when worn by different users, but such differences should be tolerable.
  • the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis.
  • the sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts.
  • the coronal plane is a section perpendicular to the ground along the left-right direction of the body, dividing the body into anterior and posterior parts.
  • the horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts.
  • the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane;
  • the coronal axis is the axis along the left-right direction of the body and perpendicular to the sagittal plane;
  • the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane.
  • the "front side of the ear” mentioned in this application is a concept relative to "back side of the ear.” The former refers to the side of the ear that is away from the head, while the latter refers to the side of the ear that faces the head. Both refer to the user's ear.
  • a schematic diagram of the front contour of the ear shown in Figure 1 can be obtained.
  • the earphone 10 may include a mechanism module 11 and an ear hook portion 12 connected to the mechanism module 11.
  • the mechanism module 11 When worn, the mechanism module 11 is located at the front of the ear, and at least part of the ear hook portion 12 is located at the back of the ear, so that the earphone 10 is hung on the ear when worn.
  • the mechanism module 11 may have a connection end CE connected to the ear hook portion 12 and a free end FE not connected to the ear hook portion 12.
  • the mechanism module 11 may be configured not to block the external auditory canal when worn, making the earphone 10 an "open-back earphone.” Due to individual differences among users, when the earphone 10 is worn by different users, the mechanism module 11 may partially cover the external auditory canal, but the external auditory canal will still not be blocked.
  • the mechanism module 11 includes a housing assembly 110 (in some embodiments of this application, the housing assembly is also referred to as the mechanism housing), a speaker 111, and a circuit board 112. Further, the speaker 111 and the circuit board 112 can be stacked within the housing assembly 110. This arrangement effectively improves the space utilization within the mechanism module 11 and facilitates optimization of the overall size of the earphone 10. Specifically, without changing the size of the mechanism module 11, the stacked arrangement allows the circuit board 112 to have a larger and more complete surface area without interference from the speaker 111, facilitating processing and effectively increasing the surface area of the circuit board 112. This further allows the circuit board 112 to integrate more circuits, such as a main control circuit and a sensor control circuit.
  • the circuit board 112 integrates any one or more of the main control circuit, sensor control circuit, etc.
  • the circuit board 112 integrates at least the main control circuit of the earphone 10 and a sensor control circuit for connection with the sensor 15.
  • the speaker 111 is a component that converts electrical signals into corresponding sound signals under the control of the circuit board 112.
  • the speaker 111 is an air conduction speaker 111; in other embodiments, the speaker 111 may also be a bone conduction speaker 111.
  • the speaker 111 and the circuit board 112 are stacked in the housing assembly 110, meaning that the speaker 111 and the circuit board 112 are arranged vertically in space along the axial direction z1 of the speaker 111.
  • the earphone 10 further includes a battery assembly connected to the end of the ear hook 12 away from the mechanism module 11.
  • the battery assembly includes a battery housing 13, within which a battery coupled to the mechanism module 11 is disposed.
  • the orthographic projection of the battery housing 13 on a reference plane partially overlaps with the orthographic projection of the free end FE on the same reference plane.
  • the earphone 10 further includes a housing assembly 110, a deformable element 14, and a sensor 15 disposed on the deformable element 14.
  • the deformable element 14 is provided with a bending region that can bend laterally when subjected to a counter-pressure F1 applied along the interval direction.
  • the sensor 15 is disposed in the bending region to generate a corresponding electrical signal when the degree of bending of the bending region is greater than a preset bending threshold, and transmits the corresponding electrical signal to the corresponding component of the earphone 10, such as the circuit board 112, so that the circuit board 112 executes the corresponding control function based on the corresponding electrical signal, thereby controlling the earphone 10 to perform the corresponding earphone 10 functions, such as switching tracks, pausing playback, and starting playback.
  • the bending region is a part of the deformable part 14, and the bending region is a region on the deformable part 14 that can undergo lateral bending deformation when subjected to opposing compressive force F1, and the bending amount is relatively large compared to other parts of the deformable part 14.
  • the bending region can be any structural shape.
  • a preset bending threshold can be set.
  • the electrical signal generated by the sensor 15 when the bending degree of the bending area exceeds the preset bending threshold can be used as the electrical signal to trigger the headphone function.
  • the circuit board 112 to better avoid electrical signals generated by accidental touches by the user, thereby effectively improving the control accuracy and anti-interference capability of the headphone 10.
  • the sensor 15 generates a corresponding level of electrical signal based on the deformation of the deformable element 14.
  • the circuit board 112 does not execute the control function when the signal level of the electrical signal does not exceed the preset threshold (when the signal level is less than or equal to the preset threshold, it indicates that the electrical signal is caused by accidental touch).
  • the preset bending threshold can be determined by statistical analysis methods or by the user based on their usage habits.
  • the housing assembly 110 includes a first housing 1101, which includes a first sidewall portion US1 and a second sidewall portion LS1 disposed opposite to each other.
  • a counter-pressing force F1 applied to the outer sides of the first sidewall portion US1 and the second sidewall portion LS1 along the spacing direction of the first sidewall portion US1 and the second sidewall portion LS1 causes the first sidewall portion US1 and the second sidewall portion LS1 to deform, and indirectly or directly transmits the pressing or squeezing pressure to the deformable member 14, further causing the deformable member 14 to deform, which is detected by the sensor 15.
  • the first housing 1101 serves as the outer shell of the earphone 10, which is also the overall structural support of the earphone 10. Therefore, as a structural support, the first housing 1101 has sufficient structural strength to resist the force when the force acting on the first side wall portion US1 and/or the second side wall portion LS1 is small. This effectively reduces the probability of deformation of the first side wall portion US1 and/or the second side wall portion LS1 due to accidental touch operations such as slight collisions or slight pressure. Consequently, it effectively reduces the risk of deformation of the deformable part 15 due to accidental touch operations such as slight collisions or slight pressure, thereby effectively improving the touch accuracy and anti-interference capability of the earphone 10.
  • first sidewall portion US1 and the second sidewall portion LS1 are subjected to a counter-pressure F1 applied from the outside along the interval direction, either or both of the first sidewall portion US1 and the second sidewall portion LS1 deform, causing at least a portion of the first sidewall portion US1 and at least a portion of the second sidewall portion LS1 to exhibit a small displacement that moves closer to each other along the interval direction. This allows the pressure to be transferred to the deformable member 14 through contact or pulling.
  • both the first sidewall portion US1 and the second sidewall portion LS1 undergo a small displacement that moves closer to each other along the interval direction.
  • the corresponding deformation displacement causes the first sidewall portion US1 and the second sidewall portion LS1 to exhibit a small displacement that moves closer to each other along the interval direction.
  • first sidewall portion US1 and the second sidewall portion LS1 when the first sidewall portion US1 and the second sidewall portion LS1 are subjected to a counter-pressure force F1 applied from the outside along the interval direction, only the first sidewall portion US1 or the second sidewall portion LS1 undergoes a corresponding deformation displacement, but the first sidewall portion US1 and the second sidewall portion LS1 as a whole still exhibit a small displacement that moves closer to each other along the interval direction.
  • the first sidewall portion US1 and the second sidewall portion LS1 are configured to both undergo corresponding deformation displacements when subjected to the counter-pressure force F1, and the amount of deformation displacement of the first sidewall portion US1 and the second sidewall portion LS1 is nearly equal. This effectively improves the user's comfort when pressing the earphone 10 and also effectively prevents the earphone 10 from falling out of the user's ear due to an imbalance of force when subjected to the user's counter-pressure.
  • the senor 15 is directly disposed on the deformable member 14 and located within the bending area of the deformable member 14.
  • the resistance sensor is directly attached to the surface of the bending area.
  • the sensor 15 can directly sense the deformation of the deformable member 14 to receive the user's touch operation on the first sidewall portion US1 and the second sidewall portion LS1. Under the same sensing accuracy, the sensor 15 can sense more subtle deformations on the deformable member 14, thereby effectively improving the touch sensitivity of the earphone 10 while also effectively reducing the manufacturing cost of the earphone 10.
  • the housing assembly 110 is the housing of the mechanism module 11. Since the mechanism module 11 is located in front of the ear when the earphone 10 is worn, compared to earphone components located behind the ear, such as the ear hook 12, the spatial position of the mechanism module 11 in the wearing state is more convenient for the user to operate the earphone 10. Therefore, setting the housing assembly 110 as a trigger element for the deformation of the trigger deformation element 14 to control the function of the earphone 10 can effectively improve the convenience of touch operation of the earphone 10. Further, in some embodiments, in ear hook earphones, the mechanism module 11 is usually the part with the largest overall structural size of the earphone 10.
  • the housing assembly 110 as a component that bends laterally to trigger the deformation element 14 conforms to the operating habits of the human hand and effectively improves the convenience of touch operation of the earphone 10.
  • the distance between the first sidewall portion US1 and the second sidewall portion LS1 is less than or equal to the maximum thickness of the housing assembly 110. This setting can effectively improve the convenience of touch operation of the earphone 10.
  • the distance between the first sidewall portion US1 and the second sidewall portion LS1 along the thickness direction X is equal to the maximum thickness dimension of the housing assembly 110.
  • the spacing direction is defined as an operational direction that allows the user to apply opposing pressure on opposite sides of the housing assembly 110 when the earphone 10 is worn.
  • the housing assembly 110 includes a length direction Y, a width direction Z, and a thickness direction X that are orthogonal to each other.
  • the length direction Y is defined as the direction from the free end FE toward or away from the connecting end CE
  • the thickness direction X is defined as the direction toward or away from the auricle when worn.
  • the spacing direction is set to be parallel to the width direction Z, that is, the first sidewall portion US1 and the second sidewall portion LS1 are the sidewalls of the first housing 1101 along the thickness direction X.
  • This arrangement ensures that when the earphone 10 is worn, the first sidewall portion US1 and the second sidewall portion LS1 are not completely blocked by the user's ears and head, making it convenient for the user to press the first sidewall portion US1 and the second sidewall portion LS1 to control the earphone 10 function.
  • the dimensions of the first sidewall portion US1 and the second sidewall portion US2 along the length direction Y are larger than the dimensions along the thickness direction X. This arrangement makes it easier for the first sidewall portion US1 and the second sidewall portion US2 to deform, thereby effectively improving the pressure control comfort of the earphone 10.
  • the housing assembly 110 further includes a second housing 1102 that mates with the first housing 1101 along a preset mating direction.
  • the mating direction and the spacing direction are intersected, which effectively improves the ease of assembly of the earphone 10.
  • the mating direction is parallel to the thickness direction X.
  • the first housing 1101 includes a sidewall and a first top wall portion OS1
  • the second housing 1102 includes a sidewall and a second top wall portion OS2 connected to the sidewall.
  • the first sidewall portion OS1 and the second sidewall portion OS1 are two sidewall portions spaced apart along the spacing direction from the sidewall of the first housing 1101.
  • the sidewall of the first housing 1101, away from the first top wall OS1 is provided with a first ring portion 1101a recessed outward from the inner side of the sidewall of the first housing 1101, and the sidewall of the second housing 1102, away from the second top wall OS2, is provided with a second ring portion 1102a recessed inward from the outer side of the sidewall of the second housing 1102.
  • the second ring portion 1102a is inserted into the inner side of the first ring portion 1101a, and at least in the spacing direction, a small amount of adhesive is pre-formed between the first ring portion 1101a and the second ring portion 1102a.
  • the gap (in some embodiments herein, the dispensing gap includes a second gap Jx1) is used to connect and fix the first ring portion 1101a and the second ring portion 1102a by dispensing adhesive, thereby effectively improving the connection stability between the first housing 1101 and the second housing 1102. Furthermore, the first housing 1101 and the second housing 1102, through the cooperation of the first ring portion 1101a and the second ring portion 1102a, allow for a smooth transition connection between the outer surfaces of the sidewalls of the first housing 1101 and the second housing 1102, thereby effectively improving the aesthetics of the earphone 10.
  • the earphone 10 includes an elastic sealant disposed in the dispensing gap for connecting and fixing the first housing 1101 and the second housing 1102.
  • the deformable member 14 has a plate-shaped region 16.
  • the plate-shaped region 16 receives the indirect or direct compressive or pressing force transmitted to the deformable member 14, thereby causing lateral bending.
  • the sensor 15 is disposed on the plate-shaped region 16.
  • the plate-shaped region 16 is a portion of the deformable member 14 that is plate-shaped, and does not directly restrict the overall structure of the deformable member 14 to a plate-shaped structure.
  • the overall structure of the deformable member 14 can be rod-shaped, bar-shaped, plate-shaped, etc.
  • the bending region includes a plate-shaped region 16.
  • the plate-shaped region 16 is located within the bending region of the deformable member 14, and its area is less than or equal to the area of the bending region.
  • the deformable element 14 can be a circuit board 112, and the sensor 15 is directly disposed on the circuit board 112.
  • the circuit board 112 is provided with a sensing control circuit electrically connected to the sensor 15.
  • the sensing control circuit executes corresponding control functions based on electrical signals.
  • the sensor 15 can be directly connected to the sensing control circuit through the circuit board 112.
  • the circuit board 112 serves as a circuit board for laying out the earphone 10, and also serves as a deformable element 14 to transmit the user's touch signals to the sensor 15, effectively simplifying the internal wiring and internal structure of the earphone 10, thereby effectively improving the space utilization of the earphone 10.
  • the side edges (i.e., side edges 1122 and 1123) of the circuit board 112 along the interval direction abut against the inner walls of the first sidewall portion US1 and the second sidewall portion LS1, or are spaced apart by a certain gap.
  • the first sidewall portion US1 and the second sidewall portion LS1 compress the opposite side edges (i.e., side edges 1122 and 1123) of the circuit board 112, so that the main surface 1121 of the circuit board 112 is laterally bent, and the sensor 15 is disposed on the main surface 1121 of the circuit board 112.
  • the overall structure of the circuit board 112 is a plate-like structure.
  • the main surface 1121 of the circuit board 112 is the plate surface of the circuit board 112.
  • the main surface 1121 of the circuit board 112 is set at a certain preset angle with the spacing direction.
  • the preset angle is greater than or equal to 0° and less than or equal to 5°.
  • the preset angle can be 5°. This setting makes it easier for the circuit board 112 to deform under the pressure of the first side wall portion US1 and the second side wall portion LS1, thereby effectively improving the control sensitivity of the earphone 10.
  • the side edges (i.e., side edges 1122 and 1123) of the circuit board 112 along the interval direction abut against the inner walls of the first side wall portion US1 and the second side wall portion LS1.
  • the first side wall portion US1 and the second side wall portion LS1 can transmit the opposing compressive force F1 to the circuit board 112 in the first time, thereby effectively improving the control response speed of the earphone 10 and thus effectively improving the user experience.
  • the first sidewall portion US1 and the second sidewall portion LS1 maintain a first gap Jx2 between themselves and the side edges of the adjacent circuit board 112.
  • the circuit board 112 includes two oppositely arranged side edges (i.e., side edge 1122 and side edge 1123), wherein one side edge 1123 is adjacent to the first sidewall portion US1 with a first gap Jx2, and the other side edge 1122 is adjacent to the second sidewall portion LS1 with a first gap Jx2.
  • the first sidewall portion US1 and the second sidewall portion LS1 can maintain a distance and not come into contact, thereby preventing the first sidewall portion US1 and the second sidewall portion LS1 from deforming due to accidental touch operation by the user, causing the earphone 10 to randomly execute some earphone 10 functions that do not conform to the user's wishes, thereby effectively improving the control accuracy of the earphone 10 and the anti-interference capability of the control function.
  • the first gap Jx2 is the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 (that is, the distance between the inner side of the first sidewall portion US1 and the side edge 1123), and the first gap Jx2 is the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 (that is, the distance between the inner side of the second sidewall portion LS1 and the side edge 1122).
  • the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 and the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 are both set to the first gap Jx2.
  • first sidewall portion US1 and the second sidewall portion LS1 can maintain good force stability when subjected to opposing pressure, and prevent the earphone 10 from falling off the user's ear due to unbalanced force when subjected to opposing pressure from the user.
  • the minimum distance between the inner side of the first sidewall portion US1 and the circuit board 112 and the minimum distance between the second sidewall portion LS1 and the circuit board 112 can also be set to be unequal.
  • one of the first sidewall portion US1 and the second sidewall portion LS1 can directly abut against the circuit board 112, while the other maintains a first gap Jx2 with the circuit board 112.
  • the other of the first sidewall portion US1 and the second sidewall portion LS1 can still maintain a distance from the circuit board 112 through the first gap Jx2, thereby preventing the first sidewall portion US1 and the second sidewall portion LS1 from simultaneously squeezing the circuit board 112, causing the circuit board 112 to deform.
  • This can still improve the control accuracy and anti-interference capability of the control function of the earphone 10 to a certain extent.
  • the circuit board 112 can be effectively prevented from deforming due to accidental touch operation by the user, thereby effectively improving the operating accuracy and anti-interference capability of the headphone 10.
  • This paper mainly uses an embodiment where the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 and the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 are both set to the first gap Jx2 to describe the headphone 10 of this application in detail.
  • the first gap Jx2 is set to be greater than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is a first pressure threshold, and less than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is a second pressure threshold.
  • the first pressure threshold is not less than 0.5 N
  • the second pressure threshold is between 1 N and 5 N.
  • the first pressure threshold is a limit value of the opposing compressive force F1 acting on the first sidewall US1 and the second sidewall LS1 due to accidental user touch.
  • the second pressure threshold can be a minimum value that triggers the headphone 10's function. Setting the first gap Jx2 to be less than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is the second pressure threshold can effectively improve the pressure control comfort of the headphone 10. Setting the first pressure threshold to not less than 0.5 Newtons can further improve the control precision and anti-interference capability of the headphone 10's control function. Setting the second pressure threshold to between 1 Newton and 5 Newtons can further improve the pressure control comfort of the headphone 10.
  • the housing assembly 110 includes a second housing 1102 that mates with the first housing 1101 along a predetermined mating direction.
  • the second housing 1102 includes a third sidewall portion US2 and a fourth sidewall portion LS2 that are spaced apart from each other along a spacing direction.
  • the third sidewall portion US2 and the fourth sidewall portion LS2 are inserted between the first sidewall portion US1 and the second sidewall portion LS1 along the mating direction and partially overlap. In their natural state and along the spacing direction, the first sidewall portion US1 and the adjacent third sidewall portion US2...
  • a second gap Jx1 is maintained between the second sidewall portion LS1 and the adjacent fourth sidewall portion LS2, and the second gap Jx1 is greater than the first gap Jx2.
  • the third sidewall portion US2 and the fourth sidewall portion LS2 are two sidewall portions that are spaced apart along the sidewall of the second housing 1102 in the interval direction.
  • the third sidewall portion US2 and the fourth sidewall portion LS2 are inserted between the first sidewall portion US1 and the second sidewall portion LS1 in the mating direction and partially overlap.
  • the portion of the third sidewall portion US2 and the portion of the third sidewall portion US2 where the second ring portion 1102a is provided are inserted into the inner side of the first ring portion 1101a and overlap with the first ring portion 1101a.
  • the first sidewall portion US1 and the adjacent third sidewall portion US2, as well as the second sidewall portion LS1 and the adjacent fourth sidewall portion LS2 maintain a second gap Jx1, which is greater than the first gap Jx2.
  • first ring portion 1101a and the second ring portion 1102a having a second gap Jx1 in their natural state and along the spacing direction, which is the dispensing gap described above.
  • the first housing 1101 is the main component that receives the opposing pressure F1 from the user, and the second housing 1102 is in contact with the first housing 1101 along the interval direction. Therefore, the second housing 1102 will cause a certain resistance to the deformation of the first side wall portion US1 and the second side wall portion LS1.
  • the second gap Jx1 is set to be greater than the first gap Jx2, which effectively reduces the resistance of the second housing 1102 to the first side wall portion US1 and the second side wall portion LS1 during the deformation stroke of the first side wall portion US1 and the second side wall portion LS1 pressing the circuit board 112. This ensures that the first side wall portion US1 and the second side wall portion can smoothly contact the circuit board 112, thereby effectively improving the stability of the pressure control function of the earphone 10.
  • the first housing 1101 further includes a first top wall portion OS1 connecting the first side wall portion US1 and the second side wall portion LS1
  • the second housing 1102 further includes a second top wall portion OS2 connecting the third side wall portion US2 and the fourth side wall portion LS2.
  • the first top wall portion OS1 and the second top wall portion OS2 are arranged opposite to each other and spaced apart along the mating direction, and the circuit board 112 is located between the first top wall portion OS1 and the second top wall portion OS2.
  • one side edge 1123 of the circuit board 112 further overlaps with the overlapping portions of the first side wall portion US1 and the third side wall portion US2, and the other side edge 1122 of the circuit board 112 further overlaps with the overlapping portions of the second side wall portion LS1 and the fourth side wall portion LS2.
  • the first top wall is located at one end of the first side wall portion US1 and the second side wall portion LS1, and is respectively connected to the first side wall portion US1 and the second side wall portion LS1.
  • This arrangement results in a cantilevered arrangement between the first side wall portion US1, the second side wall portion LS1, and the first top wall portion OS1, that is, the first side wall portion US1 and the second side wall portion LS1 are similarly suspended on the first top wall portion OS1.
  • the first side wall portion US1 and the second side wall portion LS1 are located at the end opposite to the first top wall portion OS1 (that is, along the mating direction, closer to the first side wall portion US1).
  • the portion overlapping with the third sidewall portion US2, and the portion overlapping near the second sidewall portion LS1 and the fourth sidewall portion LS2 is more prone to deformation.
  • one side edge 1123 of the circuit board 112 is further overlapped with the overlapping portions of the first sidewall portion US1 and the third sidewall portion US2, and the other side edge 1122 of the circuit board 112 is further overlapped with the overlapping portions of the second sidewall portion LS1 and the fourth sidewall portion LS2.
  • This is more conducive to the compression of the first sidewall portion US1 and the second sidewall portion LS1 with the circuit board 112, thereby effectively improving the stability of the pressure control function of the earphone 10.
  • the two side edges (i.e., side edges 1122 and side edges 1123) of the circuit board 112 can also be configured to overlap with the third side wall portion US2 and the fourth side wall portion LS2 respectively.
  • the minimum distance between the inner side of the third side wall portion US2 and the circuit board 112 is also the first gap Jx2
  • the minimum spacing distance between the inner side of the fourth side wall portion LS2 and the circuit board 112 is also the first gap Jx2.
  • the first side wall portion US1 and the second side wall portion LS1 when the first side wall portion US1 and the second side wall portion LS1 are subjected to opposing compressive force F1, the first side wall portion US1 and the third side wall portion US2 can together compress one side edge 1123 of the main control board circuit, and the second side wall portion LS1 and the fourth side wall portion LS2 can together compress the other side edge 1122 of the circuit board 112.
  • the earphone 10 further includes a circuit board 112 disposed within the housing assembly 110.
  • the deformable element 14 is independent of the circuit board 112, and the circuit board 112 is provided with a main control circuit electrically connected to the sensor 15.
  • the main control circuit executes corresponding control functions based on electrical signals.
  • the deformable element 14 is disposed as an independent component within the housing assembly 110, and the sensor 15 is disposed on the deformable element 14. This effectively reduces the space occupied by the sensor 15 on the main control board circuit and lowers the design complexity of the circuit board 112.
  • the deformable member 14 includes two opposing abutment portions 141. Both the first sidewall portion US1 and the second sidewall portion LS1 are provided with abutment grooves, and the two abutment portions 141 are respectively disposed in the corresponding abutment grooves.
  • the abutment portions 141 can be fixedly connected to the abutment grooves by dispensing adhesive. This arrangement can effectively improve the connection stability between the deformable member 14 and the housing assembly 110, so as to ensure the touch stability of the earphone 10.
  • the deformable member 14 further includes an arched portion 142, wherein two abutting portions 141 are respectively connected to both ends of the arched portion 142 and extend away from the arched portion 142 to form a complete deformable member 14.
  • the arched portion 142 is arranged in a raised shape from both ends of the arched portion 142 along the vertical direction of the spacing direction.
  • the sensor 15 is disposed on the arched portion 142.
  • the two abutting portions 141 abut against the first sidewall portion US1 and the second sidewall portion LS1, respectively.
  • the sensor 15 is disposed in the middle of the arched portion 142.
  • the middle region of the arched portion 142 is configured as a plate-like region 16, and the sensor 15 is disposed in the plate-like region 16.
  • the arched portion 142 is arched from both ends along the perpendicular direction of the spacing direction.
  • the first sidewall portion US1 and the second sidewall portion LS1 are subjected to opposing compressive force F1, they deform and compress the two abutment portions 141, causing the arched portion 142 to deform.
  • This arrangement allows the arched portion 142 to deform more effectively when compressed by the two abutment portions 141, thereby effectively improving the control accuracy of the earphone 10.
  • the deformable member 14 is formed by bending a sheet or plate, and the arched portion 142 is U-shaped, U-shaped, or C-shaped.
  • the deformable member 14 can also be formed by bending a rod-shaped member, a stick-shaped member, or the like.
  • the earphone 10 further includes a housing assembly.
  • the speaker 111 is located within the housing assembly 110.
  • the main surface 1121 of the circuit board 112 overlaps with the speaker 111 along the axial direction z1 of the speaker 111.
  • the deformable member 14 is arranged radially to the side of the speaker 111.
  • the main surface 143 of the deformable member 14 intersects with the main surface 1121 of the circuit board 112. This arrangement effectively improves the space utilization inside the housing assembly 110.
  • the arched portion 142 has a thickness of 0.2 mm, a width of 1.9 mm, and a length of 11.5 mm.
  • the width of the arched portion 142 is the structural length along the axial direction z1 of the speaker 111
  • the length of the arched portion 142 is the structural length along the spacing direction
  • the thickness of the arched portion 142 is the structural length along the length direction Y of the housing assembly 110.
  • the main surface 1121 of the circuit board 112 and the main surface 143 of the deformable member 14 overlap with the speaker 111 along the axial direction z1 of the speaker 111.
  • the axial direction z1 of the speaker 111 is parallel to the thickness direction X of the core module 11.
  • the earphone 10 further includes an ear hook portion 12 connected to the housing assembly 110.
  • the ear hook portion 12 is used to place the housing assembly 110 in front of the user's auricle when worn.
  • the deformable member 14 is arranged radially along the speaker 111 on the side of the speaker 111 near the ear hook. This arrangement can effectively improve the space utilization of the housing assembly 110.
  • the deformable element 14 can also be a second housing 1102.
  • the second housing 1102 includes a third side wall portion US2, a fourth side wall portion LS2, and a second top wall portion OS2.
  • the second housing 1102 cooperates with the first housing 1101 in the manner described in the above embodiments.
  • the sensor 15 is disposed on the second top wall portion OS2.
  • the first side wall portion US1 and the second side wall portion LS1 When the first side wall portion US1 and the second side wall portion LS1 are subjected to opposing compressive force F1 and deform, the first side wall portion US1 and the second side wall portion LS1 respectively compress the third side wall portion US2 and the fourth side wall portion LS2, so that the third side wall portion US2 and the fourth side wall portion LS2 pull the second top wall portion OS2 and cause the second top wall portion OS2 to deform.
  • the sensor 15 disposed on the second top wall portion OS2 detects the deformation of the second top wall portion OS2 and generates an electrical signal.
  • the sensor 15 is electrically connected to the circuit board 112 via a flexible circuit board 17/wire assembly, thereby transmitting electrical signals to the main control circuit of the circuit board 112. This arrangement effectively simplifies the structure of the earphone 10 and optimizes its space utilization.
  • the circuit board 112 is located between the speaker 111 and the second top wall portion OS2. This arrangement allows the sensor 15 to be as close as possible to the circuit board 112, thereby reducing the length of the flexible circuit board 17 and effectively improving the utilization rate of the internal space of the housing assembly 110.
  • the deformable member 14 may also be the top wall of the first housing 1101, for example, the first top wall portion OS1.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Headphones And Earphones (AREA)

Abstract

本申请主要是涉及一种耳机，其包括壳体组件，壳体组件包括第一壳体，第一壳体包括沿彼此相对且间隔设置的第一侧壁部和第二侧壁部，耳机还设置有形变件和传感器，形变件设置于第一侧壁部和第二侧壁部之间，第一侧壁部和/或第二侧壁部在受到从外侧沿第一侧壁部和所述第二侧壁部的间隔方向施加的对向挤压力时产生形变，并共同挤压所述形变件，以使形变件向间隔方向的侧向弯曲，传感器设置于形变件的弯曲区域内，并在弯曲区域的弯曲程度大于预设弯曲阈值时产生相应的电信号。通过上述方式，能有效地提升耳机的触控精度和触控功能的抗干扰能力，并且通过上述方式，还能有效地提升耳机的触控灵敏度的同时，有效地减小耳机的制作成本。

Description

耳机 【技术领域】
本申请涉及电子设备的技术领域，具体是涉及一种耳机。
【背景技术】
随着电子设备的不断普及，电子设备已经成为人们日常生活中不可或缺的社交、娱乐工具，人们对于电子设备的要求也越来越高。耳机、智能眼镜这类电子设备，也已广泛地应用于人们的日常生活，它可以与手机、电脑等终端设备配合使用，以便于为使用者提供听觉盛宴。传统耳机采用机械按键来产生控制指令，随着对耳机控制功能的增加，单纯的机械按键已无法满足更多的控制需求。
【发明内容】
本申请提供了一种耳机，耳机包括壳体组件，壳体组件包括第一壳体，第一壳体包括沿彼此相对且间隔设置的第一侧壁部和第二侧壁部，耳机还设置有形变件和传感器，形变件设置于第一侧壁部和第二侧壁部之间，第一侧壁部和/或第二侧壁部在受到从外侧沿第一侧壁部和所述第二侧壁部的间隔方向施加的对向挤压力时产生形变，并共同挤压所述形变件，以使形变件向间隔方向的侧向弯曲，传感器设置于形变件的弯曲区域内，并在弯曲区域的弯曲程度大于预设弯曲阈值时产生相应的电信号。
在一些实施方式中，形变件具有板状区域，板状区域设置成在第一侧壁部和第二侧壁部的挤压作用下朝向板状区域的主表面的侧向弯曲，传感器设置于板状区域上。
在一些实施方式中，形变件为电路板，传感器设置于电路板上，电路板上设置有与传感器电连接的主控电路，主控电路基于电信号执行相应的控制功能。
在一些实施方式中，电路板的主表面沿间隔方向设置，第一侧壁部和第二侧壁部在对向挤压力的作用下挤压电路板的相对两侧边缘，以使得电路板的主表面发生侧向弯曲，传感器设置于电路板的主表面上。
在一些实施方式中，在自然状态下且沿间隔方向，第一侧壁部和第二侧壁部中的至少一者与其相邻的电路板的侧边缘之间保持第一间隙。
在一些实施方式中，第一间隙设置成大于在对向挤压力为第一压力阈值时第一侧壁部和第二侧壁部的形变量，且小于在对向挤压力为第二压力阈值时第一侧壁部和第二侧壁部的形变量，第一压力阈值不小于0.5牛，第二压力阈值介于1牛～5牛之间。
在一些实施方式中，壳体组件还包括沿预设的配合方向与第一壳体配合的第二壳体，配合方向与间隔方向交叉设置，第二壳体包括沿间隔方向彼此相对且间隔设置的第三侧壁部和第四侧壁部，第三侧壁部和第四侧壁部沿配合方向插入第一侧壁部和第二侧壁部之间且部分重合，在自然状态下且沿间隔方向，第一侧壁部与相邻的第三侧壁部之间以及第二侧壁部与相邻的第四侧壁部之间分别保持第二间隙，第二间隙大于第一间隙。
在一些实施方式中，第一壳体进一步包括连接第一侧壁部和第二侧壁部的第一顶壁部，第二壳体进一步包括连接第三侧壁部和第四侧壁部的第二顶壁部，第一顶壁部和第二顶壁部沿配合方向彼此相对且间隔设置，电路板位于第一顶壁部和第二顶壁部之间，沿配合方向，电路板的一侧边缘与第一侧壁部和第三侧壁部的重合部分进一步重合，电路板的另一侧边缘与第二侧壁部和第四侧壁部的重合部分进一步重合。
在一些实施方式中，耳机进一步包括设置于壳体组件内的电路板，形变件独立于电路板，电路板上设置有与传感器电连接的主控电路，主控电路基于电信号执行相应的控制功能。
在一些实施方式中，沿间隔方向，形变件包括拱形部以及分别连接于拱形部两端且远离拱形部延伸的两个抵接部，拱形部从拱形部的两端沿间隔方向的垂直方向呈供起状设置，传感器设置于拱形部上，两个抵接部分别与第一侧壁部及第二侧壁部抵接。
在一些实施方式中，沿间隔方向，传感器设位于拱形部的中部。
在一些实施方式中，形变件由板材或片材弯折而成，拱形部呈ㄇ型、U形或C型设置。
在一些实施方式中，耳机还包括设置于壳体组件内的扬声器，电路板的主表面沿扬声器的轴向与扬声器重叠设置，形变件沿扬声器的径向设置于扬声器的侧向，形变件的主表面与电路板的主表面彼此交叉设置。
在一些实施方式中，耳机进一步包括与壳体组件连接的耳挂部，耳挂部用于在佩戴状态将壳体组件在使用者的耳廓前侧，形变件沿扬声器的径向设置于扬声器靠近耳挂的一侧。
在一些实施方式中，耳机还包括设置于壳体组件内的扬声器，电路板的主表面和形变件的主表面沿扬声器的轴向与扬声器重叠设置，且彼此重叠设置。
在一些实施方式中，第一壳体进一步包括连接第一侧壁部和第二侧壁部的第一顶壁部，形变件为第一顶壁部，或者壳体组件进一步包括与第一壳体配合的第二壳体，形变件为第二壳体。
在一些实施方式中，壳体组件还包括第一壳体配合的第二壳体，耳机还包括设置于壳体组件内的扬声器以及与壳体组件连接的耳挂部，耳挂部用于在佩戴状态将壳体组件在使用者的耳廓前侧，扬声器至少大部分 或整体位于第一壳体内。
在一些实施方式中，壳体组件包括与耳挂部连接的连接端和远离连接段的自由端，壳体组件进一步具有彼此正交的长度方向、宽度方向和厚度方向，其中长度方向定义为由自由端朝向或背离连接端的方向，厚度方向定义为在佩戴状态下朝向或背离耳廓的方向，第一侧壁部和第二侧壁部沿宽度方向彼此间隔设置。
在一些实施方式中，第一侧壁部和第二侧壁部沿长度方向的尺寸大于沿厚度方向的尺寸。
本申请的有益效果是：通过对向挤压第一壳体的方式，向传感器传递触控操作，如此能有效地提升耳机的触控精度和触控功能的抗干扰能力。并且，传感器设置于形变件的弯曲区域上，如此设置，传感器能直接感知形变件的形变，以接收使用者作用在第一侧壁部和第二侧壁部上触控操作，在感应精度相同的情况下，传感器能感知形变件上更细微的形变，从而有效地提升耳机的触控灵敏度的同时，还能有效地减小耳机的制作成本。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请所述的使用者的耳部的前侧轮廓示意图；
图2是本申请提供的耳机一实施例的结构示意图；
图3图2所示的耳机在佩戴状态下的示意图；
图4图2所示的耳机以电路板作为形变件的实施例中，耳机的爆炸结构示意图；
图5图2所示的耳机以独立于电路板的部件作为形变件的实施例中，耳机的爆炸结构示意图；
图6图2所示的耳机以第二壳体作为形变件的实施例中，耳机的实施例的爆炸结构示意图；
图7是图2中电路板一实施例的结构示意图；
图8是图2所示的耳机以电路板作为形变件的实施例中，机芯模组沿A1-A1剖切方向的剖面结构示意图；
图9是图8中所示的机芯模组的局部B的结构示意图；
图10是图5所示的机芯模组去掉第二壳体后的结构示意图；
图11是图2所示的耳机以第二壳体作为形变件的实施例中，机芯模组沿A2-A2剖切方向的剖面结构示意图。
【具体实施方式】
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。本领域技术人员显式地和隐式地理解的是，本申请所描述的实施例可以与其他实施例相结合。
结合图1，使用者的耳部100可以包括外耳道101、耳甲腔102、耳甲艇103、三角窝104、对耳轮105、耳舟106、耳轮107及对耳屏108等生理部位。其中，虽然外耳道101具有一定的深度并延伸至耳部的鼓膜，但是为了便于描述，并结合图1，本申请在没有特别说明的情况下，外耳道101具体是指其背离鼓膜的入口(也即耳孔)。进一步地，耳甲腔102、耳甲艇103、三角窝104等生理部位具有一定的容积及深度；且耳甲腔102与外耳道101直接连通，也即可以简单地视作前述耳孔位于耳甲腔102的底部。
进一步地，不同的使用者可能存在个体差异，导致耳部存在不同的形状、大小等尺寸差异。为了便于描述，以及减小(甚至是消除)不同使用者的个体差异，基于ANSI:S3.36,S3.25和IEC:60318-7标准可以制得一含头部及其(左、右)耳部的模拟器，例如GRAS 45BC KEMAR、HEAD Acoustics、B&K 4128系列或者B&K 5128系列，以此呈现出大多数使用者佩戴耳机10的情景。以GRAS KEMAR作为示例，耳部的模拟器可以为GRAS 45AC、GRAS 45BC、GRAS 45CC或者GRAS 43AG等中的任意一种；以HEAD Acoustics作为示例，耳部的模拟器可以为HMS II.3、HMS II.3LN或者HMS II.3LN HEC等中的任意一种。因此，本申请中，诸如“使用者佩戴耳机10”、“耳机10处于佩戴状态”及“在佩戴状态下”等描述可以指本申请所述的耳机10佩戴于前述模拟器的耳部。当然，正是因为不同的使用者存在个体差异，耳机10被不同的使用者佩戴时可能会与耳机10佩戴于前述模拟器的耳部存在一定的差异，但是这种差异应该是被容忍的。
需要说明的是：在医学、解剖学等领域中，可以定义人体的矢状面(Sagittal Plane)、冠状面(Coronal Plane)和水平面(Horizontal Plane)三个基本切面以及矢状轴(Sagittal Axis)、冠状轴(Coronal Axis)和垂直轴(Vertical Axis)三个基本轴。其中，矢状面是指沿身体前后方向所作的与地面垂直的切面，它将人体分为左右两部分；冠状面是指沿身体左右方向所作的与地面垂直的切面，它将人体分为前后两部分；水平面是指沿身体上下方向所作的与地面平行的切面，它将人体分为上下两部分。相应地，矢状轴是指沿身体前后方向且垂直于冠状面的轴，冠状轴是指沿身体左右方向且垂直于矢状面的轴，垂直轴是指沿身体上下方向且垂直于水平面的轴。 进一步地，本申请所述的“耳部的前侧”是一个相对于“耳部的后侧”的概念，前者指耳部背离头部的一侧，后者指耳部朝向头部的一侧，他们均是针对使用者的耳部。其中，沿人体冠状轴所在方向观察上述模拟器的耳部，可以得到图1所示的耳部的前侧轮廓示意图。
作为示例性地，结合图2至图6，耳机10可以包括机芯模组11和与机芯模组11连接的耳挂部12，机芯模组11在佩戴状态下位于耳部的前侧，至少部分耳挂部12在佩戴状态下位于耳部的后侧，以使得耳机10在佩戴状态下挂设在耳部上。其中，机芯模组11可以具有与耳挂部12连接的连接端CE和不与耳挂部12连接的自由端FE。进一步地，机芯模组11可以设置成在佩戴状态下不堵住外耳道，使得耳机10作为“开放式耳机”。其中，由于不同的使用者存在个体差异，使得耳机10被不同的使用者佩戴时，机芯模组11可能会部分遮挡外耳道，但外耳道依旧未被堵住。
可选地，在一些实施例中，机芯模组11包括壳体组件110(在本申请一些实施例中，壳体组件又称为机芯壳体)、扬声器111及电路板112。进一步地，扬声器111与电路板112可以以层叠方式设置于壳体组件110内，如此设置能有效地提升机芯模组11内部的空间利用率，同时便于优化耳机10的整体尺寸。具体地，在不改变机芯模组11尺寸的情况，以层叠方式设置可以使得电路板112在不受扬声器111的干涉下尽可能将其板面设置得更大以及更完整，便于加工，也有效地提升电路板112的板面面积，进一步使得电路板112可以集成更多的电路，例如主控电路、传感控制电路等电路。在一些实施例中，电路板112集成设置有主控电路、传感控制电路等电路中的任一种或两种以上的电路。优选地，在本实施例中，电路板112上至少集成设置有耳机10的主控电路以及用于与传感器15连接的传感控制电路。其中，扬声器111为能在电路板112的控制下，将电信号转换为对应的声音信号的部件。其中，在本实施例中，扬声器111为气导扬声器111，在其它实施例中，扬声器111也可以设置为骨传导扬声器111。
需要注意的是，扬声器111与电路板112以层叠方式设置于壳体组件110内，是指沿扬声器111的轴向z1，扬声器111与电路板112在空间上上下排布。
可选地，在一些实施例中，耳机10还包括与耳挂部12远离机芯模组11的一端连接的电池组件，电池组件包括电池壳体13，电池壳体13内设置有与机芯模组11耦接的电池，电池壳体13在参考平面上的正投影与自由端FE在同一参考平面上的正投影部分重叠。如此，以在自由端FE至少部分插入耳甲腔内时，电池壳体13可以从耳部的后侧支撑耳部，这样有利于改善耳机10在佩戴状态下的稳定性。
可选地，如图4-6所示，在一些实施例中，耳机10还包括壳体组件110、形变件14及设置在形变件14上的传感器15，其中，形变件14上设置有可在受到沿间隔方向施加的对向挤压力F1时发生侧向弯曲的弯曲区域，传感器15设置于弯曲区域内，以在弯曲区域的的弯曲程度大预设弯曲阈值时产生相应的电信号，并将相应的电信号传递至耳机10的对应部件，例如电路板112，以使电路板112基于对应的电信号执行相应的控制功能，从而控制耳机10执行相应的耳机10功能，例如，切换曲目、暂停播放、开始播放等耳机10功能。
需要注意的是，弯曲区域是形变件14上的一部分，并且弯曲区域是形变件14上在受到对向挤压力F1时可发生侧向弯曲形变且弯曲量相对形变件14的其它部位较大的区域，在自然状态下，弯曲区域可以是任意结构形状。
可选地，在一些实施例中，可以设定预设弯曲阈值，将传感器15基于弯曲区域的弯曲程度大于预设弯曲阈值时生成的电信号，作为触发耳机功能的电信号，如此能使得电路板112能更好地规避由于使用者误触而产生的电信号，从而有效地提升耳机10的控制精度和控制功能的抗干扰能力。例如，在一些实施例中，传感器15基于形变件14的形变大小，而生成对应等级的电信号，电路板112在电信号的信号等级不超过预设阈值时(当信号等级小于或等于预设阈值时，说明该电信号为误触操作引发的信号)，不执行控制功能。具体地，预设弯曲阈值可以由统计分析的方法确定，也可以由使用者基于使用习惯自行确定。
进一步地，如图4-6所示，在一些实施例中，壳体组件110包括第一壳体1101，第一壳体1101包括彼此相对间隔设置的第一侧壁部US1和第二侧壁部LS1，其中，沿第一侧壁部US1和第二侧壁部LS1的间隔方向，对第一侧壁部US1和第二侧壁部LS1的外侧施加的对向挤压力F1，使得第一侧壁部US1和第二侧壁部LS1发生形变，并间接或直接地将挤压或按压力传递至形变件14，进一步使得形变件14产生形变，由传感器15检测到。其中，第一壳体1101作为耳机10的外壳，也即耳机10的整体结构支撑件，因此作为结构支撑件的第一壳体1101，在作用在第一侧壁部US1和/第二侧壁部LS1上的作用力较小时，第一壳体1101自身结构强度足以抵抗该作用力，从而有效地减小第一侧壁部US1和/第二侧壁部LS1由于轻微碰撞、轻微挤压等误触操作的作用下产生形变的概率，进而有效地减小形变件15因轻微碰撞、轻微挤压等误触操作而发生形变的风险，从而有效地提升耳机10的触控精度和触控功能的抗干扰能力。
需要注意的是，第一侧壁部US1和第二侧壁部LS1在受到外侧沿间隔方向施加的对向挤压力F1时，第一侧壁部US1和第二侧壁部LS1中任一者或两者发生形变，以使第一侧壁部US1上的至少部分区域和第二侧壁部LS1上的至少部分区域呈现沿间隔方向发生相互靠近的小位移，从而通过与形变件14抵接或拉扯的方式将挤压力传递至形变件14。例如，在一些实施例中，第一侧壁部US1和第二侧壁部LS1在受到外侧沿间隔方向施加的对向挤压力F1时，第一侧壁部US1和第二侧壁部LS1在对向挤压力F1的作用下均发生对 应的形变位移，从而使得第一侧壁部US1和第二侧壁部LS1整体呈现沿间隔方向发生相互靠近的小位移。又例如，在一些实施例中，第一侧壁部US1和第二侧壁部LS1在受到外侧沿间隔方向施加的对向挤压力F1时，只有第一侧壁部US1或第二侧壁部LS1发生对应的形变位移，但第一侧壁部US1和第二侧壁部LS1整体依然呈现沿间隔方向发生相互靠近的小位移。当然，在本实施例中，第一侧壁部US1和第二侧壁部LS1设置为在受到对向挤压力F1时，第一侧壁部US1和第二侧壁部LS1均发生对应的形变位移，并且，第一侧壁部US1的形变位移量和第二侧壁部LS1的形变位移量近乎相等，如此能有效地使用者在按压耳机10时的舒适度，并且还能有效地防止耳机10在受到使用者的对向按压力时出受力不平衡的情况，导致耳机10从使用者的耳部掉落。
进一步地，在一些实施例中，传感器15直接设置于形变件14上，且位于形变件14的弯曲区域内，例如，电阻传感器直接贴附于弯曲区域表面，如此设置，传感器15能直接感知形变件14的形变，以接收使用者作用在第一侧壁部US1和第二侧壁部LS1上触控操作，在感应精度相同的情况下，传感器15能感知形变件14上更细微的形变，从而有效地提升耳机10的触控灵敏度的同时，还能有效地减小耳机10的制作成本。
优选地，在一些实施例中，壳体组件110为机芯模组11的机芯壳体，由于耳机10在佩戴状态下，机芯模组11位于耳部的前侧，相比于位于耳部的后侧的耳机部件，例如耳挂部12等，机芯模组11在佩戴状态下所处的空间位置，更便于使用者操作耳机10，故此将壳体组件110设置为触发形变件14形变的触发件，以控制耳机10功能，能有效地提升耳机10的触控操作便捷性。进一步地，在一些实施例中，在耳挂式耳机中，机芯模组11通常是耳机10整体结构尺寸最大的部位，将壳体组件110作为触发形变件14侧向弯曲的部件，符合人手的操作习惯，有效地提升耳机10的触控操作便捷性。可选地，在一些实施例中，沿厚度方向X，第一侧壁部US1和第二侧壁部LS1的间隔距离小于或等于壳体组件110的最大厚度尺寸，如此设置能有效地提升耳机10的触控操作便捷性。优选地，在一些实施中，沿厚度方向X，第一侧壁部US1和第二侧壁部LS1的间隔距离等于壳体组件110的最大厚度尺寸。
可选地，在一些实施例中，间隔方向定义为耳机10在佩戴状态下便于使用者能在壳体组件110的相对的两侧作用对向压力的一个操作方向。具体地，壳体组件110包括彼此正交的长度方向Y、宽度方向Z及厚度方向X，长度方向Y定义为由自由端FE朝向或背离连接端CE的方向，厚度方向X定义为在佩戴状态下朝向或背离耳郭的方向。其中，在本实施例中，间隔方向设置为与宽度方向Z平行，也即第一侧壁部US1和第二侧壁部LS1即为第一壳体1101沿厚度方向X两侧的侧壁，如此设置，使得耳机10在佩戴状态下，第一侧壁部US1和第二侧壁部LS1不会完全地被使用者的耳部及头部等部位完全遮挡，便于使用者按压第一侧壁部US1和第二侧壁部LS1，以控制耳机10的耳机10功能。
可选地，在一些实施例中，第一侧壁部US1和第二侧壁部US2沿长度方向Y的尺寸大于沿厚度方向X侧尺寸，如此设置使得第一侧壁部US1和第二侧壁部US2能更容易产生形变，从而有效地提升耳机10的压控舒适度。
可选地，如图4-6所示，在一些实施例中，壳体组件110还包括沿预设的配合方向与第一壳体1101配合的第二壳体1102，配合方向与间隔方向交叉设置，如此设置，能有效地提升耳机10的装配便捷性。在本实施例中，配合方向与厚度方向X平行设置。
进一步地，如图4-6所示，在一些实施例中，第一壳体1101包括侧壁及第一顶壁部OS1，第二壳体1102包括侧壁及与其侧壁连接第二顶壁部OS2。其中，第一侧壁部US1和第二侧壁部LS1即为沿间隔方向上，第一壳体1101的侧壁间隔设置的两个侧壁部。
可选地，在一些实施例中，第一壳体1101的侧壁背离第一顶壁部OS1的一端设置有由第一壳体1101的侧壁的内侧向外凹陷的第一环部1101a，第二壳体1102的侧壁背离第二顶壁部OS2的一端设置有由第二壳体1102的侧壁的外侧向内凹陷的第二环部1102a，其中，沿配合方向，第二环部1102a插入第一环部1101a的内侧，并且至少沿间隔方向，第一环部1101a和第二环部1102a之间预留有点胶间隙(在本文一些实施例中，点胶间隙包括第二间隙Jx1)，用于通过点胶方式将第一环部1101a和第二环部1102a连接固定，从而有效地提升第一壳体1101和第二壳体1102之间的连接稳定性，并且，第一壳体1101和第二壳体1102通过第一环部1101a和第二环部1102a配合，使得第一壳体1101的侧壁的外表面和第二壳体1102侧壁的外表面能实现平滑过渡连接，从而有效地提升耳机10的美观度。可选地，在一些实施例中，耳机10包括弹性密封胶，弹性密封胶设置于点胶间隙，用于将第一壳体1101和第二壳体1102连接固定。
可选地，如图7、图11所示，在一些实施例中，形变件14具有板状区域16，当第一侧壁部US1和第二侧壁部LS1外侧受到对向挤压力时，板状区域16接受传递到形变件14上间接或直接的挤压或按压力，进而发生侧向弯曲，传感器15设置于板状区域16上。需要注意的是，板状区域16为形变件14上的成板状设置的部分区域，并非直接限制形变件14的整体结构呈现板状结构，换而言之，形变件14的整体结构可以是棍状、棒状、板状等结构。故此在形变件14上设置板状区域16能使得形变件14能更好地“感知”使用者作用在第一侧壁部US1和第二侧壁部LS1上的对向作用力，并发生对应的形变，使得传感器15能更好地接收使用者的触控操作信号，从而有效地提升耳机10的控制灵敏度。其中，弯曲区域包括板状区域16，换而言之，板状区域16位于形变件14的弯曲区域内，其面积小于或等于弯曲区域的面积。
可选地，如图4、图7及图8所示，在一些实施例中，形变件14可以为电路板112，并将传感器15直接设置于电路板112上，电路板112上设置有与传感器15电连接的传感控制电路，传感控制电路基于电信号执行相应的控制功能，如此设置，一方面，传感器15可以直接通过电路板112与传感控制电路连接，并且，电路板112作为布局耳机10的电路板件的同时，还用作为形变件14，为传感器15传递使用者的触控信号，有效地简化耳机10的内部走线和内部结构，从而有效地提升耳机10的空间利用率。
可选地，如图8所示，在一些实施例中，电路板112沿间隔方向的侧边缘(即侧边缘1122和侧边缘1123)与第一侧壁部US1和第二侧壁部LS1的内壁抵接设置，或者以一定间隙间隔设置。第一侧壁部US1和第二侧壁部LS1在对向挤压力F1的作用下挤压电路板112的相对两侧边缘(即侧边缘1122和侧边缘1123)，以使得电路板112的主表面1121发生侧向弯曲，传感器15设置于电路板112的主表面1121上。进一步，电路板112整体结构呈现为板状结构，其中，电路板112的主表面1121即为电路板112的板面，并且，电路板112的主表面1121与间隔方向呈一定预设角度设置，其中，预设角度大于等于0°，且小于等于5°，例如，预设角度可以是5°，如此设置，使得电路板112在第一侧壁部US1和第二侧壁部LS1的挤压下更易发生形变，从而有效地提升耳机10的控制灵敏度。
具体地，在一些实施例中，在自然状态下，电路板112沿间隔方向的侧边缘(即侧边缘1122和侧边缘1123)与第一侧壁部US1和第二侧壁部LS1的内壁抵接设置，如此设置第一侧壁部US1和第二侧壁部LS1在受到对向挤压力F1时，第一侧壁部US1和第二侧壁部LS1能在第一时间向电路板112传递对向挤压力F1，从而有效地提升耳机10的控制响应速度，进而有效地提升用户的使用体验。
具体地，如图9所示，在一些实施例中，在自然状态下且沿间隔方向，第一侧壁部US1和第二侧壁部LS1分别与相邻的电路板112的侧边缘之间保持第一间隙Jx2。具体地，沿间隔方向，电路板112包括相对设置的两个侧边缘(即侧边缘1122和侧边缘1123)，其中，一侧边缘1123与第一侧壁部US1以第一间隙Jx2相邻间隔设置，另一侧边缘1122与第二侧壁部LS1以第一间隙Jx2相邻设置，如此设置在自然状态下，第一侧壁部US1和第二侧壁部LS1均能保持距离并不发生接触，从而防止第一侧壁部US1和第二侧壁部LS1由于使用者的误触操作，导致电路板112形变，导致耳机10随机执行一些不符合使用者意愿的耳机10功能，进而有效地提升耳机10的控制精度和控制功能的抗干扰能力。其中，第一间隙Jx2为第一侧壁部US1的内侧到电路板112的最小距离(也即第一侧壁部US1的内侧到侧边缘1123之间的距离)，以及第一间隙Jx2为第二侧壁部LS1的内侧到电路板112的最小距离(也即第二侧壁部LS1的内侧到侧边缘1122之间的距离)，也即第一侧壁部US1的内侧到电路板112的最小距离和第二侧壁部LS1的内侧到电路板112的最小距离均设置为第一间隙Jx2，如此能有效地确保第一侧壁部US1和第二侧壁部LS1在受到对向挤压时能保持较好的受力稳定性，防止耳机10在受到使用者的对向按压力时出受力不平衡的情况，导致耳机10从使用者的耳部掉落。
当然，在一些实施例中，第一侧壁部US1的内侧与电路板112的最小距离和第二侧壁部LS1与电路板112的最小距离，也可以设置为不相等，例如，第一侧壁部US1和第二侧壁部LS1中的一者可以直接与电路板112抵接，另一者与电路板112保持第一间隙Jx2设置，如此即使使用者对耳机10产生误触操作，第一侧壁部US1和第二侧壁部LS1中的另一者还能通过第一间隙Jx2与电路板112保持距离，从而防止第一侧壁部US1和第二侧壁部LS1同时挤压电路板112，以致电路板112产生形变，从而依然能在一定程度上提升耳机10的控制精度和控制功能的抗干扰能力。换而言之，在一自然状态下且沿间隔方向，只需第一侧壁部US1和第二侧壁部LS1中一者与电路板112以第一间隙Jx2的最小距离间隔设置，即可有效地防止电路板112由于使用者的误触操作发生形变，从而有效地提升耳机10的操作精度和控制功能的抗干扰能力。其中，本文主要以第一侧壁部US1的内侧到电路板112的最小距离和第二侧壁部LS1的内侧到电路板112的最小距离均设置为第一间隙Jx2的实施例，对本申请的耳机10进行详细的阐述。
可选地，在一些实施例中，第一间隙Jx2设置成大于在对向挤压力F1为第一压力阈值时第一侧壁部US1和第二侧壁部LS1的形变量，且小于在对向挤压力F1为第二压力阈值时第一侧壁部US1和第二侧壁部LS1的形变量，第一压力阈值不小于0.5牛，第二压力阈值介于1牛～5牛之间。其中，第一压力阈值为由使用者误触操作而作用在第一侧壁部US1和第二侧壁部LS1上的对向挤压力F1的一个极限值，故此将第一间隙Jx2设置成大于在对向挤压力F1为第一压力阈值时第一侧壁部US1和第二侧壁部LS1的形变量，能有效地提升耳机10的控制精度和控制功能的抗干扰能力。进一步地，第二压力阈值可以为能够触发耳机10的耳机10功能时的一个最小值，将第一间隙Jx2设置成小于在对向挤压力F1为第二压力阈值时第一侧壁部US1和第二侧壁部LS1的形变量，能有效地耳机10的压控舒适度。其中，将第一压力阈值设置为不小于0.5牛，能进一步地提升耳机10的控制精度和控制功能的抗干扰能力。将第二压力阈值设置为介于1牛～5牛之间，能进一步地提升耳机10的压控舒适度。
可选地，如图8及图9所示，在一些实施例中，如上述内容所阐述的，壳体组件110包括沿预设的配合方向与第一壳体1101配合的第二壳体1102，其中，第二壳体1102包括沿间隔方向彼此相对且间隔设置的第三侧壁部US2和第四侧壁部LS2，第三侧壁部US2和第四侧壁部LS2沿配合方向插入第一侧壁部US1和第二侧壁部LS1之间且部分重合，在自然状态下且沿间隔方向，第一侧壁部US1与相邻的第三侧壁部US2之 间以及第二侧壁部LS1与相邻的第四侧壁部LS2之间分别保持第二间隙Jx1，第二间隙Jx1大于第一间隙Jx2。具体地，如上述内容所阐述的，第三侧壁部US2和第四侧壁部LS2沿为第二壳体1102的侧壁沿间隔方向间隔设置的两个侧壁部。其中，第三侧壁部US2和第四侧壁部LS2沿配合方向插入第一侧壁部US1和第二侧壁部LS1之间且部分重合，可以理解为，第一壳体1101和第二壳体1102沿配合方向配合后，第三侧壁部US2和第三侧壁部US2设置有第二环部1102a的部位，插入第一环部1101a内侧，并与第一环部1101a重合。其中，在自然状态下且沿间隔方向，第一侧壁部US1与相邻的第三侧壁部US2之间以及第二侧壁部LS1与相邻的第四侧壁部LS2之间分别保持第二间隙Jx1，第二间隙Jx1大于第一间隙Jx2，可以理解为，在自然状态下且沿间隔方向，第一环部1101a和第二环部1102a存在第二间隙Jx1，也即上述内容所阐述的点胶间隙。其中，第一壳体1101作为接收使用者的对向挤压力F1的主要部件，并且第二壳体1102与第一壳体1101沿间隔方向存在抵靠关系，所以第二壳体1102会对第一侧壁部US1和第二侧壁部LS1的形变造成一定的阻力，故此将第二间隙Jx1设置为大于第一间隙Jx2，有效地减小在第一侧壁部US1和第二侧壁部LS1挤压电路板112的形变行程中，第二壳体1102对第一侧壁部US1和第二侧壁的阻力，从而确保第一侧壁部US1和第二侧壁能顺利地与电路板112抵接，以有效地提升耳机10的压控功能的稳定性。
可选地，如图8所示，在一些实施例中，如上述内容所阐述的，第一壳体1101进一步包括连接第一侧壁部US1和第二侧壁部LS1的第一顶壁部OS1，第二壳体1102进一步包括连接第三侧壁部US2和第四侧壁部LS2的第二顶壁部OS2，第一顶壁部OS1和第二顶壁部OS2沿配合方向彼此相对且间隔设置，电路板112位于第一顶壁部OS1和第二顶壁部OS2之间。其中，沿配合方向，电路板112的一侧边缘1123与第一侧壁部US1和第三侧壁部US2的重合部分进一步重合，电路板112的另一侧边缘1122与第二侧壁部LS1和第四侧壁部LS2的重合部分进一步重合。具体地，如上述内容所阐述的，沿配合方向，第一顶壁位于，第一侧壁部US1和第二侧壁部LS1一端并分别与第一侧壁部US1和第二侧壁部LS1，如此设置使得第一侧壁部US1、第二侧壁部LS1及第一顶壁部OS1之间呈现悬臂状设置，也即第一侧壁部US1和第二侧壁部LS1类似悬挂设置于第一顶壁部OS1上，基于此使得第一侧壁部US1和第二侧壁部LS1背离第一顶壁部OS1的一端(也即沿配合方向，靠近第一侧壁部US1与第三侧壁部US2重合部分，以及靠近第二侧壁部LS1与第四侧壁部LS2的重合部分)更易发生形变，故此沿间隔方向将电路板112的一侧边缘1123与第一侧壁部US1和第三侧壁部US2的重合部分进一步重合，电路板112的另一侧边缘1122与第二侧壁部LS1和第四侧壁部LS2的重合部分进一步重合，能更有利于第一侧壁部US1和第二侧壁部LS1分别与电路板112的挤压，从而有效地提升耳机10的压控功能的稳定性。当然，在一些实施例中，沿间隔方向，电路板112的两侧边缘(即侧边缘1122和侧边缘1123)也可以设置为分别于第三侧壁部US2和第四侧壁部LS2存在重合关系，并且，第三侧壁部US2的内侧与电路板112之间的最小距离也为第一间隙Jx2，第四侧壁部LS2的内侧与电路板112之间的最小间隔距离也为第一间隙Jx2，如此设置，在第一侧壁部US1和第二侧壁部LS1受到对向挤压力F1时，第一侧壁部US1和第三侧壁部US2能一起挤压主控板电路的一侧边缘1123，第二侧壁部LS1和第四侧壁部LS2能一起挤压电路板112的另一侧边缘1122，从而有效地防止第一侧壁部US1和第三侧壁部US2发生错位以及第二侧壁部LS1和第四侧壁部LS2发生错位，导致第一壳体1101和第二壳体1102出现松动。
可选地，如图5及图10所示，在一些实施例中，如上述内容所阐述的，耳机10进一步包括设置于壳体组件110内的电路板112。其中，形变件14独立于电路板112，电路板112上设置有与传感器15电连接的主控电路，主控电路基于电信号执行相应的控制功能。具体地，形变件14作为一个独立的部件设置在壳体组件110内，且传感器15设置在形变件14上，基于此能有效地减小传感器15对主控板电路的占用空间，降低电路板112的设计复杂度。
可选地，如图5及图10所示，在一些实施例中，沿间隔方向，形变件14包括相对设置的两个抵接部141，第一侧壁部US1和第二侧壁部LS1上均设置有抵接槽，两个抵接部141分别设置于对应的抵接槽内，在一些实施例中，抵接部141可通过点胶方式与抵接槽固定连接，如此设置能有效地提升形变件14与壳体组件110的连接稳定性，以确保耳机10的触控稳定性。
优选地，如图5及图10所示，形变件14进一步包括拱形部142，其中，两个抵接部141分别连接于拱形部142两端且远离拱形部142延伸，以形成完整的形变件14，拱形部142从拱形部142的两端沿间隔方向的垂直方向呈供起状设置，传感器15设置于拱形部142上，两个抵接部141分别与第一侧壁部US1及第二侧壁部LS1抵接。具体地，在一些实施例中，沿间隔方向，传感器15设置于拱形部142的中部，换而言之，沿间隔方向，拱形部142至少中间区域设置为板状区域16，传感器15设置于板状区域16，其中，拱形部142从拱形部142的两端沿间隔方向的垂直方向呈拱起状设置，在第一侧壁部US1和第二侧壁部LS1受到对向挤压力F1时产生形变，并挤压两个抵接部141，以使两个抵接部141挤压拱形部142，从而使得拱形部142发生形变。如此设置，使得拱形部142受到两个抵接部141的挤压时，能更好地产生形变，从而有效地提升耳机10的控制精度。
可选地，在一些实施例中，形变件14由板材或片材弯折而成，拱形部142呈ㄇ型、U形或C型设置。当然，在其它一些实施例中，形变件14也可以由棒状件、棍状件等弯折形成。
可选地，如图5及图10所示，在一些实施例中，如上述内容所阐述的，耳机10还包括设置于壳体组件 110内的扬声器111，电路板112的主表面1121沿扬声器111的轴向z1与扬声器111重叠设置，形变件14沿扬声器111的径向设置于述扬声器111的侧向，形变件14的主表面143与电路板112的主表面1121彼此交叉设置，如此设置能有效地提升壳体组件110内部的空间利用率。其中，在一些实施例中，拱形部142的厚度设置为0.2mm、宽度设置为1.9mm、长度设置为11.5mm，其中，拱形部142的宽度为沿扬声器111的轴向z1上的结构长度，拱形部142的长度为沿间隔方向上的结构长度，拱形部142的厚度为沿壳体组件110的长度方向Y上的结构长度。可选地，在其它实施例中，电路板112的主表面1121和形变件14的主表面143沿扬声器111的轴向z1与扬声器111重叠设置。其中，扬声器111的轴向z1与机芯模组11的厚度方向X平行设置。
可选地，在一些实施例中，耳机10进一步包括与壳体组件110连接的耳挂部12，耳挂部12用于在佩戴状态将壳体组件110在使用者的耳廓前侧，形变件14沿扬声器111的径向设置于扬声器111靠近耳挂的一侧，如此设置能有效地提升壳体组件110的空间利用率。
可选地，如图6及图11所示，在一些实施例中，形变件14还可以是第二壳体1102，具体地，第二壳体1102包括第三侧壁部US2、第四侧壁部LS2及第二顶壁部OS2，其中，第二壳体1102通过上述实施例所阐述的方式与第一壳体1101配合，传感器15设置于第二顶壁部OS2上，当第一侧壁部US1和第二侧壁部LS1受到对向挤压力F1并发生形变时，第一侧壁部US1和第二侧壁部LS1分别挤压第三侧壁部US2和第四侧壁部LS2，以使第三侧壁部US2和第四侧壁部LS2拉扯第二顶壁部OS2，并使第二顶壁部OS2发生形变，设置于第二顶壁部OS2上的传感器15检测到第二顶壁部OS2的形变后产生电信号。其中，传感器15通过软质电路板17/导线组件与电路板112电连接，从而将电信号传递至电路板112的主控电路上。如此设置能有效地简化耳机10的结构，优化耳机10的空间利用率。
并且，在一些实施例中，电路板112位于扬声器111和第二顶壁部OS2之间，如此设置，使得传感器15能尽可能地靠近电路板112，从而减小软质电路板17的长度，有效地提升壳体组件110的内部空间利用率。
可选地，在一些实施例中，形变件14也可以是第一壳体1101的顶壁，例如，第一顶壁部OS1。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (19)

  1. 一种耳机，其特征在于，所述耳机包括壳体组件，所述壳体组件包括第一壳体，所述第一壳体包括沿彼此相对且间隔设置的第一侧壁部和第二侧壁部，所述耳机还设置有形变件和传感器，所述形变件设置于所述第一侧壁部和所述第二侧壁部之间，所述第一侧壁部和/或所述第二侧壁部在受到从外侧沿所述第一侧壁部和所述第二侧壁部的间隔方向施加的对向挤压力时产生形变，并共同挤压所述形变件，以使所述形变件向所述间隔方向的侧向弯曲，所述传感器设置于所述形变件的弯曲区域内，并在所述弯曲区域的弯曲程度大于预设弯曲阈值时产生相应的电信号。
  2. 根据权利要求1所述的耳机，其特征在于，所述形变件具有板状区域，所述板状区域设置成在所述第一侧壁部和所述第二侧壁部的挤压作用下朝向所述板状区域的主表面的侧向弯曲，所述传感器设置于所述板状区域上。
  3. 根据权利要求2所述的耳机，其特征在于，所述形变件为主控电路板，所述传感器设置于所述电路板上，所述电路板上设置有与所述传感器电连接的主控电路，所述主控电路基于所述电信号执行相应的控制功能。
  4. 根据权利要求3所述的耳机，其特征在于，所述电路板的主表面沿所述间隔方向设置，所述第一侧壁部和所述第二侧壁部在所述对向挤压力的作用下挤压所述电路板的相对两侧边缘，以使得所述电路板的主表面发生侧向弯曲，所述传感器设置于所述电路板的主表面上。
  5. 根据权利要求4所述的耳机，其特征在于，在自然状态下且沿所述间隔方向，所述第一侧壁部和所述第二侧壁部分中的至少一者与其相邻的所述电路板的侧边缘之间保持第一间隙。
  6. 根据权利要求5所述的耳机，其特征在于，所述第一间隙设置成大于在所述对向挤压力为第一压力阈值时所述第一侧壁部和所述第二侧壁部的形变量，且小于在所述对向挤压力为第二压力阈值时所述第一侧壁部和所述第二侧壁部的形变量，所述第一压力阈值不小于0.5牛，所述第二压力阈值介于1牛～5牛之间。
  7. 根据权利要求5所述的耳机，其特征在于，所述壳体组件还包括沿预设的配合方向与所述第一壳体配合的第二壳体，所述配合方向与所述间隔方向交叉设置，所述第二壳体包括沿所述间隔方向间隔设置的第三侧壁部和第四侧壁部，所述第三侧壁部和所述第四侧壁部沿所述配合方向插入所述第一侧壁部和所述第二侧壁部之间且部分重合，在自然状态下且沿所述间隔方向，所述第一侧壁部与相邻的所述第三侧壁部之间以及所述第二侧壁部与相邻的所述第四侧壁部之间分别保持第二间隙，所述第二间隙大于所述第一间隙。
  8. 根据权利要求7所述的耳机，其特征在于，所述第一壳体进一步包括连接所述第一侧壁部和所述第二侧壁部的第一顶壁部，所述第二壳体进一步包括连接所述第三侧壁部和所述第四侧壁部的第二顶壁部，所述第一顶壁部和所述第二顶壁部沿所述配合方向彼此相对且间隔设置，所述电路板位于所述第一顶壁部和所述第二顶壁部之间，沿所述配合方向，所述电路板的一侧边缘与所述第一侧壁部和所述第三侧壁部的重合部分进一步重合，所述电路板的另一侧边缘与所述第二侧壁部和所述第四侧壁部的重合部分进一步重合。
  9. 根据权利要求2所述的耳机，其特征在于，所述耳机进一步包括设置于所述壳体组件内的电路板，所述形变件独立于所述电路板，所述电路板上设置有与所述传感器电连接的主控电路，所述主控电路基于所述电信号执行相应的控制功能。
  10. 根据权利要求9所述的耳机，其特征在于，沿所述间隔方向，所述形变件包括拱形部以及分别连接于所述拱形部两端且远离所述拱形部延伸的两个抵接部，所述拱形部从所述拱形部的两端沿所述间隔方向的垂直方向呈供起状设置，所述传感器设置于所述拱形部上，所述两个抵接部分别与所述第一侧壁部及所述第二侧壁部抵接。
  11. 根据权利要求10所述的耳机，其特征在于，沿所述间隔方向，所述传感器设位于所述拱形部的中部。
  12. 根据权利要求10所述的耳机，其特征在于，所述形变件由板材或片材弯折而成，所述拱形部呈ㄇ型、U形或C型设置。
  13. 根据权利要求10所述的耳机，其特征在于，所述耳机还包括设置于所述壳体组件内的扬声器，所述电路板的主表面沿所述扬声器的轴向与所述扬声器重叠设置，所述形变件沿所述扬声器的径向设置于所述述扬声器的侧向，所述形变件的主表面与所述电路板的主表面彼此交叉设置。
  14. 根据权利要求13所述的耳机，其特征在于，所述耳机进一步包括与所述壳体组件连接的耳挂部，所述耳挂部用于在佩戴状态将所述壳体组件在使用者的耳廓前侧，所述形变件沿所述扬声器的径向设置于所述扬声器靠近所述耳挂的一侧。
  15. 根据权利要求10所述的耳机，其特征在于，所述耳机还包括设置于所述壳体组件内的扬声器，所 述电路板的主表面和所述形变件的主表面沿所述扬声器的轴向与所述扬声器重叠设置，且彼此重叠设置。
  16. 根据权利要求2所述的耳机，其特征在于，所述第一壳体进一步包括连接所述第一侧壁部和所述第二侧壁部的第一顶壁部，所述形变件为所述第一顶壁部，或者所述壳体组件进一步包括与所述第一壳体配合的第二壳体，所述形变件为所述第二壳体。
  17. 根据权利要求1-16任意一项所述的耳机，其特征在于，所述壳体组件还包括所述第一壳体配合的第二壳体，所述耳机还包括设置于所述壳体组件内的扬声器以及与所述壳体组件连接的耳挂部，所述耳挂部用于在佩戴状态将所述壳体组件在使用者的耳廓前侧，所述扬声器至少大部分或整体位于所述第一壳体内。
  18. 根据权利要求17所述的耳机，其特征在于，所述壳体组件包括与所述耳挂部连接的连接端和远离所述连接端的自由端，所述壳体组件进一步具有彼此正交的长度方向、宽度方向和厚度方向，其中所述长度方向定义为由所述自由端朝向或背离所述连接端的方向，所述厚度方向定义为在佩戴状态下朝向或背离所述耳廓的方向，所述第一侧壁部和所述第二侧壁部沿所述宽度方向彼此间隔设置。
  19. 根据权利要求18所述的耳机，其特征在于，所述第一侧壁部和所述第二侧壁部沿所述长度方向的尺寸大于沿所述厚度方向的尺寸。
PCT/CN2024/095598 2024-05-27 2024-05-27 耳机 Pending WO2025245673A1 (zh)

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CN214851755U (zh) * 2021-05-10 2021-11-23 深圳瑞湖科技有限公司 一种压感耳机
CN215734837U (zh) * 2021-08-13 2022-02-01 万魔声学股份有限公司 一种按压检测装置及耳机
CN115150701A (zh) * 2021-03-31 2022-10-04 苹果公司 力激活式耳机

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US20200092629A1 (en) * 2018-09-14 2020-03-19 Apple Inc. Elastomeric Pressure Transduction Based User Interface
CN115150701A (zh) * 2021-03-31 2022-10-04 苹果公司 力激活式耳机
CN214851755U (zh) * 2021-05-10 2021-11-23 深圳瑞湖科技有限公司 一种压感耳机
CN215734837U (zh) * 2021-08-13 2022-02-01 万魔声学股份有限公司 一种按压检测装置及耳机

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