WO2025212331A1

WO2025212331A1 - Two-piece cooling plate for a showerhead of a substrate processing system

Info

Publication number: WO2025212331A1
Application number: PCT/US2025/021496
Authority: WO
Inventors: Jeremy Jerome POOL; Andrew BORTH; Sean M. Donnelly; Troy GOMM
Original assignee: Lam Research Corp
Current assignee: Lam Research Corp
Priority date: 2024-04-02
Filing date: 2025-03-26
Publication date: 2025-10-09
Anticipated expiration: 2026-10-02
Also published as: TW202603830A

Abstract

A cooling plate for a showerhead includes an outer annular portion comprising a first annular body including a first cavity extending in an axial direction, an inlet, a first fluid passage extending from the inlet to the first cavity, an outlet, and a second fluid passage extending from the first cavity to the outlet. An inner annular portion is arranged in the first cavity of the outer annular portion and comprises a second annular body including a second cavity extending in an axial direction and configured to receive a stem portion of a showerhead, a radially outer surface, and a fluid channel defined on the radially outer surface. The fluid channel is in fluid communication with the first fluid passage and the second fluid passage.

Description

TWO-PIECE COOLING PLATE FOR A SHOWERHEAD OF A SUBSTRATE PROCESSING SYSTEM

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63/573,254, filed on April 2, 2024. The entire disclosure of the above application is incorporated herein by reference.

FIELD

[0002] The present disclosure relates to cooling plates for substrate processing systems, and more particularly to a two-piece cooling plate for a showerhead of a substrate processing system.

BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] Substrate processing systems may be used to treat substrates such as semiconductor wafers. The treatments may include deposition, etching, cleaning, and/or other treatments. During processing, a substrate is arranged on a substrate support such as a pedestal or an electrostatic chuck (ESC) in a processing chamber of the substrate processing system. Process gas mixtures are introduced into the processing chamber using a gas delivery system. In some processes, radio frequency (RF) plasma may be used to initiate chemical reactions.

[0005] The gas delivery system includes a showerhead including a stem and a base portion that extend into the processing chamber. The stem portion includes a gas channel connected to a gas plenum defined in the base portion. A cover plate covers the gas plenum and includes gas through holes.

[0006] A heater may be arranged in the showerhead to heat the showerhead to a setpoint temperature. Some heaters may require a long period to heat the showerhead to the predetermined temperature, which reduces throughput. Some heaters may be operated frequently near a maximum output power to reach the predetermined temperature, which may cause premature heater failure. Failure to heat the showerhead to the predetermined temperature may cause substrate processing nonuniformity.

SUMMARY

[0007] A cooling plate for a showerhead includes an outer annular portion including a first annular body. The first annular body includes a first cavity extending in an axial direction, an inlet, a first fluid passage extending from the inlet to the first cavity, an outlet, and a second fluid passage extending from the first cavity to the outlet. An inner annular portion is arranged in the first cavity of the outer annular portion and comprises a second annular body. The second annular body includes a second cavity extending in an axial direction and configured to receive a stem portion of a showerhead, a radially outer surface, and a fluid channel defined on the radially outer surface, wherein the fluid channel is in fluid communication with the first fluid passage and the second fluid passage.

[0008] In other features, the inner annular portion further comprises a first annular channel arranged adjacent to one side of the fluid channel and a second annular channel arranged adjacent to the other side of the fluid channel.

[0009] In other features, a first seal and a second seal are arranged in the first annular channel and the second annular channel, respectively. N bores extend in an axial direction in the inner annular portion of the cooling plate, where N is an integer greater than zero. N heaters arranged in the N bores.

[0010] In other features, the outer annular portion of the cooling plate includes an annular base portion and an annular stem portion extending from the base portion. The outer annular portion includes a projection extending radially inwardly from a distal end of the stem portion of the outer annular portion.

[0011] In other features, a bottom surface of the projection is in contact with an adjacent surface of the showerhead, and an upper surface of the projection contacts a lower surface of the inner annular portion. The fluid channel of the inner annular portion is located a predetermined distance from a lower edge of the second annular body. A corrosion-resistant film is coated on the fluid channel of the inner annular portion and on a corresponding surface of the outer annular portion. [0012] In other features, the annular base portion of the outer annular portion includes M bores extending axially therethrough at a location radially outside of the annular stem portion of the outer annular portion, where M is an integer greater than zero. The M bores are configured to provide access through the annular base portion to height adjusters of a height/tilt adjustment device, where M is an integer greater than one. The annular base portion of the outer annular portion includes P bores extending axially therethrough at a location radially outside of the annular stem portion of the outer annular portion, where P is an integer greater than zero.

[0013] In other features, the P bores are configured to receive P fasteners configured to attach the cooling plate to a height/tilt adjustment device.

[0014] A substrate processing system includes the cooling plate, a height/tilt adjustment device, and a showerhead including a stem portion and a base portion. The stem portion of the showerhead is received in the second cavity of the inner annular portion and the cooling plate is attached to the height/tilt adjustment device.

[0015] In other features, the height/tilt adjustment device includes a first annular plate attached to a top wall of a processing chamber, a second annular plate attached to the cooling plate, and a plurality of height adjusters arranged between the first annular plate and the second annular plate.

[0016] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0018] FIG. 1 is a functional block diagram of an example of a substrate processing system including a showerhead, a height/tilt adjustment device, and a cooling plate according to the present disclosure;

[0019] FIG. 2 is a more detailed cross section of the showerhead, the height/tilt adjustment device, and a single-piece cooling plate; [0020] FIG. 3A is a perspective cross sectional view of a two-piece cooling plate according to the present disclosure;

[0021] FIG. 3B is a plan view of an inner annular portion of the two-piece cooling plate according to the present disclosure; and

[0022] FIGS. 4A and 4B are cross sections of examples of fluid passages.

[0023] In the drawings, reference numbers may be reused to identify similar and/or identical elements.

DETAILED DESCRIPTION

[0024] Some processes such as deposition of ashable hard masks (AHMs) may require the showerheads to be heated to a setpoint temperature (such as 400°C). The showerheads are slow to heat, may be unable to reach the setpoint temperature, and/or may be unable to reach the setpoint temperature within a predetermined period (e.g., even with the heaters running at or near maximum power output).

[0025] The showerhead is typically attached to the processing chamber by a cooling plate and an optional height/tilt adjustment device. The cooling plate includes an internal fluid channel for receiving cooling fluid such as liquid coolant. The cooling provided by the cooling plate may delay or prevent the heater from heating the showerhead to the predetermined temperature. Cooling provided by the cooling plate slows heating of the showerhead.

[0026] The time required for the showerhead to reach the setpoint temperature reduces tool throughput. Operating the showerhead at a temperature less than the setpoint temperature may cause processing nonuniformity. In addition, operating the showerhead heaters at or near the maximum output power increases the likelihood of heater failure. Heater failures cause substrates to be scrapped and increase tool downtime.

[0027] The present disclosure relates to a cooling plate for a showerhead that includes an outer annular portion and an inner annular portion. The inner annular portion is arranged in a first cavity defined by the outer annular portion. The inner annular portion defines a second cavity that receives a stem portion of the showerhead. The inner annular portion defines a fluid channel that is enclosed by a radially inner surface of the outer annular portion. [0028] The outer annular portion includes a lower surface including a projection defining a contact area with an upwardly facing surface of the showerhead. The fluid channel is located at a predetermined axial distance from the lower surface of the inner annular portion of the cooling plate. The size of the contact area, the size of the fluid channel, the predetermined distance between the fluid channel and the showerhead, and/or other parameters of the cooling plate are varied to adjust cooling performance of the cooling plate and heating of the showerhead.

[0029] Referring now to FIG. 1 , a substrate processing system 100 includes a processing chamber 102 including a gas distribution device 104 and a substrate support 106. The substrate support 106 includes a plate 112 made of metal and/or ceramic. In some examples, the substrate support 106 includes an electrostatic chuck (ESC). During operation, a substrate 108 is arranged on the substrate support 106. If an ESC is used, the plate 112 includes an electrostatic electrode 113 that is embedded therein and that is energized and deenergized to clamp and unclamp, respectively, the substrate 108 on the plate 112.

[0030] A gas delivery system 130 includes one or more gas sources 132. The gas sources 132 supply one or more process gas mixtures. For a deposition process, the process gas mixture may include carrier gas, inert gases, deposition precursor gases, etc. For an etching process, the process gas mixture may include carrier gas, inert gases, etching gas, etc. The gas sources 132 are connected by flow metering devices 134 (e.g., mass flow controllers and valves) to a manifold 140. An output of the manifold 140 is fed to the gas distribution device 104.

[0031] In some examples, a vapor delivery system 170 includes one or more vapor delivery sources that supply vapor to the manifold 140 or connect to the gas distribution device 104 downstream from the manifold 140. In some examples, the vapor delivery system 170 includes one or more ampoules 174, vaporizers 176, and flow metering devices 178 to controllably supply the vapor to the processing chamber.

[0032] In some examples, a temperature controller 142 is connected to heating elements 144 (e.g., thermal control elements (TCEs) or resistive heaters) arranged in or in thermal contact with the plate 112. The temperature controller 142 may be used to supply power to the heating elements 144 to control a temperature of the substrate support 106 and the substrate 108 during processing. The temperature controller 142 also operates a coolant assembly 146 that supplies coolant to a cooling plate described below. For example, the coolant assembly 146 may include a coolant pump and coolant reservoir (not shown). The temperature controller 142 operates the coolant assembly 146 to selectively flow the coolant to the cooling plate described below.

[0033] A valve 150 and a pump 152 are connected to a gas line 148 (e.g., an exhaust gas line) and are used to control pressure within the processing chamber 102 and/or to evacuate reactants from the processing chamber 102. A plasma generator 154 includes a radio frequency (RF) source 156 to output RF voltage/power to a matching network 158. The matching network 158 matches the impedance of the RF source 156 to the impedance of the load including the processing chamber and plasma. A controller 160 may be used to monitor system parameters and to control components of the substrate processing system 100 based on a recipe. One or more robots 161 may be used to deliver substrates onto, and remove substrates from, the substrate support 106 through a port (not shown).

[0034] The gas distribution device 104 includes a showerhead 180 including a stem portion 181 extending vertically from a base portion 182. The stem portion includes a gas channel 179 extending vertically therethrough and connecting with a gas plenum 185. The base portion 182 includes a slanted surface 183 extending in a downward direction at an obtuse angle relative to a vertical sidewall of the stem portion 181. A lower horizontal portion of the base portion 182 defines the gas plenum 185. The gas channel 179 extends through the stem portion 181 and the base portion 182 to the gas plenum 185. A cover plate 186 is arranged over the gas plenum 185 and includes a plurality of gas through holes 187 that allow gas to flow from the gas plenum 185 into the processing chamber.

[0035] Heaters 188 extend into the stem portion 181 and/or the base portion 182 to heat the showerhead 180. In some examples, the showerhead 180 is connected to a cooling plate 192 and an optional height/tilt adjustment device 190 and/or the processing chamber 102. The height/tilt adjustment device 190 allows adjustment of the height and/or tilt of the showerhead relative to the substrate support. In other examples, the height/tilt adjustment device 190 is omitted and the showerhead 180 is mounted directly on an exterior surface of the processing chamber 102.

[0036] Referring now to FIG. 2, the height/tilt adjustment device 190 includes a first annular plate 220 that is attached to a horizontal surface 219 on a top wall 223 of the processing chamber. In some examples, the first annular plate 220 includes an axially projecting portion 222 extending in a downward direction towards the substrate. A radially inner surface 224 of the axially projecting portion 222 defines a gap 226 with an outer surface of the stem portion 181. The axially projecting portion 222 defines a horizontal surface 228 that contacts a horizontal surface of an annular channel 225 in the top wall of the processing chamber. In some examples, a seal 230 (e.g., such as an O-ring or other elastomeric seal with a non-circular cross section) is arranged in a channel 231 to provide a gas seal. In some examples, the axially projecting portion 222, the horizontal surface 228, and/or the horizontal surface of the annular channel 225 are omitted. When these features are omitted, the seal 230 and the channel 231 can be located on the horizontal surface 219.

[0037] The height/tilt adjustment device 190 includes a second annular plate 240 arranged above the first annular plate 220. The second annular plate 240 includes an upper surface 243 and a lower surface 244. One or more height adjusters 250 (e.g., such as a threaded fastener and/or spacing blocks) may be used to adjust the height or tilt of the showerhead 180 relative to the substrate. The height can be adjusted by changing all of the height adjusters 250 by the same amount. The tilt of the showerhead can be adjusted by changing some of the height adjusters 250 differently than others of the height adjusters 250. Opposite ends of a bellows 221 are attached to the first annular plate 220 and the second annular plate 240, respectively, to provide a seal between the first annular plate 220 and the second annular plate 240. The cooling plate 192 is attached around the stem portion 181 of the showerhead 180 and is attached to and supported by the height/tilt adjustment device 190.

[0038] The cooling plate 192 typically includes a single unitary component that is assembled using welding and/or brazing. The cooling plate 192 includes an annular base portion 262 and an annular stem portion 264 (extending in a direction towards the substrate). The annular base portion 262 and the annular stem portion 264 define a center opening 266. In some examples, a horizontal surface of the annular base portion 262 may include an annular channel 241 and a seal 242 (e.g., such as an O-ring or seals with other cross-sectional shapes) to provide a seal. In other examples, the annular channel 241 and the seal 242 are arranged on the second annular plate 240 as shown in FIG. 2 and not on the annular base portion 262.

[0039] The center opening 266 surrounds a vertical outer surface of the stem portion 181 of the showerhead 180. In some examples, there is a radial clearance between the center opening 266 and the adjacent surface on the stem portion 181. A lower horizontal surface 274 of the annular stem portion 264 is in contact with a horizontal surface 273 of the showerhead 180 defined at a transition between the stem portion 181 and the base portion 182 of the showerhead 180.

[0040] A radially outer surface of the annular stem portion 264 of the cooling plate 192 includes one or more fluid channels 268. A radially outer surface of the one or more fluid channels 268 are enclosed by an annular sleeve 272. The annular sleeve 272 is typically welded to the radially outer surface of the annular stem portion 264.

[0041] The cooling plate 192 experiences part-to-part cooling variability for several reasons. The fluid channel 268 is typically sealed by welding such as E-beam welding. Inconsistent E-beam weld penetration depth may be responsible for variations in coolant flow, which affects showerhead thermal performance. Inconsistent cooling plate-to-showerhead contact pressure may also cause cooling variability. Showerhead fasteners may have a short grip length. Small changes in fastener stretch can lead to loss of clamp load. For example, a contact pressure map takes on a variable cruciform shape illustrating variable contact pressure (e.g., focused around fastener locations).

[0042] Referring now FIGS. 3A and 3B, a cooling plate 300 is shown. The cooling plate 300 includes an outer annular portion 310 including an annular base portion 312. An annular stem portion 314 extends axially from the annular base portion 312. The outer annular portion 310 defines an annular cavity 329 configured to receive an inner annular portion 330 of the cooling plate 300.

[0043] The annular stem portion 314 includes a lower horizontal surface 318. In some examples, the lower horizontal surface 318 of the annular stem portion 314 includes a horizontal projection 320 (at a distal end of the annular stem portion 314) extending radially inwardly from an inner surface 321. The horizontal projection 320 extends below a radially outer edge of the inner annular portion 330. A radially outer edge of the horizontal projection 320 has a radius n and a radially inner edge of the horizontal projection 320 has a radius r The size of the contact area of the cooling plate is defined by an area between n and .

[0044] The annular base portion 312 defines an inlet fluid passage 324 and an outlet fluid channel 325. Fluid fittings 326 and 327 may be attached to the inlet fluid passage 324 and the outlet fluid channel 325, respectively, (e.g., using threads). [0045] The inner annular portion 330 includes an annular body 331 defining a cavity 334 arranged in the center of the annular body 331. In some examples, upper and/or lower openings 335 and 337, respectively, into the cavity 334 are sloped or chamfered. A radially outer surface of the inner annular portion 330 defines a fluid channel 332. The inner annular portion 330 includes vertical bores 333 configured to receive the heater 188. In some examples, the radially outer surface of the inner annular portion 330 defines a wall 350 (shown in FIG. 3B) separating inlet and outlet sides of the fluid channel 332. Fluid 360 flows through the fluid channel 332 in a single pass from the inlet fluid passage 324, through the fluid channel 332, to the outlet fluid channel 325.

[0046] In some examples, the radially outer surface of the inner annular portion 330 defines first and second annular channels 336 for receiving seals 338 (e.g., such as O- rings or seals with other non-circular cross sectional shapes) to provide a fluid seal against radially inner walls of the annular cavity 329. In some examples, the first and second annular channels 336 are arranged above and below the fluid channel 332.

[0047] The cooling plate 300 uses a two-piece design to define the fluid channel 332 that is sealed by the seal 338. The cooling plate 300 eliminates welding, which reduces variability in thermal resistance. The two-piece design also allows for application of a chemical film (e.g., at 339) to all wetted surfaces, which improves corrosion resistance. The two-piece design allows adjustment of the thermal resistance. The predetermined distance di can be adjusted to increase or decrease cooling. For example, the fluid channel 332 can be moved farther away from (or closer to) the contact area to increase (or decrease) thermal resistance.

[0048] The outer annular portion 310 may include one or more elongated holes 380 to allow access to the height adjusters 250. The outer annular portion 310 may also include bores 382 for receiving fasteners to attach the outer annular portion 310 to the second annular plate 240. The outer annular portion 310 and/or the inner annular portion 330 may include a bore for receiving on or more fasteners 390 for fixing relative positions of the outer annular portion 310 and the inner annular portion 330.

[0049] Referring now to FIGS. 4A and 4B, the fluid channel 332 can have any suitable design. For example, the fluid channel in FIGS. 3A and 3B defines a single pass. In FIG. 4A, the fluid channel 332 defines a helical path around the inner annular portion 330. In FIG. 4B, the inlet can be connected to a manifold 410 supplying M channels 414 separated by walls 415. The M channels 414 can be recombined in a manifold 420 connected to the outlet.

[0050] Fluid passages of the cooling plate 300 according to the present disclosure are sealed with the seals 338 instead of welded plugs to reduce manufacturing cost and part-to-part variations in cooling performance. The cooling plate 300 is modular which allows the inner and/or outer annular portions to be independently replaced.

[0051] The cooling plate 300 can be disassembled to inspect the fluid channel 332 for corrosion, pitting, and/or debris buildup. If debris buildup occurs, the fluid channel 332 can be cleaned and the cooling plate 300 can be reassembled without replacement. The modular design of the cooling plate enables successful application of the corrosion resistant film to wetter surfaces 339, which improves corrosion resistance. In some examples, the corrosion resistant film includes MIL-DTL-5541 Type II Class 1A, although other types of film can be used. Corrosion resistant film is difficult to apply successfully after welding of the cooling plate shown in FIG. 2 due to reduced clearance and access. If the corrosion resistant film is applied before welding, the film is typically damaged during welding.

[0052] As can be appreciated, the inner annular portion 330 and the outer annular portion 310 of the cooling plate can be designed with the same or different materials. A plurality of the outer annular portions 310 of the cooling plate 300 can be manufactured with contact areas having different sizes. A plurality of the inner annular portions 330 of the cooling plate 300 can be manufactured with different values of the predetermined distance di, d2, and/or height hi. Then, the inner annular portions 330 and the outer annular portions 310 can be mixed and matched to provide cooling plates with different thermal characteristics.

[0053] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and/or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0054] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0055] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform, or platforms for processing, and/or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and/or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and/or load locks connected to or interfaced with a specific system. [0056] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, non-transitory memory, and/or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and/or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or dies of a wafer.

[0057] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and/or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber. [0058] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and/or manufacturing of semiconductor wafers.

[0059] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and/or load ports in a semiconductor manufacturing factory.

Claims

CLAIMS What is claimed is:

1 . A cooling plate for a showerhead comprising: an outer annular portion comprising a first annular body including: a first cavity extending in an axial direction; an inlet; a first fluid passage extending from the inlet to the first cavity; an outlet; and a second fluid passage extending from the first cavity to the outlet; and an inner annular portion arranged in the first cavity of the outer annular portion and comprising a second annular body including: a second cavity extending in an axial direction and configured to receive a stem portion of a showerhead; a radially outer surface; and a fluid channel defined on the radially outer surface, wherein the fluid channel is in fluid communication with the first fluid passage and the second fluid passage.

2. The cooling plate of claim 1 , wherein the inner annular portion further comprises: a first annular channel arranged adjacent to one side of the fluid channel; and a second annular channel arranged adjacent to the other side of the fluid channel.

3. The cooling plate of claim 2, further comprising a first seal and a second seal arranged in the first annular channel and the second annular channel, respectively.

4. The cooling plate of claim 1 further comprising N bores extending in an axial direction in the inner annular portion of the cooling plate, where N is an integer greater than zero.

5. The cooling plate of claim 4, further comprising N heaters arranged in the N bores.

6. The cooling plate of claim 1 , wherein the outer annular portion of the cooling plate includes an annular base portion and an annular stem portion extending from the annular base portion.

7. The cooling plate of claim 6, wherein the outer annular portion includes a projection extending radially inwardly from a distal end of the stem portion of the outer annular portion.

8. The cooling plate of claim 7, wherein: a bottom surface of the projection is in contact with an adjacent surface of the showerhead, and an upper surface of the projection contacts a lower surface of the inner annular portion.

9. The cooling plate of claim 1 , wherein the fluid channel of the inner annular portion is located a predetermined distance from a lower edge of the second annular body.

10. The cooling plate of claim 1 , further comprising a corrosion-resistant film coated on the fluid channel of the inner annular portion and on a corresponding surface of the outer annular portion.

11 . The cooling plate of claim 6, wherein the annular base portion of the outer annular portion includes M bores extending axially therethrough at a location radially outside of the annular stem portion of the outer annular portion, where M is an integer greater than zero.

12. The cooling plate of claim 11 , wherein the M bores are configured to provide access through the annular base portion to height adjusters of a height/tilt adjustment device, where M is an integer greater than one.

13. The cooling plate of claim 6, wherein the annular base portion of the outer annular portion includes P bores extending axially therethrough at a location radially outside of the annular stem portion of the outer annular portion, where P is an integer greater than zero.

14. The cooling plate of claim 13, wherein the P bores are configured to receive P fasteners to attach the cooling plate to a height/tilt adjustment device.

15. A substrate processing system comprising: a cooling plate including an outer annular portion and an inner annular portion, the outer annular portion having a first annular body, the first annular body including a first cavity extending in an axial direction, an inlet, a first fluid passage extending from the inlet to the first cavity, an outlet, and a second fluid passage extending from the first cavity to the outlet, the inner annular portion arranged in the first cavity of the outer annular portion, the inner annular portion including a second annular body, the second annular body including a second cavity extending in an axial direction, a radially outer surface, and a fluid channel defined on the radially outer surface; a height/tilt adjustment device; and a showerhead including a stem portion and a base portion, wherein the fluid channel is in fluid communication with the first fluid passage and the second fluid passage, and wherein the stem portion of the showerhead is received in the second cavity of the inner annular portion and the cooling plate is attached to the height/tilt adjustment device.

16. The substrate processing system of claim 15, wherein the height/tilt adjustment device includes: a first annular plate attached to a top wall of a processing chamber; a second annular plate attached to the cooling plate; and a plurality of height adjusters arranged between the first annular plate and the second annular plate.