WO2025140354A1 - Charging device - Google Patents
Charging device Download PDFInfo
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- WO2025140354A1 WO2025140354A1 PCT/CN2024/142519 CN2024142519W WO2025140354A1 WO 2025140354 A1 WO2025140354 A1 WO 2025140354A1 CN 2024142519 W CN2024142519 W CN 2024142519W WO 2025140354 A1 WO2025140354 A1 WO 2025140354A1
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- Prior art keywords
- inner cavity
- extension portion
- charging device
- bottom shell
- heat
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present application relates to the field of electronic product accessories, and in particular to a charging device.
- an embodiment of the present application provides a charging device that can ensure good heat dissipation of electronic components inside the charging device while avoiding the problem of being scalded.
- an embodiment of the present application provides a charging device, comprising: a shell, the shell having an inner cavity and a mounting hole connected to the inner cavity; a heat exchange assembly, a first portion of the heat exchange assembly being located in the inner cavity, and a second portion extending out of the inner cavity through the mounting hole; an internal electronic device, disposed in the inner cavity and thermally connected to the first portion of the heat exchange assembly; a pin, connected to the second portion of the heat exchange assembly, one end of the pin being electrically connected to the internal electronic device in the inner cavity, and the other end thereof extending out of the inner cavity through the second portion.
- the second part of the heat exchange component includes a bottom shell, which is disposed in the mounting hole and seals the inner cavity, a surface of the bottom shell facing away from the shell body is exposed outside the inner cavity, and the pins pass through the bottom shell.
- the first portion includes a thermally conductive support
- the thermally conductive support is disposed within the inner cavity
- the thermally conductive support supports the internal electronic device.
- one end of the thermally conductive bracket close to the bottom shell is connected to the middle portion of the bottom shell.
- the internal electronic device includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are perpendicular to each other, and at least one of the first circuit board and the second circuit board is connected to the thermally conductive bracket.
- the heat conductive extension portion extends to at least one target heat dissipation device among the multiple target heat dissipation devices.
- the plurality of target heat dissipation devices include a rectifier chip, and the heat conductive extension portion includes a first extension portion, and the first extension portion extends to the rectifier chip.
- the plurality of target heat dissipation devices include a filter device and a transformer, and the heat conductive extension portion includes a second extension portion, and the second extension portion extends between the filter device and the transformer.
- the bottom case is made of an insulating material with high thermal conductivity; and/or the first portion includes a metal member and an insulating member, and the insulating member insulates the metal member from the internal electronic device.
- a plurality of fins are disposed on a surface of the bottom shell away from the inner cavity, and the plurality of fins are spaced apart from each other.
- a connection hole is provided on a side of the shell facing away from the mounting hole, the internal electronic device includes an electrical connector provided corresponding to the connection hole, and an external connector can be connected to the electrical connector through the connection hole.
- the shell includes an outer shell and an inner shell, the inner shell is arranged around the mounting hole, and the heat exchange component also includes a thermally conductive extension portion extending from the second portion toward the inner cavity, and the thermally conductive extension portion contacts the inner shell.
- an embodiment of the present application provides another charging device, comprising: a shell having an inner cavity, wherein the inner cavity is provided with an internal electronic device; a bottom shell connected to the shell, wherein the bottom shell is provided with pins electrically connected to the internal electronic device; a heat-conductive bracket located in the inner cavity, and wherein the heat-conductive bracket is thermally conductively connected to the internal electronic device and the bottom shell respectively.
- a first extension portion is provided on the thermally conductive bracket, the internal electronic device includes a target heat dissipation device, the first extension portion extends toward the target heat dissipation device, and the first extension portion is thermally conductively connected to the target heat dissipation device.
- the target heat dissipation device includes a first circuit board and a rectifier chip, the first circuit board is connected to the bottom shell, the rectifier chip is arranged on the first circuit board, and the first extension portion is thermally connected to the rectifier chip.
- the rectifier chip is disposed on a side of the first circuit board close to the inner wall of the housing, and the first extension portion extends to the rectifier chip and is in contact with and connected to the rectifier chip.
- the target heat dissipation device also includes a second circuit board and a filter device, the second circuit board is connected to the first circuit board; the filter device is arranged on the second circuit board, and the thermal conductive bracket is also provided with a second extension portion, and the second extension portion extends to the outer surface of the filter device.
- the filter device includes a first capacitor and a second capacitor
- the thermally conductive bracket further includes a third extending portion, and the third extending portion extends from the second extending portion to between the first capacitor and the second capacitor.
- the thermally conductive bracket includes a first end surface close to the bottom shell, the bottom shell includes a second end surface corresponding to the first end surface, and the first end surface is in contact with and connected to the second end surface.
- the thermally conductive bracket is an annular structure; and/or the thermally conductive bracket and the bottom shell are separate structures.
- a fixing bracket is disposed on one side of the bottom shell close to the inner cavity, one end of the pin is connected to the fixing bracket, and the other end extends through the bottom shell and is exposed on a side of the bottom shell away from the heat conductive bracket.
- the first part of the heat exchange component is thermally connected to the internal electronic device through the first part and then is conducted out of the inner cavity through the second part, and the pin is inserted into the second part. Therefore, when the charging device is plugged into the socket, the heat exchange component is the part of the charging device close to the socket. Therefore, after charging is completed, people will not touch the second part when unplugging the charging device from the socket.
- the above arrangement makes it possible to conduct the heat of the internal electronic device while preventing burns;
- the heat is thermally connected to the internal electronic device in the shell through a heat conductive bracket, and the heat conductive bracket is arranged in the inner cavity of the shell.
- the heat conductive bracket is thermally connected to the internal electronic device, the heat is conducted out of the inner cavity through the bottom shell, so that the heat of the internal electronic device can be conducted from the inner cavity toward the bottom shell to the outside of the inner cavity, which can further solve the problem of unsatisfactory heat dissipation effect on the basis of miniaturization of the charging device.
- FIG1 is a schematic diagram of the structure of a charging device provided in one embodiment of the present application.
- FIG. 2 is a schematic diagram of the exploded structure of the charging device shown in FIG. 1 .
- FIG. 3 is a schematic diagram of the exploded structure of the internal electronic components in the charging device shown in FIG. 1 .
- FIG. 4 is a side view of the charging device shown in FIG. 1 with the outer shell removed.
- FIG. 5 is a schematic structural diagram of the charging device shown in FIG. 1 from another angle.
- the target heat dissipation device 21 includes, for example, a first circuit board 22 and a rectifier chip 211, and the first circuit board 22 is connected to the bottom shell 43.
- the rectifier chip 211 is arranged on the first circuit board 22, and the first extension portion 421 extends to the rectifier chip 211 and is connected to the rectifier chip 211 by thermal conduction.
- the internal electronic device 20 in the charging device 100 will generate heat when working, but some electronic components emit relatively high heat when working, that is, high-heat electronic devices.
- the rectifier chip 211 in the present application belongs to a high-heat electronic device.
- the heat-conducting bracket 41 includes a first end face 4101 close to the bottom shell 43, the bottom shell 43 includes a second end face 4301 corresponding to the first end face 4101, and the first end face 4101 is in contact with and connected to the second end face 4301.
- the heat-conducting bracket 41 can be aligned with and fixedly connected to the bottom shell 43 by the first end face 4101 and the second end face 4301 being in contact with and connected to each other.
- the heat-conducting bracket 41 is configured as a ring structure, so that the heat absorbed by the heat-conducting bracket 41 can be conducted in a ring direction, achieving a rapid heat-averaging effect and avoiding the phenomenon of scalding caused by excessive local temperature.
- the heat-conducting bracket 41 is provided with a protrusion 44 protruding toward the bottom shell 43, the protrusion 44 is provided on the first end face 4101, and the second end face 4301 is correspondingly provided with a groove 433, and the protrusion 44 is connected to the groove 433.
- the heat-conducting bracket is, for example, a bracket in an annular shape, and the annular shape is hollow, and the hollow part is used to set the internal electronic device 20, that is, the heat-conducting bracket 41 can be sleeved on the outer side of the internal electronic device 20.
- the heat-conducting bracket 41 Since the heat-conducting bracket 41 is annular, its first end face 4101 in contact with the bottom shell 43 is similar to a hollow rectangle, and its heat conduction area is fixed.
- the protrusion 44 is provided on the heat-conducting bracket 41, which is equivalent to increasing the contact area with the bottom shell, that is, increasing the heat conduction connection area, so that the heat-conducting bracket 41 can transfer more heat to the bottom shell 43 and then discharge it from the bottom shell 43.
- the arrangement of the protrusion 44 and the groove 433 can facilitate the assembly of the heat-conducting bracket 41 and the bottom shell 43, and can also play a fool-proof effect to avoid assembly failure.
- a fixing bracket 17 is provided on one side of the bottom shell 43 close to the inner cavity 13 , and one end of the pin 30 electrically connected to the internal electronic device 20 is connected to the fixing bracket 17 .
- the outer surface of the thermally conductive bracket 41 is flush with the outer surface of the bottom case 43 .
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本申请涉及电子产品配件领域,尤其涉及一种充电装置。The present application relates to the field of electronic product accessories, and in particular to a charging device.
手机、平板、电脑等电子产品通常需要通过电源适配器等充电装置进行充电,随着人们对充电速度的要求变化,快充技术也逐渐成熟,但是快充功能的充电装置在工作时温度过高,现有的充电装置通常将内部电子器件的热量导向充电装置的各个表面,但是这样导致整个外壳的温度较高,用户在充电后从插座上拔下充电装置时会有烫手的感觉。Electronic products such as mobile phones, tablets, and computers usually need to be charged through charging devices such as power adapters. As people's requirements for charging speed change, fast charging technology has gradually matured. However, the temperature of charging devices with fast charging functions is too high when working. Existing charging devices usually direct the heat of internal electronic components to various surfaces of the charging device, but this causes the temperature of the entire casing to be high, and users will feel hot when unplugging the charging device from the socket after charging.
因此,如何保证充电装置内部电子器件良好的散热的同时避免烫手的问题成为了亟待解决的问题。Therefore, how to ensure good heat dissipation of the electronic components inside the charging device while avoiding the problem of being burned has become an urgent problem to be solved.
因此,为克服现有技术中存在的至少部分缺陷和不足,本申请实施例提供一种充电装置,能保证充电装置内部电子器件良好的散热的同时避免烫手的问题。Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, an embodiment of the present application provides a charging device that can ensure good heat dissipation of electronic components inside the charging device while avoiding the problem of being scalded.
具体地,一方面,本申请实施例提供一种充电装置,包括:壳体,所述壳体具有内腔和与所述内腔连通的安装孔;热交换组件,所述热交换组件的第一部分位于所述内腔内,第二部分通过所述安装孔伸出至所述内腔外;内部电子器件,设置在所述内腔内,与所述热交换组件的所述第一部分导热连接;插脚,连接于所述热交换组件的所述第二部分,所述插脚的一端在所述内腔内与所述内部电子器件电连接,相对的另一端穿过所述第二部分伸出至所述内腔外。Specifically, on the one hand, an embodiment of the present application provides a charging device, comprising: a shell, the shell having an inner cavity and a mounting hole connected to the inner cavity; a heat exchange assembly, a first portion of the heat exchange assembly being located in the inner cavity, and a second portion extending out of the inner cavity through the mounting hole; an internal electronic device, disposed in the inner cavity and thermally connected to the first portion of the heat exchange assembly; a pin, connected to the second portion of the heat exchange assembly, one end of the pin being electrically connected to the internal electronic device in the inner cavity, and the other end thereof extending out of the inner cavity through the second portion.
在一些实施例中,所述热交换组件的所述第二部分包括底壳,所述底壳设于所述安装孔并密封所述内腔,所述底壳背向所述壳体的表面暴露在所述内腔外,所述插脚穿设所述底壳。In some embodiments, the second part of the heat exchange component includes a bottom shell, which is disposed in the mounting hole and seals the inner cavity, a surface of the bottom shell facing away from the shell body is exposed outside the inner cavity, and the pins pass through the bottom shell.
在一些实施例中,所述第一部分包括导热支架,所述导热支架设置在所述内腔内,且所述导热支架支撑所述内部电子器件。In some embodiments, the first portion includes a thermally conductive support, the thermally conductive support is disposed within the inner cavity, and the thermally conductive support supports the internal electronic device.
在一些实施例中,所述导热支架靠近所述底壳的一端连接所述底壳的中部。In some embodiments, one end of the thermally conductive bracket close to the bottom shell is connected to the middle portion of the bottom shell.
在有些实施例中,所述内部电子器件包括第一电路板和第二电路板,所述第一电路板和所述第二电路板相互垂直且所述第一电路板和所述第二电路板至少之一连接于所述导热支架。In some embodiments, the internal electronic device includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are perpendicular to each other, and at least one of the first circuit board and the second circuit board is connected to the thermally conductive bracket.
在一些实施例中,所述内部电子器件包括目标待散热器件,所述第一部分包括导热延伸部,所述导热延伸部自所述底壳靠近所述内腔的一侧朝所述内腔内延伸,且所述导热延伸部与所述目标待散热器件热传导连接。In some embodiments, the internal electronic device includes a target heat dissipation device, the first part includes a thermally conductive extension portion, the thermally conductive extension portion extends from a side of the bottom shell close to the inner cavity toward the inner cavity, and the thermally conductive extension portion is thermally connected to the target heat dissipation device.
在一些实施例中,所述目标待散热器件的数量为多个,所述导热延伸部延伸至多个所述目标待散热器件中至少一个目标待散热器件上。In some embodiments, there are multiple target heat dissipation devices, and the heat conductive extension portion extends to at least one target heat dissipation device among the multiple target heat dissipation devices.
在一些实施例中,多个所述目标待散热器件包括整流芯片,所述导热延伸部包括第一延伸部,所述第一延伸部延伸至所述整流芯片。In some embodiments, the plurality of target heat dissipation devices include a rectifier chip, and the heat conductive extension portion includes a first extension portion, and the first extension portion extends to the rectifier chip.
在一些实施例中,多个所述目标待散热器件包括滤波器件和变压器,所述导热延伸部包括第二延伸部,所述第二延伸部延伸至所述滤波器件和所述变压器之间。In some embodiments, the plurality of target heat dissipation devices include a filter device and a transformer, and the heat conductive extension portion includes a second extension portion, and the second extension portion extends between the filter device and the transformer.
在一些实施例中,所述底壳由高导热率绝缘材料制成;和/或,所述第一部分包括金属件和绝缘件,所述绝缘件将所述金属件与所述内部电子器件绝缘。In some embodiments, the bottom case is made of an insulating material with high thermal conductivity; and/or the first portion includes a metal member and an insulating member, and the insulating member insulates the metal member from the internal electronic device.
在一些实施例中,所述底壳远离所述内腔的表面上设置多个翅片,所述多个翅片相互间隔设置。In some embodiments, a plurality of fins are disposed on a surface of the bottom shell away from the inner cavity, and the plurality of fins are spaced apart from each other.
在一些实施例中,所述壳体背向所述安装孔的一侧设置有连接孔,所述内部电子器件包括对应所述连接孔设置的电连接器,外部连接器可通过所述连接孔与所述电连接器连接。In some embodiments, a connection hole is provided on a side of the shell facing away from the mounting hole, the internal electronic device includes an electrical connector provided corresponding to the connection hole, and an external connector can be connected to the electrical connector through the connection hole.
在一些实施例中,所述壳体包括外壳和内壳,所述内壳环设于所述安装孔处,所述热交换组件还包括自所述第二部分朝所述内腔内延伸的导热延伸部,所述导热延伸部与所述内壳接触。In some embodiments, the shell includes an outer shell and an inner shell, the inner shell is arranged around the mounting hole, and the heat exchange component also includes a thermally conductive extension portion extending from the second portion toward the inner cavity, and the thermally conductive extension portion contacts the inner shell.
另一方面,本申请实施例提供另一种充电装置,包括:壳体,具有内腔,所述内腔设有内部电子器件;底壳,与所述壳体连接,所述底壳设有与所述内部电子器件电连接的插脚;导热支架,位于所述内腔内,且所述导热支架分别与所述内部电子器件、所述底壳热传导连接。On the other hand, an embodiment of the present application provides another charging device, comprising: a shell having an inner cavity, wherein the inner cavity is provided with an internal electronic device; a bottom shell connected to the shell, wherein the bottom shell is provided with pins electrically connected to the internal electronic device; a heat-conductive bracket located in the inner cavity, and wherein the heat-conductive bracket is thermally conductively connected to the internal electronic device and the bottom shell respectively.
在一些实施例中,所述导热支架上设置有第一延伸部,所述内部电子器件包括目标待散热器件,所述第一延伸部朝向所述目标待散热器件延伸、且所述第一延伸部与所述目标待散热器件热传导连接。In some embodiments, a first extension portion is provided on the thermally conductive bracket, the internal electronic device includes a target heat dissipation device, the first extension portion extends toward the target heat dissipation device, and the first extension portion is thermally conductively connected to the target heat dissipation device.
在一些实施例中,所述目标待散热器件包括第一电路板和整流芯片,所述第一电路板连接所述底壳,所述整流芯片设置在所述第一电路板上,所述第一延伸部与所述整流芯片热传导连接。In some embodiments, the target heat dissipation device includes a first circuit board and a rectifier chip, the first circuit board is connected to the bottom shell, the rectifier chip is arranged on the first circuit board, and the first extension portion is thermally connected to the rectifier chip.
在一些实施例中,所述整流芯片设置在所述第一电路板靠近所述壳体的内壁的一侧,所述第一延伸部延伸至所述整流芯片、且与所述整流芯片接触连接。In some embodiments, the rectifier chip is disposed on a side of the first circuit board close to the inner wall of the housing, and the first extension portion extends to the rectifier chip and is in contact with and connected to the rectifier chip.
在一些实施例中,所述目标待散热器件还包括第二电路板和滤波器件,所述第二电路板与所述第一电路板连接;所述滤波器件设置在所述第二电路板上,所述导热支架还设置有第二延伸部,所述第二延伸部延伸至所述滤波器件的外表面。In some embodiments, the target heat dissipation device also includes a second circuit board and a filter device, the second circuit board is connected to the first circuit board; the filter device is arranged on the second circuit board, and the thermal conductive bracket is also provided with a second extension portion, and the second extension portion extends to the outer surface of the filter device.
在一些实施例中,所述滤波器件包括第一电容和第二电容,所述导热支架还包括第三延伸部,所述第三延伸部从所述第二延伸部延伸至所述第一电容和所述第二电容之间。In some embodiments, the filter device includes a first capacitor and a second capacitor, and the thermally conductive bracket further includes a third extending portion, and the third extending portion extends from the second extending portion to between the first capacitor and the second capacitor.
在一些实施例中,所述导热支架包括靠近底壳的第一端面,所述底壳包括与所述第一端面相对应的第二端面,所述第一端面与所述第二端面接触连接。In some embodiments, the thermally conductive bracket includes a first end surface close to the bottom shell, the bottom shell includes a second end surface corresponding to the first end surface, and the first end surface is in contact with and connected to the second end surface.
在一些实施例中,所述导热支架上设置有凸起部,所述凸起部设置在所述第一端面上、且朝向所述底壳凸起,所述第二端面上对应设置有凹槽部,所述凸起部与所述凹槽部连接。In some embodiments, a protrusion is provided on the thermally conductive bracket, the protrusion is provided on the first end surface and protrudes toward the bottom shell, a groove is correspondingly provided on the second end surface, and the protrusion is connected to the groove.
在一些实施例中,所述导热支架为环形结构;和/或,所述导热支架与所述底壳为分体结构。In some embodiments, the thermally conductive bracket is an annular structure; and/or the thermally conductive bracket and the bottom shell are separate structures.
在一些实施例中,所述底壳靠近内腔的一侧设置有固定支架,所述插脚的一端与所述固定支架连接,相对的另一端穿过所述底壳延伸并露出于所述底壳远离所述导热支架的一侧。In some embodiments, a fixing bracket is disposed on one side of the bottom shell close to the inner cavity, one end of the pin is connected to the fixing bracket, and the other end extends through the bottom shell and is exposed on a side of the bottom shell away from the heat conductive bracket.
由上可知,一方面,本申请实施例提供的充电装置中通过热交换组件的第一部分与内部电子器件导热连接后经过第二部分导出至内腔外,且插脚穿设第二部分,因此充电装置插在插座上时热交换组件为充电装置与插座靠近的部分,因此,在充电完成后人们从插座上拔下充电装置是不会触摸到第二部分,因此上述设置使得能将内部电子器件热量导出的同时防止烫手;另一方面,本申请实施例提供的充电装置中通过导热支架与壳体中的内部电子器件热传导连接,且导热支架设置在壳体的内腔内,通过导热支架与内部电子器件导热连接后经过底壳导出至内腔外,使得内部电子器件热量能够从内腔内朝底壳方向传导出至内腔外,能够进一步解决充电装置的小型化的基础下,散热效果不够理想的问题。As can be seen from the above, on the one hand, in the charging device provided in the embodiment of the present application, the first part of the heat exchange component is thermally connected to the internal electronic device through the first part and then is conducted out of the inner cavity through the second part, and the pin is inserted into the second part. Therefore, when the charging device is plugged into the socket, the heat exchange component is the part of the charging device close to the socket. Therefore, after charging is completed, people will not touch the second part when unplugging the charging device from the socket. Therefore, the above arrangement makes it possible to conduct the heat of the internal electronic device while preventing burns; on the other hand, in the charging device provided in the embodiment of the present application, the heat is thermally connected to the internal electronic device in the shell through a heat conductive bracket, and the heat conductive bracket is arranged in the inner cavity of the shell. After the heat conductive bracket is thermally connected to the internal electronic device, the heat is conducted out of the inner cavity through the bottom shell, so that the heat of the internal electronic device can be conducted from the inner cavity toward the bottom shell to the outside of the inner cavity, which can further solve the problem of unsatisfactory heat dissipation effect on the basis of miniaturization of the charging device.
为了更清楚地说明本申请实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
图1为本申请一个实施例提供的充电装置的结构示意图。FIG1 is a schematic diagram of the structure of a charging device provided in one embodiment of the present application.
图2为图1所示的充电装置的分解结构示意图。FIG. 2 is a schematic diagram of the exploded structure of the charging device shown in FIG. 1 .
图3为图1所示的充电装置中内部电子器件的分解结构示意图。FIG. 3 is a schematic diagram of the exploded structure of the internal electronic components in the charging device shown in FIG. 1 .
图4为图1所示的充电装置中除去外壳之后的侧面示意图。FIG. 4 is a side view of the charging device shown in FIG. 1 with the outer shell removed.
图5为图1所示的充电装置另一角度的结构示意图。FIG. 5 is a schematic structural diagram of the charging device shown in FIG. 1 from another angle.
图6为图5中A区域的局部放大示意图。FIG. 6 is a partial enlarged schematic diagram of area A in FIG. 5 .
图7为图1所示的充电装置的另一个方向的结构示意图。FIG. 7 is a schematic structural diagram of the charging device shown in FIG. 1 in another direction.
图8为图7所示充电装置的分解结构示意图。FIG. 8 is a schematic diagram of the exploded structure of the charging device shown in FIG. 7 .
图9为本申请另一个实施例提供的充电装置的结构示意图。FIG. 9 is a schematic diagram of the structure of a charging device provided in another embodiment of the present application.
图10为图9所示的充电装置的分解结构示意图。FIG. 10 is a schematic diagram of the exploded structure of the charging device shown in FIG. 9 .
图11为图9所示的充电装置中内部电子器件与导热支架的结构示意图。FIG. 11 is a schematic structural diagram of internal electronic components and a heat-conducting bracket in the charging device shown in FIG. 9 .
图12为图11所示的内部电子器件与导热支架的分解示意图。FIG. 12 is an exploded schematic diagram of the internal electronic components and the thermally conductive bracket shown in FIG. 11 .
图13为图9所示的充电装置中底壳与导热支架的分解示意图。FIG. 13 is an exploded schematic diagram of the bottom case and the heat-conducting bracket in the charging device shown in FIG. 9 .
图14为图9所示的充电装置中导热支架的结构示意图。FIG. 14 is a schematic structural diagram of the heat-conducting bracket in the charging device shown in FIG. 9 .
图15为图9所示的充电装置去掉壳体的部分一截面示意图。FIG15 is a schematic cross-sectional view of the charging device shown in FIG9 with the shell portion removed.
图16为图9所示的充电装置去掉壳体的部分另一截面示意图。FIG16 is another cross-sectional schematic diagram of the charging device shown in FIG9 with the shell portion removed.
【附图标记说明】
100、充电装置;10、壳体;12、外壳;13、内腔;14、内壳;15、安装孔;16、连接
孔;17、固定支架;20、内部电子器件;21、目标待散热器件;211、整流芯片;212、变压器;213、滤波器件;2131、第一电容;2132、第二电容;22、第一电路板;23、第二电路板;24、电连接器;30、插脚;40、热交换组件;41、导热支架;4101、第一端面;42、导热延伸部;421、第一延伸部;422、第二延伸部;423、第三延伸部;4231、第一表面;4232、第二表面;43、底壳;4301、第二端面;431、翅片;432、收纳槽;433、凹槽部;44、凸起部。[Description of Reference Numerals]
100, charging device; 10, shell; 12, outer shell; 13, inner cavity; 14, inner shell; 15, mounting hole; 16, connecting hole; 17, fixing bracket; 20, internal electronic device; 21, target heat dissipation device; 211, rectifier chip; 212, transformer; 213, filter device; 2131, first capacitor; 2132, second capacitor; 22, first circuit board; 23, second circuit board; 24, electrical connector; 30, pin; 40, heat exchange component; 41, thermally conductive bracket; 4101, first end face; 42, thermally conductive extension portion; 421, first extension portion; 422, second extension portion; 423, third extension portion; 4231, first surface; 4232, second surface; 43, bottom shell; 4301, second end face; 431, fin; 432, storage groove; 433, groove portion; 44, protrusion.
为了使本申请实施例的目的、技术方案和优点更加清楚,下面将结合附图对本申请实施例中的技术方案进行清楚、完整的描述,显然,所描述的实施例仅仅是本申请的部分实施例,而不是全部实施例。基于本申请描述的实施例,本领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其他实施例,都属于本申请的保护范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments described in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.
需要说明,本申请实施例中所有方向性指示(诸如上、下、左、右、前、后、顶、底)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, top and bottom) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
在本申请实施例中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。In the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.
参见图1,本申请一个实施例提供一种充电装置100,充电装置100包括壳体10、热交换组件40、内部电子器件20(参照图2)和插脚30。参照图2,壳体10具有内腔13和与内腔13连通的安装孔15。其中,内部电子器件20设置在内腔13内,热交换组件40的第一部分设置在所述内腔13内且与内部电子器件20导热连接(也即热传导连接),热交换组件40的第二部分通过安装孔15伸出至内腔13外。插脚30连接于热交换组件40的第二部分,插脚30的一端在内腔13内与内部电子器件20电连接,相对的另一端穿过第二部分伸出至内腔13外。Referring to FIG1 , an embodiment of the present application provides a charging device 100, which includes a housing 10, a heat exchange assembly 40, an internal electronic device 20 (refer to FIG2 ), and a pin 30. Referring to FIG2 , the housing 10 has an inner cavity 13 and a mounting hole 15 connected to the inner cavity 13. The internal electronic device 20 is disposed in the inner cavity 13, the first part of the heat exchange assembly 40 is disposed in the inner cavity 13 and is thermally connected to the internal electronic device 20 (i.e., thermally conductively connected), and the second part of the heat exchange assembly 40 extends out of the inner cavity 13 through the mounting hole 15. The pin 30 is connected to the second part of the heat exchange assembly 40, one end of the pin 30 is electrically connected to the internal electronic device 20 in the inner cavity 13, and the other end thereof extends out of the inner cavity 13 through the second part.
本申请实施例提供的充电装置100例如为可为各种电子产品(例如手机、电脑、平板、便携式调温装置等)充电的电源适配器或者充电能量棒等。插脚30用于插入插座内将电流导入到内部电子器件20。内部电子器件20例如包括电源管理电路、作为电源管理电路构成部分的元器件、为电源管理电路提供支撑以及触点的电路板、用于输出电流给待充电电子产品的输出接口等。在利用本实施例提供的充电装置100为待充电电子产品充电时,将插脚30插在插座上,输入的电流经内部电子器件20调整后从输出接口输出至待充电电子产品以实现充电。在充电期间,由于热交换组件40的第一部分与内部电子器件20热传导连接,且第二部分伸出至内腔13外,内部电子器件20产生的热量可快速经过第一部分导出至第二部分最终散发到内腔13外。参照图5,第二部分上例如设置有用于容纳插脚30的收纳槽432,插脚30与热交换组件40的第二部分活动连接,在完成充电后例如可将插脚30收纳在收纳槽中,方便充电装置100的收纳。The charging device 100 provided in the embodiment of the present application is, for example, a power adapter or a charging energy stick that can charge various electronic products (such as mobile phones, computers, tablets, portable thermostats, etc.). The pin 30 is used to be inserted into the socket to introduce current into the internal electronic device 20. The internal electronic device 20 includes, for example, a power management circuit, components as a component of the power management circuit, a circuit board that provides support and contacts for the power management circuit, and an output interface for outputting current to the electronic product to be charged. When the charging device 100 provided in this embodiment is used to charge the electronic product to be charged, the pin 30 is plugged into the socket, and the input current is adjusted by the internal electronic device 20 and output from the output interface to the electronic product to be charged to achieve charging. During charging, since the first part of the heat exchange component 40 is connected to the internal electronic device 20 by thermal conduction, and the second part extends out of the inner cavity 13, the heat generated by the internal electronic device 20 can be quickly conducted through the first part to the second part and finally dissipated outside the inner cavity 13. 5 , the second portion is provided with a receiving groove 432 for accommodating the pin 30 , and the pin 30 is movably connected to the second portion of the heat exchange assembly 40 . After charging is completed, the pin 30 can be stored in the receiving groove, for example, to facilitate the storage of the charging device 100 .
由于插脚30穿过第二部分伸出到内腔13外,因此,当将充电装置100通过插脚30插到插座上时,热交换组件40的第二部分位于壳体10朝向插座的一侧,也即位于用户不会接触到的一侧,因此通过热交换组件40可将热量导出至非常规接触面,由于在充电期间以及在充电完成后将充电装置100从插座上拔下时人们不会接触到插脚30所在的一侧,也即不会接触到热交换组件40的第二部分,因此可以避免烫手的问题。其中,壳体10例如包括外壳12例如可以设置为导热性能较差的材料或者外壳12与内部电子器件20间隔设置,或者可以在外壳12与内部电子器件20之间设置隔热材料等,或者壳体10包括外壳12和内壳14,外壳12通过内壳14实现与内部电子器件20的隔离等以保证热量主要从热交换组件40的第二部分导出而不导向外壳12的表面。Since the pin 30 extends out of the inner cavity 13 through the second part, when the charging device 100 is plugged into the socket through the pin 30, the second part of the heat exchange assembly 40 is located on the side of the housing 10 facing the socket, that is, on the side that the user will not touch, so the heat can be conducted to the unconventional contact surface through the heat exchange assembly 40. Since people will not touch the side where the pin 30 is located, that is, will not touch the second part of the heat exchange assembly 40 when the charging device 100 is unplugged from the socket during charging and after charging is completed, the problem of burning hands can be avoided. Wherein, the housing 10, for example, includes an outer shell 12, which can be set to a material with poor thermal conductivity, or the outer shell 12 is spaced from the internal electronic device 20, or a heat insulating material can be set between the outer shell 12 and the internal electronic device 20, or the housing 10 includes an outer shell 12 and an inner shell 14, and the outer shell 12 is isolated from the internal electronic device 20 by the inner shell 14, etc., to ensure that the heat is mainly conducted from the second part of the heat exchange assembly 40 instead of being directed to the surface of the outer shell 12.
在一些实施例中,参照图7和图8,壳体10背向安装孔15的一侧设置有连接孔16,内部电子器件20包括对应连接孔16设置的电连接器24,外部连接器可通过连接孔16与电连接器24连接。电连接器24即与内部电源管理电路电连接的输出接口,外部连接器例如是待充电设备上的充电接口或者是数据线、充电线上的输入接口,充电时需要将外部连接器通过连接孔16与电连接器24连接,以将电流充入待充电设备,当充电结束后需要将外部连接器从充电装置100上拔下,因此可能接触到壳体10,本实施例中将连接孔16设置在壳体10上远离安装孔15的一侧,也即远离热交换组件40的第二部分的一侧,使得连接孔16尽可能地远离热量散出的部分,防止拔下外部连接器时烫手。In some embodiments, referring to FIG. 7 and FIG. 8 , a connection hole 16 is provided on the side of the housing 10 facing away from the mounting hole 15, and the internal electronic device 20 includes an electrical connector 24 provided corresponding to the connection hole 16, and an external connector can be connected to the electrical connector 24 through the connection hole 16. The electrical connector 24 is an output interface electrically connected to the internal power management circuit, and the external connector is, for example, a charging interface on the device to be charged or an input interface on a data cable or a charging cable. When charging, the external connector needs to be connected to the electrical connector 24 through the connection hole 16 to charge the current into the device to be charged. When charging is completed, the external connector needs to be unplugged from the charging device 100, so it may contact the housing 10. In this embodiment, the connection hole 16 is provided on the side of the housing 10 away from the mounting hole 15, that is, away from the side of the second part of the heat exchange assembly 40, so that the connection hole 16 is as far away from the heat dissipation part as possible to prevent the external connector from being burned when being unplugged.
前述实施例中,热交换组件40的第二部分例如包括底壳43,底壳43设于安装孔15并密封内腔13,底壳43背向壳体10的表面暴露在内腔13外,插脚30穿设底壳43。因此第二部分导出的热量可通过底壳43背向壳体10的表面与内腔13外的空气接触从而将热量散发到空气中。在一些实施例中,参照图5和图6,底壳43远离内腔13的表面上设置多个翅片431,多个翅片431相互间隔设置。通过设置多个翅片431可以增大底壳43与空气的接触面积,实现更好的导热效果。In the above-mentioned embodiment, the second part of the heat exchange component 40 includes, for example, a bottom shell 43, which is arranged in the mounting hole 15 and seals the inner cavity 13, and the surface of the bottom shell 43 facing away from the housing 10 is exposed outside the inner cavity 13, and the pins 30 are passed through the bottom shell 43. Therefore, the heat derived from the second part can be contacted with the air outside the inner cavity 13 through the surface of the bottom shell 43 facing away from the housing 10, thereby dissipating the heat into the air. In some embodiments, referring to Figures 5 and 6, a plurality of fins 431 are arranged on the surface of the bottom shell 43 away from the inner cavity 13, and the plurality of fins 431 are arranged at intervals from each other. By providing a plurality of fins 431, the contact area between the bottom shell 43 and the air can be increased, thereby achieving a better heat conduction effect.
热交换组件40的第一部分例如可以是填充在底壳43和内部电子器件20之间的导热胶,也可以是其他导热材料。The first part of the heat exchange assembly 40 may be, for example, a thermally conductive adhesive filled between the bottom shell 43 and the internal electronic device 20 , or may be other thermally conductive materials.
在一些实施例中,热交换组件40的第一部分包括导热支架41,导热支架41设置在内腔13内,且导热支架41支撑内部电子器件20。参照图2和图3,内部电子器件20例如包括第一电路板22和第二电路板23,第一电路板22和第二电路板23上分别设置有多个元器件,第一电路板22和第二电路板23相互垂直设置,可使得结构更紧凑。第一电路板22和第二电路板23至少之一与导热支架41连接,以由导热支架41为第一电路板22和第二电路板23提供支撑,使得内部电子器件20集合成一个整体,便于装配。提供支撑的同时导热支架41与第一电路板22和第二电路板23的接触面积大,有利于将内部电子器件20产生的热量通过导热支架41导出到底壳43上,实现更好的导热效果。本实施例提供的上述方案将支撑功能和导热功能结合于导热支架41一体,能实现对内腔13内空间的合理利用,使得充电装置100的结构更紧凑,可减小体积、节省材料。In some embodiments, the first part of the heat exchange assembly 40 includes a heat conductive bracket 41, which is disposed in the inner cavity 13, and the heat conductive bracket 41 supports the internal electronic device 20. Referring to Figures 2 and 3, the internal electronic device 20 includes, for example, a first circuit board 22 and a second circuit board 23, on which a plurality of components are disposed respectively, and the first circuit board 22 and the second circuit board 23 are disposed perpendicularly to each other, which can make the structure more compact. At least one of the first circuit board 22 and the second circuit board 23 is connected to the heat conductive bracket 41, so that the heat conductive bracket 41 provides support for the first circuit board 22 and the second circuit board 23, so that the internal electronic device 20 is assembled into a whole, which is convenient for assembly. While providing support, the contact area between the heat conductive bracket 41 and the first circuit board 22 and the second circuit board 23 is large, which is conducive to conducting the heat generated by the internal electronic device 20 to the bottom shell 43 through the heat conductive bracket 41, so as to achieve a better heat conduction effect. The above solution provided in this embodiment combines the supporting function and the heat conducting function into the heat conducting bracket 41 , which can realize the reasonable utilization of the space in the inner cavity 13 , making the structure of the charging device 100 more compact, reducing the volume and saving materials.
在一些实施例中,导热支架41靠近底壳43的一端连接底壳43的中部。即导热支架41将内部电子器件20产生的热量导向底壳43的中部后由底壳43均匀导出,导热更快、效果更好。In some embodiments, one end of the heat-conducting bracket 41 close to the bottom shell 43 is connected to the middle of the bottom shell 43. That is, the heat-conducting bracket 41 guides the heat generated by the internal electronic device 20 to the middle of the bottom shell 43 and then evenly guides it out from the bottom shell 43, so that the heat conduction is faster and the effect is better.
在一些实施例中,内部电子器件20包括目标待散热器件21,热交换组件40的第一部分包括导热延伸部42,导热延伸部42自底壳43靠近内腔13的一侧朝内腔13内延伸,且导热延伸部42与目标待散热器件21热传导连接。其中目标待散热器件21指的是充电装置100工作时发热较高的元器件,例如变压器、电容、芯片等。目标待散热器件21的数量例如为多个,导热延伸部42延伸至多个目标待散热器件21中至少一个目标待散热器件21上。通过设置导热延伸部42,可重点针对内部电子器件20中发热较高的区域进行导热,实现将热量快速导出。In some embodiments, the internal electronic device 20 includes a target heat dissipation device 21, and the first part of the heat exchange assembly 40 includes a heat conductive extension portion 42, the heat conductive extension portion 42 extends from the side of the bottom shell 43 close to the inner cavity 13 toward the inner cavity 13, and the heat conductive extension portion 42 is thermally connected to the target heat dissipation device 21. The target heat dissipation device 21 refers to a component that generates high heat when the charging device 100 is working, such as a transformer, a capacitor, a chip, etc. The number of target heat dissipation devices 21 is, for example, multiple, and the heat conductive extension portion 42 extends to at least one target heat dissipation device 21 among the multiple target heat dissipation devices 21. By providing the heat conductive extension portion 42, heat conduction can be focused on the area with higher heat generation in the internal electronic device 20 to achieve rapid heat dissipation.
举例而言,参照图2,多个目标待散热器件21包括整流芯片211,导热延伸部42包括第一延伸部421,第一延伸部421延伸至整流芯片211。当充电装置100工作时,插脚30插入插座,以将交流电导入内部电子器件20,需要对交流点进行整流滤波,整流芯片211由多个二极管组成,为内部电子器件20中对交流电进行整流的部分,可以调整电流的方向。本实施例中针对整流芯片211设置第一延伸部421可将整流芯片211上的热量快速导出至底壳43上。For example, referring to FIG. 2 , the multiple target heat dissipation devices 21 include a rectifier chip 211, and the heat-conducting extension portion 42 includes a first extension portion 421, and the first extension portion 421 extends to the rectifier chip 211. When the charging device 100 is working, the pin 30 is inserted into the socket to introduce the alternating current into the internal electronic device 20, and the alternating current point needs to be rectified and filtered. The rectifier chip 211 is composed of a plurality of diodes, which is the part of the internal electronic device 20 that rectifies the alternating current and can adjust the direction of the current. In this embodiment, the first extension portion 421 is provided for the rectifier chip 211 to quickly conduct the heat on the rectifier chip 211 to the bottom shell 43.
在一些实施例中,参照图4,多个目标待散热器件21包括滤波器件213和变压器212,导热延伸部42包括第二延伸部422,第二延伸部422延伸至滤波器件213和变压器212之间。其中滤波器件213例如是充电装置100中负责转换高压电源的电路部件之一,使整流电路输入的脉动直流高电压转换为适合变压器212使用的稳定的直流高电压。变压器212负责将滤波器件213传输的直流高电压进一步转换为合适待充电电子产品使用的直流低电压。本实施例中,通过设置第二延伸部422在滤波器件213和变压器212之间,一方面可以由第二延伸部422将滤波器件213和变压器212上的热量同步导出,另一方面,第二延伸部422还可作为绝缘结构将滤波器件213和变压器212隔离开来使得滤波器件213和变压器212之间符合安规距离,使得滤波器件213和变压器212可以设置的更近,例如相互堆叠或者隔着第二延伸部422紧挨在一起,能够使结构更紧凑,减小充电装置100的体积。在一些实施例中,第二延伸部422还可以设置为围绕变压器212或者滤波器件213的形状,例如图4中所示的L型等。In some embodiments, referring to FIG. 4 , the plurality of target heat dissipation devices 21 include a filter device 213 and a transformer 212, and the heat conductive extension portion 42 includes a second extension portion 422, and the second extension portion 422 extends between the filter device 213 and the transformer 212. The filter device 213 is, for example, one of the circuit components in the charging device 100 responsible for converting the high-voltage power supply, so that the pulsating DC high voltage input by the rectifier circuit is converted into a stable DC high voltage suitable for use by the transformer 212. The transformer 212 is responsible for further converting the DC high voltage transmitted by the filter device 213 into a DC low voltage suitable for use by the electronic product to be charged. In this embodiment, by setting the second extension portion 422 between the filter device 213 and the transformer 212, on the one hand, the heat on the filter device 213 and the transformer 212 can be synchronously extracted by the second extension portion 422, and on the other hand, the second extension portion 422 can also be used as an insulating structure to isolate the filter device 213 and the transformer 212 so that the filter device 213 and the transformer 212 meet the safety distance, so that the filter device 213 and the transformer 212 can be set closer, such as stacked on each other or close together with the second extension portion 422, which can make the structure more compact and reduce the volume of the charging device 100. In some embodiments, the second extension portion 422 can also be set to a shape surrounding the transformer 212 or the filter device 213, such as the L-shape shown in Figure 4.
在一些实施例中,底壳43例如为高导热率绝缘材料件。即底壳43可以采用高导热率绝缘材料制成。举例而言,高导热率绝缘材料例如可以是聚碳酸酯(Polycarbonate)、石墨和含磷阻燃剂的组合物,其中,聚碳酸酯的浓度(即质量分数)为70%-80%,石墨的浓度为小于等于25%,含磷阻燃剂的浓度为小于等于5%,含磷阻燃剂例如为磷酸酯阻燃剂。应理解的是,底壳43不限于上述组分的高导热率绝缘材料,只要使底壳43具有良好的导热性和绝缘性的材料即可。高导热率绝缘材料在一定的温度条件下有超强的导热性能,可以以较快的速度传递热量,因此可实现通过底壳43快速导热的效果。In some embodiments, the bottom shell 43 is, for example, a high thermal conductivity insulating material. That is, the bottom shell 43 can be made of a high thermal conductivity insulating material. For example, the high thermal conductivity insulating material can be, for example, a composition of polycarbonate, graphite and a phosphorus-containing flame retardant, wherein the concentration (i.e., mass fraction) of polycarbonate is 70%-80%, the concentration of graphite is less than or equal to 25%, the concentration of the phosphorus-containing flame retardant is less than or equal to 5%, and the phosphorus-containing flame retardant is, for example, a phosphate flame retardant. It should be understood that the bottom shell 43 is not limited to the high thermal conductivity insulating material of the above components, as long as the bottom shell 43 has a material with good thermal conductivity and insulation. The high thermal conductivity insulating material has super thermal conductivity under certain temperature conditions and can transfer heat at a faster rate, so the effect of rapid heat conduction through the bottom shell 43 can be achieved.
在一些实施例中,热交换组件40的第一部分包括高导热率绝缘材料件。即热交换组件40的第一部分可以采用高导热率绝缘材料制成。举例而言,例如前述导热支架41采用高导热率绝缘材料。或者导热延伸部42采用高导热率绝缘材料。本实施例并不限制。选择高导热率绝缘材料可以将第一部分设计为沿长度方向导热,实现更好的导热效果。例如对于导热延伸部42可设置其按照沿从底壳43延伸到目标待散热器件21的方向来导热,可将热量更快速的导出到底壳43上。In some embodiments, the first part of the heat exchange component 40 includes a high thermal conductivity insulating material. That is, the first part of the heat exchange component 40 can be made of a high thermal conductivity insulating material. For example, the aforementioned thermally conductive bracket 41 is made of a high thermal conductivity insulating material. Or the thermally conductive extension 42 is made of a high thermal conductivity insulating material. This embodiment is not limited. By selecting a high thermal conductivity insulating material, the first part can be designed to conduct heat along the length direction to achieve a better thermal conductivity effect. For example, the thermally conductive extension 42 can be set to conduct heat in a direction extending from the bottom shell 43 to the target heat dissipation device 21, so that the heat can be conducted to the bottom shell 43 more quickly.
在另一些实施例中,热交换组件40包括金属件和绝缘件,绝缘件将金属件与内部电子器件20绝缘。例如可以在金属件上包裹绝缘层,或者在金属件更靠近内部电子器件20的一侧设置绝缘件,从而利用金属的导热性实现快速导热并通过绝缘件保证安全。In other embodiments, the heat exchange assembly 40 includes a metal member and an insulating member, and the insulating member insulates the metal member from the internal electronic device 20. For example, an insulating layer may be wrapped around the metal member, or an insulating member may be provided on a side of the metal member closer to the internal electronic device 20, thereby utilizing the thermal conductivity of the metal to achieve rapid heat conduction and ensuring safety through the insulating member.
在一些实施例中,壳体10包括外壳12和内壳14,内壳14环设于安装孔15处,热交换组件40包括自第二部分朝内腔13内延伸的导热延伸部42,导热延伸部42与内壳14接触。通过上述设置内壳14可以吸收内部电子器件20散发到内腔13中的热量,由导热延伸部42将内壳14吸收的热量传导至热交换组件40的第二部分,从而通过第二部分将热量导出至内腔13外,减少热量透过外壳12传递,防止用户接触外壳12时烫手。In some embodiments, the housing 10 includes an outer shell 12 and an inner shell 14, the inner shell 14 is arranged around the mounting hole 15, and the heat exchange assembly 40 includes a heat conductive extension portion 42 extending from the second portion toward the inner cavity 13, and the heat conductive extension portion 42 is in contact with the inner shell 14. Through the above arrangement, the inner shell 14 can absorb the heat emitted from the internal electronic device 20 to the inner cavity 13, and the heat absorbed by the inner shell 14 is conducted to the second portion of the heat exchange assembly 40 by the heat conductive extension portion 42, so that the heat is conducted out of the inner cavity 13 through the second portion, reducing the heat transfer through the outer shell 12, and preventing the user from getting burned when touching the outer shell 12.
参见图9-图15所示,本申请另一个实施例提供了一种充电装置100,充电装置100与前述实施例区别主要在于,导热支架41的结构不同。本实施例充电装置100例如包括:壳体10、底壳43、导热支架41、内部电子器件20和插脚30。如图10所示,壳体10例如包括外壳12和内壳14,外壳12套设在内壳14外,壳体10具有内腔13以及与内腔13连通的安装孔15。在本实施例中,内腔13形成在内壳14内部,安装孔15也设置在内壳14上。其中,底壳43与壳体10连接,底壳43可与壳体10密封连接,且底壳43与壳体10密封连接形成有该内腔13。导热支架41与底壳43连接、且位于内腔13内。内部电子器件20设置在内腔13内,且与导热支架41热传导连接。插脚30设置在底壳43上,插脚30的一端在内腔13与内部电子器件20电连接,相对的另一端穿过底壳43延伸并露出于底壳43远离导热支架41的一侧。Referring to FIGS. 9 to 15 , another embodiment of the present application provides a charging device 100 , which differs from the above-mentioned embodiment mainly in that the structure of the heat-conducting bracket 41 is different. The charging device 100 of this embodiment includes, for example, a housing 10 , a bottom housing 43 , a heat-conducting bracket 41 , an internal electronic device 20 , and a pin 30 . As shown in FIG. 10 , the housing 10 includes, for example, an outer housing 12 and an inner housing 14 , the outer housing 12 is sleeved outside the inner housing 14 , and the housing 10 has an inner cavity 13 and a mounting hole 15 connected to the inner cavity 13 . In this embodiment, the inner cavity 13 is formed inside the inner housing 14 , and the mounting hole 15 is also provided on the inner housing 14 . Among them, the bottom housing 43 is connected to the housing 10 , the bottom housing 43 can be sealed with the housing 10 , and the bottom housing 43 is sealed with the housing 10 to form the inner cavity 13 . The heat-conducting bracket 41 is connected to the bottom housing 43 and is located in the inner cavity 13 . The internal electronic device 20 is arranged in the inner cavity 13 and is thermally connected to the heat-conducting bracket 41 . The pin 30 is disposed on the bottom shell 43 , one end of the pin 30 is electrically connected to the internal electronic device 20 in the inner cavity 13 , and the other end thereof extends through the bottom shell 43 and is exposed at a side of the bottom shell 43 away from the heat conductive bracket 41 .
具体地,插脚30用于插入插座内并将电流导入到内部电子器件20。内部电子器件20例如包括电源管理电路、作为电源管理电路构成部分的元器件、为电源管理电路提供支撑以及触点的电路板、用于输出电流给待充电电子产品的输出接口等。在利用本实施例提供的充电装置100为待充电电子产品充电时,将插脚30插在插座上,输入的电流经内部电子器件20调整后从输出接口输出至待充电电子产品以实现充电。在充电期间,由于导热支架41与内部电子器件20热传导连接、且导热支架41与底壳43连接,内部电子器件20产生的热量可快速经过导热支架41导出至底壳43上,也即可快速将内部电子器件20产生的热量导出至内腔13外。如图13所示,底壳43远离内腔13的一侧有用于容纳插脚30的收纳槽432,插脚30与底壳43活动连接,在完成充电后例如可将插脚30收纳在容纳槽中,方便充电装置100的收纳。其中,所述外壳12采用透明材质制成,内壳14采用塑胶材质制成,且内壳14可以选择采用透明材质或不透明材质制成,外壳12通过内壳14实现与内部电子器件20的隔离。Specifically, the pin 30 is used to be inserted into the socket and conduct current to the internal electronic device 20. The internal electronic device 20 includes, for example, a power management circuit, components as a component of the power management circuit, a circuit board that provides support and contacts for the power management circuit, and an output interface for outputting current to the electronic product to be charged. When the charging device 100 provided in this embodiment is used to charge the electronic product to be charged, the pin 30 is plugged into the socket, and the input current is adjusted by the internal electronic device 20 and output from the output interface to the electronic product to be charged to achieve charging. During charging, since the heat-conducting bracket 41 is thermally connected to the internal electronic device 20 and the heat-conducting bracket 41 is connected to the bottom shell 43, the heat generated by the internal electronic device 20 can be quickly conducted to the bottom shell 43 through the heat-conducting bracket 41, and the heat generated by the internal electronic device 20 can be quickly conducted to the outside of the inner cavity 13. As shown in FIG13 , the bottom shell 43 has a receiving groove 432 for accommodating the pin 30 on one side away from the inner cavity 13. The pin 30 is movably connected to the bottom shell 43. After charging is completed, the pin 30 can be stored in the receiving groove, which is convenient for storing the charging device 100. The outer shell 12 is made of a transparent material, and the inner shell 14 is made of a plastic material. The inner shell 14 can be made of a transparent material or an opaque material. The outer shell 12 is isolated from the internal electronic device 20 through the inner shell 14.
在本实施例中,通过导热支架41与内部电子器件20热传导连接,且导热支架41设置在底壳43上,通过导热支架41与内部电子器件20导热连接后经过与导热支架41连接的底壳43导出至内腔13外,使得能将内部电子器件20热量导出,能够解决充电装置100的小型化的基础下,散热效果不够理想的问题。In this embodiment, the heat is connected to the internal electronic device 20 through heat conduction through the heat-conducting bracket 41, and the heat-conducting bracket 41 is arranged on the bottom shell 43. After the heat is connected to the internal electronic device 20 through heat conduction through the heat-conducting bracket 41, the heat is discharged to the outside of the inner cavity 13 through the bottom shell 43 connected to the heat-conducting bracket 41, so that the heat of the internal electronic device 20 can be discharged, which can solve the problem that the heat dissipation effect is not ideal on the basis of the miniaturization of the charging device 100.
如图10-图12所示,导热支架41上设置有第一延伸部421,第一延伸部421朝向内部电子器件20延伸、且第一延伸部421与内部电子器件20热传导连接。内部电子器件20例如包括目标待散热器件21,目标待散热器件21指的是充电装置100在工作时发热较高的电子元器件,例如变压器、电容、芯片等。第一延伸部421与目标待散热器件21热传导连接,从而可方便目标待散热器件21的定向散热。As shown in FIGS. 10 to 12 , a first extension portion 421 is provided on the heat-conducting bracket 41, and the first extension portion 421 extends toward the internal electronic device 20, and the first extension portion 421 is thermally connected to the internal electronic device 20. The internal electronic device 20 includes, for example, a target heat dissipation device 21, which refers to an electronic component of the charging device 100 that generates high heat when working, such as a transformer, a capacitor, a chip, etc. The first extension portion 421 is thermally connected to the target heat dissipation device 21, so as to facilitate directional heat dissipation of the target heat dissipation device 21.
进一步地,目标待散热器件21例如包括第一电路板22和整流芯片211,第一电路板22连接底壳43。整流芯片211设置在第一电路板22上,第一延伸部421延伸至整流芯片211、且与整流芯片211热传导连接。在本申请中,充电装置100中的内部电子器件20在工作时,都会产生热量,但是有一些电子元件在工作时散发的热量比较高,也即高发热量的电子器件。而本申请中的整流芯片211就属于高发热量的电子器件,当充电装置100工作时,插脚30插入插座,以将交流电导入内部电子器件20,然后通过整流芯片211对交流电进行整流,以及调整电流的方向,使输入的交流电转为脉动直流电。通过设置第一延伸部421延伸至整流芯片211,可将整流芯片211上的热量通过第一延伸部421快速导出至底壳43上,达到定向散热的目的。Further, the target heat dissipation device 21 includes, for example, a first circuit board 22 and a rectifier chip 211, and the first circuit board 22 is connected to the bottom shell 43. The rectifier chip 211 is arranged on the first circuit board 22, and the first extension portion 421 extends to the rectifier chip 211 and is connected to the rectifier chip 211 by thermal conduction. In the present application, the internal electronic device 20 in the charging device 100 will generate heat when working, but some electronic components emit relatively high heat when working, that is, high-heat electronic devices. The rectifier chip 211 in the present application belongs to a high-heat electronic device. When the charging device 100 is working, the pin 30 is inserted into the socket to introduce the alternating current into the internal electronic device 20, and then the alternating current is rectified by the rectifier chip 211, and the direction of the current is adjusted to convert the input alternating current into pulsating direct current. By setting the first extension portion 421 to extend to the rectifier chip 211, the heat on the rectifier chip 211 can be quickly exported to the bottom shell 43 through the first extension portion 421, so as to achieve the purpose of directional heat dissipation.
具体地,如图11和图12所示,整流芯片211设置在第一电路板22靠近壳体10的内壁的一侧,第一延伸部421延伸至整流芯片211、且与整流芯片211接触连接。通过将整流芯片211设置在第一电路板22靠近壳体10内壁的一侧上可更加方便整流芯片的热量通过导热支架41导至腔体外,达到进一步定向散热导热的目的。Specifically, as shown in Figures 11 and 12, the rectifier chip 211 is arranged on a side of the first circuit board 22 close to the inner wall of the housing 10, and the first extension portion 421 extends to the rectifier chip 211 and is in contact with and connected to the rectifier chip 211. By arranging the rectifier chip 211 on a side of the first circuit board 22 close to the inner wall of the housing 10, it is more convenient to conduct the heat of the rectifier chip to the outside of the cavity through the heat-conducting bracket 41, thereby achieving the purpose of further directional heat dissipation and heat conduction.
进一步地,目标待散热器件21还例如包括第二电路板23和滤波器件213。第二电路板23与第一电路板22连接,第二电路板23连接底壳43。通过第一电路板22和第二电路板23以使得将内部电子器件20集合成一个整体,便于装配至底壳43上并与导热支架41热传导连接。同时,设置第一电路板22和第二电路板23,可使得导热支架41与第一电路板22和第二电路板23的接触面积增大。滤波器件213设置在第二电路板23上,导热支架41还设置有第二延伸部422,第二延伸部422延伸至滤波器件213的外表面。其中滤波器件213例如是充电装置100中负责转换高压电源的电路部件之一。通过将第二延伸部422延伸至滤波器件213的外表面,即可对滤波器件213产生的热量快速带走至底壳43上并排出至内腔13外。Further, the target heat dissipation device 21 also includes, for example, a second circuit board 23 and a filter device 213. The second circuit board 23 is connected to the first circuit board 22, and the second circuit board 23 is connected to the bottom shell 43. The first circuit board 22 and the second circuit board 23 are used to integrate the internal electronic device 20 into a whole, which is convenient for assembly to the bottom shell 43 and thermally connected to the heat-conducting bracket 41. At the same time, the first circuit board 22 and the second circuit board 23 are provided, so that the contact area between the heat-conducting bracket 41 and the first circuit board 22 and the second circuit board 23 can be increased. The filter device 213 is arranged on the second circuit board 23, and the heat-conducting bracket 41 is also provided with a second extension portion 422, and the second extension portion 422 extends to the outer surface of the filter device 213. Among them, the filter device 213 is, for example, one of the circuit components responsible for converting high-voltage power in the charging device 100. By extending the second extension portion 422 to the outer surface of the filter device 213, the heat generated by the filter device 213 can be quickly taken away to the bottom shell 43 and discharged to the outside of the inner cavity 13.
在一些实施例中,第一电路板22和第二电路板23可相互垂直设置,通过相互垂直设置可使得内部电子器件20的结构更紧凑。In some embodiments, the first circuit board 22 and the second circuit board 23 may be disposed perpendicularly to each other, and the structure of the internal electronic device 20 may be made more compact by arranging them perpendicularly to each other.
更进一步地,如图11和图12所示,滤波器件213包括第一电容2131和第二电容2132,第一电容2131和第二电容2132间隔设置在第二电路板23上,导热支架41还包括第三延伸部423,第三延伸部423从第二延伸部422延伸至第一电容2131和第二电容2132之间。第一电容2131和第二电容2132例如为充电装置100中负责转换高压电源的电路中的电解电容。本申请通过将第三延伸部423设置在第一电容2131和第二电容2132的间隙之间,可进一步将第一电容2131和第二电容2132产生的热量快速传导至内腔13外,实现快速散热的目的。Furthermore, as shown in FIGS. 11 and 12 , the filter device 213 includes a first capacitor 2131 and a second capacitor 2132, and the first capacitor 2131 and the second capacitor 2132 are arranged on the second circuit board 23 at intervals, and the heat-conducting bracket 41 also includes a third extension portion 423, and the third extension portion 423 extends from the second extension portion 422 to between the first capacitor 2131 and the second capacitor 2132. The first capacitor 2131 and the second capacitor 2132 are, for example, electrolytic capacitors in the circuit responsible for converting high-voltage power in the charging device 100. By arranging the third extension portion 423 between the gap between the first capacitor 2131 and the second capacitor 2132, the heat generated by the first capacitor 2131 and the second capacitor 2132 can be further quickly conducted to the outside of the inner cavity 13, thereby achieving the purpose of rapid heat dissipation.
更进一步地,如图11-图13所示,第三延伸部423与第二延伸部422相互垂直,第三延伸部423具有相对设置的第一表面4231和第二表面4232,第一表面4231与第一电容2131的侧表面接触连接,第二表面4232与第二电容2132的侧表面接触连接,第二延伸部422分别与第一电容2131、第二电容2132的端部表面接触连接。通过设置第二延伸部422和第三延伸部423分别与第一电容2131和第二电容2132的表面接触,可达到对滤波器件213的进一步散热和导热的目的。Furthermore, as shown in FIGS. 11 to 13 , the third extension portion 423 is perpendicular to the second extension portion 422, and the third extension portion 423 has a first surface 4231 and a second surface 4232 that are arranged opposite to each other, the first surface 4231 is in contact with the side surface of the first capacitor 2131, the second surface 4232 is in contact with the side surface of the second capacitor 2132, and the second extension portion 422 is in contact with the end surfaces of the first capacitor 2131 and the second capacitor 2132, respectively. By arranging the second extension portion 422 and the third extension portion 423 to be in contact with the surfaces of the first capacitor 2131 and the second capacitor 2132, respectively, the purpose of further heat dissipation and heat conduction of the filter element 213 can be achieved.
如图14所示,导热支架41包括靠近底壳43的第一端面4101,底壳43包括与第一端面4101相对应的第二端面4301,第一端面4101与第二端面4301接触连接。通过第一端面4101与第二端面4301接触连接,使得导热支架41能够与底壳43对齐并固定连接。As shown in FIG14 , the heat-conducting bracket 41 includes a first end face 4101 close to the bottom shell 43, the bottom shell 43 includes a second end face 4301 corresponding to the first end face 4101, and the first end face 4101 is in contact with and connected to the second end face 4301. The heat-conducting bracket 41 can be aligned with and fixedly connected to the bottom shell 43 by the first end face 4101 and the second end face 4301 being in contact with and connected to each other.
在一些实施例中,导热支架41为环形结构;和/或,导热支架41与底壳43为分体结构。In some embodiments, the thermally conductive bracket 41 is an annular structure; and/or, the thermally conductive bracket 41 and the bottom shell 43 are separate structures.
将导热支架41设置为环形结构,能够使导热支架41吸收到热量沿环向传导,实现快速均热的效果,避免局部温度过高而导致烫手现象。The heat-conducting bracket 41 is configured as a ring structure, so that the heat absorbed by the heat-conducting bracket 41 can be conducted in a ring direction, achieving a rapid heat-averaging effect and avoiding the phenomenon of scalding caused by excessive local temperature.
导热支架41与底壳43采用分体设置的结构设计,使得导热支架41可以通过注塑成型的方式单独生产,降低注塑模具的复杂程度、提高生产效率。在一些实施例中,导热支架41可与底壳43通过粘胶、超声波焊接等方式固定连接,在其他实施例中,导热支架41与底壳43可拆卸连接,可方便导热支架41与底壳43之间的装配与拆卸。此外,当充电装置100进行升级,也即内部电子器件20的排布发生变化时,可以仅更换与其相适配的导热支架41即可,降低充电装置100的生产成本。The heat-conducting bracket 41 and the bottom shell 43 are designed to be separated, so that the heat-conducting bracket 41 can be produced separately by injection molding, reducing the complexity of the injection mold and improving production efficiency. In some embodiments, the heat-conducting bracket 41 can be fixedly connected to the bottom shell 43 by means of adhesive, ultrasonic welding, etc. In other embodiments, the heat-conducting bracket 41 and the bottom shell 43 are detachably connected, which can facilitate the assembly and disassembly between the heat-conducting bracket 41 and the bottom shell 43. In addition, when the charging device 100 is upgraded, that is, the arrangement of the internal electronic devices 20 changes, only the heat-conducting bracket 41 that is compatible with it can be replaced, thereby reducing the production cost of the charging device 100.
进一步地,如图14所示,导热支架41上设置有朝向底壳43凸起的凸起部44,凸起部44设置在第一端面4101上,第二端面4301上对应设置有凹槽部433,凸起部44与凹槽部433连接。在本实施例中,导热支架例如为一环形形状的支架,该环形为为中空设置,中空部分用于设置内部电子器件20,也即导热支架41可套设在内部电子器件20的外侧上,由于导热支架41为环形,其与底壳43接触的第一端面4101类似于中空的矩形,其导热面积是固定的,在导热支架41上设置凸起部44,相当于可以增大与底壳的接触面积,也即可以增加导热连接面积,从而可使得导热支架41可以传到更多的热量至底壳43上,再从底壳43上排出。此外,凸起部44和凹槽部433的设置,可以方便导热支架41与底壳43的装配,同时可以起到防呆效果,避免装配失败。Further, as shown in FIG. 14 , the heat-conducting bracket 41 is provided with a protrusion 44 protruding toward the bottom shell 43, the protrusion 44 is provided on the first end face 4101, and the second end face 4301 is correspondingly provided with a groove 433, and the protrusion 44 is connected to the groove 433. In this embodiment, the heat-conducting bracket is, for example, a bracket in an annular shape, and the annular shape is hollow, and the hollow part is used to set the internal electronic device 20, that is, the heat-conducting bracket 41 can be sleeved on the outer side of the internal electronic device 20. Since the heat-conducting bracket 41 is annular, its first end face 4101 in contact with the bottom shell 43 is similar to a hollow rectangle, and its heat conduction area is fixed. The protrusion 44 is provided on the heat-conducting bracket 41, which is equivalent to increasing the contact area with the bottom shell, that is, increasing the heat conduction connection area, so that the heat-conducting bracket 41 can transfer more heat to the bottom shell 43 and then discharge it from the bottom shell 43. In addition, the arrangement of the protrusion 44 and the groove 433 can facilitate the assembly of the heat-conducting bracket 41 and the bottom shell 43, and can also play a fool-proof effect to avoid assembly failure.
在一些实施例中,如图15所示,导热支架41的外表面由四周朝向中心处倾斜,底壳43的外表面也由四周朝向中心处倾斜,通过如此设置,可方便导热支架41与底壳43更加方便与壳体10装配,以使得导热支架41能够方便的装配进内腔13内。In some embodiments, as shown in Figure 15, the outer surface of the thermally conductive bracket 41 is inclined from the periphery toward the center, and the outer surface of the bottom shell 43 is also inclined from the periphery toward the center. Through such an arrangement, the thermally conductive bracket 41 and the bottom shell 43 can be more conveniently assembled with the shell 10, so that the thermally conductive bracket 41 can be conveniently assembled into the inner cavity 13.
导热支架41和底壳43可例如为导热材料件。也即导热支架41和底壳43可以采用导热材料制成。导热材料例如可采用现有技术中的导热材料。导热材料例如为具有有超强的导热性能的材料,可以以极快的速度传递热量,因此可实现通过导热支架41和所述底壳43快速导热的效果。The heat-conducting bracket 41 and the bottom shell 43 may be, for example, heat-conducting material pieces. That is, the heat-conducting bracket 41 and the bottom shell 43 may be made of heat-conducting material. The heat-conducting material may be, for example, a heat-conducting material in the prior art. The heat-conducting material may be, for example, a material with super-strong heat-conducting properties, which can transfer heat at an extremely fast speed, thereby achieving the effect of rapid heat conduction through the heat-conducting bracket 41 and the bottom shell 43.
更进一步地,如图14所示,底壳43靠近内腔13的一侧设置有固定支架17,插脚30与内部电子器件20电连接的一端与固定支架17连接。Furthermore, as shown in FIG. 14 , a fixing bracket 17 is provided on one side of the bottom shell 43 close to the inner cavity 13 , and one end of the pin 30 electrically connected to the internal electronic device 20 is connected to the fixing bracket 17 .
在一些实施例中,导热支架41的外表面与底壳43的外表面平齐。In some embodiments, the outer surface of the thermally conductive bracket 41 is flush with the outer surface of the bottom case 43 .
具体地,如图16所示,导热支架41的外表面与底壳43的外表面平齐,导热支架41与底壳43之间的外表面平齐,可方便导热支架41与底壳43的装配,可在先装配导热支架41与底壳43,再将导热支架41与底壳43装配的组合体装配进内腔13,从而提高装配效率。Specifically, as shown in Figure 16, the outer surface of the thermally conductive bracket 41 is flush with the outer surface of the bottom shell 43, and the outer surfaces between the thermally conductive bracket 41 and the bottom shell 43 are flush, which can facilitate the assembly of the thermally conductive bracket 41 and the bottom shell 43. The thermally conductive bracket 41 and the bottom shell 43 can be assembled first, and then the assembled combination of the thermally conductive bracket 41 and the bottom shell 43 can be assembled into the inner cavity 13, thereby improving the assembly efficiency.
此外,可以理解的是,前述各个实施例仅为本申请的示例性说明,在技术特征不冲突、结构不矛盾、不违背本申请的发明目的前提下,各个实施例的技术方案可以任意组合、搭配使用。In addition, it can be understood that the aforementioned embodiments are merely illustrative descriptions of the present application. Under the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the invention of the present application is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.
最后应说明的是:以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (24)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311808479.7A CN117479509B (en) | 2023-12-26 | 2023-12-26 | Charging device |
| CN202311808479.7 | 2023-12-26 | ||
| CN202420990687.7U CN222322047U (en) | 2024-05-09 | 2024-05-09 | Charging device |
| CN202420990687.7 | 2024-05-09 |
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| Publication Number | Publication Date |
|---|---|
| WO2025140354A1 true WO2025140354A1 (en) | 2025-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2024/142519 Pending WO2025140354A1 (en) | 2023-12-26 | 2024-12-25 | Charging device |
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| Country | Link |
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| WO (1) | WO2025140354A1 (en) |
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|---|---|---|---|---|
| US20190020145A1 (en) * | 2017-07-14 | 2019-01-17 | Lotes Co., Ltd | Connector assembly |
| CN114916160A (en) * | 2021-02-07 | 2022-08-16 | 华为数字能源技术有限公司 | Power adapter |
| CN217388260U (en) * | 2022-02-10 | 2022-09-06 | 瑞康诺(深圳)创新发展有限公司 | Charger convenient to heat dissipation |
| CN217935429U (en) * | 2022-07-15 | 2022-11-29 | Oppo广东移动通信有限公司 | Power adapter |
| CN117479509A (en) * | 2023-12-26 | 2024-01-30 | 深圳市蓝禾技术有限公司 | Charging device |
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2024
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190020145A1 (en) * | 2017-07-14 | 2019-01-17 | Lotes Co., Ltd | Connector assembly |
| CN114916160A (en) * | 2021-02-07 | 2022-08-16 | 华为数字能源技术有限公司 | Power adapter |
| CN217388260U (en) * | 2022-02-10 | 2022-09-06 | 瑞康诺(深圳)创新发展有限公司 | Charger convenient to heat dissipation |
| CN217935429U (en) * | 2022-07-15 | 2022-11-29 | Oppo广东移动通信有限公司 | Power adapter |
| CN117479509A (en) * | 2023-12-26 | 2024-01-30 | 深圳市蓝禾技术有限公司 | Charging device |
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