WO2025138344A1 - Heat dissipation structure integrating heat dissipation plate and phase change heat transfer device - Google Patents
Heat dissipation structure integrating heat dissipation plate and phase change heat transfer device Download PDFInfo
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- WO2025138344A1 WO2025138344A1 PCT/CN2024/071602 CN2024071602W WO2025138344A1 WO 2025138344 A1 WO2025138344 A1 WO 2025138344A1 CN 2024071602 W CN2024071602 W CN 2024071602W WO 2025138344 A1 WO2025138344 A1 WO 2025138344A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Definitions
- the invention relates to the technical field of heat dissipation, and in particular to a heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device.
- phase change heat transfer devices are recognized as the most efficient heat conduction devices and are widely used in various heat dissipation scenarios.
- the heat spreader is a heat conduction device rather than a heat dissipation device and must be used in conjunction with a heat dissipation plate structure such as an air cooling plate or a liquid cooling plate.
- a heat dissipation plate structure such as an air cooling plate or a liquid cooling plate.
- the contact interface of the two plates has a thermal conductivity of less than 10W/mK.
- the thermal conductivity of the water cooling plate material is less than 400W/mK. Such a low thermal conductivity seriously affects the heat exchange efficiency between the heat spreader and the heat dissipation plate.
- the technical problem to be solved by the present invention is to propose a heat dissipation structure of a heat sink coupled with a phase change heat transfer device.
- the heat spreader By removing part of the shell structure of the heat sink, the heat spreader as a whole is used as the missing shell part of the heat sink, so that the dielectric material in the heat sink is directly in contact with the heat spreader for heat conduction, thereby increasing the thermal conductivity between the two, and solving the problem of poor heat dissipation effect caused by low heat exchange efficiency of the contact interface and low thermal conductivity of the heat sink material during the contact heat dissipation process between the heat spreader and the dielectric heat sink.
- the present invention adopts the following technical solutions to achieve the above problems:
- the heat sink is provided with a flow channel for the medium material to flow, and the flow channel can be any continuous internal channel.
- the flow channel is preferably set to a serpentine shape. Therefore, as a preferred embodiment of the present invention, the flow channel is a serpentine flow channel;
- the upper shell surface of the heat sink that was originally in direct contact with the heat spreader is removed, or a gap is opened in the upper shell surface, so that the dielectric material in the heat sink has the opportunity to directly contact the heat spreader, which greatly improves the thermal conductivity and eliminates the influence of the heat sink plate material on the heat exchange efficiency.
- FIG4 is a schematic diagram of the assembly of the heat dissipation structure of Example 1;
- FIG6 is a schematic diagram of the three-dimensional structure of the water cooling plate of Example 2.
- FIG. 7 is a schematic diagram of the assembly of the heat dissipation structure of Example 2.
- the water cooling plate 1 is provided with a flow channel 11 for the flow of the medium material.
- the flow channel 11 is configured as a meandering serpentine flow channel.
- the head and tail ends of the flow channel 11 are respectively connected to an inlet 12 for water to flow into the flow channel 11 and an outlet 12 for water to flow out of the flow channel 11.
- the inlet 12 and the outlet 13 are integrally formed with the water-cooled plate 1 without an upper shell surface, and the processing methods include but are not limited to milling, drilling and turning; they can also be processed separately and then connected by threaded connection, welding or gluing.
- the material of the water-cooled plate 1 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials.
- the heat spreader 2 is a high thermal conductivity heat transfer device prepared based on the principle of phase change heat transfer, and the material of the heat spreader 2 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials.
- a sealing ring 3 is provided between the water-cooled plate 1 and the heat spreader 2.
- this embodiment preferably adopts a bolt connection, that is, a plurality of threaded holes 5 are provided on the flow channel partition wall 15 of the water cooling plate 1, and correspondingly, a plurality of through holes 6 are provided on the non-working area of the vapor chamber 2, and the vapor chamber 2 is tightened on the threaded holes 5 on the water cooling plate 1 by bolts 7 to achieve a stable connection between the two.
- the through holes 6 are set as countersunk holes in this embodiment.
- the size of the sealing ring 3 is determined by the size of the sealing ring groove 4. For the convenience of assembly, it is recommended to offset 0.2-0.5mm to the entity part according to the principle of entry. A hole is left on the sealing ring 3 to match the threaded hole 5 on the water cooling plate 1.
- the material of the sealing ring 3 includes but is not limited to waterproof materials such as rubber.
- a heat sink 2 is provided on the contact surface between the lower side of the heat sink 2 and the water. There are fins protruding into the flow channel, which are not described in this embodiment.
- the upper surface of the heat spreader 2 that cooperates with the heat source is processed with a boss that cooperates with the heat source (not shown in the figure), and the heat spreader can also be made into a shape that cooperates with the actual use scenario, such as a step shape. Regardless of how the shape of the heat spreader changes, it only needs to have a contact surface that matches the notch 14 on the upper end surface of the water cooling plate 1.
- the heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device of this embodiment is shown in Figures 6-7.
- the difference between the heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device of Example 1 is that the sealing ring 3 and its related mechanisms, such as the sealing ring groove 4 in Example 1, are replaced.
- waterproof glue 8 is applied to the upper surface of the flow channel partition wall 15 of the water-cooled plate 1, and the water-cooled plate 1 and the heat spreader 2 are assembled with 7 bolts before the waterproof glue 8 is cured. Then, the assembled heat dissipation structure is baked at 90°C to accelerate the curing of the waterproof glue 8. In this way, the heat dissipation structure can meet the requirements of waterproof sealing.
- the embodiment is simpler to implement because there is no need to process the sealing ring groove 4 that matches with the sealing ring 3.
- the above two embodiments are illustrative of the case where the upper shell surface of the water-cooling plate 1 is completely missing. However, in some special cases, the upper shell surface of the water-cooling plate 1 is not completely missing, but only a part of it is missing. In this case, the gap of the water-cooling plate 1 can be sealed with the entire heat spreader 2. The principle is the same as that of the above two embodiments.
- the above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments.
- the core of the present invention is to use the heat spreader 2 as the cover plate of the missing part of the water cooling plate 1, and together with the water cooling plate 1 form a water flow channel 11, so that the water directly contacts the heat spreader 2, thereby improving the thermal conductivity.
- any equivalent replacement method by changing the water cooling plate, heat spreader, bolt hole and bolt size, position and quantity is included in the protection scope of the present invention.
- Changing the sealing method between the water-cooling plate and the heat spreader for example, using glue seals instead of rubber and other materials for waterproof sealing, is an equivalent replacement method, which is included in the protection scope of the present invention.
- Spraying a coating on the phase change heat transfer device or the bottom of the water-cooling plate is an equivalent replacement method, which is also included in the protection scope of the present invention.
- Changing the hole structure of the heat spreader for example, changing the countersunk hole to a through hole is an equivalent replacement method and is included in the protection scope of the present invention.
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本发明涉及散热技术领域，具体涉及一种散热板耦合相变传热器件的散热结构。The invention relates to the technical field of heat dissipation, and in particular to a heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device.
相变传热器件(均热板)是公认最高效的导热器件，被广泛应用于各类散热场景。但是，均热板属于导热器件而非散热器件，必须配合风冷板或液冷板等散热板结构使用。但是，均热板与散热板接触时，两种板材的接触界面存在导热率＜10W/mK的问题，而如水冷板材料的热导率＜400W/mK，这样低的导热率严重影响了均热板与散热板间的换热效率。Phase change heat transfer devices (heat spreaders) are recognized as the most efficient heat conduction devices and are widely used in various heat dissipation scenarios. However, the heat spreader is a heat conduction device rather than a heat dissipation device and must be used in conjunction with a heat dissipation plate structure such as an air cooling plate or a liquid cooling plate. However, when the heat spreader contacts the heat dissipation plate, the contact interface of the two plates has a thermal conductivity of less than 10W/mK. For example, the thermal conductivity of the water cooling plate material is less than 400W/mK. Such a low thermal conductivity seriously affects the heat exchange efficiency between the heat spreader and the heat dissipation plate.
因此，需要一种均热板与散热板之间热量无阻力交换的方法，减少接触界面和散热板材料对传热效率的影响。Therefore, a method for heat exchange between a vapor chamber and a heat sink without resistance is needed to reduce the influence of the contact interface and the heat sink material on the heat transfer efficiency.
发明内容Summary of the invention
有鉴于此，本发明所要解决的技术问题，就是提出一种散热板耦合相变传热器件的散热结构，通过去掉散热板的部分壳体结构，将均热板整体作为散热板缺失的壳体部分使用，从而使散热板中的介质材料直接与均热板接触导热，加大了两者之间的导热效率，解决均热板和介质散热板接触散热过程中因接触界面的换热效率低以及散热板材料的低热导率导致的散热效果差的问题。In view of this, the technical problem to be solved by the present invention is to propose a heat dissipation structure of a heat sink coupled with a phase change heat transfer device. By removing part of the shell structure of the heat sink, the heat spreader as a whole is used as the missing shell part of the heat sink, so that the dielectric material in the heat sink is directly in contact with the heat spreader for heat conduction, thereby increasing the thermal conductivity between the two, and solving the problem of poor heat dissipation effect caused by low heat exchange efficiency of the contact interface and low thermal conductivity of the heat sink material during the contact heat dissipation process between the heat spreader and the dielectric heat sink.
为解决上述技术问题，本发明采用以下技术方案予以实现：In order to solve the above technical problems, the present invention adopts the following technical solutions to achieve the above problems:
一种散热板耦合相变传热器件的散热结构，包括散热板和均热板；A heat dissipation structure of a heat dissipation plate coupled with a phase change heat transfer device, comprising a heat dissipation plate and a heat spreader;
所述散热板内设有供介质材料流动的流道，所述流道可以是任何连贯的内部通道，为了增加流道的长度，优选将流道设置为蜿蜒曲折的形状。因此，作为本发明的一个优选实施例，所述流道为蛇形流道；The heat sink is provided with a flow channel for the medium material to flow, and the flow channel can be any continuous internal channel. In order to increase the length of the flow channel, the flow channel is preferably set to a serpentine shape. Therefore, as a preferred embodiment of the present invention, the flow channel is a serpentine flow channel;
所述散热板未封装上壳面，即散热板具有上端面缺口，所述均热板贴设在散热板的上端面缺口上替换散热板的上壳面发挥作用。当然，散热板的上壳面也可以是完整的，仅仅上壳面上设置有一个缺口，而均热板的下板面与该缺口大小适配并对该缺口进行封堵。也 即散热板上设置有供均热板封堵的缺口，该缺口是整块散热板的上壳面，也可以是上壳面上的一部分。The heat sink does not have an upper shell surface encapsulated, that is, the heat sink has an upper end surface notch, and the heat spreader is attached to the upper end surface notch of the heat sink to replace the upper shell surface of the heat sink. Of course, the upper shell surface of the heat sink can also be complete, with only a notch on the upper shell surface, and the lower plate surface of the heat spreader is adapted to the size of the notch and blocks the notch. That is, a gap is provided on the heat sink for the heat spreader to seal, and the gap is the upper shell surface of the entire heat sink, and can also be a part of the upper shell surface.
所述散热板上还设有供介质材料流入流道并从流道流出的进口和出口。The heat sink is also provided with an inlet and an outlet for the medium material to flow into the flow channel and flow out of the flow channel.
本发明中，去掉了原本直接与均热板接触的散热板的上壳面，或者上壳面开设一个缺口，散热板中的介质材料有了直接与均热板接触的机会，大大提高了导热率，同时，也消除了散热板板材对于换热效率的影响。In the present invention, the upper shell surface of the heat sink that was originally in direct contact with the heat spreader is removed, or a gap is opened in the upper shell surface, so that the dielectric material in the heat sink has the opportunity to directly contact the heat spreader, which greatly improves the thermal conductivity and eliminates the influence of the heat sink plate material on the heat exchange efficiency.
本发明中，考虑到均热板与散热板本身的大小，优选将散热板的上壳面全部去除形成整个上壳面缺口，并以均热板对该缺口进行封堵的技术方案。也就是说，所述散热板上端面的缺口大小与整块散热板的上壳面大小是一致的，所述均热板贴设在散热板的上端面缺口上作为散热板的上壳面。In the present invention, considering the size of the vapor chamber and the heat sink itself, it is preferred to completely remove the upper shell surface of the heat sink to form a gap in the entire upper shell surface, and use the vapor chamber to block the gap. In other words, the size of the gap on the upper end surface of the heat sink is consistent with the size of the upper shell surface of the entire heat sink, and the vapor chamber is attached to the gap on the upper end surface of the heat sink as the upper shell surface of the heat sink.
作为优选地，所述散热板与均热板之间设有防水密封结构，该防水密封结构为涂刷在散热板的流道隔墙上表面的防水胶；除此之外，所述防水密封结构也可以是设置在散热板与均热板之间的密封圈，优选地，密封圈的形状大小与流道隔墙上表面相适配；从而保证了散热板的密封性，防止散热板发生漏气漏液的情况。进一步地，在防水密封结构采用密封圈的情况下，为了保证密封圈的位置不发生移位，在散热板的上端面(流道隔墙上表面)上还设有密封圈沟槽，密封圈设于密封圈沟槽中可以更加稳定，且不会在均热板安装时顶住均热板。Preferably, a waterproof sealing structure is provided between the heat sink and the heat spreader. The waterproof sealing structure is a waterproof glue applied to the upper surface of the flow channel partition wall of the heat sink. In addition, the waterproof sealing structure can also be a sealing ring provided between the heat sink and the heat spreader. Preferably, the shape and size of the sealing ring are adapted to the upper surface of the flow channel partition wall. Thus, the sealing of the heat sink is ensured and the heat sink is prevented from leaking air or liquid. Furthermore, when a sealing ring is used in the waterproof sealing structure, a sealing ring groove is provided on the upper end surface of the heat sink (the upper surface of the flow channel partition wall) to ensure that the position of the sealing ring does not shift. The sealing ring is provided in the sealing ring groove to be more stable and will not press against the heat spreader when the heat spreader is installed.
此外，防水密封结构也可以是喷涂在均热板或者散热板的接触面上的防水涂层。In addition, the waterproof sealing structure may also be a waterproof coating sprayed on the contact surface of the heat spreader or the heat sink.
作为优选地，所述散热板的流道隔墙上设有若干螺纹孔，对应地，所述均热板的非工作区设有若干通孔，均热板通过螺栓与散热板固定连接。而为了本发明的散热结构的平整性，所述通孔为沉头孔。Preferably, the flow channel partition wall of the heat sink is provided with a plurality of threaded holes, and correspondingly, the non-working area of the heat sink is provided with a plurality of through holes, and the heat sink is fixedly connected to the heat sink by bolts. In order to ensure the flatness of the heat sink structure of the present invention, the through holes are countersunk holes.
作为优选地，所述散热板为水冷板，水冷板中的冷却液直接接触均热板进行换热，效率更高。此外，为了进一步提升换热效率，在均热板的介质材料接触面还设有凸起进入流道中的翅片。Preferably, the heat sink is a water-cooled plate, and the coolant in the water-cooled plate directly contacts the vapor chamber for heat exchange, which is more efficient. In addition, in order to further improve the heat exchange efficiency, a fin protruding into the flow channel is provided on the dielectric material contact surface of the vapor chamber.
作为优选地，为与芯片或功率器件等高热流密度的热源配合，均热板上与热源配合的上表面加工有与热源配合的凸台，也可将均热板做成与实际使用场景配合的形状，如阶梯 状。不管均热板形状如何变化，只需均热板具有与散热板的上端面缺口适配的接触面即可。As a preferred embodiment, in order to cooperate with a heat source with high heat flux density such as a chip or a power device, the upper surface of the heat spreader that cooperates with the heat source is processed with a boss that cooperates with the heat source. The heat spreader can also be made into a shape that cooperates with the actual use scenario, such as a step. No matter how the shape of the vapor chamber changes, it is sufficient that the vapor chamber has a contact surface that matches the notch on the upper end surface of the heat sink.
与现有技术相比，本发明具有的有益效果为：Compared with the prior art, the present invention has the following beneficial effects:
本发明能够有效解决均热板与散热板的复合散热中均热板与冷却介质材料之间热交换效率不足的难题，有效提升均热板与散热板的复合散热方式的冷却效率。无需对各组成部分做出大的改动，因均热板对结构的要求高，而本申请无需对均热板的内部结构进行变化，生产加工也容易实现。The present invention can effectively solve the problem of insufficient heat exchange efficiency between the vapor chamber and the cooling medium material in the composite heat dissipation of the vapor chamber and the heat sink, and effectively improve the cooling efficiency of the composite heat dissipation method of the vapor chamber and the heat sink. There is no need to make major changes to the components, because the vapor chamber has high requirements for the structure, and the present application does not need to change the internal structure of the vapor chamber, and production and processing are also easy to implement.
图1为实施例1水冷板的立体结构示意图；FIG1 is a schematic diagram of the three-dimensional structure of the water cooling plate of Example 1;
图2为实施例1的均热板的立体结构示意图；FIG2 is a schematic diagram of the three-dimensional structure of the heat sink of Example 1;
图3为实施例1的密封圈的立体结构示意图；FIG3 is a schematic diagram of the three-dimensional structure of the sealing ring of Example 1;
图4为实施例1的散热结构的组装示意图；FIG4 is a schematic diagram of the assembly of the heat dissipation structure of Example 1;
图5为实施例1的散热结构组装好后的结构示意图；FIG5 is a schematic structural diagram of the heat dissipation structure of Example 1 after being assembled;
图6为实施例2的水冷板的立体结构示意图；FIG6 is a schematic diagram of the three-dimensional structure of the water cooling plate of Example 2;
图7为实施例2的散热结构的组装示意图。FIG. 7 is a schematic diagram of the assembly of the heat dissipation structure of Example 2.
图中：In the figure:
1水冷板、11流道、12进口、13出口、14上端面缺口、15流道隔墙、2均热板、3密封圈、4密封圈沟槽、5螺纹孔、6通孔、7螺栓、8防水胶。1 water-cooling plate, 11 flow channel, 12 inlet, 13 outlet, 14 upper end face notch, 15 flow channel partition wall, 2 heat spreader, 3 sealing ring, 4 sealing ring groove, 5 threaded hole, 6 through hole, 7 bolt, 8 waterproof glue.
为让本领域的技术人员更加清晰直观的了解本发明，下面将结合附图，对本发明作进一步的说明。In order to allow those skilled in the art to understand the present invention more clearly and intuitively, the present invention will be further described below in conjunction with the accompanying drawings.
实施例1Example 1
本实施例的水冷板耦合相变传热器件的散热结构如图1-5所示，包括水冷板1和均热板2；The heat dissipation structure of the water-cooling plate coupled phase-change heat transfer device of this embodiment is shown in FIG1-5 , and includes a water-cooling plate 1 and a heat spreader 2;
水冷板1内设有供介质材料流动的流道11，本实施例中，流道11设置为蜿蜒曲折的蛇形流道。流道11的首尾端分别连接有供水流入流道11的进口12，以及从流道11流出 的出口13；The water cooling plate 1 is provided with a flow channel 11 for the flow of the medium material. In this embodiment, the flow channel 11 is configured as a meandering serpentine flow channel. The head and tail ends of the flow channel 11 are respectively connected to an inlet 12 for water to flow into the flow channel 11 and an outlet 12 for water to flow out of the flow channel 11. Exit 13;
本实施例中，水冷板1的上端未封装上壳面，即水冷板1具有上端面缺口14，而均热板2贴设在水冷板1的上端面缺口14上作为水冷板1的上壳面发挥作用。通过这样的设置，水冷板1中的水可以直接与均热板2进行接触换热，由于是水与均热板2之间的直接换热，消除了原本的热量需要透过水冷板1和均热板2的壳体以及两层界面材料才能进行交换的弊端，因此大大提高了散热效率，消除了水冷板1壳体材料对于换热效率的影响。In this embodiment, the upper end of the water-cooling plate 1 is not encapsulated with an upper shell surface, that is, the water-cooling plate 1 has an upper end surface notch 14, and the heat spreader 2 is attached to the upper end surface notch 14 of the water-cooling plate 1 to function as the upper shell surface of the water-cooling plate 1. Through such a setting, the water in the water-cooling plate 1 can directly contact and exchange heat with the heat spreader 2. Since it is a direct heat exchange between water and the heat spreader 2, the original disadvantage that heat needs to pass through the shell of the water-cooling plate 1 and the heat spreader 2 and two layers of interface materials to be exchanged is eliminated, thereby greatly improving the heat dissipation efficiency and eliminating the influence of the shell material of the water-cooling plate 1 on the heat exchange efficiency.
本实施例中，水冷板1的制作时，进口12和出口13与无上壳面的水冷板1一体式成型加工而成，加工方式包括但不限于铣削、钻削和车削；也可分别独立加工，后续采用螺纹连接、焊接或胶粘等方式连接。水冷板1的材料包括但不限于铜基、铝基或不锈钢基纯金属材料或合金材料。均热板2是基于相变传热原理制备的高导热传热器件，均热板2的材料包括但不限于铜基、铝基或不锈钢基纯金属材料或合金材料。In this embodiment, when the water-cooled plate 1 is manufactured, the inlet 12 and the outlet 13 are integrally formed with the water-cooled plate 1 without an upper shell surface, and the processing methods include but are not limited to milling, drilling and turning; they can also be processed separately and then connected by threaded connection, welding or gluing. The material of the water-cooled plate 1 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials. The heat spreader 2 is a high thermal conductivity heat transfer device prepared based on the principle of phase change heat transfer, and the material of the heat spreader 2 includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials.
既然本实施例中去掉了水冷板1的一个壳面，虽然均热板2对上端面缺口14进行了封堵，但是还是要考虑到使用过程中的稳定性，比如密封稳定性。为了保证在水冷板1和均热板2的连接位置的密封性，在水冷板1与均热板2之间设置密封圈3。进一步地，密封圈3的形状和大小应该与流道隔墙15上表面相适配，便于组装时密封圈3的稳定放置，同时，可以保证整个流道11的防水密封性能；更进一步地，在水冷板1上流道隔墙15的上表面上还设有密封圈沟槽4，密封圈3设于密封圈沟槽4中可以更加稳定，且不会在均热板2安装时顶住均热板2。Since one shell surface of the water-cooled plate 1 is removed in this embodiment, although the heat spreader 2 has blocked the upper end surface notch 14, the stability during use, such as sealing stability, must still be considered. In order to ensure the sealing of the connection position between the water-cooled plate 1 and the heat spreader 2, a sealing ring 3 is provided between the water-cooled plate 1 and the heat spreader 2. Furthermore, the shape and size of the sealing ring 3 should be compatible with the upper surface of the flow channel partition wall 15, so as to facilitate the stable placement of the sealing ring 3 during assembly, and at the same time, the waterproof sealing performance of the entire flow channel 11 can be ensured; further, a sealing ring groove 4 is also provided on the upper surface of the flow channel partition wall 15 on the water-cooled plate 1, and the sealing ring 3 is arranged in the sealing ring groove 4 to be more stable and will not support the heat spreader 2 when the heat spreader 2 is installed.
对于水冷板1与均热板2的连接方式，本实施例优选采用螺栓连接的方式，即水冷板1的流道隔墙15上设有若干螺纹孔5，对应地，均热板2的非工作区设有若干通孔6，均热板2通过螺栓7在水冷板1上的螺纹孔5上旋紧而实现两者连接稳定。而为了整个散热结构的平整性，本实施例中将通孔6设置为沉头孔。As for the connection between the water cooling plate 1 and the vapor chamber 2, this embodiment preferably adopts a bolt connection, that is, a plurality of threaded holes 5 are provided on the flow channel partition wall 15 of the water cooling plate 1, and correspondingly, a plurality of through holes 6 are provided on the non-working area of the vapor chamber 2, and the vapor chamber 2 is tightened on the threaded holes 5 on the water cooling plate 1 by bolts 7 to achieve a stable connection between the two. In order to ensure the flatness of the entire heat dissipation structure, the through holes 6 are set as countersunk holes in this embodiment.
在具体实施的时候，密封圈3的尺寸由密封圈沟槽4尺寸决定。为了方便装配，建议根据入体原则向实体部分偏移0.2-0.5mm。密封圈3上留有与水冷板1上的螺纹孔5配合的孔。密封圈3的材料包括但不限于橡胶等防水材料。In the specific implementation, the size of the sealing ring 3 is determined by the size of the sealing ring groove 4. For the convenience of assembly, it is recommended to offset 0.2-0.5mm to the entity part according to the principle of entry. A hole is left on the sealing ring 3 to match the threaded hole 5 on the water cooling plate 1. The material of the sealing ring 3 includes but is not limited to waterproof materials such as rubber.
为了进一步提升换热效率，在一些实施例中，在均热板2的下侧与水的接触面上还设 有凸起进入流道中的翅片，本实施例中对此不做说明。In order to further improve the heat exchange efficiency, in some embodiments, a heat sink 2 is provided on the contact surface between the lower side of the heat sink 2 and the water. There are fins protruding into the flow channel, which are not described in this embodiment.
而为与芯片或功率器件等高热流密度的热源配合，均热板2上与热源配合的上表面加工有与热源配合的凸台(图中未示出)，也可将均热板做成与实际使用场景配合的形状，如阶梯状。不管均热板形状如何变化，只需均热板2具有与水冷板1的上端面缺口14适配的接触面即可。In order to cooperate with heat sources with high heat flux density such as chips or power devices, the upper surface of the heat spreader 2 that cooperates with the heat source is processed with a boss that cooperates with the heat source (not shown in the figure), and the heat spreader can also be made into a shape that cooperates with the actual use scenario, such as a step shape. Regardless of how the shape of the heat spreader changes, it only needs to have a contact surface that matches the notch 14 on the upper end surface of the water cooling plate 1.
实施例2Example 2
本实施例的水冷板耦合相变传热器件的散热结构如图6-7所示，其与实施例1的水冷板耦合相变传热器件的散热结构的不同之处在于，替换实施例1中的密封圈3及其相关机构，比如密封圈沟槽4，而为了实现散热结构的防水密封性，本实施例中在水冷板1的流道隔墙15上表面涂刷防水胶8，在防水胶8未固化前将水冷板1与均热板2通过7螺栓装配好，然后在90℃环境下对完成装配的散热结构进行烘烤，加速防水胶8固化，这样做出来的散热结构可以达到防水密封的要求。The heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device of this embodiment is shown in Figures 6-7. The difference between the heat dissipation structure of the water-cooled plate coupled with the phase change heat transfer device of Example 1 is that the sealing ring 3 and its related mechanisms, such as the sealing ring groove 4 in Example 1, are replaced. In order to achieve the waterproof sealing of the heat dissipation structure, in this embodiment, waterproof glue 8 is applied to the upper surface of the flow channel partition wall 15 of the water-cooled plate 1, and the water-cooled plate 1 and the heat spreader 2 are assembled with 7 bolts before the waterproof glue 8 is cured. Then, the assembled heat dissipation structure is baked at 90°C to accelerate the curing of the waterproof glue 8. In this way, the heat dissipation structure can meet the requirements of waterproof sealing.
相对来说，本实施例与实施例1相比，因为无需加工出与密封圈3配合的密封圈沟槽4，因此实施例起来更为简便。Relatively speaking, compared with the embodiment 1, the embodiment is simpler to implement because there is no need to process the sealing ring groove 4 that matches with the sealing ring 3.
上面2个实施例都是水冷板1的上壳面整个缺失的情况进行的说明，而在一些特殊的情况下，水冷板1的上壳面并不是全部缺失的，其只是缺失一部分，而针对这种情况，可以以整个均热板2对水冷板1的缺口进行封堵，原理与上面两个实施例的原理相同。The above two embodiments are illustrative of the case where the upper shell surface of the water-cooling plate 1 is completely missing. However, in some special cases, the upper shell surface of the water-cooling plate 1 is not completely missing, but only a part of it is missing. In this case, the gap of the water-cooling plate 1 can be sealed with the entire heat spreader 2. The principle is the same as that of the above two embodiments.
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，本发明的核心在于采用均热板2作为水冷板1的缺失部分的盖板，与水冷板1共同构成水的流道11，使得水直接与均热板2接触，从而提高热导率。The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. The core of the present invention is to use the heat spreader 2 as the cover plate of the missing part of the water cooling plate 1, and together with the water cooling plate 1 form a water flow channel 11, so that the water directly contacts the heat spreader 2, thereby improving the thermal conductivity.
因此，本发明中，通过改变水冷板、均热板、螺栓孔和螺栓尺寸、位置和数量为等效的置换方式，都包含在本发明的保护范围之内。Therefore, in the present invention, any equivalent replacement method by changing the water cooling plate, heat spreader, bolt hole and bolt size, position and quantity is included in the protection scope of the present invention.
通过改变水冷板和均热板间的密封方式，例如采用胶封替代橡胶等材料进行防水密封，为等效的置换方式，都包含在本发明的保护范围之内。通过在相变传热器件或水冷板下上喷涂涂层为等效的置换方式，都包含在本发明的保护范围之内。Changing the sealing method between the water-cooling plate and the heat spreader, for example, using glue seals instead of rubber and other materials for waterproof sealing, is an equivalent replacement method, which is included in the protection scope of the present invention. Spraying a coating on the phase change heat transfer device or the bottom of the water-cooling plate is an equivalent replacement method, which is also included in the protection scope of the present invention.
通过改变水冷板壳体上流道形状、结构和尺寸参数属于等效的置换方式，都包含在本 发明的保护范围之内。By changing the shape, structure and size parameters of the flow channel on the water-cooled plate shell, it is an equivalent replacement method and is included in this within the scope of protection of the invention.
通过改变均热板外形结构，例如在与热源接触的接触面设置凸台、阶梯和凹槽等属于等效的置换方式，都包含在本发明的保护范围之内。Changing the external structure of the heat spreader, for example, providing bosses, steps and grooves on the contact surface with the heat source, etc., are equivalent replacement methods and are all included in the protection scope of the present invention.
通过改变均热板孔位结构，例如沉头孔改为通孔属于等效的置换方式，都包含在本发明的保护范围之内。Changing the hole structure of the heat spreader, for example, changing the countersunk hole to a through hole is an equivalent replacement method and is included in the protection scope of the present invention.
以及其他的任何未背离本发明的核心思想所作的零件结构改变、修饰、替代、组合和简化，均应为等效的置换方式，都包含在本发明的保护范围之内。 Any other structural changes, modifications, substitutions, combinations and simplifications of parts that do not deviate from the core concept of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.
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