WO2025035264A1 - 芯片的余热回收方法和装置、存储介质和整车系统 - Google Patents

芯片的余热回收方法和装置、存储介质和整车系统 Download PDF

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Publication number
WO2025035264A1
WO2025035264A1 PCT/CN2023/112547 CN2023112547W WO2025035264A1 WO 2025035264 A1 WO2025035264 A1 WO 2025035264A1 CN 2023112547 W CN2023112547 W CN 2023112547W WO 2025035264 A1 WO2025035264 A1 WO 2025035264A1
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WIPO (PCT)
Prior art keywords
chip
heat
temperature
waste heat
water circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/112547
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English (en)
French (fr)
Inventor
李韦林
胡磊
许俊波
夏嵩勇
王健
邢晓东
孙利刚
葛鹏飞
褚冠群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Geely Holding Group Co Ltd
Zhejiang Zeekr Intelligent Technology Co Ltd
Original Assignee
Zhejiang Geely Holding Group Co Ltd
Zhejiang Zeekr Intelligent Technology Co Ltd
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Filing date
Publication date
Application filed by Zhejiang Geely Holding Group Co Ltd, Zhejiang Zeekr Intelligent Technology Co Ltd filed Critical Zhejiang Geely Holding Group Co Ltd
Priority to PCT/CN2023/112547 priority Critical patent/WO2025035264A1/zh
Priority to CN202380100718.5A priority patent/CN121620453A/zh
Publication of WO2025035264A1 publication Critical patent/WO2025035264A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating devices
    • B60H1/22—Heating, cooling or ventilating devices the heat source being other than the propulsion plant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the technical field of waste heat recovery, and in particular to a waste heat recovery method for a chip, a computer-readable storage medium, a whole vehicle system, and a waste heat recovery device for a chip.
  • Vehicle components often generate heat during operation, and if this heat is not recycled in time, it will be dissipated directly, causing waste and affecting the environment.
  • waste heat recovery in the chips inside the vehicle system or components is achieved by converting heat energy into electrical energy through temperature difference power generation for recovery, directly recovering heat energy through a circulating water circuit, and directly recovering heat energy through a heat pump.
  • the efficiency of temperature difference power generation is 3%-10%, which is low in efficiency and poor in recovery effect, making it difficult to use on a large scale in the mass production of actual project models; in the process of collecting thermal energy directly through a cooling circuit or a refrigerant circuit, the cooling circuit or the refrigerant circuit needs to be pre-arranged in the components, and it is not easy to install, maintain and replace later. It is also not conducive to modularization and commonality in multiple models, and has poor feasibility.
  • the present disclosure aims to solve at least one of the technical problems in the related art to a certain extent.
  • the first purpose of the present disclosure is to propose a waste heat recovery method for a chip, which recovers the waste heat conducted from the chip to the heat pipe through a heat exchanger and a coolant in an external circulating water circuit, thereby improving the recovery efficiency of heat energy, and the external circulating water circuit is easy to install and maintain, has strong versatility and feasibility, and can achieve waste heat recovery in winter and cooling in summer.
  • a second object of the present disclosure is to provide a computer-readable storage medium.
  • the third objective of the present disclosure is to provide a whole vehicle system.
  • the fourth objective of the present disclosure is to provide a waste heat recovery device for a chip.
  • the first aspect embodiment of the present disclosure proposes a method for recovering waste heat of a chip, wherein the chip is arranged inside a shell, at least one heat pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, a valve is arranged in the external circulating water circuit, and the method comprises: obtaining the temperature of the heat pipe, the temperature of the coolant in the external circulating water circuit and the ambient temperature; when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, controlling the valve to open so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.
  • the waste heat conducted from the chip to the heat pipe is recovered by the coolant in the heat exchanger and the external circulating water circuit, which can improve the recovery efficiency of thermal energy.
  • the external circulating water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.
  • waste heat recovery method of the chip according to the above embodiment of the present disclosure may also have the following additional technical features:
  • the ambient temperature satisfies a preset temperature, including: the ambient temperature is less than or equal to a first preset temperature, or the ambient temperature is greater than or equal to a second preset temperature, and the first preset temperature is less than the second preset temperature.
  • the value range of the first preset temperature is [5°C, 10°C]
  • the value range of the second preset temperature is [30°C, 40°C].
  • a first heat conducting pipe and a second heat conducting pipe are disposed inside the housing, the first heat conducting pipe is used to support the chip, and the second heat conducting pipe is disposed above the chip.
  • a groove is further provided on the first heat pipe, and the groove is used to place the chip.
  • a portion of the first heat pipe used for supporting the chip is provided with at least one opening.
  • heat insulation cotton is provided on the inner side of the shell.
  • the second aspect embodiment of the present disclosure proposes a computer-readable storage medium, on which a chip waste heat recovery program is stored.
  • the chip waste heat recovery program is executed by a processor, the above-mentioned chip waste heat recovery method is implemented.
  • the computer-readable storage medium can improve the recovery efficiency of heat energy generated during chip operation, and has strong versatility and feasibility, and can also realize waste heat recovery in winter and cooling in summer.
  • the third aspect embodiment of the present disclosure proposes a whole vehicle system, which includes a memory, a processor, and a waste heat recovery program of a chip stored in the memory and executable on the processor.
  • the processor executes the waste heat recovery program, the above-mentioned waste heat recovery method of the chip is implemented.
  • the whole vehicle system proposed according to the embodiment of the present disclosure can improve the recovery efficiency of the heat energy generated during the operation of the chip, and the waste heat recovery method has strong versatility and feasibility, and can also achieve waste heat recovery in winter and cooling in summer.
  • the fourth aspect embodiment of the present disclosure proposes a waste heat recovery device for a chip, wherein the chip is arranged inside a shell, at least one heat pipe is arranged inside the shell, a heat exchanger is arranged through the shell, one end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit, a valve is arranged in the external circulating water circuit, and the device includes: an acquisition module, used to obtain the temperature of the heat pipe, the coolant temperature in the external circulating water circuit and the ambient temperature; a control module, used to control the valve to open when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the coolant temperature in the external circulating water circuit, so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.
  • the control module controls the heat exchanger and the coolant in the external circulation water circuit to recover the waste heat conducted by the chip to the heat pipe, which can improve the recovery efficiency of thermal energy.
  • the external circulation water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.
  • FIG1 is a schematic diagram of a component structure including a chip according to an embodiment of the present disclosure
  • FIG2 is a schematic flow diagram of a method for recovering waste heat from a chip according to an embodiment of the present disclosure
  • FIG3 is a schematic diagram of the structure of components of a vehicle lamp according to a specific embodiment of the present disclosure.
  • FIG4 is a schematic flow diagram of a method for recovering waste heat from a chip according to a specific embodiment of the present disclosure
  • FIG5 is a block diagram of a vehicle system according to an embodiment of the present disclosure.
  • FIG6 is a block diagram of a waste heat recovery device for a chip according to an embodiment of the present disclosure.
  • FIG. 1 is a schematic diagram of components including a chip according to an embodiment of the present disclosure.
  • the chip 13 is disposed inside the shell 10
  • at least one heat pipe is disposed inside the shell 10
  • a heat exchanger 15 is penetrated through the shell 10
  • one end of the heat exchanger 15 is connected to the heat pipe
  • the other end of the heat exchanger 15 is connected to an external circulating water circuit
  • a valve 20 is provided in the external circulating water circuit, and when coolant passes through the external circulating water circuit, the heat on the heat pipe can be discharged through the coolant through the heat exchanger 15.
  • FIG2 is a schematic flow chart of a method for recovering waste heat from a chip according to an embodiment of the present disclosure.
  • the waste heat recovery method of a chip includes the following steps:
  • a temperature sensor can be set on the heat exchanger to obtain the temperature of the heat pipe, a temperature sensor can be set in the external circulating water circuit to obtain the coolant temperature of the external circulating water circuit, and a temperature sensor can be set outside the shell to obtain the ambient temperature.
  • the temperature of the pipe in the external circulating water circuit can be detected, and then the temperature of the coolant can be calculated by the temperature of the pipe.
  • the environmental information can also be determined by obtaining weather temperature information released by the Meteorological Bureau.
  • the present disclosure may not specifically limit the method of obtaining the temperature of the heat pipe, the coolant temperature in the external circulating water circuit, and the ambient temperature.
  • the valve when the ambient temperature is less than or equal to the first preset temperature, or the ambient temperature is greater than or equal to the second preset temperature, the first preset temperature is less than the second preset temperature, and the temperature of the heat pipe is greater than the temperature of the coolant in the external circulating water circuit, the valve is controlled to open to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.
  • the ambient temperature when the ambient temperature is greater than the first preset temperature and less than the second preset temperature, the chip operates within a suitable temperature range, and neither heat dissipation is required to prevent component ablation nor additional heat needs to be absorbed, so within this temperature range, the valve does not need to be controlled to open.
  • the value range of the first preset temperature is [5°C, 10°C]
  • the value range of the second preset temperature is [30°C, 40°C].
  • the value of the first preset temperature can be preferably 7°C
  • the value of the second preset temperature can be preferably 35°C. That is, when the ambient temperature is less than or equal to 7°C, since the ambient temperature is low, the heat energy generated by the chip can be recovered to other places in the vehicle for use, so the valve needs to be opened; and when the ambient temperature is greater than or equal to 35°C, since the ambient temperature is high, the temperature of the chip working environment needs to be lowered to prevent component ablation, so the valve also needs to be opened.
  • the present disclosure may not specifically limit the values of the first preset temperature and the second preset temperature.
  • a first heat pipe and a second heat pipe are disposed inside the housing, the first heat pipe is used to carry the chip, and the second heat pipe is disposed above the chip.
  • a first heat pipe 11 and a second heat pipe 12 are provided inside the housing 10, and a groove (not shown in the figure) is also provided on the first heat pipe 11, and the groove can be used to place the chip 13.
  • the portion of the first heat pipe 11 used to carry the chip 13 is provided with at least one opening, thereby increasing the heat exchange efficiency and reducing the contact thermal resistance.
  • the heat transfer efficiency can be increased by applying a thermal conductive adhesive on the heat source side of the first heat pipe 11 and the second heat pipe 12.
  • the second heat pipe 12 is arranged above the chip 13, and the heat generated by the chip 13 during operation can heat the air above it, thereby generating a heat flow.
  • the second heat pipe 12 is arranged above the chip 13, which can improve the waste heat recovery rate.
  • the second heat pipe 12 can also be set to a ring shape to be designed in a shape that surrounds the chip 13.
  • the first heat pipe 11 and the second heat pipe 12 can also be non-standardly designed such as special-shaped, that is, the first heat pipe 11 and the second heat pipe 12 are customized for the heat dissipation device.
  • a PCB (Printed Circuit Board) board 14 is also placed on the first heat conducting pipe 11, and the bottom surface of the PCB board 14 is in contact with the heat source side of the first heat conducting pipe.
  • the control valve 20 is opened, and the coolant enters the heat exchanger 15 through the water inlet pipe 16 of the external circulating water circuit. After the coolant absorbs the heat of the heat exchanger 15, it flows out through the water outlet pipe 17 of the external circulating water circuit.
  • the heat is then collected into the heating circuit of the vehicle to be used, for example, to heat the back of the seat and the internal ambient temperature of the vehicle.
  • the present disclosure may not specifically limit the use of the collected heat, which may be specifically limited according to the real-time needs of the user.
  • the heat exchanger 15 is also provided with a temperature sensor 18 for detecting the temperature of the heat exchanger 15, and a base 19 for supporting the housing 10.
  • heat insulation cotton is provided on the inner side of the shell.
  • heat insulation cotton by arranging heat insulation cotton on the inside of the shell, heat loss can be prevented, which facilitates the maximum collection of heat.
  • heat insulation materials such as foam materials and fiber materials can also be arranged on the inside of the shell.
  • the present disclosure may not specifically limit the selection of the heat insulation material arranged in the shell.
  • the shell 10 can also be arranged as a heat pipe to participate in the recovery of the waste heat of the chip.
  • the temperature of the headlight chip 25 increases when it is working, and the heat generated by the headlight PCB board 24 and/or the headlight chip 25 will be transferred to the headlight heat exchanger 32 through the headlight PCB heat pipe 26.
  • the heat radiation and the rising hot air flow heat the upper components, such as the reflector 23, the lampshade 29, the decorative ring 30 and the lens 31.
  • the reflector heat pipe 22 above the headlight chip 25 and in contact with the reflector 23 will transfer the heat of the reflector 23 and other components to the headlight heat exchanger 32, thereby preventing the components from being burned and failing.
  • the headlight temperature sensor 36 can preferentially obtain the temperature of the headlight PCB heat pipe 26, that is, the priority of the headlight PCB heat pipe 26 is greater than the priority of the reflector heat pipe 22. In addition, the present disclosure may not specifically limit the priority of the headlight PCB heat pipe 26 and the reflector heat pipe 22.
  • the ambient temperature is less than or equal to the first preset temperature or the ambient temperature is greater than or equal to the second preset temperature
  • the headlight temperature sensor 36 obtains that the temperature of the headlight PCB heat pipe 26 is greater than the temperature of the coolant in the external circulating water circuit
  • the headlight valve 34 is controlled to open, and the coolant enters the headlight heat exchanger 32 through the headlight water inlet pipe 33 of the external circulating water circuit.
  • the car light also includes a bracket 27, a first car light shell 21 and a second car light shell 28, wherein the bracket 27 is used to support the car light PCB heat pipe 26 to fix the car light PCB heat pipe 26, and the first car light shell 21 and the second car light shell 28 are arranged in cooperation to protect the internal components of the car light.
  • heat insulation cotton can be arranged on the inner side of the first car light shell 21 and the second car light shell 28 to prevent heat loss and facilitate the maximum collection of the heat generated by the car light.
  • waste heat recovery method of the chip disclosed in the present invention can be applied not only to car lights, but also to engines, brake pads and other places. As long as it is a place on the vehicle where heat is generated, the method can be used to recover the heat.
  • the present invention does not need to make specific limitations on the application scenarios of the waste heat recovery method of the chip.
  • the heat exchanger water circuit is closed by default, that is, the valve is closed by default so that the heat exchanger is not connected to the external circulating water circuit for heat exchange.
  • the waste heat conducted from the chip to the heat pipe is recovered by the coolant in the heat exchanger and the external circulating water circuit, which can improve the recovery efficiency of thermal energy.
  • This waste heat recovery method has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.
  • the embodiment of the present disclosure also proposes a computer-readable storage medium, on which a waste heat recovery program of the chip is stored.
  • the waste heat recovery program of the chip is executed by the processor, the waste heat recovery method of the chip of the aforementioned embodiment of the present disclosure is implemented.
  • the processor executes the waste heat recovery program of the chip stored thereon, so as to improve the recovery efficiency of the heat energy generated during the operation of the chip, and the waste heat recovery method has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.
  • FIG5 is a block diagram of a vehicle system according to an embodiment of the present disclosure.
  • the embodiment of the present disclosure also proposes a whole vehicle system 1000, including a memory 1001, a processor 1002, and a waste heat recovery program of the chip stored in the memory 1001 and executable on the processor 1002.
  • the processor 1002 executes the waste heat recovery program, the waste heat recovery method of the chip of the aforementioned embodiment of the present disclosure is implemented.
  • the processor executes the waste heat recovery program stored in the chip on the memory, which can improve the recovery efficiency of the heat energy generated during the operation of the chip, and the waste heat recovery method has strong versatility and feasibility, and can also achieve waste heat recovery in winter and cooling in summer.
  • FIG6 is a block diagram of a waste heat recovery device for a chip according to an embodiment of the present disclosure.
  • the waste heat recovery device 2000 of the chip includes an acquisition module 100 and a control module 200.
  • the chip is arranged inside the shell.
  • At least one heat pipe is arranged inside the shell.
  • a heat exchanger is arranged through the shell. One end of the heat exchanger is connected to the heat pipe, and the other end of the heat exchanger is connected to an external circulating water circuit.
  • a valve is arranged in the external circulating water circuit.
  • the acquisition module 100 is used to obtain the temperature of the heat pipe, the coolant temperature in the external circulating water circuit and the ambient temperature;
  • the control module 200 is used to control the valve to open when the ambient temperature meets the preset temperature and the temperature of the heat pipe is greater than the coolant temperature in the external circulating water circuit, so as to recover the waste heat of the chip through the heat exchanger and the coolant in the external circulating water circuit.
  • the ambient temperature meeting the preset temperature includes: the ambient temperature is less than or equal to a first preset temperature, or the ambient temperature is greater than or equal to a second preset temperature, wherein the first preset temperature is less than the second preset temperature.
  • the value range of the first preset temperature is [5°C, 10°C]
  • the value range of the second preset temperature is [30°C, 40°C].
  • a first heat pipe and a second heat pipe are disposed inside the housing, the first heat pipe is used to carry the chip, and the second heat pipe is disposed above the chip.
  • a groove is further provided on the first heat pipe, and the groove is used to place the chip.
  • a portion of the first heat pipe used for carrying the chip is provided with at least one opening.
  • heat insulation cotton is provided on the inner side of the shell.
  • the control module controls the heat exchanger and the coolant in the external circulation water circuit to recover the waste heat conducted to the heat pipe by the chip, which can improve the recovery efficiency of thermal energy.
  • the external circulation water circuit is easy to install and maintain, has strong versatility and feasibility, and can realize waste heat recovery in winter and cooling in summer.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

一种芯片的余热回收装置和方法、存储介质和整车系统，其中，芯片设置在壳体内部，壳体内部设置有至少一个导热管并贯穿设置有换热器，换热器的一端与导热管连接，换热器的另一端与设置有阀门的外部循环水路连接，余热回收方法包括：获取导热管的温度、外部循环水路中的冷却液温度和环境温度；在环境温度满足预设温度、且导热管的温度大于外部循环水路中的冷却液温度时，控制阀门开启，以通过换热器和外部循环水路中的冷却液回收芯片的余热。

Description

芯片的余热回收方法和装置、存储介质和整车系统 技术领域
本公开涉及余热回收技术领域，尤其涉及一种芯片的余热回收方法、一种计算机可读存储介质、一种整车系统和一种芯片的余热回收装置。
背景技术
车辆在工作中零器件常常会产生热量，而这些热量不及时进行回收利用则会直接散发掉，造成浪费，也会给环境造成影响。
相关技术中，全车系统或零部件内部芯片中余热回收的方式为热能通过温差发电转化为电能进行回收、热能直接通过循环水路进行回收和热能直接通过热泵进行回收。
其中，温差发电的效率在3％-10％，效率低，回收效果差，难以在实际项目车型量产中大规模使用；热能直接通过冷却回路或冷媒回路进行收集的过程中需要将冷却回路或冷媒回路预先布置到零部件内，且后期不易安装、维护及更换，同时也不利于在多车型上模块化、共通化，可行性差。
公开内容
本公开旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本公开的第一个目的在于提出一种芯片的余热回收方法，通过换热器和外部循环水路中的冷却液回收芯片传导到导热管中的余热，能够提高热能的回收效率，且外部循环水路易于安装和维护，通用性和可行性强，并可以实现冬季余热回收、夏季冷却降温。
本公开的第二个目的在于提出一种计算机可读存储介质。
本公开的第三个目的在于提出一种整车系统。
本公开的第四个目的在于提出一种芯片的余热回收装置。
为了达到上述目的，本公开第一方面实施例提出了一种芯片的余热回收方法，其中，所述芯片设置在壳体内部，所述壳体内部设置有至少一个导热管，所述壳体上贯穿设置有换热器，所述换热器的一端与所述导热管连接，所述换热器的另一端与外部循环水路连接，所述外部循环水路中设置有阀门，所述方法包括：获取所述导热管的温度、所述外部循环水路中的冷却液温度和环境温度；在所述环境温度满足预设温度、且所述导热管的温度大于所述外部循环水路中的冷却液温度时，控制所述阀门开启，以通过所述换热器和所述外部循环水路中的冷却液回收所述芯片的余热。
根据本公开实施例提出的芯片的余热回收方法，通过换热器和外部循环水路中的冷却液回收芯片传导到导热管中的余热，能够提高热能的回收效率，且外部循环水路易于安装和维护，通用性和可行性强，并可以实现冬季余热回收、夏季冷却降温。
另外，根据本公开上述实施例的芯片的余热回收方法还可以具有如下的附加技术特征：
根据本公开的一个实施例，所述环境温度满足预设温度，包括：所述环境温度小于或等于第一预设温度，或者所述环境温度大于或等于第二预设温度，所述第一预设温度小于所述第二预设温度。
根据本公开的一个实施例，所述第一预设温度的取值范围为[5℃，10℃]，所述第二预设温度的取值范围为[30℃，40℃]。
根据本公开的一个实施例，所述壳体内部设置有第一导热管和第二导热管，所述第一导热管用于承载所述芯片，所述第二导热管设置在所述芯片的上方。
根据本公开的一个实施例，所述第一导热管上还设置有凹槽，所述凹槽用于放置所述芯片。
根据本公开的一个实施例，所述第一导热管中用于承载所述芯片的部分设置有至少一个开孔。
根据本公开的一个实施例，所述壳体内侧设置有隔热棉。
为了达到上述目的，本公开第二方面实施例提出了一种计算机可读存储介质，其上存储有芯片的余热回收程序，所述芯片的余热回收程序被处理器执行时实现上述的芯片的余热回收方法。
根据本公开上述实施例的计算机可读存储介质，能够提高芯片工作中所产生的热能的回收效率，且通用性和可行性较强，同时可以实现冬季余热回收、夏季冷却降温。
为了达到上述目的，本公开第三方面实施例提出了一种整车系统，该整车系统包括存储器、处理器及存储在存储器上并可在处理器上运行的芯片的余热回收程序，所述处理器执行所述余热回收程序时，实现上述的芯片的余热回收方法。
根据本公开实施例提出的整车系统，能够提高芯片工作中所产生的热能的回收效率，且该余热回收方式的通用性和可行性较强，同时可以实现冬季余热回收、夏季冷却降温。
为了达到上述目的，本公开第四方面实施例提出了一种芯片的余热回收装置，所述芯片设置在壳体内部，所述壳体内部设置有至少一个导热管，所述壳体上贯穿设置有换热器，所述换热器的一端与所述导热管连接，所述换热器的另一端与外部循环水路连接，所述外部循环水路中设置有阀门，所述装置包括：获取模块，用于获取所述导热管的温度、所述外部循环水路中的冷却液温度和环境温度；控制模块，用于在所述环境温度满足预设温度、且所述导热管的温度大于所述外部循环水路中的冷却液温度时，控制所述阀门开启，以通过所述换热器和所述外部循环水路中的冷却液回收所述芯片的余热。
根据本公开实施例提出的芯片的余热回收装置，通过控制模块控制换热器和外部循环水路中的冷却液回收芯片传导到导热管中的余热，能够提高热能的回收效率，且外部循环水路易于安装和维护，通用性和可行性强，并可以实现冬季余热回收、夏季冷却降温。
本公开附加的方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开的实践了解到。
附图说明
图1是根据本公开实施例中含芯片的零部件结构示意图；
图2是根据本公开实施例中芯片的余热回收方法的流程示意图；
图3是根据本公开一个具体实施例中车灯的零部件结构示意图；
图4是根据本公开一个具体实施例中芯片的余热回收方法的流程示意图；
图5是根据本公开实施例中整车系统的方框示意图；
图6是根据本公开实施例中芯片的余热回收装置的方框示意图。
具体实施方式
下面详细描述本公开的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本公开，而不能理解为对本公开的限制。
下面参考附图描述本公开实施例的芯片的余热回收方法、计算机可读存储介质、整车系统和芯片的余热回收装置。
图1是根据本公开实施例中含芯片的零部件示意图。
具体地，在本公开的一些实施例中，芯片13设置在壳体10内部，壳体10内部设置有至少一个导热管，壳体10上贯穿设置有换热器15，换热器15的一端与导热管连接，换热器15的另一端与外部循环水路连接，外部循环水路中设置有阀门20，外部循环水路在有冷却液通过的时候，可以通过换热器15将导热管上的热量经过冷却液导出。
图2是根据本公开实施例中芯片的余热回收方法的流程示意图。
具体地，在本公开的一些实施例中，如图2所示，芯片的余热回收方法包括以下步骤：
S101，获取导热管的温度、外部循环水路中的冷却液温度和环境温度。
具体地，在该实施例中，可以在换热器上设置温度传感器以获取导热管的温度，在外部循环水路中设置温度传感器，以获取外部循环水路的冷却液温度，在壳体外面设置温度传感器以获取环境温度，当然，还可以通过检测外部循环水路中管道的温度，然后通过管道的温度推算出冷却液的温度，还可以通过获取气象局发布的天气温度信息以确定环境信息，此外，本公开可以不对获取导热管的温度、外部循环水路中的冷却液温度和环境温度的方式进行具体限定。
S102，在环境温度满足预设温度、且导热管的温度大于外部循环水路中的冷却液温度时，控制阀门开启，以通过换热器和外部循环水路中的冷却液回收芯片的余热。
具体地，在该实施例中，环境温度小于或等于第一预设温度，或者环境温度大于或等于第二预设温度，第一预设温度小于第二预设温度，且导热管的温度大于外部循环水路中的冷却液温度时，控制阀门开启，以通过换热器和外部循环水路中的冷却液回收芯片的余热。另外，在环境温度大于第一预设温度，且环境温度小于第二预设温度时，芯片工作在合适的温度范围内，既不需要散热以防止零部件烧蚀，也没有额外的热量需要吸收，所以在该温度范围内，不需要控制阀门开启。
需要说明的是，第一预设温度的取值范围为[5℃，10℃]，第二预设温度的取值范围为[30℃，40℃]。其中，第一预设温度的取值可以优选为7℃，第二预设温度的取值可以优选为35℃。即当环境温度小于或等于7℃时，由于环境温度较低，所以可以将芯片工作所产生的热能回收到车辆中其他地方使用，因此需要打开阀门；而当环境温度大于或等于35℃时，由于环境温度较高，所以需要降低芯片工作环境的温度，以防止零部件烧蚀，所以也需要打开阀门。此外，本公开可以不对第一预设温度和第二预设温度的取值进行具体限定。
进一步地，在本公开的一些实施例中，壳体内部设置有第一导热管和第二导热管，第一导热管用于承载芯片，第二导热管设置在芯片的上方。
具体地，在该实施例中，如图1所示，壳体10内部设置有第一导热管11和第二导热管12，第一导热管11上还设置有凹槽(图中未示出)，凹槽可以用于放置芯片13。第一导热管11中用于承载芯片13的部分设置有至少一个开孔，进而可以增加换热效率，降低接触热阻。此外，还可以通过在第一导热管11和第二导热管12的热源侧涂抹导热胶以增加换热效率。第二导热管12设置在芯片13的上方，芯片13在工作过程中所产生的热量可以对其上方的空气进行加热，进而产生热流，因此将第二导热管12设置在芯片13上方，可以提高余热回收率，当然，在一些示例中，也可以将第二导热管12设置为环状，以包围芯片13的形状进行设计。也就是说，第一导热管11和第二导热管12还可以进行异形等非标准设计，即针对散热的器件对第一导热管11和第二导热管12进行定制化的处理。
需要说明的是，如图1所示，第一导热管11上还放置有PCB(Printed Circuit Board，印制电路板)板14，PCB板14的底面与第一导热管的热源侧接触，进而在芯片13温度升高时，PCB板14或芯片13的热量会通过第一导热管11传递到换热器15上，控制阀门20开启，冷却液通过外部循环水路的进水管16进入换热器15中，冷却液将换热器15的热量吸收后，再通过外部循环水路的出水管17流出， 进而将热量收集到整车的制热回路中，以对收集的热量加以利用，例如，座椅背部的加热和车体内部环境温度的加热等。此外，本公开可以不对收集的热量的用途进行具体限定，具体可以根据用户的实时需求进行限定。需要说明的是，换热器15上还设置有用于检测换热器15温度的温度传感器18，以及用于承载壳体10的底座19。
进一步地，在本公开的一些实施例中，壳体内侧设置有隔热棉。
具体地，在该实施例中，通过在壳体内侧设置隔热棉，可以防止热量的流失，便于对热量最大限度进行采集。另外，壳体内侧还可以设置泡沫材料和纤维材料等隔热材料。此外，本公开可以不对壳体内设置的隔热材料的选型进行具体限定。当然，在一些示例中，壳体10也可以设置为导热管，以参与芯片余热的回收。
以车辆的车灯为例进行说明，如图3所示，当芯片的余热回收方法应用在车灯上时，车灯芯片25工作时温度升高，车灯PCB板24和/或车灯芯片25产生的热量会通过车灯PCB导热管26传递到车灯换热器32上，热辐射以及热气流上升加热上方零部件，如反射镜23、灯罩29、饰圈30和透镜31等，车灯芯片25上方且与反射镜23贴合设置的反射镜导热管22会将反射镜23等零部件的热量传递到车灯换热器32上，进而可以防止零部件烧蚀和失效。
车灯温度传感器36可以优先获取车灯PCB导热管26的温度，即车灯PCB导热管26的优先级大于反射镜导热管22的优先级。此外，本公开可以不对车灯PCB导热管26和反射镜导热管22的优先级进行具体限定。当环境温度小于或等于第一预设温度或者环境温度大于或等于第二预设温度，且车灯温度传感器36获取到车灯PCB导热管26的温度大于外部循环水路中冷却液的温度时，控制车灯阀门34开启，冷却液通过外部循环水路的车灯进水管33进入到车灯换热器32中，冷却液将车灯换热器32的热量吸收后，再通过外部循环水路的出水管37流出，进而将热量收集到整车制热回路中，对收集的热量加以利用，例如，座椅背部的加热和车体内部环境温度的加热等，从而降低整车能耗。车灯中还包括有支架27、车灯第一壳体21和车灯第二壳体28，其中，支架27用于支撑车灯PCB导热管26，以对车灯PCB导热管26进行固定，车灯第一壳体21和车灯第二壳体28配合设置可以对车灯的内部器件进行保护，同时，车灯第一壳体21和车灯第二壳体28的内侧还可以设置隔热棉，从而可以防止热量的流失，便于对车灯所产生热量进行最大限度的采集。
需要说明的是，本公开的芯片的余热回收方法不仅可以应用在车灯，还可以应用在发动机和刹车片等地方，只要是车辆上发热的位置即可以采用该方法对热量进行回收，本公开可以不对芯片的余热回收方法的应用场景进行具体限定。
下面结合附图4与本公开的具体实施例，对芯片的余热回收方法具体流程步骤进行说明，如图4所示，执行如下步骤：
S1，启动回收芯片余热。
S2，默认关闭换热器水路，即默认关闭阀门，以使换热器不与外部循环水路连通换热。
S3，获取导热管的温度、外部循环水路中的冷却液温度和环境温度。
S4，环境温度小于或等于第一预设温度或者环境温度大于或等于第二预设温度，且导热管的温度大于外部循环水路中的冷却液温度时，控制外部循环水路中的阀门开启，其中，第一预设温度小于第二预设温度。
S5，开启换热器水路，实现外部循环水路与换热器的连通换热。
综上，根据本公开实施例提出的芯片的余热回收方法，通过换热器和外部循环水路中的冷却液回收芯片传导到导热管中的余热，能够提高热能的回收效率，且该余热回收方式的通用性和可行性强，并可以实现冬季余热回收、夏季冷却降温。
基于前述本公开实施例的芯片的余热回收方法，本公开实施例还提出了一种计算机可读存储介质，其上存储有芯片的余热回收程序，芯片的余热回收程序被处理器执行时实现上述本公开实施例的芯片的余热回收方法。
综上，根据本公开上述实施例的计算机可读存储介质，通过处理器执行其上存储有的芯片的余热回收程序，能够提高芯片工作中所产生的热能的回收效率，且该余热回收方式的通用性和可行性强，同时可以实现冬季余热回收、夏季冷却降温。
图5是根据本公开实施例中整车系统的方框示意图。
进一步地，如图5所示，基于前述本公开实施例的芯片的余热回收方法，本公开实施例还提出了一种整车系统1000，包括存储器1001、处理器1002及存储在存储器1001上并可在处理器1002上运行的芯片的余热回收程序，处理器1002执行余热回收程序时，实现上述本公开实施例的芯片的余热回收方法。
综上，根据本公开实施例的整车系统，通过处理器执行存储在存储器上芯片的余热回收程序，能够提高芯片工作中所产生的热能的回收效率，且该余热回收方式的通用性和可行性较强，同时可以实现冬季余热回收、夏季冷却降温。
图6是根据本公开是实施例中芯片的余热回收装置的方框示意图。
如图6所示，芯片的余热回收装置2000包括获取模块100和控制模块200，芯片设置在壳体内部，壳体内部设置有至少一个导热管，壳体上贯穿设置有换热器，换热器的一端与导热管连接，换热器的另一端与外部循环水路连接，外部循环水路中设置有阀门。
其中，获取模块100用于获取导热管的温度、外部循环水路中的冷却液温度和环境温度；控制模块200用于在环境温度满足预设温度、且导热管的温度大于外部循环水路中的冷却液温度时，控制阀门开启，以通过换热器和外部循环水路中的冷却液回收芯片的余热。
在本公开的一些实施例中，环境温度满足预设温度包括：环境温度小于或等于第一预设温度，或者环境温度大于或等于第二预设温度，其中，第一预设温度小于第二预设温度。
在本公开的一些实施例中，第一预设温度的取值范围为[5℃，10℃]，第二预设温度的取值范围为[30℃，40℃]。
在本公开的一些实施例中，壳体内部设置有第一导热管和第二导热管，第一导热管用于承载芯片，第二导热管设置在芯片的上方。
在本公开的一些实施例中，第一导热管上还设置有凹槽，凹槽用于放置芯片。
在本公开的一些实施例中，第一导热管中用于承载芯片的部分设置有至少一个开孔。
在本公开的一些实施例中，壳体内侧设置有隔热棉。
需要说明的是，本公开实施例提出的芯片的余热回收装置的其它具体实施方式，可以参见前述本公开实施例的芯片的余热回收方法的具体实施方式，为减少冗余，在此不再赘述。
综上，根据本公开实施例提出的芯片的余热回收装置，通过控制模块控制换热器和外部循环水路中的冷却液回收芯片传导到导热管中的余热，能够提高热能的回收效率，且外部循环水路易于安装和维护，通用性和可行性强，并可以实现冬季余热回收、夏季冷却降温。

Claims (10)

  1. 一种芯片的余热回收方法，其中，所述芯片设置在壳体内部，所述壳体内部设置有至少一个导热管，所述壳体上贯穿设置有换热器，所述换热器的一端与所述导热管连接，所述换热器的另一端与外部循环水路连接，所述外部循环水路中设置有阀门，所述方法包括：
    获取所述导热管的温度、所述外部循环水路中的冷却液温度和环境温度；
    在所述环境温度满足预设温度、且所述导热管的温度大于所述外部循环水路中的冷却液温度时，控制所述阀门开启，以通过所述换热器和所述外部循环水路中的冷却液回收所述芯片的余热。
  2. 根据权利要求1所述的余热回收方法，其中，所述环境温度满足预设温度，包括：
    所述环境温度小于或等于第一预设温度，或者所述环境温度大于或等于第二预设温度，其中，所述第一预设温度小于所述第二预设温度。
  3. 根据权利要求2所述的余热回收方法，其中，所述第一预设温度的取值范围为[5℃，10℃]，所述第二预设温度的取值范围为[30℃，40℃]。
  4. 根据权利要求1-3中任一项所述的余热回收方法，其中，所述壳体内部设置有第一导热管和第二导热管，所述第一导热管用于承载所述芯片，所述第二导热管设置在所述芯片的上方。
  5. 根据权利要求4所述的余热回收方法，其中，所述第一导热管上还设置有凹槽，所述凹槽用于放置所述芯片。
  6. 根据权利要求4或5所述的余热回收方法，其中，所述第一导热管中用于承载所述芯片的部分设置有至少一个开孔。
  7. 根据权利要求1-6中任一项所述的余热回收方法，其中，所述壳体内侧设置有隔热棉。
  8. 一种计算机可读存储介质，其上存储有芯片的余热回收程序，所述芯片的余热回收程序被处理器执行时实现根据权利要求1-7中任一项所述的芯片的余热回收方法。
  9. 一种整车系统，包括存储器、处理器及存储在存储器上并可在处理器上运行的芯片的余热回收程序，所述处理器执行所述余热回收程序时，实现根据权利要求1-7中任一项所述的芯片的余热回收方法。
  10. 一种芯片的余热回收装置，其中，所述芯片设置在壳体内部，所述壳体内部设置有至少一个导热管，所述壳体上贯穿设置有换热器，所述换热器的一端与所述导热管连接，所述换热器的另一端与外部循环水路连接，所述外部循环水路中设置有阀门，所述装置包括：
    获取模块，用于获取所述导热管的温度、所述外部循环水路中的冷却液温度和环境温度；
    控制模块，用于在所述环境温度满足预设温度、且所述导热管的温度大于所述外部循环水路中的冷却液温度时，控制所述阀门开启，以通过所述换热器和所述外部循环水路中的冷却液回收所述芯片的余热。
PCT/CN2023/112547 2023-08-11 2023-08-11 芯片的余热回收方法和装置、存储介质和整车系统 Pending WO2025035264A1 (zh)

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CN111016570A (zh) * 2018-10-10 2020-04-17 深圳光启空间技术有限公司 一种车载温度平衡系统
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CN203323073U (zh) * 2013-07-26 2013-12-04 江海帆 Led液冷型散热器
CN106439517A (zh) * 2016-10-21 2017-02-22 中国科学院广州能源研究所 利用热泵将led灯具冷却并进行余热回收的综合节能系统
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