WO2025029948A3 - Multi-node server unit - Google Patents

Multi-node server unit Download PDF

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Publication number
WO2025029948A3
WO2025029948A3 PCT/US2024/040429 US2024040429W WO2025029948A3 WO 2025029948 A3 WO2025029948 A3 WO 2025029948A3 US 2024040429 W US2024040429 W US 2024040429W WO 2025029948 A3 WO2025029948 A3 WO 2025029948A3
Authority
WO
WIPO (PCT)
Prior art keywords
server unit
devices
node server
compute
node
Prior art date
Application number
PCT/US2024/040429
Other languages
French (fr)
Other versions
WO2025029948A2 (en
Inventor
Anand Kulkarni
Ethan Schmitz
Wilson V. Vu
Mark Shaw
Mark A. Shaw
Benito Joseph Rodriguez
Robert Jason Ii Lankston
Luke Gregory
Original Assignee
MTS IP Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MTS IP Holdings Ltd filed Critical MTS IP Holdings Ltd
Publication of WO2025029948A2 publication Critical patent/WO2025029948A2/en
Publication of WO2025029948A3 publication Critical patent/WO2025029948A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Stored Programmes (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A server unit having multiple compute nodes with reconfigurable connections to a plurality of I/O devices is described. The number of I/O devices assigned to each compute node can be reconfigured by a user with firmware and/or hardware. The server unit is adapted to accept oversized I/O devices for additional processing capability. The compute-node PCBs and I/O device PCBs can each be arrayed in two and three dimensions for cooling in an immersion-cooling system.
PCT/US2024/040429 2023-08-01 2024-07-31 Multi-node server unit WO2025029948A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US202363516996P 2023-08-01 2023-08-01
US63/516,996 2023-08-01
US202363578255P 2023-08-23 2023-08-23
US63/578,255 2023-08-23
US202363598825P 2023-11-14 2023-11-14
US63/598,825 2023-11-14

Publications (2)

Publication Number Publication Date
WO2025029948A2 WO2025029948A2 (en) 2025-02-06
WO2025029948A3 true WO2025029948A3 (en) 2025-03-20

Family

ID=94396016

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2024/040429 WO2025029948A2 (en) 2023-08-01 2024-07-31 Multi-node server unit

Country Status (1)

Country Link
WO (1) WO2025029948A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119917442B (en) * 2025-03-31 2025-07-15 苏州元脑智能科技有限公司 Server cabinet and server system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050267963A1 (en) * 2004-04-08 2005-12-01 Takashige Baba Method for managing I/O interface modules in a computer system
US20090207563A1 (en) * 2008-02-20 2009-08-20 Ryuta Niino Blade server and switch blade
US20170374768A1 (en) * 2016-06-28 2017-12-28 Dell Products, L.P. Sled mounted processing nodes for an information handling system
US20180317337A1 (en) * 2014-05-30 2018-11-01 Hewlett Packard Enterprise Development Lp Supporting input/output (i/o) connectivity for a printed circuit assembly (pca) in a hot aisle cabling or a cold aisle cabling arrangement
US20230025369A1 (en) * 2022-09-29 2023-01-26 Prabhakar Subrahmanyam Methods and apparatus for an autonomous stage-switching multi-stage cooling device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050267963A1 (en) * 2004-04-08 2005-12-01 Takashige Baba Method for managing I/O interface modules in a computer system
US20090207563A1 (en) * 2008-02-20 2009-08-20 Ryuta Niino Blade server and switch blade
US20180317337A1 (en) * 2014-05-30 2018-11-01 Hewlett Packard Enterprise Development Lp Supporting input/output (i/o) connectivity for a printed circuit assembly (pca) in a hot aisle cabling or a cold aisle cabling arrangement
US20170374768A1 (en) * 2016-06-28 2017-12-28 Dell Products, L.P. Sled mounted processing nodes for an information handling system
US20230025369A1 (en) * 2022-09-29 2023-01-26 Prabhakar Subrahmanyam Methods and apparatus for an autonomous stage-switching multi-stage cooling device

Also Published As

Publication number Publication date
WO2025029948A2 (en) 2025-02-06

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