WO2024222106A1 - 麦克风阵列的阵列面板以及声波成像仪 - Google Patents

麦克风阵列的阵列面板以及声波成像仪 Download PDF

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Publication number
WO2024222106A1
WO2024222106A1 PCT/CN2024/074561 CN2024074561W WO2024222106A1 WO 2024222106 A1 WO2024222106 A1 WO 2024222106A1 CN 2024074561 W CN2024074561 W CN 2024074561W WO 2024222106 A1 WO2024222106 A1 WO 2024222106A1
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Prior art keywords
sound wave
array
sound
panel body
microphone
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PCT/CN2024/074561
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English (en)
French (fr)
Inventor
李渊
余本旭
陈�峰
梁启晨
陈芬
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Hangzhou Microimage Software Co Ltd
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Hangzhou Microimage Software Co Ltd
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Publication of WO2024222106A1 publication Critical patent/WO2024222106A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/04—Circuit arrangements, e.g. for selective connection of amplifier inputs/outputs to loudspeakers, for loudspeaker detection, or for adaptation of settings to personal preferences or hearing impairments
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/027—Spatial or constructional arrangements of microphones, e.g. in dummy heads

Definitions

  • the present application relates to audio acquisition technology, and in particular to an array panel of a microphone array, and an acoustic imaging device (Acoustic Imaging Device) using the array panel.
  • An acoustic imaging device Acoustic Imaging Device
  • An electronic device may be equipped with a microphone array.
  • the sound waves generated by a sound source propagate to the electronic device, the sound waves within the pickup range of each microphone in the microphone array can be captured by the microphone, so as to realize the audio collection of the sound source by the electronic device.
  • another part of the sound waves outside the pickup range of each microphone will be reflected by the electronic device, and the echo formed by this part of the sound waves after reflection will interfere with the sound pickup of each microphone.
  • the difference in echo energy causes different interference intensities to occur to different microphones, thereby resulting in poor sound pickup consistency of the microphone array.
  • an embodiment of the present application provides an array panel of a microphone array, which helps to improve the sound pickup consistency of the microphone array.
  • the array panel of the microphone array may include a flat panel body;
  • the panel body is provided with a plurality of sound pickup holes, each of which is a through hole that penetrates the panel body, and each of the plurality of sound pickup holes corresponds to a deployment position of each microphone in the microphone array;
  • the outer surface of the panel body facing away from the microphone array has a plurality of sound wave diffusion structures that are staggered with the plurality of sound pickup holes, and each of the sound wave diffusion structures includes a blind hole or a convex hull.
  • the calibration size is 2c/( ⁇ f_obj), where c represents the propagation speed of sound waves in air, and f_obj represents the target frequency.
  • the concave-convex size threshold is 0.15 times the interface size.
  • the center distances between any two adjacent sound wave diffusion structures are within a pre-calibrated distance range, and the range boundary of the distance range is proportional to the target wavelength of the sound wave.
  • the distance range is [ ⁇ , 3 ⁇ ], where ⁇ represents the target wavelength.
  • side walls of the plurality of sound diffusion structures are perpendicular to the outer surface.
  • side walls of the plurality of sound diffusion structures are skewed relative to a direction perpendicular to the outer surface.
  • the center distances between any two adjacent sound wave diffusion structures are not all the same.
  • a distribution density of the plurality of sound wave diffusion structures in the panel body is smaller than a distribution density of the plurality of sound pickup holes in the panel body.
  • the openings of the plurality of sound pickup holes on the outer surface are open openings having a conical surface wall.
  • the panel body is made of a porous material.
  • the panel body of the array panel in addition to having multiple sound pickup holes corresponding to each microphone of the microphone array, can also be provided with multiple sound wave diffusion structures staggered with the multiple sound pickup holes on the outer surface facing away from the microphone array. Therefore, when the sound waves generated by the sound source propagate to the outer surface of the panel body of the array panel, a part of the sound waves passing through the sound pickup holes can be captured by the microphone, while the remaining sound waves outside the sound pickup holes can be attenuated by diffuse reflection at the sound wave diffusion structure.
  • the echo energy formed after the reflection will be weakened due to the energy attenuation caused by the diffuse reflection, so that the difference in echo energy that interferes with different microphones in the microphone array will also be reduced, which will not only help to reduce the audio collection noise caused by the echo interference of the sound waves, but also help to improve the pickup consistency of the microphone array.
  • an acoustic wave imager which may include a microphone array and the array panel of the aforementioned embodiment, wherein in a direction perpendicular to the panel body, the distances between each microphone in the microphone array and the corresponding sound pickup hole are equal, thereby improving the sound pickup consistency of the microphone array by the array panel, thereby improving the imaging quality of the acoustic wave imager.
  • FIG1 is a schematic diagram of an exemplary structure of an array panel of a microphone array in one embodiment of the present application
  • FIG2 is a schematic diagram of a sound wave reflection model
  • FIG3 is a schematic diagram of improved acoustic wave reflection based on the array panel shown in FIG1 ;
  • FIG4 is a schematic diagram of a first example structure of a sound wave diffusion structure in the array panel shown in FIG1 ;
  • FIG5 is a schematic diagram of a second example structure of the sound wave diffusion structure in the array panel shown in FIG1 ;
  • FIG6 is a schematic structural diagram of a third example of the sound wave diffusion structure in the array panel shown in FIG1 ;
  • FIG. 7 is a schematic diagram of an exemplary partial structure of an electronic device in another embodiment of the present application.
  • Fig. 1 is a schematic diagram of an exemplary structure of an array panel of a microphone array in an embodiment of the present application.
  • the array panel 10 of the microphone array includes a panel body 110, which is used to be stacked with the microphone array, and the panel body 110 may have an inner surface facing the microphone array stacked therewith, and an outer surface facing away from the microphone array (such as a surface facing a sound source).
  • the panel body 110 is preferably designed to be flat.
  • FIG1 takes the outer contour shape of the flat panel body 110 as an example, which is approximately a rectangle, it can be understood that the outer contour shape of the panel body 110 can be set to any shape that is compatible with the installation requirements of the electronic device to which the array panel 10 is applied.
  • the panel body 110 of the array panel 10 can be provided with a plurality of sound pickup holes 120, and each sound pickup hole 120 is a through hole that penetrates the array panel 10, that is, each sound pickup hole 120 has openings on the inner surface and the outer surface of the panel body 110, and the plurality of sound pickup holes 120 correspond one-to-one to the deployment positions of each microphone in the microphone array.
  • FIG. 1 takes the irregular distribution of multiple sound pickup holes 120 as an example for arrangement, that is, the multiple sound pickup holes 120 corresponding to each microphone of the microphone array are not arranged in a row-column arrangement, which means that the microphone array does not have to be arranged in a standard "array" of row-column alignment. That is, in the embodiment of the present application, it is not intended to make unnecessary restrictions on the "array" of microphones, but to indicate that the microphone array can have any array form.
  • the sound waves generated by the sound source propagate to the outer surface of the panel body 110 of the array panel 10
  • the sound waves passing through the sound pickup holes 120 can be captured by the microphones, and the sound pickup range of each microphone is limited by the sound pickup holes 120 corresponding to the microphone.
  • the remaining sound waves outside the sound pickup holes 120 corresponding to each microphone will be reflected on the outer surface of the panel body 110 to form echoes.
  • FIG2 is a schematic diagram of a sound wave reflection model.
  • Pi represents the incident sound wave generated by the sound source
  • Pt represents the transmitted sound wave that passes through the pickup hole 120 and is captured by the microphone
  • Pr represents the echo formed by reflection on the outer surface of the panel body 110
  • Ra represents the acoustic impedance of the sound wave propagation medium, such as air
  • Rb represents the acoustic impedance of the panel body 110.
  • Pi is usually a spherical wave. Since the panel body 110 is a flat plate in the embodiment of the present application, Pi can also be regarded as a plane wave when it reaches the outer surface of the panel body 110.
  • the sound wave reflection model shown in FIG2 is based on the condition that Pi is regarded as a plane wave. It can be seen from Figure 2 that since Rb>Ra, the outer surface of the panel body 110 serves as the dielectric boundary between the air and the panel body 110, and is a "hard” boundary where the acoustic impedance changes during the propagation of sound waves.
  • the particle velocity phase between Pr and Pi generated by the "hard” boundary reflection is 180° different, and the sound pressure phase between Pr and Pi generated by the "hard” boundary reflection is the same.
  • the Pr energy formed after reflection is stronger. In this case, the difference in echo energy that interferes with different microphones in the microphone array will also be maximized.
  • the panel body 110 of the array panel 10 may also be provided with a plurality of sound wave diffusion structures 130 that are staggered with the plurality of sound pickup holes 120 on the outer surface facing away from the microphone array, and each sound wave diffusion structure 130 may include a blind hole or a convex hull.
  • FIG3 is a schematic diagram of improved sound wave reflection based on the array panel shown in FIG1. Please refer to FIG1 and FIG3 at the same time.
  • Pi propagates to the outer surface (i.e., the "hard" boundary) of the panel body 110 of the array panel 10.
  • the outer surface i.e., the "hard" boundary
  • the sound wave diffusion structure 130 no matter what shape of the cavity of the sound wave diffusion structure 130, Pi located outside the sound pickup hole 120 (i.e., outside the sound pickup range of the microphone) can be diffusely reflected at the sound wave diffusion structure 130, and the echo Pr after diffuse reflection can be attenuated by mutual interference at the sound wave diffusion structure 130, that is, Pi located outside the sound pickup hole 120 (i.e., outside the sound pickup range of the microphone) can be attenuated by diffuse reflection at the sound wave diffusion structure 130.
  • the Pr energy formed after reflection will be weakened due to the energy attenuation caused by diffuse reflection, so that the difference in echo energy that interferes with different microphones in the microphone array will also be reduced as the energy of Pr is weakened, thereby helping to reduce the audio collection noise caused by the echo interference of the sound wave and improve the pickup consistency of the microphone array.
  • FIG4 is a schematic diagram of a first example structure of a sound wave diffusion structure in the array panel shown in FIG1.
  • a plurality of sound wave diffusion devices are arranged on the outer surface of the panel body 110 facing away from the microphone array.
  • the structures 130 may all be blind holes 131 , each of which has an opening on the outer surface of the panel body 110 and does not penetrate to the inner surface of the panel body 110 .
  • the opening of the blind hole 131 on the outer surface of the panel body 110 can be regarded as the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110, and the hole wall of the blind hole 131 can be regarded as the side wall of the sound wave diffusion structure 130.
  • the embodiments of the present application do not impose strict restrictions on the hole shape of the blind hole 131.
  • FIG. 4 shows that the blind hole 131 has a conical cavity
  • the opening of the blind hole 131 on the outer surface of the panel body 110 i.e., the junction of the sound wave diffusion structure 130 and the outer surface of the panel body 110
  • the hole wall of the blind hole 131 i.e., the side wall of the sound wave diffusion structure 130
  • the hole wall of the blind hole 131 i.e., the side wall of the sound wave diffusion structure 130
  • the blind hole 131 has an expansion shape from the bottom of the hole to the opening direction.
  • the cross-sectional shape of the opening of the blind hole 131 on the outer surface of the panel body 110 is triangular, rectangular or other polygonal
  • the blind hole 131 can have a pyramidal cavity.
  • the hole wall of the blind hole 131 may also have an arc surface such as a curved surface, a spherical surface, an ellipsoidal surface, a parabola, etc., and the arc surface wall may also be inclined relative to the direction perpendicular to the outer surface of the panel body 110 like the conical surface wall, so that the blind hole 131 has an expansion shape from the hole bottom to the opening direction.
  • an arc surface such as a curved surface, a spherical surface, an ellipsoidal surface, a parabola, etc.
  • the blind hole 131 may also have a spherical cap hole cavity.
  • the hole wall of the blind hole 131 (i.e., the side wall of the sound wave diffusion structure 130) can also be perpendicular to the outer surface of the panel body 110.
  • the opening of the blind hole 131 on the outer surface of the panel body 110 i.e., the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110
  • the blind hole 131 can have a prismatic cavity
  • the opening of the blind hole 131 on the outer surface of the panel body 110 i.e., the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110
  • the blind hole 131 can have a cylindrical cavity.
  • Fig. 5 is a schematic diagram of a second example structure of the sound wave diffusion structure in the array panel shown in Fig. 1.
  • the plurality of sound wave diffusion structures 130 arranged on the outer surface of the panel body 110 facing away from the microphone array may all be convex hulls 132, each convex hull 132 protrudes in a direction perpendicular to the panel body 110 (protrudes in a direction facing away from the microphone array) and has a bottom surface connected to the outer surface of the panel body 110.
  • the bottom surface of the convex hull 132 connected to the outer surface of the panel body 110 can be regarded as the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110, and the outer peripheral wall of the convex hull 132 can be regarded as the sound wave diffusion structure. 130 , and the embodiment of the present application does not impose a strict limitation on the contour shape of the convex hump 132 .
  • Figure 5 shows that the convex bulge 132 is in the shape of a spherical cap, that is, the bottom surface where the convex bulge 132 is connected to the outer surface of the panel body 110 (that is, the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110) is circular, and the outer peripheral wall of the convex bulge 132 (that is, the side wall of the sound wave diffusion structure 130) is curved.
  • the outer peripheral wall of the convex bulge 132 (that is, the side wall of the sound wave diffusion structure 130) can be deflected relative to the direction perpendicular to the outer surface of the panel body 110, so that the convex bulge 132 has a contracted shape in the direction from the bottom to the top.
  • the outer peripheral wall of the convex hull 132 may also be a conical surface, and the conical surface may also be inclined relative to the direction perpendicular to the outer surface of the panel body 110 like a curved surface (such as a curved surface, a spherical surface, an ellipsoidal surface, a parabola), and the convex hull 132 has a contraction shape in the direction from the bottom to the top.
  • the convex hull 132 may be in the shape of a cone, and if the bottom surface of the convex hull 132 on the outer surface of the panel body 110 (i.e., the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110) is in the shape of a triangle, a rectangle, or any other polygon, the convex hull 132 may be in the shape of a pyramid.
  • the outer peripheral wall of the convex 132 (i.e., the side wall of the sound wave diffusion structure 130) can be perpendicular to the outer surface of the panel body 110.
  • the convex 132 can be cylindrical.
  • the convex 132 on the outer surface of the panel body 110 i.e., the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110
  • the convex 132 can be prism-shaped.
  • Fig. 6 is a schematic diagram of a third example structure of the sound wave diffusion structure in the array panel shown in Fig. 1.
  • a part may be the blind holes 131 in the first example structure shown in Fig. 4, and another part may be the convex hull 132 in the second example structure shown in Fig. 5.
  • the sidewall of the sound wave diffusion structure 130 may be perpendicular to the outer surface, or may be inclined relative to the direction perpendicular to the outer surface of the panel body 110 .
  • the sound waves that undergo echo Pr energy attenuation due to diffuse reflection at the sound wave diffusion structure 130 include sound waves within a specific frequency range, and the frequency range is related to the size of the sound wave diffusion structure 130 .
  • the opening of the blind hole 131 on the outer surface of the panel body 110 can be regarded as the interface between the sound wave diffusion structure 130 and the outer surface of the panel body 110. Therefore, the blind hole 131 is located on the outer surface of the panel body 110.
  • the opening size of the outer surface can represent the interface size r0 between the sound wave diffusion structure 130 and the outer surface of the panel body 110. Schematically, when the opening is circular, r0 is the diameter of the circle; when the opening is square, r0 is the side length of the square, and the interface size r0 is associated with the sound wave frequency f.
  • the association relationship can be expressed as the following expression (1), where c represents the propagation speed of sound waves in the air, and k is a constant greater than 0.
  • the interface dimension r0 between the sound wave diffusion structure 130 and the outer surface of the panel body 110 can be determined according to the sound wave frequency range in which echo attenuation is expected to be implemented, that is, the interface dimension r0 between the sound wave diffusion structure 130 and the outer surface of the panel body 110 can be designed to be greater than or equal to a calibration dimension that is inversely proportional to the target frequency f_obj of the sound wave, wherein the target frequency f_obj can be the center frequency or boundary frequency of the sound wave frequency range in which echo attenuation is expected to be implemented, and the calibration dimension can be expressed as k ⁇ [c/(2 ⁇ f_obj)] in the following expression (2) obtained by transforming expression (1). r0 ⁇ k ⁇ [c/(2 ⁇ f_obj)] Expression (2)
  • the value of k in expressions (1) and (2) may be the preferred value "4" measured experimentally, that is, the above-mentioned calibration dimension may be expressed as 2c/( ⁇ f_obj) when k is 4.
  • the hole depth of the blind hole 131 can represent the concave-convex dimension h0 of the acoustic wave diffusion structure 130 in the direction perpendicular to the outer surface of the panel body 110, and, when the interface dimension r0 between the acoustic wave diffusion structure 130 and the outer surface of the panel body 110 is determined, the concave-convex dimension h0 of the acoustic wave diffusion structure 130 can be designed to be greater than or equal to a concave-convex dimension threshold, which is proportional to the interface dimension r0 of the acoustic wave diffusion structure 130.
  • the proportionality coefficient q between the concave-convex dimension threshold and the interface dimension r0 of the acoustic wave diffusion structure 130 can be less than 1. That is, there is a size constraint between the concave-convex dimension h0 of the acoustic wave diffusion structure 130 and the interface dimension r0 as shown in Expression (3). h0/r0 ⁇ q Expression (3)
  • the above expression (3) means that the ratio of the convex-concave size h0 to the interface size r0 is greater than the proportional coefficient q, and, based on expression (3), q ⁇ r0 can be regarded as the convex-concave size threshold that is proportional to the interface size r0 of the sound wave diffusion structure 130.
  • the value of the proportionality coefficient q in expression (3) can be the preferred value "0.15" measured by experiment, that is, the above expression (3) can be transformed into the following expression (4) when the preferred value of q is substituted. h0/r0 ⁇ 0.15 Expression (4)
  • the above expression (4) means that the ratio of the convex-concave size h0 to the interface size r0 is greater than 0.15, and, based on expression (4), the convex-concave size threshold proportional to the interface size r0 of the sound wave diffusion structure 130 can be specifically set to 0.15 times the interface size r0 and expressed as 0.15 ⁇ r0.
  • the concave-convex size h0 of the sound diffusion structure 130 is associated with the target frequency f_obj through the size constraint between the concave-convex size h0 and the interface size r0.
  • the concave-convex size h0 of the sound wave diffusion structure 130 is set to 0.6 mm and the interface size r0 is set to 4.0 mm, then the sound waves in the frequency range of 17 kHz to 40 kHz can all undergo diffuse reflection at the sound wave diffusion structure 130 and cause echo Pr energy attenuation.
  • the bottom surface size of the convex hump 132 connecting the outer surface of the panel body 110 represents the interface size r0 between the sound wave diffusion structure 130 and the outer surface of the panel body 110
  • the protrusion height of the convex hump 132 represents the concave-convex size h0 of the sound wave diffusion structure 130 in the direction perpendicular to the outer surface of the panel body 110.
  • the main function of the sound wave diffusion structure 130 is to reduce the flatness of the outer surface (i.e., the "hard” boundary) of the panel body 110, because reducing the flatness of the outer surface (i.e., the "hard” boundary) of the panel body 110 can weaken the echo Pr energy of the incident sound wave Pi outside the pickup hole 120 (i.e., outside the pickup range of the microphone), and it should not be understood that the sound wave diffusion structure 130 and the pickup hole 120 must be one-to-one corresponding.
  • the distribution density of multiple sound wave diffusion structures 130 in the panel body 110 is lower than the distribution density of multiple pickup holes 120 in the panel body 110, that is, to express that there is not necessarily a one-to-one correspondence between the sound wave diffusion structure 130 and the pickup hole 120.
  • the center distance g between adjacent sound wave diffusion structures 130 can be controlled (g1 and g2 as shown in Figures 4-6), that is, in the embodiment of the present application, the center distance g between every two adjacent sound wave diffusion structures 130 is within a pre-calibrated distance range, and the range boundary of the distance range is proportional to the target wavelength ⁇ of the sound wave, as shown in expression (5).
  • m ⁇ and n ⁇ are the range boundaries of the distance range, m is greater than 0, n is greater than m, and according to the relationship between the wavelength and frequency of the sound wave, ⁇ in expression (5) is c/f_obj.
  • m can be 1 and n can be 3.
  • the distance range [m ⁇ , n ⁇ ] shown in expression (5) can be [ ⁇ , 3 ⁇ ].
  • the target frequency is 34kHz
  • any two adjacent sound waves The center distance g between the diffusion structures 130 may be set within the range of [1 cm, 3 cm].
  • the plurality of sound pickup holes 120 may be irregularly distributed.
  • the plurality of sound wave diffusion structures 130 may also be irregularly distributed under the condition of satisfying the distance range shown in expression (5), that is, the center distances between adjacent sound wave diffusion structures 130 may be allowed to be set to be unequal.
  • the center distance between a pair of sound wave diffusion structures 130 is g1
  • the center distance between another pair of sound wave diffusion structures 130 is g2
  • the center distances between adjacent sound wave diffusion structures 130 may not be completely the same.
  • the material of the panel body 110 can be selected from high molecular polymers such as PC (Polycarbonate). If so, please refer back to Figure 2.
  • PC Polycarbonate
  • the hardness of the "hard" boundary formed on the outer surface of the panel body 110 will be higher, so that the echo Pr can more easily obtain a larger initial energy.
  • the material of the panel body 110 may also be a porous material such as PET (Polyethylene terephthalate), so that the incident sound wave Pi is partially absorbed on the outer surface of the panel body 110, thereby helping to reduce the initial energy of the echo Pr. Furthermore, combined with the energy attenuation of the echo Pr energy through diffuse reflection at the sound wave diffusion structure 130, the echo energy difference that interferes with different microphones in the microphone array can be further reduced, so as to further reduce the audio collection noise caused by the echo interference of the sound wave, and further improve the pickup consistency of the microphone array.
  • PET Polyethylene terephthalate
  • the signal-to-noise ratio of audio collection can also be improved by increasing the energy of the incident sound wave Pi captured by the microphone.
  • the opening of the sound pickup hole 120 on the outer surface of the panel body 110 may be an opening 125 having a conical surface wall, and the opening 125 is used to guide more incident sound waves Pi to converge into the sound pickup hole 120, so that more incident sound waves Pi can be transmitted to the corresponding microphone through the sound pickup hole 120.
  • the conical surface wall of the opening 125 may have an inclination angle of 30° to 35° compared to the sound transmission direction perpendicular to the panel body 110, and preferably, the inclination angle may be 33°.
  • FIG7 is a schematic diagram of an exemplary partial structure of an electronic device in another embodiment of the present application.
  • an electronic device such as an acoustic wave imager may include a microphone array 30 and the array panel 10 in the aforementioned embodiment.
  • FIG7 only takes the acoustic wave diffusion structure 130 as an example of a blind hole 131 with a conical cavity. It can be understood that when the array panel 10 is applied to an electronic device, its acoustic wave diffusion structure 130 may use any of the structures mentioned above; moreover, FIG7 only shows the microphone array 30.
  • the simplified expression of a microphone 300 and a corresponding sound pickup hole 120 can generally represent the structure and position relationship of each microphone 300 and the corresponding sound pickup hole 120.
  • the distance between each microphone 300 in the microphone array 30 and the corresponding sound pickup hole 120 is equal in the direction perpendicular to the panel body 110 .
  • the microphone array 30 may include an array substrate 310 such as a PCB (Printed Circuit Board), and the microphones 300 may be arranged on the substrate surface of the array substrate 310 facing away from the panel body 110, and the array substrate 310 may be provided with a substrate through hole 320 at the deployment position of each microphone 300, so that when the array substrate 310 is stacked in parallel with the flat panel body 110, each microphone 300 may have a sound transmission channel passing through the corresponding sound pickup hole 120 and the substrate through hole 320, and the parallel stacking between the array substrate 310 and the flat panel body 110 can make the length distance of each microphone 300 the same as the distance between the corresponding sound pickup holes 120.
  • an array substrate 310 such as a PCB (Printed Circuit Board)
  • the microphones 300 may be arranged on the substrate surface of the array substrate 310 facing away from the panel body 110, and the array substrate 310 may be provided with a substrate through hole 320 at the deployment position of each microphone 300, so that when the array substrate 310 is stacked in parallel with the flat panel body 110,
  • the electronic device may also include a shock-absorbing medium 20 (such as foam or silicone) stacked and extruded between the array substrate 310 and the flat panel body 110.
  • the shock-absorbing medium 20 is used to absorb external impacts on the panel body 110 to protect the microphone array 30.
  • the shock-absorbing medium 20 may be provided with a medium through hole 220 that avoids the sound pickup hole 120 and the substrate through hole 320, that is, the sound transmission channel of each microphone 300 passes through the sound pickup hole 120, the medium through hole 220 and the substrate through hole 320 in sequence.
  • the electronic device in the embodiment of the present application may also include at least one of processors such as a CPU (central processing unit), an MCU (Microcontroller Unit), and an FPGA (Field-Programmable Gate Array) for acquiring and processing the audio signal generated by the microphone 300 based on the captured transmitted sound wave Pt.
  • processors such as a CPU (central processing unit), an MCU (Microcontroller Unit), and an FPGA (Field-Programmable Gate Array) for acquiring and processing the audio signal generated by the microphone 300 based on the captured transmitted sound wave Pt.
  • the microphone array may also coexist in an electronic device with modules having other functions, such as an optical imaging module having an optical lens or an audio playback module having a speaker. Therefore, in order to avoid interference with modules having other functions, the panel body 110 may also be provided with a panel avoidance hole 150 (as shown in FIG. 1 ) in an area (such as a central area) for deploying modules having other functions, to avoid the collection elements of the module (such as an optical lens or a speaker). Accordingly, avoidance holes may also be provided in the array substrate 310 and the cushioning medium 20.
  • the electronic device shown in FIG. 7 may be an acoustic wave imager.
  • the acoustic wave imager may be based on a microphone array measurement technology, by measuring the phase of the signal reaching each microphone by the sound wave in a certain space.
  • the sound source position is determined based on the phased array principle, the amplitude of the sound source is measured, and the distribution of the sound source in space is displayed in the form of an image.
  • the processor of the acoustic wave imager can be configured as follows:
  • a sound wave image is generated, wherein the pixel value of each pixel in the sound wave image is used to characterize the sound wave amplitude distribution in the array area of the microphone array, and the pixel value of each pixel in the sound wave image decreases in a gradient with the sound source position as the center.
  • the array panel 10 in the aforementioned embodiment can reduce the audio collection noise caused by the echo interference of the sound waves and improve the pickup consistency of the microphone array at the same time, the signal quality of the audio signal acquired by the acoustic wave imager including the array panel 10 can be improved, thereby improving the accuracy of the sound source position and the sound wave amplitude determined based on the signal phase difference, and further, the image quality of the acoustic wave image can be improved.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

本申请提供了一种麦克风阵列的阵列面板以及声波成像仪。该麦克风阵列的阵列面板包括平板状的面板主体；所述面板主体开设有多个拾音孔，所述多个拾音孔均为贯穿所述面板主体的通孔，所述多个拾音孔与所述麦克风阵列中的各麦克风的部署位置一一对应；所述面板主体背向所述麦克风阵列的外表面具有与所述多个拾音孔错位分布的多个声波扩散结构，每个所述声波扩散结构包括盲孔或凸包。

Description

麦克风阵列的阵列面板以及声波成像仪 技术领域
本申请涉及音频采集技术，特别涉及一种麦克风阵列的阵列面板、以及应用该阵列面板的一种声波成像仪(Acoustic Imaging Device)。
背景技术
电子设备可以配备有麦克风阵列，当声源产生的声波传播至电子设备时，处于麦克风阵列中的每个麦克风的拾音范围内的声波可以被该麦克风捕获到，用于实现电子设备对声源的音频采集。与此同时，处于各麦克风的拾音范围之外的另一部分声波会被电子设备反射，这部分声波反射后形成的回波会对各麦克风的拾音形成干扰。
通常情况下，对麦克风阵列中的不同麦克风形成干扰的回波能量存在差异，回波能量的差异导致不同麦克风受到的干扰强度不同，从而导致麦克风阵列的拾音一致性不佳。
因此，如何提升麦克风阵列的拾音一致性，成为现有技术中有待解决的技术问题。
发明内容
有鉴于此，本申请的实施例提供了一种麦克风阵列的阵列面板，有助于提升麦克风阵列的拾音一致性，该麦克风阵列的阵列面板可以包括平板状的面板主体；
所述面板主体开设有多个拾音孔，所述多个拾音孔均为贯穿所述面板主体的通孔，所述多个拾音孔与所述麦克风阵列中的各麦克风的部署位置一一对应；
所述面板主体背向所述麦克风阵列的外表面具有与所述多个拾音孔错位分布的多个声波扩散结构，每个所述声波扩散结构包括盲孔或凸包。
在一些示例中，可选地，每个所述声波扩散结构与所述外表面的交界面尺寸大于或等于标定尺寸，所述标定尺寸与声波的目标频率成反比；每个所述声波扩散结构在垂直于所述外表面的方向上的凹凸尺寸大于或等于凹凸尺寸阈值，所述凹凸尺寸阈值与所述交界面尺寸成正比。
在一些示例中，可选地，所述标定尺寸为2c/(π×f_obj)，其中，c表示声波在空气中的传播速率，f_obj表示所述目标频率。
在一些示例中，可选地，所述凹凸尺寸阈值为所述交界面尺寸的0.15倍。
在一些示例中，可选地，任意两两相邻的声波扩散结构之间的中心距离均在预先标定的距离范围内，所述距离范围的范围边界与声波的目标波长成正比。
在一些示例中，可选地，所述距离范围为[λ，3λ]，λ表示所述目标波长。
在一些示例中，可选地，所述多个声波扩散结构的侧壁垂直于所述外表面。
在一些示例中，可选地，所述多个声波扩散结构的侧壁相对于垂直于所述外表面的方向偏斜。
在一些示例中，可选地，两两相邻的声波扩散结构之间的中心距离不全相同。
在一些示例中，可选地，所述多个声波扩散结构在所述面板主体的分布密度小于所述多个拾音孔在所述面板主体的分布密度。
在一些示例中，可选地，所述多个拾音孔在所述外表面的开口为具有锥面孔壁的敞口。
在一些示例中，可选地，所述面板主体的材质为多孔材质。
基于上述实施例，阵列面板的面板主体除了具有与麦克风阵列的各麦克风一一对应的多个拾音孔之外，还可以在背向麦克风阵列的外表面布置有与多个拾音孔错位分布的多个声波扩散结构，因此，当声源产生的声波传播至阵列面板的面板主体的外表面时，穿过拾音孔的一部分声波可以被麦克风捕获到，而位于拾音孔外的剩余声波可以通过在声波扩散结构处的漫反射而发生能量衰减，因而反射后形成的回波能量会由于漫反射引发的能量衰减而被削弱，从而对麦克风阵列中的不同麦克风形成干扰的回波能量的差异也会随之减小，进而既有助于减少由于声波的回波干扰而引发的音频采集噪声，还有助于提升麦克风阵列的拾音一致性。
在本申请的另一个实施例中，提供了一种声波成像仪，该声波成像仪可以包括麦克风阵列、以及前述实施例中的阵列面板，其中，在垂直于所述面板主体的方向上，所述麦克风阵列中的各麦克风与对应的所述拾音孔之间的距离相等，从而，可以通过所述阵列面板对麦克风阵列的拾音一致性的提升，提升声波成像仪的成像质量。
附图说明
以下附图仅对本申请做示意性说明和解释，并不限定本申请的范围：
图1为本申请的一个实施例中的麦克风阵列的阵列面板的示例性结构示意图；
图2为一种声波反射模型的原理图；
图3为基于如图1所示的阵列面板改善后的声波反射原理图；
图4为如图1所示的阵列面板中的声波扩散结构的第一实例结构示意图；
图5为如图1所示的阵列面板中的声波扩散结构的第二实例结构示意图；
图6为如图1所示的阵列面板中的声波扩散结构的第三实例结构示意图；
图7为本申请的另一个实施例中的电子设备的示例性局部结构示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下参照附图并举实施例，对本申请作进一步详细说明。
图1为本申请的一个实施例中的麦克风阵列的阵列面板的示例性结构示意图。请参见图1，在本申请的实施例中，麦克风阵列的阵列面板10包括面板主体110，该面板主体110用于与麦克风阵列堆叠布置，该面板主体110可以具有面向与其堆叠的麦克风阵列的内表面、以及背向该麦克风阵列的外表面(如面对音源的表面)。
在本申请的实施例中，面板主体110优选地被设计为平板状，虽然图1中以平板状的该面板主体110的外轮廓形状呈近似的矩形为例，但可以理解的是，该面板主体110的外轮廓形状可以设置为与应用该阵列面板10的电子设备的安装需求相适配的任意形状。
从图1中可以看出，阵列面板10的面板主体110可以开设有多个拾音孔120，每个拾音孔120都为贯穿阵列面板10的通孔，即，每个拾音孔120在面板主体110的内表面和外表面均具有开口，并且，多个拾音孔120与麦克风阵列中的各麦克风的部署位置一一对应。
在本申请的实施例中，图1中以多个拾音孔120不规则分布为例进行排布，即，与麦克风阵列的各麦克风一一对应的多个拾音孔120并不是按照行列对齐的方式分布，这意味着，麦克风阵列并不是必须以行列对齐的标准“阵列”进行排布。也就是，在本申请的实施例中，并不意图对麦克风的“阵列”做不必要的限定，而是旨在表明麦克风阵列可以具有任意的阵列形态。
基于上述结构，当声源产生的声波传播至阵列面板10的面板主体110的外表面时，穿过拾音孔120的声波可以被麦克风捕获到，每个麦克风的拾音范围由该麦克风对应的拾音孔120限定。并且，位于各麦克风对应的拾音孔120外的剩余声波则会在面板主体110的外表面反射形成回波。
图2为一种声波反射模型的原理图。在图2中，Pi表示声源产生的入射声波，Pt表示穿过拾音孔120、且被麦克风捕获的透射声波，Pr表示在面板主体110的外表面反射形成的回波，Ra表示作为声波传播介质，如空气，的声阻，Rb表示面板主体110的声阻。其中，Pi通常为球面波，由于面板主体110在本申请的实施例中为平板状，因此，Pi到达面板主体110的外表面时也可以被看作是平面波，图2所示出的声波反射模型即是以Pi被视作平面波为条件的。从图2中可以看出，由于Rb>Ra，因此，面板主体110的外表面作为空气和面板主体110之间的介质边界，其属于声波传播过程中发生声阻变化的“硬”边界，“硬”边界反射产生的Pr与Pi之间的质点速度相位相差180°，“硬”边界反射产生的Pr与Pi之间的声压相位相同，由此，导致反射后形成的Pr能量较强，在此情况下，对麦克风阵列中的不同麦克风形成干扰的回波能量的差异也会被最大化。
请回看图1，为了弱化对麦克风阵列中的不同麦克风形成干扰的回波能量的差异，在本申请的实施例中，阵列面板10的面板主体110除了具有与麦克风阵列的各麦克风一一对应的多个拾音孔120之外，还可以在背向麦克风阵列的外表面布置有与多个拾音孔120错位分布的多个声波扩散结构130，每个声波扩散结构130可以包括盲孔或凸包。
图3为基于如图1所示的阵列面板改善后的声波反射原理图。请在参见图1的同时结合图3，当Pi传播至阵列面板10的面板主体110的外表面(即“硬”边界)时，无论声波扩散结构130具有何种形状的孔腔，位于拾音孔120外(即位于麦克风的拾音范围之外)的Pi都可以在声波扩散结构130处发生漫反射，并且，发生漫反射后的回波Pr可以在声波扩散结构130处通过彼此间的互扰而发生能量衰减，即，位于拾音孔120外(即位于麦克风的拾音范围之外)的Pi可以通过在声波扩散结构130处的漫反射而发生能量衰减，因此，反射后形成的Pr能量会由于漫反射引发的能量衰减而被削弱，从而对麦克风阵列中的不同麦克风形成干扰的回波能量的差异也会随着Pr的能量削弱而被减小，进而既有助于减少由于声波的回波干扰而引发的音频采集噪声，还有助于提升麦克风阵列的拾音一致性。
图4为如图1所示的阵列面板中的声波扩散结构的第一实例结构示意图。在如图4所示的第一实例结构中，面板主体110在背向麦克风阵列的外表面布置的多个声波扩散 结构130可以均为盲孔131，每个盲孔131在面板主体110的外表面具有开口、并且不贯穿至面板主体110的内表面。
在此情况下，盲孔131在面板主体110的外表面的开口可以看作是声波扩散结构130与面板主体110的外表面的交界面，盲孔131的孔壁可以看作是声波扩散结构130的侧壁，本申请的实施例对盲孔131的孔腔形状并不做严格限制。
例如，图4中示出了盲孔131具有圆锥状的孔腔，盲孔131在面板主体110的外表面的开口(即声波扩散结构130与面板主体110的外表面的交界处)形状呈圆形，并且，盲孔131的孔壁(即声波扩散结构130的侧壁)呈锥面，具体地，盲孔131的孔壁(即声波扩散结构130的侧壁)可以相对于垂直于面板主体110的外表面的方向偏斜，并使得盲孔131具有从孔底向开口方向上的扩张形态。但可以理解的是，若盲孔131在面板主体110的外表面的开口的横截面形状呈三角形、矩形或其他多边形，盲孔131可以具有棱锥状的孔腔。
再例如，盲孔131的孔壁(即声波扩散结构130的侧壁)也可以具有曲面、球面、椭球面、抛物面等弧面，该弧面孔壁也可以像锥面孔壁那样相对于垂直于面板主体110的外表面的方向偏斜，并使得盲孔131具有从孔底向开口方向上的扩张形态。在此情况下，若盲孔131在面板主体110的外表面的开口(即声波扩散结构130与面板主体110的外表面的交界面)形状呈圆形，则，盲孔131也可以具有球冠的孔腔。
还例如，盲孔131的孔壁(即声波扩散结构130的侧壁)还可以垂直于面板主体110的外表面，在此情况下，若盲孔131在面板主体110的外表面的开口(即声波扩散结构130与面板主体110的外表面的交界面)形状可以呈三角形、矩形以及其他多边形中的任意一种，则，盲孔131可以具有棱柱状的孔腔；若盲孔131在面板主体110的外表面的开口(即声波扩散结构130与面板主体110的外表面的交界面)形状呈圆形，则，盲孔131可以具有圆柱状的孔腔。
图5为如图1所示的阵列面板中的声波扩散结构的第二实例结构示意图。在如图5所示的第二实例结构中，面板主体110在背向麦克风阵列的外表面布置的多个声波扩散结构130可以均为凸包132，每个凸包132在垂直于面板主体110的方向上凸起(背向麦克风阵列的方向凸起)、并且具有与面板主体110的外表面连接的底面。
在此情况下，凸包132与面板主体110的外表面连接的底面可以看作是声波扩散结构130与面板主体110的外表面的交界面，凸包132的外周壁可以看作是声波扩散结构 130的侧壁，并且，本申请的实施例对凸包132的轮廓形状并不做严格限制。
例如，图5中示出了凸包132呈球冠，即，凸包132与面板主体110的外表面连接的底面(即声波扩散结构130与面板主体110的外表面的交界面)呈圆形，并且，凸包132的外周壁(即声波扩散结构130的侧壁)呈曲面，具体地，凸包132的外周壁(即声波扩散结构130的侧壁)可以相对于垂直于面板主体110的外表面的方向偏斜，并使得凸包132具有在从底面向顶部的方向上的收缩形态。
再例如，凸包132的外周壁(即声波扩散结构130的侧壁)也可以为锥面，该锥面也可以像弧面(如曲面、球面、椭球面、抛物面)那样相对于垂直于面板主体110的外表面的方向偏斜，并使得凸包132具有在从底面向顶部的方向上的收缩形态。在此情况下，若凸包132在面板主体110的外表面的底面(即声波扩散结构130与面板主体110的外表面的交界面)呈圆形，则凸包132可以呈圆锥体状，若凸包132在面板主体110的外表面的底面(即声波扩散结构130与面板主体110的外表面的交界面)呈三角形、矩形以及其他多边形中的任意一种，则，凸包132可以呈棱锥体状。
还例如，凸包132的外周壁(即声波扩散结构130的侧壁)可以垂直于面板主体110的外表面，在此情况下，若凸包132在面板主体110的外表面的底面(即声波扩散结构130与面板主体110的外表面的交界面)呈圆形，则凸包132可以呈圆柱体状，若凸包132在面板主体110的外表面的底面(即声波扩散结构130与面板主体110的外表面的交界面)呈三角形、矩形以及其他多边形中的任意一种，则，凸包132可以呈棱柱体状。
图6为如图1所示的阵列面板中的声波扩散结构的第三实例结构示意图。在如图6所示的第三实例结构中，面板主体110在背向麦克风阵列的外表面布置的多个声波扩散结构130中，一部分可以为如图4所示第一实例结构中的盲孔131、另一部分可以为如图5所示第二实例结构中的凸包132。
也就是，无论声波扩散结构130包括盲孔131还是凸包132，该声波扩散结构130的侧壁可以垂直于外表面、或者也可以相对于垂直于面板主体110的外表面的方向偏斜。
在本申请的实施例中，无论声波扩散结构130的结构形态如何，通过在声波扩散结构130处漫反射而发生回波Pr能量衰减的声波包括特定频率范围内的声波，并且，该频率范围与声波扩散结构130的尺寸有关。
请再参见图4，如前文所述，盲孔131在面板主体110的外表面的开口可以看作是声波扩散结构130与面板主体110的外表面的交界面，因此，盲孔131在面板主体110 的外表面的开口尺寸可以表示声波扩散结构130与面板主体110的外表面的交界面尺寸r0，示意性的，当开口为圆形时，r0是圆的直径；当开口为正方形时，r0为正方形的边长，并且，该交界面尺寸r0与声波频率f关联，该关联关系可以表示为如下的表达式(1)，该表达式(1)中的c表示声波在空气中的传播速率、k为大于0的常数。
r0×(2πf/c)≥k表达式(1)
因此，在设计时，可以根据期望被实施回波削弱的声波频率范围来确定声波扩散结构130与面板主体110的外表面的交界面尺寸r0，即，声波扩散结构130与面板主体110的外表面的交界面尺寸r0可以被设计为大于或等于与声波的目标频率f_obj成反比的标定尺寸，其中，目标频率f_obj可以是期望被实施回波削弱的声波频率范围的中心频率或边界频率，并且，该标定尺寸可以表示为基于对表达式(1)变形后得到的如下表达式(2)中的k×[c/(2π×f_obj)]。
r0≥k×[c/(2π×f_obj)]       表达式(2)
在一些示例中，表达式(1)和(2)中的k的取值，可以为经实验测得的优选值“4”，即，上述的标定尺寸可以在k取4时表示为2c/(π×f_obj)。
请继续参见图4，盲孔131的孔深可以表示声波扩散结构130在垂直于面板主体110的外表面的方向上的凹凸尺寸h0，并且，在声波扩散结构130与面板主体110的外表面的交界面尺寸r0被确定的情况下，声波扩散结构130的凹凸尺寸h0可以被设计为大于或等于凹凸尺寸阈值，该凹凸尺寸阈值与声波扩散结构130的交界面尺寸r0成正比。例如，该凹凸尺寸阈值与声波扩散结构130的交界面尺寸r0的比例系数q可以小于1。即，声波扩散结构130的凹凸尺寸h0与交界面尺寸r0之间具有如表达式(3)的尺寸约束。
h0/r0≥q        表达式(3)
上述的表达式(3)的含义是凹凸尺寸h0与交界面尺寸r0的比值大于比例系数q，并且，基于表达式(3)，q×r0可以看作是与声波扩散结构130的交界面尺寸r0成正比的凹凸尺寸阈值。
在一些示例中，表达式(3)中的比例系数q的取值，可以为经实验测得的优选值“0.15”，即，上述的表达式(3)可以在代入q的优选值时变形为如下的表达式(4)。
h0/r0≥0.15       表达式(4)
上述的表达式(4)的含义是凹凸尺寸h0与交界面尺寸r0的比值大于0.15，并且，基于表达式(4)，与声波扩散结构130的交界面尺寸r0成正比的凹凸尺寸阈值可以被具体设定为交界面尺寸r0的0.15倍、并表示为0.15×r0。
从而，声波扩散结构130的凹凸尺寸h0通过与交界面尺寸r0之间的尺寸约束而关联目标频率f_obj。
假设声波扩散结构130的凹凸尺寸h0被设定为0.6mm、交界面尺寸r0被设定为4.0mm，则，在17kHz～40kHz的频率范围内的声波都可以通过在声波扩散结构130处漫反射而发生回波Pr能量衰减。
同理，图5中以凸包132与面板主体110的外表面连接的底面尺寸表示声波扩散结构130与面板主体110的外表面的交界面尺寸r0，并且，以凸包132的凸起高度表示声波扩散结构130在垂直于面板主体110的外表面的方向上的凹凸尺寸h0。
在本申请的实施例中，声波扩散结构130的主要作用在于降低面板主体110的外表面(即“硬”边界)的平整度，因为降低面板主体110的外表面(即“硬”边界)的平整度，可削弱拾音孔120外(即位于麦克风的拾音范围之外)的入射声波Pi的回波Pr能量，不应当理解为声波扩散结构130与拾音孔120必须是一一对应的。示例性的，在图1中，多个声波扩散结构130在面板主体110的分布密度，低于多个拾音孔120在面板主体110的分布密度，即是为了表达声波扩散结构130与拾音孔120之间并不必须存在一一对应关系。
而且，无论声波扩散结构130与拾音孔120之间存在何种分布关系，为了使入射声波Pi在声波扩散结构130处通过漫反射的回波Pr能量衰减效果更优，在本申请的实施例中，可以控制相邻的声波扩散结构130之间的中心距离g(如图4-6所示的g1和g2)，即，在本申请的实施例中，每两个相邻的声波扩散结构130之间的中心距离g均在预先标定的距离范围内，该距离范围的范围边界与声波的目标波长λ成正比，如表达式(5)所示。
m×λ≤g≤n×λ       表达式(5)
在表达式(5)中，m×λ和n×λ为距离范围的范围边界，m大于0、n大于m，并且，按照声波的波长与频率的关系，表达式(5)中的λ为c/f_obj。
在一些示例中，m可以取1，n可以取3，在此情况下，表达式(5)所示的距离范围[m×λ，n×λ]可以为[λ，3λ]。假设目标频率为34kHz，则，任意两个相邻的声波 扩散结构130之间的中心距离g可以设定在[1cm，3cm]的范围内。
如前文所述，在本申请的实施例中，多个拾音孔120可以不规则分布，在此情况下，多个声波扩散结构130也可以是在满足表达式(5)所示的距离范围的条件下不规则分布，即，相邻的声波扩散结构130之间的中心距离之间可以允许被设定为不全相同。
在图4至图6中，以一对声波扩散结构130之间的中心距离为g1、另一对声波扩散结构130之间的中心距离为g2，对相邻的声波扩散结构130之间的中心距离之间可以不全相同进行图示表达。
另外，在本申请的实施例中，面板主体110的材质可以选用诸如PC(Polycarbonate，聚碳酸酯)等高分子聚合物，若如此，则，请回看图2，面板主体110的外表面形成的“硬”边界的硬度会较高，从而，回波Pr更容易获得较大的初始能量。
为了弱化面板主体110的外表面形成的“硬”边界的硬度，在本申请的实施例中，面板主体110的材质也可以选用诸如PET(Polyethylene terephthalate，涤纶树脂)等孔隙材质，以使得入射声波Pi在面板主体110的外表面被部分吸收，从而，有助于降低回波Pr的初始能量，进而，结合回波Pr能量通过在声波扩散结构130处漫反射的能量衰减，可以使得对麦克风阵列中的不同麦克风形成干扰的回波能量差异被进一步减小，以产生进一步减少由于声波的回波干扰而引发的音频采集噪声、以及进一步提升麦克风阵列的拾音一致性的效果。
除了降低噪声之外，在本申请的实施例中，还可以通过增大被麦克风捕获的入射声波Pi能量来提高音频采集的信噪比。
仍参见图4，在本申请的实施例中，拾音孔120在面板主体110的外表面的开口可以为具有锥面孔壁的敞口125，该敞口125用于将更多的入射声波Pi引导汇聚至拾音孔120内，以使得更多的入射声波Pi能够通过拾音孔120传播至其对应的麦克风。例如，敞口125的锥面孔壁相比于垂直于面板主体110的传声方向，可以具有30°～35°的倾斜角度，优选地，该倾斜角度可以为33°。
图7为本申请的另一个实施例中的电子设备的示例性局部结构示意图。请参见图7，在本申请的另一个实施例中，诸如声波成像仪等电子设备可以包括麦克风阵列30、以及前述实施例中的阵列面板10。其中，图7中仅仅是以声波扩散结构130选用具有圆锥状孔腔的盲孔131为例，可以理解的是，当该阵列面板10应用到电子设备中时，其声波扩散结构130可以选用前文提及的任意一种结构；而且，图7中仅示出了麦克风阵列30 中的一个麦克风300及其对应的一个拾音孔120，这样的简化表达方式可以通用表示每个麦克风300及其对应的拾音孔120处的结构和位置关系。
而且，在本申请的实施例中，为了确保麦克风阵列30的拾音一致性，在垂直于面板主体110的方向上，麦克风阵列30中的各麦克风300与对应的拾音孔120之间的距离相等。
例如，麦克风阵列30可以包括诸如PCB(Printed Circuit Board，印刷电路板)等阵列基板310，麦克风300可以布置在阵列基板310背向面板主体110的基板表面，并且，阵列基板310可以在每个麦克风300的部署位置开设有基板通孔320，从而，当阵列基板310与平板状的面板主体110平行堆叠时，每个麦克风300可以具有穿过对应的拾音孔120和基板通孔320的传音通道，并且，阵列基板310与平板状的面板主体110之间的平行堆叠，可以使每个麦克风300的长度距离与对应的拾音孔120之间的距离都是相同的。
从图7中还可以看出，该电子设备还可以包括堆叠挤压在阵列基板310与平板状的面板主体110之间的缓震介质20(诸如泡棉或硅胶)，该缓震介质20用于吸收面板主体110受到的外部冲击，以保护麦克风阵列30，而且，该缓震介质20可以开设有避让拾音孔120和基板通孔320的介质通孔220，即，每个麦克风300的传音通道依次贯穿拾音孔120、介质通孔220和基板通孔320。
可以理解的是，虽然未在图中示出，但本申请实施例中的电子设备还可以包括诸如CPU(central processing unit，中央处理单元)、MCU(Microcontroller Unit，微控制单元)、FPGA(Field-Programmable Gate Array，现场可编程门阵列)等处理器中的至少一种，用于获取、并处理麦克风300基于捕获到的透射声波Pt而产生的音频信号。
另外，在本申请的实施例中，麦克风阵列也可以与具有其他功能的模组一起共存于电子设备中，例如具有光学镜头的光学成像模组或者具有扬声器的音频播放模组，因此，为了避免与具有其他功能的模组发生干涉，面板主体110还可以在用于部署具有其他功能的模组的区域(例如中心区域)开设有面板避让孔150(如图1所示)，用于避让该模组的采集元件(例如光学镜头或扬声器)，相应地，阵列基板310和缓震介质20也都可以开设避让孔。
在本申请实施例的一些示例中，如图7所示的电子设备可以为声波成像仪，声波成像仪可以基于传声器阵列测量技术，通过测量一定空间内的声波到达各传声器的信号相 位差异，依据相控阵原理确定声源位置，测量声源的幅值，并以图像的方式显示声源在空间的分布。在此情况下，该声波成像仪的处理器可以被配置为：
获取麦克风阵列监测到的音频信号；
基于各麦克风的音频信号之间的信号相位差，确定声源位置和声波幅值；
基于确定的声源位置和声波幅值，生成声波图像，其中，声波图像中的各像素的像素值用于表征麦克风阵列的阵列区域内的声波幅值分布，并且，声波图像中的各像素的像素值以声源位置为中心呈梯度递减。
由于前述实施例中的阵列面板10能够减少由于声波的回波干扰而引发的音频采集噪声、并同时提升麦克风阵列的拾音一致性，因此，包括该阵列面板10的声波成像仪获取到的音频信号的信号质量可以得到提升，从而，可以提升基于信号相位差确定的声源位置和声波幅值的准确度，进而，可以提升声波图像的图像质量。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本申请保护的范围之内。

Claims (10)

  1. 一种麦克风阵列的阵列面板，其特征在于，包括：平板状的面板主体；
    所述面板主体开设有多个拾音孔，所述多个拾音孔均为贯穿所述面板主体的通孔，所述多个拾音孔与所述麦克风阵列中的各麦克风的部署位置一一对应；
    所述面板主体背向所述麦克风阵列的外表面具有与所述多个拾音孔错位分布的多个声波扩散结构，每个所述声波扩散结构包括盲孔或凸包。
  2. 根据权利要求1所述的阵列面板，其特征在于，
    每个所述声波扩散结构与所述外表面的交界面尺寸大于或等于标定尺寸，所述标定尺寸与声波的目标频率成反比；
    每个所述声波扩散结构在垂直于所述外表面的方向上的凹凸尺寸大于或等于凹凸尺寸阈值，所述凹凸尺寸阈值与所述交界面尺寸成正比。
  3. 根据权利要求2所述的阵列面板，其特征在于，
    所述标定尺寸为2c/(π×f_obj)，其中，c表示声波在空气中的传播速率，f_obj表示所述目标频率；和/或，
    所述凹凸尺寸阈值为所述交界面尺寸的0.15倍。
  4. 根据权利要求1至3中任一项所述的阵列面板，其特征在于，
    任意两两相邻的声波扩散结构之间的中心距离均在预先标定的距离范围内，所述距离范围的范围边界与声波的目标波长成正比。
  5. 根据权利要求4所述的阵列面板，其特征在于，
    所述距离范围为[λ，3λ]，λ表示所述目标波长。
  6. 根据权利要求1至5中任一项所述的阵列面板，其特征在于，
    所述多个声波扩散结构的侧壁垂直于所述外表面；或者，
    所述多个声波扩散结构的侧壁相对于垂直于所述外表面的方向偏斜。
  7. 根据权利要求1所述的阵列面板，其特征在于，
    两两相邻的声波扩散结构之间的中心距离不全相同；和/或，
    所述多个声波扩散结构在所述面板主体的分布密度小于所述多个拾音孔在所述面板主体的分布密度。
  8. 根据权利要求1所述的阵列面板，其特征在于，
    所述多个拾音孔在所述外表面的开口为具有锥面孔壁的敞口。
  9. 根据权利要求1至8中任一项所述的阵列面板，其特征在于，
    所述面板主体的材质为多孔材质。
  10. 一种声波成像仪，其特征在于，包括麦克风阵列、以及如权利要求1至9中任一项所述的阵列面板，其中，在垂直于所述面板主体的方向上，所述麦克风阵列中的各麦克风与对应的拾音孔之间的距离相等。
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