WO2024204008A1 - Device and method for forming sealing resin used for compression molding, and compression molding device - Google Patents

Abstract

The present invention addresses the problem of providing a device and method for accurately forming a sealing resin in a suitable amount, the device and method making it possible to achieve a compression molding device and a compression molding method that are able to prevent the occurrence of molding defects. As the solution, a device (100) for forming a sealing resin according to the present invention comprises: a preliminary molding unit (101) that preliminarily molds a base resin (Rm) to form a preliminary molded resin (R) to be used for sealing a workpiece (W); a measurement unit (190) that measures the weight or shape of the preliminary molded resin (R); and a removal mechanism (180) that removes part of the preliminary molded resin (R) if the measurement result from the measurement unit (190) is greater than the weight or larger than the shape required for sealing the workpiece (W).

Description

Apparatus and method for forming sealing resin used in compression molding, and compression molding apparatus

The present invention relates to an apparatus and method for forming sealing resin used in compression molding, and a compression molding apparatus.

One example of a resin sealing device and resin sealing method that uses a compression molding method to seal a workpiece, which is a base material mounted with electronic components, with sealing resin and process it into a molded product.

The compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and clamping it with the upper and lower molds. As an example, when using a sealing mold with a cavity in the upper mold, a technique is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when using a sealing mold with a cavity in the lower mold, a technique is known in which a release film (hereinafter sometimes simply referred to as "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: See JP 2019-145550 A).

JP 2019-145550 A

For example, when resin-sealing a strip-type wire-connected electronic component (semiconductor chip) as the workpiece, the compression molding method in which a cavity is provided in the upper die has the problem that resin sealing is difficult because the wire portion of the workpiece held in the lower die comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece and becomes deformed. For this reason, the compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (granular resin, as an example) is supplied into the cavity is generally used.

However, in a configuration in which the workpiece is held in the upper mold and the cavity is provided in the lower mold, if the workpiece is thin or large, it is difficult to hold it in the upper mold and it is likely to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when trying to form a thick molded product with a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, the molding stroke becomes large, and there is a problem that the film is likely to get caught in the molded product, resulting in molding defects. Furthermore, when granular resin is used as the sealing resin, in addition to the problem of the film being easily caught in the molded product, dust is generated, and handling is difficult, there is a problem that it is difficult to evenly supply (spray) the sealing resin over the entire area of the cavity provided in the lower mold, and uneven spreading is likely to occur. In addition, there is a problem that the air contained in the gaps between the particles when the sealing resin is sprayed and the gas components due to degassing from the sealing resin when melted are not released and remain in the molded product, resulting in molding defects. In particular, in the case of workpieces in which electronic components are mounted via wire connections, there is a risk of wire flow (deformation or breakage of the wire) due to the flow of resin inside the cavity during resin sealing.

On the other hand, regardless of the cavity arrangement, if the workpiece to be sealed is missing electronic components (for example, not mounted due to thinning out, or dropped after mounting, etc.), the total amount of resin required for sealing increases, causing a resin shortage and resulting in molding defects. Conversely, if more resin than necessary is supplied, the amount of overflow increases, causing a lot of waste. Therefore, it is important to accurately form the correct amount of sealing resin for each workpiece.

The present invention was made in consideration of the above circumstances, and aims to provide a molding device and a molding method that accurately forms the correct amount of sealing resin, which is easy to handle, and can realize a compression molding device and a compression molding method that solves the problems of configurations in which a cavity is provided in the upper mold and configurations in which a cavity is provided in the lower mold, prevents molding defects caused by resin flow, uneven distribution, residual gas, and dust generation during molding, and enables the formation of molded products with large thickness dimensions.

The present invention solves the above problems by using the solutions described in the following embodiments.

The device is required to include a provisional molding section that provisionally molds a base resin according to one embodiment to form a provisionally molded resin to be used for sealing the workpiece, a measuring section that measures the weight or shape of the provisionally molded resin, and a removal mechanism that removes a portion of the provisionally molded resin when the result of the measurement in the measuring section is greater than the weight required for sealing the workpiece or greater than the required shape.

It is also preferable that the removal mechanism has a processing tool for processing the provisionally molded resin.

Another embodiment of the sealing resin forming device is a forming device that compresses a base resin into tablets to form a sealing resin to be used in compression molding of a workpiece, and is required to include a tableting die that contains an initial set amount of the base resin and compresses the base resin into a sealing resin having a predetermined shape that corresponds to the shape of the workpiece, and a removal mechanism that removes a portion of the sealing resin formed by tableting to a predetermined amount.

For example, the workpiece is a workpiece having a configuration in which electronic components are mounted on a substrate. Furthermore, it is preferable that the predetermined shape of the workpiece is a shape that does not contact the electronic components when the sealing resin is placed on the substrate. It is preferable that a powder resin is used as the base resin. It is also preferable that the sealing resin has a plate-shaped or block-shaped main body and multiple legs erected on one surface of the main body, and further, it is preferable that the legs include multiple types of legs with different amounts of resin.

Furthermore, it is preferable that a control calculation unit is provided for controlling the operation of the removal mechanism, and the control calculation unit sets the predetermined amount by calculating the amount of resin required based on data obtained by measuring the presence or absence of the electronic components mounted on one of the substrates for each of the workpieces, and controls the operation of the removal mechanism so as to achieve the predetermined amount. It is also preferable that the removal mechanism has a removal tool for removing a portion of the leg so as to achieve the predetermined amount.

In one embodiment, the method for forming a sealing resin is a method for forming a sealing resin to be used in compression molding of a workpiece by tableting a base resin, and includes a tableting step in which an initial set amount of the base resin is placed in a tableting die and tableted to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece, and a removal step in which a portion of the sealing resin formed by tableting is removed so that the amount of the sealing resin formed by tableting is a predetermined amount.

In addition, the tableting process is preferably carried out at a temperature at which the base resin does not harden thermally, so that the encapsulating resin formed can be hardened thermally in the subsequent compression molding process.

Furthermore, the compression molding device according to one embodiment is required to include a final molding section that seals the workpiece with a provisionally molded resin that is provisionally molded using a base resin to perform final molding, a measurement section that measures the weight or shape of the provisionally molded resin, and a removal mechanism that removes a portion of the provisionally molded resin when the measurement result in the measurement section is greater than the weight required to seal the workpiece or greater than the required shape.

It is also preferable that the removal mechanism has a processing tool for processing the provisionally molded resin.

In another embodiment, the compression molding device is a compression molding device that seals a workpiece with sealing resin and processes it into a molded product, and is required to have a removal mechanism that removes a portion of the sealing resin formed by tableting so that the amount is a predetermined amount.

　With the molding device and molding method according to the present invention, the amount of the sealing resin formed can be appropriately changed and fine-tuned, so that the right amount of sealing resin can be accurately formed for each workpiece. Furthermore, by using the sealing resin formed by the molding device and molding method, it is possible to realize a compression molding device and compression molding method that can solve the problems of configurations in which a cavity is provided in the upper mold and configurations in which a cavity is provided in the lower mold, prevent molding defects caused by resin flow, uneven scattering, residual gas, and dust generation during molding, and form molded products with large thickness dimensions. Furthermore, handling is easier than with granular resin, especially when supplying and setting.

FIG. 1 is a plan view showing an example of a compression molding apparatus in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. FIG. 2 is an explanatory diagram illustrating an example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention is used. Fig. 3A is an enlarged view of part III in Fig. 2. Fig. 3B is an explanatory view following Fig. 3A. FIG. 4 is an explanatory diagram following FIG. 3B. FIG. 5 is an explanatory diagram following FIG. FIG. 6 is an explanatory diagram illustrating another example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention is used. FIG. 7 is an explanatory diagram following FIG. FIG. 8 is an explanatory diagram following FIG. FIG. 9 is a plan view illustrating an example of the sealing resin forming apparatus according to the first embodiment of the present invention. FIG. 10 is a side view showing an example of a pressing device of the forming apparatus shown in FIG. FIG. 11 is a side cross-sectional view showing an example of a tableting die of the forming apparatus shown in FIG. 12 is a front cross-sectional view (cross-sectional view taken along line XII-XII in FIG. 11) showing an example of a tableting die of the forming apparatus shown in FIG. 9. FIG. 13 is an explanatory diagram of a method for forming a sealing resin according to an embodiment of the present invention. FIG. 14 is an explanatory diagram following FIG. FIG. 15 is an explanatory diagram following FIG. FIG. 16 is a perspective view showing an example of a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention. FIG. 17 is a perspective view showing another example of the sealing resin formed by the forming apparatus and the forming method according to the embodiment of the present invention. FIG. 18 is a perspective view showing an example of the sealing resin after the removal step is performed in the sealing resin forming method according to the embodiment of the present invention. FIG. 19 is an explanatory diagram of a conventional compression molding method. FIG. 20 is an explanatory diagram of a conventional compression molding method. FIG. 21 is a plan view showing an example of a compression molding device according to another embodiment of the present invention. FIG. 22 is a plan view illustrating an example of an apparatus for forming a sealing resin according to the second embodiment of the present invention. FIG. 23 is a plan view showing an example of a compression molding device according to another embodiment of the present invention.

(Compression molding device and compression molding method)
The sealing resin forming apparatus 100 and the forming method according to the embodiment of the present invention are an apparatus and a method for forming a sealing resin R used in compression molding of a workpiece W. First, an outline of a compression molding apparatus 1 and a compression molding method for resin sealing (compression molding) a workpiece W using the sealing resin R will be described. Here, FIG. 1 is a plan view (schematic diagram) showing an example of a compression molding apparatus 1. For convenience of explanation, arrows may be used in the figure to indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction). In addition, in all the figures for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

The workpiece W to be sealed has a structure in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of the electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and the like. The shape of the substrate Wa is rectangular (striped), square, circular, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix).

Examples of methods for mounting electronic components Wb on the substrate Wa include wire bonding and flip chip mounting. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, the electronic components Wb can be attached using a thermally peelable adhesive tape or an ultraviolet-curing resin that hardens when exposed to ultraviolet light.

Examples of the film F include film materials with excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. The film F is also used when forming the sealing resin R in the forming device 100 described below.

As shown in FIG. 1, the compression molding device 1 mainly comprises a supply unit 10A for supplying the workpiece W, a press unit 10B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 10C for storing the molded product Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), and the arrangement order of the units can be changed. It is also possible to have a configuration that includes units other than those mentioned above (all not shown).

In addition, the compression molding device 1 has a guide rail 20 that is linearly arranged between each unit, and a transport device (first loader) 22 that transports the workpiece W and sealing resin R, and a transport device (second loader) 24 that transports the molded product Wp (which may be used to transport the sealing resin R) are arranged to be movable between predetermined units along the guide rail 20. However, the configuration is not limited to the above, and a configuration that includes a common (single) transport device (loader) that transports the workpiece W, sealing resin R, and molded product Wp (not shown) may also be used. In addition, the transport device may be configured to include a robot hand or the like instead of a loader.

In addition, the compression molding device 1 has a control unit 30 that controls the operation of each mechanism in each unit, which is located in the supply unit 10A (although it may also be configured to be located in another unit).

The press unit 10B is equipped with a pair of sealing dies that are opened and closed by the press device 250. As an example, the sealing dies may be configured such that a cavity is provided in the upper die (sealing die 202), and as another example, they may be configured such that a cavity is provided in the lower die (sealing die 302).

As an example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 202 will be described with reference to Figs. 2 to 5. In this case, the press device 250 is provided with a film supply section 211 that supplies film F to cover the mold surface 204a (predetermined area) including the inner surface of the cavity 208 in the upper mold 204. As an example, the film F is in a roll shape, but it may also be in a strip shape.

First, a preparation process (sealing preparation process) is carried out. Specifically, a process is carried out in which the upper mold 204 and the lower mold 206 are adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated. In addition, a process is carried out in which the film supply unit 211 is operated to supply new film F and adsorb it so as to cover a predetermined area of the mold surface 204a, including the inner surface of the cavity 208 in the upper mold 204.

After the preparation process, a workpiece holding process is carried out in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 202, where it is held by the workpiece holding portion 205 of the lower plate 242 (die surface 206a).

After the workpiece holding step, a resin placing step is performed in which the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (see FIG. 2). Specifically, the sealing resin R formed in the sealing resin forming device (which may simply be referred to as the "forming device") 100 described below is held by the first loader 22 (or another transport device) and carried into the sealing mold 202, where it is placed on the workpiece W held by the workpiece holding portion 205.

Alternatively, as another example of the resin placing process, the sealing resin R formed in the forming device 100 may be placed on the workpiece W prior to the above-mentioned workpiece holding process. In this case, the workpiece holding process is a process in which the workpiece W with the sealing resin R placed thereon is held by the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R placed thereon, carries it into the sealing die 202, and holds it in the workpiece holding section 205. This has the advantage of carrying out the workpiece W and sealing resin R in the sealing die 202 in one go, rather than separately.

Next, a resin sealing process is carried out in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relatively within the cavity 208 surrounded by the clamper 228 to carry out the mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. Note that FIG. 3A is an enlarged view of part III in FIG. 2, and during the mold closing process, the sealing resin R softens and melts so that it changes from the state in FIG. 3A to the state in FIG. 3B.

This causes the sealing resin R to thermally harden and complete the resin sealing (compression molding) (see Figure 4).

The steps following the mold closing step are the same as those in conventional compression molding methods. In summary, the mold opening step is performed to open the sealing mold 202 and separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 5). Next, the molded product unloading step is performed to unload the molded product Wp from the sealing mold 202 by the second loader 24 and transport it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product unloading step, the film supply unit 211 is operated to send out the used film F from the sealing mold 202 and send a new film F into the sealing mold 202 and set it therein.

The above are the main steps of the compression molding method performed using the compression molding device 1 when equipped with the sealing mold 202. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

As another example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 302 will be described with reference to Figures 6 to 8. In this case, the press device 250 is provided with a film supply section 311 that supplies film F to cover the mold surface 306a (predetermined area) including the inner surface of the cavity 308 in the lower mold 306. As an example, the film F is in a roll shape, but it may also be in a strip shape.

First, a preparation process (sealing preparation process) is carried out. Specifically, a process is carried out in which the upper die 304 and the lower die 306 are adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated. In addition, a process is carried out in which the film supply unit 311 is operated to supply new film F and adsorb it so as to cover a predetermined area of the die surface 306a, including the inner surface of the cavity 308 in the lower die 306.

After the preparation process, a workpiece holding process is carried out in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 302, where it is held by the workpiece holding portion 305 of the upper plate 342 (die surface 304a).

After the workpiece holding process, the resin holding process is carried out (it may be carried out before the workpiece holding process or in parallel). The resin holding process has the following steps: The sealing resin R is held in the cavity 308 of the lower die 306 (see FIG. 6). Specifically, the sealing resin R formed in the forming device 100 is held by the first loader 22 (or another transport device) and carried into the sealing die 302, and is housed in the cavity 308 (specifically, it is placed on the top surface of the cavity piece 326).

Next, a resin sealing process is carried out in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is raised relatively within the cavity 308 surrounded by the clamper 328 to carry out the mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 7).

The steps following the mold closing step are the same as those in conventional compression molding methods. In summary, the mold opening step is performed to open the sealing mold 302 and separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 8). Next, the molded product unloading step is performed to unload the molded product Wp from the sealing mold 302 by the second loader 24 and transport it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product unloading step, the film supply unit 311 is operated to send out the used film F from the sealing mold 302 and send a new film F into the sealing mold 302 and set it there.

The above are the main steps of the compression molding method performed using the compression molding device 1 when equipped with the sealing mold 302. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[First embodiment]
(Sealing resin forming device)
Next, a forming apparatus 100 (first embodiment) for forming the sealing resin R used in the compression molding apparatus 1 and the compression molding method will be described with reference to Figs. 9 to 12. The forming apparatus 100 processes the base resin Rm to form the sealing resin R. Fig. 9 is a plan view (schematic diagram) showing an example of the forming apparatus 100. The forming apparatus 100 may be provided either inside or outside the compression molding apparatus 1.

In this embodiment, a thermosetting resin (such as, but not limited to, an epoxy resin containing a filler) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid or semi-solid resin having a predetermined shape (details will be described later) that corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" of the required amount of sealing (one amount per workpiece W), but it may be configured so that several pieces (for example, about two or three pieces) are divided to constitute the "whole" of the required amount of sealing. In addition, the above-mentioned "semi-solid" does not mean a completely solid state, but a state in which it is melted to the so-called B stage. In addition, a powder resin (form) that is a thermosetting resin (property) is preferably used for the base resin Rm. However, it is not limited to this, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of two or more of these may be used.

As shown in FIG. 9, the forming device 100 is equipped with a tableting die 102 having a pair of dies (for example, a combination of multiple die blocks, die plates, die pillars, etc., made of alloy tool steel, and other components) that can be opened and closed. It is also equipped with a press device 150 that drives the tableting die 102 to open and close. It is also equipped with a control and calculation unit 170 that controls the operation of each mechanism. Here, a side view (schematic diagram) of the press device 150 is shown in FIG. 10. Also, a side cross-sectional view (schematic diagram) of the tableting die 102 is shown in FIG. 11, and a front cross-sectional view (schematic diagram) at the XII-XII position is shown in FIG. 12.

As shown in FIG. 10, the press device 150 is configured with a pair of platens 154, 156, a number of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured with a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, this is not limited to this). In this embodiment, the upper platen 154 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the lower platen 156 is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, this is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (neither is shown).

On the other hand, as shown in FIG. 10, the tableting die 102 is provided with an upper die 104 on the upper side in the vertical direction and a lower die 106 on the lower side as a pair of dies arranged between the pair of platens 154, 156 in the press device 150. The upper die 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the lower die 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The upper die 104 and the lower die 106 move toward and away from each other to close and open the die (the vertical direction (up and down direction) is the die opening and closing direction). In the tableting die 102 according to this embodiment, the upper die 104 constitutes a so-called "pestle die", and the lower die 106 constitutes a so-called "mortar die".

The press device 150 is provided with an upper die film supply section 113 that supplies film F to cover the die surface 104a (predetermined area) of the upper die 104, and a lower die film supply section 111 that supplies film F to cover the die surface 106a (predetermined area) including the inner surface of the cavity 108 in the lower die 106. As an example, the film F is in a roll shape, but it may also be in a strip shape.

Next, the lower die 106 of the tableting die 102 will be described in detail. As shown in Figures 11 and 12, the lower die 106 comprises a lower die chase 110, a cavity piece 126 held by it, a clamper 128, etc. The lower die chase 110 is fixed to the upper surface of the support plate 114 via a support pillar 112. A cavity 108 is provided on the upper surface of the lower die 106 (the surface facing the upper die 104). A predetermined amount of base resin Rm is contained in this cavity 108.

The clamper 128 is configured in an annular shape to surround the cavity piece 126, and is assembled to be movable up and down while being spaced (floating) from the upper surface of the support plate 114 via the push pin 122 and the clamper spring 124 (a biasing member such as a coil spring, for example) (however, this assembly structure is not limited). The cavity piece 126 forms the inner part (bottom part) of the cavity 108, and the clamper 128 forms the side part of the cavity 108. The shape and number of cavities 108 provided in one lower mold 106 are set appropriately (one or multiple).

The lower mold 106 is also provided with suction paths (holes, grooves, etc.) (not shown) that communicate with a suction device on the upper surface of the clamper 128 and at the boundary between the clamper 128 and the cavity piece 126. This allows the film F supplied from the lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a, including the inner surface of the cavity 108.

In addition, in this embodiment, a lower die heating mechanism (not shown) is provided that heats the lower die 106 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 170. As an example, the heater is built into the lower die chase 110 and is configured to apply heat to the entire lower die 106 and the base resin Rm contained in the cavity 108. At this time, the lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) that does not cause the base resin Rm to thermally harden (mainly harden).

In addition, the lower mold 106 described above has a structure that includes a movable clamper (clamper 128) as an example, but as another example, it may have a structure that does not include a movable clamper (not shown).

Next, the upper die 104 of the tableting die 102 will be described in detail. As shown in Figures 11 and 12, the upper die 104 is equipped with a tableting plate 142 that presses a predetermined amount of base resin Rm contained in the cavity 108 of the lower die 106 to form (tablet) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (the forming method will be described in detail later). The tableting plate 142 is held (fixed) by the upper die chase 140. As an example, a leg forming groove (including a recess) 143 for forming the leg Rb of the sealing resin R is provided on the lower surface (the surface facing the lower die 106) of the tableting plate 142.

In this embodiment, in order to form sealing resin R having multiple types of legs Rb with different resin amounts, multiple types of leg forming grooves 143 with different recess volumes (i.e., inner diameter and depth of the recess) are provided. As an example, the shape (recess volume) of leg forming groove 143 is set so that multiple types of legs Rb with different resin amounts (for example, 1g, 2g, 3g, 5g, etc.) can be formed.

The leg forming groove 143 is provided on the tableting plate 142, but it may also be provided on the cavity piece 126, or on both.

The upper die 104 also has suction paths (holes, grooves, etc.) (not shown) in the tableting plate 142 etc. that communicate with the suction device. This allows the film F supplied from the upper die film supply unit 113 to be adsorbed and held on the die surface 104a.

In addition, in this embodiment, an upper die heating mechanism (not shown) is provided that heats the upper die 104 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 170. As an example, the heater is built into the upper die chase 140 and is configured to apply heat to the entire upper die 104. At this time, the upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm held (contained) in the lower die 106 does not thermally harden (mainly harden).

Furthermore, as a characteristic configuration of this embodiment, the forming device 100 is provided with a removal mechanism 180 that removes a portion of the sealing resin R after tableting so that the amount of the sealing resin R formed by tableting is a predetermined amount. The removal mechanism 180 is provided with a removal tool that removes a portion of the sealing resin R (as an example, the leg portion Rb). In this application, "removal" is defined broadly as the concept of removal, such as cutting, scraping, and breaking off. Examples of removal tools that can be used include a metal blade cutter that performs mechanical removal, a thermal melting cutter that performs thermal melting removal, and the like (neither of which are shown).

By removing a portion of the sealing resin R formed by tableting, the amount of sealing resin R after tableting (formation) can be appropriately changed and fine-tuned. Therefore, the appropriate amount of sealing resin R can be accurately formed for each workpiece W.

As mentioned above, if multiple types of legs Rb with different resin amounts (for example, 1g, 2g, 3g, 5g, etc.) are formed in the sealing resin R, the work of removing the legs Rb to obtain a predetermined amount of sealing resin R can be performed quickly and easily. Note that, as an example, the legs Rb to be removed can be cylindrical in shape to facilitate removal, but are not limited to this shape.

In another embodiment, the removal mechanism 180 may be provided in the compression molding device 1 instead of the forming device 100 (see FIG. 21). As an example, it is provided in the supply unit 10A, but this is not limiting and the mechanism may be provided in another unit (not shown). In this embodiment, the operation of the removal mechanism 180 is controlled by the control unit 30.

(Method of forming sealing resin)
Next, there will be described steps of the method for forming the sealing resin according to the present embodiment, which is carried out using the above-mentioned forming apparatus 100. Here, Fig. 13 to Fig. 15 are explanatory views of each step, and are illustrated as front cross-sectional views taken in the same direction as Fig. 12.

First, a preparation step (tabletting preparation step) is performed. The preparation step includes the following steps. A lower mold heating step is performed in which the lower mold 106 is heated to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully harden, for example, 50°C to 80°C) by the lower mold heating mechanism. An upper mold heating step is performed in which the upper mold 104 is heated to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully harden, for example, 50°C to 80°C) by the upper mold heating mechanism. A lower mold film supply step is performed in which the lower mold film supply unit 111 is operated to supply new film F and adsorb it to cover a predetermined area of the mold surface 106a including the inner surface of the cavity 108 in the lower mold 106. An upper mold film supply step is performed in which the upper mold film supply unit 113 is operated to supply new film F and adsorb it to cover a predetermined area of the mold surface 104a of the upper mold 104.

After the preparation process, a tableting process is carried out in which the base resin Rm is tableted to form a solid or semi-solid resin having a predetermined shape (described later) that corresponds to the shape of the workpiece W as the sealing resin R. Specifically, an initial set amount (a resin amount greater than or equal to the maximum required amount expected for each workpiece W) of the base resin Rm is accommodated in the cavity 108 of the lower die 106 using a dispenser, a conveying device, etc. (not shown) (see FIG. 13). Next, the press device 150 is operated to close the tableting die 102 that has been heated to the above-mentioned predetermined temperature (see FIG. 14). At this time, the cavity piece 126 rises relatively in the cavity 108, and the base resin Rm is tableted (sandwiched and pressed) between the cavity piece 126 and the tableting plate 142. As a result, a solid or semi-solid sealing resin R having a predetermined shape and not yet thermally cured (mainly cured) is formed. At this time, the base resin Rm that enters the leg forming groove 143 of the tableting plate 142 through the film F becomes the leg Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the body Ra of the sealing resin R (the detailed configuration of the sealing resin R will be described later). As a modified example of the tableting process, a part of the base resin Rm may be held (welded, gripped, etc.) by the upper die 104 (not shown). Also, although the leg forming groove 143 is provided in the tableting plate 142, it may be provided in the cavity piece 126 or both.

It is important that the above tableting process is carried out at a temperature at which the base resin Rm does not thermally harden (fully harden) (the lower die 106 and the upper die 104 are heated to a temperature at which the base resin Rm does not thermally harden (fully harden)) so that the encapsulating resin R formed can be thermally hardened (fully hardened) in the subsequent resin encapsulating process (a process of the compression molding method). As mentioned above, the "temperature at which the base resin Rm does not thermally harden (fully harden)" depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (about 70°C in this embodiment).

Here, the "predetermined shape" of the sealing resin R will be described. As an example, in the case of the sealing resin R used in the compression molding device 1 when equipped with the sealing mold 202, the "predetermined shape" is a shape that does not contact the electronic component Wb (electronic component Wb having wires includes the wires) when placed on the substrate Wa of the work W. As an example, as shown in FIG. 2, a sealing resin R having a shape in which a plate-shaped or block-shaped main body Ra and legs Rb arranged intermittently (or continuously) on one side of the main body Ra (the side facing the electronic component Wb of the work W) are provided is preferable (however, this shape is not limited). The main body Ra is a size that fits into the cavity 208 in a plan view, and considering the resin flow, a size slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226) is preferable. In addition, the legs Rb need to have a height H (see FIG. 3A) that does not contact the electronic components Wb, but this does not exclude contact to the extent that the wires are not plastically deformed. The legs Rb are arranged in a position where they do not contact the electronic components Wb in a plan view of the main body Ra, and where the main body Ra does not tilt when placed on the substrate Wa of the work W. Furthermore, it is preferable that the legs Rb are arranged between the electronic components Wb or on the outer periphery of the electronic components Wb so as not to damage the wiring (especially the wires) of the work W even slightly during molding. Details of specific configuration examples of the sealing resin R (FIGS. 16 and 17) will be described later.

6, in the case of the sealing resin R used in the compression molding apparatus 1 when the sealing mold 302 is provided, the "predetermined shape" is a shape in which, when the upper mold 304 is gradually brought closer to the lower mold 306 during closing of the sealing mold 302, the body portion Ra of the sealing resin R does not come into contact with the electronic component Wb of the work W (including the wire in the case of the electronic component Wb having a wire), when the tip portion (upper end portion) of the leg portion Rb of the sealing resin R contained in the cavity 308 comes into contact with the substrate Wa of the work W held by the work holding portion 305. The specific shape of the sealing resin R is the same as that of the sealing resin R used in the compression molding apparatus 1 when the sealing mold 202 is provided (see FIGS. 16 and 17).

Here, an example of the configuration (shape) of the sealing resin R will be described with reference to Figures 16 and 17. The sealing resin R is formed into a shape having a plate-like or block-like main body portion Ra and multiple legs Rb erected on one surface of the main body portion Ra. In this embodiment, multiple types of legs Rb are provided (set appropriately to 1g, 2g, 3g, 5g, etc.) with different resin amounts (number of grams of the portion protruding from the erected surface of the main body portion Ra).

First, in the example of the sealing resin R shown in FIG. 16, all (or part) of the legs Rb are formed as convex bodies Rb1 to Rb4 arranged in a dot pattern. As an example, a leg Rb1 for placement (standing leg) is provided at the four corners of the main body Ra (or a position other than the four corners) to ensure a distance at which the main body Ra does not come into contact with the electronic component Wb. Also, a plurality of different types of legs Rb with different amounts of resin are provided at positions other than the four corners of the main body Ra (or the four corners). These are for removal (for adjusting the amount of resin) in the removal process described below, and specifically, a leg Rb2 with a resin amount of 1 g, a leg Rb3 with a resin amount of 2 g, and a leg Rb4 with a resin amount of 5 g are provided. Note that the above types are merely examples, and the amount of resin (in grams) and the number of legs provided are set appropriately. Additionally, the legs Rb2 to Rb4 to be removed can be easily removed if they are cylindrical, for example, but are not limited to this shape.

With the above-mentioned sealing resin R, the amount of resin in the sealing resin R can be adjusted by removing some of the legs Rb (the combination and number is appropriately set from Rb2 to Rb4) in the sealing resin R after tablet formation. Therefore, the appropriate amount of sealing resin R can be accurately prepared for each workpiece W and supplied for compression molding. In addition, the configuration in which the legs Rb are arranged in a columnar dotted pattern can prevent the sealing resin R placed on the workpiece W from flowing during compression molding. This can prevent wire drift and improve molding quality.

Next, in the example of sealing resin R shown in FIG. 17, part of the leg Rb is formed as a linearly arranged convex body Rb5. In this example, Rb1 and Rb5 are used as mounting (standing) legs that ensure a distance at which the main body Ra does not come into contact with the electronic component Wb. Note that the legs Rb2 to Rb4, which are used to adjust the amount of resin by removal, have the same configuration as the sealing resin R shown in FIG. 16.

The above-mentioned sealing resin R can be used to intentionally generate resin flow from the leg Rb5, which has a bank-like configuration of a certain length, to promote the filling of the sealing resin R into narrow areas in the work W (for example, between the substrate Wa and electronic component Wb that are flip-chip connected). This can therefore prevent gas from remaining in the molded product Wp, improving molding quality.

Next, the process after the tableting process will be described. After the tableting process, the tableting mold 102 is opened and the sealing resin R and the used film F are separated to enable the sealing resin R to be removed (see FIG. 15). In this embodiment, by including the lower mold film supply process and upper mold film supply process described above, the film F is placed on both the mold surface 106a of the lower mold 106 and the mold surface 104a of the upper mold 104, so that the sealing resin R formed by tableting can be easily released and damage due to the resin adhering to the mold can be prevented.

After or in parallel with the mold opening process, the lower mold film supply unit 111 and the upper mold film supply unit 113 are operated to send out the used film F from inside the tableting mold 102 and to send and set new film F into the tableting mold 102, thereby carrying out a film supply process (lower mold film supply process, upper mold film supply process).

Furthermore, after the mold opening process, a removal process is carried out to remove a part of the sealing resin R formed by the tableting process so that the sealing resin R is a "predetermined amount". Specifically, for each workpiece W to be sealed, the number of electronic components Wb mounted on one substrate Wa (the number of mounted or missing components, which may also include measuring the height of the electronic components Wb) is measured by a measuring mechanism or the like (not shown), and the control calculation unit 170 calculates the amount of resin (in grams) required for resin sealing (compression molding) by subtracting the total volume of the electronic components Wb from the volume of the cavities 208, 308 of the sealing molds 202, 302, and sets the "predetermined amount". Next, a part of the sealing resin R is removed using the removal mechanism 180 so that the set "predetermined amount" is reached (note that the control calculation unit 170 may control the operation of the removal mechanism 180, or the operator may operate the operation of the removal mechanism 180). At this time, in order to achieve the aforementioned "predetermined shape" (a shape that does not come into contact with the electronic component Wb), it is necessary not to remove some (for example, the four corners) of the legs Rb. Also, since removal is a prerequisite, it is necessary to form the sealing resin R by tableting using an amount of base resin Rm (set as the "initial setting amount") that is greater than (or equal to) the maximum amount expected for each workpiece W, while taking into account factors such as the loss rate of the electronic component Wb.

As a specific removal method, a part of the leg Rb (a part of multiple legs Rb, which may be the whole leg Rb or a part of the leg Rb) is removed using a removal tool provided in the removal mechanism 180. As described above, mechanical removal may be performed using, for example, a metal blade cutter, or thermal melt removal may be performed using a thermal melting cutter.

The legs Rb in this embodiment are formed with multiple types of resin with different amounts (for example, 1g, 2g, 3g, 5g, etc.), so that the work of removing the legs Rb can be performed quickly and easily to obtain a set, predetermined amount of sealing resin R. Note that, as an example, the legs Rb to be removed can be easily removed if they are cylindrical, but are not limited to this shape.

By carrying out the above steps, the amount of resin in the sealing resin R after tableting (forming) can be appropriately changed and fine-tuned. As a specific example, when the sealing resin R after tableting (forming) has the configuration (shape) shown in FIG. 16, if it is desired to reduce the amount of resin (total amount) of the sealing resin R by, for example, 8 g, it is sufficient to remove each of the legs Rb2 with a resin amount of 1 g, the legs Rb3 with a resin amount of 2 g, and the legs Rb4 with a resin amount of 5 g within the dashed line frame in FIG. 18 one by one (other combinations are also possible).

In this way, an appropriate amount (the "predetermined amount" mentioned above) of sealing resin R can be supplied to the workpiece W. This makes it possible to prevent molding defects caused by a shortage of the amount of resin required during resin sealing. Furthermore, it is possible to prevent waste caused by supplying an amount of resin that is greater than necessary.

It is preferable to use a powder resin as the base resin Rm. This allows the "predetermined amount" of resin to be adjusted and supplied with extremely high precision compared to when granular or crushed resin is used. However, it is not limited to powder resin.

In another embodiment, when the removal mechanism 180 is provided in the compression molding device 1, the above-mentioned removal process may be performed as one process of the compression molding method in the compression molding device 1 (before the resin sealing process).

As described above, the forming device 100 and forming method according to the present invention can appropriately change and fine-tune the amount of sealing resin R formed, so that the appropriate amount of sealing resin R can be accurately formed for each workpiece W.

Furthermore, by making the molding device 100 for the sealing resin R and the compression molding device 1 separate devices, the compression molding device 1 can be made unaffected by dust generated when the powder resin in the molding device 100 is tableted, and the compression molding device 1 can be easily placed in a clean room. Furthermore, by docking the molding device 100 for the sealing resin R and the compression molding device 1, data on a predetermined amount of resin obtained as a result of measuring each workpiece W supplied to the compression molding device 1 can be sent to the molding device 100, and a portion of the sealing resin R can be removed so that the amount becomes the predetermined amount. As described above, in one embodiment, the removal mechanism 180 is provided in the forming device 100, but in another embodiment, it may be provided in the compression molding device 1.

Furthermore, by using the sealing resin R formed by the forming device 100 and forming method, it is possible to realize a compression molding device 1 and a compression molding method that achieve the following effects. Specifically, the compression molding device 1 and the compression molding method can prevent molding defects caused by resin flow, uneven scattering, residual gas, and dust generation during molding. Furthermore, it is possible to form not only thin molded products Wp (thickness dimension less than 1 mm) but also thick molded products Wp (thickness dimension 1 mm or more). The upper limit of the thickness dimension depends on various setting conditions, but it is believed that it is possible to form a thickness of up to about 10 mm. Furthermore, handling during supply and setting is made easier.

Furthermore, the compression molding apparatus 1 and compression molding method can solve the problem that arises when a cavity is provided in the upper mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the upper mold, when performing a mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, the wire portion of the workpiece held in the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece, and is deformed or cut, making resin sealing difficult. This problem can be solved by adopting a configuration that uses the sealing resin R formed by the apparatus and method of this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

Specifically, during the mold closing process, the sealing resin R is heated and softened and melted, as shown in the transition from FIG. 3A to FIG. 3B. At this time, the resin (specifically, the main body portion Ra) comes into uniform contact with all of the wires (see FIG. 3B). This makes it possible to prevent the wires from being deformed or cut.

In addition, when the inventors of the present application actually conducted experiments in the above-mentioned compression molding device 1 using sealing resin R formed by the device and method of this embodiment, it was confirmed that deformation and breakage of the wire was prevented and molding quality was improved compared to a conventional compression molding device having a configuration in which a workpiece W is held in the upper die, a cavity is provided in the lower die, and sealing resin (specifically, granular resin) is supplied to the cavity.

On the other hand, the compression molding apparatus 1 and the compression molding method can also solve the problems that arise when a cavity is provided in the lower mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the lower mold, especially when granular resin is used as the sealing resin, the particle size and height (lamination thickness) of the sealing resin (granular resin) contained in the cavity are not uniform. Therefore, for example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity state), and when performing a mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in FIG. 19, depending on the position, there is a problem that the wire part of the workpiece held by the upper mold comes into strong (large) contact with the sealing resin (granular resin) and is deformed or cut. Furthermore, as shown in FIG. 20, there is a problem that a large resin flow occurs in the cavity, causing the wire part to be deformed or cut. This problem can be solved by adopting a configuration that uses sealing resin R formed by the device and method according to this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape that corresponds to the shape of the workpiece W.

Specifically, this is for the same reason as explained above with reference to Figures 3A and 3B, and is because during the mold closing process, the heating of the sealing resin R causes it to soften and melt, resulting in the resin (specifically, the main body portion Ra) being in uniform contact with all of the wires.

In addition, the compression molding device 1 shown in FIG. 21 can appropriately change and fine-tune the amount of sealing resin R after molding, preventing molding defects caused by an excess or deficiency of the amount of resin.

Second Embodiment
Next, a second embodiment of the present invention will be described. The forming apparatus 100 for the sealing resin R according to this embodiment has a basic configuration similar to that of the first embodiment described above, and the following description will focus on the differences. Fig. 22 is a plan view (schematic diagram) showing an example of the forming apparatus 100 according to this embodiment.

The forming device 100 includes a provisional molding section 101 that provisionally molds the base resin Rm to form the sealing resin (provisionally molded resin) R used in compression molding of the workpiece W. As an example, the "provisional molding" is "tabletting", and the provisional molding section 101 includes a press device 150. The configuration of the press device 150 is the same as that of the first embodiment described above. However, the "provisional molding" is not limited to "tabletting", and the provisional molding section 51 may include a device other than the press device 150 (not shown). In this embodiment, the configuration includes one provisional molding section 101, but the configuration may include multiple provisional molding sections 101 (not shown).

The forming device 100 also includes a measuring unit 190 that measures the sealing resin (preliminary molded resin) R. As one example, the measuring unit 190 includes a weight scale and is configured to measure the weight of the preliminarily molded resin R. As another example, the measuring unit 190 includes an image processing device and is configured to measure the shape of the preliminarily molded resin R.

The forming device 100 also includes a removal mechanism 180 that removes a portion of the sealing resin (temporary molding resin) R when the result of measurement in the measuring unit 190 indicates that the weight or shape is large compared to the "predetermined amount" (as in the first embodiment) required to seal the workpiece W. Note that a known transport device (loader, robot hand, etc.) can be used to move between the mechanisms (temporary molding unit 101, measuring unit 190, removal mechanism 180) (not shown).

As an example, the removal mechanism 180 can be configured similarly to the first embodiment described above.

Alternatively, as another example, the removal mechanism 180 can be configured to have a processing tool that processes the sealing resin (preliminary molded resin) R. Specifically, a known machining center (or a processing device similar thereto) can be used. With this configuration, it becomes possible to remove the difference from the "predetermined amount" with high precision.

In the above example, the measuring unit 190 and the removal mechanism 180 are provided in the forming device 100. Alternatively, as another example, the measuring unit 190 and the removal mechanism 180 may be provided in the compression molding device 1 (see FIG. 23).

Specifically, as shown in FIG. 23, the measuring section 190 and the removal mechanism 180 are provided in the supply unit 10A of the compression molding device 1. However, they may be provided in other units (not shown).

The press unit 10B of the compression molding device 1 also includes a final molding section 201 that seals the workpiece W using a provisionally molded sealing resin (provisionally molded resin) R to perform final molding. As an example, the final molding section 201 includes a press device 250. The configuration of the press device 250 is the same as that described above.

The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

Claims (18)

a temporary molding section for temporarily molding a base resin to form a temporary molded resin used for sealing the workpiece;
A measuring unit for measuring a weight or a shape of the provisionally molded resin;
and a removal mechanism that removes a portion of the pre-molded resin when the measurement result in the measuring unit is greater than the weight required to seal the work or is larger than the required shape. 2. The sealing resin forming apparatus according to claim 1, wherein the removing mechanism has a processing tool for processing the provisionally molded resin. A forming apparatus for tableting a base resin to form an encapsulating resin to be used in compression molding of a workpiece, comprising:
a tableting die that accommodates an initial setting amount of the base resin and tablets the base resin into the sealing resin having a predetermined shape corresponding to the shape of the workpiece;
and a removal mechanism for removing a portion of the sealing resin formed by tableting so that the amount of the sealing resin formed by tableting is a predetermined amount. As the workpiece, a workpiece having a configuration in which an electronic component is mounted on a substrate is used,
4. The sealing resin forming apparatus according to claim 3, wherein the predetermined shape is a shape that does not contact the electronic components when the sealing resin is placed on the base material. A control and calculation unit is provided for controlling the operation of the removal mechanism,
The sealing resin forming apparatus according to claim 4, characterized in that the control and calculation unit sets the predetermined amount by calculating the required amount of resin based on data measuring the presence or absence of the electronic components mounted on one of the substrates for each of the workpieces, and controls the operation of the removal mechanism so as to achieve the predetermined amount. the sealing resin has a plate-shaped or block-shaped main body and a plurality of legs provided upright on one surface of the main body,
5. The sealing resin forming apparatus according to claim 3, wherein the removing mechanism includes a remover for removing a part of the leg portion so as to obtain the predetermined amount. 7. The sealing resin forming apparatus according to claim 6, wherein the leg portions include a plurality of types of leg portions each having a different amount of resin. 5. The sealing resin forming apparatus according to claim 3, wherein the base resin is a powder resin. a final molding section that seals the workpiece with a provisionally molded resin that is provisionally molded using a base resin, and performs final molding;
A measuring unit for measuring a weight or a shape of the provisionally molded resin;
A compression molding apparatus characterized by having a removal mechanism that removes a portion of the pre-molded resin when the measurement result in the measuring unit is greater than the weight required to seal the work or is larger than the required shape. 10. The compression molding apparatus according to claim 9, wherein the removing mechanism has a processing tool for processing the provisionally molded resin. A compression molding apparatus that seals a workpiece with sealing resin to process it into a molded product,
A compression molding apparatus comprising a removal mechanism for removing a portion of the sealing resin formed by tableting so that the amount of the sealing resin is a predetermined amount. A method for forming an encapsulating resin for use in compression molding of a workpiece, comprising tableting a base resin, the method comprising:
a tableting step of putting an initial setting amount of the base resin into a tableting die and tableting the base resin to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece;
and a removing step of removing a portion of the sealing resin formed by tableting so that the amount of the sealing resin formed by tableting is a predetermined amount. As the workpiece, a workpiece having a configuration in which an electronic component is mounted on a substrate is used,
13. The method for forming a sealing resin according to claim 12, wherein the predetermined shape is a shape that does not contact the electronic component when the sealing resin is placed on the base material. The method for forming a sealing resin according to claim 13, characterized in that the removing process includes a process of setting the predetermined amount by calculating the amount of resin required based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces, and removing a portion of the sealing resin to achieve the predetermined amount. The tableting step includes a step of forming the sealing resin having a plate-like or block-like main body and a plurality of legs provided upright on one surface of the main body,
15. The method for forming a sealing resin according to claim 14, wherein the removing step includes a step of removing a part of the plurality of legs provided on the sealing resin. the tableting step includes a step of forming the sealing resin having a plurality of types of leg portions having different amounts of resin as the leg portions;
The method for forming a sealing resin according to claim 15, 14. The method for forming a sealing resin according to claim 12, wherein a powder resin is used as the base resin. The method for forming an encapsulating resin according to claim 12 or 13, characterized in that the tableting step is carried out at a temperature at which the base resin does not harden by heat, so that the encapsulating resin to be formed can be hardened by heat in a subsequent compression molding step.

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