WO2024179411A1 - 一种倒装led灯丝及led灯泡 - Google Patents
一种倒装led灯丝及led灯泡 Download PDFInfo
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- WO2024179411A1 WO2024179411A1 PCT/CN2024/078585 CN2024078585W WO2024179411A1 WO 2024179411 A1 WO2024179411 A1 WO 2024179411A1 CN 2024078585 W CN2024078585 W CN 2024078585W WO 2024179411 A1 WO2024179411 A1 WO 2024179411A1
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- Prior art keywords
- flip
- chip led
- light
- circuit board
- pad group
- Prior art date
Links
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- 239000003292 glue Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 4
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- 238000010586 diagram Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
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- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
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- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
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- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to the field of lighting, and in particular to an inverted LED filament and an LED bulb.
- LED bulbs tungsten filament lamps
- the shape of LED bulbs is similar to that of traditional incandescent lamps, and they use the existing traditional screw and socket connection methods, which are in line with people's habits of using light bulbs.
- an LED bulb in the prior art, includes a connection base 100, an LED filament 110, and a pin 120.
- the LED filament 110 is a structure connected at both ends, so when the LED filament 110 is vertically arranged, the LED filament 110 needs to be electrically connected to the base 100 at both ends through the pin 120.
- the pin 120 will be blocked on one side of the LED filament 110. Since the LED filament 110 can illuminate in all directions, the pin 120 will block the light generated by the LED filament 110, causing a local dark area, reducing the lighting angle of the LED filament 110, and making the lighting brightness uneven, thereby affecting the lighting effect.
- the present invention aims to solve at least one of the technical problems existing in the prior art.
- the present invention provides an inverted LED filament and an LED bulb, which can prevent the light generated by the inverted LED light-emitting element from being blocked by the pins, so that the lighting brightness is uniform and the lighting effect is improved.
- a flip-chip LED filament comprises: a circuit board, on which a conductive layer is arranged; a plurality of flip-chip LED light-emitting components, the circuit board is provided with a strip portion, the flip-chip LED light-emitting components are arranged on the strip portion, and the flip-chip LED light-emitting components are all electrically connected to the conductive layer; a soldering pad group, the soldering pad group is arranged on the circuit board and is located on the same side end of the strip portion, the soldering pad group is electrically connected to the conductive layer, and the soldering pad group can be connected to a connection socket of an external LED bulb.
- the same side wall surface of the flip-chip LED light emitting element is provided with a first An electrode and a second electrode
- the conductive layer includes at least two line parts
- a gap is arranged between the line parts
- the first electrode and the second electrode are respectively connected to two different line parts.
- a fluorescent glue layer is further provided on the circuit board, wherein the fluorescent glue layer surrounds the strip portion and covers the flip-chip LED light-emitting component.
- a protective member is further included, wherein the protective member is disposed on the circuit board and surrounds a connection between the pad group and an external pin.
- the circuit board is made of a light-transmitting material.
- a rectifier unit is further included on the circuit board, and a plurality of the flip-chip LED light-emitting components are connected in series, in parallel, or in series and parallel to form a light-emitting circuit.
- the input end of the rectifier unit is electrically connected to the pad group through the conductive layer, and the output end of the rectifier unit is electrically connected to the light-emitting circuit through the conductive layer.
- the rectifying unit comprises a rectifying bridge, an input end of the rectifying bridge is electrically connected to the pad group, and an output end of the rectifying bridge is electrically connected to the light-emitting circuit.
- At least two strip-shaped portions are provided on the circuit board.
- the LED bulb comprises: the above-mentioned flip-chip LED filament, pins, a connecting socket and a light-transmitting cover, the pad group is connected to the connecting socket through the pins, the light-transmitting cover is connected to the connecting socket to form a protective cavity for accommodating the flip-chip LED filament, and the connecting socket can be connected to an external lamp socket.
- connection socket is provided with a threaded portion for connecting with an external lamp socket.
- the flip-chip LED light-emitting component is arranged on the strip portion of the circuit board, and the pad group is located on the same side end of the strip portion.
- the present application also provides an LED bulb, which forms a protective cavity for accommodating the LED filament by connecting the light-transmitting cover with the connecting seat, and this structure is conducive to preventing external objects from colliding with the LED filament and avoiding damage to the filament.
- the pad group of the strip circuit board can be connected to the connecting seat through pins, and the pad group is located on the same side end of the strip part, which can prevent the light generated by the flip-chip LED light-emitting element on the strip part from being blocked by the pins, which is conducive to making the lighting brightness more uniform and improving the lighting effect.
- FIG1 is a schematic diagram of a conventional LED light bulb
- FIG2 is a schematic diagram of an LED bulb in one embodiment of the present invention.
- FIG3 is a schematic diagram of an LED filament in one embodiment of the present invention.
- FIG4 is a cross-sectional view of an LED filament in one embodiment of the present invention.
- FIG5 is an enlarged schematic diagram of point A in FIG4 ;
- FIG6 is a schematic diagram of an LED filament in another embodiment of the present invention.
- FIG7 is a circuit diagram of an LED filament in another embodiment of the present invention.
- FIG. 8 is a schematic diagram of an LED filament in another embodiment of the present invention.
- orientations such as up, down, front, back, left, right, etc.
- orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
- a flip-chip LED filament includes: a circuit board 200, on which a conductive layer 210 is disposed; a plurality of flip-chip LED light-emitting components 310, the circuit board 200 being provided with a strip portion 201, on which the flip-chip LED light-emitting components 310 are disposed, and all of the flip-chip LED light-emitting components 310 are electrically connected to the conductive layer 210; a pad group 220, which is disposed on the circuit board 200 and located on the same side end of the strip portion 201, the pad group 220 is electrically connected to the conductive layer 210, and the pad group 220 can be connected to an external pin 600.
- the flip-chip LED light-emitting component 310 is set on the strip portion 201 of the circuit board 200, and the pad group 220 is located on the same side end of the strip portion 201. With this structure, when the pad group 220 is connected to the connecting socket 800 of the external LED bulb through the external pin 600, it can prevent the pin 600 from blocking the light generated by the flip-chip LED light-emitting component 310, making the lighting brightness more uniform and improving the lighting effect.
- a first electrode 311 and a second electrode 312 are disposed on the same side wall of a flip-chip LED light emitting element 310, a conductive layer 210 includes at least two circuit portions 211, a gap is disposed between the circuit portions 211, and the first electrode 311 and the second electrode 312 are respectively connected to two different The line units 211 are connected.
- the first electrode 311 and the second electrode 312 of the flip-chip LED light-emitting component 310 are both located on the same side wall, when the flip-chip LED light-emitting component is welded to the conductive layer 210, the first electrode 311 and the second electrode 312 can be directly welded to the circuit portion 211 without being connected through a wire, thereby avoiding wire breakage and improving reliability.
- a fluorescent glue layer 400 is further provided on the circuit board 200 , and the fluorescent glue layer 400 surrounds the strip portion 201 and covers the flip-chip LED light-emitting element 310 .
- the flip-chip LED light-emitting component 310 can be protected from damage.
- fluorescent glue layers 400 of different colors the lighting color can be changed, which is helpful to meet usage requirements and improve lighting effects.
- a protection member 500 is further included.
- the protection member 500 is disposed on the circuit board 200 and surrounds the connection between the pad group 220 and the pin 600 .
- a protective member 500 is provided to surround the connection between the pad group 220 and the pin 600, which is beneficial to protecting the pad group 220, avoiding separation of the pad group 220 and the pin 600, and improving the reliability of the structure.
- the circuit board 200 is made of a light-transmitting material. This allows the light generated by the flip-chip LED light-emitting element 310 to pass through the circuit board 200 and be emitted from the back of the circuit board 200, which is conducive to achieving an all-round lighting effect.
- the transparent material can be a light-transmitting material such as aluminum oxide ceramics.
- a rectifier unit 700 is further included which is disposed on a circuit board 200 , and a plurality of flip-chip LED light-emitting components 310 are connected in series, in parallel, or in series and in parallel to form a light-emitting circuit 300 , an input end of the rectifier unit 700 is electrically connected to a pad group 220 through a conductive layer 210 , and an output end of the rectifier unit 700 is electrically connected to the light-emitting circuit 300 through a conductive layer 210 .
- the flip-chip LED light emitting element 310 Due to the unidirectional conduction characteristics of the flip-chip LED light emitting element 310, a direct current is required to work normally.
- the AC power is converted into DC power through the rectifier unit 700 and then transmitted to the flip-chip LED light-emitting component 310, so that the flip-chip LED light-emitting component 310 can work normally, so that the LED filament can be used when the external power supply inputs AC power, meeting different usage environments.
- the rectifying unit 700 includes a rectifying bridge, an input end of the rectifying bridge is electrically connected to the pad group 220 , and an output end of the rectifying bridge is electrically connected to the light emitting circuit 300 .
- the input AC power is rectified by a rectifier bridge, which has a simple structure and is easy to implement.
- the rectifier bridge can be composed of four ordinary diodes or light-emitting diodes.
- the rectifying unit 700 may also be a device or circuit including a switching power supply chip, an AC-to-DC chip, etc., which can achieve a rectifying effect.
- At least two strip portions 201 are disposed on the circuit board 200 .
- the strip-shaped light-emitting element formed by the strips 201 and the flip-chip LED light-emitting element 310 is an omnidirectional light source, the shielding between the strips 201 will not cause the overall lighting effect to have a dark area problem.
- an LED bulb according to an embodiment of the second aspect of the present invention includes: the above-mentioned flip-chip LED filament, pins 600 , a connecting socket 800 and a light-transmitting cover 900 , the pad group 220 is connected to the connecting socket 800 through the pins 600 , and the light-transmitting cover 900 is connected to the connecting socket 800 to form a protective cavity for accommodating the circuit board 200 .
- the light-transmitting cover 900 is connected to the connection base 800 to form a protective cavity for accommodating the LED filament, and this structure is conducive to preventing external objects from colliding with the LED filament and avoiding damage to the filament.
- the pad group 220 of the strip circuit board can be connected to the connection base 800 through the pin 600, and the pad group 220 is located on the same side end of the strip portion 201, which can prevent the light generated by the flip-chip LED light-emitting element 310 on the strip portion 201 from being blocked by the pin 600, which is conducive to making the lighting brightness more uniform and improving the lighting effect.
- connection base 800 is provided with a connection for connecting with an external lamp holder.
- the threaded portion 801 of the connection is provided with a connection for connecting with an external lamp holder.
- connection base 800 is threadedly connected to the external lamp holder through the threaded portion 801, which is convenient for assembly and disassembly, has a simple structure, and conforms to the usage habits of traditional light bulbs, making it more convenient to use.
- the connection base 800 can also be detachably connected to the external lamp holder through a common clamping structure.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
一种倒装LED灯丝及LED灯泡,包括:线路板(200)、多个倒装LED发光件(310)、焊盘组(220);通过倒装LED发光件(310)设置在线路板(200)的条形部(201)上,并且焊盘组(220)位于条形部(201)的同一侧端部上,以此结构,使得焊盘组(220)通过外部引脚(600)连接以与外部LED灯泡的连接座(800)连接时,能够防止引脚遮挡倒装LED发光件(310)产生的光线,令照明亮度更加均匀,提高照明效果。
Description
本发明涉及照明领域,特别涉及一种倒装LED灯丝及LED灯泡。
随着照明技术的发展,传统的白炽灯(钨丝灯)由于耗能高、使用寿命短,因而逐渐被淘汰,取而代之的是LED灯泡,LED灯泡形状与传统的白炽灯相似,并且采用现有传统的螺口、插口的连接方式,符合人们使用灯泡的习惯。
然而,参考图1,在现有技术中,LED灯泡包括连接底座100、LED灯丝110以及引脚120,LED灯丝110为两端连接的结构,导致LED灯丝110竖直设置时,LED灯丝110的需要通过引脚120实现LED灯丝110的两端与底座100电性连接,这种结构引脚120会遮挡在LED灯丝110的一侧,由于LED灯丝110能够全方位照明,导致引脚120遮挡LED灯丝110产生的光线,造成局部暗域,令LED灯丝110的照明角度减小,照明亮度不均匀,影响照明效果。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此,本发明提出一种倒装LED灯丝及LED灯泡,其能够防止倒装LED发光件产生的光线被引脚遮挡,使得照明亮度均匀,提高照明效果。
根据本发明的第一方面实施例的一种倒装LED灯丝,包括:线路板,所述线路板上设置有导电层;多个倒装LED发光件,所述线路板设置有条形部,所述倒装LED发光件设置在所述条形部上,所述倒装LED发光件均与所述导电层电性连接;焊盘组,所述焊盘组设置在所述线路板上并且位于所述条形部的同一侧端部上,所述焊盘组与所述导电层电性连接,所述焊盘组能够与外部LED灯泡的连接座连接。
根据本发明的一些实施例,所述倒装LED发光件的同一侧壁面上设置有第
一电极以及第二电极,所述导电层包括有至少两个线路部,所述线路部之间设置有间隙,所述第一电极以及所述第二电极分别与不同的两个所述线路部连接。
根据本发明的一些实施例,还包括设置在所述线路板上的荧光胶层,所述荧光胶层包围所述条形部并且覆盖所述倒装LED发光件上。
根据本发明的一些实施例,还包括保护件,所述保护件设置在所述线路板上并且所述保护件包围所述焊盘组与外部引脚的连接处。
根据本发明的一些实施例,所述线路板由透光材质制成。
根据本发明的一些实施例,还包括设置在所述线路板上的整流单元,多个所述倒装LED发光件串联、并联或串并联形成发光电路,所述整流单元的输入端通过所述导电层与所述焊盘组电性连接,所述整流单元的输出端通过所述导电层与所述发光电路电性连接。
根据本发明的一些实施例,所述整流单元包括整流桥,所述整流桥的输入端与所述焊盘组电性连接,所述整流桥的输出端与所述发光电路电性连接。
根据本发明的一些实施例,所述线路板上至少设置有两个所述条形部。
根据本发明第二方面实施例的LED灯泡,包括:上述的一种倒装LED灯丝、引脚、连接座以及透光罩,所述焊盘组通过所述引脚与所述连接座连接,所述透光罩与所述连接座连接以形成容置所述一种倒装LED灯丝的保护腔,所述连接座能够与外部灯座连接。
根据本发明的一些实施例,所述连接座上设置有用于与外部灯座连接的螺纹部。
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。
本发明的有益效果在于:
1.通过倒装LED发光件设置在线路板的条形部上,并且焊盘组位于条形部的同一侧端部上,以此结构,使得焊盘组通过外部引脚与外部LED灯泡的连接座连接时,能够防止引脚遮挡倒装LED发光件产生的光线,令照明亮度更加均匀,提高照明效果。
2.另外本申请还提供一种LED灯泡,通过透光罩与连接座连接形成容置LED灯丝的保护腔,以此结构有利于防止外部物体与LED灯丝碰撞,避免灯丝损坏。另外,条形电路板的焊盘组能够通过引脚与连接座连接,并且焊盘组位于条形部的同一侧端部上,能够防止条形部上的倒装LED发光件产生的光线被引脚遮挡,有利于令照明亮度更加均匀,提高照明效果。
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:
图1为传统中LED灯泡的示意图;
图2为本发明其中一种实施例中LED灯泡的示意图;
图3为本发明其中一种实施例中LED灯丝的示意图;
图4为本发明其中一种实施例中LED灯丝的截面图;
图5为图4中A处的放大示意图;
图6为本发明另一种实施例中LED灯丝的示意图;
图7为本发明另一种实施例中LED灯丝的电路图;
图8为本发明又一种实施例中LED灯丝的示意图。
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自
始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。
在本发明的描述中,需要理解的是,涉及到方位描述,例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
在本发明的描述中,如果有描述到第一、第二只是用于区分技术特征为目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本发明的描述中,除非另有明确的限定,设置、安装、连接等词语应做广义理解,所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。
如图2至图4、图7以及图9所示,根据本发明实施例的一种倒装LED灯丝,包括:线路板200,线路板200上设置有导电层210;多个倒装LED发光件310,线路板200设置有条形部201,倒装LED发光件310设置在条形部201上,倒装LED发光件310均与导电层210电性连接;焊盘组220,焊盘组220设置在线路板200上并且位于条形部201的同一侧端部上,焊盘组220与导电层210电性连接,焊盘组220能够与外部引脚600连接。
通过倒装LED发光件310设置在线路板200的条形部201上,并且焊盘组220位于条形部201的同一侧端部上,以此结构,使得焊盘组220通过外部引脚600与外部LED灯泡的连接座800连接时,能够防止引脚600遮挡倒装LED发光件310产生的光线,令照明亮度更加均匀,提高照明效果。
参照图6,在本发明的一些实施例中,倒装LED发光件310的同一侧壁面上设置有第一电极311以及第二电极312,导电层210包括有至少两个线路部211,线路部211之间设置有间隙,第一电极311以及第二电极312分别与不同的两
个线路部211连接。
使用倒装LED发光件310如倒装LED芯片等器件,由于倒装LED发光件310的第一电极311以及第二电极312均位于同一侧壁面上,使得倒装LED发光件与导电层210焊接时,第一电极311与第二电极312能够直接与线路部211焊接,无需通过导线连接,能够避免出现导线断裂的情况,有利于提高可靠性。
参照图2至图7和图9,在本发明的一些实施例中,还包括设置在线路板200上的荧光胶层400,荧光胶层400包围条形部201并且覆盖倒装LED发光件310上。
通过设置有荧光胶层400覆盖在倒装LED发光件310上,能够保护倒装LED发光件310避免损坏,同时通过设置不同颜色的荧光胶层400能够改变照明颜色,有利于满足使用需求,提高照明效果。
参照图3和图4,在本发明的一些实施例中,还包括保护件500,保护件500设置在线路板200上并且保护件500包围焊盘组220与引脚600的连接处。
焊盘组220与外部引脚600焊接后,通过设置有保护件500包围在焊盘组220与引脚600的连接处,有利于保护焊盘组220,避免焊盘组220与引脚600分离,提高结构的可靠性。
在本发明的一些实施例中,线路板200由透光材质制成。以此使得倒装LED发光件310产生的光线能够透过线路板200从线路板200的背面射出,有利于实现全方位发光的照明效果。透明材质可以为三氧化二铝陶瓷等能够透光的材料。
参照图8,在本发明的一些实施例中,还包括设置在线路板200上的整流单元700,多个倒装LED发光件310串联、并联或串并联形成发光电路300,整流单元700的输入端通过导电层210与焊盘组220电性连接,整流单元700的输出端通过导电层210与发光电路300电性连接。
由于倒装LED发光件310的单向导通特性,需要提供直流电以正常工作,
当外部电源输入交流电时,通过整流单元700将交流电转换为直流电后传输至倒装LED发光件310,令倒装LED发光件310能够正常工作,以此令LED灯丝能够在外部电源输入交流电的情况下使用,满足不同的使用环境。
参照图8,在本发明的一些实施例中,整流单元700包括整流桥,整流桥的输入端与焊盘组220电性连接,整流桥的输出端与发光电路300电性连接。
通过整流桥对输入的交流电进行整流,结构简单,容易实现。整流桥可以是由四个普通二极管构成,亦可以是由发光二极管构成。
整流单元700还可以是包括开关电源芯片、交流转直流芯片等能够实现整流效果的器件或电路。
参照图9,在本发明的一些实施例中,线路板200上至少设置有两个条形部201。
通过设置有多条条形部201,能够设置数量更多的倒装LED发光件310,进而提高整体的照明亮度,满足使用需求。由于条形部201配合倒装LED发光件310形成的条状发光部为全方位发光光源,条形部201之间遮挡不会导致整体照明效果存在暗域的问题。
参照图2,根据本发明第二方面实施例的LED灯泡,包括:上述的一种倒装LED灯丝、引脚600、连接座800以及透光罩900,焊盘组220通过引脚600与连接座800连接,透光罩900与连接座800连接以形成容置线路板200的保护腔。
通过透光罩900与连接座800连接形成容置LED灯丝的保护腔,以此结构有利于防止外部物体与LED灯丝碰撞,避免灯丝损坏。另外,条形电路板的焊盘组220能够通过引脚600与连接座800连接,并且焊盘组220位于条形部201的同一侧端部上,能够防止条形部201上的倒装LED发光件310产生的光线被引脚600遮挡,有利于令照明亮度更加均匀,提高照明效果。
参照图2,在本发明的一些实施例中,连接座800上设置有用于与外部灯座
连接的螺纹部801。
连接座800通过螺纹部801与外部灯座螺纹连接,方便拆装,结构简单,并且符合传统灯泡的使用习惯,令使用更加便捷。连接座800亦可以是通过常见的卡接结构与外部灯座可拆卸地连接。
以上实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
当然,本发明创造并不局限于上述实施方式,熟悉本领域的技术人员在不违背本发明精神的前提下还可作出等同变形或替换,这些等同的变型或替换均包含在本申请权利要求所限定的范围内。
Claims (10)
- 一种倒装LED灯丝,其特征在于,包括:线路板(200),所述线路板(200)上设置有导电层(210);多个倒装LED发光件(310),所述线路板(200)设置有条形部(201),所述倒装LED发光件(310)设置在所述条形部(201)上,所述倒装LED发光件(310)均与所述导电层(210)电性连接;焊盘组(220),所述焊盘组(220)设置在所述线路板(200)上并且位于所述条形部(201)的同一侧端部上,所述焊盘组(220)与所述导电层(210)电性连接,所述焊盘组(220)能够与外部引脚(600)连接。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:所述倒装LED发光件(310)的同一侧壁面上设置有第一电极(311)以及第二电极(312),所述导电层(210)包括有至少两个线路部(211),所述线路部(211)之间设置有间隙,所述第一电极(311)以及所述第二电极(312)分别与不同的两个所述线路部(211)连接。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:还包括设置在所述线路板(200)上的荧光胶层(400),所述荧光胶层(400)包围所述条形部(201)并且覆盖所述倒装LED发光件(310)上。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:还包括保护件(500),所述保护件(500)设置在所述线路板(200)上并且所述保护件(500)包围所述焊盘组(220)与外部引脚(600)的连接处。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:所述线路板(200)由透光材质制成。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:还包括设置在所述线路板(200)上的整流单元(700),多个所述倒装LED发光件(310)串联、并联或串并联形成发光电路(300),所述整流单元(700)的输入端通过所述导电层 (210)与所述焊盘组(220)电性连接,所述整流单元(700)的输出端通过所述导电层(210)与所述发光电路(300)电性连接。
- 根据权利要求6所述的一种倒装LED灯丝,其特征在于:所述整流单元(700)包括整流桥,所述整流桥的输入端与所述焊盘组(220)电性连接,所述整流桥的输出端与所述发光电路(300)电性连接。
- 根据权利要求1所述的一种倒装LED灯丝,其特征在于:所述线路板(200)上至少设置有两个所述条形部(201)。
- LED灯泡,其特征在于,包括:如权利要求1所述的一种倒装LED灯丝、引脚(600)、连接座(800)以及透光罩(900),所述焊盘组(220)通过所述引脚(600)与所述连接座(800)连接,所述透光罩(900)与所述连接座(800)连接以形成容置所述一种倒装LED灯丝的保护腔,所述连接座(800)能够与外部灯座连接。
- 根据权利要求9所述的LED灯泡,其特征在于:所述连接座(800)上设置有用于与外部灯座连接的螺纹部(801)。
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CN215674822U (zh) * | 2021-09-03 | 2022-01-28 | 东莞市鑫永航科技有限公司 | 一种伸缩式全方位led灯芯 |
US20220158050A1 (en) * | 2020-11-14 | 2022-05-19 | Hangzhou Hangke Optoelectronics Co., Ltd. | Omnidirectional led light wire and packaging method thereof, light source and lamp |
US20230213154A1 (en) * | 2023-02-27 | 2023-07-06 | James Lee | Inverted LED filament and LED bulb having same |
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CN213272093U (zh) * | 2020-08-26 | 2021-05-25 | 项腾亮 | 一种倒装led灯丝及led灯泡 |
US20220158050A1 (en) * | 2020-11-14 | 2022-05-19 | Hangzhou Hangke Optoelectronics Co., Ltd. | Omnidirectional led light wire and packaging method thereof, light source and lamp |
CN215674822U (zh) * | 2021-09-03 | 2022-01-28 | 东莞市鑫永航科技有限公司 | 一种伸缩式全方位led灯芯 |
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