WO2024154087A1

WO2024154087A1 - Cable connector assembly with power bay and strain relief

Info

Publication number: WO2024154087A1
Application number: PCT/IB2024/050493
Authority: WO
Inventors: Victor Geronimo CORPUZ; Brett TALTON; Timothy Kurt IBARRA
Original assignee: Molex LLC
Current assignee: Molex LLC
Priority date: 2023-01-20
Filing date: 2024-01-18
Publication date: 2024-07-25
Anticipated expiration: 2025-07-20
Also published as: CN120604405A; TWI907935B; TW202437603A

Abstract

A receptacle connector is described that includes signal and power wafer assemblies. The connector includes a first power cable having a distal end and a termination end, the first power cable being coupled to a first power terminal of the first power wafer assembly, and a second power cable having a distal end and a termination end, the second power cable being coupled to a second power terminal of the second power wafer assembly. A first and second crimp ring are positioned on the termination end of the first and second power cable, respectively. A first overmold housing is positioned over the termination end of the first power cable, where the first crimp ring is encapsulated by the first overmold housing, and a second overmold housing is positioned over the termination end of the second power cable, where the second crimp ring is encapsulated by the second overmold housing.

Description

CABLE CONNECTOR ASSEMBLY WITH POWER BAY AND STRAIN RELIEF

RELATED APPLICATION

[0001] This patent application claims the benefit of United States Provisional Patent Application No. 63/440,136, filed January 20, 2023, which is incorporated by reference in its entirety.

BACKGROUND

[0002] The amount of data processed by computers, computing systems, and computing environments continues to increase. For example, data centers can include hundreds of computing and networking systems interconnected using copper cables, optical cables, and various connectors, cable assemblies, and related terminations between them. The data throughput of these interconnects is high and increasing. A range of cable and connector assemblies are available to facilitate the data interconnect applications, such as board-to- board, wire-to-wire, and wire-to-board applications. An example wire-to-board connector assembly includes a free-end connector that is attached to one or more wires or cables and a fixed-end connector that is attached to a board. A wide range of suitable designs exist for each type of data interconnect application, depending on the requirements and the environment in which the cable and connector assemblies are used.

[0003] For applications where high data rates are needed and physical space is restricted, competing concerns make the design of cable and connector assemblies more challenging. High data rate applications often rely upon differentially coupled signal pairs in which two conductors are electrically coupled and physically arranged in pairs to transmit a differential signal. Differential signaling provides greater resistance to spurious signals and electronic crosstalk, among other benefits, and preferably maintains sufficient signal spacing to avoid inadvertent signaling modes with adjacent signals pairs. In the connector interface, ground terminals can be added to create a return path to electrical ground and to provide shielding between differential pairs. [0004] Cable and connector assemblies are typically designed to meet both mechanical and electrical requirements. High speed or high data rate electrical connectors are often used, for example, in backplane applications that require very high conductor density and high data rates. To achieve the desired mechanical and electrical requirements, such connectors often incorporate a plurality of wafer assemblies including an insulative web that supports a plurality of electrically conductive terminals. The use of wafer assemblies is often desirable to create a structure capable of achieving the desired high data rate that is also robust enough to support the desired assembly processes.

TECHNICAL FIELD

[0005] This disclosure relates to the field of input/ output (IO) connectors and, more specifically, to IO connectors suitable for use in high data rate applications.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, with emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0007] FIG. 1 is a top perspective view of a receptacle connector in accordance with various embodiments of the present disclosure.

[0008] FIG. 2 is a bottom perspective view of the receptacle connector in accordance with various embodiments of the present disclosure.

[0009] FIG. 3 is a top perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure. [0010] FIG. 4 is a side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure. [0011] FIG. 5 is a top perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure. [0012] FIG. 6 is a side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure. [0013] FIG. 7 is a side elevation view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure. [0014] FIG. 8 is an enlarged perspective view of a crimp ring and a power cable in accordance with various embodiments of the present disclosure.

[0015] FIG. 9 is a top plan view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure.

[0016] FIG. 10 is an enlarged top plan view of a portion of FIG. 9 in accordance with various embodiments of the present disclosure.

[0017] FIG. 11 is an enlarged side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure.

[0018] FIG. 12 is another enlarged side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure.

[0019] FIG. 13 is another enlarged side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure.

[0020] FIG. 14 is another enlarged side perspective view of the receptacle connector with outer housing components not shown in accordance with various embodiments of the present disclosure.

[0021] FIG. 15 is a series of sequential modifications of a power wire to form an arrangement of various components of the receptacle connector in accordance with various embodiments of the present disclosure.

DETAILED DESCRIPTION

[0022] Various embodiments are described for a connector assembly having power and strain relief, as well as associated methods, apparatuses, and the like. As mentioned above, the amount of data processed by computers, computing systems, and computing environments continues to increase. For example, data centers can include hundreds of computing and networking systems interconnected using optical cables, copper cables, and various connectors, cable assemblies, and terminations between them. The data throughput of these interconnects is high and increasing.

[0023] As examples, many data centers incorporate a combination of 10 Gigabit Ethernet (lOGbE), 25 GbE, 50 GbE, and 100 GbE network interfaces and interconnects. 200 GbE, 400 GbE, and 800 GbE interconnection technology is also being developed and deployed. Other interconnection solutions rely upon 56 Gigabit per second (Gb/s) and 112 Gb/s network interfaces and interconnects, and 224 Gb/s interconnection technology is being developed. A range of cable assemblies are available for data interconnects. A variety of designs exist for each cable assembly, depending on the requirements of the data communications environment in which the connectors are used.

[0024] An example wire-to-board connector assembly includes a free-end connector that is attached to one or more wires or cables and a fixed-end connector that is attached to a circuit board or like substrate. When inserted into the fixed-end connector, the free-end and fixed- end connectors can exert forces upon each other, and the housings of both the fixed-end and the free-end connectors may experience a range of forces and stresses. Additionally, depending upon the type (e.g., gauge, size, weight, and so forth) and manner in which cables or wires are coupled to a free-end connector, the cables or wires may inadvertently act as a type of lever, presenting certain forces on the free-end connector and, in some cases, the fixed-end connector. Over time, such forces can cause the connectors and connector housings to bend, deform, and possibly crack or break at certain locations.

[0025] Any loss of structural integrity due to damage in connector housings, whether that of a plug connector or a receptacle connector, may translate to loss of signal coupling integrity through the associated connector. The housing is thereby intended to support wafer assemblies in a precise and controlled manner by design. Thus, damage to or deformation of a connector housing may result in the application of unwanted, undesirable, and unexpected forces being presented on wafer assemblies within the housings, which can result in an unexpected and unwanted loss of signal coupling integrity.

[0026] In the context outlined above, a receptacle connector is described that addresses potential stress points in a wire-to-board connector while providing various improvements over existing connectors. The receptacle connector includes a first power wafer assembly and a second power wafer assembly, among other potential wafer assemblies. A first power cable has a distal end and a termination end. The first power cable is coupled to a first power terminal of the first power wafer assembly, where a first crimp ring is positioned on the termination end of the first power cable. A second power cable has a distal end and a termination end. The second power cable is coupled to a second power terminal of the second power wafer assembly, where a second crimp ring is positioned on the termination end of the second power cable. A first power cable housing is positioned over the termination end of the first power cable, where the first crimp ring is encapsulated by the first power cable housing. Similarly, a second power cable housing is positioned over the termination end of the second power cable, where the second crimp ring is encapsulated by the second power cable housing.

[0027] The first power cable housing may be positioned vertically over the second power cable housing in a stacked arrangement. Each of the first power cable housing and the second power cable housing may include a plurality of interlocking components configured to engage with corresponding interlocking features of one of the first and second power wafer assemblies, or an intermediary body positioned therebetween. The second power cable housing may include a ridge projecting from a top surface thereof that is configured to be positioned in a recess on a bottom surface of the first power cable housing. Each of the first power cable housing and the second power cable housing may be overmolded onto the first power cable and the second power cable, for instance, via low-pressure overmolding, injection molding, or other suitable molding process.

[0028] In some embodiments, the receptacle connector further includes a first signal wafer assembly and a second signal wafer assembly separate from one another. Each of the first signal wafer assembly and the second signal wafer assembly may include terminals configured to engage with corresponding terminals of a plug connector. The receptacle connector may further include a first cable collection coupled to the first terminal wafer and a second cable collection coupled to the second terminal wafer.

[0029] The first cable collection may include first cables, and the second cable collection may include second cables. The first cables may be high-speed data cables, and the second cables may be low-speed data cables, for example. The first cables may include a bend at a termination end thereof, and the second cables may similarly include a bend at a termination end thereof. Thus, a termination portion of the first cables before the bend may be at a first height relative to a bottom surface of the receptacle connector, and a distal portion of the first cables after the bend may be at a second height different than the first height. Likewise, a termination portion of the second cables before the bend may be at a first height relative to a bottom surface of the receptacle connector, and a distal portion of the second cables after the bend may be at a second height different than the first height.

[0030] A wall may be positioned between the power wafer assemblies and the signal wafer assemblies. The wall may be formed of a material and/or having dimensions suitable for reducing or preventing electromagnetic interference between the first power wafer and the second power wafer, and between the first terminal wafer and the second terminal wafer. Additionally, the receptacle connector may include one or more wire support organizers having apertures through which the first cables and the second cables are positioned. At least one of the first power cable and the second power cable may be coupled to a power terminal of a respective power wafer via ultrasonic welding or soldering in one example.

[0031] The first power wafer assembly and the second power wafer assembly may be offset from one another in a horizontal plane, a vertical plane, or in both a horizontal plane and in a vertical plane. Similarly, the first signal wafer assembly and the second signal wafer assembly may be offset from one another in a horizontal plane, a vertical plane, or in both a horizontal plane and a vertical plane. The receptacle connector may further include a first stiffener positioned on an outer side of the first signal terminal assembly towards a rear of the receptacle connector, and a second stiffener positioned on an outer side of the second signal terminal assembly towards a front of the receptacle connector.

[0032] In some embodiments, the receptacle connector further includes cable alignment blocks, where each of the cable alignment blocks includes a generally rectangular body extending horizontally along a body of the receptacle connector. The cable alignment blocks may include apertures that align with those of the overmold organizer that retain at least one of the first cable collection and the second cable collection in a bended form.

[0033] In some aspects, a method is described that includes providing a power cable and cutting the first power cable to a predetermined length, crimping a crimp ring onto a jacket of the power cable, forming a power cable housing over the power cable as crimped through low-pressure overmolding, stripping the power cable to expose a plurality of conductors of the power cable, and terminating the power cable as crimped and overmolded to a power terminal of a power wafer assembly via ultrasonic welding, soldering, and other suitable connection method.

[0034] Turning now to the drawings, FIG. 1 shows a top perspective view of a receptacle connector 100 and FIG. 2 shows a bottom perspective view of the receptacle connector 100 according to various embodiments of the present disclosure. Referring to FIGS. 1 and 2 collectively, the receptacle connector 100 may generally include a housing 103, a top cover 106, and an overmold organizer 109 (also referred to as a “wire support organizer”) according to various embodiments. The receptacle connector 100 may further include a clip assembly 112 that may facilitate in securing the receptacle connector 100 to a plug connector (not shown), where the plug connector may be mounted on or otherwise communicatively coupled to a circuit board or other substrate. For instance, the clip assembly 112 may facilitate locking to or unlocking the receptacle connector 100 from a plug connector mounted on a circuit board.

[0035] The housing 103 may contain one or more signal wafer assemblies 115a, 115b (collectively “signal wafer assemblies 115”) and power wafer assemblies 117a, 117b (collectively “power wafer assemblies 117”) having a multitude of terminals therein, where terminating ends of various terminals of the wafer assemblies 115, 117 are shown in FIG. 2. In the depicted implementation, the signal wafer assemblies 115 are in a common row in alignment with the power wafer assemblies 117, but are spaced apart from one another, as will be further described. The top cover 106 may further retain (or apply downward pressure on) the wafer assemblies 115, 117, providing a tight arrangement of the wafer assemblies 115, 117 as well as other components of the receptacle connector 100, as will be described. [0036] Further, the receptacle connector 100 may include, for example, a first cable collection 118, a second cable collection 121, and a third cable collection 124. Each cable collection 118, 121, and 124 may include one or more cables, as may be appreciated, and may be one of a multitude of varying types of cables. While three cable collections are illustrated, it is understood that other varying numbers of cable collections may be employed. In the non-limiting example of FIGS. 1 and 2, the first cable collection 118 includes twin-axial cables (e.g., high-speed data cables for differential signaling), the second cable collection 121 includes ribbon cables (e.g., low-speed data cables), and the third cable collection 124 includes power cables for applications in which power is required. [0037] To provide strain relief for at least the first cable collection 118 and the second cable collection 121, the overmold organizer 109 includes apertures that retain at least the first cable collection 118 and the second cable collection 121 in a predetermined strain relief arrangement. To this end, FIG. 3 shows the receptacle connector 100 without the housing 103, the top cover 106, the overmold organizer 109, and the clip assembly 112. The first cable collection 118 and the second cable collection 121 include bends 127a, 127b (collectively “bends 127”) that provide strain relief. The bends 127 prevent stress from occurring on a connection point between the signal wafer assembles 115 and individual cables of the first cable collection 118 and/or the second cable collection 121. The bends 127 may be formed in the cables prior to an overmolding process in which the overmold organizer 109 is formed.

[0038] As a result of bends 127 being positioned in the first cable collection 118, a termination portion of the first cable collection 118 before the bend 127 is at a first height relative to a bottom surface of the receptacle connector 100, and a distal portion of the first cable collection 118 after the bend is at a second height different than the first height. A first row of the cables in the first cable collection 118 are bent towards a second row of the cables therein to create a tight arrangement of the cables. Likewise, a termination portion of the second cable collection 121 before the bend 127 is at a first height relative to a bottom surface of the receptacle connector 100, and a distal portion of the second cable collection 121 after the bend 127 is at a second height different than the first height. A second row of the cables in the second cable collection 121 are bent towards a second row of the cables therein to further define the tight arrangement of the cables.

[0039] FIGS. 4 and 5 show side and top perspective views, respectively, of the portion of the receptacle connector 100 shown in FIG. 3. Notably, like FIG. 3, FIGS. 4 and 5 show the receptacle connector 100 without the housing 103, the top cover 106, the overmold organizer 109, and the clip assembly 112. Disposed below the overmold organizer 109 may be one of a multitude of cable alignment blocks 128a, 128b (collectively “cable alignment blocks 128”). The cable alignment blocks 128 may include generally rectangular bodies extending horizontally along a body of the receptacle connector 100. Further, the cable alignment blocks 128 may include apertures that align with those of the overmold organizer 109, shown FIGS. 1 and 2, and may further retain at least one of the first cable collection 118 and the second cable collection 121 in their bended form.

[0040] Referring among FIGS. 3, 4, and 5, the third cable collection 124 of the receptacle connector 100 may include, for example, a first power cable 130a and a second power cable 130b (collectively “power cables 130”). It is understood, however, that other numbers of power cables 130 greater or less than two may be employed in alternative arrangements. The receptacle connector 100 may further include the first power wafer assembly 117a and the second power wafer assembly 117b described above, each having respective power terminals 136a, 136b (collectively “power terminals 136”).

[0041] The first power cable 130a may have a distal end and a termination end, where the termination end of the first power cable 130a may be coupled to the power terminal 136a of the first power wafer assembly 117a. Similarly, the second power cable 130b may have a distal end and a termination end, where the termination end of the second power cable 130b may be coupled to the power terminal 136b of the second power wafer assembly 117b.

[0042] Further, in various embodiments, the receptacle connector 100 may include a first power cable housing 139a and a second power cable housing 139b (collectively “power cable housings 139”). The first power cable housing 139a may be positioned over the termination end of the first power cable 130a, whereas the second power cable housing 139b may be positioned over the termination end of the second power cable 130b. The first power cable housing 139a and/or the second power cable housing 139b may be formed through an overmolding process (e.g., a low-pressure overmold, injection overmold, and so forth), whereby a polymer material (e.g., plastic) is deposited on a termination end of a respective power cable 130, thereby securing the power cables 130 in the position as shown in FIGS. 3- 5. The power cable housings 139 may allow a small amount of play to occur in the respective power cables 130.

[0043] A multitude of projections 140a...140d (collectively “projections 140”) may extend from top surfaces of the cable alignment blocks 128 and/or a first power cable housing 139 where the projections 140 may nest in the top cover 106 or the overmold organizer 109, further retaining the components of the receptacle connector 100. In some embodiments, the projections 140 are square-shaped projections, although it is understood that other shapes may be employed. [0044] Termination pads 141a, 141b (collectively “termination pads 141”) may be positioned above or below the power terminals 136. The termination pads 141 may include a substantially planar body having a square or rectangular shape, which facilitates welding or soldering connections while permitting the cable termination to be straight. It is understood, however, that other shapes of the termination pads 141 may be employed. For instance, in some implementations, the termination pads 141 may be U-shaped for soldering connections. The termination pads 141 may assume other shapes, for instance, when other connections are employed beyond soldering, welding, and the like. Additionally, in some embodiments, the termination pads 141 may be planar with contact terminals and a wafer plastic body. The termination pads 141 may include a hole through which the power cables 130 are inserted and/or bent, which may then be soldered, welded, or the like.

[0045] Moving along to FIGS. 6 and 7, side perspective and side views of the receptacle connector 100, respectively, are shown with the power cable housings 139 of FIGS. 4 and 5 hidden for further explanation. As shown in FIGS. 6 and 7, the first power wafer assembly 117a and the second power wafer assembly 117b may be offset from one another in a horizontal plane and a vertical plane. Similarly, the first signal wafer assembly 115a and the second signal wafer assembly 115b may be offset from one another in a horizontal plane and a vertical plane. For instance, the first power wafer assembly 117a and the second power wafer assembly 117b are separated from one another in a front-to-back arrangement, and the first signal wafer assembly 115a and the second signal wafer assembly 115b are separated from one another in a front-to-back arrangement.

[0046] In various embodiments, crimp rings 142a, 142b (collectively “crimp rings 142”) may be used to further secure a power cable 130 with respect to the power terminal 136. For instance, a first crimp ring 142a may be positioned on the first power cable 130a and/or a second crimp ring 142b may be positioned on the second power cable 130b. More specifically, in some implementations, the first crimp ring 142a and the second crimp ring 142b may be positioned on termination ends of a respective power cable 130. The crimp rings 142 may be positioned a predetermined distance from a distal end of the power cable 130, such as 1.5 mm or other suitable distance, as well as a predetermined distance from a respective power terminal 136. The crimp rings 142 may provide strain relief and prevent wear occurring, for instance, when the power cables 130 are pulled in a direction parallel to an orientation of the power cables 130.

[0047] FIG. 6 further illustrates a multitude of stiffeners 143a, 143b (collectively “stiffeners 143”) which may be formed in a part of the receptacle connector 100 (e.g., via overmolding) or otherwise positioned in the housing 103 or the overmold organizer 109. The stiffeners 143 may prevent deformation of the housing 103, the overmold organizer 109, and/or the components positioned therein. For instance, a first stiffener 143a may be positioned on an outer side of the first signal wafer assembly 115a towards a rear of the receptacle connector 100, and a second stiffener positioned on an outer side of the second signal wafer assembly 115b towards a front of the receptacle connector 100.

[0048] The stiffeners 143 may be stamped or sheared from a metal or metal alloy material sheet in one example. The material sheet may have a thickness “T” in a range between 0.25 mm and 0.75 mm for example. As particular examples, the stiffeners 143 may be 0.25 mm, 0.35 mm, 0.40 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.60 mm, 0.65 mm, 0.70 mm, or 0.75 mm in thickness, although other thicknesses can be relied upon. The material sheet can preferably have a relatively high level of stiffness or rigidity and, particularly, higher than that of the material from which the housing 103 or overmold organizer 109 is formed.

[0049] As shown in FIG. 8, the power cable 130 can include a jacket 145 or sheath that surrounds one or more conductors 148. In the enlarged view of the crimp ring 142 shown in FIG. 8, the crimp rings 142 may substantially (e.g., 70% or more) surround the power cable 130. In alternative embodiments, however, the crimp rings 142 may fully surround and encapsulate the power cable 130. The crimp ring 142 can be crimped on or over the jacket 145 of the power cable 130. The crimp rings 142 may be formed of a suitable material to permit crimping (e.g., pressure applied to two or more areas of the crimp ring 142) to deform the crimp ring 142 and force a connection with the power cable 130 and/or a jacket 145 thereof. To provide additional stability, in some implementations, the crimp ring 142 includes a tail 149 that projects from a body of the crimp ring 142. While the tail 149 makes the crimp ring 142 easier to manufacture and handle on a manufacturing floor, the tail 149 may further increase a volumetric profit of the crimp ring 142 such that, when an overmold (e.g., power cable housing 139( covers the crimp ring 142, there is more of the crimp ring 142 for plastic or other material to mold around and grip onto. The crimp ring 142 may be formed of a suitable metal material. For example, the crimp ring 142 may be formed of aluminum, steel, stainless steel, copper, or alloys thereof. In some cases, the crimp ring 142 can be formed of a plastic or polymer material.

[0050] Turning now to FIGS. 9 and 10, top views of wafer assemblies 115, 117 and other select components of the receptacle connector 100 are shown. In some embodiments, the first crimp ring 142a and the termination end of the first power cable 130a may be encapsulated or otherwise positioned in the first power cable housing 139a, as shown in FIG. 9. Similarly, the second crimp ring 142b and the termination end of the first power cable 130b may be encapsulated or otherwise positioned in the second power cable housing 139b. Together, the crimp rings 142, as nested within the power cable housings 139, prevent a load from being transferred directly to a wire termination at the power terminal 136.

[0051] Further, as shown in the various views of FIGS. 11-14, the first power cable housing 139a may be positioned vertically over or on top of the second power cable housing 139b in a stacked arrangement. As such, the first power cable housing 139a and the second power cable housing 139b may be positioned vertically with respect to one another. Specifically, FIG. 14 does not show the first power cable housing 139a while showing the second power cable housing 139b. As shown in FIG. 14, the second power cable housing 139b may include a ridge 144 that projects from a top surface of the second power cable housing 139b. A bottom surface of the first power cable housing 139a may include a recessed portion that receives and substantially conforms to the ridge 144.

[0052] Referring back to FIGS. 9 and 10, at least one of the first power cable housing 139a and the second power cable housing 139b may include interlocking components 152 configured to engage with corresponding interlocking features of a power wafer assembly 117, such as a power wafer assembly 117. For instance, the interlocking components 152 include a multitude of “teeth” or projections and recesses on front and side portions of the power cable housings 139. In some implementations, the power cable housings 139 may include a rectangular, elongated body 155 and a square- or rectangular-shaped side projection 158. The interlocking components 152 may be positioned proximate the side projection 158 and/or on opposing sides of the power cable housing 139.

[0053] As the power cable housings 139 may be formed through an overmolding process, the interlocking components 152 are thus formed through the overmolding process. The overmolding process may include a low-pressure overmolding process, generally with a temperature range of 250 to 450° F according to some embodiments. As best shown in FIG. 13, the interlocking components 152 of at least the first power cable housing 139a may be configured to engage with corresponding interlocking features of one of the first power wafer assembly 117a and the second power wafer assemblies 117b, or an intermediary body positioned therebetween.

[0054] Referring back to FIG. 3, each of the wafer assemblies 115, 117 may include one or more terminals configured to engage with corresponding terminals of a plug connector, for example. The terminals may be formed of a conductive material, such as copper, or other metal. The terminals may be mounted on or affixed to a terminal housing, which may be formed of a non-conductive polymer material. The terminal housing may keep terminal pairs spaced apart from adjacent terminal pairs, and may provide rigidity to the wafer assemblies 115, 117. As noted above, a first plurality of cables (e.g., cables of the first and second cable collections 118, 121) may be coupled to the first signal wafer assembly 115a, and a second plurality of cables (e.g., other cables of the first and second cable collections 118, 121) may be coupled to the second signal wafer assembly 115b.

[0055] As best seen in the bottom perspective view of FIG. 2, the first signal wafer assembly 115a and the second signal wafer assembly 115b are positioned parallel to one another and spaced apart from one another, thereby defining two rows of terminals (e.g., two rows of signal terminals and power terminals). It is understood, however, that one row of terminal, three rows of terminals, and so forth may be implemented based on a desired application.

[0056] As best shown in the side perspective view of FIG. 6, the first signal wafer assembly 115a and the second signal wafer assembly 115b may be offset from one another in a horizontal plane and a vertical plane. For instance, the first signal wafer assembly 115a may have a first insertion depth when positioned in the housing 103, whereas the second signal wafer assembly 115b may have a second insertion depth less than the first insertion depth when positioned in the housing 103. However, terminals of the first signal wafer assembly 115a and the second signal wafer assembly 115b may have terminate at a common distance relative to a plug connector. Similarly, the first power wafer assembly 117a and the second power wafer assembly 117b may be offset from one another in a horizontal plane and a vertical plane. For instance, the first power wafer assembly 117a may have a first insertion depth when positioned in the housing 103, whereas the second power wafer assembly 117b may have a second insertion depth less than the first insertion depth when positioned in the housing 103. However, terminals of the first power wafer assembly 117a and the second power wafer assembly 117b may have terminate at a common distance relative to a plug connector.

[0057] Referring to the top plan view of FIG. 10 and the bottom perspective view of FIG. 2, the receptacle connector 100 may include a wall 164 positioned between the power wafer assemblies 117 and the signal wafer assemblies 115, thereby defining a power bay 167 that includes the power wafer assemblies 117 and a signal bay 170 that includes the signal wafer assemblies 115. As the power bay may generate heat and create electromagnetic interference (EMI), in various scenarios, the wall 164 may create a physical separation and barrier that is suitable for preventing electromagnetic interference and thermal transfer between the power wafer assemblies 117 and the signal wafer assemblies 115.

[0058] In addition, the wall 164 may make the receptacle connector 100 suitable for alternative implementations that may be desired. For instance, a separation between the power bay 167 and the signal bay 170 may facilitate last-mate-first-break applications. As such, an insertion depth of the wafer assemblies 115, 117, a length of the terminals thereof, and like characteristics, may be adjusted to employ a last-mate, first-break implementation. [0059] Turning now to FIG. 15, a sequential diagram for crimping and overmolding a power cable 130 is shown to form a connection. First, a power cable 130 may be cut to a predetermined length. Next, a crimp ring 142 may be crimped onto a jacket of the power cable 130. In some embodiments, the crimp ring 142 is crimped approximately 1.5 mm from termination. Thereafter, a power cable housing 139 may be formed over the power cable 130 as crimped. In some embodiments, the power cable housing 139 is formed through low- pressure overmolding. Next, the power cable 130 may be stripped to expose conductors 148. Finally, the cable assembly with the overmolded power cable housing 139 may be terminated to a power terminal 136 of a power wafer assembly 117, for example. To this end, a termination may include ultrasonic welding, soldering, and other suitable connection method. [0060] The features, structures, or characteristics described above may be combined in one or more embodiments in any suitable manner, and the features discussed in the various embodiments may be interchangeable, if possible. In the following description, numerous specific details are provided in order to fully understand the embodiments of the present disclosure. However, a person skilled in the art will appreciate that the technical solution of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, and the like may be employed. In other instances, well- known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

[0061] Although the relative terms such as “on,” “below,” “upper,” and “lower” are used in the specification to describe the relative relationship of one component to another component, these terms are used in this specification for convenience only, for example, as a direction in an example shown in the drawings. It should be understood that if the device is turned upside down, the “upper” component described above will become a “lower” component. When a structure is “on” another structure, it is possible that the structure is integrally formed on another structure, or that the structure is “directly” disposed on another structure, or that the structure is “indirectly” disposed on the other structure through other structures.

[0062] In this specification, the terms such as “a,” “an,” “the,” and “said” are used to indicate the presence of one or more elements and components. The terms “comprise,” “include,” “have,” “contain,” and their variants are used to be open ended, and are meant to include additional elements, components, etc., in addition to the listed elements, components, etc. unless otherwise specified in the appended claims.

[0063] The terms “first,” “second,” etc. are used only as labels, rather than a limitation for a number of the objects. It is understood that if multiple components are shown, the components may be referred to as a “first” component, a “second” component, and so forth, to the extent applicable.

[0064] The above-described embodiments of the present disclosure are merely possible examples of implementations set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims

CLAIMS Therefore, the following is claimed:

1. A receptacle connector, comprising: a first power wafer assembly and a second power wafer assembly; a first power cable having a distal end and a termination end, the first power cable being coupled to a first power terminal of the first power wafer assembly, wherein a first crimp ring is positioned on the termination end of the first power cable; a second power cable having a distal end and a termination end, the second power cable being coupled to a second power terminal of the second power wafer assembly, wherein a second crimp ring is positioned on the termination end of the second power cable; a first power cable housing positioned over the termination end of the first power cable, the first crimp ring being encapsulated by the first power cable housing; and a second power cable housing positioned over the termination end of the second power cable, the second crimp ring being encapsulated by the second power cable housing.

2. The receptacle connector according to claim 1, wherein the first power cable housing is positioned vertically over the second power cable housing in a stacked arrangement.

3. The receptacle connector according to claim 2, wherein each of the first power cable housing and the second power cable housing comprises a plurality of interlocking components configured to engage with corresponding interlocking features of one of the first and second power wafer assemblies, or an intermediary body positioned therebetween.

4. The receptacle connector according to claim 3, wherein the second power cable housing comprises a ridge projecting from a top surface thereof that is configured to be positioned in a recess on a bottom surface of the first power cable housing.

5. The receptacle connector according to any of claims 1 -4, wherein each of the first power cable housing and the second power cable housing are overmolded onto the first power cable and the second power cable.

6. The receptacle connector according to any of claims 1-5, further comprising: a first signal wafer assembly and a second signal wafer assembly separate from one another, each of the first signal wafer assembly and the second signal wafer assembly comprising a plurality of terminals configured to engage with corresponding terminals of a plug connector; a first cable collection coupled to the first terminal wafer; and a second cable collection coupled to the second terminal wafer.

7. The receptacle connector according to claim 6, wherein the first cable collection comprising a first plurality of cables, and the second cable collection comprises a second plurality of cables.

8. The receptacle connector according to claim 7, wherein the first plurality of cables are high-speed data cables, and the second plurality of cables are low-speed data cables.

9. The receptacle connector according to claims 7 or 8, wherein the first plurality of cables comprise a bend at a termination end thereof, and the second plurality of cables comprise a bend at a termination end thereof.

10. The receptacle connector according to claims 7 or 8, wherein: a termination portion of the first plurality of cables before the bend is at a first height relative to a bottom surface of the receptacle connector, and a distal portion of the first plurality of cables after the bend is at a second height different than the first height; and a termination portion of the second plurality of cables before the bend is at a first height relative to a bottom surface of the receptacle connector, and a distal portion of the second plurality of cables after the bend is at a second height different than the first height.

11. The receptacle connector according to any of claims 6-10, further comprising: a wall positioned between the first and second power wafer assemblies, and the first and second signal wafer assemblies, wherein the wall reduces electromagnetic interference between the first power wafer assembly and the second power wafer assembly, and the first signal wafer assembly and the second signal wafer assembly.

12. The receptacle connector according to claim 7, further comprising a wire support organizer comprising a plurality of apertures through which the first plurality of cables and the second plurality of cables are positioned.

13. The receptacle connector according to claim 1 , wherein the first power cable is coupled to the first power terminal of the first power wafer via ultrasonic welding, and the second power cable is coupled to the second power terminal of the second power wafer via ultrasonic welding.

14. The receptacle connector according to claim 1, wherein the first power cable is coupled to the first power terminal of the first power wafer via soldering, and the second power cable is coupled to the second power terminal of the second power wafer via soldering.

15. The receptacle connector according to claim 1, wherein the first power wafer assembly and the second power wafer assembly are offset from one another in a horizontal plane and a vertical plane.

16. The receptacle connector according to claim 6, wherein the first signal wafer assembly and the second signal wafer assembly are offset from one another in a horizontal plane and a vertical plane.

17. The receptacle connector according to claim 6, wherein the first power wafer assembly and the second power wafer assembly are separated from one another in a front-to-back arrangement, and the first signal wafer and the second signal wafer are separated from one another in a front-to-back arrangement.

18. The receptacle connector according to claim 17, further comprising a first stiffener positioned on an outer side of the first signal terminal assembly towards a rear of the receptacle connector, and a second stiffener positioned on an outer side of the second signal terminal assembly towards a front of the receptacle connector.

19. The receptacle connector according to claim 18, further comprising a plurality of cable alignment blocks, each of the cable alignment blocks comprising a generally rectangular body extending horizontally along a body of the receptacle connector.

20. The receptacle connector according to claim 19, wherein each of the cable alignment blocks comprises apertures that align with corresponding apertures of an overmold organizer of the receptacle connector that retain at least one of the first cable collection and the second cable collection in a bended form.

21. The receptacle connector according to claim 6, further comprising an overmold organizer that retains at least one of the first cable collection and the second cable collection in a bended form.

22. A method, comprising: providing a power cable and cutting the first power cable to a predetermined length; crimping a crimp ring onto a jacket of the power cable; forming a power cable housing over the power cable as crimped through low-pressure overmolding; and stripping the power cable to expose a plurality of conductors of the power cable; terminating the power cable as crimped and overmolded to a power terminal of a power wafer assembly via ultrasonic welding, soldering, and other suitable connection method.