WO2024135135A1 - スライドガラス冷却・加熱装置およびスライドガラスの冷却・加熱方法 - Google Patents

スライドガラス冷却・加熱装置およびスライドガラスの冷却・加熱方法 Download PDF

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Publication number
WO2024135135A1
WO2024135135A1 PCT/JP2023/040276 JP2023040276W WO2024135135A1 WO 2024135135 A1 WO2024135135 A1 WO 2024135135A1 JP 2023040276 W JP2023040276 W JP 2023040276W WO 2024135135 A1 WO2024135135 A1 WO 2024135135A1
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WO
WIPO (PCT)
Prior art keywords
cooling
slide glass
heat
heating
slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/040276
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English (en)
French (fr)
Japanese (ja)
Inventor
欣士郎 坂本
正史 遠藤
英利 杉山
広斌 周
良介 河内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Tech Corp
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Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Priority to EP23906506.3A priority Critical patent/EP4641164A1/en
Priority to JP2024565657A priority patent/JPWO2024135135A1/ja
Priority to CN202380086310.7A priority patent/CN120380313A/zh
Publication of WO2024135135A1 publication Critical patent/WO2024135135A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/44—Sample treatment involving radiation, e.g. heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00—Supporting devices; Holding devices
    • B01L9/52—Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/30—Staining; Impregnating ; Fixation; Dehydration; Multistep processes for preparing samples of tissue, cell or nucleic acid material and the like for analysis
    • G01N1/31—Apparatus therefor
    • G01N1/312—Apparatus therefor for samples mounted on planar substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/42—Low-temperature sample treatment, e.g. cryofixation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00029—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor provided with flat sample substrates, e.g. slides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0822—Slides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1838—Means for temperature control using fluid heat transfer medium
    • B01L2300/1844—Means for temperature control using fluid heat transfer medium using fans
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00029—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor provided with flat sample substrates, e.g. slides
    • G01N2035/00099—Characterised by type of test elements
    • G01N2035/00138—Slides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N2035/00346—Heating or cooling arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • G01N2035/0439—Rotary sample carriers, i.e. carousels
    • G01N2035/0441—Rotary sample carriers, i.e. carousels for samples

Definitions

  • the present invention relates to an apparatus and method capable of simultaneously cooling and heating multiple glass slides using a heat pump.
  • U.S. Patent No. 5,333,636 describes an individualized slide temperature control achieved by a heating system having a thermal stage radially mounted on a carousel for heating the slides and sensing the temperature of each.
  • Biopsomnia involves examining a portion of collected body tissue under a microscope and making a pathological diagnosis.
  • test sample prepared on a glass slide by sectioning the collected body tissue is subjected to heat treatment together with the glass slide in order to dissolve the paraffin that fixes the tissue and to promote the staining reaction with the reagent.
  • heat treatment the glass slide containing the test sample is heated or cooled to a specific temperature according to the test procedure.
  • adjacent slides may need to be heated or cooled to different specific temperatures.
  • Patent Document 1 describes an apparatus that thermally isolates adjacent glass slides from each other and heats or cools the adjacent glass slides, sometimes to different temperatures, at specific times using a heater or a Peltier-like heat pump installed under the glass slides.
  • Patent Document 1 describes an apparatus that thermally isolates adjacent glass slides from each other and heats or cools the adjacent glass slides, sometimes to different temperatures, at specific times using a heater or a heat pump such as a Peltier mounted under the glass slides.
  • the object of the present invention is to provide a slide cooling/heating device and a method for cooling/heating slides that can reduce the power consumption of a heat pump in an apparatus that uses a heat pump to simultaneously heat and cool multiple slides.
  • the present invention includes a number of means for solving the above problems, and one example is characterized by comprising a number of glass slides, a number of heat pumps that cool or heat each of the glass slides individually, a radiator that promotes heat dissipation from the heat pumps, and a thermally conductive plate that connects the radiator to the heat pumps and thermally couples the heat pumps together.
  • the power consumption of a heat pump can be reduced when multiple glass slides are heated and cooled simultaneously.
  • FIG. 1 is an overhead view showing an entire configuration of a slide glass cooling and heating device according to a first embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view showing a main part of the slide glass cooling and heating device of the first embodiment.
  • FIG. 6 is an overhead view showing a main part of a slide glass cooling/heating device according to a second embodiment of the present invention.
  • FIG. 11 is an overhead view showing a main part of a slide glass cooling/heating device according to a third embodiment of the present invention.
  • FIG. 11 is an overhead view showing a main part of a slide glass cooling/heating device according to a fourth embodiment of the present invention.
  • FIG. 13 is an overhead view showing a main part of a slide glass cooling/heating device according to a fifth embodiment of the present invention.
  • FIG. 13 is a bottom view of the slide glass cooling and heating device of the fifth embodiment.
  • FIG. 13 is an overhead view of an air-cooling unit of the slide glass cooling/heating device of the fifth
  • FIG. 1 A first embodiment of the slide glass cooling/heating device and slide glass cooling/heating method of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 A first embodiment of the slide glass cooling/heating device and slide glass cooling/heating method of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 A first embodiment of the slide glass cooling/heating device and slide glass cooling/heating method of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is an overhead view showing the entire slide glass cooling/heating device 10.
  • the slide glass cooling/heating device 10 shown in FIG. 1 has a number of slide glasses 11 and a number of holders 12, each of which holds one slide glass 11, arranged in a line on a fixing base 13.
  • the holders 12 are members that hold the slide glasses 11 and a heat spreader 21 (FIG. 2) described below, and the fixing base 13 is a member that fixes the holders 12.
  • the holders 12 and fixing base 13 are preferably made of plastic or polycarbonate resin.
  • the vertical lower portion of the fixed base 13 has a heat conduction plate 14 made of a material with excellent thermal conductivity.
  • This heat conduction plate 14 is a member that connects the air-cooled heat sink 15 as a radiator to the multiple heat pumps 22a, 22b, and thermally connects the multiple heat pumps 22a, 22b. From the standpoint of cost and weight, it is preferably made of aluminum, but copper can also be used.
  • the heat conduction plate 14 has an air-cooled heat sink 15 at the vertical lower part thereof as a radiator for promoting heat dissipation from the heat pumps 22a, 22b.
  • the air-cooled heat sink 15 is shown as having flat fins, but any shape that increases the surface area of the air-cooled heat sink 15 is acceptable, and the fin shape is not limited to a specific one.
  • the air-cooled heat sink 15 is preferably made of aluminum in terms of cost and weight, but copper can also be used.
  • the fan 16 blows cooling air onto the air-cooled heat sink 15, further promoting heat dissipation.
  • the direction of the air from the fan 16 is improved, and the air direction is restricted so that the air from the fan 16 passes efficiently over the surface of the air-cooled heat sink 15.
  • FIG. 2 is a side cross-sectional view showing the main parts of the slide glass cooling/heating device 10.
  • the heat spreader 21 is disposed between the glass slide 11 and the heat pumps 22a and 22b, and is provided to make the temperature distribution on the surface of the glass slide 11 uniform.
  • the area of the heat spreader 21 is desirably equal to or greater than the area of the glass slide 11, since it plays a role in making the temperature distribution on the surface of the glass slide 11 uniform.
  • the heat spreader 21 can be made of copper, a copper-based material, aluminum, etc.
  • Heat pumps 22a, 22b are provided under the heat spreader 21 to cool or heat each glass slide 11a, 11b individually so that the temperature of each slide can be adjusted to the required temperature depending on the purpose. These heat pumps 22a, 22b preferably use Peltier elements.
  • Heat pump 22a is provided for the purpose of cooling and heating glass slide 11a
  • heat pump 22b is provided for the purpose of cooling and heating glass slide 11b.
  • Heat pumps 22a and 22b each have a heat absorbing surface 23a, 23b and a heat dissipating surface 24a, 24b.
  • the thermally conductive plate 14 contacts the heat dissipating surface 24a of heat pump 22a and the heat absorbing surface 23b of heat pump 22b, thermally connecting heat pumps 22a and 22b.
  • a sensor that measures the temperature of the heat pump 22, or a sensor that measures the value of the current supplied to the heat pumps 22a and 22b, which are made of Peltier elements, and a control unit that receives input values from the sensor and controls the rotation of the fan 16 are further provided.
  • the fans 16 are operated with a duty ratio of 100%. If a large proportion of the heat pumps 22 are operating as heating, or if the fans 16 are placed near the heat pumps 22 operating as heating, they are operated with a lower duty ratio. If all of the heat pumps 22 are operating as heating, the fans 16 can be stopped, and other such control can be performed to further reduce power consumption.
  • a method can be used in which the same number of fans 16 as the number of heat pumps 22 are provided and the fans 16 are driven only when the heat pumps 22 are driven for cooling.
  • the slide glass cooling/heating device 10 of the above-mentioned embodiment 1 of the present invention includes a plurality of heat pumps 22a, 22b that cool or heat a plurality of slide glasses 11 one by one, a radiator that promotes heat dissipation from the heat pumps 22a, 22b, and a heat conductive plate 14 that connects the radiator and the plurality of heat pumps 22a, 22b and thermally couples the plurality of heat pumps 22a, 22b.
  • the effect of this embodiment was verified using a thermal network.
  • the thermal network method is a technique for solving the conservation of thermal energy by simultaneously solving the basic equations of heat transfer. For example, assuming that two Peltier elements (a type of heat pump) are connected and driven with the aim of heating one to 70°C and cooling the other to 10°C at an ambient temperature of 40°C, when the configuration of this embodiment is adopted, it is possible to reduce the power consumption of the Peltier elements by approximately 30% compared to when the two Peltier elements are thermally isolated.
  • the heat pumps 22a and 22b are Peltier elements, the device configuration can be made small and simple.
  • the efficiency of heating and cooling the slide glass 11 can be improved.
  • an air-cooled heat sink 15 as a heat sink, heat can be efficiently dissipated in cases where heat reuse is difficult, improving the performance of the cooling/heating device.
  • the heat dissipation efficiency can be further improved.
  • Fig. 3 is a perspective view showing a main part of the slide glass cooling/heating device according to the second embodiment.
  • the slide glass cooling/heating device 10A of this embodiment uses a heat sink 31 dedicated to forced air cooling, in which the air-cooled heat sink 15 and the duct 17 are integrated.
  • the heat sink 31 for forced air cooling has an internal ventilation passage and a fin shape designed to increase the heat dissipation area. Therefore, the heat sink 31 for forced air cooling receives heat from the thermal conduction plate 14, and dissipates the heat by heat transfer from the surface of the heat sink 31 into the atmosphere. The air coming out of the fan 16 passes through the ventilation passage, promoting heat dissipation by heat transfer.
  • the slide glass cooling/heating device 10A and slide glass cooling/heating method of the second embodiment of the present invention also provide substantially the same effects as the slide glass cooling/heating device 10 and slide glass cooling/heating method of the first embodiment described above.
  • FIG. 4 is a perspective view showing a main part of the slide glass cooling/heating device according to the third embodiment.
  • the slide glass cooling/heating device 10B of this embodiment uses a water-cooled heat sink as a radiator, and is a device in which the air-cooled heat sink 15, fan 16, and duct 17 of the slide glass cooling/heating device 10 shown in FIG. 1 are replaced with a water-cooled system.
  • the water-cooling system is composed of a water-cooled heat sink 41 with a space inside through which the coolant flows, piping 42 through which the coolant circulates, a pump 43 for circulating the coolant, and a heat exchanger 44 for cooling the coolant.
  • the cooling liquid flowing inside the water-cooled heat sink 41 transfers heat to and from the heat conduction plate 14, and the heat exchanger 44 cools the cooling liquid whose temperature has risen.
  • the cooled cooling liquid is circulated by the pump 43 and returns to the inside of the water-cooled heat sink 41, where the series of steps are repeated.
  • FIG. 5 is a perspective view showing a main part of the slide glass cooling/heating device according to the fourth embodiment.
  • the slide glass cooling/heating device 10C of this embodiment differs from the slide glass cooling/heating devices 10, 10A, and 10B of embodiments 1 to 3 in that multiple slide glasses 11 are arranged radially.
  • the fixing base 13C, the heat conduction plate 14C, and the air-cooled heat sink 15C can be arranged in a circular shape to reduce the space required for the device.
  • a processing device 52 can be equipped with a rotating shaft 51, rotate the fixed base 13C, and change the position of the glass slide 11 as necessary, thereby making it possible to perform the processing without having to provide a mechanism for changing the position in the processing device 52.
  • a heat sink dedicated to forced air cooling as in embodiment 2, or a water-cooled heat sink, as in embodiment 3, can be used.
  • Fig. 6 is an overhead view showing the main part of the slide glass cooling/heating device according to the fifth embodiment
  • Fig. 7 is a bottom view of the slide glass cooling/heating device
  • Fig. 8 is an overhead view of the air-cooling unit of the slide glass cooling/heating device.
  • the slide glass cooling/heating device 10D of this embodiment is the same as the slide glass cooling/heating device 10C of embodiment 4, except that the thermally conductive plate 14C and the air-cooled heat sink 15C are replaced with an air-cooling unit 60.
  • the air-cooling unit 60 is composed of a heat-conducting plate 14D, an air-cooled heat sink 15D, a fan 16D, and a duct 17D.
  • the heat-conducting plate 14D has a protrusion 81 so that it can come into contact with the heat pumps 22a and 22b.
  • at least two protrusions 81 are provided to thermally connect the different heat pumps 22a and 22b. Note that the bottom surfaces of the heat pumps 22a and 22b may be at the same height as the bottom surface of the fixed base 13D without providing the protrusions 81.
  • the slide glass cooling/heating device 10D and slide glass cooling/heating method of the fifth embodiment of the present invention also provide substantially the same effects as the slide glass cooling/heating device 10C and slide glass cooling/heating method of the fourth embodiment described above.
  • this embodiment has the advantage of being lighter in weight because the volume of the thermally conductive plate and air-cooled heat sink can be reduced compared to embodiment 4.
  • a heat sink dedicated to forced air cooling or a water-cooled heat sink can be used as the air-cooling unit, as in embodiments 2 and 3.
  • the present invention is not limited to the above-described embodiment, but includes various modified examples.
  • the above-described embodiment has been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to the embodiment having all of the described configurations.

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  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
PCT/JP2023/040276 2022-12-23 2023-11-08 スライドガラス冷却・加熱装置およびスライドガラスの冷却・加熱方法 Ceased WO2024135135A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP23906506.3A EP4641164A1 (en) 2022-12-23 2023-11-08 Slide glass cooling/heating device and slide glass cooling/heating method
JP2024565657A JPWO2024135135A1 (https=) 2022-12-23 2023-11-08
CN202380086310.7A CN120380313A (zh) 2022-12-23 2023-11-08 载玻片冷却/加热装置及载玻片的冷却/加热方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-207481 2022-12-23
JP2022207481 2022-12-23

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WO2024135135A1 true WO2024135135A1 (ja) 2024-06-27

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JP (1) JPWO2024135135A1 (https=)
CN (1) CN120380313A (https=)
WO (1) WO2024135135A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000102376A (ja) * 1998-09-30 2000-04-11 Sanyo Electric Co Ltd インキュベータの温度制御装置
JP2002505420A (ja) * 1998-02-27 2002-02-19 サイトロジックス・コーポレーション スライドを個別に加熱制御するランダムアクセス型スライド染色装置
JP2004279340A (ja) * 2003-03-18 2004-10-07 Komatsu Ltd マイクロチップ及びそれの温度調節装置
JP2007198718A (ja) * 2005-12-27 2007-08-09 Toppan Printing Co Ltd 温度制御方法
US20150308931A1 (en) * 2012-12-03 2015-10-29 Leica Biosystems Melbourne Pty Ltd Thermal module for a sample processing assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2354598T3 (es) 1998-02-27 2011-03-16 Ventana Medical Systems, Inc. Aparato de patología molecular automatizado que tiene calefactores de portaobjetos independientes.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002505420A (ja) * 1998-02-27 2002-02-19 サイトロジックス・コーポレーション スライドを個別に加熱制御するランダムアクセス型スライド染色装置
JP2000102376A (ja) * 1998-09-30 2000-04-11 Sanyo Electric Co Ltd インキュベータの温度制御装置
JP2004279340A (ja) * 2003-03-18 2004-10-07 Komatsu Ltd マイクロチップ及びそれの温度調節装置
JP2007198718A (ja) * 2005-12-27 2007-08-09 Toppan Printing Co Ltd 温度制御方法
US20150308931A1 (en) * 2012-12-03 2015-10-29 Leica Biosystems Melbourne Pty Ltd Thermal module for a sample processing assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4641164A1 *

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JPWO2024135135A1 (https=) 2024-06-27
CN120380313A (zh) 2025-07-25

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