WO2024125502A1 - Wafer level surface acoustic wave filter and radio frequency module chip - Google Patents

Wafer level surface acoustic wave filter and radio frequency module chip Download PDF

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Publication number
WO2024125502A1
WO2024125502A1 PCT/CN2023/138122 CN2023138122W WO2024125502A1 WO 2024125502 A1 WO2024125502 A1 WO 2024125502A1 CN 2023138122 W CN2023138122 W CN 2023138122W WO 2024125502 A1 WO2024125502 A1 WO 2024125502A1
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WIPO (PCT)
Prior art keywords
substrate
acoustic wave
surface acoustic
wave filter
level surface
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PCT/CN2023/138122
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French (fr)
Chinese (zh)
Inventor
胡锦钊
周温涵
李帅
张磊
杨睿智
郭嘉帅
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深圳飞骧科技股份有限公司
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Publication of WO2024125502A1 publication Critical patent/WO2024125502A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Definitions

  • the present invention relates to the field of wireless communication technology, and in particular to a wafer-level surface acoustic wave filter and a radio frequency module chip.
  • RF modules are module chips that contain two or more devices such as low noise amplifiers (LNA), switches, filters, power amplifiers (PA), etc.
  • LNA low noise amplifier
  • PA power amplifier
  • RF module chips are widely used in mobile terminals such as mobile phones and wearable devices due to their high integration and high performance.
  • LNA low noise amplifier
  • PA power amplifier
  • RF modules are becoming more and more highly integrated.
  • the increase in the demand for miniaturization of RF modules has also put forward more stringent requirements on the size of various devices.
  • the filter is one of the important components in the RF module.
  • the wafer level package (WLP) of the filter has made great progress.
  • the filter substrate is directly formed by photolithography of organic materials on the filter substrate, and then covered with an organic cover to complete the entire package. Since it does not require the traditional chip scale package (CSP) substrate, the size of the WLP has been further reduced.
  • CSP chip scale package
  • the present invention proposes a wafer-level surface acoustic wave filter and RF module chip is used to solve the problems of high manufacturing cost, large inductor installation area and inability to effectively improve the inductance value of matching inductors in traditional surface acoustic wave filters.
  • the present invention adopts the following technical solutions:
  • an embodiment of the present invention provides a wafer-level surface acoustic wave filter, wherein the wafer-level surface acoustic wave filter comprises:
  • a substrate wherein the substrate is made of a piezoelectric material
  • a finger assembly comprising fingers, a bus bar and a metal plate formed on the substrate by photolithography and silk screen printing; the fingers are connected to the bus bar, and the bus bar is connected to the metal plate;
  • a cofferdam wherein the cofferdam is an annular structure, the cofferdam is fixed to the substrate, the cofferdam is arranged around the fingers and the bus bar at intervals, and the metal plate passes through the cofferdam for electrical connection with the outside;
  • a cover plate the cover plate is arranged on the cofferdam, the cover plate is provided with a plurality of through holes penetrating therethrough, the plurality of through holes comprising a plurality of first through holes and at least one second through hole arranged opposite to each other;
  • the metal column comprising a plurality of metal columns and being located inside the cofferdam, the plurality of metal columns being respectively fixed to the substrate and respectively inserted into a corresponding one of the first through holes, and being exposed from the cover plate;
  • solder balls include a plurality of signal solder balls and dummy solder balls, one of the signal solder balls is fixedly disposed on one end of each of the metal pillars away from the substrate to form an electrical connection, and the dummy solder ball is fixedly disposed on the pad; and,
  • An inductor winding is formed on the cover plate, and two ends of the inductor winding are respectively connected to the dummy solder ball and any one of the signal solder balls.
  • the inductor winding is made of flexible conductive wire.
  • the substrate is made of any one of lithium niobate, lithium tantalate, piezoelectric ceramics and piezoelectric quartz.
  • the interdigital fingers include a plurality of interdigital fingers, which are arranged on the substrate at intervals.
  • the cofferdam is formed on the substrate using an organic material by a photolithography and silk screen printing process.
  • the cover plate is made of any one of silicon, lithium niobate and lithium tantalate.
  • the plurality of through holes are located on the inner side of the cofferdam relative to the orthographic projection of the substrate.
  • the metal column is formed on the substrate by electroplating.
  • the solder balls are grown using a copper pillar process.
  • an embodiment of the present invention provides a radio frequency module chip, comprising the above-mentioned wafer-level surface acoustic wave filter.
  • a cover plate is provided on the cofferdam, the cover plate is provided with a plurality of through holes penetrating therethrough, the plurality of through holes include a plurality of first through holes and at least one second through hole arranged opposite to each other;
  • the metal pillars include a plurality of metal pillars located on the inner side of the cofferdam, the plurality of metal pillars are respectively fixed to the substrate and respectively inserted into a corresponding one of the first through holes, and exposed to the cover plate;
  • the pad is formed in the second through hole; a signal solder ball is fixedly provided at one end of each metal pillar away from the substrate, and a dummy solder ball is fixedly provided on the pad; the two ends of the inductor winding are respectively connected to the dummy solder ball and any one of the signal solder balls.
  • a layer of inductor winding is added, which can improve the inductance value of the inductor winding in the RF
  • FIG1 is a schematic diagram of the structure of a wafer-level surface acoustic wave filter in an embodiment of the present invention
  • FIG2 is a cross-sectional view taken along line A-A of FIG1.
  • An embodiment of the present invention provides a wafer-level surface acoustic wave filter, which includes: a substrate 01, a finger assembly 02, a cofferdam 03, a cover plate 05, a metal column 04, a pad 010, a solder ball 06 and an inductor winding 07.
  • the substrate 01 is made of piezoelectric material and is used for mounting the finger assembly 02 and the cofferdam 03 .
  • the finger assembly 02 includes a finger 021, a bus bar and a metal plate formed on the substrate 01 by photolithography and silk screen printing.
  • the finger assembly 02, the cofferdam 03 and the cover plate 05 together form a cavity 08, and the finger 021 and the bus bar are arranged in the cavity 08, and the finger 021 and the bus bar are connected to each other.
  • the bus bar is connected to the metal plate, and the metal plate is formed on the substrate 01.
  • the metal plate is used to plate the metal column 04 and grow the solder ball 06 on the metal column 04.
  • the cofferdam 03 is an annular structure, the cofferdam 03 is fixed to the substrate 01, the cofferdam 03 is arranged around the inserting fingers 021 and the bus bar at intervals, and the metal plate passes through the cofferdam 03 for electrical connection with the outside.
  • the cover plate 05 is covered on the cofferdam 03 , and the cover plate 05 is provided with a plurality of through holes 09 penetrating therethrough, and the plurality of through holes 09 include a plurality of first through holes 091 and one second through hole 092 that are arranged opposite to each other.
  • the metal pillars 04 include a plurality of metal pillars 04 located on the inner side of the cofferdam 03 .
  • the plurality of metal pillars 04 are respectively fixed to the substrate 01 and respectively inserted into a corresponding one of the first through holes 091 , and exposed on the cover plate 05 .
  • the solder pad 010 is fixed in the second through hole 092.
  • the solder balls 06 include a plurality of signal solder balls 061 and dummy solder balls (not marked in the figure).
  • Each of the metal pillars 04 is away from the substrate 01.
  • One end of the inductor 07 is fixedly provided with a signal solder ball 061, and the dummy solder ball is fixedly provided on the solder pad 010.
  • Two ends of the inductor winding 07 are respectively connected to the dummy solder ball and any one of the signal solder balls 061.
  • the metal pillar 04 is a copper pillar, and the plurality of metal pillars 04 include 8 metal pillars 04, which are arranged into 2 groups, with 4 metal pillars arranged side by side in each group.
  • the solder ball point on the metal pillar 04 is used to grow a solder ball 06 on the solder ball point.
  • a solder ball point is provided on the pad 010, and a dummy solder ball is grown on the solder ball point.
  • solder ball points 1, 2, 3, 4, 5, 6, 7, and 8 are connected to the connection pads in the filter chip through metal pillars 04, but there is no copper pillar under solder ball point 9, which is only connected to the WLP package cover plate 05.
  • the length, width and height of the wafer-level surface acoustic wave filter are 0 ⁇ m, 800 ⁇ m and 200 ⁇ m respectively.
  • the wafer-level surface acoustic wave filter can also be of other sizes, which are selected according to actual conditions.
  • the cover plate 05 is covered on the cofferdam 03, and the cover plate 05 is provided with a plurality of through holes 09 penetrating therethrough, and the plurality of through holes 09 include a plurality of first through holes 091 and a second through hole 092 arranged opposite to each other;
  • the metal pillars 04 include a plurality of metal pillars 04 located on the inner side of the cofferdam 03, and the plurality of metal pillars 04 are respectively fixed to the substrate 01 and respectively inserted into a corresponding first through hole 091, and exposed from the cover plate 05;
  • the pad 010 is fixed in the second through hole 092;
  • a signal solder ball 061 is fixedly provided at one end of each metal pillar 04 away from the substrate 01, and the dummy solder ball is fixedly provided on the pad 010; and the two ends of the inductor winding 07 are respectively connected to the dummy solder ball and any of the signal solder balls 061.
  • an additional layer of inductor winding is added, and
  • the inductor winding 07 is made of a flexible conductive wire, so as to facilitate connecting the dummy solder ball and any signal solder ball 061 to form conduction.
  • the substrate 01 is made of any one of lithium niobate, lithium tantalate, piezoelectric ceramics and piezoelectric quartz, which is a crystalline material that generates voltage between the two end faces when the substrate 01 is subjected to pressure, has high strength and good piezoelectric properties.
  • the interdigital fingers 021 include a plurality of interdigital fingers 021 , which are spaced apart from each other on the substrate 01 .
  • the bank 03 is formed on the substrate 01 using an organic material by photolithography and screen printing process, which is convenient to manufacture and has good filter performance.
  • the cover plate 05 is made of any one of silicon, lithium niobate and lithium tantalate. Silicon, lithium niobate and lithium tantalate are hard materials, which can effectively ensure that the inductor winding does not deform.
  • the orthographic projection of the plurality of through holes 09 relative to the substrate 01 is located on the inner side of the cofferdam 03, so as to facilitate the installation and fixation of the metal pillar 04 and improve the packaging efficiency of the WLP filter.
  • the metal pillar 04 is formed on the substrate 01 by electroplating.
  • the metal pillar 04 has good conductivity, which is convenient for growing the signal solder ball 061, so that the signal solder ball 061 and the dummy solder ball are connected through a layer of inductor winding; without increasing the area, the possible inductance value of the inductor winding in the RF module is improved.
  • the solder ball 06 is grown by using a copper pillar process to ensure that the height of the solder ball 06 is controlled when the filter is connected to the substrate, thereby ensuring that the inductance value of the inductor winding is accurate.
  • An embodiment of the present invention provides a radio frequency module chip, including the wafer-level surface acoustic wave filter of the above-mentioned embodiment 1.
  • a substrate is provided on the radio frequency module chip.
  • the corresponding substrate is provided with a virtual pad without electrical connection at a position corresponding to the actual signal solder ball 061, and the virtual pad plays a supporting role; a pad connected to the lower winding is provided at a position corresponding to the virtual solder ball.
  • the signal will first pass through a layer of inductor winding 07 on the WLP package cover, and then be connected to the winding on the substrate.
  • by adding a layer of inductor winding 07 outside the substrate it can be used to improve the inductance value of the matching inductor without increasing the inductor area.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

Provided in the present invention are a wafer level surface acoustic wave filter and a radio frequency module chip. The wafer level surface acoustic wave filter comprises: a substrate; a finger assembly; a cofferdam; a cover plate provided with a plurality of through holes penetrating the cover plate, wherein the plurality of through holes comprise a plurality of first through holes, which are disposed opposite each other, and a second through hole; a plurality of metal columns, which are located on an inner side of the cofferdam and are respectively fixed to the substrate and inserted into at least one corresponding first through hole; a pad, which is fixed in the second through hole; and solder balls, which comprise a plurality of signal solder balls and a dummy solder ball, wherein one signal solder ball is fixed to the end of each metal column away from the substrate; the dummy solder ball and an inductive winding are fixed to the pad; the inductive winding is wound around the cover plate; and two ends of the inductive winding are respectively connected to the dummy solder ball and any one of the signal solder balls. The wafer level surface acoustic wave filter of the present invention has a simple structure, and improves the inductance value of an inductive winding inductor in a radio frequency module.

Description

晶圆级声表面波滤波器及射频模组芯片Wafer-level surface acoustic wave filter and RF module chip 技术领域Technical Field
本发明涉及无线通讯技术领域，尤其涉及一种晶圆级声表面波滤波器及射频模组芯片。The present invention relates to the field of wireless communication technology, and in particular to a wafer-level surface acoustic wave filter and a radio frequency module chip.
背景技术Background technique
随着人类进入信息化时代，无线通信技术有了飞速发展，射频模组已成为社会生活和发展不可或缺的一部分。无线通信技术的进步离不开射频电路和微波技术的发展。目前，在无线收发系统中，射频模组是一种包含低噪声放大器(LNA)，开关，滤波器，功率放大器(PA)等其中两种或多种器件的模组芯片。射频模组芯片由于其高集成度，高性能等，被广泛应用于手机，可穿戴设备等移动终端中。随着终端设备中空间要求的日益严格，射频模组也愈发高度集成化。射频模组对小型化需求的提升，对其中各类器件的尺寸也提出了更加严格的要求。As humans enter the information age, wireless communication technology has developed rapidly, and RF modules have become an indispensable part of social life and development. The advancement of wireless communication technology is inseparable from the development of RF circuits and microwave technology. At present, in wireless transceiver systems, RF modules are module chips that contain two or more devices such as low noise amplifiers (LNA), switches, filters, power amplifiers (PA), etc. RF module chips are widely used in mobile terminals such as mobile phones and wearable devices due to their high integration and high performance. With the increasingly stringent space requirements in terminal devices, RF modules are becoming more and more highly integrated. The increase in the demand for miniaturization of RF modules has also put forward more stringent requirements on the size of various devices.
滤波器是射频模组中的重要器件之一，为了满足射频模组对尺寸的要求，滤波器的晶圆级封装(Wafer Level Package，简称WLP)得到了长足的发展。一般是在滤波器衬底上直接通过有机材料光刻形成围堰后，再覆上一层有机盖板，完成整个封装。由于其不需要传统的芯片级封装(Chip Scale Package，简称CSP)的基板，因此WLP的尺寸得到了进一步的缩小。The filter is one of the important components in the RF module. In order to meet the size requirements of the RF module, the wafer level package (WLP) of the filter has made great progress. Generally, the filter substrate is directly formed by photolithography of organic materials on the filter substrate, and then covered with an organic cover to complete the entire package. Since it does not require the traditional chip scale package (CSP) substrate, the size of the WLP has been further reduced.
然而，在传统的WLP封装中，滤波器封装中缺乏相应的基板，造成了滤波器的匹配一般比较复杂，所有的匹配负担被置于射频模组的基板中。当下，随着射频模组越来越多的避免被动元件的出现，滤波器越来越多的只需要数个电感匹配。在射频模组中，如果不使用被动电感元件，电感匹配的制作方法之一是在基板中采用分层绕线的方式进行。但是，有时WLP滤波器对电感值需求较大时，在基板中的需要层数较多，传统的4层或6层基板将难以满足需求。使得基板和绕线的制造成本高，电感安装面积大，不能有效提高匹配电感的感值。However, in the traditional WLP package, the lack of a corresponding substrate in the filter package makes the filter matching generally complicated, and all the matching burden is placed on the substrate of the RF module. Nowadays, as RF modules increasingly avoid the emergence of passive components, more and more filters only need a few inductors to match. In the RF module, if passive inductor components are not used, one of the methods for making inductor matching is to use layered winding in the substrate. However, sometimes when the WLP filter has a large demand for inductance, more layers are required in the substrate, and the traditional 4-layer or 6-layer substrate will be difficult to meet the demand. This makes the manufacturing cost of the substrate and winding high, the inductor installation area large, and the inductance value of the matching inductor cannot be effectively improved.
发明内容Summary of the invention
针对以上现有技术的不足，本发明提出一种晶圆级声表面波滤波器及 射频模组芯片，以解决传统声表面波滤波器在应用时制造成本高，电感安装面积大，不能有效提高匹配电感的感值的问题。In view of the above shortcomings of the prior art, the present invention proposes a wafer-level surface acoustic wave filter and RF module chip is used to solve the problems of high manufacturing cost, large inductor installation area and inability to effectively improve the inductance value of matching inductors in traditional surface acoustic wave filters.
为了解决上述技术问题，本发明采用如下技术方案：In order to solve the above technical problems, the present invention adopts the following technical solutions:
第一方面，本发明实施例提供一种晶圆级声表面波滤波器，所述晶圆级声表面波滤波器包括：In a first aspect, an embodiment of the present invention provides a wafer-level surface acoustic wave filter, wherein the wafer-level surface acoustic wave filter comprises:
衬底，所述衬底为压电材料制成；A substrate, wherein the substrate is made of a piezoelectric material;
插指组件，所述插指组件包括通过光刻丝印形成于所述衬底上的插指、汇流条和金属板；所述插指与所述汇流条连接，所述汇流条连接所述金属板；A finger assembly, the finger assembly comprising fingers, a bus bar and a metal plate formed on the substrate by photolithography and silk screen printing; the fingers are connected to the bus bar, and the bus bar is connected to the metal plate;
围堰，所述围堰呈环形结构，所述围堰固定于所述衬底，所述围堰间隔环绕所述插指及所述汇流条设置，所述金属板穿过所述围堰用于与外部电连接；A cofferdam, wherein the cofferdam is an annular structure, the cofferdam is fixed to the substrate, the cofferdam is arranged around the fingers and the bus bar at intervals, and the metal plate passes through the cofferdam for electrical connection with the outside;
盖板，所述盖板盖设于所述围堰上，所述盖板设有贯穿其上的多个通孔，多个所述通孔包括相对设置的多个第一通孔和至少一个第二通孔；A cover plate, the cover plate is arranged on the cofferdam, the cover plate is provided with a plurality of through holes penetrating therethrough, the plurality of through holes comprising a plurality of first through holes and at least one second through hole arranged opposite to each other;
金属柱，所述金属柱包括多个并位于所述围堰的内侧，多个所述金属柱分别固定于所述衬底且分别插入对应的一个所述第一通孔内，以外露于所述盖板；a metal column, the metal column comprising a plurality of metal columns and being located inside the cofferdam, the plurality of metal columns being respectively fixed to the substrate and respectively inserted into a corresponding one of the first through holes, and being exposed from the cover plate;
焊盘，所述焊盘形成于所述第二通孔内；a pad formed in the second through hole;
焊球，所述焊球包括多个信号焊球和虚设焊球，每一所述金属柱远离所述衬底的一端固定设置一个所述信号焊球并形成电连接，所述焊盘上固定设置所述虚设焊球；以及，Solder balls, the solder balls include a plurality of signal solder balls and dummy solder balls, one of the signal solder balls is fixedly disposed on one end of each of the metal pillars away from the substrate to form an electrical connection, and the dummy solder ball is fixedly disposed on the pad; and,
电感绕线，所述电感绕线绕设形成于所述盖板，且其两端分别连接于所述虚设焊球和任一所述信号焊球。An inductor winding is formed on the cover plate, and two ends of the inductor winding are respectively connected to the dummy solder ball and any one of the signal solder balls.
优选的，所述电感绕线为柔性导电线制成。Preferably, the inductor winding is made of flexible conductive wire.
优选的，所述衬底为铌酸锂、钽酸锂、压电陶瓷和压电石英中的任意一种材料制成。Preferably, the substrate is made of any one of lithium niobate, lithium tantalate, piezoelectric ceramics and piezoelectric quartz.
优选的，所述插指包括多个，且间隔设置于所述衬底。Preferably, the interdigital fingers include a plurality of interdigital fingers, which are arranged on the substrate at intervals.
优选的，所述围堰为使用有机材料采用光刻丝印工艺形成于所述衬底。Preferably, the cofferdam is formed on the substrate using an organic material by a photolithography and silk screen printing process.
优选的，所述盖板为硅、铌酸锂和钽酸锂中的任意一种材料制成。Preferably, the cover plate is made of any one of silicon, lithium niobate and lithium tantalate.
优选的，多个所述通孔相对于所述衬底的正投影位于所述围堰的内侧。 Preferably, the plurality of through holes are located on the inner side of the cofferdam relative to the orthographic projection of the substrate.
优选的，所述金属柱通过电镀的方式形成于所述衬底。Preferably, the metal column is formed on the substrate by electroplating.
优选的，所述焊球采用铜柱工艺进行生长所形成。Preferably, the solder balls are grown using a copper pillar process.
第二方面，本发明实施例提供一种射频模组芯片，包括上述的晶圆级声表面波滤波器。In a second aspect, an embodiment of the present invention provides a radio frequency module chip, comprising the above-mentioned wafer-level surface acoustic wave filter.
与相关技术相比，本发明的实施例中，通过将盖板盖设于所述围堰上，所述盖板设有贯穿其上的多个通孔，多个所述通孔包括相对设置的多个第一通孔和至少一个第二通孔；所述金属柱包括多个并位于所述围堰的内侧，多个所述金属柱分别固定于所述衬底且分别插入对应的一个所述第一通孔内，以外露于所述盖板；所述焊盘形成于所述第二通孔内；每一所述金属柱远离所述衬底的一端固定设置一个所述信号焊球，所述焊盘上固定设置所述虚设焊球；将所述电感绕线的两端分别连接于所述虚设焊球和任一所述信号焊球。这样增加了一层电感绕线，可在不增加面积的基础上，提升了射频模组中电感绕线电感的感值；节约制造成本。Compared with the related art, in the embodiment of the present invention, a cover plate is provided on the cofferdam, the cover plate is provided with a plurality of through holes penetrating therethrough, the plurality of through holes include a plurality of first through holes and at least one second through hole arranged opposite to each other; the metal pillars include a plurality of metal pillars located on the inner side of the cofferdam, the plurality of metal pillars are respectively fixed to the substrate and respectively inserted into a corresponding one of the first through holes, and exposed to the cover plate; the pad is formed in the second through hole; a signal solder ball is fixedly provided at one end of each metal pillar away from the substrate, and a dummy solder ball is fixedly provided on the pad; the two ends of the inductor winding are respectively connected to the dummy solder ball and any one of the signal solder balls. In this way, a layer of inductor winding is added, which can improve the inductance value of the inductor winding in the RF module without increasing the area, and save manufacturing costs.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
下面结合附图详细说明本发明。通过结合以下附图所作的详细描述，本发明的上述或其他方面的内容将变得更清楚和更容易理解。附图中：The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:
图1为本发明实施例中晶圆级声表面波滤波器的结构示意图；FIG1 is a schematic diagram of the structure of a wafer-level surface acoustic wave filter in an embodiment of the present invention;
图2为图1的A-A线的剖视图。FIG2 is a cross-sectional view taken along line A-A of FIG1.
其中，01、衬底，02、插指组件，021、插指，03、围堰，04、金属柱，05、盖板，06、焊球，061、信号焊球，07、电感绕线，08、空腔，09、通孔，091、第一通孔，092、第二通孔，010、焊盘。Among them, 01, substrate, 02, finger assembly, 021, finger, 03, cofferdam, 04, metal column, 05, cover, 06, solder ball, 061, signal solder ball, 07, inductor winding, 08, cavity, 09, through hole, 091, first through hole, 092, second through hole, 010, pad.
具体实施方式Detailed ways
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同；本文中在申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请；本申请的说明书和权利要求书及上述附图说明中的术语“包括”和“具有”以及它们的任何变形，意图在于覆盖不排他的包含。本申请的说明书和权利要求书或上述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特 性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment The phrase "in some embodiments" and "in some embodiments" may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
实施例一Embodiment 1
请参阅图1-2所示，本发明实施例提供一种晶圆级声表面波滤波器，所述晶圆级声表面波滤波器包括：衬底01、插指组件02、围堰03、盖板05、金属柱04、焊盘010、焊球06以及电感绕线07。Please refer to Figures 1-2. An embodiment of the present invention provides a wafer-level surface acoustic wave filter, which includes: a substrate 01, a finger assembly 02, a cofferdam 03, a cover plate 05, a metal column 04, a pad 010, a solder ball 06 and an inductor winding 07.
所述衬底01为压电材料制成；用于安装插指组件02和围堰03。The substrate 01 is made of piezoelectric material and is used for mounting the finger assembly 02 and the cofferdam 03 .
所述插指组件02包括通过光刻丝印形成于所述衬底01上的插指021、汇流条和金属板。插指组件02、围堰03和盖板05共同围成空腔08，插指021和汇流条设置于空腔08内，插指021和汇流条之间相互连接。所述汇流条与金属板连接，金属板形成于衬底01，金属板上用于镀金属柱04和在金属柱04上生长焊球06。The finger assembly 02 includes a finger 021, a bus bar and a metal plate formed on the substrate 01 by photolithography and silk screen printing. The finger assembly 02, the cofferdam 03 and the cover plate 05 together form a cavity 08, and the finger 021 and the bus bar are arranged in the cavity 08, and the finger 021 and the bus bar are connected to each other. The bus bar is connected to the metal plate, and the metal plate is formed on the substrate 01. The metal plate is used to plate the metal column 04 and grow the solder ball 06 on the metal column 04.
所述围堰03呈环形结构，所述围堰03固定于所述衬底01，所述围堰03间隔环绕所述插指021及所述汇流条设置，所述金属板穿过所述围堰03用于与外部电连接。The cofferdam 03 is an annular structure, the cofferdam 03 is fixed to the substrate 01, the cofferdam 03 is arranged around the inserting fingers 021 and the bus bar at intervals, and the metal plate passes through the cofferdam 03 for electrical connection with the outside.
所述盖板05盖设于所述围堰03上，所述盖板05设有贯穿其上的多个通孔09，多个所述通孔09包括相对设置的多个第一通孔091和一个第二通孔092。The cover plate 05 is covered on the cofferdam 03 , and the cover plate 05 is provided with a plurality of through holes 09 penetrating therethrough, and the plurality of through holes 09 include a plurality of first through holes 091 and one second through hole 092 that are arranged opposite to each other.
所述金属柱04包括多个并位于所述围堰03的内侧，多个所述金属柱04分别固定于所述衬底01且分别插入对应的一个所述第一通孔091内，以外露于所述盖板05。The metal pillars 04 include a plurality of metal pillars 04 located on the inner side of the cofferdam 03 . The plurality of metal pillars 04 are respectively fixed to the substrate 01 and respectively inserted into a corresponding one of the first through holes 091 , and exposed on the cover plate 05 .
所述焊盘010固定于所述第二通孔092内。所述焊球06包括多个信号焊球061和虚设焊球(图中未标记)，每一所述金属柱04远离所述衬底01 的一端固定设置一个所述信号焊球061，所述焊盘010上固定设置所述虚设焊球。所述电感绕线07的两端分别连接于所述虚设焊球和任一所述信号焊球061。The solder pad 010 is fixed in the second through hole 092. The solder balls 06 include a plurality of signal solder balls 061 and dummy solder balls (not marked in the figure). Each of the metal pillars 04 is away from the substrate 01. One end of the inductor 07 is fixedly provided with a signal solder ball 061, and the dummy solder ball is fixedly provided on the solder pad 010. Two ends of the inductor winding 07 are respectively connected to the dummy solder ball and any one of the signal solder balls 061.
其中，金属柱04为铜柱，多个金属柱04包括8个，8个金属柱04设置成2组，每一组并排设置4个。金属柱04上焊球点，用于通过焊球点上生长成焊球06。焊盘010上设有一个焊球点，通过在焊球点上生长虚设焊球。The metal pillar 04 is a copper pillar, and the plurality of metal pillars 04 include 8 metal pillars 04, which are arranged into 2 groups, with 4 metal pillars arranged side by side in each group. The solder ball point on the metal pillar 04 is used to grow a solder ball 06 on the solder ball point. A solder ball point is provided on the pad 010, and a dummy solder ball is grown on the solder ball point.
其中，焊球点1，2，3，4，5，6，7，8通过金属柱04与滤波器芯片中的连接盘相连，但是焊球点9下无铜柱，仅与WLP封装盖板05相连。Among them, solder ball points 1, 2, 3, 4, 5, 6, 7, and 8 are connected to the connection pads in the filter chip through metal pillars 04, but there is no copper pillar under solder ball point 9, which is only connected to the WLP package cover plate 05.
可选的，晶圆级声表面波滤波器的长、宽和高分别为0μm、800μm和200μm。当然，晶圆级声表面波滤波器还可以是其它尺寸大小，具体根据实际情况选择。Optionally, the length, width and height of the wafer-level surface acoustic wave filter are 0 μm, 800 μm and 200 μm respectively. Of course, the wafer-level surface acoustic wave filter can also be of other sizes, which are selected according to actual conditions.
具体的，通过将盖板05盖设于所述围堰03上，所述盖板05设有贯穿其上的多个通孔09，多个所述通孔09包括相对设置的多个第一通孔091和一个第二通孔092；所述金属柱04包括多个并位于所述围堰03的内侧，多个所述金属柱04分别固定于所述衬底01且分别插入对应的一个所述第一通孔091内，以外露于所述盖板05；所述焊盘010固定于所述第二通孔092内；每一所述金属柱04远离所述衬底01的一端固定设置一个所述信号焊球061，所述焊盘010上固定设置所述虚设焊球；将所述电感绕线07的两端分别连接于所述虚设焊球和任一所述信号焊球061。这样增加了一层电感绕线，可在不增加面积的基础上，提升了射频模组中电感绕线电感的感值；节约制造成本。Specifically, the cover plate 05 is covered on the cofferdam 03, and the cover plate 05 is provided with a plurality of through holes 09 penetrating therethrough, and the plurality of through holes 09 include a plurality of first through holes 091 and a second through hole 092 arranged opposite to each other; the metal pillars 04 include a plurality of metal pillars 04 located on the inner side of the cofferdam 03, and the plurality of metal pillars 04 are respectively fixed to the substrate 01 and respectively inserted into a corresponding first through hole 091, and exposed from the cover plate 05; the pad 010 is fixed in the second through hole 092; a signal solder ball 061 is fixedly provided at one end of each metal pillar 04 away from the substrate 01, and the dummy solder ball is fixedly provided on the pad 010; and the two ends of the inductor winding 07 are respectively connected to the dummy solder ball and any of the signal solder balls 061. In this way, an additional layer of inductor winding is added, and the inductance value of the inductor winding in the RF module can be improved without increasing the area, thereby saving manufacturing costs.
在本实施例中，所述电感绕线07为柔性导电线制成。方便将虚设焊球和任一的信号焊球061相连，形成导通。In this embodiment, the inductor winding 07 is made of a flexible conductive wire, so as to facilitate connecting the dummy solder ball and any signal solder ball 061 to form conduction.
在本实施例中，所述衬底01为铌酸锂、钽酸锂、压电陶瓷和压电石英中的任意一种材料制成。使得衬底01受到压力作用时会在两端面间出现电压的晶体材料，强度高，压电性能良好。In this embodiment, the substrate 01 is made of any one of lithium niobate, lithium tantalate, piezoelectric ceramics and piezoelectric quartz, which is a crystalline material that generates voltage between the two end faces when the substrate 01 is subjected to pressure, has high strength and good piezoelectric properties.
在本实施例中，所述插指021包括多个，且间隔设置于所述衬底01。In this embodiment, the interdigital fingers 021 include a plurality of interdigital fingers 021 , which are spaced apart from each other on the substrate 01 .
在本实施例中，所述围堰03为使用有机材料采用光刻丝印工艺形成于所述衬底01。制作方便，滤波器的性能良好。 In this embodiment, the bank 03 is formed on the substrate 01 using an organic material by photolithography and screen printing process, which is convenient to manufacture and has good filter performance.
在本实施例中，所述盖板05为硅、铌酸锂和钽酸锂中的任意一种材料制成。硅、铌酸锂和钽酸锂为硬质材料，可以有效保证电感电感绕线不变形。In this embodiment, the cover plate 05 is made of any one of silicon, lithium niobate and lithium tantalate. Silicon, lithium niobate and lithium tantalate are hard materials, which can effectively ensure that the inductor winding does not deform.
在本实施例中，多个所述通孔09相对于所述衬底01的正投影位于所述围堰03的内侧。方便金属柱04的安装固定，提高WLP滤波器的封装效率。In this embodiment, the orthographic projection of the plurality of through holes 09 relative to the substrate 01 is located on the inner side of the cofferdam 03, so as to facilitate the installation and fixation of the metal pillar 04 and improve the packaging efficiency of the WLP filter.
在本实施例中，所述金属柱04通过电镀的方式形成于所述衬底01。金属柱04导电效果好，便于生长信号焊球061，使信号焊球061和虚设焊球通过一层电感绕线连接；在不增加面积的基础上，提升了射频模组中电感绕线电感的可能感值。In this embodiment, the metal pillar 04 is formed on the substrate 01 by electroplating. The metal pillar 04 has good conductivity, which is convenient for growing the signal solder ball 061, so that the signal solder ball 061 and the dummy solder ball are connected through a layer of inductor winding; without increasing the area, the possible inductance value of the inductor winding in the RF module is improved.
在本实施例中，所述焊球06采用铜柱工艺进行生长所形成。焊球06将采用铜柱工艺进行生长，保证将滤波器和基板相连时，高度得到控制，保证电感绕线电感的感值准确。In this embodiment, the solder ball 06 is grown by using a copper pillar process to ensure that the height of the solder ball 06 is controlled when the filter is connected to the substrate, thereby ensuring that the inductance value of the inductor winding is accurate.
实施例二Embodiment 2
本发明实施例提供一种射频模组芯片，包括上述实施例一的晶圆级声表面波滤波器。射频模组芯片上设有基板，在实际使用中，对应的基板在实际信号焊球061对应的位置设置无电连接的虚拟焊盘，该虚拟焊盘起到支撑的作用；在虚设焊球对应的位置设置与下层绕线相连的焊盘。通过这种方式，信号会先通过WLP封装盖板上的一层电感绕线07，再与基板上的绕线相连。这样通过在基板之外，增加了一层电感绕线07，可用于在不提升电感面积的同时，提升匹配电感的感值。An embodiment of the present invention provides a radio frequency module chip, including the wafer-level surface acoustic wave filter of the above-mentioned embodiment 1. A substrate is provided on the radio frequency module chip. In actual use, the corresponding substrate is provided with a virtual pad without electrical connection at a position corresponding to the actual signal solder ball 061, and the virtual pad plays a supporting role; a pad connected to the lower winding is provided at a position corresponding to the virtual solder ball. In this way, the signal will first pass through a layer of inductor winding 07 on the WLP package cover, and then be connected to the winding on the substrate. In this way, by adding a layer of inductor winding 07 outside the substrate, it can be used to improve the inductance value of the matching inductor without increasing the inductor area.
需要说明的是，以上参照附图所描述的各个实施例仅用以说明本发明而非限制本发明的范围，本领域的普通技术人员应当理解，在不脱离本发明的精神和范围的前提下对本发明进行的修改或者等同替换，均应涵盖在本发明的范围之内。此外，除上下文另有所指外，以单数形式出现的词包括复数形式，反之亦然。另外，除非特别说明，那么任何实施例的全部或一部分可结合任何其它实施例的全部或一部分来使用。 It should be noted that the various embodiments described above with reference to the accompanying drawings are only used to illustrate the present invention rather than to limit the scope of the present invention. Those skilled in the art should understand that any modification or equivalent substitution of the present invention without departing from the spirit and scope of the present invention should be included within the scope of the present invention. In addition, unless otherwise indicated by the context, words appearing in the singular include the plural form, and vice versa. In addition, unless otherwise specified, all or part of any embodiment may be used in combination with all or part of any other embodiment.

Claims (10)

  1. 一种晶圆级声表面波滤波器，其特征在于，所述晶圆级声表面波滤波器包括：A wafer-level surface acoustic wave filter, characterized in that the wafer-level surface acoustic wave filter comprises:
    衬底，所述衬底为压电材料制成；A substrate, wherein the substrate is made of a piezoelectric material;
    插指组件，所述插指组件包括通过光刻丝印形成于所述衬底上的插指、汇流条和金属板；所述插指与所述汇流条连接，所述汇流条连接所述金属板；A finger assembly, the finger assembly comprising fingers, a bus bar and a metal plate formed on the substrate by photolithography and silk screen printing; the fingers are connected to the bus bar, and the bus bar is connected to the metal plate;
    围堰，所述围堰呈环形结构，所述围堰固定于所述衬底，所述围堰间隔环绕所述插指及所述汇流条设置，所述金属板穿过所述围堰用于与外部电连接；A cofferdam, wherein the cofferdam is an annular structure, the cofferdam is fixed to the substrate, the cofferdam is arranged around the fingers and the bus bar at intervals, and the metal plate passes through the cofferdam for electrical connection with the outside;
    盖板，所述盖板盖设于所述围堰上，所述盖板设有贯穿其上的多个通孔，多个所述通孔包括相对设置的多个第一通孔和至少一个第二通孔；A cover plate, the cover plate is arranged on the cofferdam, the cover plate is provided with a plurality of through holes penetrating therethrough, the plurality of through holes comprising a plurality of first through holes and at least one second through hole arranged opposite to each other;
    金属柱，所述金属柱包括多个并位于所述围堰的内侧，多个所述金属柱分别固定于所述衬底且分别插入对应的一个所述第一通孔内，以外露于所述盖板；a metal column, the metal column comprising a plurality of metal columns and being located inside the cofferdam, the plurality of metal columns being respectively fixed to the substrate and respectively inserted into a corresponding one of the first through holes, and being exposed from the cover plate;
    焊盘，所述焊盘形成于所述第二通孔内；a pad formed in the second through hole;
    焊球，所述焊球包括多个信号焊球和虚设焊球，每一所述金属柱远离所述衬底的一端固定设置一个所述信号焊球并形成电连接，所述焊盘上固定设置所述虚设焊球；以及，Solder balls, the solder balls include a plurality of signal solder balls and dummy solder balls, one of the signal solder balls is fixedly disposed on one end of each of the metal pillars away from the substrate to form an electrical connection, and the dummy solder ball is fixedly disposed on the pad; and,
    电感绕线，所述电感绕线绕设形成于所述盖板，且其两端分别连接于所述虚设焊球和任一所述信号焊球。An inductor winding is formed on the cover plate, and two ends of the inductor winding are respectively connected to the dummy solder ball and any one of the signal solder balls.
  2. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述电感绕线为柔性导电线制成。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the inductor winding is made of a flexible conductive wire.
  3. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述衬底为铌酸锂、钽酸锂、压电陶瓷和压电石英中的任意一种材料制成。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the substrate is made of any one of lithium niobate, lithium tantalate, piezoelectric ceramics and piezoelectric quartz.
  4. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述插指包括多个，且间隔设置于所述衬底。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the interdigitated fingers include a plurality of interdigitated fingers, which are arranged on the substrate at intervals.
  5. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述围堰为使用有机材料采用光刻丝印工艺形成于所述衬底。 The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the cofferdam is formed on the substrate using an organic material by a photolithography and silk screen printing process.
  6. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述盖板为硅、铌酸锂和钽酸锂中的任意一种材料制成。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the cover plate is made of any one of silicon, lithium niobate and lithium tantalate.
  7. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，多个所述通孔相对于所述衬底的正投影位于所述围堰的内侧。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the plurality of through holes are located on the inner side of the cofferdam relative to the orthographic projection of the substrate.
  8. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述金属柱通过电镀的方式形成于所述衬底。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the metal pillar is formed on the substrate by electroplating.
  9. 根据权利要求1所述的晶圆级声表面波滤波器，其特征在于，所述焊球采用铜柱工艺进行生长所形成。The wafer-level surface acoustic wave filter according to claim 1 is characterized in that the solder balls are grown using a copper pillar process.
  10. 一种射频模组芯片，其特征在于，包括如权利要求1-9任一项所述的晶圆级声表面波滤波器。 A radio frequency module chip, characterized in that it comprises a wafer-level surface acoustic wave filter as described in any one of claims 1-9.
PCT/CN2023/138122 2022-12-16 2023-12-12 Wafer level surface acoustic wave filter and radio frequency module chip WO2024125502A1 (en)

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CN115833785A (en) * 2022-12-16 2023-03-21 深圳飞骧科技股份有限公司 Wafer-level surface acoustic wave filter and radio frequency module chip

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