WO2024109607A1 - 一种导电型抛光头固定装置及导电型抛光头系统 - Google Patents

一种导电型抛光头固定装置及导电型抛光头系统 Download PDF

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Publication number
WO2024109607A1
WO2024109607A1 PCT/CN2023/131747 CN2023131747W WO2024109607A1 WO 2024109607 A1 WO2024109607 A1 WO 2024109607A1 CN 2023131747 W CN2023131747 W CN 2023131747W WO 2024109607 A1 WO2024109607 A1 WO 2024109607A1
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WO
WIPO (PCT)
Prior art keywords
conductive
polishing head
channel
adsorption
loading component
Prior art date
Application number
PCT/CN2023/131747
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English (en)
French (fr)
Inventor
朱政挺
Original Assignee
杭州众硅电子科技有限公司
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Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Publication of WO2024109607A1 publication Critical patent/WO2024109607A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Definitions

  • the invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to a conductive polishing head fixing device and a conductive polishing head system.
  • the manufacturing process of wafer substrates and semiconductor devices includes processes such as polishing and surface flattening.
  • Mechanical polishing, chemical mechanical polishing or flattening are usually used.
  • the wafer back is pressed by the wafer substrate carrier head (polishing head) to control parameters such as pressure, polishing head speed, polishing disc speed, and polishing liquid flow rate.
  • the front surface or thin film surface of the wafer substrate is polished or flattened on the polishing pad.
  • chemical mechanical polishing and chemical mechanical polishing flattening can achieve higher polishing or flattening efficiency and better polishing or flattening effects, including higher flatness and lower defectivity, by adjusting the formula of the polishing liquid.
  • electrochemical mechanical polishing and planarization can further utilize the conductive properties of the wafer substrate or the thin film on the surface of the wafer substrate to form a current path, carry out electrochemical reactions on the surface of the wafer substrate or the thin film, and increase the surface chemical reaction rate through precise control of the circuit system, thereby improving the efficiency of mechanical polishing and planarization.
  • the polishing head of chemical mechanical polishing and planarization equipment has a characteristic that it needs to be frequently disassembled for maintenance, replacement of consumables, cleaning of crystals, etc. Therefore, the polishing head needs to be easy to disassemble and assemble, stable and reliable.
  • the polishing head suitable for electrochemical mechanical polishing and planarization equipment also has the same requirements, but for the electrified polishing head that needs to be connected to the external wire, the wire connection and disconnection during disassembly and assembly is a problem.
  • a conductive polishing head fixing device comprising:
  • the loading component has a first adsorption end surface that can be connected with the polishing head; and at least a first channel is formed, and one end of the first channel extends to the first adsorption end surface;
  • a first conductive member one end of which is connected to a power source
  • the conductive interface assembly at least comprises a first active end, at least a portion of which is disposed in the first channel and electrically connected to the first conductive member.
  • the first active end is made of a conductive material.
  • the conductive interface assembly also includes a fixing piece made of an insulating material.
  • the first action end is connected to the loading component, and the first action end is connected to the fixing component.
  • the loading component is connected to a rotary joint, and the loading component is rotatable.
  • the first channel extends along the axial direction of the loading component.
  • the first conductive member is disposed in the first channel.
  • the first channel includes a first gas channel and a first installation channel, and the first conductive member is disposed in the first installation channel.
  • the first channel is arranged in the loading component, or the first channel is arranged in the outer area of the loading component; or the first channel is arranged on the outer side wall of the loading component.
  • the loading component has a first adsorption end surface and is formed with at least a first channel, wherein one end of the first channel extends to the first adsorption end surface;
  • the polishing head has a second adsorption end surface and is formed with at least a second channel, wherein one end of the second channel extends to the second adsorption end surface;
  • the conductive member comprises at least a first conductive member having one end connected to a power source;
  • a conductive interface assembly comprising at least a first active end connected to the first conductive member, and a second active end, wherein at least parts of the first active end and the second active end are arranged in the first channel and/or the second channel;
  • the first action end and the second action end are in contact and connected to achieve electrical connection of the polishing head.
  • the first active end is made of a conductive material
  • the second active end is made of a conductive material
  • the conductive member also includes a second conductive member connected to the second active end.
  • the conductive interface assembly also includes a fixing piece made of an insulating material, the fixing piece is connected to the loading component or the polishing head, and the first active end or the second active end is connected to the fixing piece.
  • the conductive interface assembly also includes a mounting frame made of insulating material, the mounting frame is connected to the polishing head or the loading component, and the second active end or the first active end is connected to the mounting frame.
  • an elastic member is provided in the installation frame, and the outer wall of the second acting end or the first acting end forms a flange that can be abutted against the elastic member.
  • the flange abuts against the inner wall of the installation frame, and both ends of the second acting end or the first acting end extend out from the openings on both sides of the installation frame respectively.
  • first action end and the second action end can be magnetically attracted to each other.
  • the installation frame is formed by splicing an upper body and a lower body.
  • the loading component is connected to a rotary joint, and the polishing head can rotate synchronously with the loading component.
  • the first channel extends along the axial direction of the loading component.
  • the first channel includes a first gas channel and a first installation channel, and the first conductive The member is arranged in the first installation channel;
  • the second channel includes a second air path channel and a second installation channel, and the second conductive member is arranged in the second installation channel.
  • first gas path channel and the second gas path channel are connected vertically.
  • first active end and/or the second active end form a mounting hole
  • first conductive member and/or the second conductive member are connected to a conductive adapter
  • the conductive adapter can be threadedly connected to the mounting hole
  • the end surface of the first acting end is provided with a limit slot for partially inserting the second acting end; or, the surface of the second acting end is provided with a limit slot for partially inserting the first acting end.
  • a sealing member is provided on the outer side of the conductive interface assembly, and the first adsorption end surface and the second adsorption end surface are fitted together to form an extrusion seal on the sealing member.
  • the polishing head includes an adsorption film for adsorbing the wafer, which is at least partially made of a conductive material and is electrically connected to the second active end or the second conductive member.
  • the adsorption film is a flexible film, or a metal film, or a metal and non-metal combined film.
  • the polishing head includes a retaining ring for fixing the wafer in the polishing head, which is at least partially made of a conductive material and is electrically connected to the second active end or the second conductive member.
  • the first channel is arranged in the loading component, or the first channel is arranged in the outer area of the loading component; or the first channel is arranged on the outer side wall of the loading component.
  • the present invention is a brand-new mechanical structure of electrochemical mechanical polishing and planarization equipment suitable for large-scale mass production.
  • the advantage is that it can be easily transformed into electrochemical mechanical polishing and planarization equipment without affecting the basic structure of the original chemical mechanical polishing and planarization equipment, and is compatible with the original functions, that is, it is adaptable to both electropolishing heads and ordinary polishing heads.
  • the beneficial effects of the present invention are: 1) a simple and reliable solution is provided for the electrified polishing head; 2) a first channel and a second channel are newly provided on the loading part and the polishing head, so that the conductivity of the polishing head can be achieved without affecting the existing structure; 3) a conductive interface assembly is provided to meet the demand for convenient and quick disassembly and installation of the electrified polishing head; 4) the number of channels on the loading part and the polishing head can be set according to demand, and there can be multiple wires in one channel, or it can be connected with multiple wires, so as to meet the demand for connection of multiple wires; 5) the conductive interface assembly can be divided into two parts, namely the loading part and the polishing head, so as to facilitate daily disassembly and maintenance; 6) the two parts of the conductive interface assembly can each have different functions, and can form different functions by cooperating with each other.
  • FIG1 is a cross-sectional view of the matching structure of a conductive polishing head fixing device and a polishing head in a first embodiment of the present invention.
  • FIG2 is a cross-sectional view of the matching structure of the conductive polishing head fixing device, the polishing head and the rotary joint in the first embodiment of the present invention.
  • FIG. 3 is a top view of a conductive polishing head system in a third embodiment of the present invention.
  • Fig. 4 is a C-C sectional view in Fig. 3.
  • FIG. 5 is an enlarged view of the structure at point A in FIG. 4 .
  • FIG6 is a cross-sectional view taken along line B-B in FIG3 .
  • FIG. 7 is a top view of the conductive interface assembly in the third embodiment of the present invention.
  • Fig. 8 is a D-D cross-sectional view in Fig. 7 , at which time the first action end and the second action end are not connected and conducted.
  • Fig. 9 is a D-D cross-sectional view in Fig. 7 , at which the first working end and the second working end are connected and conducted.
  • FIG. 10 is a top view of the conductive polishing head system in the third embodiment of the present invention, where the first active end extends across the entire first channel.
  • FIG11 is an enlarged view of the portion where the conductive interface assembly is located in the third embodiment of the present invention, in which a sealing member is provided between the first adsorption end surface and the second adsorption end surface.
  • FIG. 12 is a cross-sectional view of a conductive interface assembly in Embodiment 5 of the present invention.
  • FIG13 is a cross-sectional view of a conductive polishing head system in a sixth embodiment of the present invention.
  • FIG. 14 is an enlarged view of the structure at point E in FIG. 13 .
  • FIG. 15 is a cross-sectional view of a conductive interface assembly in Embodiment 7 of the present invention.
  • FIG. 16 is a cross-sectional view of a conductive polishing head system according to an eighth embodiment of the present invention.
  • FIG. 17 is a cross-sectional view of a conductive polishing head system according to a ninth embodiment of the present invention.
  • FIG. 18 is a front view of the conductive polishing head system in the tenth embodiment of the present invention.
  • FIG19 is a cross-sectional view taken along line F-F in FIG18 .
  • a conductive polishing head fixing device includes a loading component 1 , a first conductive component 31 , and a conductive interface assembly 4 .
  • the loading component 1 has a first adsorption end surface 11 that can be connected with the polishing head 2, and at least a first channel 12 is formed on the loading component 1, and one end of the first channel 12 extends to the first adsorption end surface 11.
  • the first adsorption end surface 11 is a horizontal plane
  • the lower end of the first channel 12 extends to the first adsorption end surface 11, and the first channel 12 extends along the axial direction of the loading component 1 and penetrates the loading component 1.
  • the upper portion of the loading component 1 may be connected to the rotary joint 5 , and the loading component 1 may rotate.
  • the number of the first channel 12 may be one or two or more. As shown in FIG2 , the first channel 12 includes a first gas path channel 121 and a first installation channel 122. The first conductive member 31 is disposed in the first installation channel 122. The number of the first gas path channel 121 and the first installation channel 122 is not limited, and their functions are not limited. For example, the first gas path channel 121 may be powered, and an ultrasonic device, a microwave device, an electromagnetic device, a magnetic device, a light guide device may be provided, or liquid may be passed through.
  • One end of the first conductive member 31 is connected to a power source (not shown in the figure), and the first conductive member 31 is disposed in the first channel 12.
  • a power source not shown in the figure
  • the first conductive member 31 is disposed in the first channel 12.
  • most of the axial length of the first channel 12 is occupied by the first conductive member 31, or a small part of the axial length is occupied by the first conductive member 31.
  • the entire axial length of the first channel 12 can also be occupied by the first active end 41 of the conductive interface assembly 4, and the first conductive member 31 is connected to the first active end 41 and is located outside the first channel 12.
  • the first conductive member 31 is a wire.
  • the conductive interface assembly 4 at least includes a first active end 41, at least a portion of which is disposed in the first channel 12, and the first active end 41 is electrically connected to the first conductive member 31.
  • the first active end 41 is made of a conductive material, and of course in other embodiments, the first active end 41 may be partially made of a conductive material and partially made of a non-conductive material, without any specific limitation, as long as the conductive function can be achieved.
  • the conductive interface assembly 4 further includes a fixing member 43 made of an insulating material, the fixing member 43 is connected to the loading component 1, and the first action end 41 is connected to the fixing member 43.
  • the connection between the fixing member 43 and the loading component 1 can be a bolt connection or the like, and the connection between the first action end 41 and the fixing member 43 can be an interference fit connection, which is not specifically limited.
  • the first action end 41 may also be a columnar conductor embedded in the loading component 1 , without the need for the fixing member 43 .
  • a polishing head system includes a conductive polishing head fixing device and a polishing head 2.
  • the structures of the loading component 1, the first conductive member 31 and the conductive interface assembly 4 in the conductive polishing head fixing device are the same as those in the first embodiment and will not be described in detail.
  • the polishing head 2 is a polishing head in the prior art, which is non-conductive, and its top surface is a second adsorption end surface 21 that can be attached to the first adsorption end surface 11.
  • a conductive polishing head system includes a loading component 1 , a polishing head 2 , a conductive member, and a conductive interface assembly 4 .
  • the loading component 1 has a first adsorption end surface 11, and at least a first channel 12 is formed on the loading component 1, and one end of the first channel 12 extends to the first adsorption end surface 11.
  • the first adsorption end surface 11 is a horizontal plane
  • the lower end of the first channel 12 extends to the first adsorption end surface 11
  • the first channel 12 extends along the axial direction of the loading component 1 and penetrates the loading component 1.
  • the upper part of the loading component 1 can be connected to the rotating joint 5, and the loading component 1 can rotate around its own center line.
  • the number of the first channel 12 can be one or more than two, and the first channel 12 includes a first gas path channel 121 and a first installation channel 122, and the first conductive member 31 is disposed in the first installation channel 122.
  • the number of the first gas path channel 121 and the first installation channel 122 is not limited, and their functions are also not limited.
  • the polishing head 2 has a second adsorption end surface 21, and at least a second channel 22 is formed on the polishing head 2, and one end of the second channel 22 extends to the second adsorption end surface 21.
  • the second adsorption end surface 21 is a horizontal plane
  • the upper end of the second channel 22 extends to the second adsorption end surface 21, and the second channel 22 extends along the axial direction of the polishing head 2.
  • the conductive member at least includes a first conductive member 31 having one end connected to a power source, and the first conductive member 31 is disposed in the first channel 12.
  • first conductive member 31 having one end connected to a power source
  • the conductive member 31 is disposed in the first channel 12.
  • most of the axial length of the first channel 12 is occupied by the first conductive member 31, or a small part of the axial length is occupied by the first conductive member 31.
  • the entire axial length of the first channel 12 can also be occupied by the first active end 41 of the conductive interface assembly 4, and the first conductive member 31 is connected to the first active end 41 and is located outside the first channel 12, as shown in FIG10.
  • the first conductive member 31 is a wire.
  • the conductive interface component 4 at least includes a first action end 41 and a second action end 42, at least a portion of the first action end 41 is disposed in the first channel 12, and the first action end 41 is electrically connected to the first conductive member 31. At least a portion of the second action end 42 is disposed in the second channel 22.
  • the first action end 41 and the second action end 42 are made of conductive material.
  • the first action end 41 and the second action end 42 may be partially made of conductive material and partially made of non-conductive material, without any specific limitation, as long as the conductive function can be achieved.
  • the conductive interface component 4 also includes a mounting frame 44 made of insulating material, and the mounting frame 44 is connected to the polishing head 2.
  • the specific connection method is not limited.
  • the mounting frame 44 is non-conductive and can isolate the second working end 42 from the polishing head 2 to prevent leakage.
  • the second working end 42 is connected to the mounting frame 44.
  • the mounting frame 44 is formed by splicing an upper body 443 and a lower body 444.
  • An elastic member 441 is provided in the mounting frame 44.
  • the outer wall of the second working end 42 forms a flange 442.
  • One end of the elastic member 441 abuts against the flange 442, and the other end abuts against the lower body 444 of the mounting frame 44.
  • the flange 442 abuts against the upper body 443 of the mounting frame 44, and the second working end 42 is connected to the mounting frame 44.
  • the two ends of the second action end 42 extend out from the upper and lower openings of the mounting frame 44 respectively, so as to ensure that the second action end 42 can effectively contact and conduct with the first action end 41 .
  • the first action end 41 and the second action end 42 are in contact and connected, thereby realizing the electrical connection of the polishing head 2.
  • the power source is connected to the polishing head 2 after passing through the first conductive member 31, the first action end 41, and the second action end 42, so that the polishing head 2 is charged.
  • a limiting groove 411 is provided on the end surface of the first action end 41 , and a portion of the second action end 42 is inserted into the limiting groove 411 .
  • the first action end 41 and the second action end 42 can be magnetically attracted to each other, that is, the first action end 41 and the second action end 42 are not only conductive but also magnetic.
  • the second working end 42 and the first working end 41 may be connected to the polishing head 2 or the loading component 1 through the liquid, causing leakage; second, the liquid may corrode the second working end 42 and the first working end 41.
  • a seal 47 is disposed on the outside of the conductive interface component 4. After the first adsorption end face 11 and the second adsorption end face 21 are attached, an extrusion seal is formed on the seal 47.
  • the seal 47 can be embedded in the mounting groove of the second adsorption end face 21, or in the mounting groove of the first adsorption end face 11, without any specific limitation. As long as the seal between the first adsorption end face 11 and the second adsorption end face 21 can be achieved, water can be prevented from entering the conductive interface component 4, and the risk of water leakage and corrosion can be avoided.
  • the conductive member further includes a second conductive member 32 connected to the second acting end 42 .
  • the second action end 42 can be used to directly conduct electricity with the polishing head 2.
  • the second conductive member 32 is electrically connected to the polishing head 2, and the power source is connected to the polishing head 2 after passing through the first conductive member 31, the first action end 41, the second action end 42 and the second conductive member 32, so that the polishing head 2 is charged.
  • the number of the second channels 22 may be one or two or more. As shown in FIG6 , the second channel 22 includes a second gas path channel 221 and a second mounting channel 222, and the second conductive member 32 is disposed in the second mounting channel 222.
  • the number of the second gas path channel 221 and the second mounting channel 222 is not limited, and their functions are not limited either.
  • the first gas channel 121 and the second gas channel 221 are connected vertically. After the first gas channel 121 and the second gas channel 221 correspond one to another, they are connected to the fixed gas port through the upper rotary joint 5.
  • At least a portion of the first action end 41 is located in the first channel 12
  • at least a portion of the second action end 42 is located in the second channel 22 .
  • the structure identical to the first action end 41 can be located in the second channel 22
  • the structure identical to the second action end 42 can be located in the first channel 12 .
  • the structures in the third embodiment are interchanged up and down.
  • a limiting groove is provided on the surface of the second action end for partially inserting the first action end.
  • the first action end 41 may protrude from the first adsorption end surface 11 , and when the first adsorption end surface 11 and the second adsorption end surface 21 are in contact, the first action end 41 extends into the second channel 22 and contacts and conducts with the second action end 42 .
  • the second action end 42 protrudes from the second adsorption end surface 21 by a greater length, and the first action end 41 is located deeper inside the first channel 12.
  • the second action end 42 extends into the first channel 12 and contacts and conducts with the first action end 41.
  • the groove 13 on the loading part 1 for mounting the fixing member 43 and the first action end 41 is deep enough to accommodate the second action end 42 and most of the mounting frame 44.
  • the mounting frame 44 can be disassembled.
  • a groove with a greater depth may be formed on the polishing head 2 to accommodate the first action end 41 .
  • a mounting hole 45 is formed at the first active end 41, and an internal thread is formed in the mounting hole 45.
  • the first conductive component 31 is connected to the conductive adapter 46, and specifically can be wound around the outer periphery of the conductive connecting component 46.
  • the conductive connecting component 46 has an external thread, which can be threadedly connected to the mounting hole 45, thereby realizing a detachable connection between the first conductive component 31 and the first active end 42.
  • a second mounting hole 48 is formed at the second active end 42, and an internal thread is formed in the second mounting hole 48.
  • the second conductive member 32 is connected to the second conductive adapter 49, and specifically can be wound around the outer periphery of the second conductive adapter 49.
  • the second conductive adapter 49 has an external thread, which can be threadedly connected to the second mounting hole 48, thereby achieving a detachable connection between the second conductive adapter 49 and the second active end 42.
  • first conductive member 31 and the first active end 42 may be directly welded, or the first active end 42 may be a part of the first conductive member 31 , which is not specifically limited.
  • the first channel 12 extends along the axial direction of the loading component 1. As shown in FIG16 , the first channel 12 does not necessarily extend in a straight line along the axial direction of the loading component 1, but may extend in a curved manner, the lower end of the first channel 12 is located at the first adsorption end surface 11, and the upper end of the first channel 12 may be located at the upper end surface opposite to the first adsorption end surface 11, or may be located at the side wall of the loading component 1, without specific limitation.
  • the second channel 12 does not necessarily extend in a straight line, but may extend in a curved manner.
  • the first channel 12 is located inside the loading component 1. As shown in FIG17 , the first channel 12 can also be arranged in the outer area of the loading component 1, which includes the outer wall and the area around the loading component 1.
  • the conductive interface component 4 does not necessarily have to be a complex structure as in the above-mentioned embodiment three. It can be a simple structure, in which the first active end 41 directly extends the entire first channel 12, the second active end 42 directly extends the entire second channel 22, and the upper end of the second active end 42 is flush with the second adsorption end surface 21.
  • the polishing head 1 includes an adsorption film 23 for adsorbing the wafer, at least part of which is made of a conductive material and is electrically connected to the second active end 42 or the second conductive member 32. Specifically, in the tenth embodiment, the lower end of the second active end 42 extends to the adsorption film 23.
  • the adsorption film 23 is a flexible film, or a metal film, or a metal and non-metal combination film.
  • the polishing head 1 comprises a retaining ring 24 for fixing the wafer in the polishing head, which is at least partially made of a conductive material and is electrically connected to the second active end 42 or the second conductive member 32 .
  • the retaining ring 24 and the adsorption film 23 in the eleventh embodiment may exist at the same time or separately, and there is no specific limitation.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明公开了一种导电型抛光头固定装置，包括：装载部件（1），具有可与抛光头（2）配合连接的第一吸附端面（11）；且至少形成有第一通道（12），所述第一通道（12）的一端延伸至第一吸附端面（11）；第一导电件（31），一端与电源连接；导电接口组件（4），至少包括第一作用端（41），该第一作用端（41）的至少部分设于第一通道（12），且与所述第一导电件（31）电连接。本发明还公开了一种导电型抛光头系统。本发明在装载部件（1）和抛光头（2）上设置第一通道（12）、第二通道（22），在第一通道（12）和第二通道（22）内分别设置第一导电件（31）和第二导电件（32），可以实现抛光头（2）的导电；还设置有导电接口组件（4），使得导电型抛光头方便快捷地拆卸和安装。

Description

一种导电型抛光头固定装置及导电型抛光头系统 技术领域
本发明属于半导体集成电路芯片制造技术领域，尤其是涉及一种导电型抛光头固定装置及导电型抛光头系统。
背景技术
晶圆衬底和半导体器件制造过程包含抛光、表面平坦化等工艺，通常采用机械抛光，化学机械抛光或平坦化等技术，通过晶圆衬底载头(抛光头)向晶背加压，控制压力、抛光头转速、抛光盘转速、抛光液液体流量等参数，在抛光垫上对晶圆衬底正表面或薄膜表面进行抛光或平坦化处理。和机械抛光相比，化学机械抛光和化学机械抛光平坦化通过对抛光液配方的调整，在晶圆衬底表面产生化学反应，可以实现更高的抛光或平坦化处理效率，同时可以实现更好的抛光或平坦化处理效果，包括更高的平整度、更低的缺陷度等。
在化学机械抛光和平坦化的基础上，电化学机械抛光和平坦化可以进一步利用晶圆衬底或晶圆衬底表面薄膜的导电特性，形成电流通路，在晶圆衬底或薄膜表面进行电化学反应，通过电路系统的精密控制，提高表面化学反应速度，进而提高机械抛光和平坦化效率。
因种种难点，目前市场上尚无适合大规模量产的电化学机械抛光、平坦化设备。
化学机械抛光及平坦化设备的抛光头有一特点，即需要经常拆卸维护，需要更换耗材，清洗结晶等。故抛光头有拆装方便，稳定可靠的需求。同理，适用于电化学机械抛光及平坦化设备的抛光头也有相同的需求，但对于需要和外接导线连接的带电抛光头，在拆装时的导线通断是个难题。
发明内容
为了克服现有技术的不足，本发明提供一种可以实现抛光头的导电，且抛光头更换方便，使用灵活度高的导电型抛光头固定装置及导电型抛光头系统。
本发明解决其技术问题所采用的技术方案是：一种导电型抛光头固定装置，包括：
装载部件，具有可与抛光头配合连接的第一吸附端面；且至少形成有第一通道，所述第一通道的一端延伸至第一吸附端面；
第一导电件，一端与电源连接；
导电接口组件，至少包括第一作用端，该第一作用端的至少部分设于第一通道，且与所述第一导电件电连接。
进一步的，所述第一作用端由导电材质制成。
进一步的，所述导电接口组件还包括由绝缘材质制成的固定件，该固定件与 装载部件相连，所述第一作用端与固定件相连。
进一步的，所述装载部件与旋转接头相连，所述装载部件可旋转。
进一步的，所述第一通道沿着装载部件的轴向延伸。
进一步的，所述第一导电件穿设在所述第一通道内。
进一步的，所述第一通道包括第一气路通道和第一安装通道，所述第一导电件穿设在第一安装通道内。
进一步的，所述第一通道设于装载部件内，或者，所述第一通道设于装载部件外侧区域；或者，所述第一通道设于装载部件外侧壁。
本发明还公开了一种导电型抛光头系统，包括：
装载部件，具有第一吸附端面；且至少形成有第一通道，所述第一通道的一端延伸至第一吸附端面；
抛光头，具有第二吸附端面；且至少形成有第二通道，所述第二通道的一端延伸至第二吸附端面；
导电件，至少包括一端与电源连接的第一导电件；
导电接口组件，至少包括与所述第一导电件相连的第一作用端，及第二作用端，该第一作用端和第二作用端的至少部分设于第一通道和/或第二通道；
当第一吸附端面和第二吸附端面贴合时，所述第一作用端和第二作用端接触导通，以实现抛光头的电连接。
进一步的，所述第一作用端由导电材质制成，所述第二作用端由导电材质制成。
进一步的，所述导电件还包括第二导电件，其与第二作用端相连。
进一步的，所述导电接口组件还包括由绝缘材质制成的固定件，所述固定件与装载部件或抛光头相连，所述第一作用端或第二作用端与该固定件相连。
进一步的，所述导电接口组件还包括由绝缘材质制成的安装框，所述安装框与抛光头或装载部件相连，所述第二作用端或第一作用端与该安装框相连。
进一步的，所述安装框内设有弹性件，所述第二作用端或第一作用端外壁形成可与弹性件相抵的凸缘，在弹性件伸展状态下，所述凸缘与安装框内壁相抵，且第二作用端或第一作用端的两端分别从安装框的两侧开口伸出。
进一步的，所述第一作用端和第二作用端可磁吸吸合。
进一步的，所述安装框由上部体和下部体拼合形成。
进一步的，所述装载部件与旋转接头相连，所述抛光头可与装载部件同步旋转。
进一步的，所述第一通道沿着装载部件的轴向延伸。
进一步的，所述第一通道包括第一气路通道和第一安装通道，所述第一导电 件穿设在第一安装通道内；所述第二通道包括第二气路通道和第二安装通道，所述第二导电件穿设在第二安装通道内。
进一步的，所述第一气路通道和第二气路通道上下联通。
进一步的，所述第一作用端或/和第二作用端形成安装孔，所述第一导电件或/和第二导电件与导电转接件相连，该导电转接件可与安装孔螺纹连接。
进一步的，所述第一作用端的端面设有供第二作用端的部分插入的限位卡槽；或者，所述第二作用端的表面设有供第一作用端的部分插入的限位卡槽。
进一步的，所述导电接口组件外侧设有密封件，所述第一吸附端面和第二吸附端面贴合对该密封件形成挤压密封。
进一步的，所述抛光头包括用于吸附晶圆的吸附膜，其至少部分由导电材质制成，且与第二作用端或第二导电件电连接。
进一步的，所述吸附膜为柔性膜，或为金属膜，或为金属和非金属结合膜。
进一步的，所述抛光头包括用于固定晶圆在所述抛光头内的保持环，其至少部分由导电材质制成，且与第二作用端或第二导电件电连接。
进一步的，所述第一通道设于装载部件内，或者，所述第一通道设于装载部件外侧区域；或者，所述第一通道设于装载部件外侧壁。
本发明是一种全新的适用于大规模量产的电化学机械抛光、平坦化设备的机械结构，优势是在不影响原有的化学机械抛光、平坦化设备的基础机构的条件下，可以较容易地使之改造成电化学机械抛光、平坦化设备，且兼容原有的功能，即同时适配带电抛光头和普通抛光头。
本发明的有益效果是，1)针对抛光头带电，提供了一种简单可靠的解决办法；2)装载部件和抛光头上新设第一通道、第二通道，在不影响现有结构基础上可以实现抛光头的导电；3)设置有导电接口组件，能满足方便快捷地拆卸和安装可通电抛光头的需求；4)装载部件和抛光头上通道的数量可以根据需求设置，也可一个通道内存在多根导线，或和多根导线连通，可以满足多根导线连通的需求；5)导电接口组件可分为在装载部件和抛光头的两部分，方便日常的拆卸和维护；6)导电接口组件的两个部分各自可以有不同的功能，相互配合可以形成不同的功能。
附图说明
图1为本发明实施例一中导电型抛光头固定装置和抛光头的配合结构剖视图。
图2为本发明实施例一中导电型抛光头固定装置和抛光头、旋转接头的配合结构剖视图。
图3为本发明实施例三中导电型抛光头系统的俯视图。
图4为图3中的C-C剖视图。
图5为图4中的A处结构放大图。
图6为图3中的B-B剖视图。
图7为本发明实施例三中导电接口组件的俯视图。
图8为图7中的D-D剖视图，此时第一作用端和第二作用端未接合导通。
图9为图7中的D-D剖视图，此时第一作用端和第二作用端接合导通。
图10为本发明实施例三中导电型抛光头系统的俯视图，此时第一作用端延伸整个第一通道。
图11为本发明实施例三中导电接口组件所在部分放大图，此时第一吸附端面和第二吸附端面之间设有密封件。
图12为本发明实施例五中导电接口组件的剖视图。
图13为本发明实施例六中导电型抛光头系统的剖视图。
图14为图13中的E处结构放大图。
图15为本发明实施例七中导电接口组件的剖视图。
图16为本发明实施例八中导电型抛光头系统的剖视图。
图17为本发明实施例九中导电型抛光头系统的剖视图。
图18为本发明实施例十中导电型抛光头系统的主视图。
图19为图18中的F-F剖视图。
具体实施方式
为了使本技术领域的人员更好的理解本发明方案，下面将结合本发明实施例中的附图，对发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
实施例一
如图1所示，一种导电型抛光头固定装置，包括装载部件1，第一导电件31，及导电接口组件4。
装载部件1具有可以与抛光头2配合连接的第一吸附端面11，且在装载部件1上至少形成有第一通道12，该第一通道12的一端延伸至第一吸附端面11。以图1所示方向为例进行说明，第一吸附端面11为水平面，第一通道12的下端延伸至第一吸附端面11，且第一通道12沿着装载部件1的轴向延伸，贯穿装载部件1。
如图2所示，装载部件1的上部可以与旋转接头5相连，且装载部件1可以旋转。
第一通道12的数量可以为一个，也可以为两个及以上，如图2所示，第一通道12包括第一气路通道121和第一安装通道122，第一导电件31穿设在第一安装通道122内。第一气路通道121和第一安装通道122的数量不作限制，其作用也不作限制，如第一气路通道121内可以通电，可以设置超声装置，微波装置，电磁装置，磁吸装置，导光装置，也可以通液体等。
第一导电件31的一端与电源(图中未示出)连接，该第一导电件31穿设在第一通道12内。此处第一通道12的大部分轴向长度被第一导电件31占据，也可以是小部分轴向长度被第一导电件31占据。当然，还可以是第一通道12的整个轴向长度被导电接口组件4的第一作用端41占据，而第一导电件31连接在第一作用端41上，并且位于第一通道12外部。在本实施例中，第一导电件31为电线。
导电接口组件4至少包括第一作用端41，该第一作用端41的至少部分设置在第一通道12内，且第一作用端41与第一导电件31电连接。在本实施例中，第一作用端41由导电材质制成，当然在其他实施例中，第一作用端41可以是部分由导电材质制成，部分由非导电材质制成，具体不作限制，只要可以实现导电功能即可。
为了方便第一作用端41和装载部件1之间的装配连接，导电接口组件4还包括由绝缘材质制成的固定件43，该固定件43与装载部件1相连，第一作用端41与固定件43相连。固定件43和装载部件1之间的连接方式可以是螺栓连接等方式，而第一作用端41和固定件43之间的连接方式可以是过盈配合连接，具体不作限制。
当然，如图2所示，第一作用端41也可以是嵌设在装载部件1内的柱形导电体，不需要固定件43。
实施例二
一种抛光头系统，包括导电型抛光头固定装置及抛光头2。导电型抛光头固定装置中装载部件1、第一导电件31和导电接口组件4的结构与实施例一相同，不再赘述。
抛光头2为现有技术中的抛光头，其抛光头2不导电，其顶面为可与第一吸附端面11贴合的第二吸附端面21。抛光头2内部都有数个气囊，通过控制气囊内部的气压大小，以此来对晶圆背部各个区域产生压力，以此来控制抛光效果。
当第一吸附端面11和第二吸附端面21贴合后，在第一气路通道121内形成负压，使得装载部件1吸附抛光头2，可以旋转，装载部件1和抛光头2可以一起旋转，实现晶圆的抛光工艺。
实施例三
如图3-图10所示，一种导电型抛光头系统，包括装载部件1，抛光头2，导电件，及导电接口组件4。
装载部件1具有第一吸附端面11，且在装载部件1上至少形成有第一通道12，该第一通道12的一端延伸至第一吸附端面11。以图4所示方向为例进行说明，第一吸附端面11为水平面，第一通道12的下端延伸至第一吸附端面11，且第一通道12沿着装载部件1的轴向延伸，贯穿装载部件1。
装载部件1的上部可以与旋转接头5相连，且装载部件1可以绕着自身的中心线旋转。
第一通道12的数量可以为一个，也可以多两个及以上，第一通道12包括第一气路通道121和第一安装通道122，第一导电件31穿设在第一安装通道122内。第一气路通道121和第一安装通道122的数量不作限制，其作用也不作限制。
抛光头2具有第二吸附端面21，且在抛光头2上至少形成有第二通道22，该第二通道22的一端延伸至第二吸附端面21。以图4所示方向为例进行说明，第二吸附端面21为水平面，第二通道22的上端延伸至第二吸附端面21，且第二通道22沿着抛光头2的轴向延伸。
导电件至少包括一端与电源连接的第一导电件31，该第一导电件31穿设在第一通道12内。此处第一通道12的大部分轴向长度被第一导电件31占据，也可以是小部分轴向长度被第一导电件31占据。当然，还可以是第一通道12的整个轴向长度被导电接口组件4的第一作用端41占据，而第一导电件31连接在第一作用端41上，并且位于第一通道12外部，如图10所示。在本实施例中，第一导电件31为电线。
导电接口组件4至少包括第一作用端41及第二作用端42，该第一作用端41的至少部分设置在第一通道12内，且第一作用端41与第一导电件31电连接。第二作用端42的至少部分设置在第二通道22内。在本实施例中，第一作用端41和第二作用端42由导电材质制成，当然在其他实施例中，第一作用端41和第二作用端42可以是部分由导电材质制成，部分由非导电材质制成，具体不作限制，只要可以实现导电功能即可。
为了方便第二作用端42和抛光头2之间的装配连接，导电接口组件4还包括由绝缘材质制成的安装框44，该安装框44与抛光头2相连，具体的连接方式不作限定。安装框44不导电，可以将第二作用端42与抛光头2隔离，防止漏电。第二作用端42与安装框44相连，具体的，安装框44由上部体443和下部体444拼合形成，在安装框44内设置有弹性件441，第二作用端42的外壁形成凸缘442，弹性件441的一端与凸缘442相抵，其另一端与安装框44的下部体444相抵，在弹性件441伸展状态下，凸缘442与安装框44的上部体443相抵，且第二作 用端42的两端分别从安装框44的上下两侧开口伸出，保证第二作用端42可以和第一作用端41有效接触导通。
当第一吸附端面11和第二吸附端面21贴合时，第一作用端41和第二作用端42接触导通，从而实现抛光头2的电连接。换句话说，电源通过第一导电件31、第一作用端41、第二作用端42后与抛光头2导通，实现抛光头2带电。
为了保证第一作用端41和第二作用端42之间的有效接合，保证导电通路的形成，在第一作用端41的端面设有限位卡槽411，第二作用端42的部分插入该限位卡槽411内。
为了进一步保证第一作用端41和第二作用端42之间的有效接合，第一作用端41和第二作用端42可以磁吸吸合，也就是说，第一作用端41和第二作用端42不仅导电，还带有磁性。
因抛光头2工作区域是湿润的，可能有液体会渗入抛光头2与装载部件1之间，存在两种风险，一是可能使第二作用端42和第一作用端41通过液体与抛光头2或装载部件1导通，导致漏电；二是液体可能腐蚀第二作用端42和第一作用端41。
如图11所示，导电接口组件4外侧设置有密封件47，第一吸附端面11和第二吸附端面21贴合后，对该密封件47形成挤压密封作用。密封件47可以嵌设在第二吸附端面21的安装槽内，也可以嵌设在第一吸附端面11的安装槽内，具体不作限制。只要可以实现第一吸附端面11和第二吸附端面21之间的密封，避免水进入导电接口组件4内即可，避免漏水和腐蚀的风险。
实施例四
在本实施例中，导电件还包括第二导电件32，其与第二作用端42相连。
换句话说，在实施例三中，可以利用第二作用端42直接与抛光头2实现电导通。而在本实施例中，第二导电件32与抛光头2电导通，电源通过第一导电件31、第一作用端41、第二作用端42和第二导电件32后与抛光头2导通，实现抛光头2带电。
第二通道22的数量可以为一个，也可以为两个及以上。如图6所示，第二通道22包括第二气路通道221和第二安装通道222，第二导电件32穿设在第二安装通道222内。第二气路通道221和第二安装通道222的数量不作限制，其作用也不作限制。
为了保证装载部件1和抛光头2之间的有效吸合，第一气路通道121和第二气路通道221上下联通。第一气路通道121和第二气路通道221上下一一对应后，通过上方的旋转接头5与固定的气口连接。
实施例五
在实施例三中，第一作用端41的至少部分位于第一通道12，第二作用端42的至少部分位于第二通道22。
如图12所示，在本实施例中，与上述第一作用端41相同的结构可以位于第二通道22，与上述第二作用端42相同的结构可以位于第一通道12，换句话说，将实施例三中的结构上下互换。
此时，第二作用端的表面设有供第一作用端的部分插入的限位卡槽。
当然在其他实施例中，还可以是第一作用端41突出于第一吸附端面11，当第一吸附端面11和第二吸附端面21贴合时，第一作用端41伸入第二通道22内与第二作用端42接触导通。
或者，第二作用端42突出于第二吸附端面21的长度较大，第一作用端41位于第一通道12内部较深处，当第一吸附端面11和第二吸附端面21贴合时，第二作用端42伸入第一通道12内与第一作用端41接触导通。
实施例六
如图5所示，当装载部件1完成与固定件43的安装时，固定件43的端面与第一吸附端面11相齐平；当安装框44完成与抛光头2的安装时，安装框44的端面与第二吸附端面21相齐平。
如图13、14所示，在本实施例中，装载部件1上用于安装固定件43和第一作用端41的凹槽13深度较大，其可以容纳第二作用端42和安装框44的大部分。当抛光头2不需要带电时，可以将安装框44拆卸。
当然，在其他实施例中，也可以是在抛光头2上形成深度较大的凹槽，以将第一作用端41也容纳。
实施例七
在实施例四的基础上，为了实现第一导电件31和第一作用端41的装配连接，在第一作用端41形成安装孔45，安装孔45内形成内螺纹，第一导电件31连接在导电转接件46上，具体可以是缠绕在导电连接件46外周，导电连接件46具有外螺纹，其可以与安装孔45螺纹连接，从而实现第一导电件31和第一作用端42的可拆卸连接。
同样的，为了实现第二导电件32和第二作用端42的装配连接，在第二作用端42形成第二安装孔48，第二安装孔48内形成内螺纹，第二导电件32连接在第二导电转接件49上，具体可以是缠绕在第二导电转接件49外周，第二导电转接件49具有外螺纹，其可以与第二安装孔48螺纹连接，从而实现第二导电转接件49和第二作用端42的可拆卸连接。
当然，在其他实施例中，第一导电件31和第一作用端42可以直接焊接，或者第一作用端42是第一导电件31自带的一部分，具体不作限制。
实施例八
在上述实施例中，第一通道12沿着装载部件1的轴向延伸。如图16所示，第一通道12不一定沿着装载部件1的轴向直线延伸，而可以是弯曲延伸，第一通道12的下端位于第一吸附端面11，第一通道12的上端可以位于与第一吸附端面11相对的上端面，也可以位于装载部件1的侧壁，具体不作限制。
同样的，第二通道12也不一定是直线延伸，其可以弯曲延伸。
实施例九
在上述实施例中，第一通道12位于装载部件1内部。如图17所示，第一通道12还可以设置在装载部件1的外侧区域，该外侧区域包括外侧壁，还包括装载部件1外周的区域。
实施例十
如图18、19所示，导电接口组件4不一定要如上述实施例三中的复杂结构，其可以为简单的结构，第一作用端41直接延伸整个第一通道12，第二作用端42直接延伸整个第二通道22，并且第二作用端42的上端与第二吸附端面21齐平。
实施例十一
在上述实施例的基础上，抛光头1包括用于吸附晶圆的吸附膜23，该吸附膜23的至少部分由导电材质制成，且与第二作用端42或者与第二导电件32电连接。具体的，在实施例十中，第二作用端42，的下端延伸至吸附膜23。
上述吸附膜23为柔性膜，或者为金属膜，或者为金属和非金属结合膜。
实施例十二
在上述实施例的基础上，抛光头1包括用于将晶圆固定在所述抛光头内的保持环24，其至少部分由导电材质制成，且与第二作用端42或者与第二导电件32电连接。
保持环24与实施例十一中的吸附膜23可以同时存在，也可以单独存在，具体不作限制。
上述各个实施例之间的结构可以以不同组合的方式出现，具体不作限制。
上述具体实施方式用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利要求的保护范围内，对本发明作出的任何修改和改变，都落入本发明的保护范围。

Claims (27)

  1. 一种导电型抛光头固定装置，其特征在于，包括：
    装载部件(1)，具有可与抛光头(2)配合连接的第一吸附端面(11)；且至少形成有第一通道(12)，所述第一通道(12)的一端延伸至第一吸附端面(11)；
    第一导电件(31)，一端与电源连接；
    导电接口组件(4)，至少包括第一作用端(41)，该第一作用端(41)的至少部分设于第一通道(12)，且与所述第一导电件(31)电连接。
  2. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述第一作用端(41)由导电材质制成。
  3. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述导电接口组件(4)还包括由绝缘材质制成的固定件(43)，该固定件(43)与装载部件(1)相连，所述第一作用端(41)与固定件(43)相连。
  4. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述装载部件(1)与旋转接头(5)相连，所述装载部件(1)可旋转。
  5. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述第一通道(12)沿着装载部件(1)的轴向延伸。
  6. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述第一导电件(31)穿设在所述第一通道(12)内。
  7. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述第一通道(12)包括第一气路通道(121)和第一安装通道(122)，所述第一导电件(31)穿设在第一安装通道(122)内。
  8. 根据权利要求1所述的导电型抛光头固定装置，其特征在于：所述第一通道(12)设于装载部件(1)内，或者，所述第一通道(12)设于装载部件(1)外侧区域；或者，所述第一通道(12)设于装载部件(1)外侧壁。
  9. 一种导电型抛光头系统，其特征在于，包括：
    装载部件(1)，具有第一吸附端面(11)；且至少形成有第一通道(12)，所述第一通道(12)的一端延伸至第一吸附端面(11)；
    抛光头(2)，具有第二吸附端面(21)；且至少形成有第二通道(22)，所述第二通道(22)的一端延伸至第二吸附端面(21)；
    导电件，至少包括一端与电源连接的第一导电件(31)；
    导电接口组件(4)，至少包括与所述第一导电件(31)相连的第一作用端(41)，及第二作用端(42)，该第一作用端(41)和第二作用端(42)的至少部分设于第一通道(12)和/或第二通道(22)；
    当第一吸附端面(11)和第二吸附端面(21)贴合时，所述第一作用端(41)和第二作用端(42)接触导通，以实现抛光头(2)的电连接。
  10. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一作用端(41)由导 电材质制成，所述第二作用端(42)由导电材质制成。
  11. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述导电件还包括第二导电件(32)，其与第二作用端(42)相连。
  12. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述导电接口组件(4)还包括由绝缘材质制成的固定件(43)，所述固定件(43)与装载部件(1)或抛光头(2)相连，所述第一作用端(41)或第二作用端(42)与该固定件(43)相连。
  13. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述导电接口组件(4)还包括由绝缘材质制成的安装框(44)，所述安装框(44)与抛光头(2)或装载部件(1)相连，所述第二作用端(42)或第一作用端(41)与该安装框(44)相连。
  14. 根据权利要求12所述的导电型抛光头系统，其特征在于：所述安装框(44)内设有弹性件(441)，所述第二作用端(42)或第一作用端(41)外壁形成可与弹性件(441)相抵的凸缘(442)，在弹性件(441)伸展状态下，所述凸缘(442)与安装框(44)内壁相抵，且第二作用端(42)或第一作用端(41)的两端分别从安装框(44)的两侧开口伸出。
  15. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一作用端(41)和第二作用端(42)可磁吸吸合。
  16. 根据权利要求12所述的导电型抛光头系统，其特征在于：所述安装框(44)由上部体(443)和下部体(444)拼合形成。
  17. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述装载部件(1)与旋转接头(5)相连，所述抛光头(2)可与装载部件(1)同步旋转。
  18. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一通道(12)沿着装载部件(1)的轴向延伸。
  19. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一通道(12)包括第一气路通道(121)和第一安装通道(122)，所述第一导电件(31)穿设在第一安装通道(122)内；所述第二通道(22)包括第二气路通道(221)和第二安装通道(222)，所述第二导电件(32)穿设在第二安装通道(222)内。
  20. 根据权利要求18所述的导电型抛光头系统，其特征在于：所述第一气路通道(121)和第二气路通道(221)上下联通。
  21. 根据权利要求8所述的导电型抛光头系统，其特征在于：所述第一作用端(41)或/和第二作用端(42)形成安装孔(45)，所述第一导电件(31)或/和第二导电件(32)与导电转接件(46)相连，该导电转接件(46)可与安装孔(45)螺纹连接。
  22. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一作用端(41)的端面设有供第二作用端(42)的部分插入的限位卡槽(411)；或者，所述第二作用端的表面设有供第一作用端的部分插入的限位卡槽。
  23. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述导电接口组件(4)外 侧设有密封件(47)，所述第一吸附端面(11)和第二吸附端面(21)贴合对该密封件(47)形成挤压密封。
  24. 根据权利要求11所述的导电型抛光头系统，其特征在于：所述抛光头(2)包括用于吸附晶圆的吸附膜(23)，其至少部分由导电材质制成，且与第二作用端(42)或第二导电件(32)电连接。
  25. 根据权利要求24所述的导电型抛光头系统，其特征在于：所述吸附膜(23)为柔性膜，或为金属膜，或为金属和非金属结合膜。
  26. 根据权利要求11所述的导电型抛光头系统，其特征在于：所述抛光头(2)包括用于固定晶圆在所述抛光头内的保持环(24)，其至少部分由导电材质制成，且与第二作用端(42)或第二导电件(32)电连接。
  27. 根据权利要求9所述的导电型抛光头系统，其特征在于：所述第一通道(12)设于装载部件(1)内，或者，所述第一通道(12)设于装载部件(1)外侧区域；或者，所述第一通道(12)设于装载部件(1)外侧壁。
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