WO2024070919A1 - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法 Download PDF

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Publication number
WO2024070919A1
WO2024070919A1 PCT/JP2023/034420 JP2023034420W WO2024070919A1 WO 2024070919 A1 WO2024070919 A1 WO 2024070919A1 JP 2023034420 W JP2023034420 W JP 2023034420W WO 2024070919 A1 WO2024070919 A1 WO 2024070919A1
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WIPO (PCT)
Prior art keywords
organic resin
hole
insulating substrate
wiring board
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/034420
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English (en)
French (fr)
Japanese (ja)
Inventor
忠 長澤
智士 芦浦
卓 石岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2024549300A priority Critical patent/JPWO2024070919A1/ja
Priority to US19/111,799 priority patent/US20260101438A1/en
Publication of WO2024070919A1 publication Critical patent/WO2024070919A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • This disclosure relates to a wiring board and a method for manufacturing the same.
  • Wiring boards for communications, radar, etc. require the provision of a waveguide within the wiring board.
  • a through-hole that penetrates the top and bottom surfaces of the wiring board is used as the waveguide as is, or as described in Patent Document 1, a through-hole that penetrates the top and bottom surfaces of the wiring board is filled with resin and used as the waveguide.
  • an antenna board and a control board must be prepared and assembled separately.
  • the wiring board can be integrated with the antenna board and the control board.
  • the resin When resin is filled into through holes that penetrate the top and bottom surfaces of a wiring board to be used as a waveguide, the resin is filled by, for example, a printing method. When resin is filled by printing, voids are formed in the resin. This results in an uneven dielectric constant and large losses due to reflection.
  • the wiring board according to the present disclosure includes an insulating substrate having a through hole, a conductor layer located on the inner wall surface of the through hole and on at least a portion of the surface of the insulating substrate, and an organic resin layer that covers the insulating substrate and the conductor layer.
  • the organic resin layer has a filling portion located within the through hole.
  • the method for manufacturing a wiring board according to the present disclosure includes the steps of preparing an insulating substrate having a through hole, forming a conductor layer on at least a portion of the inner wall surface of the through hole and the surface of the insulating substrate, covering the insulating substrate and the conductor layer with an organic resin film, subjecting the substrate to a heating and pressurizing treatment to fill a portion of the organic resin film into the through hole, and curing the organic resin film to form an organic resin layer.
  • FIG. 2 is an explanatory diagram for explaining a main part of a wiring board according to an embodiment of the present disclosure.
  • 13 is an explanatory diagram for explaining a main part of a wiring board according to another embodiment of the present disclosure.
  • the resin when resin is filled into through holes that penetrate the top and bottom surfaces of a wiring board to be used as a waveguide, the resin is filled by, for example, a printing method.
  • voids are formed in the resin. This causes the dielectric constant to become non-uniform, resulting in large losses due to reflection.
  • the wiring board according to the present disclosure has a configuration as described in the section on means for solving the above problems, and thus has low dielectric loss in the through-holes filled with resin. Furthermore, according to the method for manufacturing a wiring board according to the present disclosure, the formation of voids is reduced when filling the through-holes with resin, and thus a wiring board can be obtained in which the resin-filled through-holes function as waveguides with low dielectric loss.
  • FIG. 1 is an explanatory diagram for explaining the main parts of a wiring board according to an embodiment of the present disclosure. Specifically, FIG. 1 shows the vicinity of a through hole 11 formed in an insulating substrate 1.
  • the insulating substrate 1 is not limited as long as it is made of an insulating material.
  • insulating materials include resins and ceramics.
  • resins include epoxy resins, bismaleimide-triazine resins, polyimide resins, polyphenylene ether resins, and liquid crystal polymers. These resins may be used alone or in combination of two or more.
  • ceramics include alumina. There are no particular limitations on the thickness of the insulating substrate 1, and it is, for example, 0.2 mm or more and 3.0 mm or less.
  • the insulating substrate 1 may contain an inorganic insulating filler.
  • inorganic insulating fillers include silica, alumina, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.
  • the inorganic insulating fillers may be used alone or in combination of two or more types.
  • the insulating substrate 1 may contain a reinforcing material.
  • reinforcing materials include insulating fabric materials such as glass fiber, glass nonwoven fabric, aramid nonwoven fabric, aramid fiber, and polyester fiber.
  • the reinforcing materials may be used alone or in combination of two or more types.
  • the insulating substrate 1 includes through holes 11 that penetrate from the top surface to the bottom surface.
  • the through holes 11 are holes for positioning the conductor layer 2 in order to electrically connect the top and bottom surfaces of the insulating substrate 1.
  • the number of through holes 11 is set appropriately depending on factors such as the size of the wiring substrate. Typically, the number of through holes 11 included in one wiring substrate is 1,000 or more and 30,000 or less. Furthermore, the aperture of the through holes 11 is, for example, 200 ⁇ m or more and 2,000 ⁇ m or less.
  • a conductor layer 2 is located on at least a portion of the inner wall surface of the through hole 11 and the surface of the insulating substrate 1.
  • the conductor layer 2 is not limited as long as it is a conductor such as a metal.
  • the conductor layer 2 is formed of a metal foil such as copper foil, a metal plating such as copper plating, or the like.
  • the thickness of the conductor layer 2 is not particularly limited and is, for example, 20 ⁇ m or more and 40 ⁇ m or less, and the thickness may be different between the inner wall surface of the through hole 11 and the surface of the insulating substrate 1.
  • the thickness of the conductor layer 2 located on the inner wall surface of the through hole 11 is, for example, 10 ⁇ m or more and 30 ⁇ m or less, and the thickness of the conductor layer 2 located on the surface of the insulating substrate 1 may be, for example, 20 ⁇ m or more and 40 ⁇ m or less.
  • the portion of the conductor layer 2 located on the surface 1a of the insulating substrate 1 may be referred to as the surface conductor layer 2a, and the portion located on the inner wall surface of the through hole 11 may be referred to as the through hole conductor layer 2b.
  • the surface conductor layer 2a and the through hole conductor layer 2b are integrally formed.
  • the organic resin layer 3 covers the surface of the insulating substrate 1 and the surface of the conductor layer 2.
  • the thickness of the organic resin layer 3 is not limited as long as it can cover the surface of the insulating substrate 1 and the surface of the conductor layer 2.
  • the thickness of the organic resin layer 3 is, for example, 0.025 mm or more and 0.2 mm or less.
  • the resin forming the organic resin layer 3 is not limited as long as it is an organic resin, and examples include cyclic olefin polymers, epoxy resins, bismaleimide-triazine resins, polyimide resins, polyphenylene ether resins, and liquid crystal polymers. Among these resins, it is preferable to use cyclic olefin polymers.
  • Cyclic olefin polymers are polyolefin-based polymers that have a cyclic structure.
  • cyclic olefin polymers also include cyclic olefin copolymers obtained by polymerizing a cyclic olefin with another monomer that is copolymerizable with the cyclic olefin.
  • the ratio of the cyclic olefin to the other monomer There are no particular restrictions on the ratio of the cyclic olefin to the other monomer. For example, the other monomer is used in a ratio of 2 to 20 parts by mass per 100 parts by mass of the cyclic olefin.
  • cyclic olefins examples include norbornene monomers, cyclic diene monomers, and vinyl alicyclic hydrocarbon monomers. Specific examples of cyclic olefins include norbornene, vinylnorbornene, phenylnorbornene, dicyclopentadiene, tetracyclododecene, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cyclohexadiene, and cyclooctadiene. These cyclic olefins may be used alone or in combination of two or more.
  • cyclic olefins include, for example, linear olefins, acrylic acid, methacrylic acid, acrylic acid esters, methacrylic acid esters, aromatic vinyl compounds, unsaturated nitriles, and aliphatic conjugated dienes.
  • Such monomers include ethylene, propylene, butene, acrylic acid, methacrylic acid, fumaric acid, fumaric anhydride, maleic acid, maleic anhydride, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, styrene, vinyl toluene, acrylonitrile, methacrylonitrile, 1,3-butadiene, 2-methyl-1,3-butadiene, and 2,3-dimethyl-1,3-butadiene.
  • These other monomers may be used alone or in combination of two or more.
  • the organic resin layer 3 has a filling portion 31 located in the through hole 11. That is, the filling portion 31 is formed by filling a part of the organic resin layer 3 in the through hole 11. Because the filling portion 31 is part of the organic resin layer 3, voids are less likely to form compared to when the through hole 11 is filled with organic resin separately. This makes the dielectric constant uniform, and it is possible to reduce loss due to reflection. By having such a filling portion 31, the wiring board according to one embodiment reduces the dielectric loss that occurs in the through hole 11. As a result, the filling portion 31 located in the through hole 11 is used as an excellent waveguide.
  • the organic resin layer 3 is made up of the covering portion 32 other than the filling portion 31, it is preferable that the filling portion 31 and the covering portion 32 are formed from the same material.
  • the organic resin layer 3 is integral from the covering portion 32 to the filling portion 31.
  • a part (end 31a) of this filling portion 31 may protrude from the surface 1b of the insulating substrate 1.
  • the protruding part of the filling portion 31 is shown as protruding portion 31A.
  • Protruding portion 31A is a portion located outward from the surface 1b of the insulating substrate 1. The portion excluding protruding portion 31A may be described as the main body of the filling portion 31.
  • the protruding portion 31A may reach from the surface 1b of the insulating substrate 1 to the position of the outer surface 2aa of the surface conductor layer 2a. If the protruding portion 31A reaches from the surface 1b of the insulating substrate 1 to the position of the outer surface 2aa of the surface conductor layer 2a, the filling portion 31 tends to have a high filling rate over the entire longitudinal direction of the through hole 11.
  • the organic resin layer 3 may be formed only from an organic resin such as the above-mentioned cyclic olefin polymer, or may contain a predetermined proportion of inorganic filler in the organic resin.
  • the content of the inorganic filler is preferably a volume ratio of 10 to 70, assuming that the volume of the organic resin layer 3 is 100.
  • the organic resin layer 3 may contain a flame retardant and a weather stabilizer in addition to the inorganic filler.
  • the content of the flame retardant in the organic resin layer 3 may be greater than the content of the weather stabilizer.
  • the inorganic filler and the flame retardant may be present in equal amounts.
  • the weather stabilizer may be unevenly distributed in the surface portion of the organic resin layer 3.
  • the organic resin layer 3 simultaneously contains an inorganic filler, a flame retardant, and a weather stabilizer, thereby improving the reliability of the wiring board including the organic resin layer 3 in terms of mechanical strength, flame retardancy, moisture resistance, heat resistance, and the like.
  • the volumetric proportions of the organic resin, inorganic filler, flame retardant and weather stabilizer contained in the organic resin layer 3 can be determined, for example, from an electron microscope photograph of a cross section of a wiring board.
  • each component contained in the photographed area e.g., 5 ⁇ m x 5 ⁇ m to 20 ⁇ m x 20 ⁇ m
  • the outline of each component is determined on the photograph.
  • the total area of the outline is then determined for each component.
  • the total area of each component is divided by the area of the photographed area to determine the area proportion of each component.
  • the area proportion thus determined is taken as the volumetric proportion in the organic resin layer 3.
  • the organic resin layer 3 is preferably formed integrally from the surface 1a of the insulating substrate 1 to the filling portion 31 located in the through hole 11.
  • the filling portion 31 extending from the covering portion 32 located on the insulating substrate 1 and the conductor layer 2 to the inside of the through hole 11 is an integral body. It is preferable that there is no interface between the covering portion 32 and the filling portion 31.
  • No interface exists means that the covering portion 32 and the filling portion 31 are made of the same material, and no boundary-like boundary can be seen between the covering portion 32 and the filling portion 31 when viewed with an electron microscope. In other words, it means that there is no dissimilar material between the covering portion 32 and the filling portion 31 other than the materials that make up the covering portion 32 and the filling portion 31. Therefore, the material that makes up the covering portion 32 exists continuously from the covering portion 32 to the filling portion 31 in the through hole 11, forming a structure of the same material.
  • the hole covering part 32a When the part of the covering part 32 located on the through hole 11 is the hole covering part 32a, it is preferable that there is no interface between the hole covering part 32a and the filling part 31.
  • the relationship between the hole covering part 32a and the filling part 31 should also be similar to that between the covering part 32 and the filling part 31.
  • the absence of an interface means that the hole covering part 32a and the filling part 31 are made of the same material, and no boundary-like thing is found between the hole covering part 32a and the filling part 31 even when observed with an electron microscope.
  • the organic resin layer 3 is preferably formed integrally with the covering portion 32 which is part of the surface 1a of the insulating substrate 1, the filling portion 31 located in the through hole 11, and the hole covering portion 32a located directly above the through hole 11.
  • the organic resin layer 3 is preferably formed such that nothing other than the material forming the organic resin layer 3 exists between the covering portion 32 located on the surface 1a of the insulating substrate 1 and the filling portion 31 located in the through hole 11.
  • the material forming the organic resin layer 3 means the organic resin that constitutes the organic resin layer 3.
  • the organic resin layer 3 contains inorganic fillers such as silica particles in addition to the organic resin, this means that the components and ratios (compositions) of the organic resin and inorganic filler are the same from the hole covering portion 32a to the filling portion 31.
  • the components of the organic resin are the same means, for example, that the main polymers constituting the organic resin are the same.
  • the inorganic filler is the same means, for example, that the metal oxide of the inorganic filler is the same.
  • the inorganic filler is identified, for example, by atomic absorption spectrometry, X-ray diffraction, or X-ray fluorescence.
  • the ratio (composition) of the organic resin to the inorganic filler is the same means that the volume ratio of the organic resin between the filling portion 31, the covering portion 32, and the hole covering portion 32a is within ⁇ 5%.
  • the organic resin layer 3 is preferably such that there is no interface between the covering portion 32, which is a portion located on the surface 1a of the insulating substrate 1, and the hole covering portion 32a, which is located directly above the surface 11a of the through hole 11, other than the material that forms the organic resin layer 3.
  • the organic resin layer 3 is preferably such that there is no interface between the covering portion 32, which is a portion located on the surface 1a of the insulating substrate 1, and the hole covering portion 32a, which is located directly above the surface 11a of the through hole 11.
  • the organic resin layer 3 is preferably such that there is no interface where different materials come into contact on the extension line 1aa along the surface 1a of the insulating substrate 1.
  • the organic resin layer 3 is preferably such that there is no interface between different materials on the extension line 1aa along the surface 1a of the insulating substrate 1, other than the material that forms the organic resin layer 3.
  • the absence of an interface on the extension line 1aa along the surface 1a of the insulating substrate 1, or the absence of anything other than the material forming the organic resin layer 3 on the extension line 1aa along the surface 1a of the insulating substrate 1, means that when the extension line 1aa along the surface 1a of the insulating substrate 1 is taken as a reference plane, there is no interface due to different members or different materials in the region of that reference plane.
  • the reference plane region includes the upper region 11bup and the lower region 11bun when the reference plane is used as the boundary.
  • the interface is the boundary where substances containing different main components or substances with different compositions are adjacent to each other. In this case, it means that substances containing different main components or substances with different compositions are not adjacent to each other.
  • the interface may extend in the thickness direction of the organic resin layer 3, and may extend from one surface to the other surface of the organic resin layer 3.
  • the interface extending in the thickness direction of the covering portion 32 may also extend from one surface to the other surface of the covering portion 32.
  • the interface between the filling portion 31 and the hole covering portion 32a may also extend over the entire radial direction of the hole covering portion 32a.
  • the organic resin layer 3 may have different orientations of the inorganic filler and the flame retardant between the filling portion 31 located within the through-hole 11 and the hole covering portion 32a located directly above the through-hole 11.
  • the degree of orientation of the inorganic filler contained in the filling portion 31 located within the through-hole 11 may be higher than the degree of orientation of the inorganic filler contained in the hole covering portion 32a located directly above the through-hole 11.
  • the density of the filling portion 31 may differ between the vicinity of the surface 1a of the insulating substrate 1 and the center of the insulating substrate 1 in the thickness direction.
  • the density of the filling portion 31 may also differ between both sides of the insulating substrate 1. "The density of the filling portion 31 differs" means that there may be parts in the filling portion 31 that have partially different densities.
  • the difference in density of the filled portion 31 should be evaluated based on the area ratio of the voids observed when observing the outer surface or internal cross section of the filled portion 31.
  • the wiring board is manufactured by employing a method in which the organic resin layer 3 is placed on one side of the insulating substrate 1 and then subjected to a pressurized and heated process. That is, the filled portion 31 in the wiring board is formed by placing a sheet-like organic resin film on the surface 1a of the insulating substrate 1 and then applying pressurized heat to cause part of the organic resin film to penetrate into the through-holes 11. Therefore, the construction method is different from the method of filling a paste containing organic resin by a printing method.
  • a sheet-like organic resin film has a higher viscosity than a paste containing an organic resin.
  • the high viscosity of the organic resin film makes the organic resin film susceptible to high shear stress between the organic resin film and the conductor layer 2 formed on the inner wall of the through-hole 11 when filling the through-hole 11.
  • the filling portion 31 is prone to forming portions with different densities and degrees of orientation within the through-hole 11.
  • At least one of the density and the degree of orientation of the filling portion 31 is likely to change in the radial direction.
  • a method of finding differences in the porosity of the filling portion 31 may be adopted to correspond to differences in density.
  • the porosity of the filling portion 31 is determined by observing the side of the filling portion 31 and finding the porosity at the center and end portions in the longitudinal direction, and evaluating the difference.
  • Differences in the degree of orientation in the filling portion 31 are preferably evaluated from differences in the orientation of the inorganic filler.
  • a metallurgical microscope or digital microscope may be used to evaluate the degree of orientation of the inorganic filler. When a metallurgical microscope or digital microscope is used, light is shone on the sample to be observed and the shape based on the reflected light can be obtained.
  • the degree of orientation of the inorganic filler contained in the filling portion 31 may be higher on the radial side than on the radial center.
  • the "longitudinal direction of the through hole 11" corresponds to the thickness direction of the insulating substrate 1 in the through hole 11.
  • the "radial direction of the through hole 11" corresponds to the direction perpendicular to the longitudinal direction of the through hole 11.
  • the shear stress experienced by the organic resin film is also due to the material or surface roughness of each of the components shown below.
  • the surface 1a of the insulating substrate 1, the portion directly above 11a of the through-hole 11, and the surface of the conductor layer 2 disposed on the surface 1a of the insulating substrate 1 or the surface of the conductor layer 2 within the through-hole 11 are made of different materials.
  • the surface 1a of the insulating substrate 1, the portion directly above 11a of the through-hole 11, and the surface of the conductor layer 2 disposed on the surface 1a of the insulating substrate 1 or the surface of the conductor layer 2 within the through-hole 11 may each have a different surface roughness.
  • the method for manufacturing a wiring board according to an embodiment of the present disclosure includes the following steps (a) to (e). (a) providing an insulating substrate having a through hole; (b) forming a conductive layer on at least a portion of the inner wall surface of the through hole and the surface of the insulating substrate; (c) coating the insulating substrate and the conductor layer with an organic resin film. (d) A step of subjecting the resulting product to a heat and pressure treatment to fill a portion of the organic resin film into the through-holes. (e) A step of curing the organic resin film to form an organic resin layer.
  • step (a) an insulating substrate 1 having a through hole 11 is prepared.
  • the insulating substrate 1 is as described above, and a detailed description is omitted.
  • a conductor layer 2 is formed on at least a portion of the inner wall surface of the through hole 11 and the surface of the insulating substrate 1.
  • the conductor layer 2 is formed of a metal foil such as copper foil or a metal plating such as copper plating.
  • the conductor layer 2 is formed by attaching a metal foil such as copper foil or by precipitating a metal such as copper by plating.
  • step (c) the insulating substrate 1 and the conductor layer 2 are coated with an organic resin film.
  • the organic resin film becomes the organic resin layer 3 after curing in step (e) described below. Therefore, the resins forming the organic resin film include the organic resins described above, and a detailed description will be omitted.
  • the size and shape of the organic resin film are not limited.
  • the shape of the organic resin film and the shape of the insulating substrate 1 may be substantially the same. If the shape of the organic resin film and the shape of the insulating substrate 1 are substantially the same, the same organic resin film will be present in every region on the insulating substrate 1, and no unevenness in the dielectric constant will occur. As a result, it becomes easier to match the impedance.
  • an organic resin film may be used whose complex melt viscosity at 110° C. has a frequency dependency of 1 ⁇ 10 Pa to 1 ⁇ 10 Pa in the frequency range of 0.1 rad/s to 100 rad/s.
  • the through-hole 11 can be stably filled with resin.
  • step (d) a heating and pressurizing process is performed to fill a portion of the organic resin film into the through-hole 11.
  • the heating temperature is set appropriately depending on the organic resin film used, and may be, for example, a temperature at which the organic resin film softens and a portion of the softened organic resin film can penetrate into the through-hole 11.
  • the pressure condition may be, for example, 1.0 MPa or more and 5.0 MPa or less.
  • the minimum melting temperature of the organic resin film is a°C, it may be heated within the range of a°C ⁇ 20°C. By heating at such a temperature, the softened organic resin film is less likely to flow out to the outer periphery of the insulating substrate 1 even when pressure is applied. Furthermore, the softened organic resin film can be filled into the through-holes 11 with almost no voids being generated. As a result, the dielectric constant tends to be uniform, and loss due to reflection can be reduced.
  • the heating and pressurizing treatment may be carried out in a reduced pressure atmosphere.
  • voids are less likely to occur in the organic resin film filled in the through-holes 11.
  • the dielectric constant can be kept constant, and reflection is less likely to occur.
  • step (e) the organic resin film is cured to form the organic resin layer 3.
  • the curing method is appropriately selected depending on the organic resin film used. When a thermosetting organic resin film is used, it is cured by a heat treatment. When a thermoplastic organic resin film is used, it is heated to fill the through-holes 11, and then the temperature is lowered to room temperature to be cured.
  • the filling portion and the covering portion were made of the same material. There was no interface between the covering portion and the filling portion. In other words, when the portion of the covering portion located on the through hole was used as the hole covering portion, there was no interface between the hole covering portion and the filling portion. Furthermore, in the produced wiring board, a part of the filling portion protruded from the surface opposite the surface on which the organic resin layer of the insulating substrate was disposed. Among the multiple wiring boards produced, it was found that in all of the through holes formed on the surface of the wiring board, a part of the filling portion protruded from the surface opposite the surface on which the organic resin layer of the insulating substrate was disposed.
  • the wiring board according to the present disclosure is not limited to the above-mentioned embodiment.
  • the organic resin layer 3 is located on one surface of the insulating substrate 1.
  • the organic resin layer 3 may be located on both sides of the insulating substrate 1.
  • both sides of the insulating substrate 1 may be covered with an organic resin film and subjected to a heating and pressure treatment.
  • one side of the insulating substrate 1 may be covered with an organic resin film and subjected to a heating and pressure treatment, and then the other side may be covered with an organic resin film and subjected to a heating and pressure treatment.
  • the wiring board according to the present disclosure includes an insulating substrate having a through hole, a conductor layer located on the inner wall surface of the through hole and on at least a portion of the surface of the insulating substrate, and an organic resin layer that covers the insulating substrate and the conductor layer.
  • the organic resin layer has a filling portion located within the through hole.
  • the filling portion and the covering portion are formed from the same material.
  • the covering portion located above the through hole is defined as a hole covering portion, no interface exists between the hole covering portion and the filling portion.
  • a part of the filling portion protrudes from the surface of the insulating substrate.
  • the method for manufacturing a wiring board according to the present disclosure includes the steps of preparing an insulating substrate having a through hole, forming a conductor layer on at least a portion of the inner wall surface of the through hole and the surface of the insulating substrate, coating the insulating substrate and the conductor layer with an organic resin film, subjecting the substrate to a heating and pressurizing treatment to fill a portion of the organic resin film into the through hole, and curing the organic resin film to form an organic resin layer.
  • the organic resin film and the insulating substrate have substantially the same shape in plan view.
  • the organic resin film has a frequency dependence of complex melt viscosity at 110°C of 1 x 10 4 Pas to 1 x 10 6 Pas in the frequency range of 0.1 rad/s to 100 rad/s.
  • the heating and pressurizing treatment is carried out within the range of a° C. ⁇ 20° C.
  • the heating and pressurizing treatment is carried out in a reduced pressure atmosphere.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
PCT/JP2023/034420 2022-09-27 2023-09-22 配線基板およびその製造方法 Ceased WO2024070919A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345119A (ja) * 1999-06-02 2000-12-12 Ajinomoto Co Inc 接着フィルム及びこれを用いた多層プリント配線板の製造法
JP2001257465A (ja) * 2000-03-13 2001-09-21 Ibiden Co Ltd プリント配線板およびその製造方法
JP2010251688A (ja) * 2009-03-25 2010-11-04 Nec Toppan Circuit Solutions Inc 部品内蔵印刷配線板及びその製造方法
JP2018037541A (ja) * 2016-08-31 2018-03-08 大日本印刷株式会社 有孔基板の製造方法及び有孔基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345119A (ja) * 1999-06-02 2000-12-12 Ajinomoto Co Inc 接着フィルム及びこれを用いた多層プリント配線板の製造法
JP2001257465A (ja) * 2000-03-13 2001-09-21 Ibiden Co Ltd プリント配線板およびその製造方法
JP2010251688A (ja) * 2009-03-25 2010-11-04 Nec Toppan Circuit Solutions Inc 部品内蔵印刷配線板及びその製造方法
JP2018037541A (ja) * 2016-08-31 2018-03-08 大日本印刷株式会社 有孔基板の製造方法及び有孔基板

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