WO2024063128A1 - 積層体 - Google Patents

積層体 Download PDF

Info

Publication number
WO2024063128A1
WO2024063128A1 PCT/JP2023/034249 JP2023034249W WO2024063128A1 WO 2024063128 A1 WO2024063128 A1 WO 2024063128A1 JP 2023034249 W JP2023034249 W JP 2023034249W WO 2024063128 A1 WO2024063128 A1 WO 2024063128A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive layer
adhesive
release
less
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/034249
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
健太 西嶋
友郁 加藤
郷 大西
貴志 杉野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to CN202380068105.8A priority Critical patent/CN119907842A/zh
Priority to JP2024548306A priority patent/JP7818093B2/ja
Priority to US19/113,896 priority patent/US20260098191A1/en
Priority to KR1020257009970A priority patent/KR20250073139A/ko
Publication of WO2024063128A1 publication Critical patent/WO2024063128A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Definitions

  • the present invention relates to a laminate.
  • Elements used in electronic components or semiconductor devices are often obtained by forming a large number of multiple elements at once.
  • semiconductor chips are obtained by dicing a semiconductor wafer attached to an adhesive.
  • the semiconductor chip is often transferred.
  • Patent Document 1 discloses a method (laser lift-off method) of transferring a semiconductor chip by irradiating the semiconductor chip with a laser.
  • the element When the element is moved from the pre-transfer substrate to the post-transfer substrate, the element is captured by the post-transfer substrate. When such an element is transferred, a deviation may occur between the position of the element on the substrate before transfer and the position of the element on the substrate after transfer. However, by providing unevenness on the surface of the adhesive sheet that captures the transferred elements, it is possible to suppress the displacement of the elements during capture.
  • the adhesive sheet is stuck to a release sheet until just before use, and the adhesive sheet is peeled off from the release sheet and used for transferring the element.
  • the pressure-sensitive adhesive sheet has irregularities on its surface, the pressure-sensitive adhesive sheet is strongly bonded to the release sheet, and the pressure-sensitive adhesive sheet may be difficult to peel off from the release sheet.
  • An object of the present invention is to provide a laminate that can transfer elements to appropriate positions and has improved releasability of a release sheet to an adhesive sheet.
  • a laminate including an adhesive sheet for capturing an element separated from a holding substrate, and a release sheet laminated on one surface of the adhesive sheet,
  • the adhesive sheet includes an adhesive layer, the adhesive layer has unevenness on its surface,
  • the release sheet includes a release layer in contact with the adhesive layer, and the release layer has unevenness on its surface
  • a laminate wherein a peel force of the release sheet at a peel angle of 180° with respect to the pressure-sensitive adhesive sheet, measured at a peel rate of 300 mm/min, is 1000 mN/50 mm or less.
  • the adhesive layer has, on its surface, a plurality of protrusions bounded by recesses and spaced apart from each other, and each of the plurality of protrusions of the adhesive layer has an area of 10 ⁇ m or more,
  • the adhesive layer has, on its surface, a plurality of convex portions separated from each other and bounded by concave portions, and the area occupied by the convex portions of the adhesive layer is relative to the area of the adhesive layer.
  • the adhesive layer is configured such that the ratio of the adhesive area of the adhesive layer and one element to the area of one element is 1% or more and 95% or less, [1] The laminate according to any one of [11].
  • the present invention makes it possible to transfer elements to appropriate positions and provide a laminate with improved releasability of the release sheet relative to the adhesive sheet.
  • FIG. 1 is a schematic diagram of a laminate according to an embodiment.
  • FIG. 3 is a top view showing an example of unevenness of the adhesive sheet.
  • FIG. 3 is a top view showing an example of unevenness of the adhesive sheet.
  • FIG. 3 is a top view showing an example of unevenness of the adhesive sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the pressure-sensitive adhesive sheet.
  • FIG. 3 is a cross-sectional view showing an example of unevenness of the pressure-sensitive adhesive sheet.
  • Schematic diagram illustrating separation and capture of elements Schematic diagram illustrating separation and capture of elements.
  • FIG. 3 is a top view showing an example of unevenness that a release sheet has.
  • FIG. 3 is a top view showing an example of unevenness that a release sheet has.
  • FIG. 3 is a top view showing an example of unevenness that a release sheet has.
  • FIG. 2 is a cross-sectional view showing an example of unevenness of a release sheet.
  • FIG. 2 is a cross-sectional view showing an example of unevenness of a release sheet.
  • mass average molecular weight (Mw) and number average molecular weight (Mn) are values measured by size exclusion chromatography in terms of standard polystyrene, specifically based on JIS K7252-1:2016. It is the value to be measured.
  • (meth)acrylic acid is a term that refers to both "acrylic acid” and “methacrylic acid,” and the same applies to other similar terms.
  • electroactive components include all components used in electronics and electrical engineering, as well as all components that constitute electronic devices.
  • Electrical components may be formed from any of semiconductors, conductors, and/or insulators, or a combination of these.
  • Electrodes include, for example, active components (mainly formed from semiconductors, such as transistors, ICs, LSIs, ultra-LSIs, diodes, light-emitting diodes, thyristors, three-terminal regulators, and imaging devices), passive elements (such as resistors, capacitors, speakers, coils, transformers, relays, piezoelectric elements, quartz oscillators, ceramic oscillators, and varistors), and structural components (such as wiring components, printed circuit boards, connectors, and switches).
  • semiconductor device refers to devices in general that can function by utilizing the properties of semiconductors, such as those used in processors, memories, and sensors. Examples of “semiconductor device” include micro light-emitting diodes, mini light-emitting diodes, power devices, MEMS (Micro Electro Mechanical Systems), and controller chips.
  • any lower limit value, upper limit value, and combination thereof are described.
  • the description of 1 or more, 2 or more, 3 or more, 9 or less, 8 or less, 7 or less means that the numerical range is 1 or more, 9 or less, 1 or more, 8 or less, 1 or more, 7 or less, 2 or more.
  • the number may be 2 or more and 8 or less, 2 or more and 7 or less, 3 or more and 9 or less, 3 or more and 8 or less, and 3 or more and 7 or less.
  • the laminate according to the present embodiment includes an adhesive sheet for capturing an element separated from a holding substrate, and a release sheet laminated on one surface of the adhesive sheet.
  • the adhesive layer has an uneven surface
  • the release sheet includes a release layer in contact with the adhesive layer
  • the release layer has an uneven surface.
  • the element can be transferred to an appropriate position.
  • the peeling force of the release sheet against the adhesive sheet at a peeling angle of 180° measured at a peeling speed of 300 mm/min is 1000 mN/50 mm or less. This improves the releasability of the release sheet to the adhesive sheet, and allows the adhesive sheet to be easily peeled off from the release sheet.
  • FIG. 1 shows a schematic diagram of a laminate according to one embodiment.
  • the laminate may include an adhesive layer 110, an adhesive sheet base material 120, a release layer 130, and a release sheet base material 140.
  • the adhesive sheet and the release sheet may have the adhesive sheet base material 120 and the release sheet base material 140.
  • the adhesive sheet may be composed of only the adhesive layer 110
  • the release sheet may be composed of only the release layer 130.
  • a highly supportive adhesive layer 110 and release layer 130 can be used.
  • a pressure-sensitive adhesive sheet and a release sheet are usually attached to the laminate until just before use.
  • the above-mentioned properties of the laminate may vary depending on the composition, properties, etc. of the pressure-sensitive adhesive sheet and release sheet, which will be described later.
  • the laminate can be obtained by bonding an adhesive sheet and a release sheet together so that the adhesive layer 110 of the adhesive sheet and the release layer 130 of the release sheet are in contact with each other.
  • a laminate may be formed by forming the adhesive layer 110 on the release layer 130 of a release sheet having unevenness, and then bonding the adhesive sheet base material 120 onto the adhesive layer 110. Details of each configuration will be described later.
  • the laminate according to the present embodiment has a peel force of 1000 mN/50 mm or less at a peel angle of 180° measured at a peel rate of 300 mm/min of the release sheet to the adhesive sheet.
  • the upper limit of the peeling force of the release sheet to the adhesive sheet is preferably 1000 mN/50 mm or less, more preferably 800 mN/50 mm or less, more preferably 500 mN/50 mm or less, even more preferably 200 mN/50 mm or less, particularly preferably can be 100 mN/50 mm or less. This improves the releasability of the release sheet with respect to the pressure-sensitive adhesive sheet, and allows the pressure-sensitive adhesive sheet having irregularities on its surface to be easily peeled off from the release sheet.
  • the lower limit of the peeling force of the release sheet to the adhesive sheet is not particularly limited, but is preferably 1 mN/50 mm or more, more preferably 2 mN/5 mm or more, more preferably 10 mN/50 mm or more, and even more Preferably, it is 15 mN/50 mm or more, particularly preferably 20 mN/50 mm or more. This allows it to be maintained as a laminate.
  • the range of peeling force of the laminate is preferably 1 mN/50 mm or more and 1000 mN/50 mm or less, more preferably 2 mN/5 mm or more and 800 mN/50 mm or less, more preferably 10 mN/50 mm or more and 500 mN/50 mm or less, and even more preferably can be set to 15 mN/50 mm or more and 200 mN/50 mm or less, particularly preferably 20 mN/50 mm or more and 100 mN/50 mm or less.
  • the adhesive sheet according to the present embodiment has an adhesive layer 110, and the adhesive layer 110 is a layer having adhesiveness and may contain a resin.
  • the adhesive sheet may have two or more adhesive layers 110.
  • the adhesive sheet may have one type or a laminate of two or more types of adhesive layers 110.
  • the surface of the adhesive layer 110 has irregularities.
  • the adhesive sheet captures the element separated from the holding substrate in the adhesive layer 110, and can release the gas compressed between the element and the adhesive layer 110, which is generated when the element and the adhesive layer 110 approach each other, into the recess of the adhesive sheet. This can relieve the pressure generated between the element and the adhesive layer. Details of the capture of the element by the adhesive sheet will be described later.
  • the surface of the adhesive layer 110 has a concave portion, the pressure generated between the element and the adhesive layer can be alleviated, and the holding position of the element on the adhesive sheet can be prevented from shifting. Therefore, the specific shape of the unevenness on the surface of the adhesive layer 110 is not limited. On the other hand, the unevenness on the surface of the adhesive layer 110 has a complementary relationship with the unevenness on the surface of the release layer, which will be described later.
  • the adhesive layer 110 has on its surface a plurality of protrusions bounded by depressions and spaced apart from each other.
  • Each of the plurality of convex portions may be separated by a concave portion that is continuous throughout the adhesive layer 110.
  • the recesses located around each of the plurality of projections are continuous to the end of the adhesive layer 110.
  • the concave portions that are continuous to the ends of the adhesive layer 110 in this manner, the gas compressed between the element and the convex portions of the adhesive layer 110 can efficiently escape to the outside of the element.
  • 2A to 2C are top views showing the shape of such adhesive layer 110.
  • protrusions 111 may be regularly arranged on the surface of the adhesive layer 110.
  • the regular arrangement of the protrusions 111 means that the protrusions 111 are arranged in a straight line at regular intervals.
  • the convex portions 111 may be arranged so that the intervals vary regularly.
  • the distance between the convex portions 111 is short at the center of the adhesive sheet, and the distance between the convex portions 111 is long at the periphery of the adhesive sheet. According to such a configuration, the compressed gas can be efficiently released from the periphery of the element via the wider recess while improving the retention of the adhesive sheet.
  • the convex portions 111 may be arranged irregularly.
  • FIG. 2C is a top view showing another shape of the adhesive layer 110.
  • striped convex portions 111 may be provided on the surface of the adhesive layer 110.
  • linear convex portions 111 having a constant width are lined up at regular intervals.
  • the width or interval of the linear protrusions 111 may vary regularly, or the linear protrusions 111 may be arranged irregularly.
  • the center is, for example, a circular area having 1/4 of the area of the adhesive sheet and centered on the center of gravity of the adhesive sheet
  • the peripheral area is, for example, all areas other than the center of the adhesive sheet.
  • the pitch P of the convex portions 111 is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, even more preferably 10 ⁇ m or more, and particularly preferably 15 ⁇ m or more, from the viewpoint of enhancing the pressure relief effect.
  • the pitch is preferably 100 ⁇ m or less, more preferably 75 ⁇ m or less, more preferably 50 ⁇ m or less, from the viewpoint of increasing the contact area between the adhesive layer 110 and the element and suppressing positional displacement during capture. Even more preferably, it is 35 ⁇ m or less, particularly preferably 25 ⁇ m or less.
  • the pitch of the convex portions 111 means the distance between the center point of one arbitrarily selected convex portion 111 and the center point of another convex portion 111 that is closest to that convex portion 111.
  • the pitch of the convex parts 111 is the center point of the convex part 111 on a straight line in which the convex parts 111 are lined up at regular intervals, and the center point of another convex part 111' that is closest to that convex part 111. represents the distance between When the protrusions 111 are arranged on a plurality of straight lines, the pitch represents the distance between the center points of the protrusions on the straight line arranged at the shortest pitch.
  • the convex part has an elongated shape as shown in FIG. 2C and the center point of the convex part is difficult to identify, the distance from the boundary on the same side of the convex part 111 to the nearest boundary of another convex part 111' is expressed. .
  • the specific shape of the convex portion 111 is not particularly limited.
  • the convex portion 111 may have a pillar shape.
  • the convex portion 111 may have a cylindrical shape or a prismatic shape.
  • the convex portion 111 may extend in a line shape, or may extend in a curved shape such as a wave shape.
  • these convex portions 111 may be provided with a taper.
  • FIG. 3A shows a cross-sectional view of the adhesive layer 110 according to one embodiment, passing through the convex portion 111 and perpendicular to the surface of the adhesive layer 110.
  • the convex portion 111 shown in FIG. 3A is tapered, that is, the convex portion 111 is tapered.
  • the surface of the adhesive layer 110 may have a flat recess and a protrusion 111 protruding from the recess. In this way, the plurality of convex portions 111 that the adhesive layer 110 has and are spaced apart from each other may be bounded by concave portions.
  • the tip of the convex portion 111 may have a hemispherical shape or a curved surface like a part of a sphere. According to such a configuration, the impact when the element separated from the holding substrate comes into contact with the adhesive layer 110 is further alleviated, making it easier for the adhesive layer 110 to capture the element at an appropriate position.
  • the tip of the convex portion may be flat.
  • the protrusions 111 may also have a shape of a collection of multiple grains, the surface of a lotus leaf, or a needle shape.
  • the surface of the adhesive layer 110 may be rough or fibrous, and such a surface can also be said to have irregularities.
  • each convex portion 111 is the width or diameter of its base, not its tip, and is preferably 1 ⁇ m or more, more preferably 1 ⁇ m or more, from the viewpoint of increasing adhesiveness and suppressing positional displacement during capture. , 2 ⁇ m or more, even more preferably 5 ⁇ m or more, particularly preferably 10 ⁇ m or more. On the other hand, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, even more preferably 30 ⁇ m or less, particularly preferably 20 ⁇ m or less.
  • the width and diameter of the convex portion 111 mean the minimum distance and maximum distance (represented by D in FIG. 3A) between two parallel lines touching from both sides of the convex portion 111 on the surface of the concave portion, respectively. do.
  • each convex portion 111 is preferably 10 ⁇ m 2 or more, more preferably 20 ⁇ m 2 or more, and even more preferably 30 ⁇ m 2 or more, from the viewpoint of increasing adhesiveness and suppressing positional shift during capture. It is. On the other hand, the area of each convex portion 111 is preferably 2000 ⁇ m 2 or less, more preferably 1000 ⁇ m 2 or less, and even more preferably 500 ⁇ m 2 or less, from the viewpoint of enhancing the pressure relief effect.
  • the area of the convex portion 111 means the area of the portion protruding from the surface of the concave portion (in the case of FIG. 3A, the area of a circle with a diameter D).
  • the height of each protrusion 111 is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and even more preferably 5 ⁇ m or more.
  • the height of each protrusion 111 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and even more preferably 10 ⁇ m or less.
  • the height of the protrusion 111 is represented by H in FIG. 3A.
  • each convex portion 111 relative to the area of the adhesive layer 110 is preferably 1% or more, more preferably 5% or more, from the viewpoint of increasing adhesiveness and suppressing positional shift during capture. is 10% or more, even more preferably 18% or more, particularly preferably 40% or more.
  • the area of each convex portion with respect to the area of the adhesive layer 110 is preferably 95% or less, more preferably 75% or less, and even more preferably 60% or less, from the viewpoint of increasing the pressure relief effect. .
  • the unevenness that the adhesive layer 110 has may be designed according to the shape of the element held by the adhesive sheet.
  • the ratio of the adhesion area between the adhesive layer 110 and one element to the area of one element is preferably 100% of the area of one element from the viewpoint of increasing adhesiveness and suppressing positional shift during capture. 1% or more, more preferably 2% or more, more preferably 3% or more, more preferably 4% or more, even more preferably 5% or more, even more preferably 7% or more, especially Preferably it is 10% or more.
  • the ratio of the adhesion area between the adhesive layer 110 and one element to the area of one element is preferably 95% or less, more preferably 70% or less, and even more Preferably it is 50% or less, particularly preferably 30% or less.
  • the adhesive area corresponds to the area of a circle with diameter T. Note that if the capturing position of the element on the adhesive sheet shifts, the adhesive area may change. In this case, the bonding area ratio may fall within the above range regardless of the capture position of the element.
  • the thickness of the adhesive layer 110 is not particularly limited, but from the viewpoint of adhesiveness, it is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, even more preferably 10 ⁇ m or more, preferably 70 ⁇ m or less, and more preferably, It can be 50 ⁇ m or less, more preferably 40 ⁇ m or less.
  • the thickness range of the adhesive layer 110 is preferably 1 ⁇ m or more and 70 ⁇ m or less, more preferably 5 ⁇ m or more and 50 ⁇ m or less, and even more preferably 10 ⁇ m or more and 40 ⁇ m or less.
  • the adhesive composition forming the adhesive layer 110 contains a resin.
  • the resin contained in the adhesive composition include rubber-based resins such as polyisobutylene-based resins, polybutadiene-based resins, and styrene-butadiene-based resins, acrylic-based resins, urethane-based resins, polyester-based resins, olefin-based resins, silicone-based resins, and polyvinyl ether-based resins.
  • the adhesive layer may also have heat resistance, and examples of the adhesive layer material having such heat resistance include polyimide-based resins and silicone-based resins.
  • the adhesive composition forming the adhesive layer 110 may contain a copolymer having two or more types of constituent units.
  • the form of such a copolymer is not particularly limited, and may be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer.
  • the resin contained in the adhesive composition forming the adhesive layer 110 may be composed of one type of resin, or may be composed of two or more types of resins.
  • the resin contained in the adhesive composition forming the adhesive layer 110 can be an adhesive resin that has adhesive properties by itself. Further, the resin can be a polymer having a mass average molecular weight (Mw) of 10,000 or more.
  • the weight average molecular weight (Mw) of the resin is preferably 10,000 or more, more preferably 70,000 or more, and even more preferably 140,000 or more from the viewpoint of improving adhesive strength. Further, from the viewpoint of suppressing the elastic modulus to a predetermined value or less, it is preferably 2,000,000 or less, more preferably 1,200,000 or less, and even more preferably 900,000 or less.
  • the number average molecular weight (Mn) of the resin is preferably 10,000 or more, more preferably 50,000 or more, and even more preferably 100,000 or more from the viewpoint of improving adhesive strength. Further, from the viewpoint of suppressing the elastic modulus to a predetermined value or less, it is preferably 2 million or less, more preferably 1 million or less, and even more preferably 700,000 or less.
  • the mass average molecular weight (Mw) and number average molecular weight (Mn) are the same as the mass average molecular weight (Mw) and the number average molecular weight (Mn) before the crosslinking reaction due to energy application. Refers to number average molecular weight (Mn).
  • the glass transition temperature (Tg) of the resin is preferably -75°C or higher, more preferably -70°C or higher, and preferably -10°C or lower, more preferably -20°C or lower.
  • the amount of resin relative to the total amount of components constituting the adhesive composition forming the adhesive layer 110 can be appropriately set depending on the required adhesive strength of the adhesive layer 110, but is preferably 30% by mass or more, or more. Preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, particularly preferably 60% by mass or more, preferably 99.99% by mass or less, more preferably is 99.95% by mass or less, more preferably 99.90% by mass or less.
  • the resin contained in the adhesive composition forming the adhesive layer 110 may include a thermoplastic resin. That is, the adhesive layer 110 can be formed from thermoplastic resin. When a thermoplastic resin is used, it is easy to form unevenness on the adhesive layer 110 by heating and softening the resin, and it is also easy to maintain the formed uneven shape by cooling the resin.
  • thermoplastic resins include rubber resins, acrylic resins, urethane resins, and olefin resins.
  • Examples include polybutadiene thermoplastic elastomers that use butadiene as a monomer, styrenic thermoplastic elastomers that use styrene as a monomer, and acrylic thermoplastics that use (meth)acrylic acid esters as monomers. Examples include elastomers.
  • the thermoplastic resin can be an acrylic resin (A).
  • the weight average molecular weight (Mw) of the acrylic resin (A) is preferably 10,000 or more, more preferably 100,000 or more, even more preferably 500,000 or more, from the viewpoint of improving adhesive strength. Further, from the viewpoint of suppressing the elastic modulus to a predetermined value or less, it is preferably 2 million or less, more preferably 1.5 million or less, and even more preferably 1 million or less.
  • the glass transition temperature (Tg) of the acrylic resin (A) is preferably -75°C or higher, more preferably -70°C or higher, and preferably 75°C or lower, from the viewpoint of improving adhesive strength.
  • the temperature is preferably 25°C or lower, and even more preferably -55°C or lower.
  • the glass transition temperature (Tg) of the acrylic resin (A) can be calculated using the Fox formula.
  • Tg of the monomer used at this time to induce the structural unit the value described in the Polymer Data Handbook or the Adhesive Handbook can be used.
  • Examples of the (meth)acrylic acid esters constituting the acrylic resin (A) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and isooctyl.
  • the alkyl group constituting the alkyl ester such as (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, myristyl (meth)acrylate, pentadecyl (meth)acrylate, palmityl (meth)acrylate, heptadecyl (meth)acrylate, or stearyl (meth)acrylate, has a chain structure having 1 to 18 carbon atoms.
  • (meth)acrylic acid alkyl esters (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; (meth)acrylic acid aralkyl esters such as benzyl (meth)acrylate; (meth)acrylic acid cycloalkenyl esters such as dicyclopentenyl (meth)acrylate; (meth)acrylic acid cycloalkenyloxyalkyl esters such as dicyclopentenyloxyethyl (meth)acrylate; imide (meth)acrylates; glycidyl group-containing (meth)acrylic acid esters such as glycidyl (meth)acrylate; hydroxyl group-containing (meth)acrylic acid esters such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth
  • Acrylic resin (A) is, for example, one or two selected from (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide, etc. in addition to (meth)acrylic acid ester.
  • a resin obtained by copolymerizing the above monomers may also be used.
  • the monomers constituting the acrylic resin (A) may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily.
  • the acrylic resin (A) may have functional groups capable of bonding with other compounds such as vinyl groups, (meth)acryloyl groups, amino groups, carboxy groups, and isocyanate groups. These functional groups, including the hydroxyl group of the acrylic resin (A), may be bonded to other compounds via a crosslinking agent (C), which will be described later, or may be bonded to other compounds without using a crosslinking agent (C). They may be directly combined.
  • a crosslinking agent (C) which will be described later, or may be bonded to other compounds without using a crosslinking agent (C). They may be directly combined.
  • the amount of acrylic resin (A) in the total amount of resin in the adhesive composition can be appropriately set depending on the required adhesive strength of the adhesive layer 110, but is preferably 0% by mass or more, more preferably , 10% by mass or more, even more preferably 20% by mass or more, particularly preferably 50% by mass or more, preferably 100% by mass or less, more preferably 95% by mass or less, even more preferably 80% by mass or less. It is not more than 60% by mass, particularly preferably not more than 60% by mass.
  • the resin contained in the adhesive composition forming the adhesive layer 110 may include an energy ray curable resin (B).
  • Energy ray curable refers to the property of being cured by irradiation with energy rays
  • energy ray curable resin (B) refers to a resin that is cured by irradiation with energy rays.
  • energy ray refers to electromagnetic waves or charged particle beams that have energy quanta, examples of which include ultraviolet rays, radiation, electron beams, and the like.
  • the ultraviolet rays can be irradiated using, for example, an electrodeless lamp, high pressure mercury lamp, metal halide lamp, UV-LED, etc. as an ultraviolet source.
  • the electron beam can be generated by an electron beam accelerator or the like.
  • energy ray polymerizability refers to the property of polymerizing by irradiation with energy rays.
  • a polymerizable functional group is a functional group that is crosslinked by application of energy (for example, irradiation with energy rays).
  • Examples of the polymerizable functional group include a vinyl group, an alkenyl group such as an allyl group, a (meth)acryloyl group, an oxetanyl group, and an epoxy group.
  • the mass average molecular weight (Mw) of the energy ray curable resin (B) is preferably 100 or more, more preferably 150 or more, from the viewpoint of improving adhesive strength. Further, from the viewpoint of suppressing the elastic modulus to a predetermined value or less, it is preferably 2 million or less, more preferably 1 million or less, and even more preferably 200,000 or less.
  • the number average molecular weight (Mn) of the energy ray curable resin (B) is preferably 100 or more, more preferably, from the viewpoint of polymerizability. It is 150 or more.
  • the mass average molecular weight (Mw) of the energy ray curable resin (B) is preferably 10,000 or more, more preferably 10,000 or more, from the viewpoint of improving adhesive strength. It is 50,000 or more, more preferably 100,000 or more. It is. Further, from the viewpoint of suppressing the elastic modulus to a predetermined value or less, it is preferably 2,000,000 or less, more preferably 500,000 or less, and even more preferably 300,000 or less.
  • the average number of polymerizable functional groups per molecule in the energy ray curable resin (B) is preferably 1.5 or more, more preferably 2 or more, from the viewpoint of easily maintaining the uneven shape of the adhesive layer. It is. On the other hand, this average value is preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, from the viewpoint of increasing the adhesiveness and flexibility of the adhesive layer.
  • a monomer or oligomer having a polymerizable functional group can be used as the energy ray-curable resin (B).
  • energy ray-curable compounds include glycerin di(meth)acrylate, glycerin tri(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol(meth)acrylate.
  • trimethylolpropane tri(meth)acrylate pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, etc.
  • acrylate monomer urethane (meth)acrylate; polyester (meth)acrylate; polyether (meth)acrylate; epoxy (meth)acrylate and the like.
  • glycerin di(meth)acrylate glycerin tri(meth)acrylate
  • tricyclodecane dimethanol di(meth)acrylate from the viewpoint of maintaining the formed uneven shape.
  • the energy ray curable resin (B) may be a diene rubber composed of a polymer having a polymerizable functional group at the end of the main chain and/or in the side chain.
  • a diene rubber is a rubbery polymer having a double bond in the polymer main chain.
  • Specific examples of diene rubber include polymers using butadiene or isoprene as a monomer (i.e., having butenediyl or pentenediyl groups as structural units).
  • the energy ray curable resin (B) may be a polybutadiene resin, a styrene-butadiene-styrene block copolymer, or a styrene-isoprene-styrene block copolymer.
  • the amount of the energy ray-curable resin (B) in the total amount of resin in the adhesive composition can be appropriately set depending on the required adhesive strength of the adhesive layer 110, but is preferably 0% by mass or more, or more. Preferably 10% by mass or more, even more preferably 20% by mass or more, particularly preferably 50% by mass or more, preferably 100% by mass or less, more preferably 95% by mass or less, even more preferably , 80% by mass or less, particularly preferably 60% by mass or less.
  • the adhesive composition can contain an acrylic resin (A) and an energy ray-curable resin (B).
  • the relationship between the contents of the acrylic resin (A) and the energy ray curable resin (B) can be appropriately set depending on the required adhesive strength of the adhesive layer 110.
  • the content of the acrylic resin (A) in the total content of the acrylic resin (A) and the energy beam curable resin (B) is preferably 0% by mass or more, more preferably, The content is 10% by mass or more, even more preferably 20% by mass or more, particularly preferably 50% by mass or more, and preferably 100% by mass or less, more preferably 95% by mass or less.
  • the adhesive composition forming the adhesive layer 110 may contain components other than resin.
  • the adhesive composition may contain one or more of a crosslinking agent (C), a photopolymerization initiator (D), an antioxidant (E), and other additives.
  • Crosslinking agent (C) The adhesive composition may contain a crosslinking agent (C) for crosslinking the functional groups of the resin by bonding them to other compounds.
  • a crosslinking agent (C) for crosslinking the functional groups of the resin by bonding them to other compounds.
  • the crosslinking agent (C) include isocyanate crosslinking agents (crosslinking agents having an isocyanate group) such as tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates, and epoxy type crosslinking agents such as ethylene glycol glycidyl ether.
  • Crosslinking agents crosslinking agents with glycidyl groups
  • aziridine crosslinking agents crosslinking agents with aziridinyl groups
  • metal chelate crosslinking agents such as aluminum chelate agent (crosslinking agent having a metal chelate structure), isocyanurate-based crosslinking agent (crosslinking agent having an isocyanuric acid skeleton), and the like.
  • the adhesive composition may contain one type of crosslinking agent, or may contain two or more types of crosslinking agents.
  • the content of the crosslinking agent (C) in the adhesive composition is preferably 0.01 mass% or more, more preferably 0.1 mass% or more, even more preferably 1 mass% or more, and is preferably 5 mass% or less, more preferably 4 mass% or less, even more preferably 2 mass% or less.
  • the pressure-sensitive adhesive composition may contain a photopolymerization initiator (D) that initiates a crosslinking reaction in response to the application of energy (e.g., irradiation with energy rays).
  • energy e.g., irradiation with energy rays.
  • the pressure-sensitive adhesive composition contains an energy ray-curable resin (B)
  • the pressure-sensitive adhesive layer 110 further contains a photopolymerization initiator (D), so that the crosslinking reaction proceeds even with the application of relatively low energy.
  • Examples of the photopolymerization initiator (D) include 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzylphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyro Examples include nitrile, dibenzyl, diacetyl, 8-chloroanthraquinone, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.
  • the adhesive composition may contain one type of polymerization initiator, or may contain two or more types of polymerization initiator.
  • the content of the photoinitiator (D) in the adhesive composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more. , preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 2% by mass or less.
  • the adhesive composition may contain an antioxidant (E).
  • an antioxidant E
  • examples of the antioxidant (E) include phenol-based antioxidants such as hindered phenol-based compounds, aromatic amine-based antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants such as phosphoric acid ester compounds.
  • the adhesive composition forming the adhesive layer 110 may contain one or more of a UV absorber, a light stabilizer, a resin stabilizer, a filler, a pigment, an extender, a softener, and the like.
  • the adhesive sheet base material 120 included in the adhesive sheet according to this embodiment functions as a support that supports the adhesive layer 110.
  • the type of adhesive sheet base material 120 is not particularly limited, and may be a hard base material or a flexible base material, such as plastic film, metal foil such as aluminum or stainless steel, glassine paper, wood-free paper, coated paper, or impregnated paper. It can be paper, synthetic paper, etc.
  • the device improves cushioning properties when capturing the device, facilitates attachment to other members, improves peelability, facilitates lamination, or allows the device to be formed into a roll. From this point of view, the adhesive sheet base material 120 may be a flexible base material.
  • a resin film can be used.
  • the resin film is a film in which a resin material is used as the main material, and may be made of the resin material, or may contain additives in addition to the resin material.
  • the resin film may have laser light transmittance.
  • resin films include polyethylene films such as low-density polyethylene film, linear low-density polyethylene film, and high-density polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, and ethylene-norbornene copolymer.
  • films and polyolefin-based films such as norbornene resin films
  • ethylene-based films such as ethylene-vinyl acetate copolymer films, ethylene-(meth)acrylic acid copolymer films, and ethylene-(meth)acrylic acid ester copolymer films Copolymer films
  • polyvinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films
  • polyester films such as polyethylene terephthalate films and polybutylene terephthalate films
  • polyurethane films polyimide films
  • polystyrene films polycarbonate films
  • fluororesin films such as norbornene resin films
  • ethylene-based films such as ethylene-vinyl acetate copolymer films, ethylene-(meth)acrylic acid copolymer films, and ethylene-(meth)acrylic acid ester copolymer films Copolymer films
  • polyvinyl chloride films such as polyvinyl chloride films and
  • modified films such as films containing mixtures of two or more materials, crosslinked films in which the resins forming these films are crosslinked, and ionomer films may be used.
  • the adhesive sheet base material 120 may be a laminated film in which two or more types of resin films are laminated.
  • the resin film may be a single-layer film selected from the group consisting of polyethylene film, polyester film, and polypropylene film; Alternatively, it can be a laminated film in which two or more types of films selected from this group are laminated.
  • the thickness of the adhesive sheet base material 120 is not particularly limited, but from the viewpoint of achieving both supportability and rollability, it is preferably 10 ⁇ m or more, more preferably 25 ⁇ m or more, even more preferably 40 ⁇ m or more, and preferably can be 500 ⁇ m or less, more preferably 200 ⁇ m or less, even more preferably 90 ⁇ m or less.
  • the thickness range of the adhesive sheet base material 120 is preferably 10 ⁇ m or more and 500 ⁇ m or less, more preferably 25 ⁇ m or more and 200 ⁇ m or less, and even more preferably 40 ⁇ m or more and 90 ⁇ m or less.
  • the adhesive sheet may have layers other than the adhesive sheet base material 120 and the adhesive layer 110.
  • an additional adhesive layer may be provided on the surface of the adhesive sheet base material 120 opposite to the adhesive layer 110.
  • the adhesive sheet can be attached to another substrate such as quartz glass through such an adhesive layer.
  • the type of the additional adhesive layer is not particularly limited, and for example, the additional adhesive layer can be formed using a common adhesive.
  • a pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer 110 is provided on the pressure-sensitive adhesive sheet base material 120 can be produced as follows. First, an organic solvent is added to the adhesive composition forming the above-described adhesive layer 110 to prepare a solution of the adhesive composition. Then, by applying this solution onto the adhesive sheet base material 120 to form a coating film and then drying it, an adhesive layer can be provided on the adhesive sheet base material 120. Furthermore, by performing a process to provide unevenness on the surface of this adhesive layer, it is possible to form an adhesive layer 110 having unevenness.
  • a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer 110 is provided on a pressure-sensitive adhesive sheet base material 120 can be produced as follows. First, an organic solvent is added to the adhesive composition forming the above-described adhesive layer 110 to prepare a solution of the adhesive composition. Then, this solution is applied onto a mold or a release sheet having irregularities opposite to those of the adhesive layer 110 (complementary irregularities) to form a coating film, and then dried to form the adhesive layer 110.
  • a pressure-sensitive adhesive sheet can be produced by manufacturing and bonding the pressure-sensitive adhesive layer 110 to the pressure-sensitive adhesive sheet base material 120.
  • Examples of the organic solvent used to prepare the solution of the adhesive composition include toluene, ethyl acetate, and methyl ethyl ketone.
  • Examples of methods for applying the solution include spin coating, spray coating, bar coating, knife coating, roll coating, roll knife coating, blade coating, die coating, gravure coating, and printing methods (e.g. screen printing method, inkjet method), etc.
  • unevenness can be provided on the surface of the adhesive layer using an imprint method.
  • a mold having a surface complementary to the unevenness to be provided can be used.
  • unevenness can be provided on the surface of the adhesive layer by heating the adhesive layer while pressing the adhesive layer provided on the adhesive sheet base material with a mold.
  • the adhesive layer is pressed with a mold, the adhesive layer is heated and maintained for a predetermined period of time, and then the adhesive layer is cooled and the mold can be removed.
  • the adhesive layer When heating the adhesive layer, the adhesive layer can be heated to a temperature higher than the softening point of the adhesive layer, for example. Further, the time period for maintaining the adhesive layer in the heated state is not particularly limited, but may be maintained for 10 seconds or more, or for 10 minutes or less, for example.
  • a specific method for heating the adhesive layer while pressing the adhesive layer with a mold includes a method of vacuum laminating the adhesive layer provided on the adhesive sheet base material and the mold. Note that instead of performing the two-step process of forming an adhesive layer and forming unevenness, the adhesive layer 110 having an uneven surface may be formed on the adhesive sheet base material 120 in a one-step process.
  • the adhesive layer 110 having an uneven shape can be provided by spray coating a solution of an adhesive composition. Furthermore, the adhesive layer 110 having a rough or fibrous surface can be provided by adding a filler to a solution of the adhesive composition and applying such a solution. As yet another method, an adhesive layer having an uneven shape can be directly provided on the adhesive sheet base material by applying a solution of the adhesive composition according to a desired pattern using a printing method such as an inkjet method. can.
  • a pressure-sensitive adhesive sheet without the pressure-sensitive adhesive sheet base material 120 can be produced by forming a pressure-sensitive adhesive composition into a sheet shape.
  • the adhesive layer may be formed by applying a liquid adhesive containing an adhesive composition to any object.
  • a treatment may be performed to provide unevenness on the surface of the adhesive layer, or the adhesive layer may be formed by a method in which unevenness is formed on the surface.
  • the adhesive sheet according to this embodiment can be used to capture elements separated from the holding substrate.
  • the adhesive sheet can be used as a die catch sheet for catching dies such as semiconductor dies.
  • This element is used to manufacture electronic components or semiconductor devices.
  • FIGS. 4A to 4C are schematic diagrams illustrating separation and capture of elements. Supplementing the elements from the holding substrate using the adhesive sheet will be described with reference to FIGS. 4A to 4C.
  • an adhesive sheet and a release sheet are usually attached to the laminate until just before use.
  • the release sheet is peeled off from the laminate to prepare an adhesive sheet 150 having an uneven adhesive layer.
  • an element 170 attached to a holding substrate 160 is prepared so as to face the adhesive sheet 150.
  • the type of element is not particularly limited.
  • the element may be, for example, a semiconductor chip such as an LED chip, a semiconductor chip with a protective film, a semiconductor chip with a die attach film (DAF), or the like.
  • the element may be a micro light emitting diode, a mini light emitting diode, a power device, a MEMS (Micro Electro Mechanical Systems), or a controller chip, or may be a component thereof.
  • the element may be a wafer, a panel, a substrate, or the like.
  • the device may, for example, have a circuit surface on which an integrated circuit is formed having circuit elements such as transistors, resistors, and capacitors.
  • the elements are not necessarily limited to singulated products, and may be various types of wafers or various substrates that are not singulated.
  • the size of the element is not particularly limited.
  • the size of the element may be, for example, preferably 100 ⁇ m 2 or more, more preferably 500 ⁇ m 2 or more, even more preferably 1000 ⁇ m 2 or more.
  • the size of the element may be preferably 100 mm 2 or less, more preferably 25 mm 2 or less, even more preferably 1 mm 2 or less.
  • the laser lift-off method described later is suitable for separating the elements because it is easy to selectively separate small elements.
  • wafers examples include silicon wafers, silicon carbide (SiC) wafers, compound semiconductor wafers (e.g., gallium phosphide (GaP) wafers, gallium arsenide (GaAs) wafers, indium phosphide (InP) wafers, gallium nitride (GaN)).
  • semiconductor wafers such as wafers.
  • the size of the wafer is not particularly limited, but is preferably 6 inches (about 150 mm in diameter) or more, more preferably 12 inches (about 300 mm in diameter) or more. Note that the shape of the wafer is not limited to a circle, and may be square or rectangular, for example.
  • the panel examples include fan-out semiconductor packages (for example, FOWLP or FOPLP). That is, the object to be processed may be a semiconductor package before or after singulation in fan-out type semiconductor package manufacturing technology.
  • the size of the panel is not particularly limited, it may be a rectangular substrate of about 300 to 700 mm, for example.
  • the substrate examples include a glass substrate, a sapphire substrate, a compound semiconductor substrate, and the like.
  • the holding substrate may be an adhesive sheet or a tray.
  • the adhesive sheet may have an adhesive layer, and this adhesive layer may be provided on the base material.
  • the holding substrate can hold the element on the adhesive layer.
  • the base material may be a resin film or a hard substrate.
  • the method of preparing such a holding substrate that holds the element is not particularly limited either.
  • a semiconductor wafer can be attached onto a holding substrate, and then the semiconductor wafer can be diced. By dicing the semiconductor wafer in this manner, elements can be obtained, and a holding substrate to which the elements are attached can be obtained.
  • the holding substrate As another method, by transferring the elements obtained by dicing the semiconductor wafer onto the holding substrate, it is possible to obtain the holding substrate to which the elements are attached. For example, after dicing a semiconductor wafer held on a wafer substrate, the obtained elements can be brought into close contact with the adhesive layer of the holding substrate. Thereafter, by applying an external stimulus such as a laser beam, the adhesiveness between the wafer substrate and the element can be reduced. Through such a process, the elements can be transferred from the wafer substrate to the holding substrate.
  • an external stimulus such as a laser beam
  • the element is separated from the holding substrate by laser light irradiation (laser lift-off method).
  • the adhesive layer of the holding substrate can contain a laser light absorber.
  • the laser light absorbent include one or more selected from pigments and dyes.
  • the external stimulation causes the element 170 attached to the holding substrate 160 to be separated from the holding substrate 160 and captured by the adhesive sheet 150.
  • holding substrate 160 and adhesive sheet 150 are stationary, and element 170 separated from holding substrate 160 moves to adhesive sheet 150.
  • the element 170 can be moved toward the adhesive sheet 150 due to gas pressure generated by laser light irradiation.
  • the holding substrate 160 may be moved away from the element 170.
  • the adhesive sheet 150 may be moved closer to the element 170.
  • the type of external stimulus for element separation is not particularly limited, but examples include energy application, cooling, stretching of the holding substrate, and physical stimulation (for example, pressing the back surface of the holding substrate with a pin, etc.). .
  • energy application for example, energy application, cooling, stretching of the holding substrate, and physical stimulation (for example, pressing the back surface of the holding substrate with a pin, etc.).
  • physical stimulation for example, pressing the back surface of the holding substrate with a pin, etc.
  • Examples of energy imparting methods include local heating, light irradiation, and heat ray irradiation. Further, examples of the light irradiation method include infrared ray irradiation, visible light irradiation, and laser light irradiation.
  • the external stimulus is laser irradiation, ie, separation of the device from the holding substrate by a laser lift-off method.
  • the laser beam is irradiated toward a part of the holding substrate where a specific element is attached. For example, such laser light irradiation can be performed from the surface of the holding substrate opposite to the element. Then, gas is generated at the contact site between the specific element and the holding substrate.
  • the adhesive layer when laser light is absorbed by the adhesive layer, at least a portion of the adhesive layer sublimates, thereby generating gas.
  • the adhesive area between a specific element and the adhesive layer decreases, and thus the adhesive force between the specific element and the holding substrate decreases.
  • the pressure of the generated gas also reduces the adhesive force between a specific element and the holding substrate. As a result, certain elements are separated from the holding substrate.
  • the laser light irradiation conditions are not particularly limited. From the viewpoint of selectively and efficiently separating some elements, the frequency of the laser beam is preferably 10,000 Hz or more and 100,000 Hz or less. Further, the beam diameter of the laser beam is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, while preferably 100 ⁇ m or less, more preferably 40 ⁇ m or less. The output of the laser beam is preferably 0.1 W or more and 10 W or less. The scanning speed of the laser beam is preferably 50 mm/sec or more and 2000 mm/sec or less.
  • the element 170 separated from the holding substrate 160 is captured on the adhesive sheet 150. Specifically, the element 170 is relatively separated from the holding substrate 160. Furthermore, the element 170 approaches the adhesive sheet 150 relatively. When the element 170 and the adhesive layer 110 of the adhesive sheet 150 come into contact with each other, the element 170 is captured on the adhesive sheet 150.
  • the gas compressed between the element and the adhesive layer 110 which is generated when the element and the adhesive layer 110 come close to each other, can escape to the recesses of the adhesive sheet. In this way, since the adhesive layer 110 has irregularities, the pressure generated between the element 170 and the adhesive layer 110 can be alleviated. Therefore, it is possible to suppress the displacement of the holding position of the element on the adhesive sheet due to the pressure generated between the element and the adhesive layer 110.
  • the release sheet according to this embodiment has a release layer 130, and the release layer 130 is a layer that is in contact with the adhesive layer, and may contain resin. As described above, the surface of the release layer 130 has irregularities. The unevenness on the surface of the release layer 130 is complementary to the unevenness on the surface of the adhesive layer 110. That is, the shape of the convex part 111 of the adhesive layer 110 is similar to the shape of the concave part 132 of the release layer 130, and the shape of the concave part 112 of the adhesive layer 110 is the same as the shape of the convex part 131 of the release layer 130. There is. Note that the release sheet may have two or more release layers 130. For example, the release sheet may have a laminate of one or more types of release layers 130.
  • release layer 130 has a plurality of spaced apart depressions on its surface bounded by protrusions. Each of the plurality of recesses may be separated by a continuous protrusion throughout the release layer 130.
  • the unevenness on the surface of the release layer 130 is complementary to the unevenness on the surface of the release layer 130, and the specific shape of the unevenness on the surface of the release layer 130 is not limited.
  • the convex portions located around each of the plurality of concave portions are continuous to the end of the release layer 130.
  • 5A to 5C are top views showing the shape of such a release layer 130.
  • recesses 132 may be regularly arranged on the surface of the release layer 130. The fact that the recesses 132 are regularly arranged means that the recesses 132 are arranged in a straight line at regular intervals.
  • the recesses 132 may be arranged so that the intervals vary regularly. In the example of FIG. 5B, the distance between the recesses 132 is short at the center of the release sheet, and the distance between the recesses 132 is long at the periphery of the release sheet. Furthermore, the recesses 132 may be arranged irregularly.
  • FIG. 5C is a top view showing another shape of the release layer 130.
  • striped recesses 132 may be provided on the surface of the release layer 130.
  • line-shaped recesses 132 having a constant width are lined up at regular intervals.
  • the width or interval of the line-shaped recesses 132 may vary regularly, or the line-shaped recesses 132 may be arranged irregularly.
  • the minimum interval among all the intervals between all the recesses 132 in the center part of the release sheet may be shorter than the minimum interval among all the intervals between all the recesses 132 in the peripheral part of the release sheet.
  • the center area is, for example, a circular area having 1/4 of the area of the release sheet and centered on the center of gravity of the release sheet
  • the peripheral area is, for example, all areas other than the center of the release sheet.
  • the pitch P of the concave portions 132 of the release layer 130 can be the same as the pitch of the convex portions 111 of the adhesive layer 110.
  • the pitch of the recesses 132 is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, even more preferably 10 ⁇ m or more, and particularly preferably 15 ⁇ m or more.
  • this pitch is preferably 100 ⁇ m or less, more preferably 75 ⁇ m or less, more preferably 50 ⁇ m or less, even more preferably 35 ⁇ m or less, particularly preferably 25 ⁇ m or less.
  • the pitch of the recesses 132 means the distance between the center point of one arbitrarily selected recess 132 and the center point of another recess 132 that is closest to that recess 132.
  • the pitch of the recesses 132 is the distance between the center point of the recess 132 on a straight line in which the recesses 132 are lined up at regular intervals and the center point of another recess 132' that is closest to the recess 132. represents.
  • the pitch represents the distance between the center points of the recesses on the straight line arranged at the shortest pitch.
  • the recess has an elongated shape as shown in FIG. 5C and the center point of the recess is difficult to specify, it represents the distance from the boundary on the same side of the recess 132 to the closest boundary of another recess 132'.
  • the specific shape of the recess 132 is not particularly limited.
  • the recess 132 may be depressed in the shape of a pillar.
  • the recess 132 may be recessed in a cylindrical shape or may be recessed in a prismatic shape.
  • the recessed portion 132 may be depressed so as to extend in a line shape, or may be depressed so as to extend in a curved shape such as a wave shape.
  • these recesses 132 may be provided with a taper.
  • FIG. 6A shows a cross-sectional view of a release layer 130 according to one embodiment through a recess 132 and perpendicular to the surface of the release layer 130.
  • the recess 132 shown in FIG. 6A is tapered, that is, the recess 132 is tapered.
  • the surface of the release layer 130 may have a flat convex portion and a concave portion 132 depressed from the convex portion. In this manner, the plurality of recesses 132 that are spaced apart from each other may be bounded by protrusions.
  • the bottom of the recess 132 may be curved like a hemisphere or a part of a sphere. Alternatively, the bottom of the recess may be flat. As yet another example, the recess 132 may be recessed in the shape of a collection of grains, the surface of a lotus leaf, or a needle shape. As yet another example, the surface of the release layer 130 may be recessed in a rough or fibrous shape, and such a surface can also be said to have unevenness.
  • the unevenness on the surface of the release layer 130 has a complementary relationship with the unevenness on the surface of the adhesive layer 110.
  • the adhesive layer 110 is peeled off as described below.
  • the dimensions of the recesses 132 of the layer 130 can be the same as or larger than the dimensions of the protrusions 111 of the adhesive layer 110.
  • each recess 132 is the width or diameter of its top, not its bottom, and is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, even more preferably 5 ⁇ m or more, particularly preferably 10 ⁇ m or more. It is. On the other hand, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, even more preferably 30 ⁇ m or less, particularly preferably 20 ⁇ m or less.
  • the width and diameter of the recess 132 mean the minimum distance and maximum distance (represented by D in FIG. 6A) between two parallel lines touching from both sides of the recess 132 on the surface of the projection, respectively. .
  • each recess 132 is preferably 10 ⁇ m 2 or more, more preferably 20 ⁇ m 2 or more, even more preferably 30 ⁇ m 2 or more.
  • the area of each convex portion 111 is preferably 2000 ⁇ m 2 or less, more preferably 1000 ⁇ m 2 or less, even more preferably 500 ⁇ m 2 or less.
  • the area of the concave portion 132 means the area of the portion depressed from the surface of the convex portion (in the case of FIG. 6A, the area of a circle with a diameter D).
  • each recess 132 is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and even more preferably 5 ⁇ m or more.
  • the height (depth) of each recess 132 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, even more preferably 10 ⁇ m or less.
  • the depth of the recess 132 is represented by H in FIG. 6A.
  • each recess 132 with respect to the area of the release layer 130 is preferably 1% or more, more preferably 5% or more, more preferably 10% or more, even more preferably 18% or more, and particularly preferably is 40% or more.
  • the area of each recess 132 with respect to the area of the release layer 130 is preferably 95% or less, more preferably 75% or less, and even more preferably 60% or less.
  • the thickness of the release layer 130 is not particularly limited, but from the viewpoint of releasability, it is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, preferably 50 ⁇ m or less, and more preferably, The thickness may be 45 ⁇ m or less, more preferably 40 ⁇ m or less.
  • the thickness range of the release layer 130 is preferably 10 ⁇ m or more and 50 ⁇ m or less, more preferably 15 ⁇ m or more and 45 ⁇ m or less, even more preferably 20 ⁇ m or more and 40 ⁇ m or less.
  • the release agent composition forming the release layer 130 contains a resin.
  • the resin contained in the release agent composition includes polyolefins such as polyethylene resins, thermoplastic elastomers such as olefinic thermoplastic elastomers, fluororesins such as tetrafluoroethylene, mixtures thereof, and the like.
  • the release agent composition forming the release layer 130 can include a non-silicone release agent (resin) or a non-silicone olefin release agent (resin). Examples of such resins include polyethylene resins and olefin thermoplastic elastomers.
  • the release agent composition contains a silicone resin
  • a layer of a silicone compound derived from the silicone resin may be formed on the surface of the element during the manufacturing process.
  • a non-silicone release agent (resin) or a non-silicone olefin release agent (resin) as the resin contained in the release agent composition forming the release layer 130, the silicone compound layer can be easily removed during the manufacturing process.
  • An appropriate circuit can be formed without being formed on the surface of the element.
  • the resins contained in the release agent composition are an olefinic thermoplastic elastomer and a polyethylene resin
  • the olefinic thermoplastic elastomer and the polyethylene resin may satisfy the following conditions.
  • the olefinic thermoplastic elastomer may be an ethylene-propylene copolymer, an ethylene-octene copolymer, or the like.
  • the olefinic thermoplastic elastomer can be an ethylene-propylene copolymer.
  • the density of the olefin thermoplastic elastomer is not particularly limited, but is preferably 0.80 g/cm 3 or more, more preferably 0.86 g/cm 3 or more. This improves heat resistance. Further, the density of the olefin thermoplastic elastomer is preferably 0.90 g/cm 3 or less, more preferably 0.88 g/cm 3 or less. This improves releasability. The density of the olefin thermoplastic elastomer is preferably 0.80 g/cm 3 or more and 0.90 g/cm 3 or less, more preferably 0.86 g/cm 3 or more and 0.88 g/cm 3 or less. Can be done.
  • the polyethylene resin can be synthesized using a transition metal catalyst such as a Ziegler-Natta catalyst or a metallocene catalyst.
  • a transition metal catalyst such as a Ziegler-Natta catalyst or a metallocene catalyst.
  • metallocene catalysts have excellent peelability and heat resistance.
  • the density of the polyethylene resin is not particularly limited, but is preferably 0.890 g/cm 3 or more, more preferably 0.900 g/cm 3 or more. This improves heat resistance. Further, the density of the polyethylene resin is preferably 0.925 g/cm 3 or less, more preferably 0.922 gg/cm 3 or less. This improves releasability. The density of the polyethylene resin is preferably 0.890 g/cm 3 or more and 0.925 g/cm 3 or less, more preferably 0.900 g/cm 3 or more and 0.922 g/cm 3 or less.
  • the mass ratio (mixing ratio) of the olefin-based thermoplastic elastomer to the polyethylene resin is not particularly limited, but is preferably 25:75 to 75:25, and more preferably 40:60 to 60:4. This improves the peelability and heat resistance.
  • the release agent composition that forms the release layer 130 may contain other resin components and various additives such as plasticizers and stabilizers.
  • the release sheet base material 140 included in the release sheet according to this embodiment functions as a support that supports the release layer 130.
  • the type of release sheet base material 140 is not particularly limited, and may be a hard base material or a flexible base material.
  • As the release sheet base material 140 for example, a resin film can be used.
  • the release sheet base material 140 can be the same as the adhesive sheet base material 120 described above.
  • the thickness of the release sheet base material 140 is not particularly limited, but from the viewpoint of achieving both supportability and rollability, it is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, even more preferably 30 ⁇ m or more, and preferably can be 200 ⁇ m or less, more preferably 150 ⁇ m or less, even more preferably 100 ⁇ m or less.
  • the thickness range of the release sheet base material 140 is preferably 10 ⁇ m or more and 200 ⁇ m or less, more preferably 20 ⁇ m or more and 150 ⁇ m or less, even more preferably 30 ⁇ m or more and 100 ⁇ m or less.
  • the release sheet may have layers other than the release sheet base material 140 and the release layer 130.
  • an intermediate layer may be provided between the release sheet base material 140 and the release layer 130 in order to improve the adhesion between the two.
  • a release sheet in which a release layer 130 is provided on a release sheet base material 140 can be produced as follows. First, an organic solvent is added to the release agent composition that forms the above-described release layer 130 to prepare a solution of the adhesive composition. Then, a release layer can be provided on the release sheet base material 140 by applying this solution onto the release sheet base material 140 to form a coating film and then drying it. Further, by performing a treatment to provide unevenness on the surface of this release layer, a release layer 130 having unevenness can be formed.
  • a release sheet having a release layer 130 provided on a release sheet substrate 140 can be produced as follows. First, an organic solvent is added to the release agent composition that forms the release layer 130 described above to prepare a solution of the release agent composition. This solution is then applied to a mold or adhesive sheet having an unevenness opposite to that of the release layer 130 described above (complementary unevenness) to form a coating film, which is then dried to produce the release layer 130. The release layer 130 is then attached to the release sheet substrate 120 to produce the release sheet.
  • the organic solvent used to prepare the solution of the release agent composition and the method for applying the solution can be the same as those for the above-mentioned adhesive composition.
  • a release sheet without the release sheet base material 140 can be produced by forming a release agent composition into a sheet shape.
  • the release layer may be formed by applying a liquid release agent containing a release agent composition to any object.
  • a treatment may be performed to provide unevenness on the surface of the release layer, or the release layer may be formed by a method that creates unevenness on the surface.
  • (B) component) Energy ray curable resin (B1): manufactured by Toagosei Co., Ltd., product name “Aronix M-920”
  • Crosslinking agent (C1) Isocyanurate type polyisocyanate derived from hexamethylene diisocyanate
  • Example 1 Preparation of adhesive sheet 100 parts by mass of acrylic ester copolymer (A), 5.0 parts by mass of energy ray curable resin (B1), 0.5 parts by mass of crosslinking agent (C), and photopolymerization initiator (D1).
  • a pressure-sensitive adhesive composition was prepared by dissolving 0.15 parts by mass in toluene. This adhesive composition was applied to the release-treated surface of a process sheet (manufactured by Lintec Corporation, product name "SP-PET382150", thickness 38 ⁇ m), and the resulting coating film was dried at 100°C for 2 minutes to increase the thickness. An adhesive layer having a thickness of 25 ⁇ m was formed.
  • a base material polyethylene terephthalate film, thickness 50 ⁇ m
  • release sheet with uneven surface shape 50 parts by mass of an olefinic thermoplastic elastomer containing an ethylene-propylene copolymer and 50 parts by mass of polyethylene resin were dissolved in toluene to prepare a release agent composition.
  • This release agent composition was applied to a polyethylene terephthalate film (thickness: 38 ⁇ m), and the resulting coating film was dried at 100° C. for 2 minutes to form a release layer with a thickness of 20 ⁇ m. Thereafter, the release layer was softened by heating to 160° C., and a master mold in which a convex shape had been formed in advance was bonded to the release layer, thereby producing a release sheet having an uneven surface.
  • the adhesive layer of the adhesive sheet was bonded to a release sheet having an uneven surface and vacuum laminated at 60° C. for 300 seconds.
  • the adhesive sheet having an uneven surface and the peeling surface having an uneven surface are separated.
  • a laminate consisting of sheets was produced.
  • the uneven shape of the adhesive layer of the adhesive sheet was a grid-like arrangement of pillars, similar to that of Figure 2A.
  • the pitch (P) between the pillars in the adhesive sheet was 20 ⁇ m.
  • the height (H) of each pillar was 8 ⁇ m
  • the diameter (T) of the tip was 8 ⁇ m
  • the diameter (D) of the base was 16 ⁇ m.
  • the ratio of the area of the adhesive layer and the area of the captured element (i.e., the area of the tip surface of the convex portion) to the area of the adhesive sheet was approximately 12.6%.
  • the uneven shape of the adhesive layer of the adhesive sheet had a surface shape complementary to the uneven shape of the release sheet.
  • Example 2 to 4 and Comparative Examples 1 and 2 Laminated bodies of Examples 2 to 4 and Comparative Examples 1 and 2 were obtained in the same manner as Example 1, except that the types and blending ratios of each component were changed to those shown in Table 1.
  • Reference examples 1 and 2 The laminates of Reference Examples 1 and 2 were prepared in the same manner as in Example 1, except that the types and blending ratios of each component were changed to those shown in Table 1, and no unevenness was formed on the surface of the adhesive sheet. Obtained.
  • the laminates of Examples 1 to 4 had a peel force of 1000 mN/50 mm or less. As a result, in the laminates of Examples 1 to 4, the pressure-sensitive adhesive sheet having an uneven surface could be easily peeled off from the release sheet.
  • the laminates of Comparative Examples 1 and 2 had a peel strength of 1000 mN/50 mm or more. This meant that the laminates of Comparative Examples 1 and 2 had adhesive sheets with uneven surfaces that could not be easily peeled off from the release sheet.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2023/034249 2022-09-22 2023-09-21 積層体 Ceased WO2024063128A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202380068105.8A CN119907842A (zh) 2022-09-22 2023-09-21 层叠体
JP2024548306A JP7818093B2 (ja) 2022-09-22 2023-09-21 積層体
US19/113,896 US20260098191A1 (en) 2022-09-22 2023-09-21 Laminate
KR1020257009970A KR20250073139A (ko) 2022-09-22 2023-09-21 적층체

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2022-151756 2022-09-22
JP2022-151757 2022-09-22
JP2022151757 2022-09-22
JP2022151756 2022-09-22
JP2023058463 2023-03-31
JP2023-058463 2023-03-31
JP2023058459 2023-03-31
JP2023-058459 2023-03-31
JP2023058460 2023-03-31
JP2023058462 2023-03-31
JP2023-058462 2023-03-31
JP2023-058460 2023-03-31

Publications (1)

Publication Number Publication Date
WO2024063128A1 true WO2024063128A1 (ja) 2024-03-28

Family

ID=90454623

Family Applications (6)

Application Number Title Priority Date Filing Date
PCT/JP2023/034249 Ceased WO2024063128A1 (ja) 2022-09-22 2023-09-21 積層体
PCT/JP2023/034248 Ceased WO2024063127A1 (ja) 2022-09-22 2023-09-21 粘着シート、および電子部品または半導体装置の製造方法
PCT/JP2023/034247 Ceased WO2024063126A1 (ja) 2022-09-22 2023-09-21 素子転写用シート
PCT/JP2023/034250 Ceased WO2024063129A1 (ja) 2022-09-22 2023-09-21 粘着シート及び剥離方法
PCT/JP2023/034245 Ceased WO2024063124A1 (ja) 2022-09-22 2023-09-21 粘着シート
PCT/JP2023/034246 Ceased WO2024063125A1 (ja) 2022-09-22 2023-09-21 粘着シートからの物体の剥離方法

Family Applications After (5)

Application Number Title Priority Date Filing Date
PCT/JP2023/034248 Ceased WO2024063127A1 (ja) 2022-09-22 2023-09-21 粘着シート、および電子部品または半導体装置の製造方法
PCT/JP2023/034247 Ceased WO2024063126A1 (ja) 2022-09-22 2023-09-21 素子転写用シート
PCT/JP2023/034250 Ceased WO2024063129A1 (ja) 2022-09-22 2023-09-21 粘着シート及び剥離方法
PCT/JP2023/034245 Ceased WO2024063124A1 (ja) 2022-09-22 2023-09-21 粘着シート
PCT/JP2023/034246 Ceased WO2024063125A1 (ja) 2022-09-22 2023-09-21 粘着シートからの物体の剥離方法

Country Status (6)

Country Link
US (5) US20260098191A1 (https=)
JP (6) JP7817420B2 (https=)
KR (6) KR20250073624A (https=)
CN (6) CN119855880A (https=)
TW (6) TW202428446A (https=)
WO (6) WO2024063128A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7587722B1 (ja) 2024-03-29 2024-11-20 第一工業製薬株式会社 活性エネルギー線硬化性樹脂組成物、塗膜および積層体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2022016258A (es) * 2020-06-29 2023-02-22 Unilever Ip Holdings B V Un recipiente.
TW202502553A (zh) * 2023-03-31 2025-01-16 日商琳得科股份有限公司 黏著片及剝離方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136717A (ja) * 2012-04-23 2012-07-19 Nitto Denko Corp 熱剥離型粘着シート及びその製造方法
JP2019137716A (ja) * 2018-02-06 2019-08-22 リンテック株式会社 ウィンドウフィルムおよびその製造方法
JP2020061529A (ja) * 2018-10-12 2020-04-16 三井化学株式会社 電子装置の製造方法および粘着性フィルム
WO2020166301A1 (ja) * 2019-02-14 2020-08-20 東レエンジニアリング株式会社 半導体チップの支持基板、転写装置および転写方法
WO2021079746A1 (ja) * 2019-10-24 2021-04-29 昭和電工マテリアルズ株式会社 離型フィルム及び半導体パッケージの製造方法
JP2022014690A (ja) * 2020-07-07 2022-01-20 大日本印刷株式会社 保持部材、転写部材、転写部材の製造方法及び発光基板の製造方法
JP2022102226A (ja) * 2020-12-25 2022-07-07 ジェイフィルム株式会社 剥離フィルムおよび粘着体
WO2022163233A1 (ja) * 2021-01-28 2022-08-04 三菱ケミカル株式会社 離型フィルム付き粘着シート、離型フィルム付き画像表示装置用積層体および画像表示装置用積層体の製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580479A (en) * 1978-12-12 1980-06-17 Sanyo Kokusaku Pulp Co Ltd Manufacturing of pressure-sensitive type adhesive tape or sheet
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
JP2003003132A (ja) * 2001-06-19 2003-01-08 Lintec Corp 粘着シートおよび貼着体
CA2460248A1 (en) * 2001-09-14 2003-03-27 Lintec Corporation Easily applicable adhesive sheet and method for producing the same
US7326457B2 (en) * 2002-03-05 2008-02-05 Hitachi Plant Technologies, Ltd. Substrate holding device including adhesive face with hexagons defined by convex portions
JP2003336018A (ja) * 2002-05-22 2003-11-28 Dainippon Printing Co Ltd 粘着シート
JP2004115766A (ja) 2002-09-30 2004-04-15 Dainippon Printing Co Ltd 粘着シート
JP4624813B2 (ja) * 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
DE102006053439A1 (de) * 2006-02-22 2008-05-15 Tesa Ag Klebeband und seine Verwendung
JP2009152387A (ja) * 2007-12-20 2009-07-09 Sony Corp 電子デバイスの製造方法、転写用電子デバイス基板および表示装置
JP5244072B2 (ja) * 2009-10-30 2013-07-24 日東電工株式会社 剥離ライナー付き粘着シート
JP4907724B2 (ja) * 2010-03-17 2012-04-04 リンテック株式会社 離型シートおよび粘着体
DE112012002001A5 (de) * 2011-05-06 2014-03-06 Tesa Se Doppelseitiges Klebeband mit einer ersten äußeren haftklebrigen und einer zweiten äußeren hitzeaktivierbaren Seite
JP6021263B2 (ja) * 2013-01-29 2016-11-09 日東電工株式会社 粘着テープ
JP2015220377A (ja) * 2014-05-19 2015-12-07 古河電気工業株式会社 粘接着フィルム一体型表面保護テープおよび粘接着フィルム一体型表面保護テープを用いた半導体チップの製造方法
JP6364663B2 (ja) * 2014-10-03 2018-08-01 フジコピアン株式会社 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材
JP2016135828A (ja) * 2015-01-23 2016-07-28 信越ポリマー株式会社 電子部品保持シート及び電子部品の剥離方法
JP2019137717A (ja) * 2018-02-06 2019-08-22 国立研究開発法人産業技術総合研究所 タール成分の処理方法および装置
WO2019172220A1 (ja) * 2018-03-07 2019-09-12 リンテック株式会社 粘着シート
JP2018115332A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP7252032B2 (ja) * 2018-03-28 2023-04-04 東レエンジニアリング株式会社 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
WO2019216262A1 (ja) * 2018-05-07 2019-11-14 リンテック株式会社 半導体チップの製造方法
WO2020196758A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
JP7296805B2 (ja) 2019-07-16 2023-06-23 大倉工業株式会社 均一拡張性フィルム
JP7377723B2 (ja) * 2020-01-21 2023-11-10 タキロンシーアイ株式会社 ダイシングテープ用基材フィルム
JP2021118274A (ja) * 2020-01-27 2021-08-10 株式会社ジャパンディスプレイ 移戴基板
JP7564625B2 (ja) * 2020-01-31 2024-10-09 リンテック株式会社 仮固定粘着シート
JP2021141181A (ja) 2020-03-05 2021-09-16 東レエンジニアリング株式会社 チップ転写装置
JP7612996B2 (ja) 2020-03-16 2025-01-15 Ｔｏｐｐａｎホールディングス株式会社 粘着シート
JP7099574B2 (ja) * 2020-11-25 2022-07-12 住友ベークライト株式会社 粘着テープ
JP2022152387A (ja) * 2021-03-29 2022-10-12 本田技研工業株式会社 内燃機関のｃｏ２分離装置
JPWO2022209119A1 (https=) * 2021-03-30 2022-10-06
JP2023013022A (ja) 2021-07-15 2023-01-26 古河電気工業株式会社 電子部品用粘着テープ
JP2023013023A (ja) 2021-07-15 2023-01-26 古河電気工業株式会社 電子部品用粘着テープ
KR20240057380A (ko) * 2021-09-06 2024-05-02 세키스이가가쿠 고교가부시키가이샤 반도체 장치 제조용 점착 테이프

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136717A (ja) * 2012-04-23 2012-07-19 Nitto Denko Corp 熱剥離型粘着シート及びその製造方法
JP2019137716A (ja) * 2018-02-06 2019-08-22 リンテック株式会社 ウィンドウフィルムおよびその製造方法
JP2020061529A (ja) * 2018-10-12 2020-04-16 三井化学株式会社 電子装置の製造方法および粘着性フィルム
WO2020166301A1 (ja) * 2019-02-14 2020-08-20 東レエンジニアリング株式会社 半導体チップの支持基板、転写装置および転写方法
WO2021079746A1 (ja) * 2019-10-24 2021-04-29 昭和電工マテリアルズ株式会社 離型フィルム及び半導体パッケージの製造方法
JP2022014690A (ja) * 2020-07-07 2022-01-20 大日本印刷株式会社 保持部材、転写部材、転写部材の製造方法及び発光基板の製造方法
JP2022102226A (ja) * 2020-12-25 2022-07-07 ジェイフィルム株式会社 剥離フィルムおよび粘着体
WO2022163233A1 (ja) * 2021-01-28 2022-08-04 三菱ケミカル株式会社 離型フィルム付き粘着シート、離型フィルム付き画像表示装置用積層体および画像表示装置用積層体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7587722B1 (ja) 2024-03-29 2024-11-20 第一工業製薬株式会社 活性エネルギー線硬化性樹脂組成物、塗膜および積層体
JP2025154508A (ja) * 2024-03-29 2025-10-10 第一工業製薬株式会社 活性エネルギー線硬化性樹脂組成物、塗膜および積層体

Also Published As

Publication number Publication date
TW202428818A (zh) 2024-07-16
US20250215267A1 (en) 2025-07-03
KR20250073624A (ko) 2025-05-27
JP7817420B2 (ja) 2026-02-18
US20260103624A1 (en) 2026-04-16
JPWO2024063125A1 (https=) 2024-03-28
KR20250073138A (ko) 2025-05-27
KR20250073139A (ko) 2025-05-27
JPWO2024063128A1 (https=) 2024-03-28
CN119855880A (zh) 2025-04-18
KR20250073141A (ko) 2025-05-27
CN119895537A (zh) 2025-04-25
WO2024063125A1 (ja) 2024-03-28
CN119907842A (zh) 2025-04-29
JPWO2024063124A1 (https=) 2024-03-28
KR20250072976A (ko) 2025-05-26
TW202421738A (zh) 2024-06-01
TW202422829A (zh) 2024-06-01
TW202424140A (zh) 2024-06-16
US20260098191A1 (en) 2026-04-09
JPWO2024063129A1 (https=) 2024-03-28
JPWO2024063126A1 (https=) 2024-03-28
JP7680640B2 (ja) 2025-05-20
JP7818093B2 (ja) 2026-02-19
US20250215283A1 (en) 2025-07-03
TW202430382A (zh) 2024-08-01
WO2024063129A1 (ja) 2024-03-28
KR20250073626A (ko) 2025-05-27
CN119855881A (zh) 2025-04-18
TW202428446A (zh) 2024-07-16
JPWO2024063127A1 (https=) 2024-03-28
US20250215277A1 (en) 2025-07-03
WO2024063124A1 (ja) 2024-03-28
WO2024063126A1 (ja) 2024-03-28
CN119948124A (zh) 2025-05-06
WO2024063127A1 (ja) 2024-03-28
CN119948600A (zh) 2025-05-06

Similar Documents

Publication Publication Date Title
JP7818093B2 (ja) 積層体
CN106795396B (zh) 粘着片以及加工物的制造方法
CN103087644A (zh) 切割片及半导体晶片的的制造方法
TW202405113A (zh) 電子零件暫時固定用黏著片材
WO2022201790A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
WO2024063123A1 (ja) 粘着シート及び電子部品又は半導体装置の製造方法
WO2025063125A1 (ja) 粘着シート及び物体の取り扱い方法
WO2025063123A1 (ja) 粘着シート及び物体の取り扱い方法
WO2025063124A1 (ja) 粘着シート及び物体の取り扱い方法
WO2025198043A1 (ja) 粘着シート及び粘着シートからの物体の剥離方法
WO2026088902A1 (ja) 電子部品貼付用粘着シート
WO2022201788A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
WO2022201789A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23868249

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024548306

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 202380068105.8

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 202380068105.8

Country of ref document: CN

122 Ep: pct application non-entry in european phase

Ref document number: 23868249

Country of ref document: EP

Kind code of ref document: A1