WO2024047809A1 - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
WO2024047809A1
WO2024047809A1 PCT/JP2022/032830 JP2022032830W WO2024047809A1 WO 2024047809 A1 WO2024047809 A1 WO 2024047809A1 JP 2022032830 W JP2022032830 W JP 2022032830W WO 2024047809 A1 WO2024047809 A1 WO 2024047809A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
control device
electronic control
shielding member
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/032830
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
章 瀧井
俊明 高井
祐輝 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Priority to JP2024543704A priority Critical patent/JPWO2024047809A1/ja
Priority to PCT/JP2022/032830 priority patent/WO2024047809A1/ja
Priority to DE112022007360.8T priority patent/DE112022007360T5/de
Publication of WO2024047809A1 publication Critical patent/WO2024047809A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present invention relates to an electronic control device.
  • the electronic control device that controls the vehicle includes a main electronic control device that outputs control commands, and multiple sub-electronic control devices that perform engine control, automatic brake control, display control, etc. based on control commands from the main electronic control device. It is composed of Furthermore, vehicles are equipped with many sensors for recognizing external conditions (road conditions, etc.). The electronic control device controls the vehicle while a sub electronic control device connected to the main electronic control device processes sensor signals.
  • the main electronic control unit or sub electronic control unit is equipped with a mechanism that provides basic functions in each electronic control unit and does not affect vehicle operation even if some abnormality occurs, and redundancy of each function is ensured. Guaranteed.
  • Electronic control devices are becoming more multi-functional, including redundancy, and may be configured to include a plurality of circuit boards. Further, as each circuit board of an electronic control device becomes multifunctional, multiple microcomputers and DDR memories with high operating frequencies are used, and there is a high possibility that the number of electronic components that generate heat will increase. As a result, noise countermeasures and heat countermeasures are essential for electronic control devices.
  • Patent Document 1 describes a high frequency communication device that includes a high frequency circuit board and a shield case that covers the entire surface of the high frequency circuit board.
  • the present invention has been made in view of the above, and aims to comprehensively implement noise countermeasures for electronic components mounted on any of a plurality of circuit boards included in an electronic control device.
  • an electronic control device of the present invention includes a first circuit board and a second circuit board in which the mounting surfaces of the respective electronic components are arranged facing each other with a gap between them, and the first circuit board and the second circuit board.
  • a shielding member disposed at the interval of the second circuit board to shield noise; and a conductive member connecting the first circuit board and the second circuit board to the shielding member, the shielding member comprising:
  • the frame body is characterized in that it is a frame that surrounds the entire circumference of the electronic components mounted on each of the first circuit board and the second circuit board and forms a closed circuit having a width corresponding to the interval.
  • FIG. 1 is an exploded perspective view of the electronic control device of Embodiment 1.
  • FIG. 2 is a sectional view of the electronic control device shown in FIG. 1.
  • FIG. FIG. 3 is a configuration diagram of a shielding member.
  • FIG. 3 is an exploded perspective view of an electronic control device according to a second embodiment.
  • 5 is a sectional view of the electronic control device shown in FIG. 4.
  • FIG. 3 is a configuration diagram of a shielding member, a heat sink, and a heat sink.
  • FIG. 1 is an exploded perspective view of an electronic control device 100 according to a first embodiment.
  • FIG. 2 is a sectional view of the electronic control device 100 shown in FIG.
  • FIG. 3 is a configuration diagram of the shielding member 9.
  • the electronic control device 100 is an electronic control device including a plurality of circuit boards.
  • the electronic control device 100 may be an ECU (Electronic Control Unit) that is mounted on a vehicle and controls the vehicle.
  • ECU Electronic Control Unit
  • the electronic control device 100 includes housings 1 and 2, a first circuit board 4 and a second circuit board 5, an electronic component 8, a shielding member 9, conductive members 10a and 10b, and a bracket 11.
  • the casings 1 and 2 accommodate the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b.
  • the casings 1 and 2 are formed in the shape of a hollow rectangular parallelepiped.
  • the casings 1 and 2 are made of metal or resin.
  • the casings 1 and 2 are composed of a casing base 1 that constitutes the four walls and a ceiling of the casings 1 and 2, and a casing cover 2 that constitutes the floor of the casings 1 and 2.
  • the walls of the casings 1 and 2, that is, one wall of the casing base 1, has an opening 3 that exposes an external connector 6 connected to an external device.
  • the external connector 6 is mounted on the mounting surface 4a of the first circuit board 4, and is connected to external equipment via a harness or cable.
  • the first circuit board 4 and the second circuit board 5 are arranged to face each other with their respective electronic component 8 mounting surfaces 4a and 5a spaced apart.
  • the first circuit board 4 and the second circuit board 5 are arranged parallel to each other.
  • the electronic component 8 is a semiconductor device such as a microcomputer and a DDR memory.
  • Each of the first circuit board 4 and the second circuit board 5 mounts a plurality of electronic components 8.
  • the first circuit board 4 and the second circuit board 5 are provided with a ground circuit pattern.
  • Each of the first circuit board 4 and the second circuit board 5 is provided with a signal ground 12 and a frame ground 13 as the grounds. Alternatively, only the signal ground 12 may be provided on each of the first circuit board 4 and the second circuit board 5.
  • the first circuit board 4 and the second circuit board 5 are connected to each other by an inter-board connector 7.
  • the first circuit board 4 and the second circuit board 5 are spaced apart from each other by a spacer 14 .
  • the spacer 14 is, for example, a highly rigid rod-shaped member that has one end fastened to the first circuit board 4 with a screw or the like, and the other end fastened to the second circuit board 5 with a screw or the like. Spacer 14 is fixed to shielding member 9.
  • the shielding member 9 is a member that is arranged at a distance between the first circuit board 4 and the second circuit board 5 and shields noise.
  • the shielding member 9 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • the shielding member 9 is connected to and fixed to the casings 1 and 2.
  • the shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and is arranged according to the distance between the first circuit board 4 and the second circuit board 5. It is a frame that forms a closed path with a width of The shielding member 9 surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and cooperates with the first circuit board 4 and the second circuit board 5. Thus, a closed space is formed between the first circuit board 4 and the second circuit board 5.
  • the shielding member 9 may be composed of a plurality of shielding plates. 1 and 3 show an example in which the shielding member 9 is constituted by four shielding plates provided along each side of the rectangular first circuit board 4 and second circuit board 5.
  • One shielding plate has a direction in which the first circuit board 4 and the second circuit board 5 are separated from each other or close to each other (the normal direction of the first circuit board 4 or the second circuit board 5), and a direction in which the first circuit board 4 and the second circuit board 5 are 2. This is a shielding plate that extends in the direction along one side of the circuit board 5.
  • the number of electronic components 8 surrounded by the shielding member 9 is not particularly limited. That is, the shielding member 9 surrounds some or all of the electronic components 8 mounted on the first circuit board 4, and also surrounds some or all of the electronic components 8 mounted on the second circuit board 5. Surround the entire circumference of the part 8.
  • the conductive members 10a and 10b are members that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9.
  • the conductive members 10a and 10b may be formed integrally with the shielding member 9 using the same material as the shielding member 9.
  • the conductive members 10a and 10b include a first conductive member 10a that connects a first end surface 9a of the shielding member 9 on the first circuit board 4 side and a mounting surface 4a of the first circuit board 4, and a second circuit of the shielding member 9. It has a second conductive member 10b that connects the second end surface 9b on the substrate 5 side and the mounting surface 5a of the second circuit board 5.
  • the first conductive member 10a is connected to a ground provided on the first circuit board 4.
  • the second conductive member 10b is connected to a ground provided on the second circuit board 5.
  • the first conductive member 10a and the second conductive member 10b are connected to the first conductive member 10a and the second conductive member 10b, respectively. It is connected to the frame ground 13 of the circuit board 4 and the frame ground 13 of the second circuit board 5.
  • the first conductive member 10a and the second conductive member 10b are connected to the signal ground 12 and the second conductive member 12 of the first circuit board 4, respectively. It is connected to the signal ground 12 of the second circuit board 5.
  • the first conductive member 10a is connected to the first end face 9a with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ . Multiple locations are placed along the The plurality of first conductive members 10a are arranged at equal distances from each other.
  • the second conductive member 10b is connected to the second end face 9b with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ . Multiple locations are placed along the The plurality of second conductive members 10b are arranged at equal distances from each other.
  • noise One type of noise composed of electromagnetic waves is noise (hereinafter referred to as noise) that is emitted outside the electronic control device 100 and attempts to irradiate electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5.
  • noise One type of noise composed of electromagnetic waves is noise (hereinafter referred to as “noise") that is radiated from electronic components 8 mounted on each of the first circuit board 4 and second circuit board 5 and tries to go to the outside of the electronic control device 100.
  • the wavelength ⁇ of the electromagnetic waves that make up the noise may be the wavelength of the electromagnetic waves that make up the irradiation noise, or the wavelength of the electromagnetic waves that make up the radiation noise.
  • CISPR25 is known as a standard related to measurement of EMI (Electromagnetic Interference) of in-vehicle equipment.
  • the electronic control device 100 which is an in-vehicle device, is implemented with noise countermeasures that comply with CISPR25.
  • the frequency range of radiated emissions is 0.15MHz to 2500MHz.
  • the frequency range of "GLONASS L1" of CISPR25 is 1591 MHz to 1616 MHz, which can be said to be a high frequency.
  • the bracket 11 fixes the electronic control device 100 to the vehicle body.
  • the bracket 11 connects the housings 1 and 2 to the frame ground of the vehicle body.
  • the bracket 11 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • Bracket 11 is connected to housings 1 and 2.
  • Bracket 11 is connected to shielding member 9 .
  • the bracket 11 may be connected to the shielding member 9 by passing through a wall portion of the housing base 1 in which the opening 3 is not formed.
  • the electronic control device 100 of the first embodiment includes the first circuit board 4 and the second circuit board 5, in which the mounting surfaces 4a and 5a of the respective electronic components 8 are arranged facing each other with an interval, and A shielding member 9 that is arranged at a distance between the circuit board 4 and the second circuit board 5 and that shields noise; and conductive members 10a and 10b that connect the first circuit board 4 and the second circuit board 5 and the shielding member 9; Equipped with.
  • the shielding member 9 is a frame that surrounds the entire circumference of the electronic component 8 mounted on each of the first circuit board 4 and the second circuit board 5, and forms a closed circuit having a width corresponding to the interval. be.
  • the shielding member 9 blocks or attenuates irradiation noise that is radiated outside the electronic control device 100 and attempts to irradiate the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. be able to.
  • the shielding member 9 can block or attenuate radiation noise that is emitted from the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5 and that attempts to go to the outside of the electronic control device 100. . Therefore, the electronic control device 100 of the first embodiment can effectively take EMI measures and EMS measures for the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. Therefore, the electronic control device 100 of the first embodiment can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. .
  • the conductive members 10a and 10b are connected to the first end surface 9a of the shielding member 9 on the first circuit board 4 side and the mounting surface 4a of the first circuit board 4. It has a conductive member 10a and a second conductive member 10b that connects the second end surface 9b of the shielding member 9 on the second circuit board 5 side and the mounting surface 5a of the second circuit board 5.
  • the first conductive member 10a is connected to the first end face 9a with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ .
  • the second conductive member 10b is connected to the second end face 9b with a distance of less than half ( ⁇ /2) of the wavelength ⁇ of the electromagnetic waves constituting the noise, or a distance of less than a quarter ( ⁇ /4) of the wavelength ⁇ . Multiple locations are placed along the
  • the electronic control device 100 of the first embodiment attempts to pass between the first circuit board 4 and the shielding member 9 without completely closing the space between the first circuit board 4 and the shielding member 9. It is possible to reliably attenuate irradiation noise or radiation noise.
  • the electronic control device 100 of the first embodiment prevents irradiation noise that attempts to pass between the second circuit board 5 and the shielding member 9 without completely closing the space between the second circuit board 5 and the shielding member 9.
  • radiation noise can be reliably attenuated. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily take noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. Can be done.
  • the first conductive member 10a is connected to the ground provided on the first circuit board 4, and the second conductive member 10b is connected to the ground provided on the second circuit board 5. connected to.
  • the electronic control device 100 of the first embodiment can release irradiation noise to each ground provided on the first circuit board 4 and the second circuit board 5.
  • the electronic control device 100 of the first embodiment reliably prevents malfunctions or failures of the electronic control device 100, such as malfunctions or failures of the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. can do. Therefore, the electronic control device 100 of the first embodiment can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. .
  • the shielding member 9 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin. Ru.
  • the electronic control device 100 of the first embodiment can form the shielding member 9 without using any special material. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily take noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. Can be done.
  • the electronic control device 100 of Embodiment 1 is mounted on a vehicle and includes casings 1 and 2 that house a first circuit board 4, a second circuit board 5, a shielding member 9, and conductive members 10a and 10b, and a casing. 1 and 2 to the frame ground of the vehicle body.
  • the shielding member 9 is connected to the bracket 11.
  • the electronic control device 100 of the first embodiment transfers static electricity charged on the first circuit board 4, the second circuit board 5, and the casings 1 and 2 to the frame ground of the vehicle via the shielding member 9 and the bracket 11. You can escape.
  • the electronic control device 100 of the first embodiment reliably prevents malfunctions or failures of the electronic control device 100, such as malfunctions or failures of the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5. can do. Therefore, the electronic control device 100 of the first embodiment can prevent static electricity while comprehensively implementing noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. Countermeasures can be taken.
  • the bracket 11 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which the surface of a non-conductive material is coated with a conductive resin.
  • the electronic control device 100 of the first embodiment can form the bracket 11 without using any special material. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily take noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. Can be done.
  • the electronic control device 100 of the first embodiment further includes a spacer 14 that maintains the distance between the first circuit board 4 and the second circuit board 5. Spacer 14 is fixed to shielding member 9.
  • the electronic control device 100 of the first embodiment prevents the first circuit board 4 and the second circuit board 5 from being misaligned and interfering with each other due to vibration, and preventing the inter-board connector 7 from coming off. be able to. Therefore, the electronic control device 100 of the first embodiment provides vibration resistance while comprehensively taking noise countermeasures to the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. can improve sex.
  • the electronic control device 100 of the first embodiment further includes casings 1 and 2 that house the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b.
  • the casings 1 and 2 are made of metal or resin.
  • the electronic control device 100 of the first embodiment can form the casings 1 and 2 without using special materials. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily take noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. Can be done.
  • FIG. 4 is an exploded perspective view of the electronic control device 100 of the second embodiment.
  • FIG. 5 is a sectional view of the electronic control device 100 shown in FIG. 4.
  • FIG. 6 is a configuration diagram of the shielding member 9, the heat sink 15, and the heat sink 17.
  • the electronic control device 100 of the second embodiment can take measures against noise in the electronic components 8 mounted on the plurality of circuit boards 4 and 5. Furthermore, the electronic control device 100 of the second embodiment can take measures against heat of the electronic components 8 mounted on the plurality of circuit boards 4 and 5.
  • the electronic control device 100 of the second embodiment includes a heat dissipation plate 15, a heat sink 17, and a heat dissipation material 18 in addition to the configuration provided in the electronic control device 100 of the first embodiment.
  • the casings 1 and 2 of the second embodiment house the first circuit board 4, the second circuit board 5, the shielding member 9, the conductive members 10a and 10b, the heat sink 15, and the heat sink material 18.
  • the heat sink 15 is arranged inside the shielding member 9 between the electronic components 8 mounted on the first circuit board 4 and the electronic components 8 mounted on the second circuit board 5.
  • the heat sink 15 is arranged along the first circuit board 4 and the second circuit board 5.
  • the heat sink 15 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber.
  • the heat sink 15 is connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2.
  • the heat sink 15 is formed integrally with the shielding member 9 and the heat sink 17.
  • the heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and a second pedestal 16b that protrudes toward the electronic component 8 mounted on the second circuit board 5. , has.
  • the area of each top surface of the first pedestal 16a and the second pedestal 16b may be greater than or equal to the area of each top surface of the electronic component 8 corresponding to the first pedestal 16a and the second pedestal 16b, respectively.
  • the first pedestal 16a and the second pedestal 16b may be provided for electronic components 8 that generate a large amount of heat and are mounted on the first circuit board 4 and the second circuit board 5, respectively. 8 may not be provided.
  • the heat sink 15 has a region on the surface facing the first circuit board 4 where the first pedestal 16a is not provided, and a region on the surface facing the second circuit board 5 where the second pedestal 16b is not provided. Each may be formed in a concave shape so as to be spaced apart from the first circuit board 4 and the second circuit board 5.
  • the heat dissipation material 18 is a member that comes into contact with the electronic component 8 and the heat dissipation plate 15.
  • the heat dissipation material 18 is composed of, for example, heat dissipation grease or a heat dissipation sheet.
  • the heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do.
  • the heat sink 17 is provided outside the casings 1 and 2.
  • the heat sink 17 is provided so as to be in contact with the outer surfaces of the casings 1 and 2.
  • the heat sink 17 is provided on the outer surface of the casings 1 and 2, away from the openings 3 of the casings 1 and 2, and closer to the electronic component 8 that generates a larger amount of heat than the electronic component 8 that generates a smaller amount of heat.
  • the heat sink 17 has a plurality of fins 17a extending along the direction of gravity (vertical direction) and spaced apart from each other in the horizontal direction (front-back direction or left-right direction).
  • a plurality of fins 17a extend along the direction of gravity and are spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2.
  • the heat sink 17 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber.
  • the shielding member 9, the heat sink 15, and the heat sink 17 are integrally formed.
  • the bracket 11 of the second embodiment is connected to a heat sink 17 provided on the outer surface of the casings 1 and 2.
  • the bracket 11 of the second embodiment connects the casings 1 and 2 to the frame ground of the vehicle via the heat sink 17.
  • the bracket 11 of the second embodiment is connected to the casings 1 and 2 via a heat sink 17.
  • the bracket 11 of the second embodiment is connected to the shielding member 9 via a heat sink 17 and a heat sink 15.
  • the shielding member 9, the heat sink 15, and the heat sink 17 are connected and fixed to the casings 1 and 2 so as to be able to withstand vibrations of the electronic control device 100 or impact when the electronic control device 100 is dropped.
  • These fixing methods may be the following methods.
  • a method may be used in which a screw mechanism or a hook mechanism (a mechanism using a claw and a hole) is provided on the outer surface of the shielding member 9 and the inner surface of the housing base 1 to connect the two.
  • a method of fixing the heat sink 17 and the outer surface of the housing base 1 by providing a screw mechanism or a hook mechanism to connect the two may be used.
  • the housing base 1 and the housing cover 2 may be fixed by providing a screw mechanism or a hook mechanism on the housing base 1 and the housing cover 2 to connect the two.
  • the electronic control device 100 of the second embodiment there is a gap between the electronic component 8 mounted on the first circuit board 4 and the electronic component 8 mounted on the second circuit board 5 inside the shielding member 9.
  • the heat sink 15 is connected to the heat sink 17 through or through the shielding member 9 and the casings 1 and 2.
  • the electronic control device 100 of the second embodiment can immediately transport the heat generated in the electronic component 8 to the heat sink 15 without passing through the first circuit board 4 and the second circuit board 5.
  • the electronic control device 100 of the second embodiment can immediately transport the heat transported to the heat sink 15 to the heat sink 17 outside the casings 1 and 2, and radiate the heat from the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can immediately radiate the heat generated in the electronic component 8 to the outside of the casings 1 and 2, so that the temperature of the electronic component 8 can be reliably reduced. Can be done.
  • the electronic control device 100 of the second embodiment performs comprehensive noise countermeasures on the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 provided in the electronic control device 100, and It is possible to reliably take measures against the heat of the electronic components 8 mounted on the circuit boards 4 and 5.
  • the heat sink 15 includes a first pedestal 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and an electronic component mounted on the second circuit board 5. It has a second pedestal 16b that protrudes toward the component 8.
  • the heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first pedestal 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second pedestal 16b. do.
  • the electronic control device 100 of the second embodiment can reduce the thermal resistance between the electronic component 8 and the heat sink 15, so that the heat generated in the electronic component 8 can be transferred to the heat sink 15 more quickly. Can be transported. Therefore, the electronic control device 100 of the second embodiment can further reliably reduce the temperature of the electronic component 8. Therefore, the electronic control device 100 of the second embodiment performs comprehensive noise countermeasures on the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 provided in the electronic control device 100, and Heat countermeasures for the electronic components 8 mounted on the circuit boards 4 and 5 can be taken more reliably.
  • the heat sink 17 has a plurality of fins 17a extending along the direction of gravity and spaced apart from each other in the horizontal direction, regardless of the installation posture of the casings 1 and 2. .
  • the electronic control device 100 of the second embodiment can further quickly dissipate the heat transferred to the heat sink 17 regardless of the installation orientation of the casings 1 and 2, so that the temperature of the electronic component 8 can be further reduced. This can be definitely reduced. Therefore, the electronic control device 100 of the second embodiment performs comprehensive noise countermeasures on the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 provided in the electronic control device 100, and Heat countermeasures for the electronic components 8 mounted on the circuit boards 4 and 5 can be taken more reliably.
  • each of the shielding member 9, the heat sink 15, and the heat sink 17 is formed using aluminum, copper, or carbon fiber.
  • the electronic control device 100 of the second embodiment can form the shielding member 9, the heat sink 15, and the heat sink 17 without using special materials. Therefore, the electronic control device 100 of the second embodiment performs comprehensive noise countermeasures on the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 provided in the electronic control device 100, and Heat countermeasures for the electronic components 8 mounted on the circuit boards 4 and 5 can be reliably and easily carried out.
  • the shielding member 9, the heat sink 15, and the heat sink 17 are integrally formed.
  • the electronic control device 100 of the second embodiment can transport the heat of the first circuit board 4 and the second circuit board 5 to the heat sink 15 via the shielding member 9. Furthermore, the electronic control device 100 of the second embodiment can reduce the thermal resistance between the shielding member 9 and the heat sink 15 and the thermal resistance between the heat sink 15 and the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can more quickly transport the heat generated in the first circuit board 4, the second circuit board 5, and the electronic component 8 to the heat sink 15, so that the electronic component 8 temperature can be further reliably reduced.
  • the electronic control device 100 of the second embodiment performs comprehensive noise countermeasures on the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 provided in the electronic control device 100, and Heat countermeasures for the electronic components 8 mounted on the circuit boards 4 and 5 can be taken more reliably.
  • the present invention is not limited to the above embodiments, and includes various modifications.
  • the above embodiments have been described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
PCT/JP2022/032830 2022-08-31 2022-08-31 電子制御装置 Ceased WO2024047809A1 (ja)

Priority Applications (3)

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JP2024543704A JPWO2024047809A1 (https=) 2022-08-31 2022-08-31
PCT/JP2022/032830 WO2024047809A1 (ja) 2022-08-31 2022-08-31 電子制御装置
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111232A (ja) * 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2007299870A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 中継用基板およびそれを用いた立体的電子回路構造体
US8842443B2 (en) * 2011-03-25 2014-09-23 Lg Electronics Inc. Printed circuit board assembly for a mobile terminal and method for fabricating the same
JP2019175949A (ja) * 2018-03-27 2019-10-10 京セラ株式会社 電子機器、撮像装置、および移動体
US20200093040A1 (en) * 2018-09-19 2020-03-19 Samsung Electronics Co., Ltd. Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
WO2020258447A1 (zh) * 2019-06-26 2020-12-30 昆山首源电子科技有限公司 拼接式多层线路板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111232A (ja) * 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2007299870A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 中継用基板およびそれを用いた立体的電子回路構造体
US8842443B2 (en) * 2011-03-25 2014-09-23 Lg Electronics Inc. Printed circuit board assembly for a mobile terminal and method for fabricating the same
JP2019175949A (ja) * 2018-03-27 2019-10-10 京セラ株式会社 電子機器、撮像装置、および移動体
US20200093040A1 (en) * 2018-09-19 2020-03-19 Samsung Electronics Co., Ltd. Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board
WO2020258447A1 (zh) * 2019-06-26 2020-12-30 昆山首源电子科技有限公司 拼接式多层线路板

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