Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
  • C09D5/24—Electrically-conducting paints
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
  • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
  • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
  • C09D123/10—Homopolymers or copolymers of propene
  • C09D123/12—Polypropene
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
  • C09D7/40—Additives
  • C09D7/60—Additives non-macromolecular
  • C09D7/61—Additives non-macromolecular inorganic
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
  • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L23/10—Homopolymers or copolymers of propene
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B9/00—Power cables
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B9/00—Power cables
  • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
  • H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers

Definitions

• the present disclosure relates to semiconducting compositions and power cables.
• crosslinked polyethylene has excellent insulation properties, it has been widely used as a resin component constituting an insulating layer in power cables and the like (for example, Patent Document 1).
• a semiconducting composition for forming a semiconducting layer in a power cable comprising: a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer; carbon black;
• the rubber material and elastomer have at least two units of ethylene, propylene, butylene, hexene, isoprene, octene and styrene;
• the viscosity at a high shear rate at a temperature of 190°C and a shear rate of 100 s -1 is 1000 Pa-s or more and 5000 Pa-s or less, and the viscosity at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 is 100,000 Pa-s or more and 1,000,000 Pa-s.
• the following is A semiconducting composition is provided.
• FIG. 1 is a schematic cross-sectional view orthogonal to the axial direction of a DC power cable according to an embodiment of the present disclosure.
• propylene-based resins resins containing propylene
• propylene-based resins resins containing propylene
• it can satisfy the insulation properties required for power cables. That is, it is possible to achieve both insulation properties and recyclability.
• a propylene resin handling, processability, and ease of manufacture can be improved.
• the outer diameter of the power cable is more likely to be uneven in the cross-section and longitudinal direction of the power cable than when cross-linked using polyethylene. was confirmed. In particular, it has been confirmed that when the insulating layer is formed thick relative to the conductor and the outer diameter of the power cable is increased, the outer diameter tends to become non-uniform.
• An object of the present disclosure is to provide a technique for improving the uniformity of the outer diameter of a power cable when a propylene-based resin is used as a resin component.
• propylene-based resin when used as a covering material for power cables, it is not crosslinked, so the outer diameter is more likely to fluctuate compared to crosslinked polyethylene.
• a coating material for forming an inner semiconducting layer, a coating material for forming an insulating layer, and a coating material for forming an outer semiconducting layer are placed on the outer periphery of the conductor. Extrude them simultaneously so that they are layered.
• these coating materials are crosslinked, for example, a cable is introduced into a crosslinked pipe and heated in a high temperature environment. After crosslinking, the cable is introduced, for example into a cooling bath, to cool the covering material, such as the inner semiconducting layer, the insulating layer and the outer semiconducting layer.
• the crosslinking can suppress sag due to flow of the coating material and the accompanying variation in the outer diameter of the power cable.
• the coating material when a propylene-based resin is used as the coating material, crosslinking treatment is not performed, so the coating material is cooled after extrusion. At this time, the laminated coating material is gradually cooled from the surface side to the inside. Therefore, while the shape of the surface side of the laminated coating material is fixed by cooling, a state may occur in which the inside can be melted and flowed at high temperature. Moreover, since no crosslinking treatment is performed, the viscosity of the coating material cannot be increased. As a result, the coating material may sag under its own weight until the interior of the coating material cools and its shape is fixed.
• the thickness of the coating layer may become non-uniform in the outer circumferential direction in the cross section of the power cable, and may also become non-uniform in the longitudinal direction of the power cable.
• the coating material may drip downwards in the cross section of the power cable, and if it is conveyed vertically with a vertical extruder, the power cable It may droop downwards in the longitudinal direction. If the thickness of the insulating coating becomes non-uniform in the outer circumferential direction or longitudinal direction of the cross section, there will be places where the insulation is locally low, and the desired insulation may not be achieved.
• the thicker the extrusion the more easily the coating material sag occurs, and the greater the thickness of the insulating layer, and the greater the ratio of the thickness of the insulating layer to the outer diameter of the conductor, the more it occurs.
• the present inventors investigated a method of suppressing the sagging of the insulating layer, which has a particularly large effect on outer diameter fluctuations, among the coating layers including the inner semiconducting layer, the insulating layer, and the outer semiconducting layer. Ta. Then, we focused on the viscosity of the semiconductive composition that forms the outer semiconductive layer. This is because by setting the viscosity of the semiconductive composition to be high, the shape can be maintained by suppressing sagging due to flow of the resin composition forming the insulating layer disposed inside the composition. On the other hand, semiconductive compositions are also required to have extrudability, and are required to have a viscosity that allows them to be extruded stably to a certain thickness.
• the viscosity of resin varies greatly depending on the shear rate, and it tends to have a low viscosity at high shear rates and a high viscosity at low shear rates.
• semiconductive compositions tend to have high shear rates and low viscosity during the melt-kneading and extrusion stages.
• the shear rate is low and the viscosity tends to be high.
• the viscosity at high and low shear rates tends to increase overall.
• the present inventors investigated the viscosity of the semiconductive composition at high shear rate and low shear rate, and found that by adjusting each viscosity within a predetermined range, the extrudability of the semiconductive composition was improved. It has been found that it is possible to simultaneously suppress sagging during cooling and fixing the shape. It has been found that such a semiconductive composition can improve the uniformity of the outer diameter of a power cable.
• the semiconductive composition includes: A semiconducting composition for forming a semiconducting layer in a power cable, the composition comprising: a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer; carbon black; The rubber material and elastomer have at least two units of ethylene, propylene, butylene, hexene, isoprene, octene and styrene; The viscosity at a high shear rate at a temperature of 190°C and a shear rate of 100 s -1 is 1000 Pa-s or more and 5000 Pa-s or less, and the viscosity at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 is 100,000 Pa-s or more and 1,000,000 Pa-s. It is as follows. According to this configuration, the uniformity of the outer diameter of the power cable can be improved.
• the power cable includes: a conductor; an insulating layer coated on the outer periphery of the conductor and formed from a resin composition; an outer semiconductive layer coated on the outer periphery of the insulating layer and formed from a semiconductive composition;
• the semiconductive composition is a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer; carbon black;
• the rubber material and elastomer have at least two units of ethylene, propylene, butylene, hexene, isoprene, octene and styrene;
• the viscosity at a high shear rate at a temperature of 190°C and a shear rate of 100 s -1 is 1000 Pa-s or more and 5000 Pa-s or less, and the viscosity at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 is 100,000 Pa-s or more and
• the power cable described in [2] above is The content of the carbon black is 10 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the resin component. According to this configuration, the uniformity of the outer diameter of the power cable can be further improved, and the electric field can be made more uniform.
• the power cable described in [2] or [3] above is The heat of fusion of the resin component is 55 J/g or more and 90 J/g or less. According to this configuration, the uniformity of the outer diameter can be improved more reliably.
• the power cable described in [2] or [3] above The melting point of the resin component is 140°C or more and 170°C or less. According to this configuration, the uniformity of the outer diameter can be improved more reliably.
• the power cable described in [2] or [3] above is In the cross section at two points spaced apart in the longitudinal direction, the ratio of the major axis at one point to the minor axis at the other point is 1.3 or less. According to this configuration, the uniformity of the outer diameter in the longitudinal direction of the power cable can be improved.
• the power cable described in [2] or [3] above The thickness of the outer semiconductive layer is 0.5 mm or more, and the ratio of the outer diameter of the power cable to the outer diameter of the conductor is 4 or less. According to this configuration, even if the insulating layer is formed relatively thick with respect to the outer diameter of the conductor and the outer diameter of the power cable is increased, the uniformity of the outer diameter can be maintained.
• the semi-conductive composition of this embodiment can be used as a material for forming a semi-conductive layer of a power cable. It may be used as a semiconducting layer, an outer semiconducting layer, or an inner semiconducting layer.
• the semiconductive composition includes a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer, and carbon black, and by mixing these components, the viscosity at high shear rate and low shear rate falls within a predetermined range. It has been adjusted to be. Specifically, the viscosity of the semiconductive composition is such that the viscosity at a high shear rate at a temperature of 190° C.
• a shear rate of 100 s ⁇ 1 is 1000 Pa ⁇ s or more and 5000 Pa ⁇ s or less at a temperature of 190° C. and a shear rate of 1 s ⁇ 1 .
• the viscosity at low shear rate is 100,000 Pa ⁇ s or more and 1,000,000 Pa ⁇ s or less.
• Propylene resin is a base polymer for semiconductive compositions.
• propylene-based resins include propylene homopolymers (hereinafter also referred to as homo-PP) and propylene random polymers (hereinafter also referred to as random PP).
• homo-PP contains propylene units
• random PP has propylene units and ethylene units. From the viewpoint of obtaining higher flexibility in the semiconductive layer, the propylene resin may be random PP. Random PP contains ethylene units and has a lower amount of crystals than homo-PP, so it is less likely to produce coarse crystals during cooling and can further improve the flexibility of the semiconducting layer.
• the content of ethylene units in the random PP may be, for example, 0.5% by mass or more and 15% by mass or less.
• the content of ethylene units in the random PP may be, for example, 0.5% by mass or more and 15% by mass or less.
• stereoregularity of the propylene resin examples include isotactic, syndiotactic, and atactic.
• the stereoregularity is not particularly limited, but may be isotactic. Isotactic stereoregularity makes it possible to suppress a decrease in melting point in the semiconductive composition. As a result, it is possible to stably realize non-crosslinked or slightly crosslinked use.
• the viscosity of the propylene resin at high shear rate and low shear rate is not particularly limited.
• the viscosity at high shear rate may be 100 Pa ⁇ s or more and 6000 Pa ⁇ s or less.
• the viscosity at low shear rate may be from 500 Pa ⁇ s to 50,000 Pa ⁇ s or less. Having such a viscosity makes it easy to adjust the viscosity to a predetermined value in the semiconductive composition.
• By setting the viscosity of the propylene resin serving as the base polymer within the above range when mixed with an elastomer etc., it becomes possible to reliably adjust the viscosity of the semiconductive composition at each shear rate within the above range. .
• propylene resin one type having a viscosity within a predetermined range at high shear rate or low shear rate may be used alone, or two or more types having different viscosities may be used in combination. From the viewpoint of adjusting the viscosity of the resin composition within a predetermined range, two or more types may be used in combination.
• resin components such as propylene resins have different viscosity curves depending on their physical properties such as melting point, heat of fusion, and molecular weight distribution.
• the physical property values of the propylene resin may be set as follows.
• the melting point of the propylene resin is not particularly limited, but may be 160°C or higher and 175°C or lower if it is a propylene homopolymer (homo PP), or 140°C or higher and 150°C if it is a propylene random polymer (random PP). It may be the following. According to such a propylene resin, the viscosity of the semiconductive composition can be easily adjusted to a predetermined range. Moreover, by increasing the melting point of the semiconducting composition, it is possible to improve the heat resistance temperature of the semiconducting layer and the like. Thereby, even if the semiconductive layer is non-crosslinked, high performance can be stably maintained in a high temperature environment.
• the heat of fusion of the propylene resin is not particularly limited, but it may be 100 J/g or more and 120 J/g or less in the case of homo-PP, or 90 J/g or more and 105 J/g or less in the case of random PP. .
• the viscosity of the semiconductive composition can be easily adjusted to a predetermined range, and the heat resistance of the semiconductive layer can be improved to stably maintain various properties even in a high temperature environment. can.
• the melting point and the heat of fusion are measured as follows.
• DSC differential scanning calorimetry
• the temperature is raised from room temperature (normal temperature, for example 27°C) to 220°C at a rate of 10°C/min.
• a DSC curve can be obtained by plotting the amount of heat absorbed per unit time (heat flow) against the temperature.
• the temperature at which the amount of heat absorbed per unit time in the sample reaches its maximum (peak) is defined as the "melting point (melting peak temperature)".
• the value (J /g) is the "heat of fusion”. Note that the degree of crystallinity (%) of the sample can be determined based on the heat of fusion of the sample and the theoretical value of the heat of fusion of a perfectly crystalline body.
• Propylene resin has a predetermined molecular weight distribution, and the broader the molecular weight distribution, that is, the larger the ratio of weight average molecular weight (Mw) to number average molecular weight (Mn) in the molecular weight distribution, the higher the shear rate.
• Mw/Mn may be 3.0 or more and 8.0 or less, or 3.5 or more and 7.0 or less. It may be.
• the number average molecular weight Mn may be, for example, 60,000 or more and 150,000 or less.
• the weight average molecular weight Mw may be, for example, 210,000 or more and 1,000,000 or less.
• the rubber material or elastomer controls the crystal growth of the propylene resin in the semiconductive composition and imparts flexibility to the semiconductive layer. Furthermore, when rubber materials and elastomers are mixed with propylene resin, there is a risk that the viscosity of the semiconducting composition at each shear rate may vary; A certain flexibility can be imparted to the layer.
• the rubber material or elastomer of this embodiment contains at least two of ethylene, propylene, butene, hexene, isoprene, octene, and styrene.
• the viscosity of the rubber material or elastomer at high and low shear rates is not particularly limited.
• the viscosity at high shear rate may be 300 Pa ⁇ s or more and 7000 Pa ⁇ s or less. Further, the viscosity at low shear rate may be 4000 Pa ⁇ s or more and 80000 Pa ⁇ s or less.
• the viscosity at high shear rate may be 500 Pa ⁇ s or more and 5000 Pa ⁇ s or less, and the viscosity at low shear rate may be 10000 Pa ⁇ s or more and 70000 Pa ⁇ s or less.
• the viscosity at high shear rate may be 1000 Pa ⁇ s or more and 6000 Pa ⁇ s or less, and the viscosity at low shear rate may be 5000 Pa ⁇ s or more and 50000 Pa ⁇ s or less.
• the viscosity of the semiconductive composition can be easily adjusted to a desired range when mixed with the propylene resin.
• the melting point of the rubber material or elastomer is not particularly limited. Rubber materials generally do not have a melting point because no endothermic peak is detected in DSC measurements.
• the elastomer may not have a melting point, or even if it does have a melting point, the melting point may be 100°C or less.
• the heat of fusion of the rubber material or elastomer is not particularly limited.
• the heat of fusion of the rubber material is nil because the melting point cannot be measured.
• the heat of fusion of the elastomer may be 50 J/g or less, or 30 J/g or less.
• the rubber material a copolymer obtained by copolymerizing at least any two of ethylene, propylene, butene, hexene, and octene may be used.
• the rubber material may be a copolymer containing propylene from the viewpoint of compatibility with the propylene resin.
• the copolymer containing propylene for example, ethylene propylene rubber (EPR) can be used.
• the ethylene content of EPR may be, for example, 20% by mass or more, 40% by mass or more, or 55% by mass or more. If the ethylene content is less than 20% by mass, crystallization of the propylene resin may not be sufficiently controlled. On the other hand, by setting the ethylene content to 20% by mass or more, crystallization of the propylene resin due to EPR can be sufficiently controlled while obtaining the softening effect due to EPR. Furthermore, by setting the ethylene content to 40% by mass or more, or 55% by mass or more, crystallization can be controlled more stably. Note that the density of VLDPE is, for example, 0.855 g/cm 3 or more and 0.890 g/cm 3 or less.
• the rubber material may be, for example, a copolymer that does not contain propylene.
• a copolymer not containing propylene for example, very low density polyethylene (VLDPE) can be used from the viewpoint of easy availability.
• VLDPE very low density polyethylene
• examples of VLDPE include PE composed of ethylene and 1-butene, PE composed of ethylene and 1-octene, and the like. According to the copolymer that does not contain propylene, crystallization of the propylene resin can be stably controlled.
• a styrenic thermoplastic elastomer containing styrene as a hard segment and at least one of ethylene, propylene, butene, isoprene, etc. as a soft segment can be used.
• styrene thermoplastic elastomers can be dispersed in semiconductive compositions to control the crystal growth of propylene resin and impart flexibility to the semiconductive layer, or to adjust the viscosity of the semiconductive composition. It is a component that contributes to adjustment.
• the styrene-based thermoplastic elastomer suppresses the occurrence of mechanical stress cracks in the semiconductive layer, thereby contributing to improving the water tree resistance of the semiconductive layer.
• styrenic thermoplastic elastomer examples include styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene copolymer (SIS), hydrogenated styrene-isoprene-styrene copolymer, Examples include hydrogenated styrene butadiene rubber, hydrogenated styrene isoprene rubber, and styrene ethylene butylene olefin crystal block copolymer. Two or more of these may be used in combination.
• hydrolysis here means adding hydrogen to a double bond.
• hydrogenated styrene-butadiene-styrene block copolymer means a polymer in which hydrogen is added to the double bonds of a styrene-butadiene-styrene block copolymer. Note that no hydrogen is added to the double bond of the aromatic ring of styrene.
• Hydrodrogenated styrene butadiene styrene block copolymer can be translated as styrene ethylene butylene styrene block copolymer (SEBS).
• the styrenic thermoplastic elastomer may be one that does not contain a double bond in its chemical structure.
• the resin component may be thermally degraded during molding of the semiconductive composition, and the properties of the resulting semiconductive layer may be deteriorated.
• materials that do not contain double bonds have high resistance to thermal deterioration, and therefore can maintain higher properties of the semiconducting layer.
• the styrene content in the styrenic thermoplastic elastomer is not particularly limited, but from the viewpoint of controlling crystal growth of the propylene resin and softening the semiconductive layer, it may be 5% by mass or more and 35% by mass or less.
• Carbon Black Carbon black imparts electrical conductivity to the resin component by being added to and mixed with the resin component.
• the carbon black for example, furnace carbon black or acetylene carbon black may be used.
• the furnace carbon black refers to one produced by burning oil or the like.
• Acetylene carbon black is produced by thermally decomposing acetylene as a raw material.
• the average particle diameter of carbon black is not particularly limited, and may be appropriately set within a range that allows it to be appropriately dispersed in the semiconductive layer and to obtain a predetermined conductivity.
• the average particle diameter may be 35 nm or more and 100 nm or less.
• the average particle diameter is here.
• the particle size at an integrated value of 50% in the particle size distribution determined by particle size measurement using a laser diffraction/scattering method is shown.
• the semiconductive composition may also contain, for example, an antioxidant, a copper inhibitor, a lubricant, and a colorant.
• the semiconductive composition may have a small content of an additive that functions as a nucleating agent that generates propylene crystals, or may be substantially free of such an additive.
• the content of the additive that functions as a nucleating agent is, for example, 1 part by mass when the total of the resin component containing the propylene resin and at least one of a rubber material and an elastomer is 100 parts by mass. It may be less than 0 parts by mass.
• the semiconductive composition may contain an inorganic filler, but from the viewpoint of adjusting the viscosity at high shear rate and low shear rate to a predetermined range, the amount added may be small, or no filler may be added. .
• the semiconductive composition is formed by mixing a propylene resin, at least one of a rubber material and an elastomer, and carbon black, and by mixing these components,
• the semiconductive composition has a viscosity of 1000 Pa-s or more and 5000 Pa-s or less at a high shear rate at a temperature of 190°C and a shear rate of 100 s-1, and a viscosity of 100,000 Pa at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 .
• - s or more and 1,000,000 Pa ⁇ s or less are examples of the viscosity of 1000 Pa-s or more and 5000 Pa-s or less at a high shear rate at a temperature of 190°C and a shear rate of 100 s-1, and a viscosity of 100,000 Pa at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 . - s or more and 1,000,000 Pa
• Propylene resins, rubber materials, and elastomers each have their own unique viscosity curves.
• the viscosity curve is a curve in which the horizontal axis represents shear rate and the vertical axis represents viscosity, and the viscosity decreases as the shear rate increases.
• This viscosity curve has a unique shape depending on the molecular weight, molecular weight distribution, melting point, heat of fusion, etc. of the resin.
• the viscosity curves will differ not only when the types of propylene resins, rubber materials, and elastomers are different, but also when the same propylene resin has different physical properties such as molecular weight distribution and melting point.
• the viscosity at each shear rate is adjusted by mixing propylene resin, rubber material, and elastomer with different viscosity curves. Moreover, by adding carbon black to the resin component, the viscosity curve of the semiconductive composition is controlled and the viscosity at each shear rate is adjusted.
• the semiconductive composition can be extruded with a uniform thickness while the flow of the coating material for forming the insulating layer can be controlled. can be suppressed to maintain its shape.
• the viscosity at high shear rates may be between 1000 Pa ⁇ s and 3000 Pa ⁇ s.
• the viscosity at a low shear rate is less than 100,000 Pa ⁇ s, the flow (sagging) of the coating material for forming the insulating layer cannot be suppressed during the production of a power cable, and outer diameter fluctuations are likely to occur.
• the viscosity at a low shear rate exceeds 1,000,000 Pa ⁇ s, the viscosity at a high shear rate also increases, and as mentioned above, the extrusion amount of the semiconductive composition becomes unstable, and the semiconductive layer It may not be possible to form a uniform thickness.
• the viscosity at a low shear rate within the range of 100,000 Pa ⁇ s to 1,000,000 Pa ⁇ s, it is possible to suppress sagging of the extruded semiconductive composition and improve the uniformity of the outer diameter of the power cable. I can do it.
• the viscosity at low shear rate may be between 100,000 Pa ⁇ s and 300,000 Pa ⁇ s.
• the ratio of viscosity at high shear rate to viscosity at low shear rate is not particularly limited, but when the viscosity at high shear rate is A and the viscosity at low shear rate is B, B/A is 30 or more. It may be 1000 or less. The larger this ratio is, the more the molten semiconductive composition can be extruded at a lower pressure, and the more the material for forming the insulating layer can be prevented from sagging during the production of a power cable.
• (1-6) Melting point and heat of fusion of semiconductive composition The melting point and heat of fusion of the semiconductive composition vary depending on the amount of propylene resin, rubber material, and elastomer mixed as resin components. In other words, the melting point and the like are indicators of the ratio (composition) of each component. Note that the melting point and heat of fusion of the semiconductive composition are substantially the same as those of the resin component excluding carbon black.
• propylene resin has a relatively high melting point
• rubber materials and elastomers either do not have a melting point, or even if they do have a melting point, their melting point is low.
• propylene resin has high crystallinity and a high heat of fusion
• rubber materials and elastomers have low crystallinity or are amorphous and have a low heat of fusion. Therefore, the melting point and heat of fusion of the resin components in the semiconductive composition tend to be lower than the melting point and heat of fusion that the propylene resin inherently has.
• the melting point and heat of fusion of the resin components are not particularly limited, but from the viewpoint of mixing each component in an appropriate ratio and keeping the viscosity at a high shear rate and a low shear rate within a predetermined range, they should be in the following ranges. It's okay.
• the melting point of the resin component may be 158° C. or higher and 168° C. or lower if homo-PP is included as the propylene resin. Further, if random PP is included as the propylene resin, the temperature may be 140° C. or higher and 150° C. or lower.
• the heat of fusion of the resin component may be 75 J/g or more and 110 J/g or less if homo-PP is included as the propylene resin. Further, if random PP is included as the propylene resin, the amount may be 60 J/g or more and 100 J/g or less.
• the viscosity at high and low shear rates can be adjusted to a predetermined range. Can be easily adjusted.
• each component in the semiconductive composition is determined by selecting the type of propylene resin, rubber material, and elastomer so that the viscosity at high shear rate and low shear rate is within a predetermined range. It is advisable to adjust it accordingly. From the viewpoint of reliably adjusting the viscosity within a predetermined range, each component may be mixed so that the melting point and heat of fusion of the resin component fall within the above-mentioned ranges. Specifically, in the resin composition, the addition ratio of the propylene resin may be 50% by mass or more. In addition, the propylene resin may be a combination of two or more components having different viscosities, melting points, and heats of fusion. Regarding rubber materials and elastomers, two or more components having different physical property values may be used in combination.
• the content of carbon black in the semiconductive composition is not particularly limited.
• carbon black When carbon black is mixed into the resin component, it becomes a factor that increases the viscosity at each shear rate. Therefore, it is preferable to change the viscosity as appropriate so that the viscosity at each shear rate falls within a predetermined range while satisfying the conductivity required of the semiconductive layer.
• the content of carbon black may be 10 parts by mass or more and 100 parts by mass or less, or 10 parts by mass or more and 80 parts by mass or less, based on 100 parts by mass of the resin component.
• FIG. 1 is a cross-sectional view orthogonal to the axial direction of the power cable according to the present embodiment.
• the power cable 10 of this embodiment is configured as a so-called solid insulated power cable. Moreover, the power cable 10 of this embodiment is configured to be installed, for example, on land (inside a conduit), underwater, or on the bottom of the water. Note that the power cable 10 is used for, for example, alternating current.
• the power cable 10 includes, for example, a conductor 110, an inner semiconducting layer 120, an insulating layer 130, an outer semiconducting layer 140, a shielding layer 150, and a sheath 160.
• the conductor 110 is configured by twisting together a plurality of conductor core wires (conductive core wires) containing, for example, pure copper, copper alloy, aluminum, or aluminum alloy.
• Internal semiconducting layer 120 is provided to cover the outer periphery of conductor 110 . Further, the internal semiconducting layer 120 has semiconductivity and is configured to suppress electric field concentration on the surface side of the conductor 110.
• Internal semiconductive layer 120 is formed from a semiconductive composition containing a resin component and carbon black. Examples of the resin component include ethylene copolymers such as ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-butyl acrylate copolymer, and ethylene-vinyl acetate copolymer; At least one of elastomer, propylene resin, etc. can be used. Further, a semiconductive composition whose viscosity at each of the above-mentioned shear rates is adjusted to a predetermined range may be used.
• the insulating layer 130 is provided to cover the outer periphery of the internal semiconducting layer 120.
• propylene resin is preferably used from the viewpoint of non-crosslinking.
• a resin component containing the above-mentioned propylene resin and at least one of a rubber material and an elastomer may be used.
• the insulating layer 130 is formed, for example, by extruding a resin composition containing a resin component.
• the external semiconducting layer 140 is provided to cover the outer periphery of the insulating layer 130. Further, the external semiconducting layer 140 has semiconductivity and is configured to suppress electric field concentration between the insulating layer 130 and the shielding layer 150.
• the outer semiconductive layer 140 is formed from a semiconductive composition whose viscosity at each shear rate described above is adjusted to be within a predetermined range.
• the shielding layer 150 is provided to cover the outer periphery of the outer semiconducting layer 140.
• the shielding layer 150 is configured, for example, by winding a copper tape, or as a wire shield formed by winding a plurality of annealed copper wires or the like. Note that a tape made of rubberized cloth or the like may be wound around the inside or outside of the shielding layer 150.
• Sheath 160 is provided to cover the outer periphery of the shielding layer 150.
• Sheath 160 is made of polyvinyl chloride or polyethylene, for example.
• the power cable 10 of this embodiment may have a metal water shielding layer such as a so-called aluminum sheathing or a steel wire armoring on the outside of the shielding layer 150. good.
• the power cable 10 of the present embodiment has the above-mentioned water tree suppressing effect, and therefore has a metal water shielding layer such as a so-called aluminum sheathing on the outside of the shielding layer 150. It doesn't have to be. That is, the power cable 10 of this embodiment may be configured with a non-complete water-shielding structure.
• the specific dimensions of the power cable 10 are not particularly limited, for example, the diameter of the conductor 110 is 5 mm or more and 60 mm or less, and the thickness of the internal semiconductive layer 120 is 0.5 mm or more and 3 mm or less.
• the thickness of the insulating layer 130 is 3 mm or more and 35 mm or less
• the thickness of the outer semiconducting layer 140 is 0.5 mm or more and 3 mm or less
• the thickness of the shielding layer 150 is 0.1 mm or more and 5 mm or less.
• the thickness of the sheath 160 is 1 mm or more.
• the outer diameter of the power cable 10 is, for example, 15 mm or more and 170 mm or less.
• the thickness of the outer semiconductive layer 140 may be 0.5 mm or more, or 1 mm or more from the viewpoint of further suppressing outer diameter fluctuations.
• the AC voltage applied to the power cable 10 of this embodiment is, for example, 20 kV or more.
• the outer semiconductive layer 140 is formed using a semiconductive composition whose viscosity at each shear rate is adjusted to a predetermined range, thereby suppressing sagging of the insulating layer 130 due to flow. and easy to maintain its shape. Therefore, even if the insulating layer 130 is formed thicker than the outer diameter of the conductor 110 and the outer diameter of the power cable 10 is increased, variation in the outer diameter can be suppressed.
• the thickness of the insulating layer 130 may be 13 mm or less.
• the ratio of the outer diameter of the power cable 10 to the outer diameter of the conductor 110 may be 4 or less.
• the outer diameter of the conductor 110 may be in a range such that the cross-sectional area of the conductor 110 is 8 mm 2 or more and 900 mm 2 or less.
• a small variation in the outer diameter in a cross section means that in a cross section perpendicular to the longitudinal direction of the power cable 10, the difference between the maximum value and the minimum value of the outer diameter in the outer circumferential direction is small.
• the ratio of the major axis to the minor axis (A 1 /B 1 ) is 1. It may be .3 or less, or it may be 1.25 or less. Note that the lower limit of the ratio is 1.
• a small change in the outer diameter in the longitudinal direction means that the difference in outer diameter between the two points in the cross section of the power cable 10 spaced apart in the longitudinal direction is small.
• the short axis at one point is A 2 and the long axis at the other point is B 2 (A 2 ⁇ B 2 ).
• the ratio (B 2 /A 2 ) of the major axis B 2 at the other point to the minor axis A 2 at one point may be 1.3 or less, or 1.25 or less. Note that the lower limit of the ratio is 1.
• step will be abbreviated as "S”.
• the semiconductive composition for forming the outer semiconductive layer 140 may be prepared as follows.
• a propylene resin, at least one of a rubber material and an elastomer, carbon black, and other additives (antioxidants, etc.) as necessary are mixed (kneaded) in a mixer to form a mixed material.
• a mixer to form a mixed material.
• propylene resin, rubber material, elastomer, and carbon black are mixed in a predetermined ratio so that the semiconductive composition has a viscosity within a predetermined range at high shear rate and low shear rate.
• the propylene resin, rubber material, and elastomer may be mixed so that the melting point and heat of fusion of the resin components are within a predetermined range, and the content of carbon black may be adjusted as appropriate within a range that provides the desired semiconductivity.
• examples of the mixer include an open roll, a Banbury mixer, a pressure kneader, a single-shaft mixer, a multi-shaft mixer, and the like.
• the mixed material is granulated using an extruder.
• a pellet-shaped semiconducting composition that will form the outer semiconducting layer 140 is formed. Note that the steps from mixing to granulation may be performed all at once using a twin-screw extruder with a high kneading effect.
• a conventionally known semiconductive composition can be used for forming the internal semiconductive layer 120.
• a material containing a propylene resin and carbon black that can be used in a non-crosslinked state can be used.
• a semiconductive composition for forming the external semiconductive layer 140 described above may be used.
• the resin composition for forming the insulating layer 130 is not particularly limited, and conventionally known resin compositions can be used.
• one containing a propylene resin can be used.
• a material containing the above-mentioned propylene resin and at least one of a rubber material and an elastomer can be used.
• each coating material is extruded using, for example, a three-layer co-extruder so as to cover the outer periphery of the conductor 110 to a predetermined thickness.
• a semiconductive composition for forming the internal semiconductive layer is charged into extruder A for forming the internal semiconductive layer 120, for example.
• a pellet-shaped resin composition is charged into the extruder B that forms the insulating layer 130 as a coating material for forming the insulating layer.
• the set temperature of extruder B is set to a temperature higher than the desired melting point by a temperature of 10° C. or more and 50° C. or less. The set temperature may be adjusted as appropriate based on the linear speed and extrusion pressure.
• the above-mentioned semiconductive composition is charged into the extruder C that forms the outer semiconductive layer 140.
• the respective extrudates from extruders A to C are led to a common head, and the inner semiconducting layer 120, the insulating layer 130, and the outer semiconducting layer 140 are simultaneously applied to the outer periphery of the conductor 110 from the inside to the outside.
• the semiconductive composition for forming the external semiconductive layer 140 has a viscosity adjusted to 1000 Pa ⁇ s or more and 5000 Pa ⁇ s or less at a high shear rate, so that the semiconductive composition has a uniform thickness and is stable. It can be pushed out. This forms an extruded material that will become the cable core.
• the extruded material is cooled, for example, with water. This solidifies each coating material and fixes its shape.
• the viscosity of the semiconductive composition for forming the external semiconductive layer at low shear rate is adjusted to 100,000 Pa ⁇ s or more and 1,000,000 Pa ⁇ s or less, so that the insulating layer 130 located inside the semiconductive composition Flow (sagging) of the coating material to be formed can be suppressed. Therefore, each covering material can be fixed in its extruded shape. As a result, the thickness of the insulating coating formed from the inner semiconducting layer 120, the insulating layer 130, and the outer semiconducting layer 140 can be formed uniformly in the outer direction and longitudinal direction of the cross section of the extruded material. .
• a cable core composed of the conductor 110, the inner semiconducting layer 120, the insulating layer 130, and the outer semiconducting layer 140 is formed.
• a shielding layer 150 is formed on the outside of the outer semiconducting layer 140, for example by wrapping copper tape.
• a sheath 160 is formed around the outer periphery of the shielding layer 150 by charging vinyl chloride into an extruder and extruding it.
• the power cable 10 as a solid insulated power cable is manufactured.
• the semiconductive composition of this embodiment has a viscosity of 1000 Pa ⁇ s to 5000 Pa ⁇ s at a high shear rate. Thereby, when melting and extruding the semiconductive composition, it is possible to stably extrude the composition with a uniform thickness while maintaining the extruded shape. Further, the viscosity at low shear rate is 100,000 Pa ⁇ s to 1,000,000 Pa ⁇ s. Thereby, when the semiconductive composition is extruded onto the outer periphery of the coating material forming the insulating layer 130, the semiconductive composition can press down the coating material of the insulating layer 130.
• the semiconductive composition of the present embodiment has a moderate viscosity when melted and extruded, so that desired extrudability can be obtained, while it has a relatively high viscosity after extrusion. It is difficult to flow and can maintain its extruded shape.
• the cross section of the power cable 10 is uniform in both the outer circumferential direction and the longitudinal direction. It can be the outer diameter. In other words, variations in the outer diameter of the power cable 10 in the cross section and longitudinal direction can be reduced. Specifically, in the cross section of the power cable 10, the ratio of the maximum value (long diameter) of the outer diameter to the minimum value (short diameter) of the outer diameter in the outer circumferential direction can be set to 1.3 or less. Moreover, in the cross section of two points spaced apart in the longitudinal direction of the power cable 10, the ratio of the short axis at one point to the long axis at the other point can be 1.3 or less.
• the semiconductive composition can suppress excessive crystal growth of the propylene resin during the cooling process from a molten state. Thereby, the desired conductivity and flexibility can be obtained in a well-balanced manner at a high level in the outer semiconducting layer 140.
• the content of carbon black may be 10 parts by mass or more and 100 parts by mass or less based on 100 parts by mass of the resin component. With such a content, a predetermined semiconductivity can be obtained while reliably adjusting the viscosity of the semiconductive composition at each shear rate within a predetermined range. As a result, variations in the outer diameter of the power cable 10 can be suppressed more reliably, and the electric field in the power cable 10 can be made more uniform to suppress partial discharge.
• the melting point of the resin component may be 140° C. to 150° C. if it contains random PP, or 158° C. to 168° C. if it contains homo PP. Further, the heat of fusion of the resin component may be 60 J/g to 100 J/g if random PP is included, and 75 J/g to 110 J/g if homo PP is included.
• the addition ratio of the propylene resin, rubber material, and elastomer can be set within an appropriate range, and a high shear rate can be achieved. And the viscosity at low shear rates can be reliably adjusted within the above range. Moreover, higher flexibility can be obtained in the outer semiconducting layer 140.
• the viscosity at low shear rate is 100,000 Pa ⁇ s or more, which is relatively large.
• deformation of the insulating layer 130 can be suppressed.
• the conductor 110 is formed so that the ratio of the outer diameter of the power cable 10 to the outer diameter of the conductor 110 is 4 or less. Even when the insulating layer 130 is formed thicker than the outer diameter, fluctuations in the outer diameter can be suppressed to a small level.
• the outer diameter variation in the longitudinal direction which is particularly likely to occur when a vertical extruder is used, and when a horizontal extruder is used, It is possible to suppress variations in the outer diameter in the outer circumferential direction of the cross section, which are particularly likely to occur.
• the shape of the insulating layer 130 can be maintained even if the viscosity of the coating material forming the insulating layer 130 is low. can. Specifically, even if the viscosity of the coating material forming the insulating layer 130 at a low shear rate is in the range of 3000 Pa ⁇ s or more, the shape of the insulating layer 130 can be maintained.
• the resin composition molded body serving as the insulating layer is mechanically mixed and extruded.
• the resin composition molded body is not polymerized and extruded. There may be.
• the power cable 10 may have a simple water-blocking layer because it has the above-mentioned remarkable water tree suppression effect.
• the simple water-blocking layer is made of, for example, a metal laminate tape.
• a metal laminate tape has a metal layer made of, for example, aluminum or copper, and an adhesive layer provided on one or both sides of the metal layer.
• the metal laminate tape is, for example, wrapped vertically so as to surround the outer periphery of the cable core (the outer periphery of the outer semiconductive layer).
• the water-blocking layer may be provided outside the shielding layer, or may also serve as the shielding layer. With such a configuration, the cost of the power cable 10 can be reduced.
• the power cable 10 may be configured as a so-called overhead wire (overhead insulated wire).
• the viscosity at high shear rate is 100 Pa-s or more and 6000 Pa-s or less
• the viscosity at low shear rate is 500 Pa-s or more and 50,000 Pa-s or less
• the melting point is 140°C or more and 145°C or less
• the heat of fusion is 90 J/g or more and 105 J/g or less
• the ratio Mw/Mn of weight average molecular weight (Mw) and number average molecular weight (Mn) is 3.0 or more and 8.0 or less
• Mn is 60,000 to 150,000
• Mw is 210,000 to 1,000,000.
• a plurality of types of propylene random polymers different from each other within the range were prepared.
• the viscosity at high shear rate is 500 Pa-s or more and 5000 Pa-s or less
• the viscosity at low shear rate is 10,000 Pa-s or more and 70,000 Pa-s or less
• the melting point and heat of fusion are none, and there are several different types.
• the elastomer has a viscosity of 1000 Pa-s or more and 6000 Pa-s or less at high shear rate, a viscosity of 5000 Pa-s or more and 50000 Pa-s or less at low shear rate, a melting point of 30°C or more and 80°C or less, and a heat of fusion of 5 J/s.
• a plurality of types of styrenic resins having different amounts within the range of 50 J/g or more and 50 J/g or more were prepared.
• the carbon black used had an average particle diameter of 10 nm.
• propylene resins with physical property values within the above ranges are used alone or in combination of two or more, and rubber materials and elastomers with physical property values within the above ranges are used.
• One type or two or more types were used.
• a predetermined amount of carbon black is added to 100 parts by mass of these resin components, and the viscosity of the resulting semiconductive composition at each shear rate becomes a predetermined value.
• Materials A to D were prepared as follows. Here, the addition ratio of the propylene resin was adjusted to be 50% by mass or more of the resin component.
• the melting points and heat of fusion of the resin components contained in Materials A to D were determined by DSC measurement. DSC measurements were performed in accordance with JIS-K-7121 (1987). Specifically, a PerkinElmer DSC8500 (input compensation type) was used as the DSC device. The reference sample was, for example, ⁇ -alumina. The mass of the measurement sample was 8 to 10 g. In the DSC device, the temperature was raised from room temperature (27°C) to 220°C at a rate of 10°C/min. Thereby, a DSC curve was obtained by plotting the amount of endotherm (heat flow) per unit time versus temperature.
• the temperature at which the amount of heat absorbed per unit time in each measurement sample was maximum was defined as the "melting point.”
• the "heat of fusion” was determined by determining the area of the region surrounded by the melting peak and the baseline in the DSC curve.
• viscosity The viscosity at each shear rate of materials A to D was determined using a rotary rheometer (“MCR302” manufactured by Anton Paar) at 190°C using a jig PP-12 at a shear rate of 0.001 s - Measurements were made by varying the shear rate from 1 to 1000 s -1 .
• a resin composition for forming an insulating layer was prepared separately from Materials A to D as semiconductive compositions. Specifically, the propylene resin, rubber material, and elastomer used in preparing the above-mentioned semiconductive composition are mixed appropriately, and the viscosity at high shear rate is 1000 Pa ⁇ s and the viscosity at low shear rate is 5000 Pa ⁇ Composition A for forming an insulating layer of s was prepared. Further, the mixing ratio of each component was changed as appropriate to prepare a composition B for forming an insulating layer having a viscosity of 100 Pa ⁇ s at a high shear rate and a viscosity of 800 Pa ⁇ s at a low shear rate.
• compositions A and B for forming an insulating layer and materials A to D which are semiconductive compositions.
• Example 1 Specifically, as shown in Table 2 below, a conductor having a cross-sectional area of 200 mm 2 (conductor diameter approximately 16.0 mm) was first prepared. After preparing the conductor, add the material A prepared above as a coating material for forming an inner semiconducting layer, the composition A for forming an insulating layer, and the material A prepared above as a coating material for forming an outer semiconducting layer. , were charged into extruders A to C, respectively.
• the respective extrudates from extruders A to C were led to a common head, and an inner semiconducting layer, an insulating layer and an outer semiconducting layer were simultaneously extruded from the inside to the outside around the outer periphery of the conductor.
• the thicknesses of the inner semiconducting layer, the insulating layer, and the outer semiconducting layer were 0.5 mm, 9.0 mm, and 0.5 mm, respectively, and the insulation coating thickness was 10 mm.
• Sample 1 of a power cable (cable outer diameter: 36 mm) was manufactured, which had a conductor, an inner semiconducting layer, an insulating layer, and an outer semiconducting layer from the center to the outer periphery. Note that, when the conductor diameter is X and the outer diameter of the power cable (cable outer diameter) is Y, the ratio (Y/X) of the cable outer diameter to the conductor diameter was 1.9.
• Samples 2 to 5 are the same as Sample 1 except that the type of semiconductive composition was changed to Material B to Material D, or the type of composition for forming an insulating layer was changed to Composition B. Power cables were produced in the same manner as in the above, and Samples 2 to 5 were obtained.
• the uniformity of the outer diameter in the cross section was evaluated as follows. Specifically, select any one point in the longitudinal direction of the power cable, measure the outer diameter in the outer circumferential direction of the cross section, find the major axis (maximum value) and the minor axis (minimum value), and calculate the difference between the minor axis and the minor axis. The ratio of the major axis was calculated. The smaller this ratio is, the smaller the variation in the outer diameter in the cross section is.
• the uniformity of the outer diameter in the longitudinal direction was evaluated as follows. Specifically, we selected two points 5 m apart in the longitudinal direction of the power cable, measured the major axis and minor axis at each point, and calculated the ratio of the major axis at one point to the minor axis at the other point. did. The smaller this ratio is, the smaller the variation in the outer diameter in the longitudinal direction is.
• a semiconducting composition for forming a semiconducting layer in a power cable comprising: a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer; carbon black;
• the rubber material and elastomer have at least two units of ethylene, propylene, butylene, hexene, isoprene, octene and styrene;
• the viscosity at a high shear rate at a temperature of 190°C and a shear rate of 100 s -1 is 1000 Pa-s or more and 5000 Pa-s or less, and the viscosity at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 is 100,000 Pa-s or more and 1,000,000 Pa-s.
• the semiconductive composition is a resin component containing a propylene-based resin and at least one of a rubber material and an elastomer; carbon black;
• the rubber material and elastomer have at least two units of ethylene, propylene, butylene, hexene, isoprene, octene and styrene;
• the viscosity at a high shear rate at a temperature of 190°C and a shear rate of 100 s -1 is 1000 Pa-s or more and 5000 Pa-s or less, and the viscosity at a low shear rate at a temperature of 190°C and a shear rate of 1 s -1 is 100,000 Pa-s or more and 1,000,000 Pa-s.
• the following is power
• the content of the carbon black is 10 parts by mass or more and 100 parts by mass or less based on 100 parts by mass of the resin component. Power cable described in Appendix 2.
• the heat of fusion of the resin component is 55 J/g or more and 90 J/g or less, Power cables as described in Appendix 2 or Appendix 3.
• the melting point of the resin component is 140°C or more and 170°C or less, Power cables described in any one of appendices 2 to 4.
• the thickness of the outer semiconductive layer is 0.5 mm or more, and the ratio of the outer diameter of the power cable to the outer diameter of the conductor is 4 or less. Power cables described in any one of appendices 2 to 7.
• the propylene resin has a viscosity of 100 Pa ⁇ s or more and 6000 Pa ⁇ s or less at the high shear rate, and a viscosity of 500 Pa ⁇ s to 50,000 Pa ⁇ s or less at the low shear rate. Power cables described in any one of appendices 2 to 8.
• the propylene resin has a melting point of 140° C. or more and 150° C. or less, and a heat of fusion of 90 J/g or more and 105 J/g or less. Power cables described in any one of Appendices 2 to 9.
• the rubber material and elastomer have a viscosity of 300 Pa ⁇ s or more and 7000 Pa ⁇ s or less at the high shear rate, and a viscosity of 4000 Pa ⁇ s or more and 80000 Pa ⁇ s or less at the low shear rate.
• the rubber material has a heat of fusion of 50 J/g or less, The power cable described in any one of appendices 2 to 12.
• Power cable 110 Conductor 120 Inner semiconducting layer 130 Insulating layer 140 Outer semiconducting layer 150 Shielding layer 160 Sheath

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