WO2023286758A1 - 接合体 - Google Patents

接合体 Download PDF

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Publication number
WO2023286758A1
WO2023286758A1 PCT/JP2022/027369 JP2022027369W WO2023286758A1 WO 2023286758 A1 WO2023286758 A1 WO 2023286758A1 JP 2022027369 W JP2022027369 W JP 2022027369W WO 2023286758 A1 WO2023286758 A1 WO 2023286758A1
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WO
WIPO (PCT)
Prior art keywords
plate
frame
ceramics
aluminum oxide
ceramic
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Ceased
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PCT/JP2022/027369
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English (en)
French (fr)
Japanese (ja)
Inventor
翔一 太田
欽 章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2023534810A priority Critical patent/JP7692042B2/ja
Publication of WO2023286758A1 publication Critical patent/WO2023286758A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating

Definitions

  • the present invention relates to a conjugate.
  • a diaphragm structure comprising a flexible film and a substrate having a window covered with this film has been used as a constituent member of various sensors.
  • the diaphragm portion of the diaphragm structure is configured to detect bending displacement caused by an object to be measured by an appropriate detecting means.
  • diaphragm structures have also been used as constituent members of piezoelectric/electrostrictive actuators.
  • the diaphragm portion of the diaphragm structure When used as a constituent member of a piezoelectric/electrostrictive actuator, the diaphragm portion of the diaphragm structure is deformed by the piezoelectric/electrostrictive element, and pressure is generated in a pressure chamber formed inside the diaphragm structure. ing.
  • molded bodies are integrally sintered, and the diaphragm portion is directed outwardly in the opposite direction to the window portion.
  • a joined body according to the present disclosure includes a frame containing a polycrystalline first ceramic containing aluminum oxide as a main component and a polycrystalline second ceramic containing aluminum oxide as a main component, and is thinner than the frame. plate-like body.
  • a joined body according to the present disclosure has a structure in which a frame body and a plate-like body are diffusion-bonded in the thickness direction. The content of aluminum oxide contained in the second ceramics is higher than the content of aluminum oxide contained in the first ceramics.
  • a diaphragm structure according to the present disclosure includes the above bonded body.
  • a pressure sensor according to the present disclosure includes this diaphragm structure and a sensor element or thick film resistor mounted on the first main surface of the plate-like body of the diaphragm structure.
  • a method for manufacturing a joined body according to the present disclosure includes a frame containing a polycrystalline first ceramic containing aluminum oxide as a main component, and a polycrystalline second ceramic containing aluminum oxide as a main component, and the frame contains: a step of arranging a plate-shaped body thinner than the thickness direction so as to face each other; and a step of heat-treating the frame body and the plate-shaped body while pressing them from the thickness direction.
  • FIG. 1 is a plan view showing a joined body according to an embodiment of the present disclosure
  • FIG. FIG. 2 is a cross-sectional view taken along line XX shown in FIG. 1;
  • Patent Document 1 As described above, in Patent Document 1, from the viewpoint of reliability, heat resistance, and corrosion resistance, the molded bodies are integrally sintered, and the diaphragm portion is convex outward in the opposite direction to the window portion. A closed diaphragm structure is disclosed. However, when the diaphragm portion is repeatedly bent, the residual stress in the convex diaphragm portion significantly increases. As a result, there is a problem of premature breakage. Therefore, there is a demand for a joined body that is resistant to breakage over a long period of time even when repeatedly bent.
  • the bonded body according to the present disclosure has a structure in which a structure made of ceramics and a plate-shaped body made of ceramics are diffusion-bonded in the thickness direction. Therefore, both main surfaces of the plate-like body made of ceramics are planar. Therefore, the bonded body according to the present disclosure is less likely to break over a long period of time even when repeatedly bent.
  • the method for manufacturing a joined body according to the present disclosure includes the step of diffusion-bonding the structure made of ceramics and the plate-like body made of ceramics in the thickness direction. Therefore, both main surfaces of the plate-like body made of ceramics are planar. Therefore, according to the method for manufacturing a joined body according to the present disclosure, it is possible to provide a joined body that is resistant to breakage over a long period of time even when repeatedly bent.
  • a joined body 1 according to an embodiment of the present disclosure shown in FIG. 1 includes a frame 2 containing first ceramics and a plate-like body 3 containing second ceramics.
  • a bonded body 1 according to one embodiment has a structure in which a frame body 2 and a plate-like body 3 are diffusion-bonded in the thickness direction.
  • both main surfaces (first main surface 31 and second main surface 32) of plate-like body 3 are planar.
  • the joined body 1 according to one embodiment is less likely to break over a long period of time even when repeatedly bent.
  • the main surface located on the side opposite to the frame 2 is referred to as a first main surface 31, and the main surface located on the frame 2 side is referred to as a second main surface.
  • 32, of the main surfaces of the frame 2, the main surface located on the side opposite to the plate-like body 3 is defined as the first main surface 21 and explained.
  • the first ceramics contained in the frame 2 is made of polycrystal and has aluminum oxide as its main component.
  • "mainly composed of aluminum oxide” means that the content of aluminum oxide is 90% by mass or more in the total 100% by mass of the ceramics of interest.
  • the first ceramic may have an aluminum oxide content of 92% by mass or more.
  • the content of aluminum oxide contained in the second ceramics is higher than the content of aluminum oxide contained in the first ceramics. Therefore, if the content of aluminum oxide in the first ceramics is 92% by mass or more, the content of aluminum oxide in the second ceramics, which will be described later, also exceeds 92% by mass. Therefore, the mechanical strength of the second ceramics can also be improved.
  • the first ceramics may contain, for example, at least one selected from the group consisting of silicon, magnesium and calcium.
  • the content of these elements in terms of oxides may be, for example, 6.7% by mass or less in total.
  • the rigidity of the first ceramics can be improved.
  • the frame 2 can support the plate-like body 3 more stably.
  • the amount of silicon contained in the first ceramics in terms of oxide is 2 mass % or more and 7 mass % or less
  • the amount of magnesium in terms of oxide is 0.42 mass % or more and 1 mass % or less
  • the amount of calcium in terms of oxide is 0. .17% by mass or more and 1.1% by mass or less.
  • the frame 2 has a square shape when viewed from above.
  • the shape of the frame 2 is not limited to a quadrilateral shape, and may be a circular shape, an elliptical shape, or a polygonal shape other than a quadrilateral shape.
  • Polygons including quadrilaterals may be regular polygons or scalene polygons.
  • the size of the frame 2 is not limited, and is appropriately set according to the use of the joined body 1.
  • the size of the frame body 2 is a polygonal shape such as a square shape
  • the length of one side of the outer periphery may be, for example, 15 mm or more and 30 mm or less.
  • the outer diameter may be, for example, 15 mm or more and 30 mm or less.
  • both the major axis and the minor axis should be within such ranges.
  • the thickness T1 of the frame 2 is not limited, and is appropriately set according to the application of the joined body 1.
  • the thickness T1 of the frame 2 may be, for example, 10 mm or more and 20 mm or less.
  • the second ceramics contained in the plate-like body 3 is polycrystalline and has aluminum oxide as its main component.
  • the definition of the principal component is as described above.
  • the second ceramics may also contain, in addition to aluminum oxide, at least one selected from the group consisting of silicon, magnesium and calcium, for example.
  • the amount of silicon contained in the second ceramics in terms of oxide is 0.01% by mass or more and 0.04% by mass or less
  • the amount of magnesium in terms of oxide is 0.028% by mass or more and 0.049% by mass or less
  • the amount of calcium in terms of oxide is 0.028% by mass or more and 0.049% by mass or less.
  • the oxide conversion amount is 0.022% by mass or more and 0.039% by mass or less.
  • the oxide equivalent amount of these elements contained in the second ceramics may be less than the oxide equivalent amount of these elements contained in the first ceramics. If the amount of oxide conversion of these elements contained in the second ceramics is small, for example, when a sensor element or the like is mounted on the plate-like body 3, the chemical reaction that may affect the sensor element or the like is reduced. can do.
  • the content of aluminum oxide contained in the second ceramics is higher than the content of aluminum oxide contained in the first ceramics. That is, since the plate-like body 3 has a higher static elastic modulus than the frame 2 , the plate-like body 3 has a higher rigidity than the frame 2 . As a result, even if the thickness of the plate-like body 3 is reduced, the plate-like body 3 is less likely to break.
  • the difference between the oxide equivalent amount of these elements contained in the second ceramics and the oxide equivalent amount of these elements contained in the first ceramics is, for example, 3.5% by mass or more and 4% by mass or less.
  • the first ceramics and the second ceramics may further contain magnesium aluminate.
  • the content of magnesium aluminate is not limited, and for example, the magnesium aluminate contained in the second ceramics may be less than the magnesium aluminate contained in the first ceramics. Since the thickness of the plate-like body 3 is thinner than the thickness of the frame 2 , the thermal shock resistance of the plate-like body 3 is poorer than that of the frame 2 . However, by reducing the content of magnesium aluminate, which affects thermal shock resistance, in the plate-like body 3 rather than in the frame body 2, it is possible to suppress the deterioration of the thermal shock resistance of the plate-like body 3. .
  • the difference in content of magnesium aluminate between the first ceramics and the second ceramics is 0.5% by mass or more, and the content of magnesium aluminate contained in the first ceramics is 0.5% by mass or more3 % by mass or less.
  • the second ceramic may not contain magnesium aluminate. In this case, deterioration of the thermal shock resistance of the plate-like body 3 can be further suppressed.
  • Each component contained in the first ceramics and the second ceramics may be identified using an X-ray diffractometer using CuK ⁇ rays.
  • the content of each element can be converted to a compound identified by an X-ray diffractometer using an X-ray fluorescence spectrometer (XRF) or an ICP emission spectrometer (Inductively coupled plasma optical emission spectrometer) (ICP).
  • XRF X-ray fluorescence spectrometer
  • ICP emission spectrometer Inductively coupled plasma optical emission spectrometer
  • the content of magnesium aluminate may be determined using the Rietveld method.
  • the plate-like body 3 has a square shape when viewed from above.
  • the shape of the plate-like body 3 is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, or a polygonal shape other than a rectangular shape. Polygons including quadrilaterals may be regular polygons or scalene polygons.
  • the shape and size of the plate-like body 3 are appropriately set according to the shape of the frame 2 .
  • the thickness T2 of the plate-like body 3 is not limited as long as it is thinner than the thickness T1 of the frame body 2, as shown in FIG.
  • the thickness T2 of the plate-like body 3 may be, for example, 0.1 mm or more and 2 mm or less.
  • the plate-like body 3 has a higher aluminum oxide content and a higher static elastic modulus than the frame 2, so the plate-like body 3 has higher rigidity than the frame 2. Become. As a result, the thickness of the plate-like body 3 can be reduced.
  • the thickness T2 of the plate-like body 3 is preferably 0.2 mm or more and 0.6 mm or less.
  • the static elastic modulus of the plate-like body 3 is, for example, 360 GPa or more.
  • the frame body 2 shown in FIGS. 1 and 2 is a rectangular parallelepiped, and has a rectangular parallelepiped internal space penetrating in the thickness direction of the rectangular parallelepiped. It may be a structure having an internal space for In this case, the internal space is not limited to a rectangular parallelepiped shape, and may have a shape such as a polyhedron, a frustum, or a cylinder.
  • the internal space does not necessarily have to penetrate, and the first main surface 21 of the frame 2 located on the opposite side of the plate-like body 3 may be a structure having no opening. In this case, the internal space is in contact with the second main surface 32 of the plate-like body 3 . When the first main surface 21 does not have an opening, at least one or more holes connecting the internal space and the external space may be formed in the first main surface 21 .
  • the size of the aluminum oxide crystal grains contained in the first ceramics and the size of the aluminum oxide crystal grains contained in the second ceramics are not limited.
  • the aluminum oxide crystal grains contained in the second ceramics may have a smaller average equivalent circle diameter than the aluminum oxide crystal grains contained in the first ceramics.
  • the circle-equivalent diameter is the diameter of a circle having the same area as that of each crystal grain on the surfaces of the first ceramic and the second ceramic that have been successively polished and thermally etched.
  • the first main surface 31 of the plate-like body 3 is polished with a copper disk using diamond abrasive grains having an average particle diameter D50 of 3 ⁇ m. After that, it is polished with a tin plate using diamond abrasive grains having an average particle diameter D50 of 0.5 ⁇ m.
  • the polished surface obtained by these polishing processes is subjected to thermal etching at, for example, 1480° C. until the crystal grains and the grain boundary layer can be distinguished, and is used as a surface to be measured.
  • the heat treatment is, for example, about 30 minutes.
  • the first main surface 21 of the frame 2 is polished with a copper disk using diamond abrasive grains having an average particle diameter D50 of 3 ⁇ m, and thereafter, the surface to be measured is subjected to the same procedure as described above. can be obtained.
  • the heat-treated surface is observed with an optical microscope and photographed, for example, at a magnification of 400 times.
  • the area of 4.8747*10 ⁇ 2 >m be a measurement range among the image
  • Equivalent circle diameters of individual crystal grains can be obtained by analyzing this measurement range using image analysis software (eg, Win ROOF manufactured by Mitani Shoji Co., Ltd.).
  • image analysis software eg, Win ROOF manufactured by Mitani Shoji Co., Ltd.
  • the threshold value of the equivalent circle diameter is set to 0.21 ⁇ m, and the equivalent circle diameter of less than 0.21 ⁇ m is not included in the calculation of the average value.
  • the mechanical strength and rigidity of ceramics can be improved. That is, the mechanical strength and rigidity of the second ceramics can be improved more than the first ceramics. As a result, even if the thickness of the plate-like body 3 is reduced, the plate-like body 3 is less likely to break.
  • the equivalent circle diameter of the aluminum oxide crystal grains contained in the second ceramics is, for example, 1 ⁇ m or more and 5 ⁇ m or less.
  • the equivalent circle diameter of the aluminum oxide crystal grains contained in the first ceramics is, for example, 4 ⁇ m or more and 10 ⁇ m or less.
  • the difference between the equivalent circle diameter of the aluminum oxide crystal grains contained in the second ceramics and the equivalent circle diameter of the aluminum oxide crystal grains contained in the first ceramics is preferably 1 ⁇ m or more, particularly 2 ⁇ m or more. .
  • the surface properties of the main surface of the plate-like body 3 are not particularly limited.
  • the first principal surface 31 of the plate-like body 3 has a cut level at a load length rate of 25% in the roughness curve and a cutting level at a load length rate of 75% in the roughness curve than the second principal surface 32 of the plate-like body 3.
  • the average value of the cutting level difference (R ⁇ c) which is the difference from the cutting level at the load length ratio, may be large.
  • the average value of the cutting level difference (R ⁇ c) of the first main surface 31 is, for example, 0.6 ⁇ m or more and 1.5 ⁇ m or less.
  • the average value of the cutting level difference (R ⁇ c) of the second main surface 32 is, for example, 0.3 ⁇ m or more and 0.9 ⁇ m or less.
  • the difference between the average cutting level difference (R ⁇ c) of the first main surface 31 and the average cutting level difference (R ⁇ c) of the second main surface 32 is, for example, 0.3 ⁇ m or more and 0.6 ⁇ m or less.
  • the cutting level difference (R ⁇ c) on the roughness curve is the height of the cutting levels C (Rrm1) and C (Rrm2) that correspond to the load length ratios Rmr1 and Rmr2 on the roughness curve specified in JIS B0601:2001. It is an index that indicates the difference in direction.
  • a smaller cutting level difference (R ⁇ c) in the roughness curve indicates a smoother surface with less unevenness.
  • the cutting level difference (R ⁇ c) conforms to JIS B 0601: 2001 and can be measured using a laser microscope (manufactured by Keyence Corporation, ultra-depth color 3D shape measuring microscope (VK-X1000 or its successor model)).
  • the illumination method is the coaxial epi-illumination method
  • the cutoff value ⁇ s is absent
  • the cutoff value ⁇ c is 0.08 mm
  • the cutoff value ⁇ f is absent
  • the end effect is corrected
  • the measurement magnification is 240 times
  • the measurement target is
  • the measurement range per place from the first main surface 31 and the second main surface 32 is 1428 ⁇ m ⁇ 1070 ⁇ m, and four lines to be measured are drawn in each measurement range along the longitudinal direction of the measurement range.
  • line roughness measurement may be performed. Before measuring the line roughness, the strength of correction is set to 5, and the surface shape is corrected by removing undulations. The length of one line to be measured is, for example, 1282 ⁇ m. Two measurement ranges are set from each of the first main surface 31 and the second main surface 32, the cutting level difference (R.delta.c) is measured from a total of eight lines, and the average value is calculated.
  • a method for manufacturing the joined body 1 according to one embodiment is not limited.
  • the joined body 1 is manufactured, for example, by arranging the frame body 2 and the plate-like body 3 so as to face each other and heat-treating them while pressing them from the thickness direction. Specifically, it is manufactured by the following steps.
  • step (a) first, the frame 2 and the plate-like body 3 are prepared.
  • the frame body 2 and the plate-like body 3 are as described above, and detailed description thereof will be omitted.
  • the first ceramics and second ceramics contained in the frame 2 and plate-like body 3 are obtained, for example, by the following procedure.
  • Powders of aluminum oxide having a purity of 99.9% by mass or more
  • magnesium hydroxide, silicon oxide and calcium carbonate are put into a grinding mill together with a solvent (ion-exchanged water).
  • a solvent ion-exchanged water
  • an organic binder and a dispersant for dispersing the aluminum oxide powder are added and mixed to obtain a slurry.
  • Organic binders include, for example, acrylic emulsion, polyvinyl alcohol, polyethylene glycol, and polyethylene oxide.
  • the content of magnesium hydroxide powder in the total 100 mass% of the powder is 0.6 mass% or more and 1.5 mass% or less, and the content of silicon oxide powder is 2. % by mass or more and 7% by mass or less, the content of calcium carbonate powder is 0.3% by mass or more and 2% by mass or less, and the balance is aluminum oxide powder.
  • the total content of unavoidable impurities shall be 0.25% by mass or less.
  • the content of magnesium hydroxide powder is 0.04% by mass or more and 0.07% by mass or less, and the content of silicon oxide powder is 0.01% by mass, based on the total 100% by mass of the powders. % or more and 0.04 mass % or less, the content of calcium carbonate powder is 0.04 mass % or more and 0.07 mass % or less, and the balance is aluminum oxide powder.
  • the total content of unavoidable impurities shall be 0.25% by mass or less.
  • the frame is finally obtained by applying a molding pressure of 78 MPa or more and 128 MPa or less using a uniaxial press molding device or a cold isostatic press molding device. 2 and a molded body corresponding to the shape of the plate-like body 3 are obtained.
  • a molding pressure of 78 MPa or more and 128 MPa or less
  • a molded body corresponding to the shape of the plate-like body 3 are obtained.
  • the obtained frame 2 and plate-like body 3 are arranged so as to face each other in the thickness direction. Specifically, the first area 2a of the frame 2 facing the plate-like body 3 and the second area 3a of the plate-like body 3 facing the frame 2 are arranged to face each other. Water may be applied to at least one of the first region 2a and the second region 3a, if necessary.
  • At least one of the first region 2a and the second region 3a may be processed by at least one of grinding and polishing before the frame 2 and the plate-like body 3 are arranged to face each other.
  • the grinding method and polishing method are not limited. Grinding may be performed using, for example, a surface grinder. Polishing may be carried out by, for example, supplying diamond slurry having an average particle size of 0.5 ⁇ m or more and 3 ⁇ m or less to a lapping machine made of copper, tin, or a tin-lead alloy at predetermined intervals.
  • step (b) heat treatment is performed while pressing the frame body 2 and the plate-shaped body 3, which are arranged to face each other, from the thickness direction.
  • Diffusion bonding can be used as a method of performing heat treatment while pressing in this manner.
  • the frame body 2 and the plate-like body 3 are arranged so as to face each other, and are pressed from the thickness direction, for example, by the weight of the plate-like body 3, and heated to 1000° C. or more and 1800° C. or less and for 4 hours or more and 6 hours or less.
  • Heat treatment under the conditions of If necessary, heat treatment may be performed under the above conditions by pressing from the thickness direction with a force of, for example, 800 gf or more and 3 kgf or less.
  • the heat treatment in step (b) is preferably performed with the plate-like body 3 facing downward, for example.
  • both main surfaces of the plate-like body 3 (the first main surface 31 and the second main surface 32) ) becomes easier to control the flatness.
  • step (b) at least one of the first main surface 21 of the frame 2 and the first main surface 31 of the plate-like body 3 may be subjected to at least one of grinding and polishing.
  • the second region 3a of the plate-like body 3 facing the frame 2 is ground, and after the step (b), the plate-like body 3 is ground.
  • the grindstone used for grinding the first main surface 31 may be a grindstone having a larger grain size number than the grindstone used for grinding the second region 3a.
  • the second region 3a of the plate-like body 3 facing the frame 2 is polished, and after the step (b), the plate-like body 3 is polished.
  • the abrasive grains used for polishing the first main surface 31 should have a larger grain size number than the abrasive grains used for polishing the second region 3a.
  • the second region 3a of the plate-like body 3 facing the frame 2 is polished, and after the step (b), the plate-like body 3 is polished.
  • a joined body can be efficiently obtained.
  • a joined body 1 is used, for example, as a diaphragm structure.
  • a diaphragm is a membrane that undergoes displacement under the influence of pressure.
  • the pressure sensor according to the present disclosure includes this diaphragm structure and a first main surface (plate-like body 3 and a sensor element or thick film resistor mounted on the first major surface 31) of the .
  • a sensor element is provided in the central portion of the first main surface of the plate-like body of the diaphragm structure.
  • the pressure sensor according to one embodiment is a plate-like body (plate-like body 3) of a diaphragm structure caused by a differential pressure between the pressure inside the frame 2 and the outside of the frame 2 maintained at a specific pressure. is detected by the sensor element.
  • a thick film resistor is provided on the first main surface of the plate-like body of the diaphragm structure instead of the sensor element.
  • the pressure sensor according to another embodiment like the pressure sensor according to one embodiment, is a plate of a diaphragm structure generated by a differential pressure between the pressure inside the frame 2 and the outside of the frame 2 maintained at a specific pressure. The deflection of the body (plate body 3) is detected by a thick film resistor.
  • the diaphragm structure of the present disclosure may be used not only for pressure sensors, but also for various sensors such as vibration sensors, strain sensors, acoustic sensors, MEMS sensors, biological sensors, and ultrasonic sensors.
  • the joined body of the present disclosure may be not only a diaphragm structure but also a housing (package) including a polyhedron (container) having an internal space and a plate-like body thinner than the polyhedron.
  • a sphere for absorbing vibration may be movably accommodated in the internal space of the housing, and when the sphere is accommodated, it can also be used as a ball sensor.
  • REFERENCE SIGNS LIST 1 joined body 2 frame 21 first main surface of frame 2a first region 3 plate-like body 31 first main surface of plate-like body 32 second main surface of plate-like body 3a second region

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
PCT/JP2022/027369 2021-07-14 2022-07-12 接合体 Ceased WO2023286758A1 (ja)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130334A (ja) * 1994-09-06 1996-05-21 Ngk Insulators Ltd セラミックダイヤフラム構造体及びその製造方法
JPH11339561A (ja) * 1998-05-27 1999-12-10 Ngk Insulators Ltd セラミック素子、セラミック素子の製造方法、表示装置、リレー装置及びコンデンサ
JP2011148688A (ja) * 2009-12-25 2011-08-04 Taiheiyo Cement Corp セラミックス接合体及びその製造方法
JP2014170926A (ja) * 2013-02-08 2014-09-18 Canon Inc 振動体、その製造方法、及び振動型駆動装置
JP2017211375A (ja) * 2016-05-25 2017-11-30 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 差圧センサ最大過剰圧保護機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130334A (ja) * 1994-09-06 1996-05-21 Ngk Insulators Ltd セラミックダイヤフラム構造体及びその製造方法
JPH11339561A (ja) * 1998-05-27 1999-12-10 Ngk Insulators Ltd セラミック素子、セラミック素子の製造方法、表示装置、リレー装置及びコンデンサ
JP2011148688A (ja) * 2009-12-25 2011-08-04 Taiheiyo Cement Corp セラミックス接合体及びその製造方法
JP2014170926A (ja) * 2013-02-08 2014-09-18 Canon Inc 振動体、その製造方法、及び振動型駆動装置
JP2017211375A (ja) * 2016-05-25 2017-11-30 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 差圧センサ最大過剰圧保護機器

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