WO2023275661A1 - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- WO2023275661A1 WO2023275661A1 PCT/IB2022/055685 IB2022055685W WO2023275661A1 WO 2023275661 A1 WO2023275661 A1 WO 2023275661A1 IB 2022055685 W IB2022055685 W IB 2022055685W WO 2023275661 A1 WO2023275661 A1 WO 2023275661A1
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- layer
- light
- camera
- image
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Definitions
- One aspect of the present invention relates to an electronic device.
- one aspect of the present invention is not limited to the above technical field.
- Technical fields of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input/output devices, and driving methods thereof. , or methods for producing them, can be mentioned as an example.
- the electronic device includes a camera and a display.
- Patent Literature 1 discloses a terminal in which a display unit has a main display area and a sub-display area, and a camera is installed under the sub-display area.
- An object of one aspect of the present invention is to provide an electronic device capable of smooth communication. Alternatively, an object of one embodiment of the present invention is to provide an electronic device capable of generating a clear image. Alternatively, an object of one embodiment of the present invention is to provide an electronic device that can track the line of sight of a subject. Alternatively, an object of one embodiment of the present invention is to provide an electronic device that can generate an avatar linked to movement of a subject's face. Alternatively, an object of one embodiment of the present invention is to provide a novel electronic device.
- An aspect of the present invention is an electronic device that includes a display section that includes a first camera, a second camera, and an image processing section.
- the second camera is placed in an area that does not overlap the display.
- the first camera has a function of generating a first image in which a subject is captured
- the second camera has a function of generating a second image in which a subject is captured.
- the image processing unit has a generator that learns using teacher data.
- the training data has an image containing a person's face.
- the image processing unit has a function of sharpening the first image when the first image is input to the generator, and a function of performing line-of-sight tracking of the subject based on the second image.
- the above electronic device further includes a light source that emits infrared light, the light source is arranged in a region that does not overlap with the display unit, the light source is used for detecting the line of sight of the subject, and by repeating the detection of the line of sight of the subject, the eye-tracking is preferably performed.
- Another aspect of the present invention is an electronic device including a display section including a first camera, a second camera, a third camera, and an image processing section.
- the second camera and the third camera are each independently arranged in a region that does not overlap the display section.
- the first camera has a function of generating a first image in which the subject is captured
- the second camera has a function of generating a second image in which the subject is captured
- the third camera has a function of generating a third image in which the subject is photographed.
- the image processing unit has a function of sharpening the first image, a function of recognizing the face of the subject from the clear first image, and a three-dimensional shape of the face of the subject from the second image and the third image. and a function of generating an avatar from the subject's face and the three-dimensional shape of the subject's face.
- the first camera is arranged behind the pixels of the display unit when viewed from the subject.
- the first camera is arranged in an area including pixels of the display section when viewed from the subject.
- Another aspect of the present invention is an electronic device that includes a display section that includes a first camera and a fourth camera, and an image processing section.
- the first camera has a function of generating a first image in which a subject is captured
- the fourth camera has a function of generating a fourth image in which a subject is captured.
- the image processing unit has a generator that learns using teacher data.
- the training data has an image containing a person's face.
- the image processing unit has a function of activating the first camera or the fourth camera, and the first image or the fourth image generated using the active first camera or the fourth camera is sent to the generator. and a function of sharpening the first image or the fourth image by being input.
- the first camera and the fourth camera are arranged behind the pixels of the display unit when viewed from the subject.
- the first camera and the fourth camera are arranged in an area including pixels of the display section when viewed from the subject.
- an electronic device capable of smooth communication can be provided.
- one embodiment of the present invention can provide an electronic device capable of generating a clear image.
- an electronic device capable of tracking the line of sight of a subject can be provided.
- one embodiment of the present invention can provide an electronic device capable of generating an avatar linked to movement of a subject's face.
- one embodiment of the present invention can provide a novel electronic device.
- FIG. 1A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- FIG. 1B is a perspective view illustrating a configuration example of an electronic device of one embodiment of the present invention.
- FIG. 2A is a top view schematically showing the structure of an electronic device of one embodiment of the present invention.
- FIG. 2B is a perspective view schematically showing how light enters the camera included in the electronic device of one embodiment of the present invention.
- 3A to 3C are perspective views illustrating configuration examples of electronic devices of one embodiment of the present invention.
- FIG. 4 is a flow chart showing a method of generating an image.
- 5A and 5B are schematic diagrams explaining part of the processing.
- FIG. 6 is a flowchart showing an example of the flow of processing.
- FIG. 7A and 7B are schematic diagrams explaining part of the processing.
- FIG. 8A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- 8B to 8D are perspective views illustrating configuration examples of electronic devices of one embodiment of the present invention.
- FIG. 9 is a flow chart showing a method of generating an avatar.
- 10A to 10D are schematic diagrams explaining part of the processing.
- FIG. 11A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- 11B and 11C are perspective views illustrating configuration examples of electronic devices of one embodiment of the present invention.
- 12A and 12B are diagrams illustrating usage examples of the electronic device.
- 13A and 13B are diagrams illustrating usage examples of the electronic device.
- FIG. 14A is a top view of a display portion included in the electronic device.
- FIG. 14B is a cross-sectional view of a display portion included in the electronic device.
- FIG. 15A is a top view of a display portion included in the electronic device.
- FIG. 15B is a cross-sectional view of a display portion included in the electronic device.
- FIG. 16A is a top view of a display portion included in the electronic device.
- FIG. 16B is a cross-sectional view of a display portion included in the electronic device.
- FIG. 18A is a top view showing an example of a display panel.
- 18B is a cross-sectional view showing an example of the display panel.
- 19A to 19C are cross-sectional views showing examples of display panels.
- 20A and 20B are cross-sectional views showing examples of display panels.
- 21A to 21C are cross-sectional views showing examples of display panels.
- 22A to 22C are cross-sectional views showing examples of display panels.
- 23A to 23F are cross-sectional views showing examples of display panels.
- FIG. 24A is a top view showing an example of a display panel.
- FIG. 24B is a cross-sectional view showing an example of the display panel.
- 25A to 25F are top views showing examples of pixels.
- 26A to 26H are top views showing examples of pixels.
- 27A to 27J are top views showing examples of pixels.
- 28A to 28D are top views showing examples of pixels.
- 28E to 28G are cross-sectional views showing examples of display panels.
- 29A and 29B are perspective views showing an example of a display panel.
- 30A and 30B are cross-sectional views showing examples of display panels.
- FIG. 31 is a cross-sectional view showing an example of a display panel.
- FIG. 32 is a cross-sectional view showing an example of a display panel.
- FIG. 33 is a cross-sectional view showing an example of a display panel.
- FIG. 34 is a cross-sectional view showing an example of a display panel.
- FIG. 35 is a cross-sectional view showing an example of a display panel.
- FIG. 36 is a perspective view showing an example of a display panel.
- 37A is a cross-sectional view showing an example of a display panel.
- 37B and 37C are cross-sectional views showing examples of transistors.
- 38A to 38D are cross-sectional views showing examples of display panels.
- FIG. 39 is a cross-sectional view showing an example of a display panel.
- FIG. 40A is a block diagram showing an example of a display panel.
- 40B to 40D are diagrams showing examples of pixel circuits.
- 41A to 41D are diagrams illustrating examples of transistors.
- 42A to 42F are diagrams showing configuration examples of light-emitting devices.
- 43A to 43F are diagrams showing examples of electronic devices.
- 44A to 44G are diagrams illustrating examples of electronic devices.
- film and “layer” can be interchanged depending on the case or situation.
- conductive layer can be changed to the term “conductive film.”
- insulating film can be changed to the term “insulating layer”.
- the frame in the electronic device corresponds to a portion where no image is displayed.
- the frame is part of the housing of the electronic device. Therefore, the frame described in this specification and the like can be called a housing in some cases. In addition, the housing described in this specification and the like can be called a frame in some cases.
- FIG. 1A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- Electronic device 10 shown in FIG. 1A includes display unit 11 , camera 13 , and image processing unit 14 .
- the display unit 11 also includes a camera 12 .
- the display unit 11 has a function of displaying various information (still images, moving images, text images, etc.). Moreover, the display unit 11 may have a touch panel function.
- the cameras 12 and 13 function as imaging units.
- the imaging unit has a function of capturing an image and acquiring image data.
- An image sensor can be used for the imaging unit.
- the image processing unit 14 has a function of generating images. It should be noted that the function of generating an image includes a function of sharpening an image, a function of generating an avatar, and the like. The image processing unit 14 also has a function of detecting a line of sight and a function of tracking the line of sight.
- Algorithms using neural networks may be used for any one or more of image generation, image sharpening, avatar generation, line-of-sight detection, and line-of-sight tracking. That is, the image processing unit 14 may include at least one of a processing device capable of executing a program including a neural network, or a circuit configured with a neural network.
- a program including a neural network or a circuit configured with a neural network may be referred to as a generator.
- the image processor 14 may have a generator.
- the neural network When generating an image using a neural network, the neural network is trained in advance using images containing human faces as training data.
- images containing human faces are preferably an image with a clear human face.
- the neural network learns using teacher data having clear images of human faces.
- the image captured by the camera 12 is input to the generator. This causes the generator to generate an image.
- the generator also performs image sharpening.
- the learning of the above neural network is performed using teacher data that has, for example, clear images of human faces. Therefore, even if the image input to the generator is an image in which the subject's face is unclear, an image with reduced noise is output. That is, the output image is an image in which the subject's face is clear.
- FIG. 1B is a perspective view showing a configuration example of the electronic device 10 shown in FIG. 1A.
- the electronic device 10 has a display section 11 having a camera 12 , a camera 13 , an image processing section 14 and a frame 15 .
- FIG. 1B illustrates a user 40 of the electronic device 10 .
- the user 40 is also a subject photographed by the cameras 12 and 13 .
- top surface shape of the display unit 11 shown in FIG. 1B is rectangular, the top surface shape of the display unit 11 is not limited to this.
- the top surface shape of the display unit 11 may be, for example, a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a shape with rounded corners of these polygons, an ellipse, or a circle. A shape obtained by combining these may be used.
- top surface shape of the frame 15 shown in FIG. 1B is rectangular, the top surface shape of the frame 15 is not limited to this.
- the upper surface shape of the frame 15 may be, for example, a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a shape with rounded corners of these polygons, an ellipse, or a circle. may be combined.
- the camera 12 is arranged in an area overlapping with the display unit 11.
- camera 12 is placed in the center of display 11 .
- the placement of the camera 12 is not limited to the center of the display unit 11 .
- the arrangement of the camera 12 may be other than the center of the display unit 11, for example, the left side, the right side, the upper side, the lower side, the upper left side, the upper right side, the lower left side, or the lower right side of the display unit 11. good.
- FIG. 2A shows a top view schematically showing the configuration of the electronic device 10.
- FIG. 2A shows the user 40 of the electronic device 10 and does not show the image processing unit 14 .
- the frame 15 and the support 18 are shown separately in FIG. 2A, the frame 15 and the support 18 may be integrated.
- FIG. 2B is a perspective view schematically showing how light enters the camera 12.
- FIG. 2B the display unit 11 and the frame 15 are shown separately in order to make the configuration of the electronic device 10 easier to understand. 2B, the camera 12 and a part of the pixels 17 of the display unit 11 are enlarged and shown. Note that the pixel 17 may be regarded as a sub-pixel forming the pixel 17 .
- the camera 12 is arranged closer to the support 18 of the electronic device 10 than the display unit 11 or the pixels of the display unit 11 are.
- the camera 12 is arranged behind the display section 11 or the pixels of the display section 11 when viewed from the user 40 .
- the display unit 11 or the pixels of the display unit 11 are arranged between the eyes of the user 40 and the camera 12 .
- the camera 12 is arranged so that the intersection of the plane including the pixels of the display section 11 and the straight line connecting the eye of the user 40 and the camera 12 is positioned within the display section 11 .
- the camera 12 captures the light Lt passing through the gaps between the pixels 17, as shown in FIG. 2B.
- the image captured by camera 12 has a lot of noise and a small amount of light. Therefore, compared to the image captured by camera 13, the image captured by camera 12 is a blurred image.
- the camera 12 and the pixels may be arranged on the same layer.
- the camera 12 may be arranged in a region including the display section 11 or the pixels of the display section.
- the camera 13 is arranged in an area that does not overlap with the display unit 11.
- camera 13 is placed in picture frame 15 .
- FIG. 1B camera 13 is positioned on the short side of picture frame 15 .
- the position of the camera 13 is not limited to the short side of the frame 15 .
- the camera 13 may be arranged on the long side of the frame 15 or may be arranged near the vertex of the frame 15 .
- FIG. 3A is a perspective view illustrating a configuration example of an electronic device of one embodiment of the present invention.
- the camera 13 may be arranged in the notch portion 11c of the display portion 11.
- the frame of the electronic device 10 can be narrowed.
- FIG. 3B is a perspective view illustrating a configuration example of an electronic device of one embodiment of the present invention.
- the camera 13 may be arranged in a region that does not overlap with the display unit 11, and may be fixed outside the frame 15 as shown in FIG. 3B, for example.
- an electronic device of one embodiment of the present invention may include a display device and a calculator. Examples of such computers include personal computers and servers.
- FIG. 3C is a perspective view illustrating another configuration example of the electronic device of one embodiment of the present invention.
- the electronic device 10A shown in FIG. 3C has a display device 30 and a computer 20.
- Display device 30 includes display unit 11 having camera 12 , camera 13 , frame 15 , and communication unit 16 .
- the computer 20 has an image processing section 14 , a housing 25 and a communication section 26 .
- the display unit 11 is provided in the housing of the display device 30
- the image processing unit 14 is provided in the housing 25 of the computer 20 . That is, in the electronic device 10A, the display section 11 is provided in the first housing, and the image processing section 14 is provided in the second housing.
- Data can be transmitted and received between the display device 30 and the computer 20 using the communication section 16 and the communication section 26 .
- a hub, router, modem, or the like can be used as the communication unit 16 and the communication unit 26 .
- Data transmission/reception may be wired or wireless (for example, radio waves or infrared rays).
- Communication between the display device 30 and the computer 20 is based on the Internet, intranet, extranet, PAN (Personal Area Network), LAN (Local Area Network), CAN (Campus Area Network), which are the foundations of the World Wide Web (WWW). , MAN (Metropolitan Area Network), WAN (Wide Area Network), or GAN (Global Area Network).
- PAN Personal Area Network
- LAN Local Area Network
- CAN Campus Area Network
- WWW World Wide Web
- MAN Micropolitan Area Network
- WAN Wide Area Network
- GAN Global Area Network
- the electronic devices described in this embodiment preferably have a light source that emits infrared light.
- a light source that emits infrared light may be arranged in a region that does not overlap the display section 11 .
- the electronic device 10A preferably has a light source 19 that emits infrared light in the frame 15 .
- a light source that emits infrared light may be arranged in a region overlapping the display section 11 .
- the display unit 11 preferably has display light-emitting elements (such as RGB) and light-emitting elements that emit infrared light.
- the electronic device 10 can, for example, perform line-of-sight detection and line-of-sight tracking of a subject.
- FIG. 4 is a flow chart showing an example of the above method. Note that the method shown in FIG. 4 will be described using the electronic device 10A shown in FIG. 3C. 5A and 5B are schematic diagrams for explaining part of the processing shown in FIG.
- a method for sharpening an image of a subject and tracking the line of sight of the subject includes steps S01 to S04, as shown in FIG.
- Step S01 is a process in which each of the cameras 12 and 13 photographs a subject.
- An image 51 is generated by the camera 12 photographing a subject.
- an image 52 is generated by the camera 13 photographing the subject.
- image 51 is a blurred image compared to image 52 (FIG. 5A).
- Step S02 is a step in which the image 51 and the image 52 are input to the computer 20 via the communication section 16 and the communication section 26.
- the electronic device 10 when using the electronic device 10 shown in FIG. 1B, FIG. 3A, or the like, the electronic device 10 includes the image processing unit 14, so step S02 can be omitted.
- Step S03 is a step of inputting the image 51 to the image processing unit 14 and generating an image 54 (FIG. 5B).
- the image 54 can be said to be the image 51 with the noise reduced. Also, it can be said that the image 51 is clear. Therefore, step S ⁇ b>03 can be rephrased as a step of sharpening the image 51 using the image processing unit 14 .
- the image processing unit 14 preferably has a generator. At this time, the image 54 is generated using a generator. That is, step S03 can be rephrased as a step of sharpening the image 51 by inputting the image 51 into the generator.
- the image processing unit 14 also has a function of sharpening the image 51 when the image 51 is input to the generator.
- the neural network included in the generator is pre-trained. In other words, the neural network included in the generator is trained using teacher data. The learning of the neural network will be described later.
- Step S04 is a process in which the image 52 is input to the image processing unit 14 and the line of sight of the subject is detected based on the image 52. That is, the image processing unit 14 has a function of detecting the line of sight of the subject based on the image 52 .
- the detection of the subject's line of sight is performed by analyzing the image of the subject's eyes captured by the camera 13 .
- the first method of detecting the line of sight from the positional relationship between the inner corner (or the outer corner of the eye) and the iris (or the pupil) or the second method of detecting the line of sight from the positional relationship between the corneal reflection and the pupil is used. be done.
- the second method using corneal reflection is preferable because the line of sight can be detected with higher accuracy.
- the electrical device preferably has a light source that emits infrared light.
- step S04 when continuing to detect the line of sight of the subject, the process returns to step S01. Alternatively, if detection of the line of sight of the subject is not to be continued after step S04 is finished, the process is finished.
- the electronic device of one embodiment of the present invention can be used to sharpen the image of the subject and track the line of sight of the subject.
- the image processing unit 14 has the function of detecting the line of sight of the subject based on the image 52 . Further, by repeating the above cycle and detecting the line of sight of the subject, the line of sight of the subject can be tracked. Therefore, the image processing unit 14 has a function of tracking the line of sight of the subject based on the image 52 .
- the electronic device of one embodiment of the present invention When holding a remote meeting (online meeting) using the electronic device of one embodiment of the present invention, it is preferable to transmit the image 54 to the other party. Since the image 54 is generated based on the image captured by the camera 12 in the line-of-sight direction of the user, the user can show the image 54 to the participants of the remote meeting so that the line-of-sight of the participants matches that of the participants. Facilitate communication between participants. Further, since the image 54 is a clear image with reduced noise, it does not give an unpleasant impression to the participants of the remote meeting. In addition, since the electronic device of one embodiment of the present invention has a line-of-sight detection function, a remote meeting with a high sense of presence is possible. An example of a remote meeting using line-of-sight detection will be described in the second and subsequent embodiments.
- FIG. 6 shows a flowchart showing an example of the flow of processing.
- the processing shown in FIG. 6 can also be called learning.
- 7A and 7B are schematic diagrams explaining part of the processing shown in FIG. Note that this embodiment will be described by exemplifying a case where an image including a person's face is sharpened.
- the processing shown in FIG. 6 is preferably performed by a computer different from the computer 20 included in the electronic device 10 or the electronic device 10A. may be performed by the computer 20 possessed by The processing shown in FIG. 6 will be described as being performed using a computer different from the computer 20 included in the electronic device 10 or the electronic device 10A.
- teacher data 71 is obtained.
- the teacher data 71 preferably has a clear image of a person's face.
- the training data 71 is composed of a plurality of images in which a person's face is clear.
- the number of images is preferably 1,000 or more, more preferably 5,000 or more, and more preferably 10,000 or more. As the number of images increases, more accurate learning is possible, but in practice, the performance is limited by the performance of the computer that performs the learning. Specifically, it is limited by the processing power of the CPU and AI chip provided in the computer and the storage capacity of the main memory.
- step S11 it is preferable to convert the resolution of the images forming the teacher data 71 to an appropriate value.
- noise is added to all the images that make up the teacher data 71 to generate data 72 (Fig. 7A).
- Noise to be added includes noise based on a Gaussian distribution (also called Gaussian noise), noise that appears randomly with a certain frequency independent of position (also called impulse noise), and the like.
- Gaussian noise also called Gaussian noise
- impulse noise noise that appears randomly with a certain frequency independent of position
- step S13 learning is performed. Learning is performed using teacher data 71, data 72, and generator 70 (FIG. 7B).
- the generator 70 is a program that includes a neural network, and can generate images from input data. Examples of the generator 70 include an Autoencoder (AE) and a Convolutional Autoencoder (CAE). Also, as the generator 70, a generative adversarial network (GAN) or a model applying GAN may be used. Models that apply GAN include DCGAN (Deep Convolutional GAN), StyleGAN, and Progressive GAN. It can be said that the AI chip has a function as a generator 70 .
- AE Autoencoder
- CAE Convolutional Autoencoder
- GAN generative adversarial network
- Models that apply GAN include DCGAN (Deep Convolutional GAN), StyleGAN, and Progressive GAN. It can be said that the AI chip has a function as a generator 70 .
- the generator 70 uses the data 72 as input data and performs learning so that the output data approaches the teacher data 71 .
- the generator 70 uses the data 72 as input data and updates the neural network weights so that the output data approaches the teacher data 71 .
- step S14 the learning result 73 is saved (Fig. 7B). More specifically, it stores the neural network weights obtained by learning.
- the learning result 73 is saved in the auxiliary storage device of the computer or the auxiliary storage device of the electronic device 10 or 10A.
- FIG. 8A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- An electronic device 10B shown in FIG. 8A differs from the electronic device 10 shown in FIG. 1A in that two cameras 13 are provided.
- the electronic device 10B shown in FIG. 8A has a display unit 11, two cameras 13 (a camera 13_1 and a camera 13_2), and an image processing unit .
- the display unit 11 also includes a camera 12 .
- Electronic device 10 ⁇ /b>B includes display unit 11 having camera 12 , camera 13_1 , camera 13_2 , image processing unit 14 , and frame 15 .
- the cameras 13_1 and 13_2 are arranged in areas that do not overlap with the display unit 11 respectively.
- the cameras 13_1 and 13_2 are each placed in the frame 15 .
- the cameras 13_1 and 13_2 be arranged so as to sandwich the display unit 11 therebetween.
- the camera 13_1 and the camera 13_2 are preferably arranged on opposite short sides or long sides of the frame 15, respectively.
- the camera 13_1 is arranged on one of the opposite short sides of the frame 15, and the camera 13_2 is arranged on the other of the opposite short sides of the frame 15.
- FIG. 8B the camera 13_1 is arranged on one of the opposite short sides of the frame 15, and the camera 13_2 is arranged on the other of the opposite short sides of the frame 15.
- the cameras 13_1 and 13_2 are preferably arranged near the vertices of the frame 15 located on the diagonal line of the display unit 11, respectively.
- the camera 13_1 is arranged near the vertex of the frame 15, and the camera 13_2 is arranged near the vertex on the diagonal line of the vertex.
- the arrangement of the cameras 13_1 and 13_2 is not limited to the above.
- the camera 13_1 may be arranged on the short side of the frame 15 and the camera 13_2 may be arranged on the long side of the frame 15 .
- the camera 13_1 may be arranged on the long side or short side of the frame 15 and the camera 13_2 may be arranged near the vertex of the frame 15 .
- the cameras 13_1 and 13_2 may be arranged at two vertices of the frame 15 .
- one or both of the camera 13_1 and the camera 13_2 may be arranged in the cutout portion of the display unit 11 . Also, one or both of the camera 13_1 and the camera 13_2 may be fixed outside the frame 15 .
- the present invention is not limited to this.
- An electronic device of one embodiment of the present invention may have three or more cameras 13 .
- FIG. 8B illustrates a configuration in which the display unit 11 and the image processing unit 14 are provided in a single housing
- the present invention is not limited to this.
- the display unit 11 and the image processing unit 14 may be provided in different housings.
- an electronic device of one embodiment of the present invention may include a display device and a calculator. Examples of such computers include personal computers and servers.
- FIG. 8D is a perspective view illustrating another configuration example of the electronic device of one embodiment of the present invention.
- An electronic device 10C shown in FIG. 8D has a display device 30C and a computer 20.
- the display device 30 ⁇ /b>C has a display section 11 having a camera 12 , a camera 13_1 , a camera 13_2 , a frame 15 , and a communication section 16 .
- the computer 20 has an image processing section 14 , a housing 25 and a communication section 26 .
- the display unit 11 is provided in the housing of the display device 30 ⁇ /b>C, and the image processing unit 14 is provided in the housing 25 of the computer 20 . That is, in the electronic device 10C, the display section 11 is provided in the first housing, and the image processing section 14 is provided in the second housing.
- the electronic device 10B shown in FIGS. 8A to 8C or the electronic device 10C shown in FIG. 8D is used to detect and track the line of sight of a subject, one or both of the cameras 13_1 and 13_2 may be used.
- the electronic device 10B shown in FIGS. 8A to 8C or the electronic device 10C shown in FIG. 8D may include two or more cameras 12 in the display section 11.
- the cameras 13_1 and 13_2 are used as stereo cameras (also called parallax cameras).
- FIG. 9 is a flow chart showing an example of a method for generating an avatar. Note that the method for generating the avatar shown in FIG. 9 will be described using the electronic device 10C shown in FIG. 8D. 10A to 10D are schematic diagrams explaining part of the processing shown in FIG.
- the method for generating an avatar has steps S21 to S26, as shown in FIG.
- Step S21 is a step in which each of the camera 12, camera 13_1, and camera 13_2 photographs a subject.
- An image 51 is generated by the camera 12 photographing a subject.
- an image 52_1 is generated by photographing the subject with the camera 13_1.
- an image 52_2 is generated by the camera 13_2 photographing the subject.
- image 51 is a blurred image compared to images 52_1 and 52_2 (FIG. 10A).
- Step S22 is a process in which the image 51, image 52_1, and image 52_2 are input to the computer 20 via the communication unit 16 and the communication unit 26.
- step S22 can be omitted because the electronic device 10B includes the image processing unit 14.
- Step S23 is a step of inputting the image 51 to the image processing unit 14 and generating an image 54.
- the description of step S03 can be referred to for step S23.
- Step S24 is a step of recognizing the face of the subject from the image 54 using the image processing unit 14.
- the image processing section 14 has a function of recognizing the face of the subject from the image 54 .
- FIG. 10B A method of measuring the position, the distance between the feature points 56, and the like can be used. At this time, the subject's face is perceived as a plane (two-dimensional). Although twenty feature points 56 are extracted in FIG. 10B, the number of feature points 56 to be extracted may be 19 or less, or 21 or more.
- the method of recognizing the face of the subject is not limited to the above.
- the image 54 used in the process of recognizing the subject's face is a clear image 51. Furthermore, an image 51 is an image captured from a direction close to the front of the subject. Therefore, by using the image 54, it becomes easier to extract the features of the subject's face, and the subject's face can be recognized with high accuracy.
- Step S25 is a step of inputting the image 52_1 and the image 52_2 into the image processing unit 14 and recognizing the three-dimensional shape of the subject's face (FIG. 10C). That is, the image processing unit 14 has a function of recognizing the three-dimensional shape of the subject's face from the images 52_1 and 52_2. Note that the three-dimensional shape of the subject's face described in this specification and the like may also be referred to as the orientation of the subject's face.
- the avatar generation method described in this section uses the cameras 13_1 and 13_2 as stereo cameras. This makes it possible to obtain three-dimensional information of the subject's face. That is, it is possible to recognize the three-dimensional shape of the subject's face. Note that the three-dimensional shape of the subject's face may be recognized from the images 52_1 and 52_2 captured by the cameras 13_1 and 13_2 using a neural network.
- Step S26 is a step of generating an avatar 55 from the recognized subject's face and the three-dimensional shape of the recognized subject's face using the image processing unit 14 (FIG. 10D). That is, the image processing unit 14 has a function of generating the avatar 55 from the subject's face and the three-dimensional shape of the subject's face.
- the avatar 55 may be a person in which the subject's facial features (eyes, nose, mouth, eyebrows, forehead, outline, etc.) are reflected, or may be a person who reflects the subject's facial features (eyes, nose, mouth, eyebrows, forehead, and so on).
- the subject may be a person whose outline, etc.) is partially emphasized, or a person different from the subject.
- avatar 55 may be an animal or an illustration.
- FIG. 10D illustrates, as generated avatars 55, an avatar of a cat facing front and an avatar of a cat facing sideways.
- An avatar can also be called an object, a character, or the like.
- step S26 is a step of generating the avatar 55 from the recognized subject's face using the image processing unit 14 and adjusting the orientation of the avatar 55 so as to match the three-dimensional shape of the recognized subject's face.
- the electronic device 10C by combining the feature points 56 acquired from the camera 12 and the three-dimensional shape of the subject's face acquired from the cameras 13_1 and 13_2, the electronic device 10C generates the avatar 55 linked to the movement of the subject's face, Communication using the avatar 55 can be made smoother.
- the avatar 55 reflecting the facial expression of the subject and the three-dimensional shape of the subject's face can be continuously generated.
- the avatar 55 is generated from the subject's face captured as a plane (two-dimensional), and the orientation of the avatar 55 is adjusted so as to match the three-dimensional shape of the recognized subject's face.
- the subject's face may be stereoscopically (three-dimensionally) captured.
- the subject's face may be stereoscopically (three-dimensionally) captured from the image 54 and at least one of the images 52_1 and 52_2.
- Electronic device 10 shown in FIGS. 1A and 1B has a configuration in which display unit 11 includes one camera 12 .
- the number of cameras 12 included in the display unit 11 is not limited to one.
- the display unit 11 may include two or more cameras 12 . It should be noted that portions different from the configuration example 1 described above will be mainly described, and descriptions of overlapping portions will be omitted.
- FIG. 11A is a block diagram illustrating a configuration example of an electronic device of one embodiment of the present invention.
- Electronic device 10D shown in FIG. 11A is different from electronic device 10 shown in FIG. 1A in that display unit 11 includes five cameras 12 .
- an electronic device 10D shown in FIG. 11A has a display section 11, a camera 13, and an image processing section .
- the display unit 11 also includes five cameras 12 (cameras 12_1 to 12_5).
- FIG. 11B is a perspective view showing a configuration example of the electronic device 10D shown in FIG. 11A.
- the electronic device 10D has a display unit 11 including cameras 12_1 to 12_5, a camera 13, an image processing unit 14, and a frame 15. Note that the cameras 12_2 to 12_5 shown in FIG. 11B are radially arranged around the camera 12_1, but the arrangement of the plurality of cameras 12 is not limited to this.
- the multiple cameras 12 may be arranged in a matrix.
- the electronic device 10D may have two or more cameras 13 .
- FIG. 11B illustrates a configuration in which the display unit 11 and the image processing unit 14 are provided in a single housing
- the present invention is not limited to this.
- the display unit 11 and the image processing unit 14 may be provided in different housings.
- an electronic device of one embodiment of the present invention may include a display device and a calculator. Examples of such computers include personal computers and servers.
- FIG. 11C is a perspective view illustrating another configuration example of an electronic device of one embodiment of the present invention.
- An electronic device 10E shown in FIG. 11C has a display device 30E and a computer 20.
- the display device 30E includes a display unit 11 including cameras 12_1 to 12_5, a camera 13, a frame 15, and a communication unit 16.
- the computer 20 has an image processing section 14 , a housing 25 and a communication section 26 .
- the display unit 11 is provided in the housing of the display device 30E, and the image processing unit 14 is provided in the housing 25 of the computer 20.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- FIGS. 12A and 12B show an example of a remote meeting using five electronic devices (electronic devices 1000_1 to 1000_5).
- the electronic device used for the remote meeting is preferably the electronic device described in the previous embodiment.
- the remote meeting is assumed to be an online meeting in which five users (users 1020_1 to 1020_5) participate.
- users 1020_1 to 1020_5 use electronic devices 1000_1 to 1000_5, respectively.
- FIGS. 12A and 12B Display examples of the electronic device 1000_1 and the electronic device 1000_2 when the user 1020_2 is speaking are shown in FIGS. 12A and 12B, respectively.
- An electronic device 1000_1 shown in FIG. 12A and an electronic device 1000_2 shown in FIG. 12B have five cameras 12 (cameras 12_1 to 12_5) like the electronic device 10D shown in FIG. 11B. Note that the image processing unit 14 is not illustrated in FIGS. 12A and 12B.
- FIG. 12A is a display example of the electronic device 1000_1.
- the display unit 11 of the electronic device 1000_1 displays an image 1010_2 captured by the camera of the electronic device 1000_2, an image 1010_3 captured by the camera of the electronic device 1000_3, an image 1010_4 captured by the camera of the electronic device 1000_4, and an image of the electronic device 1000_5.
- An image 1010_5 captured by the camera having the display is displayed.
- Images 1010_2 to 1010_5 include users 1020_2 to 1020_5, respectively.
- FIG. 12B is a display example of the electronic device 1000_2.
- the display unit 11 of the electronic device 1000_2 displays an image 1010_1 captured by the camera of the electronic device 1000_1, an image 1010_3 captured by the camera of the electronic device 1000_3, an image 1010_4 captured by the camera of the electronic device 1000_4, and an image of the electronic device 1000_5.
- An image 1010_5 captured by the camera having the display is displayed.
- Image 1010_1, image 1010_3, image 1010_4, and image 1010_5 include user 1020_1, user 1020_3, user 1020_4, and user 1020_5, respectively.
- one of the cameras 12_1 to 12_5 of the electronic device 1000_1 is activated.
- the electronic device 1000_1 detects a user who is speaking (user 1020_2) and detects an image (image 1010_2) including the user who is speaking. ) or closest to the image (camera 12_2 in FIG. 12A). Since the line of sight of a person looking at the display unit 11 naturally tends to be directed toward the speaker, by using this method, it is possible to activate the camera close to the viewpoint of the user 1020_1 on the display unit 11. can.
- a method of detecting the user who is speaking by the electronic device 1000_1 for example, a method of detecting an image in which the movement of the subject is the largest or the coordinates of the display unit 11 from among the images 1010_2 to 1010_5; A method of detecting an image in which the subject's voice is the loudest, which is acquired by a microphone of each electronic device 1000_5, or the like can be used.
- the method of activating one of the cameras 12_1 to 12_5 is not limited to the above.
- the electronic device 1000_1 may activate one of the cameras 12_1 to 12_5 by detecting the line of sight of the user 1020_1.
- a user 1020_1 gazes at an image 1010_2 in which a speaking user (user 1020_2) is displayed.
- electronic device 1000_1 detects the line of sight of user 1020_1 using the line of sight tracking method described in the first embodiment.
- electronic device 1000_1 estimates viewpoint 1030_1 of user 1020_1 on display unit 11 based on the detected line of sight.
- the electronic device 1000_1 activates the camera (the camera 12_2 in FIG.
- the function of activating one of the cameras 12_1 to 12_5 may be included in the image processing unit included in the electronic device 1000_1, or may be included in a calculation unit other than the image processing unit included in the electronic device 1000_1.
- the electronic device 1000_1 uses the activated camera (the camera 12_2 in FIG. 12A) and the camera 13 to photograph the user 1020_1. Two images are generated by the photographing. Electronic device 1000_1 generates a clear image of user 1020_1 using the method of sharpening the subject image described in the first embodiment. A clear image includes user 1020_1 looking at a speaking user (user 1020_2).
- the function of sharpening an image generated using an active camera may be included in the image processing unit included in the electronic device 1000_1, or may be included in a calculation unit other than the image processing unit included in the electronic device 1000_1. good.
- the image processing unit has the generator described in Embodiment 1, the above function is a function of sharpening an image generated using an active camera by inputting the image to the generator. can be paraphrased.
- the electronic device 1000_1 transmits a clear image to the electronic device (electronic device 1000_2) used by the user 1020_2.
- the electronic device 1000_2 receives the clear image and displays it on the display unit 11 of the electronic device 1000_2. Note that the clear image corresponds to the image 1010_1 shown in FIG. 12B. By visually recognizing the image 1010_1, the user 1020_2 comes to have eye contact with the user 1020_1.
- the user who is speaking and the user who is paying attention to the speech can have a remote meeting while keeping their eyes on each other. Therefore, communication in a remote meeting becomes smooth, and a remote meeting with a high sense of presence can be held.
- the remote meeting may be held by replacing the user displayed on the electronic device with an avatar.
- the avatar displayed on the electronic device is preferably generated using the method for generating the avatar described in the first embodiment. Since the avatar reflects the subject's facial expression, the direction of the subject's face, and the like, it is possible to hold a remote meeting with a high degree of presence while reducing the user's tension.
- the image 1010_4 displayed on the display unit 11 of the electronic device 1000_1 may be an image captured by the camera 13 of the electronic device 1000_4. That is, the image 1010_4 displayed on the display unit 11 of the electronic device 1000_1 may be an image of the user 1020_4 captured from an oblique direction.
- the remote meeting is held using five electronic devices (electronic devices 1000_1 to 1000_5). It may be 4 or less, or 6 or more.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- FIGS. 13A and 13B show an example of a remote meeting using five electronic devices (electronic devices 2000_1 to 2000_5).
- the electronic device used for the remote meeting is preferably the electronic device described in the previous embodiment.
- the above remote meeting is a remote lecture. It is assumed that one lecturer (lecturer 2020_1) and four students (students 2020_2 to 2020_5) are participating in the remote lecture. If the remote lecture is a remote lesson (online lesson) at a school, the lecturer should be read as a teacher or host, and the student should be read as a student, client, or guest.
- the remote lecture is a remote lesson (online lesson) at a school
- the lecturer should be read as a teacher or host, and the student should be read as a student, client, or guest.
- a lecturer 2020_1 uses an electronic device 2000_1, and students 2020_2 to 2020_5 use electronic devices 2000_2 to 2000_5, respectively.
- FIG. 13A is a diagram illustrating a usage example of the electronic devices 2000_2 to 2000_5.
- FIG. 13A shows students 2020_2 to 2020_5 taking remote lectures at their homes, cafes, coworking spaces, or the like.
- FIG. 13A shows a student 2020_2 gazing at the display unit of the electronic device 2000_2. Also, the student 2020_3 is shown to be gazing at the display unit of the electronic device 2000_3. Further, the student 2020_4 is shown to be gazing at the display unit of the electronic device 2000_4. A student 2020_5 does not look at the display of the electronic device 2000_5.
- the electronic device 2000_2 detects the line of sight of the student 2020_2 using the line of sight tracking method described in the first embodiment. Furthermore, the electronic device 2000_2 estimates the viewpoint of the student 2020_2 on the display section of the electronic device 2000_2 based on the detected line of sight. Similarly, the electronic device 2000_3 estimates the viewpoint of the student 2020_3 on the display of the electronic device 2000_3, and the electronic device 2000_4 estimates the viewpoint of the student 2020_4 on the display of the electronic device 2000_4.
- the electronic device 2000_5 detects the line of sight of the student 2020_5. Since the student 2020_5 is not looking at the display of the electronic device 2000_5, the electronic device 2000_5 presumes that the viewpoint of the student 2020_5 is not on the display of the electronic device 2000_5.
- the electronic devices 2000_2 to 2000_5 respectively transmit information about the estimated viewpoints of the students 2020_2 to 2020_5 to the electronic device 2000_1.
- the information includes the coordinates of the display unit, the stay time of the viewpoint at the coordinates, and the like.
- the estimation of the viewpoints of the students 2020_2 to 2020_5 of the electronic devices 2000_2 to 2000_5 is preferably performed while the remote lecture is being conducted.
- FIG. 13B is a diagram illustrating a usage example of the electronic device 2000_1.
- FIG. 13B shows a display example of the electronic device 2000_1.
- Electronic data to be used is displayed.
- the display unit 11 of the electronic device 2000_1 displays information about the viewpoints of the students 2020_2 to 2020_5 received from the electronic devices 2000_2 to 2000_5.
- the display unit 11 of the electronic device 2000_1 shown in FIG. 13B outputs the viewpoint 2030_2 of the student 2020_2, the viewpoint 2030_3 of the student 2020_3, and the viewpoint 2030_4 of the student 2020_4.
- the viewpoint of the student 2020_5 is not displayed on the display section 11 of the electronic device 2000_1 because it is not positioned on the display section.
- the lecturer 2020_1 visually recognizes the display unit 11 of the electronic device 2000_1 while conducting remote lectures in a conference room, office, or the like (in the case of distance learning at school, a regular classroom, a special classroom, or the like).
- the lecturer 2020_1 can easily know where the student is paying attention by recognizing the student's viewpoint output to the display unit 11 of the electronic device 2000_1. Therefore, the lecturer 2020_1 can know the reactions of the students without asking questions to the students.
- the lecturer 2020_1 can recognize that the student 2020_5 is not concentrating on the remote lecture due to looking away or falling asleep. Therefore, the lecturer 2020_1 can speak to the student 2020_5 or ask a question to encourage the student 2020_5 to regain concentration on the remote class.
- the remote lecture is conducted using five electronic devices (the electronic devices 2000_1 to 2000_5). It may be 4 or less, or 6 or more.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- FIG. 14A shows a top view of a display portion included in an electronic device of one embodiment of the present invention.
- FIG. 14B shows a cross-sectional view along the dashed-dotted line A1-A2 in FIG. 14A.
- the display unit 109 has a display area 109l and a display area 109h.
- the display area 109l is the area inside the circle indicated by the dashed line in FIG. 14A
- the display area 109h is the area outside the circle indicated by the dashed line in FIG. 14A. That is, the display area 109h is positioned around the display area 109l.
- a camera 104 is provided in an area overlapping with the display area 109l.
- the display unit 109 corresponds to the display unit 11 described in the first embodiment, and the camera 104 corresponds to the camera 12 described in the first embodiment.
- a plurality of pixels 110 are arranged in each of the display area 109h and the display area 109l.
- a plurality of pixels 110 are arranged in a matrix in the display region 109h.
- the plurality of pixels 110 are radially arranged from the center of the display area 109l. Note that the plurality of pixels 110 may be arranged in a matrix in the display region 109l.
- FIG. 14A exemplifies the case where the top surface shape of the pixel 110 is square, the shape is not limited to this.
- Examples of top surface shapes of the pixels 110 include triangles, quadrilaterals (including rectangles and squares), polygons such as pentagons, polygons with rounded corners, ellipses, and circles.
- the number of pixels 110 per unit area in the display area 109l is preferably smaller than the number of pixels 110 per unit area in the display area 109h.
- the pixel density in the display area 109l is preferably lower than the pixel density in the display area 109h.
- the display unit 109 preferably has a display area 109h and a display area 109l having a lower pixel density than the display area 109h.
- the plurality of pixels 110 arranged in the display region 109h and the plurality of pixels 110 arranged in the display region 109l are provided on the substrate 107.
- the camera 104 is provided below the substrate 107 in a region overlapping the display region 109l. By providing the camera 104 so as to overlap with the display area 109l, the amount of external light 105 detected by the camera 104 can be increased.
- the area of the pixels 110 arranged in the display region 109h and the area of the pixels 110 arranged in the display region 109l may be different. That is, the area of the pixels 110 arranged in the display region 109l may be larger or smaller than the area of the pixels 110 arranged in the display region 109h.
- the ratio of the pixels 110 per unit area in the display region 109l is preferably smaller than the ratio of the pixels 110 per unit area in the display region 109h.
- the camera 104 takes an image by detecting the external light 105 that has passed through the substrate 107 . Therefore, the substrate 107 needs to transmit visible light. Therefore, the substrate 107 preferably has a property of transmitting visible light.
- the substrate 107 includes glass, quartz, ceramic, sapphire, insulators such as zirconia stabilized (yttria stabilized zirconia, etc.), resins such as insulating resins or conductive resins, silicon, germanium, silicon carbide, silicon germanium. , gallium arsenide, indium phosphide, or zinc oxide, metals, alloys, and the like.
- insulators such as zirconia stabilized (yttria stabilized zirconia, etc.)
- resins such as insulating resins or conductive resins, silicon, germanium, silicon carbide, silicon germanium. , gallium arsenide, indium phosphide, or zinc oxide, metals, alloys, and the like.
- a polarizing plate may be used as the substrate 107 .
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, and polyethersulfone (PES) resins are used.
- polyamide resin nylon, aramid, etc.
- polysiloxane resin cycloolefin resin
- polystyrene resin polyamideimide resin
- polyurethane resin polyvinyl chloride resin
- polyvinylidene chloride resin polypropylene resin
- PTFE polytetrafluoroethylene
- ABS resin cellulose nanofiber, or the like
- glass having a thickness that is flexible may be used.
- An optical system such as a lens, a reflector, or a half mirror may be provided between the substrate 107 and the camera 104.
- Light can be collected by providing a lens between the substrate 107 and the camera 104 .
- a reflector between the substrate 107 and the camera 104, the path of light can be changed.
- a reflector can be used to guide light transmitted through the substrate 107 overlapping the display area 109l to the camera 104 located in the area overlapping the display area 109h. Therefore, the degree of freedom in arranging the camera 104 can be increased.
- the pixel 110 preferably has a light emitting device.
- light-emitting devices include organic EL (Electro Luminescence) devices and light-emitting diodes (LEDs).
- the basic configuration of an organic EL device is, for example, sandwiching a layer containing a light-emitting organic compound between a pair of electrodes. By applying a voltage to this device, light can be obtained from the light-emitting organic compound.
- a display device to which such an organic EL device is applied does not require a backlight, which is required in a liquid crystal display device, and thus can realize a thin, lightweight, high-contrast display device with low power consumption.
- a pixel 110 having an organic EL device will be described in an embodiment described later.
- the light-emitting diode is a self-luminous device
- the display device does not require a backlight and does not need to be provided with a polarizing plate. Therefore, the power consumption of the display device can be reduced, and the thickness and weight of the display device can be reduced.
- a display device to which such a light-emitting diode is applied can increase the luminance (for example, 5000 cd/m 2 or more, preferably 10000 cd/m 2 or more), and has a high contrast and a wide viewing angle. High display quality can be obtained.
- the life of the display device can be extended and the reliability can be improved.
- an LED having a double heterojunction an LED having a quantum well junction, an LED using nanocolumns, or the like may be used.
- the area of the light emitting region of the light-emitting diode is preferably 1 mm 2 or less, more preferably 10000 ⁇ m 2 or less, more preferably 3000 ⁇ m 2 or less, and even more preferably 700 ⁇ m 2 or less.
- the area of the region is preferably 1 ⁇ m 2 or more, preferably 10 ⁇ m 2 or more, and more preferably 100 ⁇ m 2 or more.
- a light-emitting diode whose light emitting region has an area of 10000 ⁇ m 2 or less may be referred to as a micro LED or a micro light-emitting diode.
- the camera 104 has a function of acquiring a captured image according to incident light.
- a CCD (Charge Coupled Device) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor may be used.
- FIG. 15A shows a top view of a display portion included in an electronic device of one embodiment of the present invention.
- FIG. 15B shows a cross-sectional view along the dashed-dotted line A1-A2 in FIG. 15A.
- the display unit 109 shown in FIGS. 15A and 15B differs from the display unit 109 shown in FIGS. 14A and 14B in that a plurality of pixels 110 are arranged uniformly.
- the substrate 107 and the plurality of pixels 110 preferably transmit visible light. Since the substrate 107 and the plurality of pixels 110 transmit visible light, the amount of external light 105 detected by the camera 104 can be increased.
- the light-emitting device included in the pixel 110 is a light-emitting device having an EL layer between a pair of electrodes
- a light-transmitting transistor such as an organic transistor using an organic semiconductor material or a transistor using an oxide semiconductor is preferably used.
- FIG. 16A shows a top view of a display portion included in an electronic device of one embodiment of the present invention.
- FIG. 16B shows a cross-sectional view along the dashed-dotted line A1-A2 in FIG. 16A.
- a display unit 109 shown in FIG. 16A has a plurality of pixels 110 and a plurality of imaging pixels 106 uniformly arranged.
- the multiple imaging pixels 106 function as an imaging unit. That is, imaging data is acquired using a plurality of imaging pixels 106 .
- the imaging pixel 106 has, for example, a photoelectric conversion device (also referred to as a photoelectric conversion element or an imaging element) and four transistors (amplification transistor, reset transistor, transfer transistor, and selection transistor). Note that the imaging pixels 106 may have capacitance. Also, the imaging pixel 106 may not have a selection transistor. Also, the imaging pixel 106 may have a plurality of photoelectric conversion devices and four transistors. Also, the plurality of imaging pixels 106 may share a reset transistor, an amplification transistor, and a selection transistor.
- the plurality of pixels 110 and the plurality of imaging pixels 106 are provided on the substrate 107 .
- the imaging section and the pixels included in the display section are arranged on the same layer.
- FIG. 17A shows a top view of a display portion included in an electronic device of one embodiment of the present invention. Moreover, FIG. 17B shows a cross-sectional view along the dashed-dotted line A1-A2 in FIG. 17A.
- a plurality of pixels 110 are uniformly arranged in the display unit 109 shown in FIGS. 17A and 17B. Also, an imaging pixel 106 is provided for each of the plurality of pixels 110 . With such a structure, definition or resolution of the display portion can be increased.
- This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.
- One embodiment of the present invention is a display panel having a display portion capable of full-color display.
- the display unit has first sub-pixels and second sub-pixels that emit different colors of light.
- the first subpixel has a first light emitting device that emits blue light and the second subpixel has a second light emitting device that emits light of a different color than the first light emitting device.
- the first light emitting device and the second light emitting device comprise at least one different material, for example different light emitting materials.
- the display panel of one embodiment of the present invention uses light-emitting devices that are separately manufactured for each emission color.
- a structure in which light-emitting layers are separately formed or painted separately for light-emitting devices of each color is sometimes called an SBS (side-by-side) structure.
- SBS side-by-side
- the material and structure can be optimized for each light-emitting device, so the degree of freedom in selecting the material and structure increases, and it becomes easy to improve luminance and reliability.
- the intensity of the first emission peak at a wavelength of 400 nm or more and less than 500 nm in the emission spectrum when blue is displayed on the display portion at the first luminance is set to 1
- the intensity of the second emission peak at a wavelength of 500 nm or more and 700 nm or less is 0 or more and 0.5 or less
- the first luminance is any value between 0 cd/m 2 and less than 1 cd/m 2 . That is, in the display panel of one embodiment of the present invention, when blue is displayed at low luminance, blue light is mainly observed, and light with a longer wavelength than blue is hardly observed (including cases where it is not substantially observed). ).
- a light-emitting device having a single structure having a structure having only one light-emitting unit
- a plurality of light-emitting layers that emit light of different colors
- the color of the emitted light may change.
- the emission color may change between low-luminance light emission and high-luminance light emission.
- a light-emitting device with an SBS structure that emits light of red, green, blue, or the like is easier to adjust the carrier balance than a light-emitting device with a single structure that emits white light.
- the emission color does not easily change between the two. Therefore, the display panel of one embodiment of the present invention can achieve high display quality with little change in color between low-luminance display and high-luminance display.
- an island-shaped light-emitting layer can be formed by a vacuum deposition method using a metal mask (also called a shadow mask).
- a metal mask also called a shadow mask
- island-like structures are formed due to various influences such as precision of the metal mask, misalignment between the metal mask and the substrate, bending of the metal mask, and broadening of the contour of the deposited film due to vapor scattering.
- the shape and position of the light-emitting layer in (1) deviate from the design, it is difficult to achieve high definition and high aperture ratio.
- the layer profile may be blurred and the edge thickness may be reduced. In other words, the thickness of the island-shaped light-emitting layer may vary depending on the location.
- the manufacturing yield will be low due to low dimensional accuracy of the metal mask and deformation due to heat or the like.
- a first layer (which can be referred to as an EL layer or part of an EL layer) including a light-emitting layer that emits light of a first color is formed over one surface.
- a first sacrificial layer (which may be called a mask layer) is formed on the first layer.
- a first resist mask is formed over the first sacrificial layer, and the first layer and the first sacrificial layer are processed using the first resist mask, thereby forming an island-shaped first layer.
- a second layer (which can be called an EL layer or part of an EL layer) including a light-emitting layer that emits light of a second color is formed as a second sacrificial layer. and an island shape using a second resist mask.
- a structure in which the light-emitting layer is processed using a photolithography method can be considered.
- the light-emitting layer may be damaged (damage due to processing, etc.) and the reliability may be significantly impaired. Therefore, when a display panel of one embodiment of the present invention is manufactured, a layer located above the light-emitting layer (for example, a carrier-transport layer or a carrier-injection layer, more specifically an electron-transport layer or an electron-injection layer) etc.) to form a sacrificial layer or the like to process the light-emitting layer into an island shape.
- a layer located above the light-emitting layer for example, a carrier-transport layer or a carrier-injection layer, more specifically an electron-transport layer or an electron-injection layer
- the island-shaped EL layer manufactured by the method for manufacturing a display panel of one embodiment of the present invention is not formed using a metal mask having a fine pattern, but the EL layer is formed over the entire surface. It is formed by processing after Therefore, it is possible to realize a high-definition display panel or a display panel with a high aperture ratio, which has hitherto been difficult to achieve. Furthermore, since the EL layer can be separately formed for each color, a display panel with extremely vivid, high-contrast, and high-quality display can be realized. In addition, by providing the sacrificial layer over the EL layer, damage to the EL layer during the manufacturing process of the display panel can be reduced, and the reliability of the light-emitting device can be improved.
- the distance between adjacent light-emitting devices can be narrowed down to Also, for example, by using an exposure apparatus for LSI, the distance between adjacent light emitting devices can be narrowed to 500 nm or less, 200 nm or less, 100 nm or less, or even 50 nm or less.
- the aperture ratio can be brought close to 100%.
- the aperture ratio can be 50% or more, 60% or more, 70% or more, 80% or more, or even 90% or more, and less than 100%.
- the pattern of the EL layer itself (which can be said to be a processing size) can also be made much smaller than when a metal mask is used.
- the thickness of the light-emitting layer varies between the center and the edge, so the effective area that can be used as the light-emitting region is smaller than the area of the light-emitting layer.
- an island-shaped EL layer can be formed with a uniform thickness. Therefore, almost the entire area of even a fine pattern can be used as a light emitting region. Therefore, a display panel having both high definition and high aperture ratio can be manufactured.
- a layer including a light-emitting layer (which can be referred to as an EL layer or part of the EL layer) is formed over one surface
- a sacrificial layer is formed over the EL layer. preferably formed.
- an island-shaped EL layer is preferably formed by forming a resist mask over the sacrificial layer and processing the EL layer and the sacrificial layer using the resist mask.
- the first layer and the second layer each include at least a light-emitting layer, and preferably consist of a plurality of layers. Specifically, it is preferable to have one or more layers on the light-emitting layer. By providing another layer between the light-emitting layer and the sacrificial layer, the light-emitting layer is prevented from being exposed to the outermost surface during the manufacturing process of the display panel, and damage to the light-emitting layer can be reduced. This can improve the reliability of the light emitting device. Therefore, each of the first layer and the second layer preferably has a light-emitting layer and a carrier-transporting layer (electron-transporting layer or hole-transporting layer) on the light-emitting layer.
- a carrier-transporting layer electron-transporting layer or hole-transporting layer
- the layers included in the EL layer include a light emitting layer, a carrier injection layer (hole injection layer and electron injection layer), a carrier transport layer (hole transport layer and electron transport layer), and a carrier block layer (hole block layer and electron block layer).
- a layer and a common electrode are formed in common (as one film) for each color.
- a carrier injection layer and a common electrode can be formed in common for each color.
- holes or electrons are sometimes referred to as "carriers".
- the hole injection layer or electron injection layer is referred to as a "carrier injection layer”
- the hole transport layer or electron transport layer is referred to as a “carrier transport layer”
- the hole blocking layer or electron blocking layer is referred to as a "carrier It is sometimes called a block layer.
- the carrier injection layer, the carrier transport layer, and the carrier block layer described above may not be clearly distinguished from each other due to their cross-sectional shape, characteristics, or the like.
- one layer may serve as two or three functions of the carrier injection layer, the carrier transport layer, and the carrier block layer.
- the carrier injection layer is often a layer with relatively high conductivity among the EL layers. Therefore, the light-emitting device may be short-circuited when the carrier injection layer comes into contact with the side surface of a part of the EL layer formed like an island or the side surface of the pixel electrode. Note that even in the case where the carrier injection layer is provided in an island shape and the common electrode is formed commonly for each color, the common electrode is in contact with the side surface of the EL layer or the side surface of the pixel electrode. there is a risk of
- the display panel of one embodiment of the present invention has an insulating layer covering at least the side surface of the island-shaped light-emitting layer.
- the side surface of the island-shaped light-emitting layer as used herein refers to a surface of the interface between the island-shaped light-emitting layer and another layer that is not parallel to the substrate (or the surface on which the light-emitting layer is formed). Also, it is not necessarily a mathematically exact plane or curved surface.
- the insulating layer preferably functions as a barrier insulating layer against at least one of water and oxygen. Further, the insulating layer preferably has a function of suppressing diffusion of at least one of water and oxygen. In addition, the insulating layer preferably has a function of capturing or fixing at least one of water and oxygen (also referred to as gettering).
- a barrier insulating layer indicates an insulating layer having barrier properties.
- barrier property refers to a function of suppressing diffusion of a corresponding substance (also referred to as low permeability).
- the corresponding substance has a function of capturing or fixing (also called gettering).
- an insulating layer having a function as a barrier insulating layer or a gettering function it is possible to suppress entry of impurities (typically, at least one of water and oxygen) that can diffuse into each light-emitting device from the outside. possible configuration. With such a structure, a highly reliable light-emitting device and a highly reliable display panel can be provided.
- impurities typically, at least one of water and oxygen
- a display panel of one embodiment of the present invention includes a pixel electrode functioning as an anode, and an island-shaped hole-injection layer, a hole-transport layer, a light-emitting layer, and an electron layer provided in this order on the pixel electrode.
- a common electrode provided on the electron injection layer and functioning as a cathode;
- the display panel of one embodiment of the present invention includes a pixel electrode functioning as a cathode, and an island-shaped electron-injection layer, an electron-transport layer, a light-emitting layer, and a positive electrode which are provided in this order over the pixel electrode.
- a hole injection layer or an electron injection layer is often a layer with relatively high conductivity among EL layers.
- the side surfaces of these layers are covered with the insulating layer; thus, contact with a common electrode or the like can be suppressed. Therefore, short-circuiting of the light-emitting device can be suppressed, and the reliability of the light-emitting device can be improved.
- the insulating layer covering the side surface of the island-shaped EL layer may have a single-layer structure or a laminated structure.
- the insulating layer can be used as a protective insulating layer for the EL layer. Thereby, the reliability of the display panel can be improved.
- the first insulating layer is preferably formed using an inorganic insulating material because it is formed in contact with the EL layer.
- an atomic layer deposition (ALD) method which causes less film damage.
- the inorganic insulating layer is formed using a sputtering method, a chemical vapor deposition (CVD) method, or a plasma enhanced CVD (PECVD) method, which has a higher film formation rate than the ALD method. preferably formed. Accordingly, a highly reliable display panel can be manufactured with high productivity.
- the second insulating layer is preferably formed using an organic material so as to planarize the concave portion formed in the first insulating layer.
- an aluminum oxide film formed by an ALD method can be used as the first insulating layer, and an organic resin film can be used as the second insulating layer.
- the organic solvent contained in the organic resin film may damage the EL layer.
- an inorganic insulating film such as an aluminum oxide film formed by an ALD method as the first insulating layer, the organic resin film and the side surface of the EL layer are not in direct contact with each other. This can prevent the EL layer from being dissolved by the organic solvent.
- the display panel of one embodiment of the present invention it is not necessary to provide an insulating layer covering the end portion of the pixel electrode between the pixel electrode and the EL layer; can. Therefore, it is possible to achieve high definition or high resolution of the display panel. Moreover, a mask for forming the insulating layer is not necessary, and the manufacturing cost of the display panel can be reduced.
- the display panel of one embodiment of the present invention can have extremely low viewing angle dependency. By reducing the viewing angle dependency, the visibility of the image on the display panel can be improved.
- the viewing angle (the maximum angle at which a constant contrast ratio is maintained when the screen is viewed obliquely) is 100° or more and less than 180°, preferably 150°. It can be in the range of 170° or more. It should be noted that the above viewing angle can be applied to each of the vertical and horizontal directions.
- the configuration for suppressing crosstalk is not limited to the configuration in which an island-shaped EL layer is formed for each light emitting device.
- crosstalk can be suppressed by applying a structure in which a region having a thin EL layer is formed between adjacent light emitting devices. Since the thin EL layer exists between the adjacent light-emitting devices, it is possible to suppress the flow of current outside the region of the EL layer that is in contact with the pixel electrode. Further, a region in contact with the pixel electrode in the EL layer can be mainly used as a light emitting region.
- T1/T2 is preferably 0.5 or more, more preferably 0.8 or more, more preferably 1.0 or more, and 1.5. The above is more preferable.
- the insulating layer forming the surface on which the pixel electrode is formed has a concave portion in the region between the adjacent light emitting devices (see the insulating layer 255c (FIG. 18B, etc.) described later), the pixel In some cases, the thickness T1 of the electrode may be small.
- T3/T2 is preferably 0.5 or more, more preferably 0.8 or more, and 1 .0 or more is more preferable, and 1.5 or more is even more preferable.
- the thickness T1 or the sum T3 of the pixel electrode is, for example, 160 nm or more, 200 nm or more, or 250 nm or more, and 1000 nm or less, 750 nm or less, 500 nm or less, 400 nm or less, or 300 nm or less. preferably.
- the angle formed by the side surface of the pixel electrode and the substrate surface (or the formation surface) is preferably 60° or more and 140° or less, more preferably 70° or more and 140° or less. More preferably, it is 80° or more and 140° or less.
- the taper angle of the pixel electrode satisfies the above condition, it becomes easy to form a region having a thin EL layer between adjacent light emitting devices.
- Display panel configuration example 1 18 and 19 show a display panel of one embodiment of the present invention.
- FIG. 18A A top view of the display panel 100 is shown in FIG. 18A.
- the display panel 100 has a display section in which a plurality of pixels 110 are arranged, and a connection section 140 outside the display section.
- a plurality of sub-pixels are arranged in a matrix in the display section.
- FIG. 18A shows sub-pixels of 2 rows and 6 columns, which constitute pixels of 2 rows and 2 columns.
- the connection portion 140 can also be called a cathode contact portion.
- the above display section corresponds to the display section 11 described in the first embodiment. Also, the pixel 110 corresponds to the pixel 17 described in the first embodiment. Also, the pixel 110 corresponds to the pixel 110 described in the fourth embodiment.
- a stripe arrangement is applied to the pixels 110 shown in FIG. 18A.
- a pixel 110 shown in FIG. 18A is composed of three sub-pixels, sub-pixels 110a, 110b, and 110c.
- the sub-pixels 110a, 110b, 110c each have light emitting devices that emit different colors of light.
- the sub-pixels 110a, 110b, and 110c include sub-pixels of three colors of red (R), green (G), and blue (B), and sub-pixels of three colors of yellow (Y), cyan (C), and magenta (M).
- R red
- G green
- B blue
- M magenta
- a pixel etc. are mentioned.
- the number of types of sub-pixels is not limited to three, and may be four or more.
- the four sub-pixels are R, G, B, and white (W) sub-pixels, R, G, B, and Y sub-pixels, and R, G, B, infrared light ( IR), four sub-pixel
- the row direction is sometimes called the X direction
- the column direction is sometimes called the Y direction.
- the X and Y directions intersect, for example perpendicularly intersect (see FIG. 18A).
- FIG. 18A shows an example in which sub-pixels of different colors are arranged side by side in the X direction and sub-pixels of the same color are arranged side by side in the Y direction.
- FIG. 18A shows an example in which the connecting portion 140 is positioned below the display portion when viewed from above
- the connecting portion 140 may be provided at least one of the upper side, the right side, the left side, and the lower side of the display portion when viewed from above, and may be provided so as to surround the four sides of the display portion.
- the shape of the upper surface of the connecting portion 140 may be strip-shaped, L-shaped, U-shaped, frame-shaped, or the like.
- the number of connection parts 140 may be singular or plural.
- 18B and 19C show cross-sectional views between the dashed-dotted line X1-X2 in FIG. 18A.
- 19A and 19B show cross-sectional views along the dashed-dotted line Y1-Y2 in FIG. 18A.
- 20A, 20B, 21A to 21C, and 22A to 22C show side by side a cross-sectional view between dashed line X1-X2 and a cross-sectional view between dashed line Y1-Y2 in FIG. 18A.
- the display panel 100 includes an insulating layer on the layer 101, light emitting devices 130a, 130b, and 130c on the insulating layer, and a protective layer 131 covering the light emitting devices. is provided.
- a substrate 120 is bonded onto the protective layer 131 with a resin layer 122 .
- An insulating layer 125 and an insulating layer 127 on the insulating layer 125 are provided in a region between adjacent light emitting devices.
- the display panel 100 can be configured to have one insulating layer 125 and one insulating layer 127, for example.
- the display panel 100 may have a plurality of insulating layers 125 separated from each other, and may have a plurality of insulating layers 127 separated from each other.
- a display panel of one embodiment of the present invention is a top emission type in which light is emitted in a direction opposite to a substrate over which a light-emitting device is formed, and light is emitted toward a substrate over which a light-emitting device is formed.
- a bottom emission type bottom emission type
- a double emission type dual emission type in which light is emitted from both sides may be used.
- a stacked structure in which a plurality of transistors are provided on a substrate and an insulating layer is provided to cover these transistors can be applied.
- An insulating layer over a transistor may have a single-layer structure or a stacked-layer structure.
- 18B and the like show an insulating layer 255a, an insulating layer 255b over the insulating layer 255a, and an insulating layer 255c over the insulating layer 255b among the insulating layers over the transistor.
- These insulating layers may have recesses between adjacent light emitting devices.
- FIG. 18B and the like show examples in which recesses are provided in the insulating layer 255c.
- Various inorganic insulating films such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, and a nitride oxide insulating film can be preferably used as the insulating layer 255a, the insulating layer 255b, and the insulating layer 255c, respectively.
- an oxide insulating film or an oxynitride insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film is preferably used.
- a nitride insulating film or a nitride oxide insulating film such as a silicon nitride film or a silicon nitride oxide film is preferably used. More specifically, a silicon oxide film is preferably used for the insulating layers 255a and 255c, and a silicon nitride film is preferably used for the insulating layer 255b.
- the insulating layer 255b preferably functions as an etching protection film.
- oxynitride refers to a material whose composition contains more oxygen than nitrogen
- nitride oxide refers to a material whose composition contains more nitrogen than oxygen. point to the material.
- silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen
- silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen. indicates
- the light emitting devices 130a, 130b, and 130c each emit light of different colors.
- Light-emitting devices 130a, 130b, and 130c are preferably a combination that emits three colors of light, red (R), green (G), and blue (B), for example.
- Light-emitting substances included in the light-emitting device include substances that emit fluorescence (fluorescent materials), substances that emit phosphorescence (phosphorescent materials), and substances that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence). delayed fluorescence (TADF) material) and the like.
- an inorganic compound quantitative dot material etc. can also be used as a light emitting substance.
- the TADF material a material in which a singlet excited state and a triplet excited state are in thermal equilibrium may be used. Since such a TADF material has a short emission lifetime (excitation lifetime), it is possible to suppress a decrease in efficiency in a high-luminance region of a light-emitting device.
- a light-emitting device has an EL layer between a pair of electrodes.
- the EL layer has at least a light-emitting layer.
- one of a pair of electrodes may be referred to as a pixel electrode and the other may be referred to as a common electrode.
- one electrode functions as an anode and the other electrode functions as a cathode.
- the case where the pixel electrode functions as an anode and the common electrode functions as a cathode may be taken as an example.
- Each end of the pixel electrode 111a, the pixel electrode 111b, and the pixel electrode 111c preferably has a tapered shape.
- the first layer 113a, the second layer 113b, and the third layer 113c provided along the side surfaces of the pixel electrodes also have tapered shapes.
- the side surface of the pixel electrode coverage of the EL layer provided along the side surface of the pixel electrode can be improved.
- it is preferable that the side surface of the pixel electrode is tapered because foreign matter (eg, dust or particles) in the manufacturing process can be easily removed by a treatment such as cleaning.
- the tapered shape refers to a shape in which at least a part of the side surface of the structure is inclined with respect to the substrate surface or the formation surface.
- the light-emitting device 130a includes the pixel electrode 111a on the insulating layer 255c, the island-shaped first layer 113a on the pixel electrode 111a, the common layer 114 on the island-shaped first layer 113a, and the common layer 114 on the common layer 114. and a common electrode 115 .
- first layer 113a and common layer 114 can be collectively referred to as EL layers.
- the island shape indicates a state in which two or more layers formed in the same process using the same material are physically separated.
- an island-shaped light-emitting layer means that the light-emitting layer is physically separated from an adjacent light-emitting layer.
- the light-emitting device 130b includes the pixel electrode 111b on the insulating layer 255c, the island-shaped second layer 113b on the pixel electrode 111b, the common layer 114 on the island-shaped second layer 113b, and the common layer 114 on the common layer 114. and a common electrode 115 .
- second layer 113b and common layer 114 can be collectively referred to as an EL layer.
- the light-emitting device 130c includes the pixel electrode 111c on the insulating layer 255c, the island-shaped third layer 113c on the pixel electrode 111c, the common layer 114 on the island-shaped third layer 113c, and the common layer 114 on the common layer 114. and a common electrode 115 .
- the third layer 113c and the common layer 114 can be collectively called an EL layer.
- the configuration of the light-emitting device of this embodiment is not particularly limited, and may be a single structure or a tandem structure.
- island-shaped layers provided for each light-emitting device are referred to as a first layer 113a, a second layer 113b, and a third layer 113c.
- a layer shared by the light emitting devices is shown as a common layer 114 .
- the first layer 113a, the second layer 113b, and the third layer 113c have at least a light-emitting layer.
- the first layer 113a has a light-emitting layer that emits red light
- the second layer 113b has a light-emitting layer that emits green light
- the third layer 113c has a light-emitting layer that emits blue light.
- a structure having layers is preferable.
- the first layer 113a, the second layer 113b, and the third layer 113c are respectively a hole injection layer, a hole transport layer, a hole blocking layer, a charge generation layer, an electron blocking layer, and an electron transport layer. , and an electron injection layer.
- the first layer 113a, the second layer 113b, and the third layer 113c may have a hole-injection layer, a hole-transport layer, a light-emitting layer, and an electron-transport layer.
- the first layer 113a, the second layer 113b, and the third layer 113c may have an electron injection layer, an electron transport layer, a light emitting layer, and a hole transport layer in this order. good. Further, a hole blocking layer may be provided between the electron transport layer and the light emitting layer. Also, a hole injection layer may be provided on the hole transport layer.
- the first layer 113a, the second layer 113b, and the third layer 113c preferably have a light-emitting layer and a carrier-transporting layer (electron-transporting layer or hole-transporting layer) on the light-emitting layer.
- the surfaces of the first layer 113a, the second layer 113b, and the third layer 113c are exposed during the manufacturing process of the display panel. exposure to light can be suppressed, and damage to the light-emitting layer can be reduced. This can improve the reliability of the light emitting device.
- each of the first layer 113a, the second layer 113b, and the third layer 113c may have, for example, a first light emitting unit, a charge generation layer, and a second light emitting unit.
- the first layer 113a has two or more light-emitting units that emit red light
- the second layer 113b has two or more light-emitting units that emit green light
- the layer 113c preferably has two or more light-emitting units that emit blue light.
- the second light-emitting unit preferably has a light-emitting layer and a carrier-transporting layer (electron-transporting layer or hole-transporting layer) on the light-emitting layer. Since the surface of the second light-emitting unit is exposed during the manufacturing process of the display panel, by providing the carrier transport layer on the light-emitting layer, the exposure of the light-emitting layer to the outermost surface is suppressed and damage to the light-emitting layer is prevented. can be reduced. This can improve the reliability of the light emitting device.
- a carrier-transporting layer electron-transporting layer or hole-transporting layer
- the common layer 114 has, for example, an electron injection layer or a hole injection layer.
- the common layer 114 may have a laminate of an electron transport layer and an electron injection layer, or may have a laminate of a hole transport layer and a hole injection layer.
- Common layer 114 is shared by light emitting devices 130a, 130b, 130c.
- the common electrode 115 is shared by the light emitting devices 130a, 130b, and 130c.
- a common electrode 115 shared by a plurality of light emitting devices is electrically connected to the conductive layer 123 provided in the connection portion 140 (see FIGS. 19A and 19B).
- a conductive layer formed using the same material and in the same process as the pixel electrode 111 is preferably used for the conductive layer 123 .
- FIG. 19A shows an example in which a common layer 114 is provided on the conductive layer 123 and the conductive layer 123 and the common electrode 115 are electrically connected through the common layer 114 .
- the common layer 114 may not be provided in the connecting portion 140 .
- conductive layer 123 and common electrode 115 are directly connected.
- a mask also referred to as an area mask or a rough metal mask to distinguish from a fine metal mask
- the common layer 114 and the common electrode 115 are formed into a region where a film is formed. can be changed.
- the protective layer 131 may have a single layer structure or a laminated structure of two or more layers.
- the conductivity of the protective layer 131 does not matter. At least one of an insulating film, a semiconductor film, and a conductive film can be used as the protective layer 131 .
- the protective layer 131 By including an inorganic film in the protective layer 131, deterioration of the light-emitting device is suppressed, such as prevention of oxidation of the common electrode 115 and entry of impurities (moisture, oxygen, etc.) into the light-emitting device. Reliability can be improved.
- inorganic insulating films such as oxide insulating films, nitride insulating films, oxynitride insulating films, and oxynitride insulating films can be used.
- oxide insulating films include silicon oxide films, aluminum oxide films, gallium oxide films, germanium oxide films, yttrium oxide films, zirconium oxide films, lanthanum oxide films, neodymium oxide films, hafnium oxide films, and tantalum oxide films.
- nitride insulating film include a silicon nitride film and an aluminum nitride film.
- the oxynitride insulating film examples include a silicon oxynitride film, an aluminum oxynitride film, and the like.
- the nitride oxide insulating film examples include a silicon nitride oxide film, an aluminum nitride oxide film, and the like.
- the protective layer 131 preferably includes a nitride insulating film or a nitride oxide insulating film, and more preferably includes a nitride insulating film.
- the protective layer 131 includes In—Sn oxide (also referred to as ITO), In—Zn oxide, Ga—Zn oxide, Al—Zn oxide, or indium gallium zinc oxide (In—Ga—Zn oxide).
- ITO In—Sn oxide
- In—Zn oxide Ga—Zn oxide
- Al—Zn oxide Al—Zn oxide
- indium gallium zinc oxide In—Ga—Zn oxide
- An inorganic film containing a material such as IGZO can also be used.
- the inorganic film preferably has a high resistance, and specifically, preferably has a higher resistance than the common electrode 115 .
- the inorganic film may further contain nitrogen.
- the protective layer 131 When the light emitted from the light-emitting device is taken out through the protective layer 131, the protective layer 131 preferably has high transparency to visible light.
- the protective layer 131 preferably has high transparency to visible light.
- ITO, IGZO, and aluminum oxide are preferable because they are inorganic materials with high transparency to visible light.
- the protective layer 131 for example, a stacked structure of an aluminum oxide film and a silicon nitride film over the aluminum oxide film, or a stacked structure of an aluminum oxide film and an IGZO film over the aluminum oxide film, or the like can be used. can be done. By using the stacked structure, entry of impurities (such as water and oxygen) into the EL layer can be suppressed.
- impurities such as water and oxygen
- the protective layer 131 may have an organic film.
- protective layer 131 may have both an organic film and an inorganic film.
- organic materials that can be used for the protective layer 131 include organic insulating materials that can be used for the insulating layer 121 described later.
- the protective layer 131 may have a two-layer structure formed using different film formation methods. Specifically, the first layer of the protective layer 131 may be formed using the ALD method, and the second layer of the protective layer 131 may be formed using the sputtering method.
- no insulating layer is provided between the pixel electrode 111a and the first layer 113a to cover the edge of the upper surface of the pixel electrode 111a. Further, no insulating layer is provided between the pixel electrode 111b and the second layer 113b to cover the edge of the upper surface of the pixel electrode 111b. Therefore, the interval between adjacent light emitting devices can be made very narrow. Therefore, a high-definition or high-resolution display panel can be obtained.
- the sacrificial layer 118a is positioned on the first layer 113a of the light-emitting device 130a, and the sacrificial layer 118b is positioned on the second layer 113b of the light-emitting device 130b.
- a sacrificial layer 118c is located on the third layer 113c of the device 130c.
- the sacrificial layer 118a is part of the sacrificial layer provided on the first layer 113a when the first layer 113a is processed.
- the sacrificial layer 118b and the sacrificial layer 118c are part of the sacrificial layers provided when the second layer 113b and the third layer 113c were formed, respectively.
- part of the sacrificial layer used for protecting the EL layer may remain during manufacturing.
- the same material may be used for any two or all of the sacrificial layers 118a to 118c, or different materials may be used.
- one edge of sacrificial layer 118a is aligned or nearly aligned with an edge of first layer 113a, and the other edge of sacrificial layer 118a is on top of first layer 113a.
- the sacrificial layer remains, for example, between the island-shaped EL layer (the first layer 113a, the second layer 113b, or the third layer 113c) and the insulating layer 125 or the insulating layer 127.
- the sacrificial layer for example, one or more of metal films, alloy films, metal oxide films, semiconductor films, organic insulating films, and inorganic insulating films can be used.
- Various inorganic insulating films that can be used for the protective layer 131 can be used as the sacrificial layer.
- inorganic insulating materials such as aluminum oxide, hafnium oxide, and silicon oxide can be used.
- one or both of the insulating layer 125 and the insulating layer 127 are the upper surfaces of the EL layers (the first layer 113a, the second layer 113b, or the third layer 113c) processed into an island shape. may cover part of the One or both of the insulating layer 125 and the insulating layer 127 cover not only the side surface of the island-shaped EL layer (the first layer 113a, the second layer 113b, or the third layer 113c) but also the top surface.
- peeling of the EL layer can be further prevented, and the reliability of the light-emitting device can be improved.
- the manufacturing yield of the light-emitting device can be further increased.
- 19C shows an example in which a stacked structure of a first layer 113a, a sacrificial layer 118a, an insulating layer 125, and an insulating layer 127 is positioned over the edge of the pixel electrode 111a.
- a laminated structure of a second layer 113b, a sacrificial layer 118b, an insulating layer 125, and an insulating layer 127 is positioned over the end of the pixel electrode 111b, and a third layer is formed over the end of the pixel electrode 111c.
- a laminate structure of layer 113c, sacrificial layer 118c, insulating layer 125, and insulating layer 127 is located.
- the size relationship between the width of the pixel electrode and the island-shaped EL layer is not particularly limited.
- the pixel electrode 111a and the first layer 113a will be described below as an example. The same applies to the pixel electrode 111b and the second layer 113b, and the pixel electrode 111c and the third layer 113c.
- FIG. 18B and the like show an example in which the end of the first layer 113a is located outside the end of the pixel electrode 111a.
- the first layer 113a is formed so as to cover the end of the pixel electrode 111a.
- the aperture ratio can be increased compared to a structure in which the end portion of the island-shaped EL layer is located inside the end portion of the pixel electrode.
- the side surface of the pixel electrode with the EL layer, contact between the pixel electrode and the common electrode 115 can be suppressed, so short-circuiting of the light emitting device can be suppressed.
- the distance between the light emitting region of the EL layer (that is, the region overlapping with the pixel electrode) and the edge of the EL layer can be increased, reliability can be improved.
- FIG. 20A shows an example in which the top surface edge of the pixel electrode 111a and the edge of the first layer 113a are aligned or substantially aligned.
- FIG. 20A shows an example in which the edge of the first layer 113a is located inside the edge of the bottom surface of the pixel electrode 111a.
- FIG. 20B shows an example in which the edge of the first layer 113a is located inside the edge of the upper surface of the pixel electrode 111a. In FIGS. 20A and 20B, the edge of the first layer 113a is located on the pixel electrode 111a.
- the thickness of the first layer 113a becomes thin at the edge of the pixel electrode 111a and its vicinity. can be suppressed, and the thickness of the first layer 113a can be made uniform.
- the ends are aligned or substantially aligned, and when the top surface shapes are matched or substantially matched, at least part of the outline overlaps between the stacked layers when viewed from the top.
- the upper layer and the lower layer may be processed with the same mask pattern or partially with the same mask pattern.
- the outlines do not overlap, and the top layer may be located inside the bottom layer, or the top layer may be located outside the bottom layer, and in this case also the edges are roughly aligned, or the shape of the top surface are said to roughly match.
- the end portion of the first layer 113a may have both a portion positioned outside the end portion of the pixel electrode 111a and a portion positioned inside the end portion of the pixel electrode 111a. good.
- an insulating layer 121 may be provided to cover top surface end portions of the pixel electrodes 111a, 111b, and 111c.
- the first layer 113 a , the second layer 113 b , and the third layer 113 c can have a portion in contact with the pixel electrode and a portion in contact with the insulating layer 121 .
- the insulating layer 121 can have a single-layer structure or a laminated structure using one or both of an inorganic insulating film and an organic insulating film.
- organic insulating materials that can be used for the insulating layer 121 include acrylic resins, epoxy resins, polyimide resins, polyamide resins, polyimideamide resins, polysiloxane resins, benzocyclobutene resins, and phenol resins.
- an inorganic insulating film that can be used for the insulating layer 121 an inorganic insulating film that can be used for the protective layer 131 can be used.
- the insulating layer 121 When an inorganic insulating film is used as the insulating layer 121, impurities are less likely to enter the light-emitting device than when an organic insulating film is used, and the reliability of the light-emitting device can be improved. Furthermore, since the insulating layer 121 can be made thin, it is possible to easily achieve high definition. On the other hand, when an organic insulating film is used as the insulating layer 121, step coverage is higher than when an inorganic insulating film is used, and the effect of the shape of the pixel electrode is reduced. Therefore, short-circuiting of the light emitting device can be prevented. Specifically, when an organic insulating film is used as the insulating layer 121, the shape of the insulating layer 121 can be processed into a tapered shape or the like.
- the insulating layer 121 may not be provided. By not providing the insulating layer 121, the aperture ratio of the sub-pixel can be increased in some cases. Alternatively, the distance between sub-pixels can be reduced, which may increase the definition or resolution of the display panel.
- the common layer 114 has a region between the first layer 113a and the second layer 113b and a region between the second layer 113b and the third layer 113c. I will show an example that is involved in such as.
- a void 135 may be formed in the region, as shown in FIG. 21B.
- the air gap 135 contains, for example, one or more selected from air, nitrogen, oxygen, carbon dioxide, and Group 18 elements (typically, helium, neon, argon, xenon, krypton, etc.). have. Alternatively, the gap 135 may be filled with resin or the like.
- an insulating layer 125 is provided so as to cover the top surface of the insulating layer 121 and side surfaces of the first layer 113a, the second layer 113b, and the third layer 113c.
- an insulating layer 127 may be provided over the insulating layer 125 .
- the insulating layer 125 preferably covers at least one of the side surface of the pixel electrode and the side surface of the island-shaped EL layer, and more preferably covers both the side surface of the pixel electrode and the side surface of the island-shaped EL layer.
- the insulating layer 125 can be in contact with side surfaces of the pixel electrode and the island-shaped EL layer.
- FIG. 18B and the like show a configuration in which the end of the pixel electrode 111a is covered with the first layer 113a, and the insulating layer 125 is in contact with the side surface of the first layer 113a.
- the edge of the pixel electrode 111b is covered with the second layer 113b
- the edge of the pixel electrode 111c is covered with the third layer 113c
- the insulating layer 125 is formed on the side surface of the second layer 113b. and the side surface of the third layer 113c.
- the insulating layer 127 is provided on the insulating layer 125 so as to fill the recesses formed in the insulating layer 125 .
- the insulating layer 127 can overlap with side surfaces of the first layer 113a, the second layer 113b, and the third layer 113c with the insulating layer 125 interposed therebetween.
- the space between the adjacent island-shaped layers can be filled; can be reduced and made flatter. Therefore, it is possible to improve the coverage of the carrier injection layer and the common electrode, and prevent the common electrode from being disconnected.
- the common layer 114 and the common electrode 115 are provided on the first layer 113a, the second layer 113b, the third layer 113c, the insulating layer 125 and the insulating layer 127.
- a step is caused between a region where the pixel electrode and the EL layer are provided and a region where the pixel electrode and the EL layer are not provided (a region between the light emitting devices). ing. Since the display panel of one embodiment of the present invention includes the insulating layer 125 and the insulating layer 127 , the step can be planarized, and coverage with the common layer 114 and the common electrode 115 can be improved. Therefore, it is possible to suppress poor connection due to step disconnection of the common electrode 115 . In addition, it is possible to prevent the common electrode 115 from being locally thinned due to the steps and increasing the electrical resistance.
- the top surface of the insulating layer 125 and the top surface of the insulating layer 127 are respectively higher than the first layer 113a, the second layer 113b, and the upper surface of the insulating layer 113b. , the height of the top surface of at least one edge of the third layer 113c.
- the upper surface of the insulating layer 127 preferably has a flat shape, it may have a convex portion, a convex curved surface, a concave curved surface, or a concave portion.
- the insulating layer 125 or the insulating layer 127 can be provided so as to be in contact with the island-shaped EL layer. This can prevent film peeling of the island-shaped EL layer. Adhesion between the insulating layer and the EL layer has the effect of fixing or bonding adjacent island-shaped EL layers to each other by the insulating layer. This can improve the reliability of the light emitting device. Moreover, the production yield of the light-emitting device can be increased.
- FIG. 22A shows an example in which the common layer 114 is provided in contact with the upper surface of the insulating layer 255c and the side surfaces and upper surfaces of the first layer 113a, the second layer 113b, and the third layer 113c.
- gaps 135 are provided in a region between the first layer 113a and the second layer 113b, a region between the second layer 113b and the third layer 113c, and the like. may have been
- one of the insulating layer 125 and the insulating layer 127 may not be provided.
- the insulating layer 125 by forming the insulating layer 125 with a single-layer structure using an inorganic material, the insulating layer 125 can be used as a protective insulating layer of the EL layer. Thereby, the reliability of the display panel can be improved.
- the insulating layer 127 by forming the insulating layer 127 having a single-layer structure using an organic material, the insulating layer 127 can be filled between adjacent island-shaped EL layers to planarize the EL layers. Accordingly, coverage of the common electrode 115 (upper electrode) formed over the island-shaped EL layer and the insulating layer 127 can be improved.
- FIG. 22B shows an example in which the insulating layer 127 is not provided. Although FIG. 22B shows an example in which the common layer 114 enters the concave portion of the insulating layer 125, a gap may be formed in this region.
- the insulating layer 125 has a region in contact with the side surface of the island-shaped EL layer and functions as a protective insulating layer for the EL layer.
- impurities oxygen, moisture, and the like
- the insulating layer 125 can be prevented from entering the inside of the island-shaped EL layer from the side surface, so that the display panel can have high reliability.
- FIG. 22C shows an example in which the insulating layer 125 is not provided.
- the insulating layer 127 can be in contact with the side surface of the island-shaped EL layer.
- the insulating layer 127 can be provided so as to fill the space between the island-shaped EL layers of each light-emitting device.
- the insulating layer 127 it is preferable to use an organic material that causes less damage to the EL layer.
- the insulating layer 127 is preferably made of an organic material such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin.
- the insulating layer 125 can be an insulating layer containing an inorganic material.
- an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used, for example.
- the insulating layer 125 may have a single-layer structure or a laminated structure.
- the oxide insulating film includes a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, and an oxide film.
- a hafnium film, a tantalum oxide film, and the like are included.
- the nitride insulating film include a silicon nitride film and an aluminum nitride film.
- Examples of the oxynitride insulating film include a silicon oxynitride film, an aluminum oxynitride film, and the like.
- the nitride oxide insulating film examples include a silicon nitride oxide film, an aluminum nitride oxide film, and the like.
- aluminum oxide is preferable because it has a high etching selectivity with respect to the EL layer and has a function of protecting the EL layer during formation of the insulating layer 127 described later.
- an inorganic insulating film such as an aluminum oxide film, a hafnium oxide film, or a silicon oxide film formed by an ALD method to the insulating layer 125, the insulating layer 125 has few pinholes and has an excellent function of protecting the EL layer. can be formed.
- the insulating layer 125 may have a layered structure of a film formed by an ALD method and a film formed by a sputtering method.
- the insulating layer 125 may have a laminated structure of, for example, an aluminum oxide film formed by ALD and a silicon nitride film formed by sputtering.
- the insulating layer 125 preferably functions as a barrier insulating layer against at least one of water and oxygen. Further, the insulating layer 125 preferably has a function of suppressing diffusion of at least one of water and oxygen. Further, the insulating layer 125 preferably has a function of capturing or fixing at least one of water and oxygen (also referred to as gettering).
- the insulating layer 125 has a function as a barrier insulating layer or a gettering function to suppress entry of impurities (typically, at least one of water and oxygen) that can diffuse into each light-emitting device from the outside. is possible. With such a structure, a highly reliable light-emitting device and a highly reliable display panel can be provided.
- impurities typically, at least one of water and oxygen
- the insulating layer 125 preferably has a low impurity concentration. Accordingly, it is possible to suppress deterioration of the EL layer due to entry of impurities from the insulating layer 125 into the EL layer. In addition, by reducing the impurity concentration in the insulating layer 125, the barrier property against at least one of water and oxygen can be improved.
- the insulating layer 125 preferably has a sufficiently low hydrogen concentration or carbon concentration, or preferably both.
- Methods for forming the insulating layer 125 include a sputtering method, a CVD method, a pulsed laser deposition (PLD) method, an ALD method, and the like.
- the insulating layer 125 is preferably formed by an ALD method with good coverage.
- the substrate temperature is preferably 60° C. or higher, more preferably 80° C. or higher, more preferably 100° C. or higher, and more preferably 120° C. or higher.
- the substrate temperature is preferably 200° C. or lower, more preferably 180° C. or lower, more preferably 160° C. or lower, more preferably 150° C. or lower, and more preferably 140° C. or lower.
- heat resistant temperature indicators include glass transition point, softening point, melting point, thermal decomposition temperature, and 5% weight loss temperature.
- the heat resistance temperature of the EL layer can be any one of these temperatures, preferably the lowest temperature among them.
- the insulating layer 125 it is preferable to form an insulating film having a thickness of, for example, 3 nm or more, 5 nm or more, or 10 nm or more and 200 nm or less, 150 nm or less, 100 nm or less, or 50 nm or less.
- the insulating layer 127 provided on the insulating layer 125 has the function of flattening the recesses of the insulating layer 125 formed between adjacent light emitting devices. In other words, the presence of the insulating layer 127 has the effect of improving the flatness of the surface on which the common electrode 115 is formed.
- an insulating layer containing an organic material can be preferably used.
- acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene-based resin, phenolic resin, and precursors of these resins are applied. can do.
- an organic material such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin may be used as the insulating layer 127 .
- a photosensitive resin can be used as the insulating layer 127 .
- a photoresist may be used as the photosensitive resin.
- a positive material or a negative material can be used for the photosensitive resin.
- a material that absorbs visible light may be used for the insulating layer 127 . Since the insulating layer 127 absorbs light emitted from the light emitting device, leakage of light (stray light) from the light emitting device to an adjacent light emitting device via the insulating layer 127 can be suppressed. Thereby, the display quality of the display panel can be improved. In addition, since the display quality can be improved without using a polarizing plate for the display panel, the weight and thickness of the display panel can be reduced.
- Materials that absorb visible light include materials containing pigments such as black, materials containing dyes, light-absorbing resin materials (e.g., polyimide), and resin materials that can be used for color filters (color filter materials ).
- resin materials that can be used for color filters color filter materials
- by mixing color filter materials of three or more colors it is possible to obtain a black or nearly black resin layer.
- the insulating layer 127 is formed using a wet film formation method such as spin coating, dipping, spray coating, inkjet, dispensing, screen printing, offset printing, doctor knife method, slit coating, roll coating, curtain coating, and knife coating. can do.
- a wet film formation method such as spin coating, dipping, spray coating, inkjet, dispensing, screen printing, offset printing, doctor knife method, slit coating, roll coating, curtain coating, and knife coating. can do.
- the insulating layer 127 is formed at a temperature lower than the heat-resistant temperature of the EL layer.
- the substrate temperature when forming the insulating layer 127 is typically 200° C. or lower, preferably 180° C. or lower, more preferably 160° C. or lower, more preferably 150° C. or lower, and more preferably 140° C. or lower. .
- 23A to 23F show the cross-sectional structure of the region 139 including the insulating layer 127 and its periphery.
- FIG. 23A shows an example in which the first layer 113a and the second layer 113b have different thicknesses.
- the height of the top surface of the insulating layer 125 matches or substantially matches the height of the top surface of the first layer 113a on the side of the first layer 113a, and the height of the top surface of the second layer 113b on the side of the second layer 113b. Matches or roughly matches height.
- the upper surface of the insulating layer 127 has a gentle slope with a higher surface on the side of the first layer 113a and a lower surface on the side of the second layer 113b.
- the insulating layers 125 and 127 have the same height as the top surface of the adjacent EL layer.
- the top surface may have a flat portion that is aligned with the height of the top surface of any of the adjacent EL layers.
- the top surface of the insulating layer 127 has a region higher than the top surface of the first layer 113a and the top surface of the second layer 113b.
- the upper surface of the insulating layer 127 can be configured to have a shape in which the center and the vicinity thereof bulge in a cross-sectional view, that is, have a convex curved surface.
- the upper surface of the insulating layer 127 has a shape that gently swells toward the center, that is, a convex surface, and a shape that is depressed at and near the center, that is, a concave surface, in a cross-sectional view.
- the insulating layer 127 has a region higher than the upper surface of the first layer 113a and the upper surface of the second layer 113b.
- the display panel has a region where the first layer 113a, the sacrificial layer 118a, the insulating layer 125, and the insulating layer 127 are stacked in this order.
- the display panel has a region where the second layer 113b, the sacrificial layer 118b, the insulating layer 125, and the insulating layer 127 are stacked in this order.
- the top surface of the insulating layer 127 has a region lower than the top surface of the first layer 113a and the top surface of the second layer 113b.
- the upper surface of the insulating layer 127 has a shape in which the center and its vicinity are depressed in a cross-sectional view, that is, has a concave curved surface.
- the top surface of the insulating layer 125 has a region higher than the top surface of the first layer 113a and the top surface of the second layer 113b. That is, the insulating layer 125 protrudes from the formation surface of the common layer 114 to form a convex portion.
- the insulating layer 125 may be formed to protrude as shown in FIG. 23E. be.
- the top surface of the insulating layer 125 has a region lower than the top surface of the first layer 113a and the top surface of the second layer 113b. That is, the insulating layer 125 forms a recess on the surface on which the common layer 114 is formed.
- the display panel of this embodiment can reduce the distance between the light emitting devices.
- the distance between light-emitting devices, the distance between EL layers, or the distance between pixel electrodes is less than 10 ⁇ m, 5 ⁇ m or less, 3 ⁇ m or less, 2 ⁇ m or less, 1 ⁇ m or less, 500 nm or less, 200 nm or less, 100 nm or less, or 90 nm or less. , 70 nm or less, 50 nm or less, 30 nm or less, 20 nm or less, 15 nm or less, or 10 nm or less.
- the display panel of this embodiment has a region where the distance between two adjacent island-shaped EL layers is 1 ⁇ m or less, preferably 0.5 ⁇ m (500 nm) or less, more preferably 0.5 ⁇ m (500 nm) or less. has a region of 100 nm or less.
- a light shielding layer may be provided on the surface of the substrate 120 on the resin layer 122 side.
- various optical members can be arranged outside the substrate 120 .
- optical members include polarizing plates, retardation plates, light diffusion layers (diffusion films, etc.), antireflection layers, light collecting films, and the like.
- an antistatic film that suppresses adhesion of dust, a water-repellent film that prevents adhesion of dirt, a hard coat film that suppresses the occurrence of scratches due to use, a shock absorption layer, etc. Layers may be arranged.
- a glass layer or a silica layer (SiO x layer) as a surface protective layer, because surface contamination and scratching can be suppressed.
- the surface protective layer DLC (diamond-like carbon), aluminum oxide (AlO x ), polyester-based material, polycarbonate-based material, or the like may be used.
- a material having a high visible light transmittance is preferably used for the surface protective layer.
- Glass, quartz, ceramic, sapphire, resin, metal, alloy, semiconductor, etc. can be used for the substrate 120 .
- a material that transmits the light is used for the substrate on the side from which the light from the light-emitting device is extracted.
- Using a flexible material for the substrate 120 can increase the flexibility of the display panel.
- a polarizing plate may be used as the substrate 120 .
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, acrylic resins, polyimide resins, polymethyl methacrylate resins, polycarbonate (PC) resins, polyethersulfone (PES) resins, respectively.
- resin polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) Resin, ABS resin, cellulose nanofiber, etc.
- glass having a thickness that is flexible may be used.
- a substrate having high optical isotropy has small birefringence (it can be said that the amount of birefringence is small).
- the absolute value of the retardation (retardation) value of the substrate with high optical isotropy is preferably 30 nm or less, more preferably 20 nm or less, and even more preferably 10 nm or less.
- Films with high optical isotropy include triacetyl cellulose (TAC, also called cellulose triacetate) films, cycloolefin polymer (COP) films, cycloolefin copolymer (COC) films, and acrylic films.
- TAC triacetyl cellulose
- COP cycloolefin polymer
- COC cycloolefin copolymer
- a film having a low water absorption rate as the substrate.
- various curable adhesives such as photocurable adhesives such as ultraviolet curable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used.
- These adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like.
- a material with low moisture permeability such as epoxy resin is preferable.
- a two-liquid mixed type resin may be used.
- an adhesive sheet or the like may be used.
- the pixel can be configured to have four types of sub-pixels.
- FIG. 24A A top view of the display panel 100 is shown in FIG. 24A.
- the display panel 100 has a display section in which a plurality of pixels 110 are arranged in a matrix and a connection section 140 outside the display section.
- a pixel 110 shown in FIG. 24A is composed of four types of sub-pixels 110a, 110b, 110c, and 110d.
- the sub-pixels 110a, 110b, 110c, and 110d can be configured to have light-emitting devices that emit light of different colors.
- the sub-pixels 110a, 110b, 110c, and 110d include four sub-pixels of R, G, B, and W, sub-pixels of four colors of R, G, B, and Y, and R, G, B, For example, four sub-pixels of IR.
- the display panel of one embodiment of the present invention may include a light-receiving device in a pixel.
- the light receiving device may be used for the imaging pixel 106 described in the fourth embodiment.
- a pn-type or pin-type photodiode can be used as the light receiving device.
- a light-receiving device functions as a photoelectric conversion device (also referred to as a photoelectric conversion element) that detects light incident on the light-receiving device and generates an electric charge. The amount of charge generated from the light receiving device is determined based on the amount of light incident on the light receiving device.
- organic photodiode having a layer containing an organic compound as the light receiving device.
- Organic photodiodes can be easily made thinner, lighter, and larger, and have a high degree of freedom in shape and design, so they can be applied to various display panels.
- an organic EL device is used as the light emitting device and an organic photodiode is used as the light receiving device.
- An organic EL device and an organic photodiode can be formed on the same substrate. Therefore, an organic photodiode can be incorporated in a display panel using an organic EL device.
- a light receiving device has an active layer that functions at least as a photoelectric conversion layer between a pair of electrodes.
- one of a pair of electrodes may be referred to as a pixel electrode and the other may be referred to as a common electrode.
- one electrode functions as an anode and the other electrode functions as a cathode.
- the light-receiving device can be driven by applying a reverse bias between the pixel electrode and the common electrode, thereby detecting light incident on the light-receiving device, generating electric charge, and extracting it as a current.
- the pixel electrode may function as a cathode and the common electrode may function as an anode.
- a manufacturing method similar to that for the light-emitting device can also be applied to the light-receiving device.
- the island-shaped active layer (also called photoelectric conversion layer) of the light receiving device is not formed by a pattern of a metal mask, but is formed by processing after forming a film that will be the active layer over the entire surface. , an island-shaped active layer can be formed with a uniform thickness. Further, by providing the sacrificial layer on the active layer, the damage to the active layer during the manufacturing process of the display panel can be reduced, and the reliability of the light-receiving device can be improved.
- FIG. 24B shows a cross-sectional view along the dashed-dotted line X3-X4 in FIG. 24A. Note that FIG. 18B can be referred to for the cross-sectional view along the dashed-dotted line X1-X2 in FIG. 24A, and FIG. 19A or FIG. 19B can be referred to for the cross-sectional view along the dashed-dotted line Y1-Y2.
- the display panel 100 includes an insulating layer provided on the layer 101, a light emitting device 130a and a light receiving device 150 provided on the insulating layer, and a protective layer covering the light emitting device 130a and the light receiving device 150.
- FIG. 131 is provided, and the substrate 120 is bonded with the resin layer 122 .
- An insulating layer 125 and an insulating layer 127 on the insulating layer 125 are provided in a region between the adjacent light emitting device and light receiving device.
- FIG. 24B shows an example in which the light emitting device 130a emits light toward the substrate 120 side and light enters the light receiving device 150 from the substrate 120 side (see light Lem and light Lin).
- the configuration of the light emitting device 130a is as described above.
- the light receiving device 150 includes a pixel electrode 111d on the insulating layer 255c, a fourth layer 113d on the pixel electrode 111d, a common layer 114 on the fourth layer 113d, and a common electrode 115 on the common layer 114. have.
- the fourth layer 113d includes at least the active layer.
- the fourth layer 113d is a layer provided in the light receiving device 150 and not provided in the light emitting device.
- the common layer 114 is a sequence of layers shared by the light-emitting and light-receiving devices.
- a layer shared by the light-receiving device and the light-emitting device may have different functions in the light-emitting device and in the light-receiving device. Components are sometimes referred to herein based on their function in the light emitting device.
- a hole-injecting layer functions as a hole-injecting layer in light-emitting devices and as a hole-transporting layer in light-receiving devices.
- an electron-injecting layer functions as an electron-injecting layer in light-emitting devices and as an electron-transporting layer in light-receiving devices.
- a layer shared by the light-receiving device and the light-emitting device may have the same function in the light-emitting device as in the light-receiving device.
- a hole-transporting layer functions as a hole-transporting layer in both a light-emitting device and a light-receiving device
- an electron-transporting layer functions as an electron-transporting layer in both a light-emitting device and a light-receiving device.
- a sacrificial layer 118 a is positioned between the first layer 113 a and the insulating layer 125
- a sacrificial layer 118 d is positioned between the fourth layer 113 d and the insulating layer 125 .
- the sacrificial layer 118a is part of the sacrificial layer provided on the first layer 113a when the first layer 113a is processed.
- the sacrificial layer 118d is a part of the sacrificial layer provided on the fourth layer 113d when processing the fourth layer 113d including the active layer.
- Sacrificial layer 118a and sacrificial layer 118d may have the same material or may have different materials.
- a display panel having a light-emitting device and a light-receiving device in a pixel since the pixel has a light-receiving function, it is possible to detect contact or proximity of an object while displaying an image. For example, not only can an image be displayed by all the sub-pixels of the display panel, but also some sub-pixels can emit light as a light source and an image can be displayed by the remaining sub-pixels.
- light-emitting devices are arranged in a matrix in the display portion, and an image can be displayed on the display portion.
- light receiving devices are arranged in a matrix in the display section, and the display section has one or both of an imaging function and a sensing function in addition to an image display function.
- the display part can be used for an image sensor or a touch sensor. That is, by detecting light on the display portion, an image can be captured, or proximity or contact of an object (a finger, hand, pen, or the like) can be detected.
- the display panel of one embodiment of the present invention can use a light-emitting device as a light source of a sensor.
- the light-receiving device when an object reflects (or scatters) light emitted by a light-emitting device included in the display portion, the light-receiving device can detect the reflected light (or scattered light).
- the reflected light or scattered light.
- imaging or touch detection is possible.
- the display panel can capture an image using the light receiving device.
- the display panel of this embodiment can be used as a scanner.
- an image sensor can be used to acquire data related to biometric information such as fingerprints and palm prints.
- the display panel can incorporate a biometric sensor.
- the biometric authentication sensor By incorporating the biometric authentication sensor into the display panel, the number of parts in the electronic device can be reduced compared to the case where the biometric authentication sensor is provided separately from the display panel, and the size and weight of the electronic device can be reduced. .
- the display panel can detect proximity or contact of an object using the light receiving device.
- a display panel of one embodiment of the present invention can have one or both of an imaging function and a sensing function in addition to an image display function.
- the display panel of one embodiment of the present invention can be said to have a structure that is highly compatible with functions other than the display function.
- a conductive film that transmits visible light is used for the electrode on the light extraction side of the pixel electrode and common electrode.
- a conductive film that reflects visible light is preferably used for the electrode on the side from which light is not extracted.
- a conductive film that transmits visible light and infrared light is used for the electrode on the side from which light is extracted, and a conductive film is used for the electrode on the side that does not extract light.
- a conductive film that reflects visible light and infrared light is preferably used.
- a conductive film that transmits visible light may also be used for the electrode on the side from which light is not extracted.
- the electrode is preferably arranged between the reflective layer and the EL layer. That is, the light emitted from the EL layer may be reflected by the reflective layer and extracted from the display panel.
- indium tin oxide also referred to as In—Sn oxide, ITO
- In—Si—Sn oxide also referred to as ITSO
- indium zinc oxide In—Zn oxide
- In—W— Zn oxides aluminum-containing alloys (aluminum alloys) such as alloys of aluminum, nickel, and lanthanum (Al-Ni-La)
- Al-Ni-La aluminum-containing alloys
- Al-Ni-La aluminum-containing alloys
- alloys of silver, palladium and copper Ag-Pd-Cu, also referred to as APC
- elements belonging to Group 1 or Group 2 of the periodic table of elements not exemplified above e.g., lithium (Li), cesium (Cs), calcium (Ca), strontium (Sr)), europium (Eu), ytterbium
- Yb rare earth metal
- an alloy containing an appropriate combination thereof, graphene, or the like can be used.
- a micro optical resonator (microcavity) structure is preferably applied to the light emitting device. Therefore, one of the pair of electrodes of the light-emitting device preferably has an electrode (semi-transmissive/semi-reflective electrode) that is transparent and reflective to visible light, and the other is an electrode that is reflective to visible light ( reflective electrode). Since the light-emitting device has a microcavity structure, the light emitted from the light-emitting layer can be resonated between both electrodes, and the light emitted from the light-emitting device can be enhanced.
- the light transmittance of the transparent electrode is set to 40% or more.
- the light-emitting device preferably uses an electrode having a transmittance of 40% or more for visible light (light with a wavelength of 400 nm or more and less than 750 nm).
- the visible light reflectance of the semi-transmissive/semi-reflective electrode is 10% or more and 95% or less, preferably 30% or more and 80% or less.
- the visible light reflectance of the reflective electrode is 40% or more and 100% or less, preferably 70% or more and 100% or less.
- the resistivity of these electrodes is preferably 1 ⁇ 10 ⁇ 2 ⁇ cm or less.
- a light-emitting layer is a layer containing a light-emitting material (also called a light-emitting substance).
- the emissive layer can have one or more emissive materials.
- a substance exhibiting emission colors such as blue, purple, violet, green, yellow-green, yellow, orange, and red is used as appropriate.
- a substance that emits near-infrared light can be used as the light-emitting substance.
- Examples of light-emitting substances include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.
- fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives. be done.
- Examples of phosphorescent materials include organometallic complexes (especially iridium complexes) having a 4H-triazole skeleton, 1H-triazole skeleton, imidazole skeleton, pyrimidine skeleton, pyrazine skeleton, or pyridine skeleton, and phenylpyridine derivatives having an electron-withdrawing group.
- organometallic complexes especially iridium complexes
- platinum complexes, rare earth metal complexes, etc. which are used as ligands, can be mentioned.
- the light-emitting layer may contain one or more organic compounds (host material, assist material, etc.) in addition to the light-emitting substance (guest material).
- One or both of a hole-transporting material and an electron-transporting material can be used as the one or more organic compounds.
- Bipolar materials or TADF materials may also be used as one or more organic compounds.
- the light-emitting layer preferably includes, for example, a phosphorescent material and a combination of a hole-transporting material and an electron-transporting material that easily form an exciplex.
- ExTET Exciplex-Triplet Energy Transfer
- a combination that forms an exciplex that emits light that overlaps with the wavelength of the absorption band on the lowest energy side of the light-emitting substance energy transfer becomes smooth and light emission can be efficiently obtained. With this configuration, high efficiency, low-voltage driving, and long life of the light-emitting device can be realized at the same time.
- the first layer 113a, the second layer 113b, and the third layer 113c each include a substance with a high hole-injection property, a substance with a high hole-transport property, and a hole-blocking material as layers other than the light-emitting layer. , a substance with a high electron-transport property, a substance with a high electron-injection property, an electron-blocking material, a bipolar substance (a substance with high electron-transport property and hole-transport property), or the like.
- Both low-molecular-weight compounds and high-molecular-weight compounds can be used in the light-emitting device, and inorganic compounds may be included.
- Each of the layers constituting the light-emitting device can be formed by a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.
- the first layer 113a, the second layer 113b, and the third layer 113c are respectively a hole-injecting layer, a hole-transporting layer, a hole-blocking layer, an electron-blocking layer, an electron-transporting layer, and an electron layer. It may have one or more of the injection layers.
- the common layer 114 one or more of a hole injection layer, a hole transport layer, a hole block layer, an electron block layer, an electron transport layer, and an electron injection layer can be applied.
- a carrier injection layer (hole injection layer or electron injection layer) may be formed as the common layer 114 . Note that the light emitting device need not have the common layer 114 .
- Each of the first layer 113a, the second layer 113b, and the third layer 113c preferably has a light emitting layer and a carrier transport layer on the light emitting layer.
- the hole-injecting layer is a layer that injects holes from the anode into the hole-transporting layer, and contains a material with high hole-injecting properties.
- highly hole-injecting materials include aromatic amine compounds and composite materials containing a hole-transporting material and an acceptor material (electron-accepting material).
- the hole-transporting layer is a layer that transports holes injected from the anode to the light-emitting layer by means of the hole-injecting layer.
- a hole-transporting layer is a layer containing a hole-transporting material.
- the hole-transporting material a substance having a hole mobility of 1 ⁇ 10 ⁇ 6 cm 2 /Vs or more is preferable. Note that substances other than these can be used as long as they have a higher hole-transport property than electron-transport property.
- hole-transporting materials include ⁇ -electron-rich heteroaromatic compounds (e.g., carbazole derivatives, thiophene derivatives, furan derivatives, etc.), aromatic amines (compounds having an aromatic amine skeleton), and other highly hole-transporting materials. is preferred.
- ⁇ -electron-rich heteroaromatic compounds e.g., carbazole derivatives, thiophene derivatives, furan derivatives, etc.
- aromatic amines compounds having an aromatic amine skeleton
- other highly hole-transporting materials is preferred.
- the electron-transporting layer is a layer that transports electrons injected from the cathode to the light-emitting layer by the electron-injecting layer.
- the electron-transporting layer is a layer containing an electron-transporting material.
- an electron-transporting material a substance having an electron mobility of 1 ⁇ 10 ⁇ 6 cm 2 /Vs or more is preferable. Note that substances other than these substances can be used as long as they have a higher electron-transport property than hole-transport property.
- electron-transporting materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, ⁇ -electron deficient including oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives with quinoline ligands, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other nitrogen-containing heteroaromatic compounds
- a material having a high electron transport property such as a type heteroaromatic compound can be used.
- the electron injection layer is a layer that injects electrons from the cathode to the electron transport layer, and is a layer that contains a material with high electron injection properties.
- Alkali metals, alkaline earth metals, or compounds thereof can be used as materials with high electron injection properties.
- a composite material containing an electron-transporting material and a donor material (electron-donating material) can also be used as a material with high electron-injecting properties.
- the electron injection layer examples include lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF x , X is an arbitrary number), and 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenoratritium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatritium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)pheno Alkali metals such as latolithium (abbreviation: LiPPP), lithium oxide (LiO x ), cesium carbonate, alkaline earth metals, or compounds thereof can be used.
- the electron injection layer may have a laminated structure of two or more layers. As the laminated structure, for example, lithium fluoride can be used for the first layer and ytterbium can be used for the second layer.
- an electron-transporting material may be used as the electron injection layer.
- a compound having a lone pair of electrons and an electron-deficient heteroaromatic ring can be used as the electron-transporting material.
- a compound having at least one of a pyridine ring, diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and triazine ring can be used.
- the lowest unoccupied molecular orbital (LUMO) level of the organic compound having an unshared electron pair is preferably -3.6 eV or more and -2.3 eV or less.
- CV cyclic voltammetry
- photoelectron spectroscopy optical absorption spectroscopy
- inverse photoelectron spectroscopy etc. are used to determine the highest occupied molecular orbital (HOMO: Highest Occupied Molecular Orbital) level and LUMO level of an organic compound. can be estimated.
- BPhen 4,7-diphenyl-1,10-phenanthroline
- NBPhen 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline
- HATNA diquinoxalino [2,3-a:2′,3′-c]phenazine
- TmPPPyTz 2,4,6-tris[3′-(pyridin-3-yl)biphenyl-3-yl]-1,3 , 5-triazine
- a charge generation layer (also referred to as an intermediate layer) is provided between two light-emitting units.
- the intermediate layer has a function of injecting electrons into one of the two light-emitting units and holes into the other when a voltage is applied between the pair of electrodes.
- charge generation layer for example, materials applicable to the electron injection layer, such as lithium, can be suitably used.
- a material applicable to the hole injection layer can be preferably used.
- a layer containing a hole-transporting material and an acceptor material (electron-accepting material) can be used as the charge-generating layer.
- a layer containing an electron-transporting material and a donor material can be used for the charge generation layer.
- the thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display panel can be formed using a sputtering method, a CVD method, a vacuum deposition method, a PLD method, an ALD method, or the like.
- CVD methods include PECVD and thermal CVD.
- one of the thermal CVD methods is the metal organic CVD (MOCVD) method.
- the thin films (insulating film, semiconductor film, conductive film, etc.) that make up the display panel can be applied by spin coating, dipping, spray coating, inkjet, dispensing, screen printing, offset printing, doctor knife, slit coating, roll coating, It can be formed by methods such as curtain coating and knife coating.
- vacuum processes such as vapor deposition and solution processes such as spin coating and inkjet can be used to fabricate light-emitting devices.
- vapor deposition methods include physical vapor deposition (PVD) such as sputtering, ion plating, ion beam vapor deposition, molecular beam vapor deposition, and vacuum vapor deposition, and chemical vapor deposition (CVD).
- PVD physical vapor deposition
- CVD chemical vapor deposition
- the functional layers (hole injection layer, hole transport layer, light emitting layer, electron transport layer, electron injection layer, etc.) included in the EL layer may be formed by a vapor deposition method (vacuum vapor deposition method, etc.), a coating method (dip coating method, die coat method, bar coat method, spin coat method, spray coat method, etc.), printing method (inkjet method, screen (stencil printing) method, offset (lithographic printing) method, flexographic (letterpress printing) method, gravure method, or micro contact method, etc.).
- a vapor deposition method vacuum vapor deposition method, etc.
- a coating method dip coating method, die coat method, bar coat method, spin coat method, spray coat method, etc.
- printing method inkjet method, screen (stencil printing) method, offset (lithographic printing) method, flexographic (letterpress printing) method, gravure method, or micro contact method, etc.
- the thin film that constitutes the display panel when processing the thin film that constitutes the display panel, it can be processed using a photolithography method or the like.
- the thin film may be processed by a nanoimprint method, a sandblast method, a lift-off method, or the like.
- an island-shaped thin film may be directly formed by a film formation method using a shielding mask such as a metal mask.
- a photolithography method there are typically the following two methods.
- One is a method of forming a resist mask on a thin film to be processed, processing the thin film by etching or the like, and removing the resist mask.
- the other is a method of forming a thin film having photosensitivity and then exposing and developing the thin film to process the thin film into a desired shape.
- the light used for exposure can be, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or a mixture of these.
- ultraviolet rays, KrF laser light, ArF laser light, or the like can also be used.
- extreme ultraviolet light (EUV: Extreme Ultra-violet) or X-rays may be used.
- An electron beam can also be used instead of the light used for exposure. The use of extreme ultraviolet light, X-rays, or electron beams is preferable because extremely fine processing is possible.
- a photomask is not necessary when exposure is performed by scanning a beam such as an electron beam.
- a dry etching method, a wet etching method, a sandblasting method, or the like can be used to etch the thin film.
- the island-shaped EL layer is formed not by using a metal mask having a fine pattern, but by forming the EL layer over the entire surface. Formed by processing. Therefore, the size of the island-shaped EL layer and further the size of the sub-pixel can be made smaller than those formed using a metal mask. Therefore, it is possible to realize a high-definition display panel or a display panel with a high aperture ratio, which has hitherto been difficult to achieve.
- the display panel of one embodiment of the present invention light-emitting devices are separately manufactured for each emission color, so that carrier balance can be easily adjusted, and emission colors differ between low-luminance light emission and high-luminance light emission. Hard to change.
- the EL layer is provided in an island shape for each sub-pixel, it is possible to suppress the occurrence of leakage current between the sub-pixels. As a result, deterioration in display quality of the display panel can be suppressed. In addition, it is possible to achieve both high definition of the display panel and high display quality.
- the arrangement of sub-pixels includes, for example, a stripe arrangement, an S-stripe arrangement, a matrix arrangement, a delta arrangement, a Bayer arrangement, and a pentile arrangement.
- top surface shapes of sub-pixels include triangles, quadrilaterals (including rectangles and squares), polygons such as pentagons, shapes with rounded corners of these polygons, ellipses, and circles.
- the top surface shape of the sub-pixel corresponds to the top surface shape of the light emitting region of the light emitting device.
- a pixel 110 shown in FIG. 25A is composed of three sub-pixels, sub-pixels 110a, 110b, and 110c.
- the sub-pixel 110a may be the blue sub-pixel B
- the sub-pixel 110b may be the red sub-pixel R
- the sub-pixel 110c may be the green sub-pixel G.
- the pixel 110 shown in FIG. 25B includes a subpixel 110a having a substantially trapezoidal top surface shape with rounded corners, a subpixel 110b having a substantially triangular top surface shape with rounded corners, and a substantially quadrangular or substantially hexagonal top surface shape with rounded corners. and a sub-pixel 110c having Also, the sub-pixel 110a has a larger light emitting area than the sub-pixel 110b.
- the shape and size of each sub-pixel can be determined independently. For example, sub-pixels with more reliable light emitting devices can be smaller in size.
- the sub-pixel 110a may be the green sub-pixel G
- the sub-pixel 110b may be the red sub-pixel R
- the sub-pixel 110c may be the blue sub-pixel B.
- FIG. 25C shows an example in which pixels 124a having sub-pixels 110a and 110b and pixels 124b having sub-pixels 110b and 110c are alternately arranged.
- the sub-pixel 110a may be the red sub-pixel R
- the sub-pixel 110b may be the green sub-pixel G
- the sub-pixel 110c may be the blue sub-pixel B.
- Pixel 124a has two sub-pixels (sub-pixels 110a and 110b) in the upper row (first row) and one sub-pixel (sub-pixel 110c) in the lower row (second row).
- Pixel 124b has one sub-pixel (sub-pixel 110c) in the upper row (first row) and two sub-pixels (sub-pixels 110a and 110b) in the lower row (second row).
- the sub-pixel 110a may be the red sub-pixel R
- the sub-pixel 110b may be the green sub-pixel G
- the sub-pixel 110c may be the blue sub-pixel B.
- FIG. 25D is an example in which each sub-pixel has a substantially square top surface shape with rounded corners
- FIG. 25E is an example in which each sub-pixel has a circular top surface shape.
- FIG. 25F is an example in which sub-pixels of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the positions of the upper sides of two sub-pixels (for example, sub-pixel 110a and sub-pixel 110b or sub-pixel 110b and sub-pixel 110c) aligned in the column direction are shifted.
- the sub-pixel 110a may be the red sub-pixel R
- the sub-pixel 110b may be the green sub-pixel G
- the sub-pixel 110c may be the blue sub-pixel B.
- the top surface shape of the sub-pixel may be a polygonal shape with rounded corners, an elliptical shape, a circular shape, or the like.
- the EL layer is processed into an island shape using a resist mask.
- the resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, depending on the heat resistance temperature of the EL layer material and the curing temperature of the resist material, curing of the resist film may be insufficient.
- a resist film that is insufficiently hardened may take a shape away from the desired shape during processing.
- the top surface shape of the EL layer may be a polygon with rounded corners, an ellipse, or a circle. For example, when a resist mask having a square top surface is formed, a resist mask having a circular top surface is formed, and the EL layer may have a circular top surface.
- a technique for correcting the mask pattern in advance so that the design pattern and the transfer pattern match.
- OPC Optical Proximity Correction
- a pattern for correction is added to a corner portion of a figure on a mask pattern.
- pixel 110 to which the stripe arrangement shown in FIG. 18A is applied for example, as shown in FIG. 110c can be a blue sub-pixel B;
- the pixel can have four types of sub-pixels.
- a stripe arrangement is applied to the pixels 110 shown in FIGS. 26A to 26C.
- FIG. 26A is an example in which each sub-pixel has a rectangular top surface shape
- FIG. 26B is an example in which each sub-pixel has a top surface shape connecting two semicircles and a rectangle
- FIG. This is an example where the sub-pixel has an elliptical top surface shape.
- a matrix arrangement is applied to the pixels 110 shown in FIGS. 26D to 26F.
- FIG. 26D is an example in which each sub-pixel has a square top surface shape
- FIG. 26E is an example in which each sub-pixel has a substantially square top surface shape with rounded corners
- FIG. which have a circular top shape.
- 26G and 26H show an example in which one pixel 110 is composed of 2 rows and 3 columns.
- the pixel 110 shown in FIG. 26G has three sub-pixels (sub-pixels 110a, 110b, 110c) in the upper row (first row) and one sub-pixel ( sub-pixel 110d).
- pixel 110 has sub-pixel 110a in the left column (first column), sub-pixel 110b in the middle column (second column), and sub-pixel 110b in the right column (third column). It has pixels 110c and sub-pixels 110d over these three columns.
- the pixel 110 shown in FIG. 26H has three sub-pixels (sub-pixels 110a, 110b, 110c) in the upper row (first row) and three sub-pixels 110d in the lower row (second row). have In other words, pixel 110 has sub-pixels 110a and 110d in the left column (first column), sub-pixels 110b and 110d in the center column (second column), and sub-pixels 110b and 110d in the middle column (second column).
- a column (third column) has a sub-pixel 110c and a sub-pixel 110d.
- a pixel 110 shown in FIGS. 26A to 26H is composed of four sub-pixels 110a, 110b, 110c, and 110d.
- the sub-pixels 110a, 110b, 110c, 110d have light emitting devices that emit different colors of light.
- As the sub-pixels 110a, 110b, 110c, and 110d four-color sub-pixels of R, G, B, and white (W), four-color sub-pixels of R, G, B, and Y, or R, G, and B , infrared light (IR) sub-pixels, and the like.
- subpixels 110a, 110b, 110c, and 110d can be red, green, blue, and white subpixels, respectively.
- a display panel of one embodiment of the present invention may include a light-receiving device in a pixel.
- three may be configured with light-emitting devices, and the remaining one may be configured with light-receiving devices.
- the sub-pixels 110a, 110b, and 110c may be three-color sub-pixels of R, G, and B, and the sub-pixel 110d may be a sub-pixel having a light receiving device.
- the pixels shown in FIGS. 28A and 28B have sub-pixels G, sub-pixels B, sub-pixels R, and sub-pixels PS. Note that the arrangement order of the sub-pixels is not limited to the illustrated configuration, and can be determined as appropriate. For example, the positions of sub-pixel G and sub-pixel R may be exchanged.
- a stripe arrangement is applied to the pixels shown in FIG. 28A.
- a matrix arrangement is applied to the pixels shown in FIG. 28B.
- the sub-pixel R has a light-emitting device that emits red light.
- Sub-pixel G has a light-emitting device that emits green light.
- Sub-pixel B has a light-emitting device that emits blue light.
- the sub-pixel PS has a light receiving device.
- the wavelength of light detected by the sub-pixel PS is not particularly limited.
- the sub-pixel PS can be configured to detect one or both of visible light and infrared light.
- the pixels shown in FIGS. 28C and 28D have sub-pixel G, sub-pixel B, sub-pixel R, sub-pixel X1, and sub-pixel X2. Note that the arrangement order of the sub-pixels is not limited to the illustrated configuration, and can be determined as appropriate. For example, the positions of sub-pixel G and sub-pixel R may be exchanged.
- FIG. 28C shows an example in which one pixel is provided over 2 rows and 3 columns.
- Three sub-pixels (sub-pixel G, sub-pixel B, and sub-pixel R) are provided in the upper row (first row).
- two sub-pixels (sub-pixel X1 and sub-pixel X2) are provided in the lower row (second row).
- FIG. 28D shows an example in which one pixel is composed of 3 rows and 2 columns.
- the first row has sub-pixels G
- the second row has sub-pixels R
- the two rows have sub-pixels B.
- the third row has two sub-pixels (sub-pixel X1 and sub-pixel X2).
- the pixel shown in FIG. 28D has three sub-pixels (sub-pixel G, sub-pixel R, and sub-pixel X2) in the left column (first column) and the right column (second column). has two sub-pixels (sub-pixel B and sub-pixel X1).
- the layout of sub-pixels R, G, and B shown in FIG. 28C is a stripe arrangement. Also, the layout of the sub-pixels R, G, and B shown in FIG. 28D is a so-called S-stripe arrangement. Thereby, high display quality can be realized.
- At least one of the sub-pixel X1 and the sub-pixel X2 preferably has a light-receiving device (it can also be said to be a sub-pixel PS).
- the layout of the pixels having the sub-pixels PS is not limited to the configurations shown in FIGS. 28A to 28D.
- the sub-pixel PS For the sub-pixel X1 or the sub-pixel X2, for example, a configuration having a light-emitting device that emits infrared light (IR) can be applied. At this time, the sub-pixel PS preferably detects infrared light. For example, while an image is displayed using the sub-pixels R, G, and B, one of the sub-pixels X1 and X2 is used as a light source, and the other of the sub-pixels X1 and X2 emits light from the light source. Reflected light can be detected.
- IR infrared light
- a configuration having a light receiving device can be applied to both the sub-pixel X1 and the sub-pixel X2.
- the wavelength ranges of light detected by the sub-pixel X1 and the sub-pixel X2 may be the same, different, or partly common.
- one of the sub-pixel X1 and the sub-pixel X2 may mainly detect visible light, and the other may mainly detect infrared light.
- the light receiving area of the sub-pixel X1 is smaller than the light receiving area of the sub-pixel X2.
- the smaller the light-receiving area the narrower the imaging range, which makes it possible to suppress the blurring of the imaging result and improve the resolution. Therefore, by using the sub-pixel X1, high-definition or high-resolution imaging can be performed as compared with the case of using the light receiving device included in the sub-pixel X2.
- the sub-pixel X1 can be used to capture an image for personal authentication using a fingerprint, palm print, iris, pulse shape (including vein shape and artery shape), face, or the like.
- the light-receiving device included in the sub-pixel PS preferably detects visible light, and preferably detects one or more of colors such as blue, purple, blue-violet, green, yellow-green, yellow, orange, and red. . Also, the light receiving device included in the sub-pixel PS may detect infrared light.
- the sub-pixel X2 is a touch sensor (also referred to as a direct touch sensor) or a near touch sensor (also referred to as a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor). It can be used for such as
- the sub-pixel X2 can appropriately determine the wavelength of light to be detected according to the application. For example, sub-pixel X2 preferably detects infrared light. This enables touch detection even in dark places.
- the touch sensor or near-touch sensor can detect the proximity or contact of an object (finger, hand, pen, etc.).
- a touch sensor can detect an object by bringing the display panel into direct contact with the object.
- the near-touch sensor can detect the target even if the target does not touch the display panel.
- the display panel can detect the target when the distance between the display panel and the target is 0.1 mm or more and 300 mm or less, preferably 3 mm or more and 50 mm or less.
- the display panel can be operated without direct contact with the object, in other words, the display panel can be operated without contact.
- the risk of staining or scratching the display panel can be reduced, or the display panel can be operated without direct contact with dirt (for example, dust or viruses) attached to the display panel by an object. It becomes possible to
- the display panel of one embodiment of the present invention can have a variable refresh rate.
- the power consumption can be reduced by adjusting the refresh rate (for example, in the range of 1 Hz to 240 Hz) according to the content displayed on the display panel.
- the drive frequency of the touch sensor or the near-touch sensor may be changed according to the refresh rate. For example, when the refresh rate of the display panel is 120 Hz, the driving frequency of the touch sensor or the near-touch sensor can be higher than 120 Hz (typically 240 Hz). With this structure, low power consumption can be achieved and the response speed of the touch sensor or the near touch sensor can be increased.
- the display panel 100 shown in FIGS. 28E to 28G has a layer 353 having a light receiving device, a functional layer 355, and a layer 357 having a light emitting device between a substrate 351 and a substrate 359.
- FIG. 1 A layer 353 having a light receiving device, a functional layer 355, and a layer 357 having a light emitting device between a substrate 351 and a substrate 359.
- the functional layer 355 has a circuit for driving the light receiving device and a circuit for driving the light emitting device.
- the functional layer 355 can be provided with switches, transistors, capacitors, resistors, wirings, terminals, and the like. Note that in the case of driving the light-emitting device and the light-receiving device by a passive matrix method, a structure in which the switch and the transistor are not provided may be employed.
- a finger 352 in contact with the display panel 100 reflects light emitted by a light emitting device in a layer 357 having a light emitting device, so that a light receiving device in a layer 353 having a light receiving device reflects the light. Detect light. Thereby, it is possible to detect that the finger 352 touches the display panel 100 .
- FIGS. 28F and 28G it may have a function of detecting or imaging an object that is close to (not in contact with) the display panel.
- FIG. 28F shows an example of detecting a finger of a person
- FIG. 28G shows an example of detecting information around, on the surface of, or inside the human eye (number of blinks, eyeball movement, eyelid movement, etc.).
- the light receiving device can be used to capture an image around the eye, the surface of the eye, or the inside of the eye (such as the fundus) of the user of the wearable device. Therefore, the wearable device can have a function of detecting any one or more selected from the user's blink, black eye movement, and eyelid movement.
- various layouts can be applied to pixels each including sub-pixels each including a light-emitting device.
- a structure in which a pixel includes both a light-emitting device and a light-receiving device can be applied to the display panel of one embodiment of the present invention. Also in this case, various layouts can be applied.
- the display panel of this embodiment can be a high-definition display panel. Therefore, the display panel of the present embodiment can be used, for example, in information terminal devices (wearable devices) such as wristwatch-type and bracelet-type display units, VR devices such as head-mounted displays, and eyeglass-type AR devices. It can be used for the display part of wearable devices that can be worn on the head, such as devices for smartphones.
- information terminal devices wearable devices
- VR devices such as head-mounted displays
- eyeglass-type AR devices eyeglass-type AR devices. It can be used for the display part of wearable devices that can be worn on the head, such as devices for smartphones.
- the display panel of this embodiment can be a high-resolution display panel or a large-sized display panel. Therefore, the display panel of the present embodiment can be used for relatively large screens such as televisions, desktop or notebook personal computers, computer monitors, digital signage, and large game machines such as pachinko machines. It can be used for display portions of digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, and sound reproducing devices, in addition to electronic devices equipped with
- the display panel of the present embodiment since the light-emitting devices are separately manufactured for each emission color, there is little change in chromaticity between low-luminance light emission and high-luminance light emission.
- the display panel of this embodiment mode since the EL layers included in the light emitting devices are separated, crosstalk between adjacent sub-pixels can be suppressed even in a high-definition display panel. Therefore, a display panel with high definition and high display quality can be realized.
- the display panel of this embodiment can be used for the display portion of the electronic device of one embodiment of the present invention.
- FIG. 29A shows a perspective view of display module 280 .
- the display module 280 has a display panel 100A and an FPC 290 .
- the display panel included in the display module 280 is not limited to the display panel 100A, and may be any one of the display panels 100B to 100F, which will be described later.
- the display module 280 has substrates 291 and 292 .
- the display module 280 has a display section 281 .
- the display unit 281 is an area for displaying an image in the display module 280, and is an area where light from each pixel provided in the pixel unit 284, which will be described later, can be visually recognized.
- FIG. 29B shows a perspective view schematically showing the configuration on the substrate 291 side.
- a circuit section 282 , a pixel circuit section 283 on the circuit section 282 , and a pixel section 284 on the pixel circuit section 283 are stacked on the substrate 291 .
- a terminal portion 285 for connecting to the FPC 290 is provided on a portion of the substrate 291 that does not overlap with the pixel portion 284 .
- the terminal portion 285 and the circuit portion 282 are electrically connected by a wiring portion 286 composed of a plurality of wirings.
- the pixel section 284 has a plurality of periodically arranged pixels 284a. An enlarged view of one pixel 284a is shown on the right side of FIG. 29B.
- the pixel 284a has a light emitting device 130R that emits red light, a light emitting device 130G that emits green light, and a light emitting device 130B that emits blue light.
- the display unit 281 corresponds to the display unit 11 described in the first embodiment. Also, the pixel 284a corresponds to the pixel 17 described in the first embodiment. Also, the pixel 284a corresponds to the pixel 110 described in the fourth embodiment.
- the pixel circuit section 283 has a plurality of periodically arranged pixel circuits 283a.
- One pixel circuit 283a is a circuit that controls light emission of three light emitting devices included in one pixel 284a.
- One pixel circuit 283a may have a structure in which three circuits for controlling light emission of one light emitting device are provided.
- the pixel circuit 283a can have at least one selection transistor, one current control transistor (driving transistor), and a capacitive element for each light emitting device. At this time, a gate signal is inputted to the gate of the selection transistor, and a source signal is inputted to the source thereof. This realizes an active matrix display panel.
- the circuit section 282 has a circuit that drives each pixel circuit 283 a of the pixel circuit section 283 .
- a circuit that drives each pixel circuit 283 a of the pixel circuit section 283 For example, it is preferable to have one or both of a gate line driver circuit and a source line driver circuit.
- at least one of an arithmetic circuit, a memory circuit, a power supply circuit, and the like may be provided.
- the FPC 290 functions as wiring for supplying a video signal, power supply potential, or the like to the circuit section 282 from the outside. Also, an IC may be mounted on the FPC 290 .
- the aperture ratio (effective display area ratio) of the display portion 281 is can be very high.
- the aperture ratio of the display section 281 can be 40% or more and less than 100%, preferably 50% or more and 95% or less, more preferably 60% or more and 95% or less.
- the pixels 284a can be arranged at an extremely high density, and the definition of the display portion 281 can be extremely high.
- the pixels 284a may be arranged with a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and still more preferably 6000 ppi or more, and 20000 ppi or less, or 30000 ppi or less. preferable.
- a display module 280 Since such a display module 280 has extremely high definition, it can be suitably used for devices for VR such as head-mounted displays, or glasses-type devices for AR. For example, even in the case of a configuration in which the display portion of the display module 280 is viewed through a lens, the display module 280 has an extremely high-definition display portion 281, so pixels cannot be viewed even if the display portion is enlarged with the lens. , a highly immersive display can be performed. Moreover, the display module 280 is not limited to this, and can be suitably used for electronic equipment having a relatively small display unit. For example, it can be suitably used for a display part of a wearable electronic device such as a wristwatch.
- Display panel 100A A display panel 100A shown in FIG.
- the substrate 301 corresponds to the substrate 291 in FIGS. 29A and 29B.
- a laminated structure from the substrate 301 to the insulating layer 255c corresponds to the layer 101 in the fifth embodiment.
- a transistor 310 is a transistor having a channel formation region in the substrate 301 .
- the substrate 301 for example, a semiconductor substrate such as a single crystal silicon substrate can be used.
- Transistor 310 includes a portion of substrate 301 , conductive layer 311 , low resistance region 312 , insulating layer 313 and insulating layer 314 .
- the conductive layer 311 functions as a gate electrode.
- An insulating layer 313 is located between the substrate 301 and the conductive layer 311 and functions as a gate insulating layer.
- the low-resistance region 312 is a region in which the substrate 301 is doped with impurities and functions as either a source or a drain.
- the insulating layer 314 is provided to cover the side surface of the conductive layer 311 and functions as an insulating layer.
- a device isolation layer 315 is provided between two adjacent transistors 310 so as to be embedded in the substrate 301 .
- An insulating layer 261 is provided to cover the transistor 310 , and a capacitor 240 is provided over the insulating layer 261 .
- the capacitor 240 has a conductive layer 241, a conductive layer 245, and an insulating layer 243 positioned therebetween.
- the conductive layer 241 functions as one electrode of the capacitor 240
- the conductive layer 245 functions as the other electrode of the capacitor 240
- the insulating layer 243 functions as the dielectric of the capacitor 240 .
- the conductive layer 241 is provided on the insulating layer 261 and embedded in the insulating layer 254 .
- Conductive layer 241 is electrically connected to one of the source or drain of transistor 310 by plug 271 embedded in insulating layer 261 .
- An insulating layer 243 is provided over the conductive layer 241 .
- the conductive layer 245 is provided in a region overlapping with the conductive layer 241 with the insulating layer 243 provided therebetween.
- An insulating layer 255a is provided to cover the capacitor 240, an insulating layer 255b is provided on the insulating layer 255a, and an insulating layer 255c is provided on the insulating layer 255b.
- Various inorganic insulating films such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, and a nitride oxide insulating film can be preferably used as the insulating layer 255a, the insulating layer 255b, and the insulating layer 255c, respectively.
- an oxide insulating film or an oxynitride insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film is preferably used.
- a nitride insulating film or a nitride oxide insulating film such as a silicon nitride film or a silicon nitride oxide film is preferably used. More specifically, a silicon oxide film is preferably used for the insulating layers 255a and 255c, and a silicon nitride film is preferably used for the insulating layer 255b.
- the insulating layer 255b preferably functions as an etching protection film. In this embodiment mode, an example in which the insulating layer 255c is provided with the recessed portion is shown; however, the insulating layer 255c may not be provided with the recessed portion.
- FIG. 30A shows an example in which the light emitting device 130R, the light emitting device 130G, and the light emitting device 130B have the laminated structure shown in FIG. 18B.
- the light-emitting device is separately manufactured for each emission color, so the change in chromaticity is small between low-luminance light emission and high-luminance light emission.
- the first layer 113a, the second layer 113b, and the third layer 113c are separated and separated from each other, even in a high-definition display panel, the cross between adjacent sub-pixels can be reduced. It is possible to suppress the occurrence of talk. Therefore, a display panel with high definition and high display quality can be realized.
- An insulator is provided in the region between adjacent light emitting devices.
- an insulating layer 125 and an insulating layer 127 over the insulating layer 125 are provided in this region.
- a sacrificial layer 118a is positioned on the first layer 113a of the light-emitting device 130R, a sacrificial layer 118b is positioned on the second layer 113b of the light-emitting device 130G, and a third layer 113b of the light-emitting device 130B.
- a sacrificial layer 118c is located on the layer 113c.
- the pixel electrode 111a, the pixel electrode 111b, and the pixel electrode 111c of the light-emitting device are composed of the insulating layer 243, the insulating layer 255a, the insulating layer 255b, and the insulating layer 255c, the plug 256 embedded in the insulating layer 255c, and the conductive layer embedded in the insulating layer 254. It is electrically connected to one of the source or drain of transistor 310 by layer 241 and plug 271 embedded in insulating layer 261 .
- the height of the upper surface of the insulating layer 255c and the height of the upper surface of the plug 256 match or substantially match.
- Various conductive materials can be used for the plug.
- a protective layer 131 is provided on the light emitting device 130R, the light emitting device 130G, and the light emitting device 130B.
- a substrate 120 is bonded onto the protective layer 131 with a resin layer 122 .
- Embodiment 5 can be referred to for details of the components from the light emitting device to the substrate 120 .
- Substrate 120 corresponds to substrate 292 in FIG. 29A.
- no insulating layer is provided between the pixel electrode 111a and the first layer 113a. Further, no insulating layer is provided between the pixel electrode 111b and the second layer 113b to cover the edge of the upper surface of the pixel electrode 111b. Therefore, the interval between adjacent light emitting devices can be made very narrow. Therefore, a high-definition or high-resolution display panel can be obtained.
- the display panel 100A has the light-emitting devices 130R, 130G, and 130B, the display panel of the present embodiment may further have light-receiving devices.
- the display panel shown in FIG. 30B is an example having light emitting devices 130R and 130G and a light receiving device 150.
- the light receiving device 150 has a pixel electrode 111d, a fourth layer 113d, a common layer 114, and a common electrode 115 which are stacked.
- Embodiment 5 can be referred to for details of the components of the light receiving device 150 .
- a display panel 100B shown in FIG. 31 has a structure in which a transistor 310A and a transistor 310B each having a channel formed in a semiconductor substrate are stacked.
- the description of the same parts as those of the previously described display panel may be omitted.
- the display panel 100B has a configuration in which a substrate 301B provided with a transistor 310B, a capacitor 240, and a light emitting device and a substrate 301A provided with a transistor 310A are bonded together.
- an insulating layer 345 on the lower surface of the substrate 301B.
- an insulating layer 346 is preferably provided over the insulating layer 261 provided over the substrate 301A.
- the insulating layers 345 and 346 are insulating layers that function as protective layers, and can suppress diffusion of impurities into the substrates 301B and 301A.
- an inorganic insulating film that can be used for the protective layer 131 or the insulating layer 332 can be used.
- a plug 343 penetrating through the substrate 301B and the insulating layer 345 is provided on the substrate 301B.
- the insulating layer 344 is an insulating layer that functions as a protective layer and can suppress diffusion of impurities into the substrate 301B.
- an inorganic insulating film that can be used for the protective layer 131 can be used.
- a conductive layer 342 is provided under the insulating layer 345 on the back surface side (surface opposite to the substrate 120 side) of the substrate 301B.
- the conductive layer 342 is preferably embedded in the insulating layer 335 .
- the lower surfaces of the conductive layer 342 and the insulating layer 335 are preferably planarized.
- the conductive layer 342 is electrically connected with the plug 343 .
- the conductive layer 341 is provided on the insulating layer 346 on the substrate 301A.
- the conductive layer 341 is preferably embedded in the insulating layer 336 . It is preferable that top surfaces of the conductive layer 341 and the insulating layer 336 be planarized.
- the substrates 301A and 301B are electrically connected.
- the conductive layer 341 and the conductive layer 342 are bonded together. can be improved.
- the same conductive material is preferably used for the conductive layers 341 and 342 .
- a metal film containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or a metal nitride film (titanium nitride film, molybdenum nitride film, tungsten nitride film) containing the above elements as components etc. can be used.
- copper is preferably used for the conductive layers 341 and 342 .
- a Cu—Cu (copper-copper) direct bonding technique (a technique for achieving electrical continuity by connecting Cu (copper) pads) can be applied.
- Display panel 100C A display panel 100C shown in FIG.
- the conductive layers 341 and 342 can be electrically connected.
- the bumps 347 can be formed using a conductive material containing, for example, gold (Au), nickel (Ni), indium (In), tin (Sn), or the like. Also, for example, solder may be used as the bumps 347 . Further, an adhesive layer 348 may be provided between the insulating layer 345 and the insulating layer 346 . Further, when the bump 347 is provided, the insulating layer 335 and the insulating layer 336 may not be provided.
- Display panel 100D A display panel 100D shown in FIG. 33 is mainly different from the display panel 100A in that the configuration of transistors is different.
- the transistor 320 is a transistor (OS transistor) in which a metal oxide (also referred to as an oxide semiconductor) is applied to a semiconductor layer in which a channel is formed.
- OS transistor a transistor in which a metal oxide (also referred to as an oxide semiconductor) is applied to a semiconductor layer in which a channel is formed.
- the transistor 320 has a semiconductor layer 321 , an insulating layer 323 , a conductive layer 324 , a pair of conductive layers 325 , an insulating layer 326 , and a conductive layer 327 .
- the substrate 331 corresponds to the substrate 291 in FIGS. 29A and 29B.
- a laminated structure from the substrate 331 to the insulating layer 255c corresponds to the layer 101 in the fifth embodiment.
- the substrate 331 an insulating substrate or a semiconductor substrate can be used.
- An insulating layer 332 is provided on the substrate 331 .
- the insulating layer 332 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the substrate 331 into the transistor 320 and oxygen from the semiconductor layer 321 toward the insulating layer 332 side.
- a film into which hydrogen or oxygen is less likely to diffuse than a silicon oxide film such as an aluminum oxide film, a hafnium oxide film, or a silicon nitride film, can be used.
- a conductive layer 327 is provided over the insulating layer 332 , and an insulating layer 326 is provided to cover the conductive layer 327 .
- the conductive layer 327 functions as a first gate electrode of the transistor 320, and part of the insulating layer 326 functions as a first gate insulating layer.
- An oxide insulating film such as a silicon oxide film is preferably used for at least a portion of the insulating layer 326 that is in contact with the semiconductor layer 321 .
- the upper surface of the insulating layer 326 is preferably planarized.
- the semiconductor layer 321 is provided on the insulating layer 326 .
- the semiconductor layer 321 preferably includes a metal oxide (also referred to as an oxide semiconductor) film having semiconductor characteristics.
- a pair of conductive layers 325 is provided on and in contact with the semiconductor layer 321 and functions as a source electrode and a drain electrode.
- An insulating layer 328 is provided covering the top and side surfaces of the pair of conductive layers 325 and the side surface of the semiconductor layer 321, and the insulating layer 264 is provided on the insulating layer 328.
- the insulating layer 328 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing into the semiconductor layer 321 from the insulating layer 264 or the like and oxygen from leaving the semiconductor layer 321 .
- an insulating film similar to the insulating layer 332 can be used as the insulating layer 328.
- An opening reaching the semiconductor layer 321 is provided in the insulating layer 328 and the insulating layer 264 .
- the insulating layer 323 and the conductive layer 324 are buried in contact with the side surfaces of the insulating layer 264 , the insulating layer 328 , and the conductive layer 325 and the top surface of the semiconductor layer 321 .
- the conductive layer 324 functions as a second gate electrode, and the insulating layer 323 functions as a second gate insulating layer.
- the top surface of the conductive layer 324, the top surface of the insulating layer 323, and the top surface of the insulating layer 264 are planarized so that their heights are the same or substantially the same, and the insulating layers 329 and 265 are provided to cover them. ing.
- the insulating layers 264 and 265 function as interlayer insulating layers.
- the insulating layer 329 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing into the transistor 320 from the insulating layer 265 or the like.
- an insulating film similar to the insulating layers 328 and 332 can be used.
- a plug 274 electrically connected to one of the pair of conductive layers 325 is provided so as to be embedded in the insulating layer 265 , the insulating layer 329 , the insulating layer 264 and the insulating layer 328 .
- the plug 274 includes a conductive layer 274a that covers the side surfaces of the openings of the insulating layers 265, the insulating layers 329, the insulating layers 264, and the insulating layer 328 and part of the top surface of the conductive layer 325, and the conductive layer 274a. It is preferable to have a conductive layer 274b in contact with the top surface. At this time, a conductive material into which hydrogen and oxygen are difficult to diffuse is preferably used for the conductive layer 274a.
- a display panel 100E illustrated in FIG. 34 has a structure in which a transistor 320A and a transistor 320B each including an oxide semiconductor as a semiconductor in which a channel is formed are stacked.
- the display panel 100D can be used for the configuration of the transistor 320A, the transistor 320B, and their peripherals.
- transistors each including an oxide semiconductor are stacked here, the structure is not limited to this.
- a structure in which three or more transistors are stacked may be employed.
- a display panel 100F illustrated in FIG. 35 has a structure in which a transistor 310 in which a channel is formed over a substrate 301 and a transistor 320 including a metal oxide in a semiconductor layer in which the channel is formed are stacked.
- An insulating layer 261 is provided to cover the transistor 310 , and a conductive layer 251 is provided over the insulating layer 261 .
- An insulating layer 262 is provided to cover the conductive layer 251 , and the conductive layer 252 is provided over the insulating layer 262 .
- the conductive layers 251 and 252 each function as wirings.
- An insulating layer 263 and an insulating layer 332 are provided to cover the conductive layer 252 , and the transistor 320 is provided over the insulating layer 332 .
- An insulating layer 265 is provided to cover the transistor 320 and a capacitor 240 is provided over the insulating layer 265 . Capacitor 240 and transistor 320 are electrically connected by plug 274 .
- the transistor 320 can be used as a transistor forming a pixel circuit. Further, the transistor 310 can be used as a transistor forming a pixel circuit or a transistor forming a driver circuit (a gate line driver circuit or a source line driver circuit) for driving the pixel circuit. Further, the transistors 310 and 320 can be used as transistors included in various circuits such as an arithmetic circuit and a memory circuit.
- FIG. 36 shows a perspective view of the display panel 100G
- FIG. 37A shows a cross-sectional view of the display panel 100G.
- the display panel 100G has a configuration in which a substrate 152 and a substrate 151 are bonded together.
- the substrate 152 is clearly indicated by dashed lines.
- the display panel 100G has a display section 162, a connection section 140, a circuit 164, wiring 165, and the like.
- FIG. 36 shows an example in which an IC 173 and an FPC 172 are mounted on the display panel 100G. Therefore, the configuration shown in FIG. 36 can also be said to be a display module having the display panel 100G, an IC (integrated circuit), and an FPC.
- connection part 140 is provided outside the display part 162 .
- the connection portion 140 can be provided along one side or a plurality of sides of the display portion 162 .
- the number of connection parts 140 may be singular or plural.
- FIG. 36 shows an example in which connecting portions 140 are provided so as to surround the four sides of the display portion.
- the connection part 140 the common electrode of the light emitting device and the conductive layer are electrically connected, and a potential can be supplied to the common electrode.
- a scanning line driving circuit for example, can be used as the circuit 164 .
- the wiring 165 has a function of supplying signals and power to the display section 162 and the circuit 164 .
- the signal and power are input to the wiring 165 from the outside through the FPC 172 or input to the wiring 165 from the IC 173 .
- FIG. 36 shows an example in which the IC 173 is provided on the substrate 151 by a COG (Chip On Glass) method, a COF (Chip on Film) method, or the like.
- a COG Chip On Glass
- COF Chip on Film
- the IC 173 for example, an IC having a scanning line driver circuit or a signal line driver circuit can be applied.
- the display panel 100G and the display module may be configured without an IC.
- the IC may be mounted on the FPC by the COF method or the like.
- part of the area including the FPC 172, part of the circuit 164, part of the display part 162, part of the connection part 140, and part of the area including the edge of the display panel 100G are cut off.
- An example of a cross section is shown.
- the display panel 100G shown in FIG. 37A includes a transistor 201 and a transistor 205, a light-emitting device 130R that emits red light, a light-emitting device 130G that emits green light, and a light-emitting device that emits blue light. It has a device 130B and the like.
- the light-emitting devices 130R, 130G, and 130B each have the laminated structure shown in FIG. 18B, except that the configurations of the pixel electrodes are different.
- Embodiment 5 can be referred to for details of the light-emitting device.
- the display panel 100G light emitting devices are separately manufactured for each emission color, so there is little change in chromaticity between light emission at low luminance and light emission at high luminance.
- the first layer 113a, the second layer 113b, and the third layer 113c are separated and separated from each other, even in a high-definition display panel, the cross between adjacent sub-pixels can be reduced. It is possible to suppress the occurrence of talk. Therefore, a display panel with high definition and high display quality can be realized.
- the light emitting device 130R has a conductive layer 112a, a conductive layer 126a on the conductive layer 112a, and a conductive layer 129a on the conductive layer 126a. All of the conductive layers 112a, 126a, and 129a can be called pixel electrodes, and some of them can be called pixel electrodes.
- the light emitting device 130G has a conductive layer 112b, a conductive layer 126b on the conductive layer 112b, and a conductive layer 129b on the conductive layer 126b.
- the light emitting device 130B has a conductive layer 112c, a conductive layer 126c on the conductive layer 112c, and a conductive layer 129c on the conductive layer 126c.
- the conductive layer 112a is connected to the conductive layer 222b of the transistor 205 through an opening provided in the insulating layer 214 or the like.
- the end of the conductive layer 126a is located outside the end of the conductive layer 112a.
- the end of the conductive layer 126a and the end of the conductive layer 129a are aligned or substantially aligned.
- a conductive layer functioning as a reflective electrode can be used for the conductive layers 112a and 126a
- a conductive layer functioning as a transparent electrode can be used for the conductive layer 129a.
- the conductive layers 112b, 126b, and 129b in the light-emitting device 130G and the conductive layers 112c, 126c, and 129c in the light-emitting device 130B are the same as the conductive layers 112a, 126a, and 129a in the light-emitting device 130R, so detailed description thereof is omitted. .
- Concave portions are formed in the conductive layers 112a, 112b, and 112c so as to cover openings provided in the insulating layer 214 and the like.
- a layer 128 is embedded in the recess.
- the layer 128 has a function of planarizing the concave portions of the conductive layers 112a, 112b, and 112c.
- Conductive layers 126a, 126b, and 126c electrically connected to the conductive layers 112a, 112b, and 112c are provided over the conductive layers 112a, 112b, and 112c and the layer 128, respectively. Therefore, regions overlapping with the concave portions of the conductive layers 112a, 112b, and 112c can also be used as light emitting regions, and the aperture ratio of pixels can be increased.
- the layer 128 may be an insulating layer or a conductive layer.
- Various inorganic insulating materials, organic insulating materials, and conductive materials can be used as appropriate for layer 128 .
- layer 128 is preferably formed using an insulating material.
- An insulating layer containing an organic material can be suitably used as the layer 128 .
- an acrylic resin, a polyimide resin, an epoxy resin, a polyamide resin, a polyimideamide resin, a siloxane resin, a benzocyclobutene resin, a phenol resin, precursors of these resins, or the like can be applied.
- a photosensitive resin can be used as the layer 128 .
- a positive material or a negative material can be used for the photosensitive resin.
- the layer 128 can be produced only through the steps of exposure and development, and the influence of dry etching, wet etching, or the like on the surfaces of the conductive layers 112a, 112b, and 112c can be reduced. Further, when the layer 128 is formed using a negative photosensitive resin, the layer 128 can be formed using the same photomask (exposure mask) used for forming the opening of the insulating layer 214 in some cases. be.
- the top and side surfaces of the conductive layer 126a and the top and side surfaces of the conductive layer 129a are covered with the first layer 113a.
- the top and side surfaces of the conductive layer 126b and the top and side surfaces of the conductive layer 129b are covered with the second layer 113b.
- the top and side surfaces of the conductive layer 126c and the top and side surfaces of the conductive layer 129c are covered with the third layer 113c. Therefore, the entire regions where the conductive layers 126a, 126b, and 126c are provided can be used as the light-emitting regions of the light-emitting devices 130R, 130G, and 130B, so that the aperture ratio of pixels can be increased.
- the side surfaces of the first layer 113a, the second layer 113b, and the third layer 113c are covered with insulating layers 125 and 127, respectively.
- a sacrificial layer 118 a is located between the first layer 113 a and the insulating layer 125 .
- a sacrificial layer 118b is positioned between the second layer 113b and the insulating layer 125, and a sacrificial layer 118c is positioned between the third layer 113c and the insulating layer 125.
- a common layer 114 is provided over the first layer 113 a , the second layer 113 b , the third layer 113 c , and the insulating layers 125 and 127 , and the common electrode 115 is provided over the common layer 114 .
- the common layer 114 and the common electrode 115 are each a series of films commonly provided for a plurality of light emitting devices.
- a protective layer 131 is provided on the light emitting devices 130R, 130G, and 130B. By providing the protective layer 131 that covers the light-emitting device, it is possible to prevent impurities such as water from entering the light-emitting device and improve the reliability of the light-emitting device.
- the protective layer 131 and the substrate 152 are adhered via the adhesive layer 142 .
- a solid sealing structure, a hollow sealing structure, or the like can be applied to sealing the light-emitting device.
- the space between substrates 152 and 151 is filled with an adhesive layer 142 to apply a solid sealing structure.
- the space may be filled with an inert gas (such as nitrogen or argon) to apply a hollow sealing structure.
- the adhesive layer 142 may be provided so as not to overlap the light emitting device.
- the space may be filled with a resin different from the adhesive layer 142 provided in a frame shape.
- a conductive layer 123 is provided on the insulating layer 214 in the connecting portion 140 .
- the conductive layer 123 includes a conductive film obtained by processing the same conductive film as the conductive layers 112a, 112b, and 112c and a conductive film obtained by processing the same conductive film as the conductive layers 126a, 126b, and 126c. , and a conductive film obtained by processing the same conductive film as the conductive layers 129a, 129b, and 129c.
- the ends of the conductive layer 123 are covered with the sacrificial layer 118 a , the insulating layer 125 and the insulating layer 127 .
- a common layer 114 is provided over the conductive layer 123 , and a common electrode 115 is provided over the common layer 114 .
- the conductive layer 123 and the common electrode 115 are electrically connected through the common layer 114 .
- the common layer 114 may not be formed in the connecting portion 140 . In this case, the conductive layer 123 and the common electrode 115 are directly contacted and electrically connected.
- the display panel 100G is of top emission type. Light emitted by the light emitting device is emitted to the substrate 152 side. A material having high visible light transmittance is preferably used for the substrate 152 .
- the pixel electrode contains a material that reflects visible light, and the counter electrode (common electrode 115) contains a material that transmits visible light.
- a laminated structure from the substrate 151 to the insulating layer 214 corresponds to the layer 101 in the fifth embodiment.
- Both the transistor 201 and the transistor 205 are formed over the substrate 151 . These transistors can be made with the same material and the same process.
- An insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are provided on the substrate 151 in this order.
- Part of the insulating layer 211 functions as a gate insulating layer of each transistor.
- Part of the insulating layer 213 functions as a gate insulating layer of each transistor.
- An insulating layer 215 is provided over the transistor.
- An insulating layer 214 is provided over the transistor and functions as a planarization layer. Note that the number of gate insulating layers and the number of insulating layers covering a transistor are not limited, and each may have a single layer or two or more layers.
- a material in which impurities such as water and hydrogen are difficult to diffuse for at least one insulating layer covering the transistor.
- Inorganic insulating films are preferably used for the insulating layer 211, the insulating layer 213, and the insulating layer 215, respectively.
- As the inorganic insulating film for example, a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, an aluminum nitride film, or the like can be used.
- a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, a neodymium oxide film, or the like may be used.
- two or more of the insulating films described above may be laminated and used.
- An organic insulating layer is suitable for the insulating layer 214 that functions as a planarization layer.
- Materials that can be used for the organic insulating layer include acrylic resins, polyimide resins, epoxy resins, polyamide resins, polyimideamide resins, siloxane resins, benzocyclobutene-based resins, phenolic resins, precursors of these resins, and the like.
- the insulating layer 214 may have a laminated structure of an organic insulating layer and an inorganic insulating layer. The outermost layer of the insulating layer 214 preferably functions as an etching protective layer.
- a recess in the insulating layer 214 can be suppressed when the conductive layer 112a, the conductive layer 126a, or the conductive layer 129a is processed.
- recesses may be provided in the insulating layer 214 when the conductive layers 112a, 126a, 129a, or the like are processed.
- the transistors 201 and 205 include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, conductive layers 222a and 222b functioning as sources and drains, a semiconductor layer 231, and an insulating layer functioning as a gate insulating layer. It has a layer 213 and a conductive layer 223 that functions as a gate. Here, the same hatching pattern is applied to a plurality of layers obtained by processing the same conductive film.
- the insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231 .
- the insulating layer 213 is located between the conductive layer 223 and the semiconductor layer 231 .
- the structure of the transistor included in the display panel of this embodiment is not particularly limited.
- a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used.
- the transistor structure may be either a top-gate type or a bottom-gate type.
- gates may be provided above and below a semiconductor layer in which a channel is formed.
- a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates is applied to the transistors 201 and 205 .
- a transistor may be driven by connecting two gates and applying the same signal to them.
- the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and applying a potential for driving to the other.
- Crystallinity of a semiconductor material used for a transistor is not particularly limited, either an amorphous semiconductor or a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region). may be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.
- a semiconductor layer of a transistor preferably includes a metal oxide (also referred to as an oxide semiconductor).
- the display panel of this embodiment preferably uses a transistor in which a metal oxide is used for a channel formation region (hereinafter referred to as an OS transistor).
- crystalline oxide semiconductors examples include CAAC (c-axis-aligned crystalline)-OS, nc (nanocrystalline)-OS, and the like.
- a transistor using silicon for a channel formation region may be used.
- silicon examples include monocrystalline silicon, polycrystalline silicon, amorphous silicon, and the like.
- a transistor including low-temperature polysilicon (LTPS) in a semiconductor layer hereinafter also referred to as an LTPS transistor
- the LTPS transistor has high field effect mobility and good frequency characteristics.
- Si transistors such as LTPS transistors
- circuits that need to be driven at high frequencies for example, source driver circuits
- the external circuit mounted on the display panel can be simplified, and the parts cost and mounting cost can be reduced.
- An OS transistor has extremely high field effect mobility compared to a transistor using amorphous silicon.
- an OS transistor has extremely low source-drain leakage current (hereinafter also referred to as an off-state current) in an off state, and can retain charge accumulated in a capacitor connected in series with the transistor for a long time. is possible. Further, by using the OS transistor, power consumption of the display panel can be reduced.
- the off current value of the OS transistor per 1 ⁇ m of channel width at room temperature is 1 aA (1 ⁇ 10 ⁇ 18 A) or less, 1 zA (1 ⁇ 10 ⁇ 21 A) or less, or 1 yA (1 ⁇ 10 ⁇ 24 A) or less.
- the off current value of the Si transistor per 1 ⁇ m channel width at room temperature is 1 fA (1 ⁇ 10 ⁇ 15 A) or more and 1 pA (1 ⁇ 10 ⁇ 12 A) or less. Therefore, it can be said that the off-state current of the OS transistor is about ten digits smaller than the off-state current of the Si transistor.
- the amount of current flowing through the light emitting device it is necessary to increase the amount of current flowing through the light emitting device.
- the OS transistor when the transistor operates in the saturation region, the OS transistor can reduce the change in the current between the source and the drain with respect to the change in the voltage between the gate and the source compared to the Si transistor. Therefore, by applying an OS transistor as a drive transistor included in a pixel circuit, the current flowing between the source and the drain can be finely determined according to the change in the voltage between the gate and the source. You can control it. Therefore, the number of gradations in the pixel circuit can be increased.
- the OS transistor flows a more stable current (saturation current) than the Si transistor even when the source-drain voltage gradually increases. be able to. Therefore, by using the OS transistor as the driving transistor, a stable current can be supplied to the light-emitting device even when the current-voltage characteristics of the EL device vary, for example. That is, when the OS transistor operates in the saturation region, even if the source-drain voltage is increased, the source-drain current hardly changes, so that the light emission luminance of the light-emitting device can be stabilized.
- an OS transistor as a driving transistor included in a pixel circuit, it is possible to suppress black floating, increase emission luminance, provide multiple gradations, and suppress variations in light emitting devices. can be planned.
- Metal oxides used for the semiconductor layer include, for example, indium and M (M is gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum , cerium, neodymium, hafnium, tantalum, tungsten, and magnesium) and zinc.
- M is preferably one or more selected from aluminum, gallium, yttrium, and tin.
- an oxide also referred to as IGZO
- IGZO oxide containing indium (In), gallium (Ga), and zinc
- an oxide containing indium, tin, and zinc is preferably used.
- oxides containing indium, gallium, tin, and zinc are preferably used.
- an oxide containing indium (In), aluminum (Al), and zinc (Zn) is preferably used.
- an oxide containing indium (In), aluminum (Al), gallium (Ga), and zinc (Zn) also referred to as IAGZO
- IAGZO oxide containing indium (In), aluminum (Al), gallium (Ga), and zinc (Zn)
- the atomic ratio of In in the In-M-Zn oxide is preferably equal to or higher than the atomic ratio of M.
- the transistor included in the circuit 164 and the transistor included in the display portion 162 may have the same structure or different structures.
- the plurality of transistors included in the circuit 164 may all have the same structure, or may have two or more types.
- the structures of the plurality of transistors included in the display portion 162 may all be the same, or may be of two or more types.
- All of the transistors in the display portion 162 may be OS transistors, all of the transistors in the display portion 162 may be Si transistors, or some of the transistors in the display portion 162 may be OS transistors and the rest may be Si transistors. good.
- LTPS transistors and OS transistors are combined in the display unit 162
- a display panel with low power consumption and high driving capability can be realized.
- a structure in which an LTPS transistor and an OS transistor are combined is sometimes called an LTPO.
- an OS transistor is used as a transistor or the like that functions as a switch for controlling conduction or non-conduction between wirings, and an LTPS transistor is used as a transistor or the like that controls current. .
- one of the transistors included in the display portion 162 functions as a transistor for controlling the current flowing through the light emitting device and can also be called a driving transistor.
- One of the source and drain of the driving transistor is electrically connected to the pixel electrode of the light emitting device.
- An LTPS transistor is preferably used as the driving transistor. This makes it possible to increase the current flowing through the light emitting device in the pixel circuit.
- the other transistor included in the display unit 162 functions as a switch for controlling selection and non-selection of pixels, and can also be called a selection transistor.
- the gate of the selection transistor is electrically connected to the gate line, and one of the source and the drain is electrically connected to the source line (signal line).
- An OS transistor is preferably used as the selection transistor.
- the display panel of one embodiment of the present invention can have high aperture ratio, high definition, high display quality, and low power consumption.
- the display panel of one embodiment of the present invention includes an OS transistor and a light-emitting device with an MML (metal maskless) structure.
- the light-emitting device having the MML structure refers to a light-emitting device manufactured without using a metal mask or FMM (fine metal mask, high-definition metal mask).
- FMM fine metal mask, high-definition metal mask.
- leakage current that can flow through the transistor and leakage current that can flow between adjacent light-emitting devices also referred to as lateral leakage current, side leakage current, or the like
- an observer can observe one or more of image sharpness, image sharpness, high saturation, and high contrast ratio. Note that by adopting a structure in which leakage current that can flow in the transistor and lateral leakage current between light-emitting devices are extremely small, light leakage that can occur during black display can be minimized.
- the transistor 209 and the transistor 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer 231 having a channel formation region 231i and a pair of low-resistance regions 231n, and one of the pair of low-resistance regions 231n.
- a conductive layer 222a connected to a pair of low-resistance regions 231n, a conductive layer 222b connected to the other of a pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223 have
- the insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i.
- the insulating layer 225 is located at least between the conductive layer 223 and the channel formation region 231i.
- an insulating layer 218 may be provided to cover the transistor.
- the transistor 209 shown in FIG. 37B shows an example in which the insulating layer 225 covers the top surface and side surfaces of the semiconductor layer 231 .
- the conductive layers 222a and 222b are connected to the low-resistance region 231n through openings provided in the insulating layers 225 and 215, respectively.
- One of the conductive layers 222a and 222b functions as a source and the other functions as a drain.
- the insulating layer 225 overlaps the channel formation region 231i of the semiconductor layer 231 and does not overlap the low resistance region 231n.
- the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layers 222a and 222b are connected to the low resistance region 231n through openings in the insulating layer 215.
- a connecting portion 204 is provided in a region of the substrate 151 where the substrate 152 does not overlap.
- the wiring 165 is electrically connected to the FPC 172 via the conductive layer 166 and the connecting layer 242 .
- the conductive layer 166 includes a conductive film obtained by processing the same conductive film as the conductive layers 112a, 112b, and 112c and a conductive film obtained by processing the same conductive film as the conductive layers 126a, 126b, and 126c. , and a conductive film obtained by processing the same conductive film as the conductive layers 129a, 129b, and 129c.
- the conductive layer 166 is exposed on the upper surface of the connecting portion 204 . Thereby, the connecting portion 204 and the FPC 172 can be electrically connected via the connecting layer 242 .
- a light shielding layer 117 is preferably provided on the surface of the substrate 152 on the substrate 151 side.
- the light shielding layer 117 can be provided between adjacent light emitting devices, the connection portion 140, the circuit 164, and the like. Also, various optical members can be arranged outside the substrate 152 .
- Materials that can be used for the substrate 120 can be used for the substrates 151 and 152, respectively.
- a material that can be used for the resin layer 122 can be applied as the adhesive layer 142 .
- connection layer 242 an anisotropic conductive film (ACF: Anisotropic Conductive Film), an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), or the like can be used.
- ACF Anisotropic Conductive Film
- ACP Anisotropic Conductive Paste
- Display panel 100H A display panel 100H shown in FIG. 38A is mainly different from the display panel 100G in that it is a bottom emission type display panel.
- the light emitted by the light emitting device is emitted to the substrate 151 side.
- a material having high visible light transmittance is preferably used for the substrate 151 .
- the material used for the substrate 152 may or may not be translucent.
- a light shielding layer 117 is preferably formed between the substrate 151 and the transistor 201 and between the substrate 151 and the transistor 205 .
- FIG. 38A shows an example in which the light-blocking layer 117 is provided over the substrate 151 , the insulating layer 153 is provided over the light-blocking layer 117 , and the transistors 201 and 205 and the like are provided over the insulating layer 153 .
- the light emitting device 130R has a conductive layer 112a, a conductive layer 126a on the conductive layer 112a, and a conductive layer 129a on the conductive layer 126a.
- the light emitting device 130G has a conductive layer 112b, a conductive layer 126b on the conductive layer 112b, and a conductive layer 129b on the conductive layer 126b.
- conductive layers 112a, 112b, 126a, 126b, 129a, and 129b materials with high visible light transmittance are used.
- a material that reflects visible light is preferably used for the common electrode 115 .
- FIG. 37A and 38A show an example in which the upper surface of the layer 128 has a flat portion, but the shape of the layer 128 is not particularly limited.
- a variation of layer 128 is shown in Figures 38B-38D.
- the upper surface of the layer 128 can be configured to have a shape in which the center and the vicinity thereof are depressed in a cross-sectional view, that is, a shape having a concave curved surface.
- the upper surface of the layer 128 can be configured to have a shape in which the center and the vicinity thereof bulge in a cross-sectional view, that is, have a convex curved surface.
- the top surface of the layer 128 may have one or both of a convex curved surface and a concave curved surface.
- the number of convex curved surfaces and concave curved surfaces that the upper surface of the layer 128 has is not limited, and may be one or more.
- the height of the top surface of the layer 128 and the height of the top surface of the conductive layer 112a may be the same or substantially the same, or may be different from each other.
- the height of the top surface of layer 128 may be lower or higher than the height of the top surface of conductive layer 112a.
- FIG. 38B can also be said to be an example in which the layer 128 is accommodated inside the recess formed in the conductive layer 112a.
- the layer 128 may exist outside the recess formed in the conductive layer 112a, that is, the upper surface of the layer 128 may be wider than the recess.
- Display panel 100J A display panel 100J shown in FIG. 39 is mainly different from the display panel 100G in that it has a light receiving device 150 .
- the light receiving device 150 has a conductive layer 112d, a conductive layer 126d on the conductive layer 112d, and a conductive layer 129d on the conductive layer 126d.
- the conductive layer 112d is connected to the conductive layer 222b of the transistor 205 through an opening provided in the insulating layer 214 or the like.
- the top and side surfaces of the conductive layer 126d and the top and side surfaces of the conductive layer 129d are covered with the fourth layer 113d.
- the fourth layer 113d has at least an active layer.
- the side surfaces of the fourth layer 113d are covered with insulating layers 125 and 127.
- a sacrificial layer 118 d is located between the fourth layer 113 d and the insulating layer 125 .
- a common layer 114 is provided over the fourth layer 113 d and the insulating layers 125 and 127 , and a common electrode 115 is provided over the common layer 114 .
- the common layer 114 is a continuous film that is commonly provided for the light receiving device and the light emitting device.
- the display panel 100J for example, either the pixel layout shown in FIG. 24A described in Embodiment 5 or the pixel layout shown in FIGS. 28A to 28D described in Embodiment 6 can be applied.
- the light receiving device 150 can be provided in at least one of the sub-pixel PS, the sub-pixel X1, the sub-pixel X2, and the like. Further, Embodiment 5 can be referred to for details of the display panel including the light receiving device.
- One embodiment of the present invention is a display panel including a light-emitting device and a pixel circuit.
- the display panel can realize a full-color display panel by having, for example, three types of light-emitting devices that respectively emit red (R), green (G), and blue (B) light.
- transistors having silicon in a semiconductor layer in which a channel is formed, for all transistors included in pixel circuits that drive light-emitting devices.
- silicon include monocrystalline silicon, polycrystalline silicon, and amorphous silicon.
- a transistor hereinafter also referred to as an LTPS transistor
- LTPS low-temperature polysilicon
- the LTPS transistor has high field effect mobility and good frequency characteristics.
- circuits that need to be driven at high frequencies can be built on the same substrate as the display section.
- source driver circuits for example, source driver circuits
- At least one of the transistors included in the pixel circuit is preferably a transistor including a metal oxide (hereinafter also referred to as an oxide semiconductor) as a semiconductor in which a channel is formed (hereinafter also referred to as an OS transistor).
- OS transistors have much higher field-effect mobility than transistors using amorphous silicon.
- an OS transistor has extremely low source-drain leakage current (hereinafter also referred to as an off-state current) in an off state, and can retain charge accumulated in a capacitor connected in series with the transistor for a long time. is possible. Further, by using the OS transistor, power consumption of the display panel can be reduced.
- an OS transistor is preferably used as a transistor that functions as a switch for controlling conduction/non-conduction between wirings
- an LTPS transistor is preferably used as a transistor that controls current.
- one of the transistors provided in the pixel circuit functions as a transistor for controlling the current flowing through the light emitting device and can also be called a driving transistor.
- One of the source and drain of the driving transistor is electrically connected to the pixel electrode of the light emitting device.
- An LTPS transistor is preferably used as the driving transistor. This makes it possible to increase the current flowing through the light emitting device in the pixel circuit.
- the other transistor provided in the pixel circuit functions as a switch for controlling selection/non-selection of the pixel, and can also be called a selection transistor.
- the gate of the selection transistor is electrically connected to the gate line, and one of the source and the drain is electrically connected to the source line (signal line).
- An OS transistor is preferably used as the selection transistor.
- Display panel configuration example 2 A block diagram of the display panel 400 is shown in FIG. 40A.
- the display panel 400 includes a display portion 404, a driver circuit portion 402, a driver circuit portion 403, and the like.
- the display unit 404 has a plurality of pixels 430 arranged in a matrix.
- Pixel 430 has sub-pixel 405R, sub-pixel 405G, and sub-pixel 405B.
- Sub-pixel 405R, sub-pixel 405G, and sub-pixel 405B each have a light-emitting device that functions as a display device.
- a display unit 404 corresponds to the display unit 11 described in the first embodiment. Also, the pixel 430 corresponds to the pixel 17 described in the first embodiment. Also, the pixel 430 corresponds to the pixel 110 described in the fourth embodiment.
- the pixel 430 is electrically connected to the wiring GL, the wiring SLR, the wiring SLG, and the wiring SLB.
- the wiring SLR, the wiring SLG, and the wiring SLB are each electrically connected to the driver circuit portion 402 .
- the wiring GL is electrically connected to the driver circuit portion 403 .
- the driver circuit portion 402 functions as a source line driver circuit (also referred to as a source driver), and the driver circuit portion 403 functions as a gate line driver circuit (also referred to as a gate driver).
- the wiring GL functions as a gate line
- the wiring SLR, the wiring SLG, and the wiring SLB each function as a source line.
- the sub-pixel 405R has a light-emitting device that emits red light.
- Sub-pixel 405G has a light-emitting device that emits green light.
- Sub-pixel 405B has a light-emitting device that emits blue light. Accordingly, the display panel 400 can perform full-color display.
- pixel 430 may have sub-pixels with light-emitting devices that exhibit other colors of light. For example, in addition to the three sub-pixels described above, the pixel 430 may have a sub-pixel having a light-emitting device that emits white light, a sub-pixel that has a light-emitting device that emits yellow light, or the like.
- the wiring GL is electrically connected to the sub-pixels 405R, 405G, and 405B arranged in the row direction (the extending direction of the wiring GL).
- the wiring SLR, the wiring SLG, and the wiring SLB are electrically connected to the sub-pixels 405R, 405G, or 405B (not shown) arranged in the column direction (the direction in which the wiring SLR and the like extend). .
- FIG. 40B shows an example of a circuit diagram of a pixel 405 that can be applied to the sub-pixel 405R, sub-pixel 405G, and sub-pixel 405B.
- Pixel 405 comprises transistor M1, transistor M2, transistor M3, capacitor C1, and light emitting device EL.
- a wiring GL and a wiring SL are electrically connected to the pixel 405 .
- the wiring SL corresponds to one of the wiring SLR, the wiring SLG, and the wiring SLB shown in FIG. 40A.
- the transistor M1 has a gate electrically connected to the wiring GL, one of its source and drain electrically connected to the wiring SL, and the other of the source and drain electrically connected to one electrode of the capacitor C1 and the gate of the transistor M2.
- the transistor M2 has one of its source and drain electrically connected to the wiring AL, and the other of its source and drain connected to one electrode of the light-emitting device EL, the other electrode of the capacitor C1, and one of the source and drain of the transistor M3. electrically connected.
- the transistor M3 has a gate electrically connected to the wiring GL and the other of its source and drain electrically connected to the wiring RL.
- the other electrode of the light emitting device EL is electrically connected to the wiring CL.
- a data potential D is applied to the wiring SL.
- a selection signal is applied to the wiring GL.
- the selection signal includes a potential that makes the transistor conductive and a potential that makes the transistor non-conductive.
- a reset potential is applied to the wiring RL.
- An anode potential is applied to the wiring AL.
- a cathode potential is applied to the wiring CL.
- the anode potential is higher than the cathode potential.
- the reset potential applied to the wiring RL can be set to a potential such that the potential difference between the reset potential and the cathode potential is smaller than the threshold voltage of the light emitting device EL.
- the reset potential can be a potential higher than the cathode potential, the same potential as the cathode potential, or a potential lower than the cathode potential.
- the transistor M1 and the transistor M3 function as switches.
- the transistor M2 functions as a transistor for controlling the current flowing through the light emitting device EL.
- the transistor M1 functions as a selection transistor and the transistor M2 functions as a driving transistor.
- LTPS transistors it is preferable to apply LTPS transistors to all of the transistors M1 to M3. Alternatively, it is preferable to use an OS transistor for the transistors M1 and M3 and an LTPS transistor for the transistor M2.
- OS transistors may be applied to all of the transistors M1 to M3.
- one or more of the plurality of transistors included in the driver circuit portion 402 and the plurality of transistors included in the driver circuit portion 403 can be an LTPS transistor, and the other transistors can be OS transistors.
- the transistors provided in the display portion 404 can be OS transistors
- the transistors provided in the driver circuit portions 402 and 403 can be LTPS transistors.
- Metal oxides used for the semiconductor layer include, for example, indium and M (M is gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum , cerium, neodymium, hafnium, tantalum, tungsten, and magnesium) and zinc.
- M is preferably one or more selected from aluminum, gallium, yttrium, and tin.
- an oxide containing indium, gallium, and zinc (also referred to as IGZO) is preferably used for the semiconductor layer of the OS transistor.
- an oxide containing indium, tin, and zinc is preferably used.
- oxides containing indium, gallium, tin, and zinc are preferably used.
- a transistor including an oxide semiconductor as the transistor M1 and the transistor M3
- the charge held in the capacitor C1 can be prevented from leaking through the transistor M1 or the transistor M3.
- the charge held in the capacitor C1 can be held for a long time, a still image can be displayed for a long time without rewriting the data of the pixel 405 .
- transistors are shown as n-channel transistors in FIG. 40B, p-channel transistors can also be used.
- each transistor included in the pixel 405 is preferably formed side by side over the same substrate.
- a transistor having a pair of gates that overlap with each other with a semiconductor layer interposed therebetween can be used as the transistor included in the pixel 405 .
- a configuration in which the pair of gates are electrically connected to each other and supplied with the same potential has the advantage of increasing the on current of the transistor and improving saturation characteristics.
- a potential for controlling the threshold voltage of the transistor may be applied to one of the pair of gates.
- the stability of the electrical characteristics of the transistor can be improved.
- one gate of the transistor may be electrically connected to a wiring to which a constant potential is applied, or may be electrically connected to its own source or drain.
- a pixel 405 shown in FIG. 40C is an example in which transistors having a pair of gates are applied to the transistor M1 and the transistor M3. A pair of gates of the transistor M1 and the transistor M3 are electrically connected to each other. With such a structure, the period for writing data to the pixel 405 can be shortened.
- a pixel 405 shown in FIG. 40D is an example in which a transistor having a pair of gates is applied to the transistor M2 in addition to the transistors M1 and M3. A pair of gates of the transistor M2 are electrically connected.
- Transistor configuration example An example of a cross-sectional structure of a transistor that can be applied to the display panel is described below.
- FIG. 41A is a cross-sectional view including transistor 410.
- FIG. 41A is a cross-sectional view including transistor 410.
- a transistor 410 is a transistor provided on the substrate 401 and using polycrystalline silicon for a semiconductor layer.
- transistor 410 corresponds to transistor M2 of pixel 405 . That is, FIG. 41A is an example in which one of the source and drain of transistor 410 is electrically connected to conductive layer 431 of the light emitting device.
- a transistor 410 includes a semiconductor layer 411, an insulating layer 412, a conductive layer 413, and the like.
- the semiconductor layer 411 has a channel formation region 411i and a low resistance region 411n.
- Semiconductor layer 411 comprises silicon.
- Semiconductor layer 411 preferably comprises polycrystalline silicon.
- Part of the insulating layer 412 functions as a gate insulating layer.
- Part of the conductive layer 413 functions as a gate electrode.
- the semiconductor layer 411 can also have a structure containing a metal oxide (also referred to as an oxide semiconductor) exhibiting semiconductor characteristics.
- the transistor 410 can be called an OS transistor.
- the low resistance region 411n is a region containing an impurity element.
- the transistor 410 is an n-channel transistor, phosphorus, arsenic, or the like may be added to the low-resistance region 411n.
- boron, aluminum, or the like may be added to the low resistance region 411n.
- the impurity described above may be added to the channel formation region 411i.
- An insulating layer 421 is provided on the substrate 401 .
- the semiconductor layer 411 is provided over the insulating layer 421 .
- the insulating layer 412 is provided to cover the semiconductor layer 411 and the insulating layer 421 .
- the conductive layer 413 is provided over the insulating layer 412 so as to overlap with the semiconductor layer 411 .
- An insulating layer 422 is provided to cover the conductive layer 413 and the insulating layer 412 .
- a conductive layer 414 a and a conductive layer 414 b are provided over the insulating layer 422 .
- the conductive layers 414 a and 414 b are electrically connected to the low-resistance region 411 n through openings provided in the insulating layers 422 and 412 .
- Part of the conductive layer 414a functions as one of the source and drain electrodes, and part of the conductive layer 414b functions as the other of the source and drain electrodes.
- An insulating layer 423 is provided to cover the conductive layers 414 a , 414 b , and the insulating layer 422 .
- a conductive layer 431 functioning as a pixel electrode is provided on the insulating layer 423 .
- the conductive layer 431 is provided over the insulating layer 423 and is electrically connected to the conductive layer 414 b through an opening provided in the insulating layer 423 .
- an EL layer and a common electrode can be stacked over the conductive layer 431 .
- FIG. 41B shows a transistor 410a having a pair of gate electrodes.
- a transistor 410a illustrated in FIG. 41B is mainly different from FIG. 41A in that a conductive layer 415 and an insulating layer 416 are included.
- the conductive layer 415 is provided on the insulating layer 421 .
- An insulating layer 416 is provided to cover the conductive layer 415 and the insulating layer 421 .
- the semiconductor layer 411 is provided so that at least a channel formation region 411i overlaps with the conductive layer 415 with the insulating layer 416 interposed therebetween.
- part of the conductive layer 413 functions as a first gate electrode and part of the conductive layer 415 functions as a second gate electrode.
- part of the insulating layer 412 functions as a first gate insulating layer, and part of the insulating layer 416 functions as a second gate insulating layer.
- the conductive layer 413 and the conductive layer 413 are electrically conductive in a region (not shown) through openings provided in the insulating layers 412 and 416 .
- the layer 415 may be electrically connected.
- a conductive layer is formed through openings provided in the insulating layers 422, 412, and 416 in a region (not shown).
- the conductive layer 414a or the conductive layer 414b and the conductive layer 415 may be electrically connected.
- the transistor 410 illustrated in FIG. 41A or the transistor 410a illustrated in FIG. 41B can be used.
- the transistor 410a may be used for all the transistors included in the pixel 405
- the transistor 410 may be used for all the transistors, or the transistor 410a and the transistor 410 may be used in combination. .
- FIG. 41C shows a cross-sectional schematic diagram including transistor 410 a and transistor 450 .
- Configuration Example 1 For the transistor 410a, Configuration Example 1 can be used. Note that although an example using the transistor 410a is shown here, a structure including the transistors 410 and 450 may be employed, or a structure including all of the transistors 410, 410a, and 450 may be employed.
- a transistor 450 is a transistor in which a metal oxide is applied to a semiconductor layer.
- the configuration shown in FIG. 41C is an example in which, for example, the transistor 450 corresponds to the transistor M1 of the pixel 405 and the transistor 410a corresponds to the transistor M2. That is, FIG. 41C shows an example in which one of the source and drain of the transistor 410 a is electrically connected to the conductive layer 431 .
- FIG. 41C shows an example in which the transistor 450 has a pair of gates.
- the transistor 450 includes a conductive layer 455, an insulating layer 422, a semiconductor layer 451, an insulating layer 452, a conductive layer 453, and the like.
- a portion of conductive layer 453 functions as a first gate of transistor 450 and a portion of conductive layer 455 functions as a second gate of transistor 450 .
- part of the insulating layer 452 functions as a first gate insulating layer of the transistor 450 and part of the insulating layer 422 functions as a second gate insulating layer of the transistor 450 .
- the conductive layer 455 is provided on the insulating layer 412 .
- An insulating layer 422 is provided to cover the conductive layer 455 .
- the semiconductor layer 451 is provided over the insulating layer 422 .
- the insulating layer 452 is provided to cover the semiconductor layer 451 and the insulating layer 422 .
- the conductive layer 453 is provided over the insulating layer 452 and has regions that overlap with the semiconductor layer 451 and the conductive layer 455 .
- An insulating layer 426 is provided to cover the insulating layer 452 and the conductive layer 453 .
- a conductive layer 454 a and a conductive layer 454 b are provided over the insulating layer 426 .
- the conductive layers 454 a and 454 b are electrically connected to the semiconductor layer 451 through openings provided in the insulating layers 426 and 452 .
- Part of the conductive layer 454a functions as one of the source and drain electrodes, and part of the conductive layer 454b functions as the other of the source and drain electrodes.
- An insulating layer 423 is provided to cover the conductive layers 454 a , 454 b , and the insulating layer 426 .
- the conductive layers 414a and 414b electrically connected to the transistor 410a are preferably formed by processing the same conductive film as the conductive layers 454a and 454b.
- the conductive layer 414a, the conductive layer 414b, the conductive layer 454a, and the conductive layer 454b are formed on the same plane (that is, in contact with the upper surface of the insulating layer 426) and contain the same metal element. showing.
- the conductive layers 414 a and 414 b are electrically connected to the low-resistance region 411 n through the insulating layers 426 , 452 , 422 , and openings provided in the insulating layer 412 . This is preferable because the manufacturing process can be simplified.
- the conductive layer 413 functioning as the first gate electrode of the transistor 410a and the conductive layer 455 functioning as the second gate electrode of the transistor 450 are preferably formed by processing the same conductive film.
- FIG. 41C shows a configuration in which the conductive layer 413 and the conductive layer 455 are formed on the same surface (that is, in contact with the upper surface of the insulating layer 412) and contain the same metal element. This is preferable because the manufacturing process can be simplified.
- the insulating layer 452 functioning as the first gate insulating layer of the transistor 450 covers the edge of the semiconductor layer 451.
- the transistor 450a shown in FIG. It may be processed so that the top surface shape matches or substantially matches that of the layer 453 .
- the upper surface shapes roughly match means that at least a part of the contours overlaps between the laminated layers.
- the upper layer and the lower layer may be processed with the same mask pattern or partially with the same mask pattern. Strictly speaking, however, the contours do not overlap, and the upper layer may be located inside the lower layer, or the upper layer may be located outside the lower layer.
- the transistor 410a corresponds to the transistor M2 and is electrically connected to the pixel electrode
- the present invention is not limited to this.
- the transistor 450 or the transistor 450a may correspond to the transistor M2.
- transistor 410a may correspond to transistor M1, transistor M3, or some other transistor.
- the light-emitting device has an EL layer 786 between a pair of electrodes (lower electrode 772, upper electrode 788).
- EL layer 786 can be composed of multiple layers such as layer 4420 , light-emitting layer 4411 , and layer 4430 .
- the layer 4420 can have, for example, a layer containing a substance with high electron-injection properties (electron-injection layer) and a layer containing a substance with high electron-transport properties (electron-transporting layer).
- the light-emitting layer 4411 contains, for example, a light-emitting compound.
- the layer 4430 can have, for example, a layer containing a substance with high hole-injection properties (hole-injection layer) and a layer containing a substance with high hole-transport properties (hole-transport layer).
- a structure having a layer 4420, a light-emitting layer 4411, and a layer 4430 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 42A is referred to herein as a single structure.
- FIG. 42B is a modification of the EL layer 786 included in the light emitting device shown in FIG. 42A.
- the light-emitting device shown in FIG. It has a top layer 4422 and a top electrode 788 on layer 4422 .
- layer 4431 functions as a hole injection layer
- layer 4432 functions as a hole transport layer
- layer 4421 functions as an electron transport layer
- Layer 4422 functions as an electron injection layer.
- layer 4431 functions as an electron injection layer
- layer 4432 functions as an electron transport layer
- layer 4421 functions as a hole transport layer
- layer 4421 functions as a hole transport layer
- 4422 functions as a hole injection layer.
- a configuration in which a plurality of light-emitting layers (light-emitting layers 4411, 4412, and 4413) are provided between layers 4420 and 4430 as shown in FIGS. 42C and 42D is also a variation of the single structure.
- tandem structure a structure in which a plurality of light-emitting units (EL layers 786a and 786b) are connected in series via a charge generation layer 4440 is referred to as a tandem structure in this specification.
- the tandem structure may also be called a stack structure. Note that the tandem structure enables a light-emitting device capable of emitting light with high luminance.
- the light-emitting layers 4411, 4412, and 4413 may be made of a light-emitting material that emits light of the same color, or even the same light-emitting material.
- the light-emitting layers 4411, 4412, and 4413 may be formed using a light-emitting material that emits blue light.
- a color conversion layer may be provided as layer 785 shown in FIG. 42D.
- light-emitting materials that emit light of different colors may be used for the light-emitting layers 4411, 4412, and 4413, respectively.
- white light emission can be obtained.
- a color filter also referred to as a colored layer
- a desired color of light can be obtained by passing the white light through the color filter.
- FIGS. 42E and 42F light-emitting materials emitting light of the same color, or even the same light-emitting material may be used for the light-emitting layers 4411 and 4412 .
- light-emitting materials that emit light of different colors may be used for the light-emitting layers 4411 and 4412 .
- white light emission can be obtained.
- FIG. 42F shows an example in which an additional layer 785 is provided. As the layer 785, one or both of a color conversion layer and a color filter (colored layer) can be used.
- the layer 4420 and the layer 4430 may have a laminated structure consisting of two or more layers as shown in FIG. 42B.
- a structure that separates the emission colors (for example, blue (B), green (G), and red (R)) for each light emitting device is sometimes called an SBS (Side By Side) structure.
- the emission color of the light-emitting device can be red, green, blue, cyan, magenta, yellow, white, or the like, depending on the material forming the EL layer 786 . Further, the color purity can be further enhanced by providing the light-emitting device with a microcavity structure.
- a light-emitting device that emits white light preferably has a structure in which two or more types of light-emitting substances are contained in the light-emitting layer.
- two or more light-emitting substances may be selected so that the light emission of each light-emitting substance has a complementary color relationship.
- the emission color of the first light-emitting layer and the emission color of the second light-emitting layer have a complementary color relationship, it is possible to obtain a light-emitting device that emits white light as a whole. The same applies to light-emitting devices having three or more light-emitting layers.
- the light-emitting layer preferably contains two or more light-emitting substances that emit light such as R (red), G (green), B (blue), Y (yellow), and O (orange).
- R red
- G green
- B blue
- Y yellow
- O orange
- the electronic device of this embodiment includes the display panel of one embodiment of the present invention in a display portion.
- a display panel of one embodiment of the present invention can easily achieve high definition and high resolution, and can achieve high display quality. Therefore, it can be used for display portions of various electronic devices.
- Examples of electronic devices include televisions, desktop or notebook personal computers, monitors for computers, digital signage, large game machines such as pachinko machines, and other electronic devices with relatively large screens. Examples include cameras, digital video cameras, digital photo frames, mobile phones, mobile game machines, mobile information terminals, and sound reproducing devices.
- the display panel of one embodiment of the present invention can have high definition, it can be suitably used for electronic devices having a relatively small display portion.
- electronic devices include wristwatch-type and bracelet-type information terminals (wearable devices), VR devices such as head-mounted displays, glasses-type AR devices, and MR devices.
- wearable devices include wristwatch-type and bracelet-type information terminals (wearable devices), VR devices such as head-mounted displays, glasses-type AR devices, and MR devices.
- a wearable device that can be attached to a part is exemplified.
- a display panel of one embodiment of the present invention includes HD (1280 ⁇ 720 pixels), FHD (1920 ⁇ 1080 pixels), WQHD (2560 ⁇ 1440 pixels), WQXGA (2560 ⁇ 1600 pixels), 4K (2560 ⁇ 1600 pixels), 3840 ⁇ 2160) and 8K (7680 ⁇ 4320 pixels).
- the resolution it is preferable to set the resolution to 4K, 8K, or higher.
- the pixel density (definition) of the display panel of one embodiment of the present invention is preferably 100 ppi or more, preferably 300 ppi or more, more preferably 500 ppi or more, more preferably 1000 ppi or more, more preferably 2000 ppi or more, and 3000 ppi or more.
- the display panel can accommodate various screen ratios such as 1:1 (square), 4:3, 16:9, and 16:10.
- the electronic device of this embodiment includes sensors (force, displacement, position, velocity, acceleration, angular velocity, number of revolutions, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage , power, radiation, flow, humidity, gradient, vibration, odor or infrared).
- the electronic device of this embodiment can have various functions. For example, functions to display various information (still images, moving images, text images, etc.) on the display, touch panel functions, functions to display calendars, dates or times, functions to execute various software (programs), wireless communication function, a function of reading a program or data recorded on a recording medium, and the like.
- An electronic device 6500 shown in FIG. 43A is a mobile information terminal that can be used as a smartphone.
- the electronic device 6500 has a housing 6501, a display unit 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, and the like.
- a display portion 6502 has a touch panel function.
- the display panel of one embodiment of the present invention can be applied to the display portion 6502 .
- FIG. 43B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.
- a light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, an optical member 6512, a touch sensor panel 6513, and a printer are placed in a space surrounded by the housing 6501 and the protective member 6510.
- a substrate 6517, a battery 6518, and the like are arranged.
- a display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 with an adhesive layer (not shown).
- a portion of the display panel 6511 is folded back in a region outside the display portion 6502, and the FPC 6515 is connected to the folded portion.
- An IC6516 is mounted on the FPC6515.
- the FPC 6515 is connected to terminals provided on the printed circuit board 6517 .
- the flexible display of one embodiment of the present invention can be applied to the display panel 6511 . Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, the thickness of the electronic device can be reduced and the large-capacity battery 6518 can be mounted. In addition, by folding back part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.
- a television set 7100 has a display portion 7000 incorporated in a housing 7101 .
- a configuration in which a housing 7101 is supported by a stand 7103 is shown.
- the display panel of one embodiment of the present invention can be applied to the display portion 7000 .
- the operation of the television apparatus 7100 shown in FIG. 43C can be performed using operation switches provided on the housing 7101 and a separate remote control operation device 7111 .
- the display portion 7000 may be provided with a touch sensor, and the television device 7100 may be operated by touching the display portion 7000 with a finger or the like.
- the remote controller 7111 may have a display section for displaying information output from the remote controller 7111 .
- a channel and a volume can be operated with operation keys or a touch panel provided in the remote controller 7111 , and an image displayed on the display portion 7000 can be operated.
- the television device 7100 is configured to include a receiver, a modem, and the like.
- the receiver can receive general television broadcasts. Also, by connecting to a wired or wireless communication network via a modem, one-way (from the sender to the receiver) or two-way (between the sender and the receiver, or between the receivers, etc.) information communication. is also possible.
- FIG. 43D shows an example of a notebook personal computer.
- a notebook personal computer 7200 has a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like.
- the display portion 7000 is incorporated in the housing 7211 .
- the display panel of one embodiment of the present invention can be applied to the display portion 7000 .
- FIGS. 43E and 43F An example of digital signage is shown in FIGS. 43E and 43F.
- a digital signage 7300 shown in FIG. 43E includes a housing 7301, a display unit 7000, speakers 7303, and the like. Furthermore, it can have an LED lamp, an operation key (including a power switch or an operation switch), connection terminals, various sensors, a microphone, and the like.
- FIG. 43F is a digital signage 7400 attached to a cylindrical post 7401.
- a digital signage 7400 has a display section 7000 provided along the curved surface of a pillar 7401 .
- the display panel of one embodiment of the present invention can be applied to the display portion 7000 in FIGS. 43E and 43F.
- the wider the display unit 7000 the more information can be provided at once.
- the wider the display unit 7000 the more conspicuous it is, and the more effective the advertisement can be, for example.
- a touch panel By applying a touch panel to the display unit 7000, not only can images or moving images be displayed on the display unit 7000, but also the user can intuitively operate the display unit 7000, which is preferable. Further, when used for providing information such as route information or traffic information, usability can be enhanced by intuitive operation.
- the digital signage 7300 or digital signage 7400 is preferably capable of cooperating with an information terminal device 7311 or information terminal device 7411 such as a smartphone possessed by the user through wireless communication.
- advertisement information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411 .
- display on the display portion 7000 can be switched.
- the digital signage 7300 or the digital signage 7400 can execute a game using the screen of the information terminal 7311 or 7411 as an operation means (controller). This allows an unspecified number of users to simultaneously participate in and enjoy the game.
- the electronic device shown in FIGS. 44A to 44G includes a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), connection terminals 9006, sensors 9007 (force, displacement, position, speed , acceleration, angular velocity, number of rotations, distance, light, liquid, magnetism, temperature, chemical substances, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, smell, or infrared rays function), a microphone 9008, and the like.
- the electronic devices shown in FIGS. 44A to 44G have various functions. For example, a function to display various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a calendar, a function to display the date or time, a function to control processing by various software (programs), It can have a wireless communication function, a function of reading and processing programs or data recorded on a recording medium, and the like. Note that the functions of the electronic device are not limited to these, and can have various functions.
- the electronic device may have a plurality of display units.
- the electronic device is equipped with a camera, etc., and has the function of capturing still images or moving images and storing them in a recording medium (external or built into the camera), or the function of displaying the captured image on the display unit, etc. good.
- FIG. 44A is a perspective view showing a mobile information terminal 9101.
- the mobile information terminal 9101 can be used as a smart phone, for example.
- the portable information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like.
- the mobile information terminal 9101 can display text and image information on its multiple surfaces.
- FIG. 44A shows an example in which three icons 9050 are displayed.
- Information 9051 indicated by a dashed rectangle can also be displayed on another surface of the display portion 9001 . Examples of the information 9051 include notification of incoming e-mail, SNS, telephone call, title of e-mail or SNS, sender name, date and time, remaining battery power, radio wave intensity, and the like.
- an icon 9050 or the like may be displayed at the position where the information 9051 is displayed.
- FIG. 44B is a perspective view showing the mobile information terminal 9102.
- the portable information terminal 9102 has a function of displaying information on three or more sides of the display portion 9001 .
- information 9052, information 9053, and information 9054 are displayed on different surfaces.
- the user can confirm the information 9053 displayed at a position where the mobile information terminal 9102 can be viewed from above the mobile information terminal 9102 while the mobile information terminal 9102 is stored in the chest pocket of the clothes.
- the user can check the display without taking out the portable information terminal 9102 from the pocket, and can determine, for example, whether to receive a call.
- the tablet terminal 9103 can execute various applications such as mobile phone, e-mail, reading and creating text, playing music, Internet communication, and computer games.
- the tablet terminal 9103 has a display portion 9001, a camera 9002, a microphone 9008, and a speaker 9003 on the front of the housing 9000, operation keys 9005 as operation buttons on the left side of the housing 9000, and connection terminals on the bottom. 9006.
- FIG. 44D is a perspective view showing a wristwatch-type mobile information terminal 9200.
- the mobile information terminal 9200 can be used as a smart watch (registered trademark), for example.
- the display portion 9001 has a curved display surface, and display can be performed along the curved display surface.
- the mobile information terminal 9200 can also make hands-free calls by mutual communication with a headset capable of wireless communication, for example.
- the portable information terminal 9200 can transmit data to and from another information terminal through the connection terminal 9006, and can be charged. Note that the charging operation may be performed by wireless power supply.
- FIG. 44E to 44G are perspective views showing a foldable personal digital assistant 9201.
- FIG. 44E is a state in which the portable information terminal 9201 is unfolded
- FIG. 44G is a state in which it is folded
- FIG. 44F is a perspective view in the middle of changing from one of FIGS. 44E and 44G to the other.
- the portable information terminal 9201 has excellent portability in the folded state, and has excellent display visibility due to a seamless wide display area in the unfolded state.
- a display portion 9001 included in the portable information terminal 9201 is supported by three housings 9000 connected by hinges 9055 .
- the display portion 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.
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Abstract
Description
図2Aは本発明の一態様の電子機器の構成を模式的に示した上面図である。図2Bは、本発明の一態様の電子機器が有するカメラに光が入射する様を模式的に示した斜視図である。
図3A乃至図3Cは本発明の一態様の電子機器の構成例を示す斜視図である。
図4は画像を生成する方法を示すフローチャートである。
図5A及び図5Bは、処理の一部を説明する模式図である。
図6は、処理の流れの一例を示すフローチャートである。
図7A及び図7Bは、処理の一部を説明する模式図である。
図8Aは本発明の一態様の電子機器の構成例を示すブロック図である。図8B乃至図8Dは本発明の一態様の電子機器の構成例を示す斜視図である。
図9はアバターを生成する方法を示すフローチャートである。
図10A乃至図10Dは、処理の一部を説明する模式図である。
図11Aは本発明の一態様の電子機器の構成例を示すブロック図である。図11B及び図11Cは本発明の一態様の電子機器の構成例を示す斜視図である。
図12A及び図12Bは、電子機器の使用例を説明する図である。
図13A及び図13Bは、電子機器の使用例を説明する図である。
図14Aは、電子機器が有する表示部の上面図である。図14Bは、電子機器が有する表示部の断面図である。
図15Aは、電子機器が有する表示部の上面図である。図15Bは、電子機器が有する表示部の断面図である。
図16Aは、電子機器が有する表示部の上面図である。図16Bは、電子機器が有する表示部の断面図である。
図17Aは、電子機器が有する表示部の上面図である。図17Bは、電子機器が有する表示部の断面図である。
図18Aは、表示パネルの一例を示す上面図である。図18Bは、表示パネルの一例を示す断面図である。
図19A乃至図19Cは、表示パネルの一例を示す断面図である。
図20A及び図20Bは、表示パネルの一例を示す断面図である。
図21A乃至図21Cは、表示パネルの一例を示す断面図である。
図22A乃至図22Cは、表示パネルの一例を示す断面図である。
図23A乃至図23Fは、表示パネルの一例を示す断面図である。
図24Aは、表示パネルの一例を示す上面図である。図24Bは、表示パネルの一例を示す断面図である。
図25A乃至図25Fは、画素の一例を示す上面図である。
図26A乃至図26Hは、画素の一例を示す上面図である。
図27A乃至図27Jは、画素の一例を示す上面図である。
図28A乃至図28Dは、画素の一例を示す上面図である。図28E乃至図28Gは、表示パネルの一例を示す断面図である。
図29A及び図29Bは、表示パネルの一例を示す斜視図である。
図30A及び図30Bは、表示パネルの一例を示す断面図である。
図31は、表示パネルの一例を示す断面図である。
図32は、表示パネルの一例を示す断面図である。
図33は、表示パネルの一例を示す断面図である。
図34は、表示パネルの一例を示す断面図である。
図35は、表示パネルの一例を示す断面図である。
図36は、表示パネルの一例を示す斜視図である。
図37Aは、表示パネルの一例を示す断面図である。図37B及び図37Cは、トランジスタの一例を示す断面図である。
図38A乃至図38Dは、表示パネルの一例を示す断面図である。
図39は、表示パネルの一例を示す断面図である。
図40Aは、表示パネルの一例を示すブロック図である。図40B乃至図40Dは、画素回路の一例を示す図である。
図41A乃至図41Dは、トランジスタの一例を示す図である。
図42A乃至図42Fは、発光デバイスの構成例を示す図である。
図43A乃至図43Fは、電子機器の一例を示す図である。
図44A乃至図44Gは、電子機器の一例を示す図である。
<構成例1>
図1Aは、本発明の一態様の電子機器の構成例を示すブロック図である。図1Aに示す電子機器10は、表示部11と、カメラ13と、画像処理部14と、を有する。また、表示部11は、カメラ12を備える。
本項では、カメラ12、カメラ13、及び画像処理部14を用いて、被写体の画像を鮮明にし、且つ当該被写体の視線を追跡する方法について説明する。
上述した画像を鮮明にする方法は、教師データを用いて学習を事前に行う。図6は処理の流れの一例を示すフローチャートを示す。図6に示す処理は、学習ともいえる。図7A及び図7Bは図6に示す処理の一部を説明する模式図である。なお、本実施の形態は、人の顔が含まれる画像を鮮明にする場合を例示して説明を行う。
図1A及び図1B示す電子機器10は、カメラ13を1つ有しているが、本発明はこれに限られない。本発明の一態様の電子機器は、カメラ13を複数有してもよい。なお、以降では、前述の構成例1と異なる部分について主に説明し、重複する部分については説明を省略する。
本項では、カメラ12、カメラ13_1、カメラ13_2、及び画像処理部14を用いて、アバターを生成する方法について説明する。
図1A及び図1Bに示す電子機器10は、表示部11がカメラ12を1つ備える構成を有する。なお、表示部11が備えるカメラ12の数は1つに限られない。表示部11は、カメラ12を2つ以上備えてもよい。なお、前述の構成例1と異なる部分について主に説明し、重複する部分については説明を省略する。
図12A及び図12Bを用いて、本発明の一態様の電子機器を利用する場合の例を説明する。図12A及び図12Bでは、5台の電子機器(電子機器1000_1乃至電子機器1000_5)を用いて行われる遠隔会合の例を示す。当該遠隔会合に用いる電子機器は、先の実施の形態で説明した電子機器であることが好ましい。
図13A及び図13Bを用いて、本発明の一態様の電子機器を利用する場合の例を説明する。図13A及び図13Bでは、5台の電子機器(電子機器2000_1乃至電子機器2000_5)を用いて行われる遠隔会合の例を示す。当該遠隔会合に用いる電子機器は、先の実施の形態で説明した電子機器であることが好ましい。
本実施の形態では、本発明の一態様の電子機器が有する表示部、および当該表示部が備えるカメラについて、図14乃至図17を用いて説明する。
本実施の形態では、本発明の一態様の表示パネルについて図18乃至図23を用いて説明する。
図18及び図19に、本発明の一態様の表示パネルを示す。
本実施の形態では、本発明の一態様の表示パネルについて図25乃至図28を用いて説明する。
本実施の形態では、主に、図18Aとは異なる画素レイアウトについて説明する。副画素の配列に特に限定はなく、様々な方法を適用することができる。副画素の配列としては、例えば、ストライプ配列、Sストライプ配列、マトリクス配列、デルタ配列、ベイヤー配列、ペンタイル配列などが挙げられる。
本実施の形態では、本発明の一態様の表示パネルについて図29乃至図39を用いて説明する。
図29Aに、表示モジュール280の斜視図を示す。表示モジュール280は、表示パネル100Aと、FPC290と、を有する。なお、表示モジュール280が有する表示パネルは表示パネル100Aに限られず、後述する表示パネル100B乃至表示パネル100Fのいずれかであってもよい。
図30Aに示す表示パネル100Aは、基板301、発光デバイス130R、130G、130B、容量240、及び、トランジスタ310を有する。
図31に示す表示パネル100Bは、それぞれ半導体基板にチャネルが形成されるトランジスタ310Aと、トランジスタ310Bとが積層された構成を有する。なお、以降の表示パネルの説明では、先に説明した表示パネルと同様の部分については説明を省略することがある。
図32に示す表示パネル100Cは、導電層341と導電層342を、バンプ347を介して接合する構成を有する。
図33に示す表示パネル100Dは、トランジスタの構成が異なる点で、表示パネル100Aと主に相違する。
図34に示す表示パネル100Eは、それぞれチャネルが形成される半導体に酸化物半導体を有するトランジスタ320Aと、トランジスタ320Bとが積層された構成を有する。
図35に示す表示パネル100Fは、基板301にチャネルが形成されるトランジスタ310と、チャネルが形成される半導体層に金属酸化物を含むトランジスタ320とが積層された構成を有する。
図36に、表示パネル100Gの斜視図を示し、図37Aに、表示パネル100Gの断面図を示す。
図38Aに示す表示パネル100Hは、ボトムエミッション型の表示パネルである点で、表示パネル100Gと主に相違する。
図39に示す表示パネル100Jは、受光デバイス150を有する点で、表示パネル100Gと主に相違する。
本実施の形態では、本発明の一態様の表示パネルに適用することのできるトランジスタの構成例について説明する。特に、チャネルが形成される半導体にシリコンを含むトランジスタを用いる場合について説明する。
図40Aに、表示パネル400のブロック図を示す。表示パネル400は、表示部404、駆動回路部402、駆動回路部403などを有する。
図40Bに、上記副画素405R、副画素405G、及び副画素405Bに適用することのできる画素405の回路図の一例を示す。画素405は、トランジスタM1、トランジスタM2、トランジスタM3、容量C1、及び発光デバイスELを有する。また、画素405には、配線GL及び配線SLが電気的に接続される。配線SLは、図40Aで示した配線SLR、配線SLG、及び配線SLBのうちのいずれかに対応する。
以下では、上記表示パネルに適用することのできるトランジスタの断面構成例について説明する。
図41Aは、トランジスタ410を含む断面図である。
図41Bには、一対のゲート電極を有するトランジスタ410aを示す。図41Bに示すトランジスタ410aは、導電層415、及び絶縁層416を有する点で、図41Aと主に相違している。
以下では、半導体層にシリコンが適用されたトランジスタと、半導体層に金属酸化物が適用されたトランジスタの両方を有する構成の例について説明する。
本実施の形態では、本発明の一態様の表示パネルに用いることができる発光デバイスについて説明する。
本実施の形態では、本発明の一態様の電子機器について、図43及び図44を用いて説明する。
Claims (8)
- 第1のカメラを備える表示部と、第2のカメラと、画像処理部と、を有し、
前記第2のカメラは、前記表示部と重ならない領域に配置され、
前記第1のカメラは、被写体が撮影された第1の画像を生成する機能を有し、
前記第2のカメラは、前記被写体が撮影された第2の画像を生成する機能を有し、
前記画像処理部は、教師データを用いて学習するジェネレータを有し、
前記教師データは、人の顔が含まれる画像を有し、
前記画像処理部は、
前記第1の画像が前記ジェネレータに入力されることで、前記第1の画像を鮮明にする機能と、
前記第2の画像をもとに前記被写体の視線追跡を行う機能と、
を有する、
電子機器。 - 請求項1において、
赤外光を発する光源をさらに有し、
前記光源は、前記表示部と重ならない領域に配置され、
前記光源は、前記被写体の視線検出に使用され、
前記被写体の視線検出を繰り返すことで、前記被写体の視線追跡が行われる、
電子機器。 - 第1のカメラを備える表示部と、第2のカメラと、第3のカメラと、画像処理部と、を有し、
前記第2のカメラ及び前記第3のカメラは、それぞれ独立に前記表示部と重ならない領域に配置され、
前記第1のカメラは、被写体が撮影された第1の画像を生成する機能を有し、
前記第2のカメラは、前記被写体が撮影された第2の画像を生成する機能を有し、
前記第3のカメラは、前記被写体が撮影された第3の画像を生成する機能を有し、
前記画像処理部は、
前記第1の画像を鮮明にする機能と、
鮮明な前記第1の画像から、前記被写体の顔を認識する機能と、
前記第2の画像及び前記第3の画像から、前記被写体の顔の立体形状を認識する機能と、
前記被写体の顔、および前記被写体の顔の立体形状から、アバターを生成する機能と、
を有する、
電子機器。 - 請求項1乃至請求項3のいずれか一項において、
前記第1のカメラは、前記被写体からみて、前記表示部が有する画素よりも奥に配置される、
電子機器。 - 請求項1乃至請求項3のいずれか一項において、
前記第1のカメラは、前記被写体からみて、前記表示部が有する画素を含む領域に配置される、
電子機器。 - 第1のカメラ、及び第4のカメラを備える表示部と、画像処理部と、を有し、
前記第1のカメラは、被写体が撮影された第1の画像を生成する機能を有し、
前記第4のカメラは、前記被写体が撮影された第4の画像を生成する機能を有し、
前記画像処理部は、教師データを用いて学習するジェネレータを有し、
前記教師データは、人の顔が含まれる画像を有し、
前記画像処理部は、
前記第1のカメラまたは前記第4のカメラをアクティブにする機能と、
アクティブな前記第1のカメラまたは前記第4のカメラを用いて生成された前記第1の画像または前記第4の画像が前記ジェネレータに入力されることで、前記第1の画像または前記第4の画像を鮮明にする機能と、
を有する、
電子機器。 - 請求項6において、
前記第1のカメラ、及び前記第4のカメラは、前記被写体からみて、前記表示部が有する画素よりも奥に配置される、
電子機器。 - 請求項6において、
前記第1のカメラ、及び前記第4のカメラは、前記被写体からみて、前記表示部が有する画素を含む領域に配置される、
電子機器。
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KR1020247002291A KR20240027708A (ko) | 2021-06-30 | 2022-06-20 | 전자 기기 |
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JP2016532197A (ja) * | 2013-08-04 | 2016-10-13 | アイズマッチ エルティーディー.EyesMatch Ltd. | 鏡における仮想化の装置、システム、及び方法 |
JP2019115037A (ja) * | 2017-12-21 | 2019-07-11 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 反射を検出する装置及び方法 |
CN111047507A (zh) * | 2019-11-29 | 2020-04-21 | 北京达佳互联信息技术有限公司 | 图像生成模型的训练方法、图像生成方法及装置 |
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JP2018142097A (ja) * | 2017-02-27 | 2018-09-13 | キヤノン株式会社 | 情報処理装置、情報処理方法及びプログラム |
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US10198068B2 (en) * | 2017-02-28 | 2019-02-05 | Microsoft Technology Licensing, Llc | Blink detection, tracking, and stimulation |
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JP2019115037A (ja) * | 2017-12-21 | 2019-07-11 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 反射を検出する装置及び方法 |
JP2021045990A (ja) * | 2019-09-17 | 2021-03-25 | 株式会社デンソー | 表示装置 |
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