WO2023206894A1 - 驱动芯片、显示装置和邦定电阻测试系统 - Google Patents

驱动芯片、显示装置和邦定电阻测试系统 Download PDF

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Publication number
WO2023206894A1
WO2023206894A1 PCT/CN2022/115875 CN2022115875W WO2023206894A1 WO 2023206894 A1 WO2023206894 A1 WO 2023206894A1 CN 2022115875 W CN2022115875 W CN 2022115875W WO 2023206894 A1 WO2023206894 A1 WO 2023206894A1
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WIPO (PCT)
Prior art keywords
connection terminal
resistance
connection
terminal
detection circuit
Prior art date
Application number
PCT/CN2022/115875
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English (en)
French (fr)
Inventor
王发永
陈心全
Original Assignee
昆山国显光电有限公司
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Publication of WO2023206894A1 publication Critical patent/WO2023206894A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08—Measuring resistance by measuring both voltage and current
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/12—Test circuits or failure detection circuits included in a display system, as permanent part thereof

Definitions

  • Embodiments of the present application relate to the field of display technology, and in particular, to a driver chip, a display device and a bonding resistance test system.
  • the top priority of product quality is that the resistance of the bonded resistor between the driver chip and the display panel in the display device meets the design standards and process capabilities.
  • the existing display device includes a driver chip and a display panel.
  • the driver chip and the display panel are bonded.
  • the bonded resistance is currently tested through automatic optical detection or four-probe testing.
  • This application provides a driver chip, a display device and a bonding resistance testing system to test the bonding resistance and improve the detection efficiency of the bonding resistance.
  • embodiments of the present application provide a driver chip, including at least two first connection terminals and a resistance detection circuit.
  • the first end of the resistance detection circuit is connected to a first connection terminal, and the second end of the resistance detection circuit is connected to Any one of the other first connection terminals;
  • the resistance detection circuit includes a current output module, a voltage detection module and a resistance calculation module;
  • the output end of the current output module is electrically connected to the first end of the resistance detection circuit, and is used to output the detection current to the first end of the resistance detection circuit;
  • the voltage detection module is electrically connected to the output end of the current output module, and is used to detect the voltage of the output end of the current output module;
  • the resistance calculation module is electrically connected to the current output module and the voltage detection module respectively, and is used to calculate the bonding resistance according to the voltage and detection current of the output terminal of the current output module.
  • the bonding resistance at least includes a first connection terminal and a display panel connected to the bonding of a second connection terminal.
  • the driver chip also includes a storage module, the storage module is electrically connected to the resistance calculation module, and the storage module is used to store the bonding resistance.
  • the driver chip also includes: a communication interface, the communication interface is connected to the memory module, and the communication interface is used to connect the test fixture and transmit the bonding resistance to the test fixture.
  • the current output module includes a current source and an output control unit.
  • the output control unit is electrically connected to the current source and the resistance calculation module respectively.
  • the current source is electrically connected to the first end of the resistance detection circuit.
  • the output control unit is used to control the current source. The size of the output detection current, and the size of the detection current transmitted to the resistance calculation module.
  • the resistance detection circuit also includes a fixed voltage terminal, the voltage of the fixed voltage terminal is lower than the voltage of the output terminal of the current output module, and the fixed voltage terminal is connected to the second terminal of the resistance detection circuit.
  • the resistance detection circuit also includes a switch module.
  • the switch module is used to control the connection state between the first end of the resistance detection circuit and the current output module, and/or is used to control the second end of the resistance detection circuit and the fixed voltage. The connection status between terminals.
  • the switch module includes a first switch and a second switch, the first end of the first switch is electrically connected to the output end of the current output module, and the second end of the first switch is electrically connected to the first end of the resistance detection circuit;
  • the first terminal of the second switch is electrically connected to the second terminal of the resistance detection circuit, and the second terminal of the second switch is electrically connected to the fixed voltage terminal.
  • embodiments of the present application further provide a display device, including the driver chip of the first aspect, and a display panel.
  • the display panel includes a driver chip bonding area, and the driver chip bonding area is provided with at least two second connection terminal;
  • the first setting is to bond the second connection terminal to the first connection terminal connected to the first end of the resistance detection circuit
  • the second setting is to bond the second connection terminal to the first connection terminal connected to the second end of the resistance detection circuit.
  • the first set second connection terminal and the second set second connection terminal are short-circuited; wherein the first set second connection terminal and the second set second connection terminal are any of at least two second connection terminals. two.
  • the two first connection terminals connected to the resistance detection circuit are arranged adjacently, and the two first connection terminals connected to the resistance detection circuit are arranged close to an edge of the driver chip; the second connection terminal is the same as the first connection terminal.
  • the display device further includes a flexible circuit board
  • the display panel further includes a flexible circuit board bonding area
  • the flexible circuit board bonding area is provided with a plurality of third connection terminals
  • the flexible circuit board includes a plurality of fourth connection terminals
  • the flexible circuit board includes a plurality of fourth connection terminals.
  • the three connection terminals are bonded and connected in a one-to-one correspondence with the fourth connection terminal, and the third connection terminal is also electrically connected in a one-to-one correspondence with the second connection terminal that is not connected to the first connection terminal.
  • embodiments of the present application also provide another display device, including the driver chip of the first aspect, a display panel and a flexible circuit board.
  • the display panel includes a driver chip bonding area and a flexible circuit board bonding area.
  • the driver chip bonding area is provided with at least two second connection terminals
  • the flexible circuit board bonding area is provided with at least two third connection terminals
  • the flexible circuit board includes at least two fourth connection terminals;
  • the first setting is to bond the second connection terminal to the first connection terminal connected to the first end of the resistance detection circuit
  • the second setting is to bond the second connection terminal to the first connection terminal connected to the second end of the resistance detection circuit.
  • the first set second connection terminal and the second set second connection terminal are any two of at least two second connection terminals
  • the first set third connection terminal is electrically connected to the first set second connection terminal
  • the second set third connection terminal is electrically connected to the second set second connection terminal; wherein the first set third connection terminal and secondly, set the third connection terminal to any two of at least two third connection terminals;
  • the first set fourth connection terminal is bonded to the first set third connection terminal, the second set fourth connection terminal is bonded to the second set third connection terminal; wherein the first set fourth connection The terminal and the second set fourth connection terminal are any two of at least two fourth connection terminals;
  • the first set fourth connection terminal and the second set fourth connection terminal are short-circuited.
  • the two first connection terminals connected to the resistance detection circuit are arranged adjacently, and the two first connection terminals connected to the resistance detection circuit are arranged close to an edge of the driver chip; the second connection terminal is the same as the first connection terminal.
  • the third connection terminal and the second connection terminal are arranged in one-to-one correspondence and electrically connected, and the fourth connection terminal and the third connection terminal are arranged in one-to-one correspondence and are bonded and connected.
  • embodiments of the present application also provide a bonding resistance testing system.
  • the display device of the second aspect or the third aspect further includes a test fixture, and the test fixture is electrically connected to the driver chip of the display device.
  • Embodiments of the present application provide a driver chip, a display device and a bonding resistance test system.
  • the driver chip includes at least two first connection terminals.
  • the driver chip includes a resistance detection circuit inside.
  • the first end of the resistance detection circuit is connected to a first connection terminal.
  • the second end of the resistance detection circuit is connected to any one of the other first connection terminals.
  • the resistance detection circuit includes a current output module, a voltage detection module and a resistance calculation module.
  • the detection current is directly provided by the current output module inside the driver chip, and the voltage detection module inside the driver chip can detect the voltage at the output end of the current output module.
  • the resistance calculation module can automatically calculate the bonding resistance based on the voltage at the output terminal of the current output module and the detection current.
  • the resistance calculation module can automatically calculate the bonding resistance.
  • the technical four-probe method of testing the bonded resistance eliminates the need to use a test fixture with probes, which helps save the cost of the test fixture and shortens the test time, which in turn helps improve production efficiency.
  • Figure 1 is a schematic diagram of the connection structure of a display device when testing bonded resistance with four probes in the prior art
  • FIG. 2 is a schematic structural diagram of a driver chip provided by an embodiment of the present application.
  • Figure 3 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of another display device provided by an embodiment of the present application.
  • Figure 8 is a schematic structural diagram of another display device provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a bonding resistance testing system provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of the connection structure of a display device when testing bonded resistance using four probes in the prior art.
  • the display device includes a driver chip 100, a display panel 200 and a flexible circuit board 300.
  • the driver chip 100 includes three reserved chip connection terminals 101, and the display panel 200 includes one reserved chip connection terminal 101.
  • the flexible circuit board 300 includes a circuit board connection terminal 301 corresponding to a one-to-one bonding connection with the second panel connection terminal 202, for example They are the first circuit board connection terminal 3011, the second circuit board connection terminal 3012, the third circuit board connection terminal 3013 and the fourth circuit board connection terminal 3014 as shown in Figure 1 .
  • the resistance between any two connection terminals in Figure 1 is the connection resistance between the two connection terminals.
  • the connection resistance between the chip connection terminal 101 and the first panel connection terminal 201 is equal to the connection resistance between the two.
  • the resistance between the first panel connection terminal 201 and the second panel connection terminal 202 is equal to the resistance of the connecting line between them, and the resistance between the second panel connection terminal 202 and the circuit board connection terminal 301 is equal to The resistance of the bonding connection between the two.
  • the current can be input to the first circuit board connection terminal 3011 and the second circuit board connection terminal 3012 through the first probe and the second probe, and measured through the third probe and the fourth probe.
  • the voltage between the third circuit board connection terminal 3013 and the fourth circuit board connection terminal 3014 is different from that between the first circuit board connection terminal 3011 and the first circuit board connection terminal 3011.
  • the ratio of the input current of the second circuit board connection terminal 3012 is used to obtain the bonding resistance between the chip connection terminal 101 of the driver chip 100 and the first panel connection terminal 201 of the display panel 200 (the first chip connection terminal 1011 and the first panel connection terminal 201 of the display panel 200 in Figure 1
  • the resistance of the bonding connection of the first panel connection terminal 2011, that is, the resistance R1 in Figure 1 can be used as the resistance of any chip connection terminal 101 of the driver chip 100 and the corresponding bonding connection of the display panel 200. bonding resistance of the first panel connection terminal 201).
  • the above-mentioned four-probe test method for bonding resistance requires the use of additional probe test fixtures, making the cost of the test fixture higher; and the use of probe test fixtures for testing makes the test more time-consuming and affects the Productivity.
  • FIG. 2 is a schematic structural diagram of a driver chip provided by an embodiment of the present application.
  • the driver chip 10 includes at least two first connection terminals 110 and a resistor.
  • the detection circuit 120 (FIG. 2 schematically shows the case where the driver chip 10 includes two first connection terminals 110), the first terminal A1 of the resistance detection circuit 120 is connected to one first connection terminal 110, and the third terminal A1 of the resistance detection circuit 120 is connected to the first connection terminal 110.
  • the two terminals A2 are connected to any one of the other first connection terminals 110; the resistance detection circuit 120 includes a current output module 121, a voltage detection module 122 and a resistance calculation module 123; the output end of the current output module 121 is connected to the first terminal of the resistance detection circuit 120.
  • Terminal A1 is electrically connected and used to output detection current to the first terminal A1 of the resistance detection circuit 120;
  • the voltage detection module 122 is electrically connected to the output terminal of the current output module 121 and is used to detect the voltage of the output terminal of the current output module 121;
  • resistance calculation The module 123 is electrically connected to the current output module 121 and the voltage detection module 122 respectively, and is used to calculate the bonding resistance according to the voltage and detection current of the output terminal of the current output module 121.
  • the bonding resistance at least includes a first connection terminal 110 connected to the bonding resistance. resistance between a second connection terminal 210 of the display panel 20 .
  • the output end of the current output module 121 is electrically connected to the first end A1 of the resistance detection circuit 120.
  • the first end A1 of the resistance detection circuit 120 is connected to the first connection terminal 110 of the driver chip 10.
  • the current output module 121 outputs The end-to-end resistance detection circuit 120 outputs a detection current to the first terminal A1, thereby enabling the current output module 121 to output the detection current to the first connection terminal 110 through its own output terminal.
  • the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120 may be bonded to a second connection terminal on the display panel of the display device including the driving chip 10 of this embodiment.
  • the driver chip 10 also includes a first connection terminal 110 connected to the second terminal A2 of the resistance detection circuit 120.
  • the first connection terminal 110 connected to the second terminal A2 of the resistance detection circuit 120 can be connected to a display device including the driver chip 10 of this embodiment. Another second connection terminal on the display panel is bonded and connected, a second connection terminal is bonded and connected to the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120, and is connected to the resistance detection circuit 120.
  • the connection method of the second connection terminal of the bonding connection of the first connection terminal 110 of the second end A2 can be designed according to the bonding resistance to be detected.
  • FIG. 3 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device includes a driver chip 10 and a display panel 20 .
  • the display panel 20 is connected to a first end of the resistance detection circuit 120 .
  • the second connection terminal 210 (the first set second connection terminal 211 in FIG. 3 ) to which the connection terminal 110 is bonded, and the second connection to the first connection terminal 110 connected to the second end of the resistance detection circuit 120
  • the terminal 210 (the second setting second connection terminal 212 in FIG. 3 ) is short-circuited.
  • the current output module 121 outputs the detection current to the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120 through its own output terminal
  • the detection current can reach the third connection terminal 110 that is bonded to the first connection terminal 110 .
  • the second connection terminal 210 ie, the first setting second connection terminal 211
  • can reach another second connection terminal 210 ie, the second setting second connection terminal 212 through the short wire of the display panel 20, and then reach the The second setting second connection terminal 212 is bonded to the first connection terminal 110 connected to the second end of the connection resistance detection circuit 120 .
  • the current detection module also includes a voltage detection module 122 and a resistance calculation module 123.
  • the voltage detection module 122 is used to detect the voltage at the output end of the current output module 121.
  • the resistance calculation module 123 detects the voltage and resistance based on the voltage detected by the voltage detection module 122.
  • Current Calculation Bond Resistor optionally, the first connection terminal 110 connected to the second end of the resistance detection circuit 120 is connected to the fixed voltage V0 in the driver chip 10, then the second connection terminal 211 and the second setting are set according to the first setting of the display device in Figure 3.
  • connection method of the two connection terminals 212 according to the difference between the voltage of the output terminal of the current output module 121 detected by the voltage detection module 122 and the fixed voltage V0, it can be obtained that the first connection terminal 110 connecting the first end of the resistance detection circuit 120 and The voltage drop between the connection resistance of the second connection terminal 210 corresponding to the bonding connection and the connection resistance of the first connection terminal 110 at the second end of the resistance detection circuit 120 and the connection resistance of the second connection terminal 210 corresponding to the bonding connection, and the two The current flowing through each connection resistor is the detection current.
  • the resistance calculation module 123 can use the ratio of the voltage difference between the output terminal of the current output module 121 and the fixed voltage V0 to the detection current as the ratio to obtain the above two connection resistances (i.e. The connection resistance between the first connection terminal 110 at the first end of the resistance detection circuit 120 and the second connection terminal 210 corresponding to the bonding connection, and the first connection terminal 110 at the second end of the resistance detection circuit 120 and the second connection terminal 210 corresponding to the bonding connection.
  • the total resistance of the connecting resistor of the connecting terminal 210 then optionally, the resistance calculation module 123 directly uses the ratio of the voltage difference between the output terminal of the current output module 121 and the fixed voltage, and the detection current as the bonding resistance, then the The bonding resistance is equal to the sum of the connection resistances between the two pairs of connection terminals of the driver chip 10 and the display panel 20 (a pair of connection terminals is a first connection terminal 110 and a second connection terminal 210 bonded to it); or Directly take 1/2 of the ratio of the voltage difference between the output terminal of the current output module 121 and the fixed voltage and the detection current as the bonding resistance, then the bonding resistance is equal to the two pairs of connection terminals (one pair) of the driver chip 10 and the display panel 20
  • the connection terminal is half of the sum of the connection resistance between a first connection terminal 110 and a second connection terminal 210 bonded thereto.
  • the bonding resistance can be used as a link between the driver chip 10 and the display panel 20 . to the connection resistance between the connection terminals.
  • the first connection terminal 110 of the driver chip 10 may be a bonding pad of the driver chip 10
  • the second connection terminal 210 of the display panel 20 may be a bonding pad of the display panel 20 .
  • connection mode of the first set second connection terminal 211 and the second set second connection terminal 212 in the display device shown in FIG. 3 only corresponds to at least one first connection of the test bonding resistor including the driver chip 10
  • the bonding resistance may also include at least one between the display panel 20 and the flexible circuit board. The resistance between a pair of connection terminals, correspondingly, the connection method of the first set second connection terminal 211 and the second set second connection terminal 212 needs to be changed accordingly.
  • the test site for the bonding resistance can be directly integrated into the function testing site of the display module (including at least the display panel and the driver chip bonded to it). For example, it can be integrated into the lighting test site of the display module. , thereby improving production efficiency.
  • the bonding connection between the first connection terminal and the second connection terminal can be realized through conductive glue or through welding.
  • the first connection terminal and the corresponding bonding connection The connection resistance between the second connection terminals of the fixed connection may be equal to the resistance of the bonding connection therebetween.
  • the driver chip of this embodiment includes at least two first connection terminals.
  • the driver chip includes a resistance detection circuit inside.
  • the first end of the resistance detection circuit is connected to one first connection terminal, and the second end of the resistance detection circuit is connected to other first connections. any of the terminals.
  • the resistance detection circuit includes a current output module, a voltage detection module and a resistance calculation module.
  • the output end of the current output module is electrically connected to the first end of the resistance detection circuit.
  • the current output module outputs the detection current to the first connection terminal through its own output end, and Through the bonding connection between the first connection terminal and the second connection terminal on the display panel, and the second connection terminal bonded to the first connection terminal connected to the first end of the resistance detection circuit, and the second connection terminal connected to the resistance detection circuit.
  • the first connection terminal at the second end is bonded to the second connection terminal to realize the detection current from the first connection terminal connected to the first end of the resistance detection circuit to the first connection terminal connected to the second end of the resistance detection circuit.
  • transmission the voltage detection module is electrically connected to the output end of the current output module, and can detect the voltage at the output end of the current output module;
  • the resistance calculation module is electrically connected to the current output module and voltage detection module respectively, and can detect the voltage at the output end of the current output module. and the detection current to calculate the bonding resistance, and then the automatic calculation of the bonding resistance can be realized inside the driver chip.
  • the detection current is directly provided by the current output module inside the driver chip, and the voltage detection module inside the driver chip can detect the voltage at the output terminal of the current output module, and the resistance calculation module can detect the voltage at the output terminal of the current output module according to the output of the current output module.
  • the voltage and detection current at the terminal are automatically calculated for the bonding resistance. Compared with the automatic optical detection method in the existing technology, it is easier to detect the bonding resistance; and compared with the four-probe testing method of the bonding resistance in the existing technology , there is no need to use a test fixture with probes, which is conducive to saving the cost of the test fixture, and is conducive to shortening the test time, which is conducive to improving production efficiency.
  • FIG 4 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • the driver chip 10 also includes a memory module 124.
  • the memory module 124 is electrically connected to the resistance calculation module 123.
  • the memory module 124 is to store the bonded resistor.
  • the calculated bonding resistance value can be transmitted to the storage module 124.
  • the storage module 124 stores the calculated bonding resistance, thereby facilitating the test fixture 30 to transfer the value from the memory module 124 to the memory module 124. Reading the bonding resistance in medium is conducive to further improving production efficiency.
  • the storage module 124 may be a register. By reading the bonding resistance from the memory module 124, it takes very little time, and it is easy to realize the reading of the bonding resistance of a large number of display devices.
  • the driver chip 10 further includes: a communication interface 130 connected to the memory module 124 .
  • the communication interface 130 is used to connect the test fixture 30 and transmit the bonding resistance to the test fixture 30 .
  • the type of communication interface 130 may be a Mobile Industry Processor Interface (MIPI) interface or an I 2 C interface.
  • MIPI Mobile Industry Processor Interface
  • the test fixture 30 and the memory module 124 are connected through the communication interface 130 , so that the test fixture 30 can read the bonding resistance from the memory module 124 through the communication interface 130 .
  • the test fixture 30 After the test fixture 30 reads the bonding resistance from the memory module 124, it determines whether the bonding resistance meets the requirements through the setting program.
  • FIG. 5 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • the current output module 121 includes a current source 1211 and an output control unit 1212.
  • the output control unit 1212 is connected to the current source 1211 and 1212 respectively.
  • the resistance calculation module 123 is electrically connected, the current source 1211 is electrically connected to the first end A1 of the resistance detection circuit 120, and the output control unit 1212 is used to control the size of the detection current output by the current source 1211, and transmit the detection current to the resistance calculation module 123. size.
  • the current source 1211 is used to output the detection current
  • the output control unit 1212 is connected to the current source 1211 and used to control the magnitude of the detection current output by the current source 1211.
  • the current source 1211 is an adjustable current source whose output detection current is adjustable.
  • the output control unit 1212 is used to adjust the detection current output by the current source 1211 so that the current source 1211 can output a more appropriate detection current. , which is helpful to improve the accuracy of the obtained bonded resistance.
  • the output control unit 1212 controls the size of the detection current output by the power flow and at the same time transmits the size of the detection current to the resistance calculation module 123, so that the resistance calculation module 123 can calculate the corresponding bonding based on the voltage and detection current detected by the voltage detection module 122. resistance.
  • the voltage detection module 122 includes an operational amplifier 1221 and an analog-to-digital conversion unit 1222 , where the operational amplifier 1221 is used to convert the detected voltage of the first input terminal B1 connected to the output terminal of the current output module 121 .
  • Amplification, the specific amplification factor can be determined by the circuit structure connected to the second input terminal B2.
  • the analog-to-digital conversion unit 1222 is used to convert the analog voltage signal output by the operational amplifier 1221 into a digital voltage signal.
  • the resistance detection circuit 120 also includes a fixed voltage terminal.
  • the voltage of the fixed voltage terminal is lower than the voltage of the output terminal of the current output module 121.
  • the fixed voltage terminal is connected to the third terminal of the resistance detection circuit 120. Connect the two terminals A2.
  • the fixed voltage V0 in Figure 3 can also be the ground voltage of the fixed voltage terminal.
  • the fixed voltage terminal is used to input a fixed voltage.
  • the fixed voltage terminal may be the ground terminal GND.
  • the fixed voltage terminal is connected to the second terminal A2 of the resistance detection circuit 120.
  • the second terminal A2 of the resistance detection circuit 120 is also connected to the first connection terminal 110. Therefore, the first connection terminal 110 of the second terminal A2 of the resistance detection circuit 120 is connected to Fixed voltage terminal electrical connection.
  • the voltage at the output terminal of the current output module 121 detected by the voltage detection module 122 is equal to the voltage drop of each resistor on the bonding resistance test path to be measured, where the bonding resistance test path
  • the resistance test path is bonded and connected by the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120 and the second connection terminal 210 connected to the second terminal A1 of the resistance detection circuit 120 .
  • the connection relationship of the second connection terminal 210 is determined.
  • the resistance on the bonding resistance test path includes the first connection terminal 110 connected to the first end A1 of the resistance detection circuit 120 and the second connection terminal of the display panel 20 corresponding to the bonding connection.
  • connection resistance between the connection terminals 210 and the connection resistance between the first connection terminal 110 connecting the second end A2 of the resistance detection circuit 120 and the second connection terminal 210 of the display panel 20 corresponding to the bonding connection are as shown in FIG.
  • the display device shown in 3 can directly use the ratio of the voltage at the output terminal of the current output module 121 to the detection current as a bonding resistor.
  • the bonding resistor includes two pairs of connection terminals (a pair of connection terminals) of the driver chip 10 and the display panel 20.
  • the terminal is the sum of the connection resistances between a first connection terminal 110 and the second connection terminal 210) bonded to it; or directly take 1/2 of the ratio of the voltage at the output terminal of the current output module 121 to the detection current as
  • the bonding resistor includes two pairs of connection terminals between the driver chip 10 and the display panel 20 (a pair of connection terminals is a first connection terminal 110 and a second connection terminal 210 bonded to it). Half of the sum of the connecting resistors can be used as the bonding resistor as a connecting resistor between the driving chip 10 and a pair of connecting terminals of the display panel 20 .
  • FIG. 6 is a schematic structural diagram of another driver chip provided by an embodiment of the present application.
  • the resistance detection circuit 120 also includes a switch module 140 .
  • the switch module 140 is used to control the first end of the resistance detection circuit 120 The connection state between A1 and the current output module 121, and/or the connection state between the second terminal A2 and the fixed voltage terminal used to control the resistance detection circuit 120.
  • the switch module 140 can be used to control the first end A1 of the resistance detection circuit 120 and the current output module.
  • the output terminal of 121 is disconnected, and/or the second terminal A2 of the control resistance detection circuit 120 is disconnected from the fixed voltage terminal (FIG. 6 exemplarily shows that the fixed voltage terminal is the ground terminal GND), so that the driver chip 10 When the circuit is not powered on or the bonding resistance is not detected, no current flows through the resistance detection circuit 120 , which is beneficial to saving the power consumption of the driver chip 10 .
  • the switch module 140 includes a first switch K1 and a second switch K2.
  • the first end of the first switch K1 is electrically connected to the output end of the current output module 121.
  • the second end of the first switch K1 It is electrically connected to the first terminal A1 of the resistance detection circuit 120; the first terminal of the second switch K2 is electrically connected to the second terminal A2 of the resistance detection circuit 120; the second terminal of the second switch K2 is electrically connected to the fixed voltage terminal.
  • the first switch K1 can be used to control the connection state between the first terminal A1 of the resistance detection circuit 120 and the output terminal of the current output module 121
  • the second switch K2 can be used to control the second terminal of the resistance detection circuit 120.
  • the connection state between A2 and the fixed voltage terminal (FIG. 6 exemplarily shows that the fixed voltage terminal is the ground terminal GND).
  • the driver chip 10 may be provided with a switch control module that controls the conduction state of the first switch K1 and/or the second switch K2.
  • the first switch K1 may include a first control terminal
  • the second switch K2 may include a The second control terminal
  • the switch control module is electrically connected to the first control terminal and the second control terminal respectively.
  • the switch control module controls the conduction state of the first switch K1 by transmitting a control signal to the first control terminal to realize the resistance detection circuit. Control the connection state between the first terminal A1 of 120 and the output terminal of the current output module 121; and control the conduction state of the second switch K2 by transmitting a control signal to the second control terminal to realize the control of the resistance detection circuit 120 Control of the connection state between the second terminal A2 and the fixed voltage terminal.
  • An embodiment of the present application also provides a display device.
  • the display device includes the driver chip 10 of any of the above embodiments of the present application, and also includes a display panel 20.
  • the display panel 20 includes the driver chip.
  • Fixed area COG, the driving chip bonding area COG is provided with at least two second connection terminals 210;
  • the first setting is that the second connection terminal 211 is bonded to the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120
  • the second setting is that the second connection terminal 212 is connected to the second terminal A2 of the resistance detection circuit 120
  • the first connection terminal 110 is bonded, and the first setting second connection terminal 211 and the second setting second connection terminal 212 are short-circuited; wherein the first setting second connection terminal 211 and the second setting second connection terminal 211 are connected
  • the terminal 212 is any two of the at least two second connection terminals 210 .
  • the bonding resistance can be calculated based on the voltage detected by the voltage detection module 122 and the detection current output by the current output module 121.
  • the specific calculation method can be referred to the above mentioned in this application.
  • the embodiments will not be described again here.
  • the display device of this embodiment includes the driver chip 10 of any of the above-mentioned embodiments of this application, and has the beneficial effects of the driver chip 10 of any of the above-mentioned embodiments of this application.
  • the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacently, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged close to an edge of the driver chip 10;
  • the second connection terminals 210 are arranged in one-to-one correspondence with the first connection terminals 110 and are bonded.
  • the first connection terminals 110 of the driver chip 10 are arranged along the first direction x, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacent to each other in the first direction x and close to the driver chip 10
  • the set edge is set, wherein the extending direction of the set edge intersects the first direction x.
  • the second connection terminals 210 are arranged in one-to-one correspondence with the first connection terminals 110 and are bonded. Then the first set second connection terminal 211 and the second set second connection terminal 212 are also arranged adjacently and close to the display panel.
  • An edge setting is provided.
  • the two first connection terminals 110 of the driver chip 10 connected to the resistance detection circuit 120 are not used to transmit display driving signals, and the first connection terminals 110 not connected to the resistance detection circuit 120 are used to transmit display signals to the display panel 20
  • the driving signal therefore, in this embodiment, the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacently, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged close to one edge of the driving chip 10 , which is more conducive to the wiring design in the display panel 20 .
  • FIG. 7 is a schematic structural diagram of another display device provided by an embodiment of the present application.
  • the display device also includes a flexible circuit board 40
  • the display panel 20 also includes a flexible circuit board bonding area FOG, a flexible circuit
  • the board bonding area FOG is provided with a plurality of third connection terminals 220.
  • the flexible circuit board 40 includes a plurality of fourth connection terminals 410.
  • the third connection terminals 220 and the fourth connection terminals 410 are bonded in a one-to-one correspondence.
  • the third connection terminals 220 is also electrically connected in a one-to-one correspondence with the first set second connection terminal 211 that is not connected to the first connection terminal 110 .
  • the flexible circuit board 40 is bonded to the third connection terminal 220 of the display panel 20 through its own fourth connection terminal 410.
  • the flexible circuit board 40 is also connected to the main board of the display device, thereby causing the signal sent by the main board to The fourth connection terminal 410 can be reached through the flexible circuit board 40, and then the third connection terminal 220 bonded to the fourth connection terminal 410, and then the second connection terminal 210 connected to the third connection terminal 220, and then The first connection terminal 110 is bonded to the second connection terminal 210 , thereby enabling the display panel 20 to be driven.
  • FIG. 8 is a schematic structural diagram of another display device provided by the embodiment of the present application.
  • the display device includes the driver chip 10 of any of the above embodiments of the present application. It also includes a display panel 20 and a flexible circuit board 40.
  • the display panel 20 includes a driver chip bonding area COG and a flexible circuit board bonding area FOG.
  • the driver chip bonding area COG is provided with at least two second connection terminals 210.
  • the bonding area FOG is provided with at least two third connection terminals 220, and the flexible circuit board 40 includes at least two fourth connection terminals 410;
  • the first setting is that the second connection terminal 211 is bonded to the first connection terminal 110 connected to the first terminal A1 of the resistance detection circuit 120
  • the second setting is that the second connection terminal 212 is connected to the second terminal A2 of the resistance detection circuit 120
  • the first connection terminal 110 is bonded and connected; wherein the first setting second connection terminal 211 and the second setting second connection terminal 212 are any two of at least two second connection terminals 210;
  • the first set third connection terminal 221 is electrically connected to the first set second connection terminal 211, and the second set third connection terminal 222 is electrically connected to the second set second connection terminal 212; wherein the first set third connection terminal 221 is electrically connected to the second set second connection terminal 212;
  • the third connection terminal 221 and the second set third connection terminal 222 are any two of the at least two third connection terminals 220;
  • the first set fourth connection terminal 411 is bonded to the first set third connection terminal 221, and the second set fourth connection terminal 412 is bonded to the second set third connection terminal 222; wherein the first set The fourth connection terminal 411 and the second fourth connection terminal 412 are set to any two of the at least two fourth connection terminals 410; the first set fourth connection terminal 411 and the second set fourth connection terminal 412 Short.
  • the total resistance of the bonding resistance test path includes the first connection terminal 110 connected to the first end A1 of the resistance detection circuit 120 and the first set second The connection resistance between the connection terminals 211 (the resistance of the bonding connection between the two), the connection resistance between the first set second connection terminal 211 and the first set third connection terminal 221 (the resistance of the connection end between the two ), the first setting is the connection resistance between the third connection terminal 221 and the fourth connection terminal 411 (the resistance of the bonding connection between the two), the second setting is the connection resistance between the fourth connection terminal 412 and the second setting The connection resistance between the third connection terminals 222 (the resistance of the bonding connection between the two), the connection resistance between the second set third connection terminal 222 and the second set second connection terminal 212 (the connection resistance between the two The resistance of the wire), and the second setting is the connection resistance between the second connection terminal 212 and the first connection terminal 110 connecting the second end of the resistance detection circuit 120 (the
  • the first connection terminal 110 is bonded to the corresponding second connection terminal 210 , the second connection terminal 210 and the corresponding third connection terminal 220 are connected through a connecting wire, and the third connection terminal 220 is connected to the corresponding fourth connection terminal 410 Bond the connection.
  • the current flowing through the above-mentioned bonding resistance test path is still the detection current.
  • the difference between the voltage at the output terminal of the current output module 121 measured by the voltage detection module 122 and the fixed voltage is equal to the voltage drop on the total resistance of the above-mentioned bonding resistance test path.
  • the bonding resistance is equal to the first terminal connected to the resistance detection circuit 120
  • the connection resistance between the first connection terminal 110 and the first set second connection terminal 211 of A1 the connection resistance between the first set second connection terminal 211 and the first set third connection terminal 221, the first setting the connection resistance between the third connection terminal 221 and the first setting fourth connection terminal 411, the second setting the connection resistance between the fourth connection terminal 412 and the second setting third connection terminal 222, the second setting The connection resistance between the third connection terminal 222 and the second connection terminal 212 is set, and the connection between the second connection terminal 212 and the first connection terminal 110 connecting the second end of the resistance detection circuit 120 is set.
  • connection resistance detection The connection resistance between the first connection terminal 110 and the first set second connection terminal 211 of the first end A1 of the circuit 120, the connection resistance between the first set second connection terminal 211 and the first set third connection terminal 221 The connection resistance, the connection resistance between the first set third connection terminal 221 and the first set fourth connection terminal 411, the second set connection resistance between the fourth connection terminal 412 and the second set third connection terminal 222 The connection resistance, the second setting of the connection resistance between the third connection terminal 222 and the second setting of the second connection terminal 212, the second setting of the first connection between the second connection terminal 212 and the second end of the connection resistance detection circuit 120 Half of the sum of the connection resistances between the terminals 110, the bonding resistance can also be considered to be equal to the resistance of the bonding connection between a first connection terminal 110
  • the display device of this embodiment includes the driver chip of any of the above-mentioned embodiments of this application, and has the beneficial effects of the driver chip of any of the above-mentioned embodiments of this application.
  • the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacently, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged close to an edge of the driver chip 10;
  • the second connection terminal 210 is arranged in one-to-one correspondence with the first connection terminal 110 and is bonded;
  • the third connection terminal 220 is arranged in one-to-one correspondence with the first set second connection terminal 211 and is electrically connected;
  • the fourth connection terminal 410 is arranged in one-to-one correspondence with the third connection terminal 211 and is electrically connected.
  • the connection terminals 220 are set in one-to-one correspondence and bonded.
  • the first connection terminals 110 of the driver chip 10 are arranged along the first direction x, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacent to each other in the first direction x and close to the driver chip 10
  • the set edge is set, wherein the extending direction of the set edge intersects the first direction x.
  • the second connection terminals 210 are arranged in one-to-one correspondence with the first connection terminals 110 and are bonded. Then the first set second connection terminal 211 and the second set second connection terminal 212 are also arranged adjacently and close to the display panel.
  • An edge setting is provided.
  • first set third connection terminal 221 and the second set third connection terminal 222 are adjacent and arranged close to an edge of the display panel
  • the first set fourth connection terminal 411 and the second set fourth connection terminal 412 is arranged adjacent to and close to an edge of the display panel.
  • the two first connection terminals 110 of the driver chip 10 connected to the resistance detection circuit 120 are not used to transmit display driving signals, and the first connection terminals 110 not connected to the resistance detection circuit 120 are used to transmit display signals to the display panel 20
  • the driving signal therefore, in this embodiment, the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged adjacently, and the two first connection terminals 110 connected to the resistance detection circuit 120 are arranged close to one edge of the driving chip 10 , which is more conducive to the wiring design in the display panel 20 .
  • the embodiment of the present application also provides a bonding resistance test system.
  • Figure 9 is a schematic structural diagram of a bonding resistance test system provided by the embodiment of the application.
  • the bonding resistance test system includes any of the above-mentioned components of the application.
  • the display device 1 of the embodiment further includes a test fixture 30 , and the test fixture 30 is electrically connected to the driver chip 10 of the display device 1 .
  • the bonding resistance test system includes the display device of any of the above-mentioned embodiments of the present application, and has the beneficial effects of the display device of any of the above-mentioned embodiments of the present application, which will not be described again here.

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Abstract

一种驱动芯片（100）、显示装置和邦定电阻测试系统，驱动芯片（100）包括至少两个第一连接端子（110），驱动芯片（100）内部包括电阻检测电路（120），电阻检测电路（120）的第一端（A1）连接一个第一连接端子（110），电阻检测电路的第二端（A2）连接其他第一连接端子（110）中的另一个。电阻检测电路（120）包括电流输出模块（121）、电压检测模块（122）和电阻计算模块（123），检测电流直接由驱动芯片（100）内部的电流输出模块（121）提供，并且驱动芯片（100）内部的电压检测模块（122）可以实现对电流输出模块（121）的输出端的电压的检测，电阻计算模块（123）可以根据电流输出模块（121）的输出端的电压和检测电流对邦定电阻自动计算，无需使用设置探针的测试治具，有利于节约测试治具成本，且有利于缩短测试耗费的时间，进而有利于提高生产效率。

Description

驱动芯片、显示装置和邦定电阻测试系统
本申请要求于2022年04月26日提交中国专利局、申请号为202210447462.2、申请名称为“驱动芯片、显示装置和邦定电阻测试系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及显示技术领域，尤其涉及一种驱动芯片、显示装置和邦定电阻测试系统。
背景技术
显示装置中驱动芯片与显示面板之间邦定电阻的电阻符合设计标准和工艺制程能力是产品品质的重中之重。
现有显示装置包括驱动芯片和显示面板，驱动芯片和显示面板之间邦定连接，现有对邦定电阻的测试一般通过自动光学检测或四探针测试方式测量得到。
然而，自动光学检测存在检测困难的问题，而四探针测试邦定电阻的方式影响生产效率。
发明内容
本申请提供一种驱动芯片、显示装置和邦定电阻测试系统，以实现对邦定电阻的测试，并提高邦定电阻的检测效率。
第一方面，本申请实施例提供了一种驱动芯片，包括至少两个第一连接端子和电阻检测电路，电阻检测电路的第一端连接一个第一连接端子，电阻检测电路的第二端连接其他第一连接端子中的任一个；电阻检测电路包括电流输出模块、电压检测模块和电阻计算模块；
电流输出模块的输出端与电阻检测电路的第一端电连接，用于向电阻检测电路的第一端输出检测电流；
电压检测模块与电流输出模块的输出端电连接，用于检测电流输出模块的输出端的电压；
电阻计算模块分别与电流输出模块、电压检测模块电连接，用于根据电流输出模块的输出端的电压和检测电流计算邦定电阻，邦定电阻至少包括一个第一连接端子与邦定连接的显示面板的一个第二连接端子的之间的电阻。
可选的，驱动芯片还包括存储模块，存储模块与电阻计算模块电连接，存储模块用于存储邦定电阻。
可选的，驱动芯片还包括：通信接口，通信接口与存储模块连接，通信接口用于连接测试治具，并向测试治具传输邦定电阻。
可选的，电流输出模块包括电流源和输出控制单元，输出控制单元分别与电流源、电阻计算模块电连 接，电流源与电阻检测电路的第一端电连接，输出控制单元用于控制电流源输出的检测电流的大小，以及向电阻计算模块传输检测电流的大小。
可选的，电阻检测电路还包括固定电压端，固定电压端的电压低于电流输出模块的输出端的电压，固定电压端与电阻检测电路的第二端连接。
可选的，电阻检测电路还包括开关模块，开关模块用于控制电阻检测电路的第一端与电流输出模块之间的连接状态，和/或用于控制电阻检测电路的第二端与固定电压端之间的连接状态。
可选的，开关模块包括第一开关和第二开关，第一开关的第一端与电流输出模块的输出端电连接，第一开关的第二端与电阻检测电路的第一端电连接；第二开关的第一端与电阻检测电路的第二端电连接，第二开关的第二端与固定电压端电连接。
第二方面，本申请实施例还提供了一种显示装置，包括第一方面的驱动芯片，还包括显示面板，显示面板包括驱动芯片邦定区，驱动芯片邦定区设置有至少两个第二连接端子；
第一设定第二连接端子与连接电阻检测电路的第一端的第一连接端子邦定连接，第二设定第二连接端子与连接电阻检测电路的第二端的第一连接端子邦定连接，第一设定第二连接端子与第二设定第二连接端子短接；其中第一设定第二连接端子和第二设定第二连接端子为至少两个第二连接端子中的任意两个。
可选的，连接电阻检测电路的两个第一连接端子相邻设置，且与电阻检测电路连接的两个第一连接端子靠近驱动芯片的一个边缘设置；第二连接端子与第一连接端子一一对应设置并邦定连接；
可选的，显示装置还包括柔性线路板，显示面板还包括柔性线路板邦定区，柔性线路板邦定区设置有多个第三连接端子，柔性线路板包括多个第四连接端子，第三连接端子与第四连接端子一一对应邦定连接，第三连接端子还与未连接第一连接端子的第二连接端子一一对应电连接。
第三方面，本申请实施例还提供了另一种显示装置，包括第一方面的驱动芯片，还包括显示面板和柔性线路板，显示面板包括驱动芯片邦定区和柔性线路板邦定区，驱动芯片邦定区设置有至少两个第二连接端子，柔性线路板邦定区设置有至少两个第三连接端子，柔性线路板包括至少两个第四连接端子；
第一设定第二连接端子与连接电阻检测电路的第一端的第一连接端子邦定连接，第二设定第二连接端子与连接电阻检测电路的第二端的第一连接端子邦定连接；其中第一设定第二连接端子和第二设定第二连接端子为至少两个第二连接端子中的任意两个；
第一设定第三连接端子与第一设定第二连接端子电连接，第二设定第三连接端子与第二设定第二连接端子电连接；其中第一设定第三连接端子和第二设定第三连接端子为至少两个第三连接端子中的任意两个；
第一设定第四连接端子与第一设定第三连接端子邦定连接，第二设定第四连接端子与第二设定第三连接端子邦定连接；其中第一设定第四连接端子和第二设定第四连接端子为至少两个第四连接端子中的任意两个；
第一设定第四连接端子和第二设定第四连接端子短接。
可选的，连接电阻检测电路的两个第一连接端子相邻设置，且与电阻检测电路连接的两个第一连接端子靠近驱动芯片的一个边缘设置；第二连接端子与第一连接端子一一对应设置并邦定连接；第三连接端子与第二连接端子一一对应设置并电连接，第四连接端子与第三连接端子一一对应设置并邦定连接。
第四方面，本申请实施例还提供了一种邦定电阻测试系统，第二方面或第三方面的显示装置，还包括测试治具，测试治具与显示装置的驱动芯片电连接。
本申请实施例提供了驱动芯片、显示装置和邦定电阻测试系统，驱动芯片包括至少两个第一连接端子，驱动芯片内部包括电阻检测电路，电阻检测电路的第一端连接一个第一连接端子，电阻检测电路的第二端连接其他第一连接端子中的任一个。电阻检测电路包括电流输出模块、电压检测模块和电阻计算模块，检测电流直接由驱动芯片内部的电流输出模块提供，并且驱动芯片内部的电压检测模块可以实现对电流输出模块的输出端的电压的检测，电阻计算模块可以根据电流输出模块的输出端的电压和检测电流对邦定电阻自动计算，相比于现有技术中的自动光学检测方法更加容易实现对邦定电阻的检测；且相比于现有技术四探针测试邦定电阻的方式，无需使用设置探针的测试治具，有利于节约测试治具成本，且有利于缩短测试耗费的时间，进而有利于提高生产效率。
附图说明
图1是现有技术中四探针测试邦定电阻方式时显示装置的连接结构示意图；
图2是本申请实施例提供的一种驱动芯片的结构示意图；
图3是本申请实施例提供的一种显示装置的结构示意图；
图4是本申请实施例提供的另一种驱动芯片的结构示意图；
图5是本申请实施例提供的另一种驱动芯片的结构示意图；
图6是本申请实施例提供的另一种驱动芯片的结构示意图；
图7是本申请实施例提供的另一种显示装置的结构示意图；
图8是本申请实施例提供的另一种显示装置的结构示意图；
图9是本申请实施例提供的一种邦定电阻测试系统的结构示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。
正如背景技术中所述，现有对邦定电阻的测试一般通过自动光学检测或四探针测试方式测量得到，自动光学检测存在检测困难的问题，而四探针测试邦定电阻的方式影响生产效率。经申请人研究发现，出现上述问题的原因在于，现有显示面板包括硬质显示面板和柔性显示面板，其中柔性显示面板包括柔性基底，柔性基底通常采用聚酰亚胺等柔性材料，透过率相对较低，使得自动光学检测方式检测困难。图1是现有 技术中四探针测试邦定电阻方式时显示装置的连接结构示意图。参考图1，显示装置包括驱动芯片100、显示面板200和柔性线路板300，其中驱动芯片100上包括预留的三个芯片连接端子101，显示面板200上包括预留的与芯片连接端子101一一对应邦定连接的第一面板连接端子201，以及四个第二面板连接端子202；柔性线路板300上包括与第二面板连接端子202一一对应邦定连接的线路板连接端子301，例如为如图1所示的第一线路板连接端子3011、第二线路板连接端子3012、第三线路板连接端子3013和第四线路板连接端子3014。图1中任意两个连接端子之间的电阻为该两个连接端子之间的连接电阻，示例性的，芯片连接端子101与第一面板连接端子201之间的连接电阻等于二者之间的邦定连接的电阻，第一面板连接端子201与第二面板连接端子202之间的电阻等于二者之间连接线的电阻，第二面板连接端子202与线路板连接端子301之间的电阻等于二者之间的邦定连接的电阻。进行邦定电阻的测试时，可以通过第一探针和第二探针向第一线路板连接端子3011和第二线路板连接端子3012输入电流，并通过第三探针和第四探针测量第三线路板连接端子3013和第四线路板连接端子3014之间的电压，根据第三线路板连接端子3013和第四线路板连接端子3014之间的电压，与第一线路板连接端子3011和第二线路板连接端子3012输入电流的比值，得到驱动芯片100的芯片连接端子101与显示面板200的第一面板连接端子201之间的邦定电阻(图1中第一芯片连接端子一1011和第一面板连接端子一2011的邦定连接的电阻，即图1中电阻R1，可将该邦定连接的电阻作为驱动芯片100的任一芯片连接端子101与对应邦定连接的显示面板200的第一面板连接端子201的邦定电阻)。而上述四探针测试邦定电阻的方式，需要使用额外的探针测试治具，使得测试治具成本较高；并且使用探针测试治具进行测试的方式，使得测试耗费时间较长，影响生产效率。
基于上述原因，本申请实施例提供一种驱动芯片，图2是本申请实施例提供的一种驱动芯片的结构示意图，参考图2，该驱动芯片10包括至少两个第一连接端子110和电阻检测电路120(图2中示意性示出了驱动芯片10包括两个第一连接端子110的情况)，电阻检测电路120的第一端A1连接一个第一连接端子110，电阻检测电路120的第二端A2连接其他第一连接端子110中的任一个；电阻检测电路120包括电流输出模块121、电压检测模块122和电阻计算模块123；电流输出模块121的输出端与电阻检测电路120的第一端A1电连接，用于向电阻检测电路120的第一端A1输出检测电流；电压检测模块122与电流输出模块121的输出端电连接，用于检测电流输出模块121的输出端的电压；电阻计算模块123分别与电流输出模块121、电压检测模块122电连接，用于根据电流输出模块121的输出端的电压和检测电流计算邦定电阻，邦定电阻至少包括一个第一连接端子110与邦定连接的显示面板20的一个第二连接端子210的之间的电阻。
具体的，电流输出模块121的输出端与电阻检测电路120的第一端A1电连接，电阻检测电路120的第一端A1连接驱动芯片10的第一连接端子110，电流输出模块121通过自身输出端向电阻检测电路120 的第一端A1输出检测电流，进而实现电流输出模块121通过自身输出端向第一连接端子110输出检测电流。其中，连接电阻检测电路120第一端A1的第一连接端子110可以与包含本实施例的驱动芯片10的显示装置中的显示面板上的一第二连接端子邦定连接。驱动芯片10还包括连接电阻检测电路120第二端A2的第一连接端子110，该连接电阻检测电路120第二端A2的第一连接端子110可以与包含本实施例的驱动芯片10的显示装置中的显示面板上的另一第二连接端子邦定连接，与连接于电阻检测电路120第一端A1的第一连接端子110邦定连接的第二连接端子，和与连接于电阻检测电路120第二端A2的第一连接端子110邦定连接的第二连接端子的连接方式可以根据要检测的邦定电阻进行设计。
图3是本申请实施例提供的一种显示装置的结构示意图，参考图3，该显示装置包括驱动芯片10和显示面板20，显示面板20上与连接于电阻检测电路120第一端的第一连接端子110邦定连接的第二连接端子210(图3中第一设定第二连接端子211)，和与连接于电阻检测电路120第二端的第一连接端子110邦定连接的第二连接端子210(图3中第二设定第二连接端子212)短接。因此，电流输出模块121通过自身输出端向与电阻检测电路120的第一端A1连接的第一连接端子110输出检测电流时，该检测电流可以到达与该第一连接端子110邦定连接的第二连接端子210(即第一设定第二连接端子211)，并可以通过显示面板20的短接线到达另一第二连接端子210(即第二设定第二连接端子212)，然后到达与第二设定第二连接端子212邦定连接的连接电阻检测电路120第二端的第一连接端子110。驱动芯片10中，电流检测模块还包括电压检测模块122和电阻计算模块123，电压检测模块122用于检测电流输出模块121输出端的电压，电阻计算模块123根据电压检测模块122检测到的电压和检测电流计算邦定电阻。可选的，连接电阻检测电路120第二端的第一连接端子110在驱动芯片10中连接固定电压V0，则按照图3中显示装置的第一设定第二连接端子211与第二设定第二连接端子212的连接方式，根据电压检测模块122检测到的电流输出模块121的输出端的电压与该固定电压V0的差值，可以得到连接电阻检测电路120第一端的第一连接端子110与对应邦定连接的第二连接端子210的连接电阻，和电阻检测电路120第二端的第一连接端子110与对应邦定连接的第二连接端子210的连接电阻二者上的电压降，而两个连接电阻流过的电流均为检测电流，据此电阻计算模块123可以将电流输出模块121的输出端的电压与固定电压V0的压差，与检测电流的比值作为得到上述两个连接电阻(即连接电阻检测电路120第一端的第一连接端子110与对应邦定连接的第二连接端子210的连接电阻，和电阻检测电路120第二端的第一连接端子110与对应邦定连接的第二连接端子210的连接电阻)的总阻值，则可选的，电阻计算模块123直接将电流输出模块121的输出端的电压与固定电压的电压差，与检测电流的比值作为邦定电阻，则该邦定电阻等于驱动芯片10与显示面板20的两对连接端子(一对连接端子为一个第一连接端子110和与之邦定连接的第二连接端子210)之间的连接电阻的和；或者直接将电流输出模块121的输出端的电压与固定电压的电压差，与检测电流的比值的1/2作为邦定电阻，则邦定电阻等于驱动芯片10与显示面板20的两对连接端子(一对连接 端子为一个第一连接端子110和与之邦定连接的第二连接端子210)之间的连接电阻的和的一半，可以将该邦定电阻可作为驱动芯片10与显示面板20的一对连接端子之间的连接电阻。
其中，本实施例中，驱动芯片10的第一连接端子110可以是驱动芯片10的焊盘，显示面板20的第二连接端子210可以是显示面板20的焊盘。
需要说明的是，图3所示显示装置中第一设定第二连接端子211和第二设定第二连接端子212的连接方式只对应测试邦定电阻包括驱动芯片10的至少一个第一连接端子110与邦定连接的显示面板20的第二连接端子210之间的连接电阻的情况，在本申请其他可选实施例中，邦定电阻还可以包括显示面板20与柔性电路板之间至少一对连接端子之间的电阻，相应的，第一设定第二连接端子211和第二设定第二连接端子212的连接方式要相应发生改变，具体可以参照本申请下述实施例。
其中，对邦定电阻的测试站点可以直接集成在显示模组(至少包括显示面板和与之邦定连接的驱动芯片)的功能检测站点，示例性的，可以集成在显示模组的点灯测试站点，进而提高生产效率。
需要说明的是，本实施例及下述实施例中，第一连接端子与第二连接端子邦定连接可以通过导电胶来实现，也可通过焊接实现，相应的，第一连接端子与对应邦定连接的第二连接端子之间的连接电阻可以等于二者之间邦定连接的电阻。
本实施例的驱动芯片，包括至少两个第一连接端子，驱动芯片内部包括电阻检测电路，电阻检测电路的第一端连接一个第一连接端子，电阻检测电路的第二端连接其他第一连接端子中的任一个。电阻检测电路包括电流输出模块、电压检测模块和电阻计算模块，电流输出模块的输出端与电阻检测电路的第一端电连接，电流输出模块通过自身输出端向第一连接端子输出检测电流，并通过在第一连接端子与显示面板上第二连接端子的邦定连接，以及连接于电阻检测电路的第一端的第一连接端子邦定连接的第二连接端子，与连接于电阻检测电路的第二端的第一连接端子邦定连接的第二连接端子的连接，来实现检测电流由与电阻检测电路第一端连接的第一连接端子向与电阻检测电路第二端连接的第一连接端子的传输；电压检测模块与电流输出模块的输出端电连接，可以检测电流输出模块的输出端的电压；电阻计算模块分别与电流输出模块、电压检测模块电连接，可以根据电流输出模块的输出端的电压和检测电流计算邦定电阻，进而在驱动芯片内部即可实现对邦定电阻的自动计算。本实施的驱动芯片，检测电流直接由驱动芯片内部的电流输出模块提供，并且驱动芯片内部的电压检测模块可以实现对电流输出模块的输出端的电压的检测，电阻计算模块可以根据电流输出模块的输出端的电压和检测电流对邦定电阻自动计算，相比于现有技术中的自动光学检测方法更加容易实现对邦定电阻的检测；且相比于现有技术四探针测试邦定电阻的方式，无需使用设置探针的测试治具，有利于节约测试治具成本，且有利于缩短测试耗费的时间，进而有利于提高生产效率。
图4是本申请实施例提供的另一种驱动芯片的结构示意图，参考图4，可选的，驱动芯片10还包括存储模块124，存储模块124与电阻计算模块123电连接，存储模块124用于存储邦定电阻。
具体的，电阻计算模块123计算出邦定电阻后，可以将计算出的邦定电阻值传输至存储模块124，存储模块124存储计算出的邦定电阻，进而方便测试治具30从存储模块124中读取邦定电阻，有利于生产效率的进一步提升。其中，存储模块124可以是寄存器。通过从存储模块124中进行邦定电阻的读取，耗时很短，易于实现大批量显示装置的邦定电阻的读取。
继续参考图4，可选的，驱动芯片10还包括：通信接口130，通信接口130与存储模块124连接，通信接口130用于连接测试治具30，并向测试治具30传输邦定电阻。
可选的，通信接口130的类型可以是移动行业处理器接口(Mobile Industry Processor Interface，MIPI)接口或者I 2C接口。测试治具30和存储模块124通过通信接口130连接，使得测试治具30可以通过通信接口130从存储模块124中读取邦定电阻。可选的，测试治具30从存储模块124中读取邦定电阻后，通过设定程序来判断邦定电阻是否符合要求。
图5是本申请实施例提供的另一种驱动芯片的结构示意图，参考图5，可选的，电流输出模块121包括电流源1211和输出控制单元1212，输出控制单元1212分别与电流源1211、电阻计算模块123电连接，电流源1211与电阻检测电路120的第一端A1电连接，输出控制单元1212用于控制电流源1211输出的检测电流的大小，以及向电阻计算模块123传输检测电流的大小。
其中，电流源1211用于输出检测电流，输出控制单元1212与电流源1211连接，用来控制电流源1211输出的检测电流的大小。具体的，本实施例中电流源1211为输出的检测电流可调的可调电流源，通过输出控制单元1212来调节电流源1211输出的检测电流大小，使得电流源1211可以输出较为适当的检测电流，进而有利于提高得到的邦定电阻的准确性。输出控制单元1212控制电源流输出的检测电流大小的同时，向电阻计算模块123传输检测电流的大小，使得电阻计算模块123可以根据电压检测模块122检测到的电压和检测电流计算得到对应的邦定电阻。
继续参考图5，可选的，电压检测模块122包括运算放大器1221和模数转换单元1222，其中运算放大器1221用来将检测到的连接电流输出模块121的输出端的第一输入端B1的电压进行放大，具体放大倍数可以由第二输入端B2所接入的电路结构决定，模数转换单元1222用来将运算放大器1221输出的模拟电压信号转换为数字电压信号。
继续参考图2、图4和图5，可选的，电阻检测电路120还包括固定电压端，固定电压端的电压低于电流输出模块121的输出端的电压，固定电压端与电阻检测电路120的第二端A2连接。可选的，图3中 的固定电压V0也可以是固定电压端的接地电压。
具体的，参考图2、图4和图5，固定电压端用于输入固定电压。示例性地，固定电压端可以是接地端GND。固定电压端与电阻检测电路120的第二端A2连接，电阻检测电路120的第二端A2还连接第一连接端子110，因此连接电阻检测电路120的第二端A2的第一连接端子110与固定电压端电连接。示例性地，当固定电压端为接地端GND时，电压检测模块122所检测到的电流输出模块121的输出端的电压即等于要测量的邦定电阻测试路径上各电阻的电压降，其中邦定电阻测试路径由连接于电阻检测电路120的第一端A1的第一连接端子110邦定连接的第二连接端子210，和连接于电阻检测电路120第二端的第一连接端子110所邦定连接的第二连接端子210的连接关系决定。示例性的，对于图3所示显示装置，邦定电阻测试路径上的电阻则包括连接电阻检测电路120的第一端A1的第一连接端子110和对应邦定连接的显示面板20的第二连接端子210之间的连接电阻，以及连接电阻检测电路120的第二端A2的第一连接端子110与对应邦定连接的显示面板20的第二连接端子210之间的连接电阻，则对于图3所示显示装置，可以直接将电流输出模块121的输出端的电压与检测电流的比值作为邦定电阻，则该邦定电阻包括了驱动芯片10与显示面板20的两对连接端子(一对连接端子为一个第一连接端子110和与之邦定连接的第二连接端子210)之间的连接电阻的和；或者直接将电流输出模块121的输出端的电压与检测电流的比值的1/2作为邦定电阻，则邦定电阻包括了驱动芯片10与显示面板20的两对连接端子(一对连接端子为一个第一连接端子110和与之邦定连接的第二连接端子210)之间的连接电阻的和的一半，可以将该邦定电阻可作为驱动芯片10与显示面板20的一对连接端子之间的连接电阻。
图6是本申请实施例提供的另一种驱动芯片的结构示意图，参考图6，可选的，电阻检测电路120还包括开关模块140，开关模块140用于控制电阻检测电路120的第一端A1与电流输出模块121之间的连接状态，和/或用于控制电阻检测电路120的第二端A2与固定电压端之间的连接状态。
具体的，通过设置开关模块140，可以在驱动芯片10未上电或者驱动芯片10上电但不进行邦定电阻检测时，通过开关模块140控制电阻检测电路120的第一端A1与电流输出模块121的输出端断开，和/或控制电阻检测电路120的第二端A2与固定电压端(图6中示例性地示出了固定电压端为接地端GND)之间断开，使得驱动芯片10未上电或者不进行邦定电阻检测时，电阻检测电路120中无电流通过，进而有利于节约驱动芯片10的功耗。
继续参考图6，可选的，开关模块140包括第一开关K1和第二开关K2，第一开关K1的第一端与电流输出模块121的输出端电连接，第一开关K1的第二端与电阻检测电路120的第一端A1电连接；第二开关K2的第一端与电阻检测电路120的第二端A2电连接，第二开关K2的第二端与固定电压端电连接。
具体的，第一开关K1可以用来控制电阻检测电路120的第一端A1与电流输出模块121的输出端之 间的连接状态，第二开关K2可以用来控制电阻检测电路120的第二端A2与固定电压端(图6中示例性地示出了固定电压端为接地端GND)之间的连接状态。可选的，驱动芯片10中可以设置对第一开关K1和/或第二开关K2的导通状态进行控制的开关控制模块，第一开关K1可以包括第一控制端，第二开关K2可以包括第二控制端，开关控制模块分别与第一控制端、第二控制端电连接，开关控制模块通过向第一控制端传输控制信号控制第一开关K1的导通状态，以实现对电阻检测电路120的第一端A1与电流输出模块121的输出端之间连接状态的控制；并通过向第二控制端传输控制信号来控制第二开关K2的导通状态，以实现对电阻检测电路120的第二端A2与固定电压端之间的连接状态的控制。
本申请实施例还提供了一种显示装置，显示装置的结构示意图可以参考图3，该显示装置包括本申请上述任意实施例的驱动芯片10，还包括显示面板20，显示面板20包括驱动芯片邦定区COG，驱动芯片邦定区COG设置有至少两个第二连接端子210；
第一设定第二连接端子211与连接电阻检测电路120的第一端A1的第一连接端子110邦定连接，第二设定第二连接端子212与连接电阻检测电路120的第二端A2的第一连接端子110邦定连接，第一设定第二连接端子211与第二设定第二连接端子212短接；其中第一设定第二连接端子211和第二设定第二连接端子212为至少两个第二连接端子210中的任意两个。
通过设置显示装置中驱动芯片10与显示面板20的上述连接方式，可以根据电压检测模块122检测到的电压与电流输出模块121输出的检测电流计算得到邦定电阻，具体计算方式可以参照本申请上述实施例，在此不再赘述。本实施例的显示装置，包括本申请上述任意实施例的驱动芯片10，具备本申请上述任意实施例的驱动芯片10的有益效果。
继续参考图3，可选的，连接电阻检测电路120的两个第一连接端子110相邻设置，且与电阻检测电路120连接的两个第一连接端子110靠近驱动芯片10的一个边缘设置；第二连接端子210与第一连接端子110一一对应设置并邦定连接。
可选的，驱动芯片10的第一连接端子110沿第一方向x排布，与电阻检测电路120连接的两个第一连接端子110在第一方向x上相邻设置，并靠近驱动芯片10的设定边缘设置，其中设定边缘的延伸方向与第一方向x相交。第二连接端子210与第一连接端子110一一对应设置并邦定连接，则第一设定第二连接端子211和第二设定第二连接端子212也相邻设置，并靠近显示面板的一个边缘设置。因在正常显示时，驱动芯片10连接电阻检测电路120的两个第一连接端子110不用来传输显示驱动信号，不与电阻检测电路120连接的第一连接端子110用来向显示面板20传输显示驱动信号，因此，本实施例中，连接电阻检测电路120的两个第一连接端子110相邻设置，且与电阻检测电路120连接的两个第一连接端子110靠近驱动芯片10的一个边缘设置，更加有利于显示面板20中的布线设计。
图7是本申请实施例提供的另一种显示装置的结构示意图，参考图7，可选的，显示装置还包括柔性线路板40，显示面板20还包括柔性线路板邦定区FOG，柔性线路板邦定区FOG设置有多个第三连接端子220，柔性线路板40包括多个第四连接端子410，第三连接端子220与第四连接端子410一一对应邦定连接，第三连接端子220还与未连接第一连接端子110的第一设定第二连接端子211一对应电连接。
一方面，柔性线路板40通过自身的第四连接端子410与显示面板20的第三连接端子220邦定连接，另一方面，柔性线路板40还连接显示装置的主板，进而使得主板发送的信号可以通过柔性线路板40到达其第四连接端子410，然后到达与第四连接端子410邦定连接的第三连接端子220，然后到达与第三连接端子220连接的第二连接端子210，然后到达与第二连接端子210邦定连接的第一连接端子110，进而可以实现对显示面板20的驱动。
本申请实施例还提供了另一种显示装置，图8是本申请实施例提供的另一种显示装置的结构示意图，参考图8，该显示装置包括本申请上述任意实施例的驱动芯片10，还包括显示面板20和柔性线路板40，显示面板20包括驱动芯片邦定区COG和柔性线路板邦定区FOG，驱动芯片邦定区COG设置有至少两个第二连接端子210，柔性线路板邦定区FOG设置有至少两个第三连接端子220，柔性线路板40包括至少两个第四连接端子410；
第一设定第二连接端子211与连接电阻检测电路120的第一端A1的第一连接端子110邦定连接，第二设定第二连接端子212与连接电阻检测电路120的第二端A2的第一连接端子110邦定连接；其中第一设定第二连接端子211和第二设定第二连接端子212为至少两个第二连接端子210中的任意两个；
第一设定第三连接端子221与第一设定第二连接端子211电连接，第二设定第三连接端子222与第二设定第二连接端子212电连接；其中第一设定第三连接端子221和第二设定第三连接端子222为至少两个第三连接端子220中的任意两个；
第一设定第四连接端子411与第一设定第三连接端子221邦定连接，第二设定第四连接端子412与第二设定第三连接端子222邦定连接；其中第一设定第四连接端子411和第二设定第四连接端子412为至少两个第四连接端子410中的任意两个；第一设定第四连接端子411和第二设定第四连接端子412短接。
具体的，显示装置的连接方式为图8的上述连接方式时，邦定电阻测试路径的总电阻包括了连接电阻检测电路120的第一端A1的第一连接端子110与第一设定第二连接端子211之间的连接电阻(二者邦定连接的电阻)、第一设定第二连接端子211与第一设定第三连接端子221之间的连接电阻(二者之间连接端的电阻)、第一设定第三连接端子221与第一设定第四连接端子411之间的连接电阻(二者邦定连接的电阻)、第二设定第四连接端子412与第二设定第三连接端子222之间的连接电阻(二者邦定连接的电阻)、第二设定第三连接端子222与第二设定第二连接端子212之间的连接电阻(二者之间连接线的电阻)、第 二设定第二连接端子212与连接电阻检测电路120第二端的第一连接端子110之间的连接电阻(二者邦定连接的电阻)。即第一连接端子110与对应的第二连接端子210邦定连接，第二连接端子210与对应的第三连接端子220通过连接线进行连接，第三连接端子220与对应的第四连接端子410邦定连接。流过上述邦定电阻测试路径的电流仍为检测电流，电压检测模块122测得的电流输出模块121的输出端的电压与固定电压的差值等于上述邦定电阻测试路径的总电阻上的电压降，则将电压检测模块122测得的电流输出模块121的输出端的电压与固定电压V0的差值，与检测电流的比值作为邦定电阻时，邦定电阻等于连接电阻检测电路120的第一端A1的第一连接端子110与第一设定第二连接端子211之间的连接电阻、第一设定第二连接端子211与第一设定第三连接端子221之间的连接电阻、第一设定第三连接端子221与第一设定第四连接端子411之间的连接电阻、第二设定第四连接端子412与第二设定第三连接端子222之间的连接电阻、第二设定第三连接端子222与第二设定第二连接端子212之间的连接电阻、第二设定第二连接端子212与连接电阻检测电路120第二端的第一连接端子110之间的连接电阻之和；将电压检测模块122测得的电流输出模块121的输出端的电压与固定电压V0的差值，与检测电流的比值的1/2作为邦定电阻时，邦定电阻等于连接电阻检测电路120的第一端A1的第一连接端子110与第一设定第二连接端子211之间的连接电阻、第一设定第二连接端子211与第一设定第三连接端子221之间的连接电阻、第一设定第三连接端子221与第一设定第四连接端子411之间的连接电阻、第二设定第四连接端子412与第二设定第三连接端子222之间的连接电阻、第二设定第三连接端子222与第二设定第二连接端子212之间的连接电阻、第二设定第二连接端子212与连接电阻检测电路120第二端的第一连接端子110之间的连接电阻之和的一半，也可认为该邦定电阻等于一个第一连接端子110与一个第二连接端子210邦定连接的电阻、一个第二连接端子210与一个第三连接端子220连接线的电阻、与一个第三连接端子与一个第四连接端子410邦定连接的电阻的和。
本实施例的显示装置，包括本申请上述任意实施例的驱动芯片，具备本申请上述任意实施例的驱动芯片的有益效果。
继续参考图8，可选的，连接电阻检测电路120的两个第一连接端子110相邻设置，且与电阻检测电路120连接的两个第一连接端子110靠近驱动芯片10的一个边缘设置；第二连接端子210与第一连接端子110一一对应设置并邦定连接；第三连接端子220与第一设定第二连接端子211一对应设置并电连接，第四连接端子410与第三连接端子220一一对应设置并邦定连接。
可选的，驱动芯片10的第一连接端子110沿第一方向x排布，与电阻检测电路120连接的两个第一连接端子110在第一方向x上相邻设置，并靠近驱动芯片10的设定边缘设置，其中设定边缘的延伸方向与第一方向x相交。第二连接端子210与第一连接端子110一一对应设置并邦定连接，则第一设定第二连 接端子211和第二设定第二连接端子212也相邻设置，并靠近显示面板的一个边缘设置。同理第一设定第三连接端子221和第二设定第三连接端子222相邻且靠近显示面板的一个边缘设置、第一设定第四连接端子411和第二设定第四连接端子412相邻且靠近显示面板的一个边缘设置。因在正常显示时，驱动芯片10连接电阻检测电路120的两个第一连接端子110不用来传输显示驱动信号，不与电阻检测电路120连接的第一连接端子110用来向显示面板20传输显示驱动信号，因此，本实施例中，连接电阻检测电路120的两个第一连接端子110相邻设置，且与电阻检测电路120连接的两个第一连接端子110靠近驱动芯片10的一个边缘设置，更加有利于显示面板20中的布线设计。
本申请实施例还提供了一种邦定电阻测试系统，图9是本申请实施例提供的一种邦定电阻测试系统的结构示意图，参考图9，该邦定电阻测试系统包括本申请上述任意实施例的显示装置1，还包括测试治具30，测试治具30与显示装置1的驱动芯片10电连接。该邦定电阻测试系统包括本申请上述任意实施例的显示装置，具备本申请上述任意实施例的显示装置的有益效果，在此不再赘述。
注意，上述仅为本申请的较佳实施例及所运用技术原理。本领域技术人员会理解，本申请不限于这里所述的特定实施例，对本领域技术人员来说能够进行各种明显的变化、重新调整和替代而不会脱离本申请的保护范围。因此，虽然通过以上实施例对本申请进行了较为详细的说明，但是本申请不仅仅限于以上实施例，在不脱离本申请构思的情况下，还可以包括更多其他等效实施例，而本申请的范围由所附的权利要求范围决定。

Claims (10)

  1. 一种驱动芯片，其中包括至少两个第一连接端子和电阻检测电路，所述电阻检测电路的第一端连接一个所述第一连接端子，所述电阻检测电路的第二端连接其他所述第一连接端子中的任一个；所述电阻检测电路包括电流输出模块、电压检测模块和电阻计算模块；
    所述电流输出模块的输出端与所述电阻检测电路的第一端电连接，用于向所述电阻检测电路的第一端输出检测电流；
    所述电压检测模块与所述电流输出模块的输出端电连接，用于检测所述电流输出模块的输出端的电压；
    所述电阻计算模块分别与所述电流输出模块、所述电压检测模块电连接，用于根据所述电流输出模块的输出端的电压和所述检测电流计算邦定电阻，所述邦定电阻至少包括一个所述第一连接端子与邦定连接的显示面板的一个第二连接端子的之间的电阻。
  2. 根据权利要求1所述的驱动芯片，其中，还包括存储模块，所述存储模块与所述电阻计算模块电连接，所述存储模块用于存储所述邦定电阻。
  3. 根据权利要求2所述的驱动芯片，其中，还包括通信接口，所述通信接口与所述存储模块连接，所述通信接口用于连接测试治具，并向所述测试治具传输所述邦定电阻。
  4. 根据权利要求1所述的驱动芯片，其中，所述电流输出模块包括电流源和输出控制单元，所述输出控制单元分别与所述电流源、所述电阻计算模块电连接，所述电流源与所述电阻检测电路的第一端电连接，所述输出控制单元用于控制所述电流源输出的所述检测电流的大小，以及向所述电阻计算模块传输所述检测电流的大小。
  5. 根据权利要求1所述的驱动芯片，其中，所述电阻检测电路还包括固定电压端，所述固定电压端的电压低于所述电流输出模块的输出端的电压，所述固定电压端与所述电阻检测电路的第二端连接。
  6. 根据权利要求5所述的驱动芯片，其中，所述电阻检测电路还包括开关模块，所述开关模块用于控制所述电阻检测电路的第一端与所述电流输出模块之间的连接状态，和/或用于控制所述电阻检测电路的第二端与所述固定电压端之间的连接状态。
  7. 根据权利要求6所述的驱动芯片，其中，所述开关模块包括第一开关和第二开关，所述第一开关的第一端与所述电流输出模块的输出端电连接，所述第一开关的第二端与所述电阻检测电路的第一端电连接；所述第二开关的第一端与所述电阻检测电路的第二端电连接，所述第二开关的第二端与所述固定电压端电连接。
  8. 一种显示装置，其中，包括权利要求1-7任一项所述的驱动芯片，还包括显示面板，所述显示面板包括驱动芯片邦定区，所述驱动芯片邦定区设置有至少两个第二连接端子；
    第一设定第二连接端子与连接所述电阻检测电路的第一端的所述第一连接端子邦定连接，第二设定第二连接端子与连接所述电阻检测电路的第二端的所述第一连接端子邦定连接，所述第一设定第二连接端子 与所述第二设定第二连接端子短接；其中所述第一设定第二连接端子和所述第二设定第二连接端子为至少两个所述第二连接端子中的任意两个；
    优选的，连接所述电阻检测电路的两个第一连接端子相邻设置，且与所述电阻检测电路连接的两个所述第一连接端子靠近所述驱动芯片的一个边缘设置；所述第二连接端子与所述第一连接端子一一对应设置并邦定连接；
    优选的，所述显示装置还包括柔性线路板，所述显示面板还包括柔性线路板邦定区，所述柔性线路板邦定区设置有多个第三连接端子，所述柔性线路板包括多个第四连接端子，所述第三连接端子与所述第四连接端子一一对应邦定连接，所述第三连接端子还与未连接所述第一连接端子的所述第二连接端子一一对应电连接。
  9. 一种显示装置，其中，包括权利要求1-7任一项所述的驱动芯片，还包括显示面板和柔性线路板，所述显示面板包括驱动芯片邦定区和柔性线路板邦定区，所述驱动芯片邦定区设置有至少两个第二连接端子，所述柔性线路板邦定区设置有至少两个第三连接端子，所述柔性线路板包括至少两个第四连接端子；
    第一设定第二连接端子与连接所述电阻检测电路的第一端的所述第一连接端子邦定连接，第二设定第二连接端子与连接所述电阻检测电路的第二端的所述第一连接端子邦定连接；其中所述第一设定第二连接端子和所述第二设定第二连接端子为至少两个所述第二连接端子中的任意两个；
    第一设定第三连接端子与所述第一设定第二连接端子电连接，第二设定第三连接端子与所述第二设定第二连接端子电连接；其中所述第一设定第三连接端子和所述第二设定第三连接端子为至少两个所述第三连接端子中的任意两个；
    第一设定第四连接端子与所述第一设定第三连接端子邦定连接，第二设定第四连接端子与所述第二设定第三连接端子邦定连接；其中所述第一设定第四连接端子和所述第二设定第四连接端子为至少两个所述第四连接端子中的任意两个；
    所述第一设定第四连接端子和所述第二设定第四连接端子短接；
    优选的，连接所述电阻检测电路的两个第一连接端子相邻设置，且与所述电阻检测电路连接的两个所述第一连接端子靠近所述驱动芯片的一个边缘设置；所述第二连接端子与所述第一连接端子一一对应设置并邦定连接；所述第三连接端子与所述第二连接端子一一对应设置并电连接，所述第四连接端子与所述第三连接端子一一对应设置并邦定连接。
  10. 一种邦定电阻测试系统，其中，包括权利要求8或9所述的显示装置，还包括测试治具，所述测试治具与所述显示装置的驱动芯片电连接。
PCT/CN2022/115875 2022-04-26 2022-08-30 驱动芯片、显示装置和邦定电阻测试系统 WO2023206894A1 (zh)

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