WO2023204580A1 - 압력센서모듈 및 그 제어방법 - Google Patents
압력센서모듈 및 그 제어방법 Download PDFInfo
- Publication number
- WO2023204580A1 WO2023204580A1 PCT/KR2023/005248 KR2023005248W WO2023204580A1 WO 2023204580 A1 WO2023204580 A1 WO 2023204580A1 KR 2023005248 W KR2023005248 W KR 2023005248W WO 2023204580 A1 WO2023204580 A1 WO 2023204580A1
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- WO
- WIPO (PCT)
- Prior art keywords
- sensing electrode
- electrode
- sensing
- pressure sensor
- sensor module
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2268—Arrangements for correcting or for compensating unwanted effects
- G01L1/2281—Arrangements for correcting or for compensating unwanted effects for temperature variations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
Definitions
- One embodiment of the present invention relates to a pressure sensor module and its control method.
- pressure sensors were attached as a thin film on a flat surface to a typical substrate or substrate.
- Patent Document 1 KR 101301277 B1
- the purpose of one embodiment of the present invention is to provide a pressure sensor module that can more effectively increase the reliability of pressure sensing by responding more flexibly to external pressure through a pressure sensor using a flexible base material.
- the purpose is to provide a pressure sensor module that can adjust the heating temperature according to the location or degree of pressure applied through the heater unit including.
- pressure sensing and heating can be operated simultaneously through a structure in which the heat wire is formed on the same base material as the sensing electrode for pressure sensing, or a structure in which the heat wire can be formed simultaneously when the resistor is formed on the substrate forming the resistor.
- it is intended to provide a control method of a pressure sensor module that can appropriately control the heating action through pressure sensing values.
- the pressure sensor module includes a base substrate, at least one sensing electrode formed on the base substrate, an adhesive layer formed on the base substrate so that the sensing electrode is exposed, and the adhesive layer formed on the adhesive layer, It is formed on a resistor substrate and a base substrate having at least one resistor facing the sensing electrode, and includes at least one heater unit including a heating wire formed to be insulated from the sensing electrode.
- the sensing electrode may be combined so that the first sensing electrode and the second sensing electrode are insulated from each other so as to be symmetrical in all directions on a plane.
- the heater unit is formed adjacent to the sensing electrode on the base substrate and includes a heating wire for electrical connection
- the sensing electrode includes a first electrode wire electrically connected to the first sensing electrode and a second sensing electrode. and a second electrode wire electrically connected to, and the hot wire may be formed on the base substrate to be insulated from the first electrode wire or the second electrode wire.
- the hot wire may be formed on one side or the other side of the base substrate to be insulated from the first sensing electrode, the second sensing electrode, and the first electrode wiring and the second electrode wiring.
- the resistor may include a plurality of separate resistance patterns that contact each other to electrically connect the first sensing electrode and the second sensing electrode so that the first sensing electrode and the second sensing electrode are electrically connected to each other. there is.
- the pressure sensor module includes a base substrate, at least one sensing electrode formed on the base substrate, an insulating layer formed on the base substrate so that the sensing electrode is exposed, and It may include a resistor substrate with at least one resistor facing the sensing electrode and at least one heater unit including a heating wire formed on the insulating layer.
- the sensing electrode may be combined so that the first sensing electrode and the second sensing electrode are insulated from each other so as to be symmetrical in all directions on a plane.
- the hot wire is formed on one side or the other side of the base substrate, and is electrically connected to the first sensing electrode and the second sensing electrode, a first electrode wire electrically connected to the first sensing electrode, and a second sensing electrode. It may be formed to be insulated from the second electrode wiring.
- the resistor may include a plurality of separate resistance patterns that contact each other to electrically connect the first sensing electrode and the second sensing electrode so that the first sensing electrode and the second sensing electrode are electrically connected to each other. there is.
- a pressure sensor module includes a base substrate, at least one sensing electrode formed on the base substrate, an adhesive layer formed on the base substrate to expose the sensing electrode, and an insulating layer formed on the sensing electrode. It is formed on a resistor substrate having at least one resistor facing the electrode and a single resistor substrate, and includes at least one heater unit including a heating wire formed to be insulated from the resistor.
- the sensing electrode may be combined so that the first sensing electrode and the second sensing electrode are insulated from each other so as to be symmetrical in all directions on a plane.
- the hot wire is formed on one side or the other side of the base substrate, and is electrically connected to the first sensing electrode and the second sensing electrode, a first electrode wire electrically connected to the first sensing electrode, and a second sensing electrode. It may be formed to be insulated from the second electrode wiring.
- the resistor may include a plurality of separate resistance patterns that contact each other to electrically connect the first sensing electrode and the second sensing electrode so that the first sensing electrode and the second sensing electrode are electrically connected to each other. there is.
- a method of manufacturing a pressure sensor module includes the steps of sensing external pressure by a pressure sensing unit including a plurality of sensing electrodes on a base material, and calculating a pressure value from the value sensed by the pressure sensing unit. Calculating the position and size of the additional pressure sensor, respectively, selecting the heater area corresponding to the position of the pressure sensor calculated by the pressure value calculation unit and the heater area of the heater unit, and A heating control unit controls the heater unit to apply a heating temperature corresponding to the distribution of the pressure value calculated by the pressure value calculation unit.
- the step of the heating control unit controlling the heater unit is to set at least two heater areas at positions closest to the pressure sensing position calculated by the pressure value calculation unit, and to set the pressure value calculated by the pressure value calculation unit. It may include setting the heating temperature on the two heater areas to be distributed to correspond to the relative difference.
- sensing electrodes in directions that intersect one direction and the other on the base material of the pressure sensor, and electrically connecting the electrode wires of each sensing electrode in directions that intersect, a plane on which pressure is sensed and applied at the same time is sensed. It has the effect of effectively sensing the coordinates (position) of the image.
- a bump that protrudes upward is additionally formed at a position corresponding to the position where the sensing electrode and the resistor face each other, so that external pressure is effectively transmitted through contact deformation between the sensing electrode and the resistor, thereby improving the accuracy and sensitivity of pressure sensing. There is an effect that can further improve.
- the electrode wiring of the sensing electrode of the base substrate when forming the electrode wiring of the sensing electrode of the base substrate, by arranging them to be insulated on the upper and lower surfaces of the base substrate, it is possible to more effectively secure an insulating structure with the heat wire formed on the base substrate. there is.
- the heater unit when used in car seats or other chairs, when the user's pressure is sensed by a pressure sensor, the heater unit is appropriately controlled to correspond to the corresponding pressure sensing value by calculating the position of the pressure sensing or the size of the pressure value to control the user's pressure. It has the effect of implementing an optimized heater function for convenience and improving energy efficiency.
- FIG. 1 is a plan view of the arrangement of sensing electrodes of a pressure sensor module according to a first embodiment of the present invention.
- Figure 2 is a plan schematic diagram showing only the heater part of the pressure sensor module according to the first embodiment of the present invention.
- Figure 3 is a plan view of the pressure sensor module according to the first embodiment of the present invention.
- Figure 4 is a perspective view of the pressure sensor module according to the first embodiment of the present invention.
- Figure 5 is a cross-sectional view taken along AA' of part A of Figure 4.
- Figure 6 is a cross-sectional view taken along BB' of part B of Figure 4.
- Figure 7 is a top view and partial cross-sectional view of the resistance substrate of the pressure sensor module according to the first embodiment of the present invention.
- Figure 8 is an exploded perspective view of the pressure sensor module according to the first embodiment of the present invention.
- Figure 10 is a top view of the contact between the sensing electrode and the resistor of the pressure sensor module according to the first embodiment of the present invention.
- Figure 11 is an enlarged view of the sensing electrode of the pressure sensor module according to the first embodiment of the present invention.
- Figure 12 is an enlarged view of the resistor of the pressure sensor module according to the first embodiment of the present invention
- Figure 13 is an enlarged view of the contact form between the sensing electrode and the resistor of the pressure sensor module according to the first embodiment of the present invention.
- Figure 14 is an enlarged view of a modified example of the resistor of the pressure sensor module according to the first embodiment of the present invention
- 15 and 16 are schematic diagrams of the operation of the pressure sensor module according to the first embodiment of the present invention.
- Figure 17 is an exploded perspective view of the pressure sensor module according to the second embodiment of the present invention.
- Figure 18 is an exploded perspective view of the pressure sensor module according to the third embodiment of the present invention.
- Figure 19 is a schematic diagram of the operation of the control method of the pressure sensor module according to an embodiment of the present invention.
- Figure 1 is a plan view of the arrangement of the sensing electrodes of the pressure sensor module according to the first embodiment of the present invention
- Figure 2 is a plan schematic diagram showing only the heater part of the pressure sensor module according to the first embodiment of the present invention
- Figure 3 is this A top view of the pressure sensor module according to the first embodiment of the invention
- Figure 4 is a perspective view of the pressure sensor module according to the first embodiment of the invention
- Figure 5 is a cross-sectional view taken along AA' of portion A of Figure 4
- Figure 6 is a cross-sectional view of the pressure sensor module according to the first embodiment of the invention.
- FIG. 7 A cross-sectional view taken along line BB' of part B of Figure 4
- Figure 7 is a plan view and a partial cross-sectional view of the resistance substrate of the pressure sensor module according to the first embodiment of the present invention
- Figure 8 is a pressure diagram according to the first embodiment of the present invention. This is an exploded perspective view of the sensor module.
- the pressure sensor module includes a base substrate 10, at least one sensing electrode 20 formed on the base substrate 10, and a pressure sensor module installed on the base substrate so that the sensing electrode 20 is exposed.
- a formed adhesive layer 31 is formed on the adhesive layer 31, and is formed on a resistor substrate 40 and the base substrate 10 on which at least one resistor 41 facing the sensing electrode 20 is formed.
- at least one heater unit 50 including a heating wire 51 formed to be insulated from the sensing electrode 20.
- the sensing electrode 20 is formed on the base substrate 10, and the electrode wiring 23 for electrical connection of the sensing electrode 20 is formed on the base substrate 10. It can be.
- the base substrate 10 is formed with a sensing electrode 20 and electrode wiring 23 for electrical connection of the sensing electrode 20.
- a flexible printed circuit board can be applied to allow flexible movement for sensing external pressure, and the base substrate 10 is formed using a flexible polyester film or polyimide film having the same physical properties. Of course you can do it.
- the base substrate 10 can serve as a support substrate for pressure sensing. Since the base material 10 can flexibly respond to multiple pressures, the reliability of pressure sensing can be further improved through the sensing electrode 20.
- the solid and dotted lines of the electrode wire 23 shown in the plan view of the pressure sensor module shown in FIG. 1 are solid lines for the electrode wire 23 formed on the upper surface of the base substrate 10, and are formed on the lower surface of the base substrate 10.
- the formed electrode wiring 23 is expressed as a dotted line. Specific details regarding this will be described later.
- the sensing electrode 20 is formed to be mutually insulated from the first sensing electrode 21 and the second sensing electrode 22 (see FIG. 11), and the electrode wiring 23 is also electrically connected from the first sensing electrode 21. It is formed of a first electrode wire 23a and a second electrode wire 23b electrically connected from the second sensing electrode 22.
- a plurality of sensing electrodes 20 may be arranged on the base substrate 10 in two mutually insulating axes directions.
- pressure can be sensed with a single sensing electrode 20, but by arranging a plurality of them in two axes directions, not only the pressure but also the position of the energized sensing electrode 20 can also be sensed.
- a plurality of sensing electrodes 20 are arranged on the base substrate 10, spaced apart from each other in one direction and the other direction.
- the first sensing electrode 21 is electrically connected through the first electrode wire 23a
- the sensing electrode 20 is connected in the other direction through the second electrode wire 23b.
- the second sensing electrodes 22 are each electrically connected.
- the electrode wire 23 is connected to the first electrode wire 23a and the second electrode wire to prevent electrical short-circuiting at the points where they cross each other and to maximize the sensing area of the sensing electrode 20 on the base substrate 10.
- the position of the sensing electrode 20 to which pressure is applied can be sensed through the difference between the electrical signals of the first electrode wire 23a and the second electrode wire 23b.
- the bottom surface of the base material 10 is The second electrode wire 23b formed in may extend from the end of the base substrate 10 back to the upper surface and be connected to the power connection unit.
- Figure 1 shows one embodiment of the arrangement of the electrode wiring 23.
- Figure 2 is a diagram showing the heater unit 50 on one side of the base substrate 10.
- the heater unit 50 may be formed on the same surface of the base substrate to be insulated and spaced apart from the sensing electrode 20, and the sensing electrode and the heater unit 50 may be formed to be insulated from each other as shown in FIG. 3.
- the heating wire 51 of the heater unit 50 may be formed along the circumference adjacent to the sensing electrode 20 and is formed to be insulated from the electrode wire 23 connecting the sensing electrode 20.
- the heating wire 51 may be formed of at least one heater unit that is independently electrically connected to generate heat.
- the heating wire 51 may be formed on one surface of the base substrate 10 to form a heater area with one closed curve.
- it can be formed by dividing into a plurality of heater areas: first area (I), second area (II), third area (III), and fourth area (IV).
- the heater unit 50 consisting of one closed curve of the heating wire 51 is formed into a plurality of heater areas, and each heating wire 51 is independently electrically connected, so that the heating temperature can be adjusted for each heater area.
- FIG. 2 Although four areas are shown in FIG. 2, multiple areas including the sensing electrode 20 can be set as heater areas, or the heater unit 30 can be formed with only one heater area, so the design scope and shape are not shown. It is not limited to the drawings provided.
- the base material (10) is used to insulate the sensing electrode 20, the electrode wiring 23, and the heating wire 51 of the heater unit 50 from each other. 10) can be arranged to cross the upper and lower surfaces.
- the electrode wiring 23 of the sensing electrode 20 formed on one side of the base substrate 10 is shown as a solid line, and the electrode wiring of the sensing electrode 20 formed on the other side of the base substrate 10 ( 23) is expressed as a dotted line.
- FIG. 5 is a partially enlarged view of area A of FIG. 4 and a cross-section of AA'.
- a hot wire 51 is formed on one side of the base material 10, and a second electrode wire 23b is disposed on the other side of the base material 10 to electrically insulate the hot wire 51. did.
- the second electrode wiring 23b is connected to the sensing electrode 20 on the upper surface of the base material 10 through the via hole 11 filled with the electrode paste 12 penetrating on one side and the other side of the base material 10. Electrical connections can be made.
- the heating wire 51 is electrically connected through the via hole 11 filled with the electrode face 12 on the other side of the base substrate 10, thereby insulating the sensing electrode 20 and the electrode wiring 23 on the upper side. can be maintained.
- the sensing electrode 20 and the heater unit 50 can be formed together on one base substrate 10, thereby ensuring mutual electrical connection reliability and the pressure sensing module.
- the freedom of device application can be increased through thinning.
- FIG. 7 is a diagram showing the resistor 41 formed on the resistor substrate 40.
- the resistor 41 may be formed of a conductor having a shape corresponding to the sensing electrode 20, and various shapes and forms may be applied as long as it is in contact with the sensing electrode 20.
- Figure 8 is an exploded perspective view of the pressure sensor module according to the first embodiment of the present invention.
- the heater unit 50 including the sensing electrode 20 and the heating wire 51 can be formed together on the base substrate 10.
- the adhesive layer 31 can effectively contact the resistor 41 of the resistance substrate 40 and the sensing electrode 20 through the through hole 31a by external pressure.
- the adhesive layer 31 can be made of an insulating adhesive material, and of course, various known adhesive materials can be applied.
- Figure 9 is a modified example of the resistor of the resistance substrate of the pressure sensor module according to the first embodiment of the present invention
- Figure 10 is a plan view of the contact between the sensing electrode and the resistor of the pressure sensor module according to the first embodiment of the present invention
- Figure 11 is an enlarged view of the sensing electrode of the pressure sensor module according to the first embodiment of the present invention
- Figure 12 is an enlarged view of the resistor of the pressure sensor module according to the first embodiment of the present invention
- Figure 13 is an enlarged view of the sensing electrode of the pressure sensor module according to the first embodiment of the present invention.
- Figure 14 is an enlarged view of a modified example of the resistor of the pressure sensor module according to the first embodiment of the present invention
- Figures 15 (14) and Figure 16 (15) is a schematic diagram of the operation of the pressure sensor module according to the first embodiment of the present invention.
- the resistor 41 is formed of a conductor so as to be in contact with the sensing electrode 20, and may include a plurality of resistance patterns 41a.
- the resistance pattern 41a is formed by forming a plurality of resistance patterns by external pressure when the first sensing electrode 21 and the second sensing electrode 22 are symmetrical and spaced apart from each other. (41a) can contact the space between the first sensing electrode 21 and the second sensing electrode 22 to energize the first sensing electrode 21 and the second sensing electrode 22.
- a plurality of resistance patterns 41a are formed, and the resistance varies depending on the number of resistance patterns 41a that conduct electricity to the first sensing electrode 21 and the second sensing electrode 22.
- the amount of change can be quantitatively measured and sensed.
- the number and arrangement of the plurality of resistance patterns 41a of the resistor 41 depend on the form of insulation, that is, the form of the space between the first and second sensing electrodes 21 and 22 in contact. It can be formed in response to . By doing so, the change in resistance according to the number of contacts of the resistance pattern 41a can be effectively sensed and converted into a pressure value.
- the resistor may be formed of a conductor corresponding to the external shape of the sensing electrode.
- the resistance of the sensing electrode changes according to a change in the area of the resistor in contact with the sensing electrode, allowing pressure to be sensed.
- Figures 15 and 16 show a schematic diagram of an operation in which the sensing electrode 20 and the resistor 41 are in contact when the base material 10 is flexibly deformed by external pressure in response to the pressure.
- the sensing electrode 20 and the resistor 41 come into contact and a change in resistance occurs through electrical conduction.
- the pressure value can be sensed and measured through this change in resistance.
- Figure 17 is an exploded perspective view of the pressure sensor module according to the second embodiment of the present invention.
- the pressure sensor module includes a base substrate 10, at least one sensing electrode 20 formed on the base substrate 10, and a pressure sensor module installed on the base substrate so that the sensing electrode 20 is exposed.
- the formed insulating layer 32, a resistor substrate 40 formed on the insulating layer 32 and at least one resistor 41 facing the sensing electrode 20, and on the insulating layer 32 It includes at least one heater unit 50 including a heating wire 51 formed therein.
- the heater unit 50 including the heating wire 51 is formed in a separate insulating layer 32.
- the insulating layer 32 is laminated on the base material 10, and the heater unit 50 including the heating wire 51 is formed on the insulating layer 32 to form the sensing electrode 20 of the base material 10. Insulation with the electrode wiring 23 can be maintained.
- the insulating layer 32 is preferably formed of a flexible material in the form of a film, so that it can appropriately respond to deformation of the pressure sensor module due to external pressure.
- Known films of insulating materials can be applied, and of course, appropriate application of materials capable of electrical insulation and physical properties is also possible.
- the base substrate 10, the sensing electrode 20, the resistance substrate 40, and the heater unit 50 are substantially the same as the pressure sensor module of the first embodiment of the present invention already described above, so overlapping descriptions will be omitted. Do this.
- Figure 18 is an exploded perspective view of the pressure sensor module according to the third embodiment of the present invention.
- the pressure sensor module includes a base substrate 10, at least one sensing electrode 20 formed on the base substrate 10, and a pressure sensor module installed on the base substrate so that the sensing electrode 20 is exposed.
- the formed adhesive layer 31 is formed on the adhesive layer 31, and is formed on the resistor substrate 40 and the resistor substrate 40 on which at least one resistor 41 facing the sensing electrode 20 is formed.
- at least one heater unit 50 including a heating wire 51 formed to be insulated from the resistor 41.
- a heater unit 50 including a heating wire 51 is formed on a resistance substrate 40.
- a heating wire 51 is formed in a space spaced apart from the resistor 41 of the resistance substrate 40 to maintain an insulated state, and a heating function can be implemented through electrical connection of the heating wire 51.
- the heater unit 50 is formed so that the sensing electrode 20 of the adhesive layer 31 is exposed and is formed in an area other than the through hole 31a formed to contact the resistor 41, thereby contacting the sensing electrode ( 20) or electrical insulation from the electrode wiring 23 can be maintained.
- the base substrate 10, the sensing electrode 20, the adhesive layer 31, and the heater unit 50 are substantially the same as the pressure sensor module of the first embodiment of the present invention already described above, so overlapping descriptions will be omitted. do.
- Figure 19 is a schematic diagram of the operation of the pressure sensor module control method according to an embodiment of the present invention.
- a method of controlling a pressure sensor module includes the steps of sensing external pressure by a pressure sensing unit including a plurality of sensing electrodes on a base material, and calculating a pressure value from the value sensed by the pressure sensing unit. Calculating the position and size of the additional pressure sensor, respectively, selecting the heater area corresponding to the position of the pressure sensor calculated by the pressure value calculation unit and the heater area of the heater unit, and A heating control unit controls the heater unit to apply a heating temperature corresponding to the distribution of the pressure value calculated by the pressure value calculation unit.
- a pressure sensing unit including a plurality of sensing electrodes on the base material.
- a sensing electrode formed on the base material.
- the sensing electrode is formed with two axes that intersect each other on the base material, so that the pressure sensing position and pressure value can be sensed simultaneously by energizing the sensing electrode.
- Step 3 is the step in which the pressure value calculation unit calculates the position of the pressure detection and the magnitude of the pressure using the values sensed by the pressure sensing unit.
- the pressure value calculation unit calculates the position and pressure value of pressure detection by external pressure by the pressure sensing unit, respectively. By calculating the location of the pressure detection and each matching pressure value corresponding to the location, the heating area and heating temperature range of the heater unit to be performed later can be calculated.
- the heater area in which the heater unit will operate is selected through the pressure sensing position calculated by the pressure value calculation unit.
- the heater area can be set to multiple heater areas. In other words, by making each heating area individually electrically connected with a closed curved heating wire, the heating temperature of each heating area can be individually controlled. By setting a plurality of these heater areas, it is possible to match the heater area at the position closest to the position where the pressure value is detected.
- the heating area is set to correspond to the position of the pressure sensor, but by selecting at least two heater areas, it is possible to maintain a more stable warming effect for the user.
- the pressure value calculated by the pressure value calculation unit may be reflected in the set value of the heating temperature of the heating area.
- the deviation or distribution of pressure values at each pressure sensing location can be matched to the heater area and heating temperature of the corresponding heater unit.
- electrode wiring 23a first electrode wiring
- Adhesive layer 31a Through hole
- heater unit 51 heating wire
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Abstract
Description
Claims (15)
- 베이스기재;상기 베이스기재상에 적어도 하나 이상 형성된 센싱전극;상기 센싱전극이 노출되도록 상기 베이스 기재에 형성된 접착층;상기 접착층상에 형성되고, 상기 센싱전극에 마주보는 적어도 하나 이상의 저항체가 형성된 저항기판; 및싱기 베이스기재상에 형성되되, 상기 센싱전극과 절연되도록 형성된 열선을 포함하는 적어도 하나 이상의 히터부를 포함하는 압력센서모듈.
- 청구항 1에 있어서,상기 센싱전극은 평면상 모든 방향에 대칭을 이루도록 제1 센싱전극과 제2 센싱전극이 상호 절연되도록 결합된 압력센서모듈.
- 청구항 2에 있어서,상기 히터부는상기 베이스기재상에 상기 센싱전극에 인접하여 형성되며, 전기적 연결을 위한 열선을 포함하고,상기 센싱전극은상기 제1 센싱전극에 전기적 연결된 제1 전극배선; 및상기 제2 센싱전극에 전기적 연결된 제2 전극배선을 포함하며,상기 열선은 상기 제1 전극배선 또는 상기 제2 전극배선과 절연되도록 상기 베이스기재상에 형성된 압력센서모듈.
- 청구항 3에 있어서,상기 열선은 상기 베이스기재 일면 또는 타면에서 상기 제1 센싱전극 및 상기 제2 센싱전극과 상기 제1 전극배선 및 상기 제2 전극배선과 절연되도록 형성되는 압력센서모듈
- 청구항 2에 있어서,상기 저항체는 상기 제1 센싱전극과 상기 제2 센싱전극이 상호 통전되도록 상기 제1 센싱전극과 상기 제2 센싱전극을 전기적으로 연결시키도록 접촉하는 각각 분리된 복수개의 저항패턴을 포함하는 압력센서모듈.
- 베이스기재;상기 베이스기재상에 적어도 하나 이상 형성된 센싱전극;상기 센싱전극이 노출되도록 상기 베이스기재에 형성된 절연층;상기 절연층상에 형성되고, 상기 센싱전극에 마주보는 적어도 하나 이상의 저항체가 형성된 저항기판; 및상기 절연층상에 형성되는 열선을 포함하는 적어도 하나 이상의 히터부를 포함하는 압력센서모듈.
- 청구항 6에 있어서,상기 센싱전극은 평면상 모든 방향에 대칭을 이루도록 제1 센싱전극과 제2 센싱전극이 상호 절연되도록 결합된 압력센서모듈.
- 청구항 7에 있어서,상기 열선은 상기 베이스기재 일면 또는 타면에 형성되어, 상기 제1 센싱전극 및 상기 제2 센싱전극, 상기 제1 센싱전극과 전기적 연결되는 제1 전극배선 및 상기 제2 센싱전극과 전기적 연결되는 제2 전극배선과 절연되도록 형성되는 압력센서모듈.
- 청구항 7에 있어서,상기 저항체는 상기 제1 센싱전극과 상기 제2 센싱전극이 상호 통전되도록 상기 제1 센싱전극과 상기 제2 센싱전극을 전기적으로 연결시키도록 접촉하는 각각 분리된 복수개의 저항패턴을 포함하는 압력센서모듈.
- 베이스기재;상기 베이스기재상에 적어도 하나 이상 형성된 센싱전극;상기 센싱전극이 노출되도록 상기 베이스 기재에 형성된 접착층;상기 절연층상에 형성되고, 상기 센싱전극에 마주보는 적어도 하나 이상의 저항체가 형성된 저항기판; 및싱기 저항기판상에 형성되되, 상기 저항체와 절연되도록 형성된 열선을 포함하는 적어도 하나 이상의 히터부를 포함하는 압력센서모듈.
- 청구항 10에 있어서,상기 센싱전극은 평면상 모든 방향에 대칭을 이루도록 제1 센싱전극과 제2 센싱전극이 상호 절연되도록 결합된 압력센서모듈.
- 청구항 11에 있어서,상기 열선은 상기 베이스기재 일면 또는 타면에 형성되어, 상기 제1 센싱전극 및 상기 제2 센싱전극, 상기 제1 센싱전극과 전기적 연결되는 제1 전극배선 및 상기 제2 센싱전극과 전기적 연결되는 제2 전극배선과 절연되도록 형성되는 압력센서모듈.
- 청구항 11에 있어서,상기 저항체는 상기 제1 센싱전극과 상기 제2 센싱전극이 상호 통전되도록 상기 제1 센싱전극과 상기 제2 센싱전극을 전기적으로 연결시키도록 접촉하는 각각 분리된 복수개의 저항패턴을 포함하는 압력센서모듈.
- 베이스기재상에 복수개의 센싱전극이 포함된 압력센싱부에 의해 외부 압력을 센싱하는 단계;상기 압력센싱부에 의한 센싱값으로 압력값산출부가 압력감지의 위치 및 압력의 크기를 각각 산출하는 단계 및상기 압력값산출부에 의해 산출된 압력감지의 위치와 히터부의 히터영역 중 대응되는 위치의 히터영역을 선택하고, 상기 선택된 히터영역상에 상기 압력값산출부에 의해 산출된 압력값의 분포와 대응되는 히팅온도를 인가하도록 히팅제어부가 상기 히터부를 제어하는 단계;를 포함하는 압력센서모듈의 제어방법.
- 청구항 14에 있어서,상기 히팅제어부가 상기 히터부를 제어하는 단계는,상기 압력값산출부에서 산출된 상기 압력감지 위치와 가장 가까운 위치의 최소 2개의 히터영역을 설정하고,상기 압력값산출부에서 산출된 압력값의 상대적 차이에 대응되도록 상기 2개의 히터영역상의 히팅온도가 분포될 수 있도록 설정하는 단계를 포함하는 압력센서모듈의 제어방법.
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| US18/847,783 US20250198862A1 (en) | 2022-04-20 | 2023-04-18 | Pressure sensor module and control method thereof |
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| KR1020220048774A KR102689548B1 (ko) | 2022-04-20 | 2022-04-20 | 압력센서모듈 및 그 제어방법 |
| KR10-2022-0048774 | 2022-04-20 |
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| US (1) | US20250198862A1 (ko) |
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| WO (1) | WO2023204580A1 (ko) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0345806A2 (en) * | 1988-06-10 | 1989-12-13 | Mazda Motor Corporation | Automobile seat assembly |
| JP3707363B2 (ja) * | 2000-06-28 | 2005-10-19 | 株式会社デンソー | 車両用シートセンサ |
| JP4638474B2 (ja) * | 2007-10-30 | 2011-02-23 | ニッタ株式会社 | センサシート |
| KR20110125970A (ko) * | 2010-05-14 | 2011-11-22 | 삼성전기주식회사 | 단층 정전용량식 터치스크린 및 그 제조방법 |
| JP6539204B2 (ja) * | 2014-12-24 | 2019-07-03 | 日本メクトロン株式会社 | 感圧素子および圧力センサ |
| KR20210133013A (ko) * | 2020-04-28 | 2021-11-05 | 한국전자기술연구원 | 압력센서모듈 및 그 제어방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301277B1 (ko) | 2012-07-30 | 2013-08-27 | 주식회사 마블덱스 | 박막형 압력센서와 근접센서를 구비한 입력 장치. |
| KR102253082B1 (ko) * | 2019-11-08 | 2021-05-17 | 주식회사 테라온 | 전원 제어 패턴이 구현된 히터 및 그 장치와 그 제조 방법 |
-
2022
- 2022-04-20 KR KR1020220048774A patent/KR102689548B1/ko active Active
-
2023
- 2023-04-18 WO PCT/KR2023/005248 patent/WO2023204580A1/ko not_active Ceased
- 2023-04-18 US US18/847,783 patent/US20250198862A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0345806A2 (en) * | 1988-06-10 | 1989-12-13 | Mazda Motor Corporation | Automobile seat assembly |
| JP3707363B2 (ja) * | 2000-06-28 | 2005-10-19 | 株式会社デンソー | 車両用シートセンサ |
| JP4638474B2 (ja) * | 2007-10-30 | 2011-02-23 | ニッタ株式会社 | センサシート |
| KR20110125970A (ko) * | 2010-05-14 | 2011-11-22 | 삼성전기주식회사 | 단층 정전용량식 터치스크린 및 그 제조방법 |
| JP6539204B2 (ja) * | 2014-12-24 | 2019-07-03 | 日本メクトロン株式会社 | 感圧素子および圧力センサ |
| KR20210133013A (ko) * | 2020-04-28 | 2021-11-05 | 한국전자기술연구원 | 압력센서모듈 및 그 제어방법 |
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| US20250198862A1 (en) | 2025-06-19 |
| KR20230149497A (ko) | 2023-10-27 |
| KR102689548B1 (ko) | 2024-07-30 |
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