WO2023170895A1 - 配線板 - Google Patents

配線板 Download PDF

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Publication number
WO2023170895A1
WO2023170895A1 PCT/JP2022/010751 JP2022010751W WO2023170895A1 WO 2023170895 A1 WO2023170895 A1 WO 2023170895A1 JP 2022010751 W JP2022010751 W JP 2022010751W WO 2023170895 A1 WO2023170895 A1 WO 2023170895A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
signal
point
section
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/010751
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
幸司 宮川
哲 大和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2022/010751 priority Critical patent/WO2023170895A1/ja
Priority to JP2022554448A priority patent/JP7274056B1/ja
Priority to CN202280093230.XA priority patent/CN118830334A/zh
Priority to DE112022006365.3T priority patent/DE112022006365T5/de
Priority to KR1020247029213A priority patent/KR102730729B1/ko
Publication of WO2023170895A1 publication Critical patent/WO2023170895A1/ja
Priority to US18/790,135 priority patent/US20240397611A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00—Delay lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00—Delay lines of the waveguide type
    • H01P9/02—Helical lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Definitions

  • the present disclosure relates to a wiring board.
  • printed wiring boards that perform parallel transmission using multiple signal wirings such as bus wiring used in DDR-SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory), have signals transmitted by each of the multiple signal wirings on the output side.
  • DDR-SDRAM Double Data Rate Synchronous Dynamic Random Access Memory
  • these plurality of signal wires have the same length.
  • printed wiring boards have been known in which meander wiring is formed in which a plurality of signal wirings have the same length by intentionally folding back and meandering some of the signal wirings among the plurality of signal wirings as described above. (See Patent Document 1).
  • FIG. 1 is a schematic diagram showing meander wiring formed on a general wiring board.
  • a signal is input from a wiring end 1A, passes through a meandering wiring, and is output from a wiring end 2A.
  • Such meander wiring has a structure in which the signal transmission direction is opposite between adjacent wirings, so noise is likely to occur due to mutual interference between the same signals between adjacent wirings, and the signal on the wiring board Quality may deteriorate.
  • the present disclosure has been made in order to solve the above-mentioned problems, and aims to provide a wiring board that can suppress the generation of noise during signal propagation more than the conventional wiring board.
  • a wiring board includes a substrate and a wiring that connects a first point and a second point with one path and propagates a signal from the first point to the second point, and the wiring includes a signal
  • the first wiring part is disposed between a first point and a second point on a path along which a signal is propagated, and has a first wiring part and a second wiring part for propagating a signal
  • the first wiring part is a first wiring part along a first point along a surface of the substrate.
  • the second wiring part is arranged so as to be adjacent to the first wiring part in a direction intersecting the direction in which the signal propagates, when viewed from a direction perpendicular to the surface of the substrate, It is characterized by propagating the signal in the direction of.
  • the generation of noise during signal propagation can be suppressed more than in the past.
  • FIG. 2 is a schematic diagram showing general meander wiring.
  • 1 is a schematic diagram showing a wiring board according to Embodiment 1.
  • FIG. 3 is a schematic diagram showing second wiring according to Embodiment 1.
  • FIG. 3 is a schematic diagram showing an example of a direction in which a signal propagates in the second wiring according to the first embodiment.
  • FIG. 3 is a schematic diagram showing second wiring according to Embodiment 2.
  • FIG. 7 is a schematic diagram showing second wiring according to Embodiment 3.
  • FIG. 2 is a schematic diagram showing wiring board 10 according to the first embodiment, viewed from a direction perpendicular to a surface of wiring board 10 (surface 11a of substrate 11, which will be described later).
  • the wiring board 10 includes a substrate 11, and first wiring 41 and second wiring 51 that are formed on the substrate 11 and transmit signals.
  • the wiring board 10 is a multilayer board having a plurality of inner layers (not shown) formed inside the board 11 along a surface 11a of the board, and a first printed wiring of a conductor is formed by printing technology.
  • This is a printed wiring board on which wiring 41 and second wiring 51 are formed.
  • the first wiring 41 and the second wiring 51 are bus wiring including a plurality of signal wirings, such as DDR. Note that although the first wiring 41 and the second wiring 51 are formed in the inner layer of the substrate 11, they are both shown using solid lines in FIG. 2 for ease of viewing. Further, the layer in which the first wiring 41 and the second wiring are formed is sandwiched between a ground layer (not shown) that is grounded when the wiring board 10 is used.
  • the wiring board 10 is provided with a transmitting section 21 that transmits a signal, and a receiving section 31 that receives the signal transmitted by the transmitting section 21.
  • the wiring board 10, the transmitting section 21, and the receiving section 31 constitute the printed circuit board 10A.
  • the transmitter 21 and the receiver 31 are, for example, integrated circuits or processing devices such as an IC (Integrated Circuit), a CPU (Central Processing Unit), or an FPGA (Field-Programmable Gate Array). .
  • the signal transmitted by the transmitting section 21 is propagated to the receiving section 31 by parallel transmission via the first wiring 41 and the second wiring 51. Therefore, in order to align the timing at which the transmission from the transmitting section 21 reaches the receiving section 31 between the first wiring 41 and the second wiring 51, in the signal propagation path from the transmitting section 21 to the receiving section 31, 41 and the second wiring 51 are required to have the same length.
  • the second wiring 51 according to the first embodiment is a delay wiring formed to match the wiring length with the first wiring 41 by intentionally extending the wiring length.
  • the second wiring 51 has no branching or merging between the first point 1 and the second point 2, and is connected by a single path formed on the same surface, from the end on the transmitter 21 side.
  • the input signal is propagated to the first point 1, the signal passing through the first point 1 is propagated to the second point 2, and the signal passing through the second point 2 is propagated to the receiving section 31.
  • the signal is configured to be output toward the receiving section 31 from the end on the 31 side.
  • the wiring forming the route between the first point 1 and the second point 2 is formed in the same layer, and the wiring forming the route between the end on the transmitter 21 side and the first point is , at least a portion thereof is formed in a different layer from the wiring forming the route between the first point 1 and the second point 2.
  • a signal from a layer different from the wiring forming the path between the first point 1 and the second point 2 is input to the first point 1 via a signal via or the like.
  • the wiring board 10 only needs to propagate the signal transmitted by the transmitting section 21 to the receiving section 31 via the first wiring 41 and the second wiring 51, and may have a configuration other than the integrated circuit or processing device described above. It may be. Further, the wiring board 10 may be equipped with components other than the transmitting section 21 and the receiving section 31, or may have wiring other than that for propagating the signal from the transmitting section 21 to the receiving section 31, Wiring other than the first wiring 41 and the second wiring 51 that propagate signals between the transmitter 21 and the receiver 31 may be provided.
  • FIG. 3 is a schematic diagram showing a part of the second wiring 51 according to the first embodiment, viewed from a direction perpendicular to the surface 11a of the substrate 11.
  • the transmitter 21 side is also referred to as upstream
  • the receiver 31 side is also referred to as downstream.
  • the second wiring 51 includes a first wiring section 101, a second wiring section 102, a It has three wiring parts 103, a fourth wiring part 104, a fifth wiring part 105, a sixth wiring part 106, a seventh wiring part 107, and an eighth wiring part 108.
  • the first direction A1 constitutes the first direction and the second direction in the first embodiment.
  • the second wiring 51 is such that the downstream end of the fourth wiring section 104 and the upstream end of the fifth wiring section 105 are connected by a wiring formed along a crossing direction A2 that intersects the first direction A1.
  • the downstream end of the fifth wiring section 105 and the upstream end of the third wiring section 103 are connected by a wiring formed along the intersecting direction A2, and the downstream end of the third wiring section 103 and the upstream end of the sixth wiring section 106 are connected by a wiring formed along the intersecting direction A2.
  • the downstream end of the second wiring section 102 and the upstream end of the seventh wiring section 107 are connected by the wiring formed along the intersecting direction A2, and the downstream end of the seventh wiring section 107 and the upstream end of the first wiring section 101 are connected.
  • the upstream end is connected by a wiring formed along the intersecting direction A2, and the downstream end of the first wiring section 101 and the upstream end of the eighth wiring section 108 are connected by a wiring formed along the intersecting direction A2. It is connected.
  • the second wiring 51 gradually moves from the point P to the second point P. They are formed to be spaced apart. In other words, in the second wiring 51, the path from the first point 1 to the second point 2 is formed in a spiral shape with the predetermined point P as the center.
  • the portion connecting the downstream end of the second wiring portion 102 and the upstream end of the seventh wiring portion 107 is the portion formed along the intersecting direction A2, which is located on the surface 11a of the substrate.
  • the portion connecting the downstream end of the third wiring portion 103 and the upstream end of the sixth wiring portion 106 is the surface 11a of the substrate, of the portion formed along the intersecting direction A2.
  • the part connecting the downstream end of the sixth wiring part 106 and the upstream end of the second wiring part 102 is the part formed along the intersecting direction A2, which is connected to the surface 11a of the substrate.
  • a portion connecting the downstream end of the seventh wiring section 107 and the upstream end of the first wiring section 101, and a downstream end of the fifth wiring section 105 and an upstream end of the third wiring section 103 when viewed from a direction perpendicular to . It is arranged so as to be adjacent to the part connecting the two in the first direction A1 (distance m5 distance m6).
  • the second wiring 51 when viewed from a direction perpendicular to the surface 11a of the substrate, a portion connecting the downstream end of the fourth wiring portion 104 and an upstream end of the fifth wiring portion 105, and a portion connecting the downstream end of the fourth wiring portion 104 and the upstream end of the fifth wiring portion 105,
  • the distance m4 between the downstream end and the portion connecting the upstream end of the third wiring section 103 is larger than m3 and m5.
  • the second wiring 51 allows the signal input from the first point 1 to be transmitted to the fourth wiring part 104, the fifth wiring part 105, the third wiring part 103, the sixth wiring part 106, and the second wiring part 106.
  • the signal is propagated to the wiring section 102, the seventh wiring section 107, the first wiring section 101, and the eighth wiring section 108 in this order.
  • the time at which the signal input from the first point 1 reaches the second point 2 is delayed compared to the case where the first point 1 and the second point 2 are connected in a straight line. It is formed to do so.
  • FIG. 4 is a schematic diagram showing an example of a direction in which a signal propagates in the second wiring 51 according to the first embodiment.
  • the second wiring section 102 is arranged adjacent to the first wiring section 101 in a crossing direction A2, which is a direction that intersects a first direction A1, which is a direction in which a signal propagates. , the signal is propagated in the same direction as the direction in which the first wiring section 101 propagates the signal. Further, the second wiring 51 is arranged between the first wiring part 101 and the second wiring part 102 in the layer in which the first wiring part 101 and the second wiring part 102 are formed. It does not have wiring for transmitting signals in the opposite direction to the direction in which they propagate.
  • the second wiring 51 since signals propagate in the same direction in the first wiring part 101 and the second wiring part 102, there is a self-transmission between the first wiring part 101 and the second wiring part 102.
  • the signal quality can be improved more than in the past, so that it becomes easier to design signal timing in, for example, bus wiring where high-speed signal propagation is performed.
  • first wiring 41 and the second wiring 51 according to the first embodiment are formed in the same inner layer of the substrate 11, and the inner layer on which the first wiring 41 and the second wiring 51 are formed is the same as that of the wiring board 10. sandwiched by a ground layer that is grounded during use, but is not limited to this.
  • the first wiring and the second wiring may be partially formed on the surface layer exposed on the front or back surface of the substrate 11, or may be formed entirely on the surface layer. Forming in the inner layer has a higher effect of suppressing noise during signal propagation. Further, the noise suppression effect is higher when the second wiring 51 is entirely sandwiched between the ground patterns formed on the ground layer, but it is not necessary that a part or all of the second wiring 51 is sandwiched between the ground patterns.
  • the substrate has a first inner layer and a second inner layer that are different from each other in the thickness direction, that is, in the direction perpendicular to the surface 11a of the substrate, a part of the second wiring is formed in the first inner layer. A portion thereof may be formed in the second inner layer, or may be formed over three or more inner layers. Further, the first wiring part and the second wiring part may be formed in different inner layers, for example, the first wiring part is formed in the first inner layer, and the second wiring part is formed in the second inner layer. Good too. By forming adjacent wirings in different inner layers in this way, it is possible to further suppress the generation of noise during signal propagation.
  • a signal is propagated from a first point 1 close to point P, which is the center of the spirally formed wiring, toward a second point 2 far from point P.
  • the second wiring may be one in which the signal propagates from the second point to the first point toward the center formed in a spiral shape, or the direction in which the signal propagates is from the transmitter 21 to the receiver 31.
  • the direction of propagation and the direction of propagation from the receiving section 31 to the transmitting section 21 may be alternately switched.
  • the second wiring 51 according to the first embodiment is arranged in a direction perpendicular to the surface 11a of the substrate, like the first wiring part 101, the second wiring part 102, the third wiring part 103, and the fourth wiring part 104.
  • a plurality of portions are formed so as to be adjacent to each other in a direction intersecting the direction in which signals propagate, and propagate signals in the same direction, but the present invention is not limited thereto.
  • the second wirings are arranged so as to be adjacent to each other in a direction intersecting the signal propagation direction when viewed from a direction perpendicular to the surface 11a of the substrate, and there is only one portion where signals are propagated in the same direction.
  • it may be formed such that it has a plurality of combinations of parts that propagate signals in the same direction, and the directions in which the signals propagate in each combination are different.
  • the signal in the first wiring part The direction in which the signal propagates (first direction) and the direction in which the signal propagates in the third wiring section (second direction) may be different, and the direction in which the signal propagates in the first wiring section and the direction in which the signal propagates in the third wiring section may be different.
  • the direction in which the signal propagates in the wiring portion may be opposite to the direction in which the signal propagates in the first wiring portion and the direction in which the signal propagates in the third wiring portion may intersect. It's okay.
  • the directions of signal propagation in the fourth wiring section 104 and the fifth wiring section 105 are opposite to each other.
  • the second wiring 51 according to the first embodiment like the fourth wiring part 104 and the fifth wiring part 105, are connected to each other in a direction intersecting the signal propagation direction when viewed from a direction perpendicular to the surface 11a of the substrate.
  • the portions are formed so that there is only one portion that is located closest to each other and in which signals propagate in opposite directions to each other, the portion is not limited to this.
  • the second wirings are arranged closest to each other in a direction intersecting the direction of signal propagation when viewed from a direction perpendicular to the surface 11a of the substrate, and so that there is no part where signals propagate in opposite directions.
  • the second wirings are formed along the same direction, are placed closest to each other, and the signals propagate in opposite directions. It is formed in such a way that there is no part where it is exposed.
  • the second wirings are arranged closest to each other in a direction intersecting the direction in which signals propagate when viewed from a direction perpendicular to the surface 11a of the substrate, and have a plurality of portions in which signals propagate in opposite directions. may be formed.
  • FIG. 5 is a schematic diagram showing a part of the second wiring 51b according to the second embodiment, viewed from a direction perpendicular to the surface 11a of the substrate 11.
  • the second wiring 51b according to the second embodiment has a different signal transmission route from the second wiring 51 according to the first embodiment, but has other configurations and features similar to the second wiring 51 according to the first embodiment. 51, and the description of the same contents as in Embodiment 1 will be omitted.
  • the second wirings 51b according to the second embodiment are arranged closest to each other in a direction intersecting the signal propagation direction when viewed from a direction perpendicular to the surface 11a of the substrate, and the signals propagate in opposite directions. It is formed into multiple parts. A signal input from the first point 1b propagates through the second wiring 51b, and is output from the second point 2b.
  • the paths between the first point and the second point are on the same plane (in the same layer). formed, but is not limited to this.
  • the second wiring is a route between the first point and the second point, in other words, the part where the wiring is deliberately extended to match the wiring length with other wiring is formed over multiple layers. It's okay.
  • FIG. 6 is a schematic diagram showing a part of the second wiring 51c according to the third embodiment, viewed from a direction perpendicular to the surface 11a of the substrate 11.
  • the second wiring 51c according to the third embodiment has a different signal transmission route from the second wiring 51 according to the first embodiment, but has other configurations and features similar to the second wiring 51 according to the first embodiment. 51, and the description of the same contents as in Embodiment 1 will be omitted.
  • the second wiring 51c includes a first wiring part 101c, a second wiring part 102c, a third wiring part 103c, and a fourth wiring part 104c on the path between the first point 1c and the second point 2c. , a fifth wiring section 105c, a sixth wiring section 106c, and a seventh wiring section 107c.
  • the second wiring 51c has a downstream end of the first wiring part 101c connected to an upstream end of the fifth wiring part 105c, and a downstream end of the fifth wiring part 105c and an upstream end of the second wiring part 102c connected to each other.
  • the downstream end of the second wiring part 102c and the upstream end of the sixth wiring part 106c are connected, the downstream end of the sixth wiring part 106c and the upstream end of the third wiring part 103c are connected, and the third wiring part
  • the downstream end of the seventh wiring section 107c is connected to the upstream end of the seventh wiring section 107c, and the downstream end of the seventh wiring section 107c is connected to the upstream end of the fourth wiring section 104c.
  • the second wiring 51c transmits the signal input from the first point 1c to the first wiring portion 101c, the fifth wiring portion 105c, the second wiring portion 102c, the sixth wiring portion 106c, and the third wiring portion 106c.
  • the signal is transmitted to the wiring section 103c, the seventh wiring section 107c, and the fourth wiring section 104c in this order along the arrow shown in FIG. 6, and is output from the second point 2c.
  • the first wiring section 101c, the second wiring section 102c, the third wiring section 103c, and the fourth wiring section 104c are formed in the same first layer (not shown).
  • the sixth wiring section 106c and the seventh wiring section 107c are formed in a second layer at different positions in the direction intersecting the surface of the substrate from the first layer.
  • the first wiring section 101c, the second wiring section 102c, the third wiring section 103c, and the fourth wiring section 104c propagate signals in a third direction A3 (first direction) that is the same direction as each other
  • the wiring section 105c, the sixth wiring section 106c, and the seventh wiring section 107c propagate signals in the same direction and in a different direction from the first wiring section 101c.
  • the fifth wiring section 105c, the sixth wiring section 106c, and the seventh wiring section 107c transmit the signal along the fourth direction A4, which is the same direction as each other and intersects the direction in which the first wiring section 101c propagates the signal. propagate.
  • the second wiring portion 102c is a portion of the wiring formed along the third direction A3 when viewed from a direction perpendicular to the surface of the substrate.
  • the first wiring part 101c and the third wiring part 103c are arranged so as to be adjacent to each other at a position closest to the first wiring part 101c and the third wiring part 103c in a direction intersecting the third direction A3.
  • the second wiring 51c is located between the first wiring part 101c and the second wiring part 102c and between the second wiring part 102c and the third wiring part 103c in the first layer.
  • 101c does not have wiring for transmitting a signal in a direction opposite to the direction in which the signal is propagated.
  • the fourth wiring portion 104c is located in the direction perpendicular to the surface of the substrate among the portion formed along the third direction A3.
  • the third wiring portion 103c is arranged adjacent to the third wiring portion 103c at a position closest to the third wiring portion 103c in a direction intersecting the third direction A3.
  • the second wiring 51c transmits a signal between the third wiring part 103c and the fourth wiring part 104c in the first layer in a direction opposite to the direction in which the third wiring part 101c propagates the signal. It does not have any wiring.
  • the second wiring 51c includes the first wiring part 101c, the second wiring part 102c, the third wiring part 103c, and the fourth wiring part 101c, which are arranged adjacent to each other in the same layer. Since the wiring portions 104c propagate signals in the same direction, the signals are transmitted between the first wiring portion 101c and the second wiring portion 102c, between the second wiring portion 102c and the third wiring portion 103c, and between the third wiring portion 103c. It is possible to suppress the influence of noise caused by mutual interference of the same signals by self-coupling between the fourth wiring section 104c and the fourth wiring section 104c.
  • the second wiring 51c propagates signals in opposite directions when viewed from a direction perpendicular to the surface of the substrate on a path between the first point 1c and the second point 2c. Since the portion does not span multiple layers of the substrate, it is possible to suppress the influence of noise caused by mutual interference of the same signals due to self-coupling.
  • the wiring is not limited to being formed in a straight line; the wiring may be formed in a curved line, or may be formed in a combination of a straight line and a curved line. It may be formed in a curved spiral shape.
  • the second wiring is formed in a curved spiral, the portion where signals propagate in opposite directions becomes smaller in the central portion, which is highly effective in suppressing the generation of noise when signals propagate.
  • the wiring board according to the present disclosure can be used to improve signal quality when propagating signals.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
PCT/JP2022/010751 2022-03-11 2022-03-11 配線板 Ceased WO2023170895A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2022/010751 WO2023170895A1 (ja) 2022-03-11 2022-03-11 配線板
JP2022554448A JP7274056B1 (ja) 2022-03-11 2022-03-11 配線板
CN202280093230.XA CN118830334A (zh) 2022-03-11 2022-03-11 布线板
DE112022006365.3T DE112022006365T5 (de) 2022-03-11 2022-03-11 Leiterplatte
KR1020247029213A KR102730729B1 (ko) 2022-03-11 2022-03-11 배선판
US18/790,135 US20240397611A1 (en) 2022-03-11 2024-07-31 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/010751 WO2023170895A1 (ja) 2022-03-11 2022-03-11 配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/790,135 Continuation US20240397611A1 (en) 2022-03-11 2024-07-31 Wiring board

Publications (1)

Publication Number Publication Date
WO2023170895A1 true WO2023170895A1 (ja) 2023-09-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/010751 Ceased WO2023170895A1 (ja) 2022-03-11 2022-03-11 配線板

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US (1) US20240397611A1 (https=)
JP (1) JP7274056B1 (https=)
KR (1) KR102730729B1 (https=)
CN (1) CN118830334A (https=)
DE (1) DE112022006365T5 (https=)
WO (1) WO2023170895A1 (https=)

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US6828876B1 (en) * 2001-11-02 2004-12-07 Thin Film Technology Corp. Tapered delay line
US20100060379A1 (en) * 2008-09-05 2010-03-11 Asustek Computer Inc. Delay line for printed circuit broad
JP2020202382A (ja) * 2013-02-19 2020-12-17 株式会社村田製作所 インダクタブリッジおよび電子機器

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