WO2023152984A1 - 対基板作業機、および電気回路基板を生産する方法 - Google Patents

対基板作業機、および電気回路基板を生産する方法 Download PDF

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Publication number
WO2023152984A1
WO2023152984A1 PCT/JP2022/005740 JP2022005740W WO2023152984A1 WO 2023152984 A1 WO2023152984 A1 WO 2023152984A1 JP 2022005740 W JP2022005740 W JP 2022005740W WO 2023152984 A1 WO2023152984 A1 WO 2023152984A1
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WO
WIPO (PCT)
Prior art keywords
carrier
circuit board
component
tray
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/005740
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English (en)
French (fr)
Japanese (ja)
Inventor
崇二 向原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to JP2023580053A priority Critical patent/JPWO2023152984A1/ja
Priority to PCT/JP2022/005740 priority patent/WO2023152984A1/ja
Publication of WO2023152984A1 publication Critical patent/WO2023152984A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a board-to-board work machine that uses a mounting device to mount components on a circuit board transported by a transport device.
  • the following patent document describes a technique for mounting components on a circuit board conveyed by a conveying device using a mounting device.
  • An object of the present invention is to improve the practicality of the technique of mounting components by means of a mounting device on a circuit board transported by a transporting device.
  • the present specification provides a transport device for transporting a carrier on which a circuit board to be produced and components to be mounted on the circuit board are placed to a predetermined position, and and a mounting device that holds components placed on the carrier from the carrier transported to the carrier and mounts the held components on the circuit board placed on the carrier.
  • the present specification provides a substrate-oriented working machine having a carrier on which a circuit board to be produced and components to be mounted on the circuit board are placed. and a step after the carrying-in step, wherein the component placed on the carrier from the carrier transported to the predetermined position is held by a mounting device included in the work machine for board, a mounting step of mounting the components held by the mounting device on the circuit board mounted on the carrier;
  • a method for producing an electric circuit board by performing a carrying-out step of carrying out the substrate from the predetermined position by the carrying device is disclosed.
  • the carrier on which the circuit board to be produced and the components to be mounted on the circuit board are placed is transported to a predetermined position by the transport device. Then, from the carrier transported to the predetermined position, the component placed on the carrier is held by the mounting device, and the held component is mounted on the circuit board placed on the carrier.
  • FIG. 1 is a perspective view showing a component mounting device of a component mounting machine;
  • FIG. It is a block diagram which shows a control apparatus.
  • FIG. 3 is a perspective view showing a carrier;
  • FIG. 4 is a perspective view showing a carrier on which a circuit board and components are placed;
  • FIG. 4 is a perspective view showing a carrier on which a glass substrate and a glass component are placed;
  • the component mounter 10 is a device for mounting components on the circuit board 12 .
  • the component mounting machine 10 includes an apparatus main body 20, a substrate conveying/holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a bulk component supplying device 30, a component supplying device 32, and a control device (see FIG. 3) 36.
  • the circuit board 12 includes a circuit board, a three-dimensional structure base material, and the like, and the circuit board includes a printed wiring board, a printed circuit board, and the like.
  • the device main body 20 is composed of a frame 40 and a beam 42 suspended on the frame 40 .
  • the substrate conveying/holding device 22 is arranged in the center of the frame 40 in the front-rear direction, and has a conveying device 50 and a clamping device 52 .
  • the transport device 50 is a device that transports the circuit board 12
  • the clamp device 52 is a device that holds the circuit board 12 .
  • the substrate conveying/holding device 22 conveys the circuit substrate 12 and also holds the circuit substrate 12 fixedly at a predetermined position.
  • the direction in which the circuit board 12 is conveyed is called the X direction
  • the horizontal direction perpendicular to that direction is called the Y direction
  • the vertical direction is called the Z direction. That is, the width direction of the mounter 10 is the X direction, and the front-rear direction is the Y direction.
  • the component mounting device 24 is arranged on the beam 42 and has two working heads 60 , 62 and a working head moving device 64 .
  • Each working head 60, 62 has a suction nozzle (see FIG. 2) 66, and the suction nozzle 66 holds a component.
  • the working head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72, as shown in FIG. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70 .
  • the working heads 60, 62 are detachably attached to sliders 74, 76, and the Z-direction moving device 72 moves the sliders 74, 76 individually in the vertical direction. That is, the working heads 60 and 62 are individually moved vertically by the Z-direction moving device 72 .
  • the mark camera 26 is attached to the slider 74 while facing downward, and is moved together with the working head 60 in the X, Y and Z directions. Thereby, the mark camera 26 images an arbitrary position on the frame 40 .
  • the parts camera 28 is arranged facing upward between the substrate conveying/holding device 22 and the parts supplying device 32 on the frame 40. As shown in FIG. Thereby, the parts camera 28 images the parts held by the suction nozzles 66 of the working heads 60 and 62 .
  • the bulk part supply device 30 is arranged at one end of the frame 40 in the front-rear direction.
  • the discrete component supply device 30 is a device that aligns a plurality of scattered components and supplies the components in an aligned state. In other words, it is a device that aligns a plurality of parts in arbitrary postures in a predetermined posture and supplies the components in the predetermined posture.
  • the component supply device 32 is arranged at the other end of the frame 40 in the front-rear direction.
  • the component supply device 32 has a feeder type component supply device 86 and a tray type component supply device 88 .
  • the feeder-type component supply device 86 is a device that supplies components using a tape feeder 90 .
  • the tape feeder 90 for example, separates the lead component from the taped component and supplies the separated lead component.
  • the rails of the tape feeder 90 are fitted into feeder slots 94 formed on the upper surface of a feeder holding base 92 fixedly provided at the other end of the frame 40, whereby the tape feeder is 90 is positioned and attached to a slot 94 of a feeder holding table 92 so that the operator can attach and detach it with one touch without using a tool.
  • the tray-type component supply device 88 is a device that supplies components placed on a tray (not shown).
  • the tray-type component supply device 88 has a tray holding table 96, and a plurality of tray slots 98 are formed on the upper surface of the tray holding table 96. As shown in FIG. A tray is positioned and attached to an arbitrary slot 98 of the plurality of slots. A tray for supplying small parts is positioned and mounted in one slot, but a tray for supplying large parts is positioned and mounted in two or more slots.
  • the control device 36 includes a controller 100, a plurality of drive circuits 102, and an image processing device 104, as shown in FIG.
  • a plurality of drive circuits 102 are connected to the conveying device 50, the clamping device 52, the working heads 60 and 62, the working head moving device 64, the feeder-type component supply device 86, the tray-type component supply device 88, and the bulk component supply device 30.
  • the controller 100 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 102 . Accordingly, the controller 100 controls the operations of the substrate conveying/holding device 22, the component mounting device 24, and the like.
  • the controller 100 is also connected to the image processing device 104 .
  • the image processing device 104 processes image data obtained by the mark camera 26 and the parts camera 28, and the controller 100 obtains various information from the image data.
  • the component mounter 10 performs component mounting work on the circuit board 12 held by the board conveying/holding device 22 with the above-described configuration. Specifically, the circuit board 12 is carried into a predetermined work position by the carrier device 50 and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit board 12 and images the circuit board 12 . Thereby, information about the error of the holding position of the circuit board 12 is obtained. Also, the bulk component supply device 30 or the component supply device 32 supplies components at a predetermined supply position. Specifically, for example, in the tray-type component supply device 88 of the component supply device 32, as described above, the components are placed on the tray mounted in the slot 98 of the tray holding table 96, and the components are placed on the tray. supply.
  • one of the working heads 60 and 62 moves above the component supply position and holds the component with the suction nozzle 66 .
  • the work heads 60 and 62 holding the parts move above the parts camera 28, and the parts held by the suction nozzle 66 are imaged by the parts camera 28.
  • FIG. This provides information about the error in the holding position of the part.
  • the working heads 60 and 62 holding the components are moved above the circuit board 12 to correct errors in the holding position of the circuit board 12, errors in the holding position of the components, etc. , mounted on circuit board 12 .
  • components supplied from a supply device such as the tray-type component supply device 88 are mounted on the circuit board 12 .
  • a supply device such as the tray-type component supply device 88
  • large-sized components are supplied by the tray-type component supply device 88, and the large-sized components are placed on large-sized trays, and the large-sized trays are placed in the plurality of slots 98 of the tray holder 96.
  • Many types of components may not be supplied by the tray-type component supply device 88 because they are loaded.
  • ten slots 98 are formed in the tray holding base 96, and three trays for large components that occupy the three slots 98 are mounted on the tray holding base 96.
  • the tray-type component supply device 88 there is only one empty slot, so many types of components cannot be supplied by the tray-type component supply device 88 . Therefore, if the mounting process for all types of components to be mounted cannot be completed by the component mounter 10 alone, it is necessary to perform the mounting process for the components that cannot be supplied by the component mounter 10 using another component mounter. There is In addition, since the placement area of the tray is limited, when the parts placed on the tray run out, it becomes necessary to supply the missing parts to the tray.
  • the carrier 110 is generally a rectangular plate-shaped member, and is carried into the component mounter 10 by the carrier device 50 in a posture extending in the longitudinal direction. Therefore, the direction in which the carrier 110 is conveyed and the longitudinal direction is described as the X direction, and the direction orthogonal to the longitudinal direction of the carrier 110 is described as the Y direction.
  • a recess 112 with an inner dimension slightly larger than the outer dimension of the circuit board 12 is formed in the center of the carrier 110 in the X direction. Therefore, as shown in FIG. 5, it is possible to fit the circuit board 12 in the concave portion 112 in a positioned state. In this manner, the circuit board 12 is placed in the recess 112 of the carrier 110 while being positioned. The depth dimension of the concave portion 112 is shallower than the thickness dimension of the circuit board 12 . Therefore, the top surface of the circuit board 12 placed in the recess 112 is higher than the top surface of the carrier 110 .
  • four recesses 114 are also formed in the carrier 110 so as to sandwich the recesses 112 in the X direction of the carrier 110 .
  • the four recesses 114 have the same shape, and two recesses 114a and 114b out of the four recesses 114 are formed side by side in the Y direction at one end of the carrier 110 in the X direction.
  • Two recesses 114c and 114d of the recesses 114 are formed side by side in the Y direction at the other end of the carrier 110 in the X direction.
  • the inner dimensions of each of the four recesses 114 are slightly larger than the outer dimensions of the tray 120 for small parts. Therefore, as shown in FIG.
  • the tray 120 can be fitted into each of the four recesses 114 while being positioned. In this manner, the tray 120 is placed in each of the four recesses 114 of the carrier 110 while being positioned. Note that the depth dimension of the recess 114 is shallower than the height dimension of the tray 120 . Therefore, the upper end of tray 120 placed in recess 114 is higher than the upper surface of carrier 110 .
  • a plurality of components 122 are placed in alignment on the tray 120 .
  • eight parts 122a are placed in two rows in the X direction on the tray 120a placed in the recess 114a, and four parts 122a are arranged in each row. . That is, eight parts 122a are placed on the tray 120a in a state of being aligned in 2 ⁇ 4 rows.
  • Six parts 122b are placed in two rows in the X direction on the tray 120b placed in the recess 114b, and three parts 122b are arranged in each row. That is, six parts 122b are placed on the tray 120b in a state of being aligned in 2 ⁇ 3 rows.
  • the tray 120d has four components 122d arranged in 2 ⁇ 2 rows.
  • Four parts 122a are placed in a row in the X direction on the tray 120c placed in the recess 114c, and three parts 122b are placed next to the four parts 122a. They are arranged in one row in the X direction. That is, the trays 120a, 120b, and 120d have a plurality of parts of one type aligned, and the tray 120c has a plurality of parts of two types aligned. It is,
  • the carrier 110 with the circuit board 12 placed in the recess 112 and the tray 120 having a plurality of components 122 placed thereon in each of the four recesses 114 is transferred to the component mounter by the carrier device 50 . 10 is brought in.
  • the four trays 120 placed in the four recesses 114 are loaded with the planned number of components to be mounted on the circuit board 12 . That is, eight parts 122a placed on the tray 120a, six parts 122b placed on the tray 120b, four parts 122a and three parts 122b placed on the tray 120c, All of the four components 122 d placed on the tray 120 d are components to be mounted on the circuit board 12 .
  • the placement of the circuit board 12 in the recess 112 and the placement of the tray 120 in the recess 114 may be performed manually by an operator or automatically by a device such as an articulated robot. Also, the placement of a plurality of parts on the tray may be performed manually by an operator, or may be performed automatically by a device such as an articulated robot.
  • the carrier 110 is carried into a predetermined working position by the carrier device 50, the carrier 110 is fixedly held by the clamp device 52 at that position.
  • the mark camera 26 moves above the circuit board 12 placed in the recess 114 of the carrier 110 and takes an image of the circuit board 12 .
  • the part 122 is placed on the tray 120 placed in the recess 114 of the carrier 110 , either of the working heads 60 and 62 is positioned above the tray 120 placed in the recess 114 of the carrier 110 . , and the component 122 is held by the suction nozzle 66 .
  • the working heads 60 and 62 holding the parts 122 move above the parts camera 28 , and the parts camera 28 picks up an image of the part 122 held by the suction nozzle 66 .
  • This provides information about the error in the holding position of the component 122 .
  • the quality of the component 122 held by the suction nozzle 66 is determined based on the imaging data. That is, based on the imaging data, it is confirmed whether or not the part 122 held by the suction nozzle 66 is damaged, deformed, or the like. When it is confirmed that the component 122 held by the suction nozzle 66 is not damaged or deformed, the working heads 60 and 62 holding the component 122 are placed in the recess 114 of the carrier 110.
  • the circuit board 12 It moves above the circuit board 12 and mounts the held component 122 on the circuit board 12 after correcting errors in the placement position of the circuit board 12 and in the component holding position. In this way, the component 122 placed on the carrier 110 via the tray 120 is attached to the circuit board 12 placed on the carrier 110 . On the other hand, when it is confirmed that the component 122 held by the suction nozzle 66 is damaged or deformed, the working heads 60 and 62 holding the component 122 are moved to the position where the component 122 is placed. It moves above the tray 120 and returns the held component 122 to the tray 120 .
  • the circuit board 12 mounted on the carrier 110 includes not only the components 122 mounted on the carrier 110 via the tray 120, but also the bulk component supply device 30, the feeder type component supply device 86, the tray type component Parts supplied from supply device 88 are also mounted.
  • the clamping of the carrier 110 by the clamping device 52 at the working position is released, and the carrier 110 is carried out from the working position by the conveying device 50 .
  • an electric circuit board having components mounted on the circuit board 12 is produced.
  • the electric circuit board is mounted on the circuit board 12 with the components electrically connected to each other. However, not only electrically connected components but also non-electrically connected components may be mounted on the electric circuit board.
  • the carrier 110 on which the circuit board 12 is mounted and the components 122 to be mounted on the circuit board 12 are also mounted is carried into the component mounter 10, whereby the tray-type component supply device 88 Even if many slots 98 are occupied by trays for large parts in , many kinds of parts can be mounted on the circuit board in the mounter 10 . In other words, even if many large component trays are set on the tray holding table 96, many types of small components can be placed on the tray 120 of the carrier 110. supply becomes possible. Further, since the four recesses 114 are formed in the carrier 110, the tray 120 can be placed in each of the four recesses 114. Increases the number of places where you can Therefore, the frequency of replenishing components to the mounter 10 can be reduced.
  • the tape feeder 90 that supplies a different type of component from the component to be supplied is mounted on the feeder holding table 92. be able to.
  • the component mounter 10 can supply the bulk component supply device 30, the component supply device 32, and other supply devices. can also be removed. In other words, it becomes possible to manufacture an electric circuit board using a component mounter that does not have a component supply device.
  • the movement distance of the working heads 60 and 62 holding the component 122 is shortened, and the tact time is shortened. can be shortened. That is, conventionally, in the component supply device 32 or the like arranged at a location away from the working position, the working head holds the component and moves above the circuit board 12 held at the working position. On the other hand, by using the carrier 110, the work head holds the components mounted on the carrier 110 and moves to above the circuit board 12 mounted on the carrier 110. Therefore, the movement distance of the work head is is shorter than before by using the carrier 110 . This makes it possible to shorten the tact time for mounting components on the circuit board.
  • a plurality of components to be attached to the circuit board 12 are placed on the four trays 120 placed in the four recesses 114 of the carrier 110 .
  • the work head holds the parts 122 placed on the tray 120 one by one, and based on the image data obtained by killing the parts, the parts 122 held by the suction nozzle 66 are damaged, deformed, or the like. check whether there is If the part is determined to be defective, the work head returns the held part to tray 120 . Therefore, when there are no components left in the four trays 120 on which the carrier 110 carried out from the component mounter 10 is, the operator must ensure that all the components placed on the carrier 110 are circuit boards. It can be determined that the material 12 is attached.
  • the operator should not allow the remaining component to become damaged, deformed, or otherwise damaged. It can be judged that it is a part where Then, if the operator can correct the component, for example, if the lead of the lead component is bent and the lead can be corrected manually, the operator corrects it, and the manually corrected component is placed on the circuit board 12 . to be worn. If the operator cannot correct the part, he or she mounts a part of the same type as the part on the circuit board 12 as a substitute part.
  • the carrier 110 is not only used for component mounting work, but can also be used to acquire the component mounting deviation amount during component mounting.
  • a glass substrate 150 having the same dimensions as the circuit board 12 is placed in the recess 112 of the carrier 110 .
  • the placed glass substrate 150 is transparent and has four circular marks 152 formed thereon.
  • a tray 120a is placed in the concave portion 112a of the carrier 110, and four glass components 156 are placed on the tray 120a in a 2 ⁇ 2 array.
  • Each glass part 156 is also transparent and has a circular mark 158 formed thereon.
  • the circular mark 152 formed on the glass substrate 150 and the circular mark 158 formed on the glass component 156 have substantially the same dimensions.
  • the carrier 110 on which the tray 120a on which the glass substrate 150 and the glass component 156 are placed is moved by the transport device 50 before the components are mounted on the circuit board in the component mounter 10. It is carried into the work position of the component mounter 10 . Then, the glass component 156 carried by the carrier 110 is attached to the glass substrate 150 . At that time, the glass component 156 is attached to the glass substrate 150 so that the marks 158 formed on the glass component 156 and the marks 152 formed on the glass substrate 150 overlap each other. Then, when each of the four glass components 156 is attached to the glass substrate 150, each attached glass component 156 is imaged by the mark camera 26. FIG.
  • the controller 100 calculates the mounting deviation amount of the glass component 156 to the glass substrate 150 based on the imaging data obtained by imaging the glass component 156 with the mark camera 26 . Specifically, when the glass component 156 is mounted on the glass substrate 150 without any deviation from the intended mounting position, the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 are completely aligned. overlaps with On the other hand, when the glass component 156 is mounted on the glass substrate 150 in a state deviated from the intended mounting position, the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 are completely different. Shifts without overlapping.
  • the controller 100 detects the deviation between the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 based on the imaging data acquired by the mark camera 26 by imaging the glass component 156 . Calculate the amount and direction of deviation. Then, the controller 100 stores the calculated deviation amount and deviation direction as a component mounting position deviation amount at the time of component mounting unique to the component mounter 10 . Therefore, when the mounter 10 mounts a component on the circuit board 12, the controller 100 corrects the mounting position of the component based on the stored mounting position deviation amount. As a result, the component can be accurately mounted on the planned mounting position of the circuit board 12 .
  • the component mounter 10 is an example of a work machine for board.
  • the circuit board 12 is an example of a circuit board.
  • the substrate conveying/holding device 22 is an example of a conveying device.
  • the component mounting device 24 is an example of a mounting device.
  • Carrier 110 is an example of a carrier.
  • Tray 120 is an example of a tray.
  • Part 122 is an example of a part.
  • one carrier 110 carries one circuit board, but it may have a structure capable of carrying a plurality of circuit boards.
  • the circuit board 12 is positioned in the carrier 110 by fitting the circuit board 12 into the concave portion 112 of the carrier 110.
  • a fixing mechanism such as a clamping mechanism is provided on the carrier, and the circuit board is fixed by the fixing mechanism.
  • a substrate may be positioned on the carrier.
  • the component 122 is placed on the tray 120 , and the tray 120 is placed on the recess 114 of the carrier 110 . That is, the component 122 is indirectly placed in the recess 114 of the carrier 110 via the tray 120 .
  • the component 122 may be placed directly into the recess 114 of the carrier 110 .
  • the component 122 may be placed directly on the upper surface of the carrier 110 without forming the recess 114 or the like on the upper surface of the carrier 110, or the component directly placed on the carrier may be placed in any posture. They can be scattered.
  • the plurality of components directly placed on the carrier may be of the same type or may be of multiple types.
  • a plate-shaped member is used as the carrier 110, but any shape that allows the circuit board 12 and the component 122 to be placed thereon can be used. It is possible to employ members having various shapes, such as.
  • the carrier may be a circuit board. That is, the circuit board and components may be placed on the circuit board.
  • the components placed on the carrier 110 may be components electrically connected to the circuit board 12 or components not electrically connected to the circuit board 12 . That is, the components mounted on the carrier 110 and mounted on the circuit board 12 may be electronic components, electric circuit components, lead components, shield covers, and the like.
  • a plurality of parts are arranged in N ⁇ M rows on the tray 120 placed in the recess 114 of the carrier 110, that is, in a plurality of rows. may be aligned with Also, the plurality of components placed on the tray may be placed on the tray 120 in a scattered state without being aligned. Also, the plurality of components mounted on the tray may be of the same type, or may be of a plurality of types.
  • the operator checks whether or not there are any parts remaining in the four trays 120 placed on the carrier 110.
  • an imaging device such as a mark camera can be used to automatically check.
  • Component mounting machine (board-to-board work machine) 12: Circuit board (circuit board) 22: Base material conveying and holding device (conveying device) 24: Component mounting device (mounting device) 110: Carrier 120: Tray 122: Components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2022/005740 2022-02-14 2022-02-14 対基板作業機、および電気回路基板を生産する方法 Ceased WO2023152984A1 (ja)

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JP2023580053A JPWO2023152984A1 (https=) 2022-02-14 2022-02-14
PCT/JP2022/005740 WO2023152984A1 (ja) 2022-02-14 2022-02-14 対基板作業機、および電気回路基板を生産する方法

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Application Number Priority Date Filing Date Title
PCT/JP2022/005740 WO2023152984A1 (ja) 2022-02-14 2022-02-14 対基板作業機、および電気回路基板を生産する方法

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229225U (https=) * 1985-08-07 1987-02-21
JPH07308826A (ja) * 1995-03-27 1995-11-28 Matsushita Electric Ind Co Ltd 部品装着方法
WO2007138671A1 (ja) * 2006-05-30 2007-12-06 Hirata Corporation ワーク自動作業装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2523760Y2 (ja) * 1990-05-28 1997-01-29 山形カシオ株式会社 部品供給装置
JP2001284892A (ja) * 2000-04-04 2001-10-12 Matsushita Electric Ind Co Ltd 電子部品実装装置における電子部品の排出方法および電子部品供給用容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229225U (https=) * 1985-08-07 1987-02-21
JPH07308826A (ja) * 1995-03-27 1995-11-28 Matsushita Electric Ind Co Ltd 部品装着方法
WO2007138671A1 (ja) * 2006-05-30 2007-12-06 Hirata Corporation ワーク自動作業装置

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