WO2023116096A1 - 一种背光源模组及显示装置 - Google Patents
一种背光源模组及显示装置 Download PDFInfo
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- WO2023116096A1 WO2023116096A1 PCT/CN2022/120743 CN2022120743W WO2023116096A1 WO 2023116096 A1 WO2023116096 A1 WO 2023116096A1 CN 2022120743 W CN2022120743 W CN 2022120743W WO 2023116096 A1 WO2023116096 A1 WO 2023116096A1
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- WIPO (PCT)
- Prior art keywords
- light
- encapsulation layer
- guide plate
- source chip
- emitting surface
- Prior art date
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims description 119
- 238000005538 encapsulation Methods 0.000 claims description 95
- 239000011241 protective layer Substances 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
Definitions
- the present application relates to the technical field of display devices, in particular to a backlight source module and a display device.
- Liquid crystal display devices have the characteristics of light weight, thin thickness, low power consumption, and low radiation, and are widely used.
- the backlight module provides a light source for the liquid crystal panel.
- the light source, light guide plate and heat sink are the main factors affecting cost and performance.
- the light incident surface of the light guide plate of the side-type backlight module is arranged opposite to the light source, and the light source is arranged on the side plate opposite to the light guide plate.
- the main purpose of the present application is to provide a backlight module and a display device, aiming at reducing the cost of the product without reducing the heat dissipation performance of the backlight module.
- This application proposes a backlight module, including:
- the light guide plate has a light incident surface and a first light exit surface
- a backlight assembly includes a substrate, a light source chip, and a packaging structure; the substrate is arranged on the side of the light guide plate away from the first light-emitting surface, and has an extension extending out of the light guide plate;
- the light source chip is arranged on the side of the extension segment facing the light guide plate;
- the packaging structure seals the light source chip;
- the packaging structure has a reflective surface and a second light-emitting surface, at least part of the reflective surface is located on the The side of the light source chip away from the light guide plate, the light emitted by the light source chip can enter the light guide plate from the light incident surface after passing through the second light exit surface.
- the packaging structure further includes: a transparent packaging layer connected to the epitaxial section; the transparent packaging layer seals the light source chip, and the transparent packaging layer It has the second light-emitting surface.
- the second light-emitting surface is a curved surface or a plane.
- the light-transmissive encapsulation layer includes a first light-transmissive encapsulation layer, the first light-transmissive encapsulation layer is configured as a concave lens structure, and the concave lens structure has the second light-emitting surface; and a second light-transmissive encapsulation layer layer, the second light-transmitting encapsulation layer is connected to the first light-transmitting encapsulation layer, and is arranged on the side of the first light-transmission encapsulation layer away from the second light-emitting surface; the second light-transmission encapsulation layer
- the packaging layer seals the light source chip; and the refractive index of the second transparent packaging layer is smaller than the refractive index of the first transparent packaging layer.
- a part of the light-transmitting encapsulation layer is configured as a convex lens structure, and the convex lens structure has the second light-emitting surface.
- the encapsulation structure further includes: a reflective layer disposed on the non-light-emitting surface of the light-transmissive encapsulation layer.
- the encapsulation structure further includes: a protective layer, the protective layer is disposed on a side of the reflective layer away from the transparent encapsulation layer, and the protective layer is connected to the epitaxial segment.
- the second light-emitting surface is a non-smooth surface.
- the backlight module further includes: a reflective sheet disposed on a side of the substrate facing the light guide plate.
- the light source chip is an LED light source chip.
- the present invention also proposes a display device, which includes:
- a backlight module includes: a light guide plate, the light guide plate has a light incident surface and a first light exit surface; and a backlight assembly, the backlight assembly includes a substrate, a light source chip, and a packaging structure;
- the substrate is arranged on the side of the light guide plate away from the first light-emitting surface, and has an extension section protruding from the light guide plate;
- the light source chip is arranged on the side of the extension section facing the light guide plate;
- the packaging structure seals the light source chip;
- the packaging structure has a reflective surface and a second light-emitting surface, at least part of the reflective surface is located on the side of the light source chip away from the light guide plate, and the light emitted by the light source chip can be After passing through the second light-emitting surface, it enters the light guide plate from the light-incident surface, and the first light-emitting surface of the light guide plate is disposed opposite to the display panel.
- the package structure further includes: a light-transmitting encapsulation layer connected to the epitaxial section, the light-transmitting encapsulation layer seals the light source chip, and the light-transmitting encapsulation layer
- the encapsulation layer has the reflective surface and the second light-emitting surface.
- the second light-emitting surface is a curved surface or a plane.
- the light-transmitting encapsulation layer includes:
- a first light-transmissive encapsulation layer is configured as a concave lens structure, and the concave lens structure has the second light-emitting surface;
- a second light-transmitting encapsulation layer is connected to the first light-transmitting encapsulation layer, and is disposed on a side of the first light-transmission encapsulation layer away from the second light-emitting surface;
- the second light-transmitting encapsulation layer seals the light source chip;
- the refractive index of the second transparent encapsulation layer is smaller than the refractive index of the first transparent encapsulation layer.
- a part of the light-transmitting encapsulation layer is configured as a convex lens structure, and the convex lens structure has the second light-emitting surface.
- the encapsulation structure further includes: a reflective layer disposed on the reflective surface of the light-transmitting encapsulation layer.
- the encapsulation structure further includes: a protective layer, the protective layer is disposed on a side of the reflective layer away from the reflective surface, and the protective layer is connected to the epitaxial segment.
- the second light emitting surface is a non-smooth surface.
- the backlight module further includes: a reflective sheet, and the reflective sheet is disposed on a side of the substrate facing the light guide plate.
- the light source chip is an LED light source chip.
- the substrate is arranged on the side of the light guide plate away from the first light-emitting surface, and has an extension section protruding from the light guide plate.
- the light source chip is connected to the extension section, that is, the light source chip is arranged on the extension section of the substrate.
- the encapsulation structure has a second light-emitting surface, and the second light-emitting surface is disposed opposite to the light-incoming surface, and the light generated by the light source chip is emitted through the second light-emitting surface.
- part of the light from some light source chips will be reflected on the reflective surface, and will not enter and be emitted from the non-light-emitting surface, thereby improving the utilization rate of light energy.
- the light from the light source chip enters the light incident surface of the light guide plate after being emitted from the second light exit surface, and then is emitted from the first light exit surface of the light guide plate. Therefore, the light source chip is arranged on the substrate parallel to the light guide plate.
- the substrate itself has a larger occupied space, and thus has a larger heat dissipation area compared with the heat dissipation area of the side plate. The ability is stronger, so it is not necessary to design a radiator for heat dissipation, which solves the technical problem in the prior art that the temperature rise reliability standard needs to be achieved at high cost.
- FIG. 1 is a schematic structural view of the first embodiment of the backlight module proposed by the present application
- FIG. 2 is a schematic structural view of a second embodiment of the backlight module proposed by the present application.
- FIG. 3 is a schematic structural diagram of a third embodiment of the backlight module proposed by the present application.
- FIG. 4 is a schematic structural view of a fourth embodiment of the backlight module proposed by the present application.
- FIG. 5 is a schematic structural diagram of a fifth embodiment of the backlight module proposed by the present application.
- FIG. 6 is a schematic structural diagram of a sixth embodiment of the backlight module proposed by the present application.
- connection and “fixation” should be understood broadly, for example, “fixation” can be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined.
- fixing can be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined.
- the light incident surface of the light guide plate is set opposite to the light source, and the light source is set on the side plate facing the light guide plate. Since the heat dissipation surface of the side plate is narrow, a heat dissipation The heat conduction of the device can make the temperature rise standard of the light source meet the reliability requirements.
- increasing the heat sink will inevitably lead to an increase in product cost; or, reducing the cost by reducing the size of the heat sink will inevitably lead to heat dissipation that cannot meet the demand.
- the embodiment of the present application proposes a backlight module, especially a side-type backlight module.
- the light source chip 200a is arranged on the substrate 200b plane parallel to the large plane of the backplane of the backlight module. Since the width of the substrate 200b can be set larger, compared with the prior art, the heat dissipation effect is improved and can The radiator in the prior art is omitted, thereby solving the technical problem in the prior art that the temperature rise reliability standard needs to be achieved at high cost.
- the backlight module includes a light guide plate 100 and a backlight assembly 200 .
- the light guide plate 100, the light guide plate 100 has a light incident surface 100b and a first light exit surface 100a.
- the side of the light guide plate 100 away from the back plate is the first light-emitting surface 100a, and light is emitted from the first light-emitting surface 100a and enters the display panel.
- the light emitted from the backlight assembly 200 enters the light guide plate 100 from the light incident surface 100 b.
- the light guide plate 100 has a cuboid structure; the light incident surface 100b is the side of the light guide plate 100, the first light exit surface 100a is the top surface of the light guide plate 100, and the light incident surface 100b and the first light exit surface 100a are perpendicular to each other.
- the light guide plate 100 can be of other configurations, for example, the angle between the normal vectors of the light incident surface 100b and the first light exit surface 100a can be an acute angle or an obtuse angle; for example, the light guide plate 100 can be a non-cuboid structure Hexahedral structure, or other shapes of structures, etc.
- a backlight assembly 200 includes a substrate 200b, a light source chip 200a, and a packaging structure 200c;
- the light source chip 200a is arranged on the side of the extension section 200b-1 facing the light guide plate 100;
- the package structure 200c seals the light source chip 200a;
- the package The structure 200c has a reflective surface 200c-1b and a second light-emitting surface 200c-1a. At least part of the reflective surface 200c-1b is located on the side of the light source chip 200a away from the light guide plate 100.
- the light emitted by the light source chip 200a It can enter the light guide plate 100 from the light incident surface 100b after passing through the second light exit surface 200c-1a.
- the package structure 200c has a second light-emitting surface 200c-1a, the second light-emitting surface 200c-1a is arranged opposite to the light-incident surface 100b, and the light generated by the light source chip 200a passes through the The second light emitting surface 200c-1a emits light.
- part of the light from the light source chip 200a will be reflected on the reflective surface 200c-1b, and will not enter and be emitted from the non-light-emitting surface, thereby improving the utilization rate of light energy.
- the light from the light source chip 200 a is emitted from the second light emitting surface 200 c - 1 a and then enters the light incident surface 100 b of the light guide plate 100 , and then is emitted from the first light emitting surface 100 a of the light guide plate 100 . Therefore, there is no need to arrange the light source chip 200a directly on the light incident surface 100b of the light guide plate 100, that is, it is not necessary to arrange the light source chip 200a on the side plate with a narrow heat dissipation area, and furthermore, it is not necessary to install a heat sink to heat the light source chip 200a. Heat dissipation.
- the substrate 200b is disposed on the side of the light guide plate 100 away from the first light emitting surface 100a, and has an extension section 200b-1 protruding from the light guide plate 100.
- the structure of the substrate 200b is a plate structure, at least a part of which protrudes from the light guide plate 100, and the at least a part is an extension section 200b-1.
- the light source chip 200a is connected to the extension section 200b-1, that is, the light source chip 200a is disposed on the extension section 200b-1 of the substrate 200b.
- the substrate 200b itself has a larger occupied space, and thus has a larger heat dissipation area compared with the heat dissipation area of the side plate, and has a stronger heat dissipation capability, so it is not necessary to design a heat sink to The heat dissipation solves the technical problem in the prior art that the temperature rise reliability standard needs to be achieved at high cost.
- the light source chip 200a is generally an LED light source chip 200a.
- the LED light source chip 200a can be a front-chip or a flip-chip structure.
- the substrate 200b is a plate structure made of a material with better heat dissipation performance, such as an aluminum substrate 200b, an aluminum alloy substrate 200b, and the like.
- extension section 200 b - 1 has an extension plane parallel to the first light emitting surface 100 a , and the extension plane is a side of the substrate 200 b facing the light guide plate 100 .
- the light source chip 200a is disposed on the epitaxial plane.
- the backlight module also includes a backplane (not shown).
- the back plate is disposed on the side of the substrate 200b away from the light guide plate 100 for supporting the substrate 200b.
- the light-transmitting encapsulation layer 200c-1 is connected to the epitaxial section 200b-1, the light-transmitting encapsulation layer 200c-1 seals the light source chip 200a, and the light-transmitting encapsulation layer 200c-1 has a reflective surface 200c-1b and The second light emitting surface 200c-1a.
- the light-transmitting encapsulation layer 200c-1 can be an encapsulation glue, which has high light transmittance and increases the luminous flux of the LED.
- the light-transmitting encapsulation layer 200c-1 is connected to the epitaxial segment 200b-1, and has a reflective surface 200c-1b and the second light-emitting surface 200c-1a.
- the light-transmitting encapsulation layer 200c-1 seals the light source chip 200a, and the light generated by the light source chip 200a is transmitted in the light-transmitting encapsulation layer 200c-1, and is reflected when the light hits the reflective surface 200c-1b, and then passes through the second light-emitting surface 200c-1a issued.
- the light-transmitting encapsulation layer 200c-1 contains phosphor powder, high color gamut KSF powder, QD material or glass diffusion particles.
- the second light-emitting surface 200c-1a is a curved surface or a plane.
- its center of curvature is located on one side of the light guide plate 100, which is a concave surface, which is mainly used to narrow the full angle of light.
- the second light-emitting surface 200c-1a when the second light-emitting surface 200c-1a is in a curved state, its center of curvature is located on the side of the light-transmitting encapsulation layer 200c-1, which is a convex surface, mainly to increase the full angle of light.
- the second light-emitting surface 200c-1a can be a plane, which can be used in some other special application scenarios.
- the present application can design the shape of the second light-emitting surface 200c-1a according to different application scenarios, which has a wider application range and stronger applicability.
- the light-transmitting encapsulation layer 200c-1 includes a first light-transmitting encapsulation layer 200c-1c, and the first light-transmitting encapsulation layer 200c-1c Constructed as a concave lens structure, the concave lens structure has the second light-emitting surface 200c-1a; and a second light-transmitting encapsulation layer 200c-1d, the second light-transmitting encapsulation layer 200c-1d is connected with the first light-transmitting encapsulation layer
- the layers 200c-1c are connected and arranged on the side of the first light-transmitting encapsulation layer 200c-1c away from the second light-emitting surface 200c-1a; the second light-transmitting encapsulation layer 200c-1d seals the light source chip 200a; and the refractive index of the second transparent encapsulation layer 200c-1d is smaller than the refr
- the refractive index of the first encapsulation layer configured as a concave lens structure is smaller than that of the first light-transmitting encapsulation layer 200c-1c, which has the effect of narrowing the light output angle of the light source, so that the more light energy emitted by the light source enters the light guide plate 100, The higher the light efficiency utilization of the overall backlight module.
- the refractive index of the first transparent encapsulation layer 200c-1c is 1.53 to 1.6; the refractive index of the second transparent encapsulation layer 200c-1d is 1.0 to 1.5.
- a part of the light-transmitting encapsulation layer 200c-1 is configured as a convex lens structure, and the convex lens structure has the second light-emitting surface 200c-1a.
- Setting the convex lens structure can make the light emitted by the light source chip 200a have a large angle, and the convex lens structure is mainly used in scenes requiring light incident at a large angle.
- large-angle light source LEDs are required to solve the problem of poor visual effects on the specific light incident side (uneven brightness and darkness between LEDs).
- the encapsulation structure 200c further includes: a reflective layer 200c-2, the reflective layer 200c-2 is disposed on the reflective surface 200c-1b of the transparent encapsulation layer 200c-1.
- the side of the packaging structure 200c facing the light-incident surface 100b of the light guide plate 100 is the second light-emitting surface 200c-1a, while the rest of the surface is the reflecting surface 200c-1b.
- the light-transmitting packaging layer 200c-1 There is a reflective layer 200c-2 on the reflective surface 200c-1b, and the reflective layer can reflect light into the light-transmissive encapsulation layer 200c-1 and enter the light incident surface 100b from the second light-emitting surface 200c-1a through refraction.
- the reflective surfaces 200c-1b can be curved surfaces, flat surfaces or a combination of both.
- the light emissivity of the reflective layer 200c-2 is above 95%, so that the light emitted by the optical chip passes through the reflective layer 200c-2 to change its propagation direction, so that the light is emitted from the second light emitting surface 200c-1a.
- the reflective layer 200c-2 may be a reflective film structure, a reflective coating structure, or a surface treatment structure capable of achieving a reflective effect.
- the package structure 200c further includes: a protective layer 200c-3, the protective layer 200c-3 is disposed on the side of the reflective layer 200c-2 away from the transparent encapsulation layer 200c-1, and the protective layer 200c-3 is connected to the epitaxial segment 200b-1.
- the protective layer 200c-3 is an outer protective structure of the packaging structure 200c, and is used to protect the packaging layer and the light source chip 200a.
- the protective layer 200c-3 is opaque.
- the protective layer 200c-3 can also be made of a light-transmitting material, that is, it has light transmission, and the light energy is relatively scattered, but it is helpful to solve the viewing angle of the product.
- the second light-emitting surface 200c-1a is a non-smooth surface to avoid total reflection and improve optical quality.
- some microstructures may be provided on the second light-emitting surface 200c-1a, and the cross-sections of these microstructures may be triangular, rhombus, elliptical, hemispherical, or other regular or irregular shapes.
- the backlight module further includes: a reflective sheet 300, the reflective sheet 300 It is disposed on the side of the substrate 200 b facing the light guide plate 100 .
- the reflective sheet 300 reflects the light into the light guide plate 100 and emits it from the first light emitting surface 100a, so as to improve the light utilization efficiency of the light emitted by the light source chip 200a.
- the present invention also proposes the display device, which is generally a liquid crystal display device. It includes a display panel and a backlight module.
- the backlight module adopts any one of the above-mentioned embodiments, so the display device has the advantages of the above-mentioned embodiments, which will not be repeated here.
- the first light-emitting surface 100a of the light guide plate 100 is disposed opposite to the display panel, and light emitted through the first light-emitting surface 100a enters the display panel.
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Abstract
一种背光源模组及显示装置，包括导光板（100）及背光源组件（200），导光板（100）具有入光面（100b）和第一出光面（100a）；背光源组件（200）包括具有外延段（200b-1）的基板（200b）、光源芯片（200a）及封装结构（200c）；光源芯片（200a）设置在外延段（200b-1）朝向导光板（100）的一面；封装结构（200c）具有反射面（200c-1b）和第二出光面（200c-1a），至少部分反射面（200c-1b）位于光源芯片（200a）远离导光板（100）的一侧，光源芯片（200a）发出的光线经第二出光面（200c-1a）后，从入光面（100b）进入导光板（100）。
Description
本申请要求于2021年12月20日提交中国专利局、申请号为202111567034.5、发明名称为“一种背光源模组及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请涉及显示装置技术领域，特别涉及一种背光源模组及显示装置。
液晶显示装置具备质量轻、厚度薄、低功耗以及辐射小等特点，被广泛应用。背光源模组为液晶面板提供光源。对于侧入式背光源模组，光源、导光板和散热器是影响成本和性能的主要因素。相关现有技术中，侧入式背光源模组的导光板的入光面与光源正对设置，光源设置在导光板正对的侧板上。
由于侧板的散热面积窄，需要安装散热器导热，才能使得光源温升标准达到可靠性的需求。然而，增加散热器势必导致产品成本增加；或者，通过减少散热器的尺寸来降低成本，但这势必导致散热达不到需求。
本申请的主要目的是提供一种背光源模组及显示装置，旨在不需要降低背光源模组散热性能的前提下降低产品的成本。
本申请提出一种背光源模组，包括：
导光板，所述导光板具有入光面和第一出光面；以及
背光源组件，所述背光源组件包括基板、光源芯片以及封装结构；所述基板设于所述导光板背离所述第一出光面的一侧，且具有伸出所述导光板的外延段；所述光源芯片设置在所述外延段朝向所述导光板的一面；所述封装结构密封所述光源芯片；所述封装结构具有反射面和第二出光面，至少部分所述反射面位于所述光源芯片远离所述导光板的一侧，所述光源芯片发出的光线可经所述第二出光面后，从所述入光面进入所述导光板。
在一些实施例中，所述封装结构还包括：透光封装层，所述透光封装层与所述外延段连接；所述透光封装层密封所述光源芯片，且所述透光封装层具有所述第二出光面。
在一些实施例中，所述第二出光面为曲面或者平面。
一些实施例中，所述透光封装层包括第一透光封装层，所述第一透光封装层构造为凹透镜结构，所述凹透镜结构具有所述第二出光面；以及第二透光封装层，所述第二透光封装层与所述第一透光封装层连接，且设置于所述第一透光封装层的背离所述第二出光面的一侧；所述第二透光封装层密封所述光源芯片；且所述第二透光封装层的折射率小于所述第一透光封装层的折射率。
一些实施例中，所述透光封装层的一部分构造为凸透镜结构，且所述凸透镜结构具有所述第二出光面。
在一些实施例中，所述封装结构还包括：反射层，所述反射层设于所述透光封装层的非出光面上。
在一些实施例中，所述封装结构还包括：保护层，所述保护层设于所述反射层背离所述透光封装层的一侧，且所述保护层与所述外延段连接。
在一些实施例中，所述第二出光面为非光滑面。
在一些实施例中，所述背光源模组还包括：反射片，所述反射片设置于所述基板面向所述导光板的一侧。
在一些实施例中，所述光源芯片为LED光源芯片。
本发明还提出一种显示装置，所述显示装置包括：
显示面板；以及
背光源模组，所述背光源模组包括：导光板，所述导光板具有入光面和第一出光面；以及背光源组件，所述背光源组件包括基板、光源芯片以及封装结构；所述基板设于所述导光板背离所述第一出光面的一侧，且具有伸出所述导光板的外延段；所述光源芯片设置在所述外延段朝向所述导光板的一面；所述封装结构密封所述光源芯片；所述封装结构具有反射面和第二出光面，至少部分所述反射面位于所述光源芯片远离所述导光板的一侧，所述光源芯片发出的光线可经所述第二出光面后，从所述入光面进入所述导光板，所述导光板的第一出光面与所述显示面板正对设置。根据上述所述的显示装置，所述封装结构还包括：透光封装层，所述透光封装层与所述外延段连接，所述透光封装层密封所述光源芯片，且所述透光封装层具有所述反射面以及所述第二出光面。
根据上述所述的显示装置，所述第二出光面为曲面或者平面。
根据上述所述的显示装置，所述透光封装层包括：
第一透光封装层，所述第一透光封装层构造为凹透镜结构，所述凹透镜结构具有所述第二出光面；以及
第二透光封装层，所述第二透光封装层与所述第一透光封装层连接，且设置于所述第一透光封装层的背离所述第二出光面的一侧；所述第二透光封装层密封所述光源芯片；
且所述第二透光封装层的折射率小于所述第一透光封装层的折射率。
根据上述所述的显示装置，所述透光封装层的一部分构造为凸透镜结构，且所述凸透镜结构具有所述第二出光面。
根据上述所述的显示装置，所述封装结构还包括：反射层，所述反射层设于所述透光封装层的反射面上。
根据上述所述的显示装置，所述封装结构还包括：保护层，所述保护层设于所述反射层背离所述反射面的一侧，且所述保护层与所述外延段连接。
根据上述所述的显示装置，所述第二出光面为非光滑面。
根据上述所述的显示装置，所述背光源模组还包括：反射片，所述反射片设置于所述基板面向所述导光板的一侧。
根据上述所述的显示装置，所述光源芯片为LED光源芯片。
本申请的技术方案中，基板设于所述导光板背离所述第一出光面的一侧，且具有伸出所述导光板的外延段。所述光源芯片与所述外延段连接，即光源芯片设置在基板的外延段上。所述封装结构具有第二出光面，所述第二出光面与所述入光面正对设置，所述光源芯片产生的光线经由所述第二出光面发出。且部分光源芯片的部分光线会在反射面上反射，而不会进入从非出光面发出，提高光能利用率。光源芯片的光线从第二出光面发出后进入导光板入光面，随后从导光板的第一出光面发出。因而，将光源芯片设置于平行于导光板的基板上，基板相比较于侧板而言本身具有较大的占据空间，因而相比较于侧板的散热面积而言具有更大的散热面积，散热能力更强，因而可以无需设计散热器来进行散热，解决了现有技术中需要在高成本下才能达到温升可靠性标准的技术问题。
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请提出的背光源模组的第一实施例的结构示意图；
图2为本申请提出的背光源模组的第二实施例的结构示意图；
图3为本申请提出的背光源模组的第三实施例的结构示意图；
图4为本申请提出的背光源模组的第四实施例的结构示意图；
图5为本申请提出的背光源模组的第五实施例的结构示意图；
图6为本申请提出的背光源模组的第六实施例的结构示意图。
附图标记说明
100、导光板；100a、第一出光面；100b、入光面；200、背光源组件；200a、光源芯片；200c-1、透光封装层；200c-2、反射层；200c-3、保护层；200c-1a、第二出光面；200c-1b、反射面；200c-1c、第一透光封装层；200c-1d、第二透光封装层；200b、基板；200b-1、外延段；200c、封装结构；300、反射片。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义，包括三个并列的方案，以“A和/或B”为例，包括A方案、或B方案、或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
相关现有技术中，侧入式背光源模组中，导光板的入光面与光源正对设置，光源设置在导光板正对的侧板上，由于侧板的散热面窄，需要安装散热器导热，才能使得光源温升标准达到可靠性的需求。然而，增加散热器势必导致产品成本增加；或者，通过减少散热器的尺寸来降低赠本，但这势必导致散热达不到需求。
为此，本申请实施例提出一种背光源模组，尤其是一种侧入式的背光模组。将光源芯片200a设置在与背光源模组的背板的大平面平行的基板200b平面上，由于基板200b的宽度可以设置的更大，相比较于现有技术中而言，散热效果提高，可以省去现有技术中的散热器，由此解决现有技术中需要在高成本下才能达到温升可靠性标准的技术问题。
具体而言，参照图1、图2或图3中的任意一个，本申请提出一种背光源模组。该背光源模组包括导光板100以及背光源组件200。
导光板100，所述导光板100具有入光面100b和第一出光面100a。导光板100背离背板的一侧为第一出光面100a，光线从第一出光面100a发出，进入显示面板。背光源组件200发出的从入光面100b进入导光板100中。一般情况下，导光板100为长方体构造；入光面100b为导光板100的侧面，第一出光面100a为导光板100的顶面，且入光面100b与第一出光面100a相互垂直。在一些特殊情况下，导光板100可以为其他构造，比如，入光面100b和第一出光面100a的法向量之间的夹角可以为锐角或者钝角；比如导光板100可以为非长方体构造的六面体构造，或者其他形状的构造等。
背光源组件200，所述背光源组件200包括基板200b、光源芯片200a以及封装结构200c；所述基板200b设于所述导光板100背离所述第一出光面100a的一侧，且具有伸出所述导光板100的外延段200b-1；所述光源芯片200a设置在所述外延段200b-1朝向所述导光板100的一面；所述封装结构200c密封所述光源芯片200a；所述封装结构200c具有反射面200c-1b和第二出光面200c-1a，至少部分所述反射面200c-1b位于所述光源芯片200a远离所述导光板100的一侧，所述光源芯片200a发出的光线可经所述第二出光面200c-1a后，从所述入光面100b进入所述导光板100。
具体实施过程中，所述封装结构200c具有第二出光面200c-1a，所述第二出光面200c-1a与所述入光面100b正对设置，所述光源芯片200a产生的光线经由所述第二出光面200c-1a发出。且部分光源芯片200a的部分光线会在反射面200c-1b上反射，而不会进入从非出光面发出，提高光能利用率。光源芯片200a的光线从第二出光面200c-1a发出后进入导光板100入光面100b，随后从导光板100的第一出光面100a发出。因而无需将光源芯片200a正对地设置于导光板100的入光面100b,也即无需将光源芯片200a设置在散热面积较窄的侧板上，进而无需通过设置散热器来对光源芯片200a进行散热。
与现有技术相比，本申请实施例中，基板200b设于所述导光板100背离所述第一出光面100a的一侧，且具有伸出所述导光板100的外延段200b-1。一般而言，基板200b为结构为平板结构，其至少一部分伸出所述导光板100，该至少一部分为外延段200b-1。所述光源芯片200a与所述外延段200b-1连接，即光源芯片200a设置在基板200b的外延段200b-1上。由于基板200b相比较于侧板而言，本身具有与较大的占据空间，因而相比较于侧板的散热面积而言具有更大的散热面积，散热能力更强，因而可以无需设计散热器来进行散热，解决了现有技术中需要在高成本下才能达到温升可靠性标准的技术问题。
需要说明的是，光源芯片200a一般为LED光源芯片200a。LED光源芯片200a可以为正装芯片或者倒装芯片结构。
需要说明的是，基板200b为具有较好散热性能的材料制成的平板结构，比如可以为铝制基板200b、铝合金基板200b等。
需要说明的是，外延段200b-1具有平行于第一出光面100a的外延平面，且外延平面为基板200b面向导光板100的一面。光源芯片200a设置于外延平面上。
进一步地，需要说明的是，背光源模组还包括背板（未示出）。背板设置于基板200b背离所述导光板100的一侧，用于支撑所述基板200b。
作为上述实施例的可选实施方式，参照图1、图2、图3、图4、图5或图6中任意一个，所述封装结构200c还包括：透光封装层200c-1，所述透光封装层200c-1与所述外延段200b-1连接，所述透光封装层200c-1密封所述光源芯片200a，且所述透光封装层200c-1具有反射面200c-1b和所述第二出光面200c-1a。透光封装层200c-1可以为封装胶，具有高透光率，增加LED的光通量。透光封装层200c-1与外延段200b-1连接，且具有反射面200c-1b和所述第二出光面200c-1a。透光封装层200c-1密封所述光源芯片200a，光源芯片200a产生的光线在透光封装层200c-1内传输，当光线射向反射面200c-1b时被反射，然后由第二出光面200c-1a发出。一般情况下，透光封装层200c-1内带有荧光粉、高色域KSF粉、QD材料或者玻璃扩散粒子。
作为上述实施例的可选实施方式，参照图1、图2、图3任意一个，所述第二出光面200c-1a为曲面或者平面。在一些应用场景下，在第二出光面200c-1a为曲面状态时，其曲率中心位于导光板100一侧，即为凹面,主要用于收窄光线全角度。在另外一些应用场景下，在第二出光面200c-1a为曲面状态时，其曲率中心位于透光封装层200c-1一侧，即为凸面，主要为了增加光线全角度。此外，第二出光面200c-1a可以为平面，应用于其他一些特殊应用场景。相比较于现有技术而言，本申请可以根据不同的应用场景设计第二出光面200c-1a的形状，其应用范围更广，适用性更强。
作为上述实施例的可选实施方式，参照图4或图5所示，所述透光封装层200c-1包括第一透光封装层200c-1c，所述第一透光封装层200c-1c构造为凹透镜结构，所述凹透镜结构具有所述第二出光面200c-1a；以及第二透光封装层200c-1d，所述第二透光封装层200c-1d与所述第一透光封装层200c-1c连接，且设置于所述第一透光封装层200c-1c的背离所述第二出光面200c-1a的一侧；所述第二透光封装层200c-1d密封所述光源芯片200a；且所述第二透光封装层200c-1d的折射率小于所述第一透光封装层200c-1c的折射率。构造为凹透镜结构的第一封装层的折射率小于所述第一透光封装层200c-1c的折射率，具有收窄光源出光角度的作用，使得光源发光的光能量进入导光板100越多，整体背光源模组光效利用越高。一般情况下，第一透光封装层200c-1c的折射率为1.53至1.6；第二透光封装层200c-1d的折射率为1.0至1.5。
在另外一些可选实施方式中，参照图6所示，所述透光封装层200c-1的一部分构造为凸透镜结构，且所述凸透镜结构具有所述第二出光面200c-1a。设置凸透镜结构能够使得光源芯片200a发出的光线具有大角度，凸透镜结构主要应用于需要大角度入光的场景。为了某些特定的产品需求，需要大角度光源LED解决特定的入光侧视效不良问题(LED间明暗不均等）。
作为上述实施例的可选实施方式，参照图1、图2、图3、图4、图5或图6中任意一个。所述封装结构200c还包括：反射层200c-2，所述反射层200c-2设于所述透光封装层200c-1的反射面200c-1b上。封装结构200c正对导光板100入光面100b的一侧为第二出光面200c-1a，而其余面均为反射面200c-1b，为了能够提升光利用效率，透光封装层200c-1的反射面200c-1b上具有反射层200c-2，发射层能够将光线反射至透光封装层200c-1内经过折射由第二出光面200c-1a射入入光面100b。一般情况下，反射面200c-1b可以为曲面、平面或者两者的组合。反射层200c-2的光发射率在95%以上，使得光线芯片发出的光通过反射层200c-2改变其传播方向，让光线从第二出光面200c-1a射出。反射层200c-2可以为反射膜片结构、反射涂层结构或者能够达到反射效果的表面处理结构。
作为上述实施例的可选实施方式，参照图1、图2、图3、图4、图5或图6中任意一个，所述封装结构200c还包括：保护层200c-3，所述保护层200c-3设于所述反射层200c-2背离所述透光封装层200c-1的一侧，且所述保护层200c-3与所述外延段200b-1连接。保护层200c-3为封装结构200c的外层保护结构，用于保护封装层和光源芯片200a。一般情况下，保护层200c-3为不透光的。但是在一些情况下，保护层200c-3也可以为采用透光材料制成，即具有透光性，光能量相对分散，但对产品灯影视角解决有帮助。
作为上述实施例的可选实施方式，所述第二出光面200c-1a为非光滑面，避免产生全反射现象，提升光学品质。比如，第二出光面200c-1a上可以设置一些微型结构（未示出），这些微型结构的剖面可以为三角形、菱形、椭圆性、半球形、其他规则或者不规则形状。
作为上述实施例的可选实施方式，参照图1、图2、图3、图4、图5或图6中任意一个，所述背光源模组还包括：反射片300，所述反射片300设置于所述基板200b面向所述导光板100的一侧。反射片300将光线反射至导光板100内，从第一出光面100a发出，提高光源芯片200a发出光线的光利用率。
本发明还提出一种所述显示装置，该显示装置一般为液晶显示装置。其包括显示面板以及背光源模组。该背光源模组采用了前述实施例中的任意一个，因而该显示装置具有上述实施例中的优势，在此不一一赘述。所述导光板100的第一出光面100a与所述显示面板正对设置，经由第一出光面100a发出的光线进入显示面板内。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的申请构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。
Claims (20)
- 一种背光源模组，其中，包括：导光板，所述导光板具有入光面和第一出光面；以及背光源组件，所述背光源组件包括基板、光源芯片以及封装结构；所述基板设于所述导光板背离所述第一出光面的一侧，且具有伸出所述导光板的外延段；所述光源芯片设置在所述外延段朝向所述导光板的一面；所述封装结构密封所述光源芯片；所述封装结构具有反射面和第二出光面，至少部分所述反射面位于所述光源芯片远离所述导光板的一侧，所述光源芯片发出的光线可经所述第二出光面后，从所述入光面进入所述导光板。
- 如权利要求1所述的背光源模组，其中，所述封装结构还包括：透光封装层，所述透光封装层与所述外延段连接，所述透光封装层密封所述光源芯片，且所述透光封装层具有所述反射面以及所述第二出光面。
- 如权利要求2所述的背光源模组，其中，所述第二出光面为曲面或者平面。
- 如权利要求2所述的背光源模组，其中，所述透光封装层包括：第一透光封装层，所述第一透光封装层构造为凹透镜结构，所述凹透镜结构具有所述第二出光面；以及第二透光封装层，所述第二透光封装层与所述第一透光封装层连接，且设置于所述第一透光封装层的背离所述第二出光面的一侧；所述第二透光封装层密封所述光源芯片；且所述第二透光封装层的折射率小于所述第一透光封装层的折射率。
- 如权利要求2所述的背光源模组，其中，所述透光封装层的一部分构造为凸透镜结构，且所述凸透镜结构具有所述第二出光面。
- 如权利要求2所述的背光源模组，其中，所述封装结构还包括：反射层，所述反射层设于所述透光封装层的反射面上。
- 如权利要求6所述的背光源模组，其中，所述封装结构还包括：保护层，所述保护层设于所述反射层背离所述反射面的一侧，且所述保护层与所述外延段连接。
- 如权利要求1所述的背光源模组，其中，所述第二出光面为非光滑面。
- 如权利要求1所述的背光源模组，其中，所述背光源模组还包括：反射片，所述反射片设置于所述基板面向所述导光板的一侧。
- 如权利要求1所述的背光源模组，其中，所述光源芯片为LED光源芯片。
- 一种显示装置，其中，所述显示装置包括：显示面板；以及背光源模组，所述背光源模组包括：导光板，所述导光板具有入光面和第一出光面；以及背光源组件，所述背光源组件包括基板、光源芯片以及封装结构；所述基板设于所述导光板背离所述第一出光面的一侧，且具有伸出所述导光板的外延段；所述光源芯片设置在所述外延段朝向所述导光板的一面；所述封装结构密封所述光源芯片；所述封装结构具有反射面和第二出光面，至少部分所述反射面位于所述光源芯片远离所述导光板的一侧，所述光源芯片发出的光线可经所述第二出光面后，从所述入光面进入所述导光板，所述导光板的第一出光面与所述显示面板正对设置。
- 如权利要求11所述的显示装置，其中，所述封装结构还包括：透光封装层，所述透光封装层与所述外延段连接，所述透光封装层密封所述光源芯片，且所述透光封装层具有所述反射面以及所述第二出光面。
- 如权利要求12所述的显示装置，其中，所述第二出光面为曲面或者平面。
- 如权利要求12所述的显示装置，其中，所述透光封装层包括：第一透光封装层，所述第一透光封装层构造为凹透镜结构，所述凹透镜结构具有所述第二出光面；以及第二透光封装层，所述第二透光封装层与所述第一透光封装层连接，且设置于所述第一透光封装层的背离所述第二出光面的一侧；所述第二透光封装层密封所述光源芯片；且所述第二透光封装层的折射率小于所述第一透光封装层的折射率。
- 如权利要求12所述的显示装置，其中，所述透光封装层的一部分构造为凸透镜结构，且所述凸透镜结构具有所述第二出光面。
- 如权利要求12所述的显示装置，其中，所述封装结构还包括：反射层，所述反射层设于所述透光封装层的反射面上。
- 如权利要求16所述的显示装置，其中，所述封装结构还包括：保护层，所述保护层设于所述反射层背离所述反射面的一侧，且所述保护层与所述外延段连接。
- 如权利要求11所述的显示装置，其中，所述第二出光面为非光滑面。
- 如权利要求11所述的显示装置，其中，所述背光源模组还包括：反射片，所述反射片设置于所述基板面向所述导光板的一侧。
- 如权利要求11所述的显示装置，其中，所述光源芯片为LED光源芯片。
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