WO2023051207A1 - 电子设备的中框、中框组件及电子设备 - Google Patents

电子设备的中框、中框组件及电子设备 Download PDF

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Publication number
WO2023051207A1
WO2023051207A1 PCT/CN2022/117562 CN2022117562W WO2023051207A1 WO 2023051207 A1 WO2023051207 A1 WO 2023051207A1 CN 2022117562 W CN2022117562 W CN 2022117562W WO 2023051207 A1 WO2023051207 A1 WO 2023051207A1
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WO
WIPO (PCT)
Prior art keywords
middle frame
electronic device
middle plate
frame
plate area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/117562
Other languages
English (en)
French (fr)
Inventor
李琦
杨涛
常万民
霍国亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to EP22871041.4A priority Critical patent/EP4205878A4/en
Priority to US18/030,951 priority patent/US20230384829A1/en
Publication of WO2023051207A1 publication Critical patent/WO2023051207A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application relates to the technical field of electronic products, in particular to a middle frame of an electronic device.
  • the middle frame is the main load-bearing component of electronic equipment such as mobile phones. It is usually formed by die-casting. The quality of its molding determines the overall strength and reliability of the electronic equipment.
  • the middle frame of die-casting electronic equipment is always accompanied by a large number of sand holes, resulting in poor quality and low strength of the middle frame, which in turn leads to the failure of the strength and reliability of the whole machine to meet the ideal requirements.
  • the embodiment of the present application provides a middle frame of an electronic device.
  • the middle frame has less trachoma, good quality and high strength, which solves the problem of low strength and reliability of the whole machine due to poor quality and low strength of the middle frame of electronic equipment.
  • the middle frame includes a middle plate and a first storage bin for accommodating batteries, the outer surface of the middle frame has a nozzle material section, and the middle plate has a structure for constructing the first storage bin.
  • the section of the nozzle material is at least partially located between the surface where the top surface and the bottom surface of the first middle plate area are located.
  • the outlet of the flow channel in the corresponding die-casting mold is at least partially located between the surface of the cavity top wall and the surface of the cavity bottom wall in the first middle plate area, so the outlet of the flow channel in the die-casting mold is at least Part of it is facing the mold cavity in the first middle plate area, and there is no drop in the thickness direction of the mold cavity from the mold cavity in the first middle plate area, so at least part of the pouring liquid does not flow along the thickness direction of the mold cavity after flowing out from the outlet of the runner, but It flows into the mold cavity in the first middle plate area directly along the direction roughly parallel to the top wall and bottom wall of the cavity in the first middle plate area, without overcoming the drop or turning, so the flow rate loss is small and the flow state is stable.
  • the formed middle frame has fewer sand holes, good forming quality, and high strength.
  • the thickness of the first middle plate area is allowed to be thinner, so as to facilitate the lightweight of the product and provide a larger capacity for the battery. of accommodation space.
  • the top side edge of the nozzle material section is coplanar with the top surface of the first middle plate area
  • the bottom side edge of the nozzle material section is coplanar with the first middle plate area. Bottom surfaces of a mid-plate region are coplanar.
  • the middle frame includes a second storage bin, and the middle plate has a second middle plate area that forms the bottom wall of the second storage bin , the second middle plate area is closer to the nozzle cross section than the first middle plate area, and the top surface and/or bottom surface of the second middle plate area has a first machined surface.
  • the thickness of the cavity in the second middle plate area in the corresponding die-casting mold needs to be designed to be greater than the thickness of the second middle plate area of the target middle frame product (that is, the cavity in the second middle plate area is thickened).
  • Improve the passability of pouring liquid in this area so as to further improve the filling quality, so that the formed middle frame has less sand holes, good forming quality and high strength.
  • a first through hole is provided in the second middle plate region, and a hole wall surface of the first through hole has a second machined surface.
  • the first through hole is not formed during the die-casting process, but is machined after the die-casting is completed. Therefore, the second middle plate area in the corresponding die-casting mold does not have a column for forming the through hole in the mold cavity, thereby There is no problem that the column hinders the flow of the pouring liquid, resulting in a large flow resistance of the pouring liquid, so the speed loss of the pouring liquid can be further reduced, thereby reducing the sand holes of the middle frame and improving the quality and strength of the middle frame.
  • the middle frame includes a third storage bin, and the middle plate has a The third middle plate area of the bottom wall of the warehouse is placed, the third middle plate area is provided with a second through hole, and the hole wall surface of the second through hole has a third machined surface.
  • the second through hole is not formed during the die-casting process, but is machined after the die-casting is completed.
  • one of the second storage compartment and the third storage compartment is used to accommodate at least a part of the antenna of the electronic device, and the other is used to accommodate the keys of the electronic device at least part of .
  • the middle frame includes The outer frame of the middle plate and the barrier rib located in the enclosed space of the frame, the side wall of the storage bin is constructed by the frame and/or the barrier rib. With this design, the separation between the storage bins is realized.
  • the middle frame Made of alloy material. With this design, it is easy to die-cast.
  • the embodiment of the present application also provides a middle frame assembly, the middle frame assembly includes the middle frame provided by the above aspects and the embodiments of each aspect, and the plastic part injection-molded on the surface of the middle frame. Since the middle frame provided by the above-mentioned aspects and embodiments of each aspect has the above-mentioned beneficial effects, the middle frame assembly also has the above-mentioned beneficial effects. In addition, the plastic parts can play the role of cushioning and protecting the middle frame.
  • the embodiment of the present application further provides an electronic device, and the electronic device includes the middle frame provided by the foregoing aspects and the implementation manners of the aspects. Since the above-mentioned aspects and the middle frame provided by the embodiments of each aspect have the above-mentioned beneficial effects, the electronic device also has the above-mentioned beneficial effects.
  • Figure 1 and Figure 2 are perspective views of an embodiment of a middle frame of an electronic device provided by the present application under different viewing angles;
  • Figure 3 is a top side view of Figure 1;
  • Fig. 4 is A-A sectional view among Fig. 3;
  • Fig. 5 is B-B sectional view among Fig. 3;
  • Figure 6 schematically shows the machining process of peeling off the nozzle material and the second middle plate area.
  • the parts shown in the figure correspond to the inner parts of the C circle in Figure 4 and Figure 5.
  • the left figure is the die-casting molded middle frame preform, and the right figure The picture shows the middle frame product;
  • Figure 7 illustrates the machining process of the third middle plate area.
  • the parts shown in the figure correspond to the parts inside the D circle in Figure 5.
  • the left picture is the die-cast middle frame preform, and the right picture is the middle frame product;
  • 10 middle plate 10a first middle plate area, 10b second middle plate area, 10c third middle plate area, 101 first machined surface, 102 second machined surface, 103 first through hole, 104 second through hole , 105 the third machined surface;
  • the middle frame of the electronic device provided by the present application includes a middle board 10 and a first storage bin 70 for accommodating the battery of the electronic device, the middle board 10 is a thin-walled structure, and the middle board 10 has a first middle board Area 10 a , the first middle plate area 10 a forms the bottom wall of the first storage bin 70 .
  • the outer surface of the middle frame has a nozzle material section A
  • the outer surface of the middle frame refers to the surface connected between the outer edge of the top surface and the outer edge of the bottom surface of the middle frame.
  • the outer side of a component refers to the surface connected between the outer edge of the top surface and the outer edge of the bottom surface of the component.
  • the middle frame is formed by die-casting with a die-casting mold, and the corresponding die-casting mold is equipped with a middle frame cavity.
  • the cavity of the middle frame is the cavity used to form the middle frame, and the cavity of a certain part mentioned in this article refers to the cavity used to form the component.
  • There is also a flow channel in the die-casting mold the inlet of the flow channel is connected with the pouring port, and the outlet of the flow channel is connected with the mold cavity of the middle frame to play a role of diversion.
  • part of the pouring liquid will be formed in the runner, and the molding in the runner is the nozzle material, also known as the pouring system condensate or return material.
  • the nozzle material 01 and the middle frame after demoulding are connected together, so after demoulding, the nozzle material 01 needs to be peeled off from the middle frame to obtain the middle frame product, and the nozzle material 01 is peeled off Finally, a section will inevitably be formed on the surface of the middle frame, which is the section A of the nozzle material.
  • the color and/or roughness/and/or flatness of the section A of the nozzle material are different from other areas of the surface of the middle frame, which can be seen by the naked eye. Or special detection equipment to observe and identify.
  • the section A of the nozzle material is at least partially located between the surface where the top surface and the bottom surface of the first middle plate region 10 a are located.
  • the surface where the top surface is located refers to the top surface itself and the extended surface of the top surface
  • the surface where the bottom surface is located refers to the bottom surface itself and the extended surface of the bottom surface.
  • the outlet of the flow channel in the corresponding die-casting mold is at least partly located at the top of the cavity of the first middle plate area between the surface where the wall is located and the surface where the bottom wall of the cavity is located, therefore, the outlet of the runner in the die-casting mold is at least partially facing the cavity in the first middle plate area, and the cavity in the first middle plate area is in the thickness direction of the cavity There is no drop, so at least part of the pouring liquid does not flow along the thickness direction of the mold cavity after flowing out from the outlet of the runner, but directly flows into the first middle plate in a direction roughly parallel to the cavity top wall and cavity bottom wall of the cavity in the first middle plate area.
  • the area of the first middle plate region 10a is generally relatively large and the thickness is relatively thin, so the cavity of the first middle plate region in the corresponding die-casting mold also has the characteristics of large area and thin thickness. Therefore, If the pouring liquid enters the mold cavity in the first middle plate area in an unstable flow state, it is easy to hit the top wall and bottom wall of the cavity in the first middle plate area, resulting in further loss of flow velocity and further disturbance of flow state , causing the flow velocity to become very low and the turbulence serious when the pouring liquid reaches the position away from the flow channel, thus affecting the filling quality, resulting in many trachomas, poor quality and low strength in the formed middle frame.
  • the pouring liquid does not flow along the thickness direction of the mold cavity after flowing out from the outlet of the runner, but directly flows into the first cavity in a direction roughly parallel to the cavity top wall and cavity bottom wall of the cavity in the first middle plate area.
  • the mold cavity in the middle plate area does not need to overcome the drop or turn, so the flow rate loss is small and the flow state is stable, so even when it flows to a position far away from the runner, it can maintain a high flow rate and a stable flow state, thereby filling
  • the quality is good, therefore, the formed middle frame has less trachoma, good quality and high strength.
  • the filling quality can be guaranteed.
  • the thickness of the first middle plate region 10a is allowed to be thinner, so as to facilitate the light weight of the product and provide the battery with Larger storage space.
  • the thickness of the first middle plate region 10a (H2 in the figure) is 0.3mm.
  • the top side edge of the nozzle material section A may be located above the surface where the top surface of the first middle plate region 10a is located, or be located below the surface where the top surface of the first middle plate region 10a is located, or be in line with the surface of the first middle plate region 10a.
  • the top faces are coplanar.
  • the bottom side edge of the nozzle material section A may be located above the surface where the bottom surface of the first middle plate area 10a is located, or be located below the surface where the bottom surface of the first middle plate area 10a is located, or be coplanar with the plane where the bottom surface of the first middle plate area 10a is located .
  • a preferred embodiment is: the top side edge of the nozzle material section A is in the same plane as the top surface of the first middle plate area 10a, and the bottom side edge of the nozzle material section A is in the same plane as the bottom surface of the first middle plate area 10a.
  • the surfaces are coplanar, so that the outlet of the flow channel in the die-casting mold faces more parts of the mold cavity in the first middle plate area, thereby reducing the velocity loss of the pouring liquid to a large extent.
  • the distance between the top side edge and the bottom side edge of the nozzle material section A is basically the same as the thickness of the nozzle material 01 (H1 in the figure).
  • the thickness of the nozzle material 01 should not be too thick.
  • about 0.5 mm is appropriate, and correspondingly, the distance between the top side edge and the bottom side edge of the nozzle material section A is also about 0.5 mm.
  • the middle frame further includes a second storage bin 80
  • the second middle plate 10 has a second middle plate area 10b
  • the second middle plate area 10b constitutes the second storage bin 80 Warehouse bottom wall.
  • the second middle plate area 10b is closer to the nozzle section A than the first middle plate area 10a.
  • the surface of the second middle plate region 10 b has a first machined surface 101 .
  • the first machined surface 101 can be located on the top surface or the bottom surface of the second middle plate area 10b, or both the top surface and the bottom surface of the second middle plate area 10b can have the first machined surface 101 .
  • having the first machined surface 101 on the top and/or bottom surface of the second middle plate region 10b means that the thickness of the die cavity in the second middle plate region in the corresponding die-casting mold needs to be designed to be larger than the target middle frame product
  • the top surface and/or bottom surface of the preform is machined to remove excess thickness, so as to form a first machined surface 101 on the top surface and/or bottom surface of the second middle plate region of the middle frame product.
  • H4 is twice as large as H3, H4 is 0.8 mm, and H3 is 0.4 mm.
  • having the first machined surface 101 on the top and/or bottom surface of the second middle plate region 10b means thickening the cavity of the second middle plate region of the corresponding die-casting mold. Since the second middle plate area 10b is closer to the nozzle material section A than the first middle plate area 10a, the mold cavity of the second middle plate area in the corresponding die-casting mold is closer to the outlet of the runner than the first middle plate area mold cavity, and the pouring At this time, the pouring liquid flows through the cavity of the second middle plate area first and then flows through the cavity of the first middle plate area, so whether the pouring liquid flows smoothly in the cavity of the second middle plate area has a great influence on the subsequent cavity (especially the thickness The filling quality of the cavity in the first middle plate area with a large thin area) is greatly affected.
  • Thickening the mold cavity in the second middle plate area effectively improves the flow smoothness of the pouring liquid in the second middle plate area mold cavity and subsequent mold cavities, so it can further improve the filling quality, thereby reducing the sand holes of the middle frame and improving the quality of the middle frame and strength.
  • a first through hole 103 is provided in the second mid-plane region 10 b, which can be used as a weight-reducing hole or a through hole for electrical connectors of electronic devices to pass through.
  • the hole wall surface of the first through hole 103 has a second machined surface 102, which means that the first through hole 103 is not formed in the die-casting process, but is machined on the die-casted second mid-plate region preform Therefore, there is no column with a through hole in the mold cavity of the second middle plate area in the corresponding die-casting mold, so there is no problem that the column hinders the flow of the pouring liquid and causes the flow resistance of the pouring liquid to be large, so the pouring can be further reduced.
  • the speed loss of the liquid can reduce the trachoma of the middle frame and improve the quality and strength of the middle frame.
  • the middle frame further includes a third storage bin 90
  • the middle plate 10 has a third middle plate area 10c
  • the third middle plate area 10c forms the bottom of the third storage bin 90
  • the second through hole 104 is provided in the third middle plate area 10c on the wall, which can be used as a weight-reducing hole or a through hole for the electrical connection of the electronic device to pass through.
  • the hole wall surface of the second through hole 104 has a third machined surface 105, which means that the second through hole 104 is not formed in the die-casting process, but is preformed in the third middle plate area of the die-casting
  • the body is machined out, so there is no column with a through hole in the mold cavity of the third middle plate area in the corresponding die-casting mold, so there is no problem that the column hinders the flow of the pouring liquid and the flow resistance of the pouring liquid is large, so It can further reduce the velocity loss of the pouring liquid, thereby reducing the trachoma of the middle frame and improving the quality and strength of the middle frame.
  • Each of the above-mentioned machined surfaces may be a blanking surface or a cutting surface.
  • punching equipment or cutting equipment may be used to machine the corresponding regions of the die-casted middle frame preform to obtain the above-mentioned machined surfaces.
  • the processing accuracy should be guaranteed to avoid stress concentration at the processing position.
  • the color and/or roughness/and/or flatness of the machined surface are different from other areas on the surface of the middle frame, which can be identified by naked eyes or special inspection equipment.
  • the middle frame also includes a frame 20 surrounding the outside of the middle plate 10, and the frame 20 includes a first frame edge 201 and a second frame edge 202 spaced from each other and a third frame edge 202 spaced apart from each other.
  • frame side 203 and fourth frame side 204 the length of the first frame side 201 and the second frame side 202 is greater than the length of the third frame side 203 and the fourth frame side 204, in other embodiments, the first frame side 201 and The length of the second frame side 202 can also be less than or equal to the length of the third frame side 203 and the fourth frame side 204, and the end to end of these four frame sides are connected successively to form a frame 20 of approximately rectangular shape.
  • the transition is smooth through the curved transition portion 205 .
  • the shape of the frame 20 is not limited to a rectangle, and the number of frame sides is not limited to four, but can be flexibly adjusted according to product needs.
  • the section A of the nozzle material is located on the outer side of the longer first frame side 201, and is as long as the first frame side 201. Reaching the position farthest from the flow channel is more conducive to ensuring the filling quality.
  • the nozzle section A can also be located on the outer side of the shorter frame side or on the outer side of multiple frame sides at the same time.
  • the middle frame includes a first barrier rib 30 , a second barrier rib 40 , a third barrier rib 50 , and a fourth barrier rib 60 , and these four barrier ribs are located on the frame 20 within the enclosed space.
  • the first barrier rib 30 is close to the first frame edge 201 and is roughly parallel to the first frame edge 201.
  • the second storage bin 80 is located between the first barrier rib 30 and the first frame edge 201.
  • the first barrier rib 30 and the first frame edge 201 to construct the side wall of the second storage bin 80 .
  • the second barrier rib 40 is close to the second frame edge 202 and is approximately parallel to the second frame edge 202.
  • the third storage bin 90 is located between the second barrier rib 40 and the second frame edge 202.
  • the second barrier rib 40 and the second frame edge 202 to construct the warehouse side wall of the third storage warehouse 90 .
  • the third barrier rib 50 is connected between one end of the first barrier rib 30 and the second barrier rib 40
  • the fourth barrier rib 60 is connected with the other end of the first barrier rib 30 and the second barrier rib 40 Between them, the first barrier rib 30 , the second barrier rib 40 , the third barrier rib 50 , and the fourth barrier rib 60 form the side wall of the first storage compartment 70 .
  • the first storage bin 70 and the second storage bin 80 are separated by the first barrier rib 30
  • the first storage bin 70 and the third storage bin 90 are separated by the second barrier rib 40 .
  • the arrangement positions of the storage bins are not limited to this embodiment, but can be flexibly adjusted according to product requirements.
  • the section A of the nozzle material is at least partially located between the surface where the top surface and the surface where the bottom surface is located in the first middle plate area 10a" is adopted, the velocity loss of the pouring liquid is reduced, so even if the side far from the section A of the nozzle material
  • the barrier ribs and frame edges also have good molding quality.
  • the second accommodating compartment 80 is used to accommodate at least a part of the key of the electronic device.
  • the key includes a pressing part exposed outside the middle frame and a linkage part linked with the pressing part.
  • the linkage of the key can be part is accommodated in the second accommodating bin 80, and the third accommodating bin 90 is used for accommodating at least a part of the antenna of the electronic device.
  • the second accommodating compartment 80 is used for accommodating at least a part of the antenna of the electronic device
  • the third accommodating compartment 90 is used for accommodating at least a part of the keys of the electronic device.
  • these two embodiments are not limited, and the components accommodated in the second storage bin 80 and the third storage bin 90 can be flexibly adjusted according to different electronic devices.
  • the material of the middle frame may be an alloy material, specifically aluminum alloy, magnesium alloy, etc., of course, the material is not limited to the alloy material, as long as it is suitable for die-casting.
  • the middle frame assembly provided by this application includes the above-mentioned middle frame, and also includes plastic parts injected on the surface of the middle frame.
  • the plastic parts cover the surface of the middle frame to play the role of cushioning and protecting the middle frame. Different appearance effects are molded on the plastic parts.
  • the electronic device provided by this application includes the above-mentioned middle frame, and the electronic device can be a mobile phone or a tablet computer, or a handheld computer, walkie-talkie, POS machine, driving recorder, wearable device, virtual reality device, or a vehicle-mounted front-mounted device.
  • the screen of the electronic device is installed on the bottom side of the middle frame.
  • the screen can be bonded to the middle plate 10 of the middle frame through structural glue, and the cover of the electronic device is installed on the top side of the middle frame.
  • the cover body may be provided with an outer surrounding portion, and the outer surrounding portion is adapted to cover the outside of the frame 20 of the middle frame.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

一种电子设备的中框，包括中板（10）和用于容置电子设备的电池的第一容置仓（70），中框的外侧面具有水口料断面（A），中板（10）具有构建第一容置仓（70）的仓底壁的第一中板区域（10a），水口料断面（A）至少部分位于第一中板区域（10a）的顶面所在面和底面所在面之间。以及一种中框组件，包括该中框和注塑在中框表面的塑胶件。以及一种电子设备，包括该中框。该中框砂眼少、质量好、强度高，解决了电子设备因中框的成型质量不好和强度不高而整机强度和可靠性不高的问题，可以应用于手机、平板电脑、手持计算机、对讲机、POS机、行车记录仪、可穿戴设备、虚拟现实设备、或车载前装等具有屏幕的终端产品。

Description

电子设备的中框、中框组件及电子设备
本申请要求于2021年09月28日提交中国国家知识产权局、申请号为202122368863.2、发明名称为“电子设备的中框、中框组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子产品技术领域，尤其涉及一种电子设备的中框。
背景技术
中框是手机等电子设备的主要承力构件，通常采用压铸成型，其成型质量的好坏决定了电子设备的整机强度和整机可靠性。
目前，压铸成型的电子设备的中框总是伴随大量的砂眼，造成中框的质量不好、强度不高，进而导致整机的强度和可靠性不能达到理想要求。
发明内容
本申请实施例提供了电子设备的中框。该中框砂眼少、质量好、强度高，解决了电子设备因中框的质量不好和强度不高而整机强度和可靠性不高的问题。
第一方面，所述中框包括中板和用于容置电池的第一容置仓，所述中框的外侧面具有水口料断面，所述中板具有构建所述第一容置仓的仓底壁的第一中板区域，所述水口料断面至少部分位于所述第一中板区域的顶面所在面和底面所在面之间。采用该设计，相应的压铸模具内的流道的出口至少部分位于第一中板区域模腔的腔顶壁所在面和腔底壁所在面之间，因此，压铸模具内的流道的出口至少部分正对着第一中板区域模腔，与第一中板区域模腔在模腔的厚度方向上没有落差，因而至少部分浇注液自流道出口流出后不沿模腔的厚度方向流动，而是直接沿大致平行于第一中板区域模腔的腔顶壁和腔底壁的方向流入第一中板区域模腔，不需要克服落差也不需要转向，因而流速损失小、流动状态平稳，所以即便流到远离流道的位置时也能保持较高的流速和平稳的流态，从而能提升充填质量，因此成型的中框砂眼少、成型质量好、强度高。另外，采用该设计，即便第一中板区域的厚度更薄一些，也能保证充填质量，因此，允许第一中板区域的厚度更薄一些，以利于产品轻量化且能给电池提供更大的容纳空间。
第一方面的一种实施方式，基于第一方面，所述水口料断面的顶侧边缘与所述第一中板区域的顶面共面，所述水口料断面的底侧边缘与所述第一中板区域的底面共面。这样设计，相应的压铸模具内的流道的出口正对着第一中板区域模腔的部分较多，从而能较大程度地降低浇注液的速度损失。
第二方面，基于第一方面或第一方面的实施方式，所述中框包括第二容置仓，所述中板具有构建所述第二容置仓的仓底壁的第二中板区域，所述第二中板区域比所述第一中板区域更靠近所述水口料断面，所述第二中板区域的顶面和/或底面具有第一机加工面。这样设计，相应的压铸模具内的第二中板区域模腔的厚度需设计得大于目标中框产品的第二中板区域的厚度(即第二中板区域模腔加厚)，因而，能提升浇注液在此区域的通过性，从而 能进一步提升充填质量，使成型的中框砂眼少、成型质量好、强度高。
第二方面的第一种实施方式，基于第二方面，所述第二中板区域设第一通孔，所述第一通孔的孔壁面具有第二机加工面。这样设计，第一通孔不是在压铸过程中成型的，而是压铸完成后机加工出来的，因而相应的压铸模具内的第二中板区域模腔中不设成型通孔的柱体，从而不存在柱体阻碍浇注液流动致使浇注液流动阻力大的问题，因而能进一步降低浇注液的速度损失，从而能减少中框的砂眼、提升中框的质量和强度。
第三方面，基于第一方面或第一方面的实施方式或第二方面或第二方面的各实施方式，所述中框包括第三容置仓，所述中板具有构建所述第三容置仓的仓底壁的第三中板区域，所述第三中板区域设第二通孔，所述第二通孔的孔壁面具有第三机加工面。这样设计，第二通孔不是在压铸过程中成型的，而是压铸完成后机加工出来的，因而相应的压铸模具内的第三中板区域模腔中不设成型通孔的柱体，从而不存在柱体阻碍浇注液流动致使浇注液流动阻力大的问题，因而能进一步降低浇注液的速度损失，从而能减少中框的砂眼、提升中框的质量和强度。
第四方面，基于第三方面，所述第二容置仓和所述第三容置仓，一者用于容置电子设备的天线的至少一部分，另一者用于容置电子设备的按键的至少一部分。这样设计，使电子设备的不同电子元件或机械元件有序规整地集装在中框的不同容置仓中，使电子设备的组装更有序，更利于实现电子设备的自动化生产。
第五方面，基于第一方面或第一方面的实施方式或第二方面或第二方面的实施方式或第三方面或第三方面的实施方式或第四方面，所述中框包括围设在所述中板外侧的边框和位于所述边框的围合空间内的隔挡肋，容置仓的仓侧壁由所述边框和/或所述隔挡肋构建。采用该设计，实现了容置仓之间的分隔。
第六方面，基于第一方面或第一方面的实施方式或第二方面或第二方面的实施方式或第三方面或第三方面的实施方式或第四方面或第五方面，所述中框采用合金材质。采用该设计，易于压铸成型。
本申请实施例还提供了中框组件，所述中框组件包括上述各方面及各方面实施方式所提供的中框以及注塑在所述中框表面的塑胶件。由于上述各方面及各方面实施方式所提供的中框具有上述有益效果，所以该中框组件也同样具有上述有益效果，另外，塑胶件能起到缓震以及保护中框的作用。
本申请实施例还提供了电子设备，所述电子设备包括上述各方面及各方面实施方式所提供的中框。由于上述各方面及各方面实施方式所提供的中框具有上述有益效果，所以该电子设备也同样具有上述有益效果。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1和图2为本申请提供的电子设备的中框的一种实施例不同视角下的立体图；
图3为图1的顶侧视图；
图4为图3中A-A截面图；
图5为图3中B-B截面图；
图6示意了剥离水口料和第二中板区域的机加工过程，图中展示的部位对应图4、图5中C圈内部位，其中，左图为压铸成型的中框预成型体，右图为中框产品；
图7示意了第三中板区域的机加工过程，图中展示的部位对应的图5中D圈内部位，其中，左图为压铸成型的中框预成型体，右图为中框产品；
附图标记说明：
01水口料；
10中板,10a第一中板区域，10b第二中板区域，10c第三中板区域，101第一机加工面，102第二机加工面，103第一通孔，104第二通孔，105第三机加工面；
20边框，201第一框边，202第二框边，203第三框边，204第四框边，205弧形过渡部；
30第一隔挡肋，40第二隔挡肋，50第三隔挡肋，60第四隔挡肋；70第一容置仓，80第二容置仓，90第三容置仓。
具体实施方式
如图1，本申请提供的电子设备的中框包括中板10和用于容置电子设备的电池的第一容置仓70，中板10为薄壁结构，中板10具有第一中板区域10a，第一中板区域10a构建第一容置仓70的仓底壁。
如图2，中框的外侧面具有水口料断面A，中框的外侧面是指连在中框的顶面外边缘和底面外边缘之间的面。本文所述的某部件的外侧面均指连在该部件的顶面外边缘和底面外边缘之间的面。
关于水口料：中框采用压铸模具压铸成型，相应的压铸模具内设有中框模腔。中框模腔即用于成型中框的模腔，本文所述的某部件模腔均指用于成型该部件的模腔。压铸模具内还设有流道，流道的进口与浇注口连通，流道的出口与中框模腔连通，起到导流作用。压铸完成后，部分浇注液会在流道内成型，流道内的成型物即为水口料，又称浇注系统凝料或者回料。
关于水口料断面：如图6，脱模后的水口料01与中框是连在一起的，所以脱模后需将水口料01从中框上剥离下来方可得到中框产品，水口料01剥离后，必然会在中框表面形成断面，该断面即为水口料断面A，水口料断面A的颜色和/或粗糙度/和/或平面度等不同于中框表面的其他区域，可通过肉眼或者专门的检测设备观测识别出来。
如图4，水口料断面A至少部分位于第一中板区域10a的顶面所在面和底面所在面之间。顶面所在面是指顶面自身以及顶面的延长面，底面所在面是指底面自身以及底面的延长面。
由于水口料断面A至少部分位于第一中板区域10a的顶面所在面和底面所在面之间，所以相应的压铸模具内的流道的出口至少部分位于第一中板区域模腔的腔顶壁所在面和腔底壁所在面之间，因此，压铸模具内的流道的出口至少部分正对着第一中板区域模腔，与第一中板区域模腔在模腔的厚度方向上没有落差，因而至少部分浇注液自流道出口流出后不沿模腔的厚度方向流动，而是直接沿大致平行于第一中板区域模腔的腔顶壁和腔底壁的 方向流入第一中板区域模腔。反言之，如果存在落差，则浇注液自流道出口流出后会先沿模腔的厚度方向流动以克服该落差，然后再转向沿平行于第一中板区域模腔的腔顶壁和腔底壁的方向流入第一中板区域模腔，这一过程会产生较大的流速损失而且流态也会被扰乱，导致浇注液流入第一中板区域模腔时的流速较低且流态不稳。
加之，为满足电池容置需求，第一中板区域10a的面积一般比较大且厚度比较薄，所以相应的压铸模具内的第一中板区域模腔也具有面积大厚度薄的特点，所以，如果浇注液以不稳的流态进入第一中板区域模腔的话，很容易撞击到第一中板区域模腔的腔顶壁和腔底壁，导致流速的进一步损失和流态的进一步紊乱，致使浇注液到达远离流道的位置时流速已经变得很低且紊流严重，因而影响充填质量，致使成型的中框砂眼多、质量不好、强度不高。
而本方案，由于至少部分浇注液自流道出口流出后不沿模腔的厚度方向流动，而是直接沿大致平行于第一中板区域模腔的腔顶壁和腔底壁的方向流入第一中板区域模腔，不需要克服落差，也不需要转向，因而流速损失小、流动状态平稳，所以即便流到远离流道的位置时也能保持较高的流速和平稳的流态，从而充填质量好，因而，成型的中框砂眼少、质量好、强度高。另外，采用本方案，即便第一中板区域10a的厚度更薄一些，也能保证充填质量，因此，允许第一中板区域10a的厚度更薄一些，以利于产品轻量化且能给电池提供更大的容纳空间。一种实施方式中，第一中板区域10a的厚度(图中H2)为0.3mm。
具体的，水口料断面A的顶侧边缘可以位于第一中板区域10a的顶面所在面之上或者位于第一中板区域10a的顶面所在面之下或者与第一中板区域10a的顶面所在面共面。水口料断面A的底侧边缘可以位于第一中板区域10a的底面所在面之上或者位于第一中板区域10a的底面所在面之下或者与第一中板区域10a的底面所在面共面。一种优选的实施方式为：水口料断面A的顶侧边缘与第一中板区域10a的顶面所在面共面，并且，水口料断面A的底侧边缘与第一中板区域10a的底面所在面共面，这样设计，压铸模具内的流道的出口正对着第一中板区域模腔的部分较多，从而能较大程度地降低浇注液的速度损失。
具体的，水口料断面A的顶侧边缘和底侧边缘之间的距离与水口料01的厚度(图中H1)基本一致，为了方便水口料01的剥离，水口料01的厚度不宜太厚，以0.5mm左右为宜，相应的，水口料断面A的顶侧边缘和底侧边缘之间的距离也大约为0.5mm。
如图3和图5，该实施例中，中框还包括第二容置仓80，第二中板10具有第二中板区域10b，第二中板区域10b构建第二容置仓80的仓底壁。第二中板区域10b比第一中板区域10a更靠近水口料断面A。第二中板区域10b表面具有第一机加工面101。第一机加工面101可位于第二中板区域10b的顶面或者第二中板区域10b的底面，也可以是第二中板区域10b的顶面和底面均具有第一机加工面101。
如图6，第二中板区域10b的顶面和/或底面具有第一机加工面101意味着：相应的压铸模具内的第二中板区域模腔的厚度需设计得大于目标中框产品的第二中板区域的厚度，这样，压铸成型的第二中板区域预成型体的厚度(H4)大于目标中框产品的第二中板区域的厚度(H3)，对第二中板区域预成型体的顶面和/或底面进行机加工以去除多余厚度，从而在中框产品的第二中板区域的顶面和/或底面形成第一机加工面101。一种实施方式中，H4是H3的两倍，H4为0.8mm，H3为0.4mm。
简言之，第二中板区域10b的顶面和/或底面具有第一机加工面101意味着加厚了相应压铸模具的第二中板区域模腔。由于第二中板区域10b比第一中板区域10a更靠近水口料断面A，所以相应的压铸模具内的第二中板区域模腔比第一中板区域模腔更靠近流道出口，浇注时，浇注液先流经第二中板区域模腔再流经第一中板区域模腔，因而浇注液在第二中板区域模腔中流动得顺畅与否对后续模腔(尤其是厚度薄面积大的第一中板区域模腔)的充填质量的影响很大。将第二中板区域模腔加厚有效提升了浇注液在第二中板区域模腔以及后续模腔的流动顺畅性，因此能进一步提升充填质量，从而减少中框的砂眼、提升中框质量和强度。
如图3和图4，该实施例中，第二中板区域10b设第一通孔103，可用作减重孔或者供电子设备的电性连接件穿过的过孔。第一通孔103的孔壁面具有第二机加工面102，这意味着：第一通孔103不是在压铸过程中成型的，而是在压铸成型的第二中板区域预成型体上机加工出来的，因而相应的压铸模具内的第二中板区域模腔中不设成型通孔的柱体，从而不存在柱体阻碍浇注液流动致使浇注液流动阻力大的问题，因而能进一步降低浇注液的速度损失，从而能减少中框的砂眼、提升中框的质量和强度。
如图3和图4，该实施例中，中框还包括第三容置仓90，中板10具有第三中板区域10c，第三中板区域10c构建第三容置仓90的仓底壁，第三中板区域10c设第二通孔104，可用作减重孔或者供电子设备的电性连接件穿过的过孔。如图7，第二通孔104的孔壁面具有第三机加工面105，这意味着：第二通孔104不是在压铸过程中成型的，而是在压铸成型的第三中板区域预成型体上机加工出来的，因而相应的压铸模具内的第三中板区域模腔中不设成型通孔的柱体，从而不存在柱体阻碍浇注液流动致使浇注液流动阻力大的问题，因而能进一步降低浇注液的速度损失，从而能减少中框的砂眼、提升中框的质量和强度。
上述各机加工面可以为冲裁面或切削面，换言之，可以采用冲裁设备或切削设备对压铸成型的中框预成型体的相应区域进行机加工以得到上述机加工面。无论采用冲裁加工方式还是切削加工方式都应保障加工精度，以避免加工位置产生应力集中。机加工面的颜色和/或粗糙度/和/或平面度等不同于中框表面的其他区域，可通过肉眼或者专门的检测设备观测识别出来。
如图1-图3，该实施例中，中框还包括围设在中板10外侧的边框20，边框20包括相互间隔的第一框边201和第二框边202以及相互间隔的第三框边203和第四框边204，第一框边201和第二框边202的长度大于第三框边203和第四框边204的长度，在其他实施例中，第一框边201和第二框边202的长度也可小于或等于第三框边203和第四框边204的长度，这四个框边首尾依次连接形成形状近似长方形的边框20，这四个框边的连接处通过弧形过渡部205平滑过渡。当然，边框20的形状不局限于长方形，框边数量也不局限于四个，而可根据产品需要灵活调整。
如图2，该实施例中，水口料断面A位于长度较长的第一框边201的外侧面，与第一框边201通长，这样，浇注液自流道出口流过较短距离就能到达最远离流道的位置，更利于保障充填质量。当然，在其他实施例中，水口料断面A也可设位于长度较短的框边的外侧面或者同时位于多个框边的外侧面。
如图3，该实施例中，中框包括第一隔挡肋30、第二隔挡肋40、第三隔挡肋50、第四 隔挡肋60，这四个隔挡肋均位于边框20的围合空间内。第一隔挡肋30靠近第一框边201并大致平行于第一框边201，第二容置仓80位于第一隔挡肋30和第一框边201之间，第一隔挡肋30和第一框边201构建第二容置仓80的仓侧壁。第二隔挡肋40靠近第二框边202并大致平行于第二框边202，第三容置仓90位于第二隔挡肋40和第二框边202之间，第二隔挡肋40和第二框边202构建第三容置仓90的仓侧壁。第三隔挡肋50连在第一隔挡肋30和第二隔挡肋40的一端之间，第四隔挡肋60连在第一隔挡肋30和第二隔挡肋40的另一端之间，第一隔挡肋30、第二隔挡肋40、第三隔挡肋50、第四隔挡肋60构建第一容置仓70的仓侧壁。第一容置仓70和第二容置仓80由第一隔挡肋30隔挡开，第一容置仓70和第三容置仓90由第二隔挡肋40隔挡开。当然，各容置仓的布设位置不局限于本实施例，而可以根据产品需要灵活调整。
由于采用上述“水口料断面A至少部分位于第一中板区域10a的顶面所在面和底面所在面之间”的设计，降低了浇注液的速度损失，所以即便远离水口料断面A的一侧隔挡肋和框边也有较好的成型质量。
一种实施例中，第二容置仓80用于容置电子设备的按键的至少一部分，通常按键包括露置在中框外的按压部和与按压部联动的联动部，可将按键的联动部容置在第二容置仓80中，第三容置仓90用于容置电子设备的天线的至少一部分。另一种实施例中，第二容置仓80用于容置电子设备的天线的至少一部分，第三容置仓90用于容置电子设备的按键的至少一部分。当然，不局限这两个实施例，根据电子设备的不同，可对第二容置仓80和第三容置仓90容置的部件进行灵活调整。
具体的，中框的材质可以为合金材质，具体可以采用铝合金、镁合金等，当然，不局限于合金材质，只要是适于压铸的材质就可以。
另外，本申请提供的中框组件包括上述中框，还包括注塑在中框表面的塑胶件，塑胶件包覆在中框表面，起到缓震、保护中框的作用，另外，还可在塑胶件上塑造出不同的外观效果。
另外，本申请提供的电子设备包括上述中框，该电子设备可以为手机或平板电脑，也可以为手持计算机、对讲机、POS机、行车记录仪、可穿戴设备、虚拟现实设备、或车载前装等具有屏幕的终端产品。一种实施例中，将电子设备的屏幕安装在中框的底侧，具体的，屏幕可通过结构胶与中框的中板10粘接，将电子设备的盖体安装在中框的顶侧，具体的，盖体可设外包围部，外包围部适配地包覆在中框的边框20外侧。
本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本实用新型的方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本实用新型原理的前提下，还可以对本实用新型进行若干改进和修饰，这些改进和修饰也落入本实用新型权利要求的保护范围内。

Claims (12)

  1. 一种电子设备的中框，其特征在于，所述中框包括中板(10)和用于容置电子设备的电池的第一容置仓(70)，所述中框的外侧面具有水口料断面(A)，所述中板(10)具有构建所述第一容置仓(70)的仓底壁的第一中板区域(10a)，所述水口料断面(A)至少部分位于所述第一中板区域(10a)的顶面所在面和底面所在面之间。
  2. 根据权利要求1所述的电子设备的中框，其特征在于，所述水口料断面(A)的顶侧边缘与所述第一中板区域(10a)的顶面共面，所述水口料断面(A)的底侧边缘与所述第一中板区域(10a)的底面共面。
  3. 根据权利要求1或2所述的电子设备的中框，其特征在于，所述中框包括第二容置仓(80)，所述中板(10)具有构建所述第二容置仓(80)的仓底壁的第二中板区域(10b)，所述第二中板区域(10b)比所述第一中板区域(10a)更靠近所述水口料断面(A)，所述第二中板区域(10b)的顶面和/或底面具有第一机加工面(101)。
  4. 根据权利要求3所述的电子设备的中框，其特征在于，所述第二中板区域(10b)设第一通孔(103)，所述第一通孔(103)的孔壁面具有第二机加工面(102)。
  5. 根据权利要求3所述的电子设备的中框，其特征在于，所述中框包括第三容置仓(90)，所述中板(10)具有构建所述第三容置仓(90)的仓底壁的第三中板区域(10c)，所述第三中板区域(10c)设第二通孔(104)，所述第二通孔(104)的孔壁面具有第三机加工面(105)。
  6. 根据权利要求4所述的电子设备的中框，其特征在于，所述中框包括第三容置仓(90)，所述中板(10)具有构建所述第三容置仓(90)的仓底壁的第三中板区域(10c)，所述第三中板区域(10c)设第二通孔(104)，所述第二通孔(104)的孔壁面具有第三机加工面(105)。
  7. 根据权利要求5所述的电子设备的中框，其特征在于，所述第二容置仓(80)和所述第三容置仓(90)，一者用于容置电子设备的天线的至少一部分，另一者用于容置电子设备的按键的至少一部分。
  8. 根据权利要求6所述的电子设备的中框，其特征在于，所述第二容置仓(80)和所述第三容置仓(90)，一者用于容置电子设备的天线的至少一部分，另一者用于容置电子设备的按键的至少一部分。
  9. 根据权利要求6所述的电子设备的中框，其特征在于，所述中框包括围设在所述中板(10)外侧的边框(20)和位于所述边框(20)的围合空间内的隔挡肋，所述第一容置仓(70)、第二容置仓(80)、第三容置仓(90)的仓侧壁由所述边框(20)和/或所述隔挡肋构建。
  10. 根据权利要求1所述的电子设备的中框，其特征在于，所述中框采用合金材质。
  11. 一种中框组件，其特征在于，包括权利要求1-10任一项所述的中框以及注塑在所述中框表面的塑胶件。
  12. 一种电子设备，其特征在于，所述电子设备包括权利要求1-10任一项所述的中框。
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