WO2022254703A1 - Dispositif de prélèvement de composant, dispositif de montage de composant - Google Patents

Dispositif de prélèvement de composant, dispositif de montage de composant Download PDF

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Publication number
WO2022254703A1
WO2022254703A1 PCT/JP2021/021405 JP2021021405W WO2022254703A1 WO 2022254703 A1 WO2022254703 A1 WO 2022254703A1 JP 2021021405 W JP2021021405 W JP 2021021405W WO 2022254703 A1 WO2022254703 A1 WO 2022254703A1
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WO
WIPO (PCT)
Prior art keywords
ejector
component
support ring
control unit
pallet
Prior art date
Application number
PCT/JP2021/021405
Other languages
English (en)
Japanese (ja)
Inventor
大介 春日
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN202180098046.XA priority Critical patent/CN117581344A/zh
Priority to KR1020237035021A priority patent/KR20230156402A/ko
Priority to DE112021007233.1T priority patent/DE112021007233T5/de
Priority to JP2023525321A priority patent/JPWO2022254703A1/ja
Priority to PCT/JP2021/021405 priority patent/WO2022254703A1/fr
Priority to TW110144365A priority patent/TWI793882B/zh
Publication of WO2022254703A1 publication Critical patent/WO2022254703A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Definitions

  • the present invention relates to a component pickup device and a component mounting device.
  • Patent Document 1 discloses a device (die supply device) that picks up dies divided from a semiconductor wafer and supplies them to a component mounter.
  • the wafer pallet 22 is provided with an information recording section 35 in which wafer information relating to the wafer size and/or the pick-up operation range is described.
  • the movable range of the push-up pot 51 is adjusted so that the push-up pot 51 does not interfere (contact) with the circular opening edge of the wafer pallet 22. Can be set automatically. This eliminates the need for the operator to input the movable range, improving productivity.
  • the chips (components) obtained by dividing the wafer are placed on a dicing sheet (component mounting sheet) stretched over the circular opening of the wafer pallet (the through hole of the support ring).
  • the ejector (push-up pot) moves inside the through-hole and pushes up the part to be picked up from below.
  • the dimensions of the ejector may vary depending on the size of the part to be picked up.
  • Patent Document 1 Although wafer information is obtained from the wafer pallet, the dimensions of the ejector actually used are not obtained. Therefore, if the ejector changes, it may come into contact with the support ring as it moves inside the through hole.
  • the components are not limited to chips obtained by dividing a wafer, and other small components also have similar problems.
  • the present invention was made to solve such problems. Techniques are disclosed herein to limit the movement of the ejector to avoid contact of the ejector with the support ring based on the size of the ejector and the size of the through hole.
  • a component pick-up device disclosed in this specification positions a support ring having a through hole penetrating vertically, and picks up a component from a component mounting sheet stretched on the upper surface side of the support ring so as to cover the through hole. It is a parts pick-up device that Such a component pickup device includes an ejector that moves within the through hole of the support ring and pushes the component from below the component mounting sheet, and the component pushed up by the ejector is sucked and picked up. a suction head, an acquisition unit that acquires information or an image of the ejector, and a control unit.
  • the control unit acquires the dimensions of the ejector based on the information or image of the ejector acquired by the acquisition unit, and based on the acquired dimensions of the ejector and the dimensions of the through hole, Movement of the ejector within the through hole is restricted to avoid contact of the ejector.
  • movement of the ejector can be restricted to avoid contact of the ejector with the support ring based on the dimensions of the ejector actually used and the dimensions of the through hole.
  • FIG. 4 is a schematic diagram showing a state when picking up a chip from a component mounting sheet in the configuration of Embodiment 1; Block diagram showing the control system of the component mounter Schematic diagram showing the positional relationship of the support ring, ejector, and tip FIG. 4 is a diagram showing ejector information stored in a storage unit; Flowchart showing the operation of the component mounter A diagram showing the relationship between the tip to be picked up and the support ring.
  • FIG. 9 is a schematic diagram showing a state when picking up a chip from a component mounting sheet in the configuration of Embodiment 2; Diagram showing information recorded in an RFID tag Top view of ejector with identifier on top A diagram showing the identifier, and the type and outer diameter R2 of the ejector corresponding to the identifier. Plan view showing the case where the entire ejector is within the field of view of the camera Plan view showing the case where the entire ejector is not within the field of view of the camera
  • Embodiment 1 of the present invention will be described in detail below with reference to FIGS. 1 to 8.
  • FIG. The component pick-up device 13 according to the present invention can be applied to various devices such as a die bonder, a taping device that stores diced chips on a tape, or a component mounting device that mounts components on a substrate.
  • Embodiment 1 is an example in which the component pick-up device 13 is applied to the component mounting device 10 .
  • FIG. 1 is a plan view showing the overall configuration of the component mounting apparatus 10.
  • FIG. FIG. 2 is an exploded perspective view mainly showing the mechanical portion of the component pick-up device 13 in the component mounting apparatus 10.
  • the component mounting apparatus 10 is an apparatus that picks up a chip (an example of a “component”) C from a diced wafer W and mounts it on an object M to be mounted.
  • the chip C is used as an example of the component, but the component may be other than the chip, such as a passive component such as a ceramic capacitor, or a molded lead frame.
  • the component mounting apparatus 10 includes a base 11, a conveyor 12, a pallet storage section 70, and a component pick-up device 13.
  • the conveyor 12 carries in the mounting object M to a predetermined mounting work position, and carries out the mounting object M from the mounting work position after the mounting work.
  • the conveyor 12 includes a conveyor body extending in the X direction that conveys the mounting target M, and a positioning mechanism (not shown) that lifts and positions the mounting target M on the conveyor body.
  • the conveyor 12 conveys the mounting object M in a substantially horizontal posture from the right side to the left side in FIG. 1, and positions and fixes it at a predetermined mounting work position.
  • the pallet storage unit 70 is a tool for storing a plurality of pallets 20, and is arranged in the central portion on the front side of the component mounting apparatus 10 in FIG.
  • the pallet storage unit 70 includes a rack (not shown) that stores the pallets 20 in a plurality of vertical stages, and a drive means (not shown) that drives the rack up and down.
  • the pallet storage unit 70 arranges a desired pallet 20 at a height position that allows it to be taken in and out of the pallet holding table 30 by raising and lowering the rack. After that, the pallet 20 arranged at a height that allows it to be taken in and out of the pallet holding table 30 is mounted on the pallet holding table 30.
  • FIG. 1 The basic structure of the pallet 20 will be described with reference to FIGS. 2 and 3.
  • FIG. 1 The pallet 20 has a rectangular plate-like pallet body 26 , a support ring 23 and an expand ring 24 .
  • the pallet main body 26 has a through hole penetrating vertically. An example in which the through holes of the pallet body 26 are circular will be described. However, the shape of the through hole of the pallet main body 26 is arbitrary and set appropriately.
  • the support ring 23 is an annular member with a through hole 22 in the center.
  • This disclosure describes an example in which the support ring 23 has an annular shape.
  • the shape of the support ring 23 is not limited to an annular shape.
  • the support ring 23 may be an annular member in which a through hole 22 is opened in a plate-like member, or may be an annular member in which a through hole 22 is opened in a cylindrical body having a predetermined thickness. good.
  • the size and shape of the through holes 22 are appropriately set according to the through holes of the pallet body 26 .
  • the through hole 22 has substantially the same size and shape as the through hole of the pallet body 26 .
  • the support ring 23 is assembled so as to be vertically movable with respect to the pallet body 26 with the through holes 22 overlapping the through holes of the pallet body 26 .
  • the component pickup device 13 has a mechanism for vertically moving the support ring 23 with respect to the pallet body 26 .
  • the inside (inside) of the through-hole 22 is a movement area in which the ejector 41 moves as described later.
  • the four locking portions 21 are provided on the upper surface of the pallet body 26 .
  • the four locking portions 21 are arranged at regular intervals so as to surround the support ring 23 .
  • the locking portion 21 is foldable with respect to the upper surface of the pallet body 26 , and locks the edge of the expand ring 24 from above to fix the expand ring 24 near the upper surface of the pallet body 26 .
  • a component mounting sheet S (hereinafter simply referred to as “sheet S”) is attached to the expand ring 24 .
  • the sheet S is a flexible sheet made of translucent resin, for example.
  • a wafer W divided into a plurality of chips C is attached to a portion of the upper surface of the sheet S that is located inside the support ring 23 in plan view. When the sheet S is stretched, the intervals between the chips C are expanded (expanding process).
  • the pallet 20 is stored in the pallet storage unit 70 with the gaps between the chips C attached to the sheet S expanded. Further, the pallets 20 stored in the pallet storage unit 70 may include a plurality of types of pallets 20 having different dimensions (inner diameters of the support rings 23) R1 of the through holes 22 depending on the size of the wafer W and the like. In order to identify these multiple types of pallets 20, the plate surface of the pallet body 26 is provided with an identifier 25 corresponding to each type of pallet 20. As shown in FIG.
  • the components constituting the component mounting apparatus 10 has a component pick-up device 13 .
  • the component pick-up device 13 includes a pallet holding table 30 that holds the pallet 20 , a push-up portion 40 (see FIG. 2), a suction portion 50 and a control portion 80 .
  • the pallet holding table 30 holds the pallet 20 pulled out from the pallet storage section 70 at the central position. Thereby, the support ring 23 constituting the pallet 20 is positioned with respect to the pallet holding table 30 .
  • the pallet holding table 30 is provided with an opening at a position overlapping the through hole 22 of the supported support ring 23 in plan view.
  • the pallet 20 stored in the pallet storage section 70 is mounted on the pallet holding table 30 by a pallet mounting mechanism (not shown).
  • the pallet mounting mechanism is an element that constitutes the component mounting apparatus 10 , and pulls out the pallet 20 from the pallet storage section 70 and mounts it on the pallet holding table 30 .
  • the component mounting apparatus 10 may also include a return mechanism (not shown) that returns the pallet 20 held by the pallet holding table 30 to the pallet storage section 70 .
  • These mounting mechanism and return mechanism may be configured separately and independently, or may be configured integrally.
  • the pallet holding table 30 can be moved in the Y direction on the base 11 by a table driving motor 33 between a component picking position and a pallet receiving position. Specifically, the pallet holding table 30 is movably supported on the base 11 with respect to a pair of fixed rails 31 extending in the Y direction, and is moved along the fixed rails 31 by a predetermined driving means.
  • the driving means for moving the pallet holding table 30 includes a ball screw shaft 32 extending parallel to the fixed rail 31 and screwed into the nut portion of the pallet holding table 30, and a table for rotating the ball screw shaft 32. and a drive motor 33 .
  • the pallet holding table 30 can pass below the conveyor 12 .
  • Such a pallet holding table 30 is movable between a predetermined component picking position (the position of the pallet holding table 30 in FIG. 1) and a pallet receiving position near the pallet storage section 70 .
  • the pallet holding table 30 is movable in the Y direction along fixed rails 31 .
  • the push-up part 40 pushes up the chip C to be picked up from the bottom to the top together with the sheet S among the plurality of chips C stuck on the sheet S at the component picking work position.
  • the pushed-up chip C is peeled off from the sheet S and lifted.
  • the push-up portion 40 includes an ejector 41, a Z-axis moving portion 42, an X-axis moving portion 43, a fixed rail 44, and a push-up portion drive motor 45 (see FIG. 4). include.
  • the ejector 41 has a cylindrical shape with an outer diameter R2 whose axis is in the vertical direction, and the lower surface is connected to the Z-axis moving part 42 .
  • the outer diameter R2 is an example of the "ejector dimension.”
  • the ejector 41 incorporates a plurality of pins 41a that can protrude upward.
  • the ejector 41 lifts the chip C of the sheet S with a plurality of pins 41a.
  • the ejector 41 protrudes the pin 41a that overlaps with the chip C to be picked up in a plan view, while keeping the other pin 41a housed in the ejector 41. Of the chips C, only the chip C to be picked up is pushed upward.
  • the ejector 41 arbitrarily changes the protruding pin 41a according to the size of the chip C to be picked up.
  • the ejector 41 is attachable to and detachable from the Z-axis moving part 42 .
  • the Z-axis moving part 42 is arranged between the X-axis moving part 43 and the ejector 41 , and its lower end is fixed to the X-axis moving part 43 .
  • the Z-axis moving part 42 is movable in the Z direction (vertical direction), and moves the ejector 41 attached to its upper end in the Z direction.
  • the ejector 41 can approach the sheet S stretched on the upper surface of the support ring 23 from below.
  • the ejector 41 is lowered in advance so that the support ring 23 and the ejector 41 do not come into contact with each other. can be made
  • the fixed rail 44 is a rail extending in the X direction and fixed on the base 11 . As shown in FIG. 2, the fixed rail 44 supports the X-axis moving portion 43 so as to be movable in the X direction.
  • An ejector 41 is mounted on the X-axis moving part 43 . Therefore, the ejector 41 can move in the X direction via the X-axis moving part 43 .
  • the pallet holding table 30 is movable along the fixed rail 31 in the Y direction. Therefore, the ejector 41 is movable in the XY directions (horizontal direction) with respect to the pallet 20 held on the pallet holding table 30 . As a result, the ejector 41 can move to directly below an arbitrary chip C and push up the chip C. As shown in FIG.
  • the movement of the ejector 41 and the operation of projecting the pin 41 a are performed by the control section 80 controlling the table driving motor 33 and the push-up section driving motor 45 .
  • the adsorption section 50 has a head unit 50A and a head unit driving mechanism 50B.
  • the head unit 50A is a device that picks up the chip C attached to the sheet S and mounts it on the mounting surface M1.
  • the head unit 50A is driven by a head unit driving mechanism 50B provided on the base 11, and moves in the XY directions (horizontal directions) within the movable area on the base 11.
  • the head unit drive mechanism 50B includes a pair of fixed rails 57, a unit support member 55, a pair of Y-axis ball screws 58, and a pair of Y-axis motors 59.
  • a pair of fixed rails 57 are fixed on the base 11 and extend parallel to the Y direction with a predetermined interval in the X direction.
  • the unit support member 55 has a shape elongated in the X direction, and supports the head unit 50A so as to be slidable in the X direction.
  • the unit support member 55 is movably supported by a pair of fixed rails 57 and is slidable in the Y direction.
  • the Y-axis ball screw 58 has a shaft shape that is long in the Y direction and is arranged side by side with the fixed rail 57 .
  • a Y-axis motor 59 is coupled to the Y-axis ball screw 58 via a coupling. , the Y-axis ball screw 58 is rotated by the driving force of the Y-axis motor 59 .
  • the Y-axis ball screw 58 constitutes a ball screw mechanism that converts the rotational force of the Y-axis motor 59 into a propulsion force in the Y direction.
  • the Y-axis ball screw 58 applies a driving force in the Y direction to the unit support member 55 and the head unit 50A. As a result, the unit support member 55 and the head unit 50A move in the Y direction (Y-axis servo mechanism).
  • the head unit drive mechanism 50B also includes an X-axis ball screw and an X-axis motor 56 that rotates the X-axis ball screw.
  • the X-axis ball screw is built in the unit support member 55 .
  • the X-axis ball screw constitutes a ball screw mechanism that converts the rotational force of the X-axis motor 56 into X-direction propulsion, and the head unit 50A receives the X-direction propulsion from the X-axis ball screw. moves in the X direction (X-axis servo mechanism).
  • the head unit 50A moves in the Y direction by driving the Y-axis servo mechanism, and moves in the X direction by driving the X-axis servo mechanism.
  • the head unit 50A includes a head unit body 61, a suction head 51, a Z-axis motor 52, and a camera 53.
  • the suction head 51 is connected to the motor shaft of the Z-axis motor 52 .
  • the Z-axis motor 52 is fixed to the head unit body 61 .
  • the suction head 51 can be moved vertically with respect to the head unit body 61 by driving the Z-axis motor 52 .
  • the suction head 51 has a shape elongated in the vertical direction, and an air supply path is provided in the central part in the vertical direction. A negative pressure is applied to the tip (lower end) of the suction head 51 by supplying negative pressure to the air supply path via a vacuum pump (not shown).
  • a suction force is generated at the lower end of the suction head 51 by applying negative pressure.
  • the suction head 51 holds the chip C.
  • the applied pressure can be switched to positive pressure.
  • the suction head 51 releases the holding of the chip C by applying the positive pressure.
  • the camera 53 is fixed to the head unit main body 61 along with the Z-axis motor 52 .
  • the camera 53 has its imaging surface facing downward, and can image the chip C attached to the upper surface of the sheet S. As shown in FIG.
  • the control unit 80 can recognize the presence of the chip C to be picked up. Further, the control unit 80 can detect the position of the chip C within the support ring 23 based on the position of the camera 53 when the chip C is imaged and the position of the pallet 20 at that time.
  • the camera 53 images the ejector 41 and the pallet 20 . As shown in FIG. 2, the ejector 41 is positioned below the camera 53 . The camera 53 images the ejector 41 when the pallet 20 moves to the pallet receiving position together with the pallet holding table 30 .
  • the pallet holding table 30 loads the pallet 20 and moves to the component extraction work position. Since the pallet 20 is positioned below the camera 53 at this time, the camera 53 takes an image of the pallet 20 .
  • the intention of imaging the ejector 41 and the pallet 20 is to perform image recognition of the ejector 41 and the pallet 20 to determine the types of the ejector 41 and the pallet 20, as will be described later.
  • FIG. 4 is a block diagram showing the control system of the component mounting apparatus 10. As shown in FIG.
  • the control unit 80 is a controller that centrally controls the component mounting apparatus 10 .
  • control unit 80 In the control unit 80, the table drive motor 33, the push-up unit drive motor 45, the X-axis motor 56, the Y-axis motor 59, the camera 53, the input unit 81, and the output unit (an example of the "display unit") 82 are electrically connected. properly connected. An operator of the component mounting apparatus 10 inputs various information and commands to the control section 80 via the input section 81 .
  • the controller 80 receives an output signal from a position detection means such as an encoder (not shown) built in each drive motor. Further, when an abnormality such as a stop of the component mounting apparatus 10 due to the approach or contact between the ejector 41 and the support ring 23 occurs, the control unit 80 displays information such as the occurrence of the abnormality and its type on the output unit 82. to notify the operator of the state of the component mounting apparatus 10 .
  • a position detection means such as an encoder (not shown) built in each drive motor.
  • the control unit 80 includes an axis control unit 83 , an image processing unit 84 , a storage unit 85 and a calculation unit 86 .
  • the axis control unit 83 is a driver that drives each drive motor, and operates each drive motor according to instructions from the calculation unit 86 .
  • the image processing unit 84 performs image processing on image data input from the camera 53 .
  • the storage unit 85 stores various programs such as implementation programs and various data. Further, the storage unit 85 stores the inner diameter R1 of the support ring 23, which differs according to the type of the pallet 20, and the registered image of the ejector 41, which differs according to the type of the ejector 41, and the outer diameter R2 corresponding to the registered image on a one-to-one basis. is doing.
  • the control unit 80 operates the conveyor 12, the pallet holding table 30, the push-up unit 40, and the suction unit 50 by controlling each drive motor and the like based on a predetermined program. Thereby, the suction position of the chip C by the suction unit 50 is adjusted. Further, the control unit 80 controls a series of operations such as loading/unloading the pallet 20 into/from the pallet storage unit 70, picking up the chip C from the sheet S, mounting the chip C by the suction head 51, and the like.
  • FIG. 5 is a plan view showing the positional relationship between the support ring 23 and the ejector 41.
  • R1 is the inner diameter of the support ring 23 and “R2” is the outer diameter of the ejector 41 .
  • A1 is the center of the support ring 23 and the through hole 22 and “A2” is the center of the ejector 41 .
  • A3 is the center of chip C to be picked up.
  • the ejector 41 is positioned directly below the chip C, and the center A2 of the ejector 41 overlaps the center A3 of the chip C.
  • the ejector 41 moves inside the support ring 23 . Therefore, the center A2 is displaced with respect to the support ring 23 as the ejector 41 moves.
  • (R1-R2)/2 is a value obtained by converting the difference (R1-R2) between the inner diameter R1 of the support ring 23 and the outer diameter R2 of the ejector 41 into a radius.
  • This (R1 ⁇ R2) is a judgment value (threshold value) used when judging whether the ejector 41 is in contact with the support ring 23 .
  • control unit 80 sets the movement of the ejector 41 with the center A1 of the support ring 23 as a reference point within a range that satisfies D ⁇ (R1-R2)/2. This prevents the ejector 41 from contacting the support ring 23 .
  • the type of the ejector 41 is determined, and the outer diameter R2 of the ejector 41 is acquired for each type.
  • control unit 80 restricts the movement of the ejector 41 on the condition that D ⁇ (R1-R2)/2 is satisfied based on the acquired outer diameter R2. Further, the control unit 80 may set the movable range of the ejector 41 so as to satisfy D ⁇ (R1 ⁇ R2)/2. Thereby, contact of the ejector 41 with the support ring 23 can be avoided regardless of the type of ejector 41 used.
  • FIG. 6 shows an example of stored information.
  • information of "registered image”, "ejector type”, and “outer diameter R2" is stored in the storage unit 85 for three types of ejectors (TYPE_001, 002, 003).
  • the calculation unit 86 acquires image data GD2 of the ejector 41 imaged by the camera 53 . Then, the calculation unit 86 compares the registered image stored in the storage unit 85 with the image data GD2. After that, the calculation unit 86 identifies the ejector 41 corresponding to the registered image that matches the image data GD2, and reads the type and outer diameter R2 of the ejector 41 from the storage unit 85. FIG. Thereby, the calculation unit 86 can acquire the "type” and the "outer diameter R2" of the ejector 41 used for production.
  • the calculation unit 86 determines the type of the support ring 23 and acquires the inner diameter R1 of the support ring 23. Then, the movement of the ejector 41 is restricted based on the acquired inner diameter R1. Thereby, contact of the ejector 41 with the support ring 23 can be avoided regardless of the type of the support ring 23 used.
  • the inner diameter R1 of the support ring 23 can be obtained by taking an image of the identifier 25 attached to the upper surface of the pallet body 26 with the camera 53 and determining the type of the pallet 20 .
  • the description of the ejector 41 may be used to determine the type of the pallet 20 and the method of obtaining the inner diameter R1 of the support ring 23 .
  • the input unit 81 gives an instruction to start production to the control unit 80 based on a signal input from the outside.
  • the control unit 80 determines whether or not the outside diameter R2 of the ejector 41 attached to the component mounting apparatus 10 has already been acquired (S10). If the outer diameter R2 has been obtained (S10: YES), skip S20 and S30 and proceed to S40 (details will be described later).
  • the camera 53 takes an image of the upper surface of the ejector 41 and transmits image data GD2 to the control section 80.
  • FIG. The control unit 80 acquires the image data GD2 transmitted from the camera 53 (S20).
  • the control unit 80 compares the image data GD2 with a plurality of registered images (see FIG. 6) stored in the storage unit 85, and identifies the type of the ejector 41 from the registered image that matches the image data GD2. Next, the control unit 80 reads and acquires the outer diameter R2 corresponding to the identified type of the ejector 41 from the storage unit 85 (S30).
  • control unit 80 moves the pallet holding table 30 holding the pallet 20 to the component picking work position (S40). At this time, the pallet 20 is positioned below the camera 53 .
  • the camera 53 captures an image of the identifier 25 formed on the plate surface of the pallet body 26 and transmits image data GD1 to the control section 80 .
  • the control unit 80 reads the identifier 25 appearing in the image data GD1, and reads and acquires the inner diameter R1 corresponding to the identifier 25 from the storage unit 85 (S50).
  • FIG. 8 is a plan view for explaining the relationship between the sheet S with the wafer W adhered to its surface and the support ring 23.
  • FIG. The white straight lines shown in FIG. 8 are dicing lines.
  • the dicing lines are lattice-shaped and divide the wafer W into a plurality of chips C (rectangular).
  • chips C are picked up in rectangular areas 1 to 5 in the vicinity of the support ring 23 among the rectangular areas of the sheet S in order from the rectangular area 1 will be described.
  • the chip C exists in the rectangular areas 1, 2 and 5
  • the chip C does not exist in the rectangular areas 3 and 4.
  • the control unit 80 moves the head unit 50A above the sheet S, and images the rectangular area 1 with the camera 53 . Then, the control unit 80 determines whether the chip C can be recognized in the rectangular area 1 from the image of the camera 53 (S60).
  • the control unit 80 calculates the position of the center A3 of the chip C in the rectangular area 1, and calculates the distance D based on the position of the center A3 (S70). .
  • the distance D is the distance from the center A1 of the support ring 23 to the center A2 of the ejector 41 when it is assumed that the ejector 41 moves below the rectangular area 1 to push up the chip C (see FIG. 5). ).
  • control unit 80 determines whether or not the distance D is smaller than (R1-R2)/2 (S80).
  • the above “R1” and “R2” use the data acquired in S30 and S50.
  • control unit 80 determines that even if the ejector 41 is moved below the rectangular area 1, it does not come into contact with the support ring 23.
  • control unit 80 determines that the ejector 41 does not contact the support ring 23 (S80: NO), it moves the ejector 41 below the rectangular area 1 . Specifically, the control unit 80 moves the ejector 41 below the rectangular area 1 so that the center A2 of the ejector 41 and the center A3 of the chip C overlap in plan view (see FIG. 5).
  • the ejector 41 protrudes the pin 41a to push up the chip C in the rectangular area 1 from below. Then, the chip C is picked up from the sheet S by sucking the pushed-up chip C with the suction head 51 (S90).
  • the suction head 51 mounts the picked up chip C at a predetermined position on the mounting surface M1.
  • control unit 80 After mounting the chip C, the control unit 80 refers to the mounting program and determines whether or not there is another chip C to be picked up on the sheet S.
  • control unit 80 When there is a chip C to be picked up (S100: YES), the control unit 80 counts up to rectangular area 2, which is the next suction position (S110).
  • control unit 80 moves the head unit 50A and images the rectangular area 2 with the camera 53.
  • the control unit 80 determines whether the chip C can be recognized in the rectangular area 2 based on the image of the camera 53 (S60).
  • the control unit 80 determines that the chip C can be recognized (S60: YES).
  • the controller 80 calculates the distance D based on the position of the center A3 of the chip C in the rectangular area 2 (S70). Then, it is determined whether or not the distance D is smaller than (R1-R2)/2 (S80). In the following, the case of D ⁇ (R1-R2)/2 and the case of D>(R1-R2)/2 will be described.
  • the suction head 51 picks up the pushed-up chip C and mounts it at a predetermined position on the mounting surface M1. After mounting, the control unit 80 counts up to rectangular area 3, which is the next suction position (S90 to S110).
  • the process proceeds to S60, and the control unit 80 determines whether or not the chip C can be recognized from the image of the camera 53 in the rectangular area 3 (S60).
  • control unit 80 since chip C does not exist in rectangular area 3 and is not recognized, it is determined as NO in S60.
  • the control unit 80 does not execute the process of shifting to S70 for rectangular area 3, but shifts to S110 and counts up to rectangular area 4, which is the next suction position.
  • control unit 80 shifts to S110 without executing the processing of S90 to S100, and counts up to rectangular area 3, which is the next suction position.
  • the controller 80 determines that even if the chip C exists in the rectangular area 2 , if the ejector 41 moves below the rectangular area 2 , it will come into contact with the support ring 23 , the ejector 41 will move below the rectangular area 2 . (Naturally, chip C is not picked up either), and counts up to the next suction position (rectangular area 3).
  • the control unit 80 moves the camera 53 above the replaced ejector 41 and images the ejector 41 with the camera 53 . Accordingly, based on the image data GD2 captured by the camera 53, the type of the replaced ejector 41 can be specified. Therefore, the data of the outer diameter R2 of the ejector 41 can be updated to the data after replacement (S20, S30). From the above, even if the ejector 41 is replaced and the value of the outer diameter R2 changes before and after the replacement, the ejector 41 can be prevented from contacting the support ring 23 by using the data of the outer diameter R2 after the replacement. Additionally, the movement of the ejector 41 can be restricted.
  • the storage unit 85 of the control unit 80 preliminarily stores registered images and outer diameters R2 corresponding to the types of the ejector 41 on a one-to-one basis. Then, the control unit 80 identifies the type of the ejector 41 by comparing the image data GD2 and the registered image, and acquires the outer diameter R2 corresponding to the type of the ejector 41 . As a result, the outer diameter R2 can be acquired without directly measuring the outer diameter R2 during execution of the flow, and the tact time of the component pick-up device 13 can be improved.
  • the component pick-up device 13 has a camera 53 .
  • the camera 53 is used not only to identify the types of the pallet 20 and the ejector 41, but also to confirm the position of the chip C to be picked up (S60, S70). By using one camera 53 for a plurality of purposes, an increase in cost can be suppressed.
  • Embodiment 2 The configuration of the component pick-up device 113 of Embodiment 2 will be described with reference to FIGS. 9 and 10.
  • FIG. The configuration of Embodiment 2 differs from that of Embodiment 1 in that the ejector 141 has an RFID tag (an example of an "information recording section") 47, and the head unit 150A has an RFID reader (an example of an "information reading section") 60. They are different in that respect. Note that the same reference numerals as those of the first embodiment are used, and detailed descriptions thereof are omitted.
  • the RFID tag 47 is a small piece of resin-molded IC chip in which identification information unique to the ejector 141 is recorded.
  • the RFID tag 47 is attached to the side surface of the ejector 141 as shown in FIG.
  • the RFID reader 60 transmits radio waves in the RF band toward the RFID tag 47 and receives radio waves transmitted by the RFID tag 47 in response. At this time, the RFID reader 60 can read the identification information recorded on the RFID tag 47 without contact.
  • the identification information of the ejector 141 recorded in the RFID tag 47 is the ejector type and outer diameter R2.
  • FIG. 10 shows an example of the correspondence relationship between the signals A to C transmitted by the RFID tag 47 attached to the ejector 141, the type of ejector, and the outer diameter of the ejector.
  • the RFID reader 60 receives the C signal
  • the RFID reader 60 reads the ejector type "TYPE_003" and the outer diameter R2 value "25 mm" as identification information.
  • the RFID reader 60 transmits the read identification information to the control unit 80, and the control unit 80 acquires the ejector type (TYPE_003) and outer diameter R2 (25 mm).
  • the RFID reader 60 can read the identification information of the ejector 141 without contact. Also, even if the ejector 141 and the RFID tag 47 are located at a position that cannot be imaged by the camera 53, the control unit 80 can acquire the identification information of the ejector 141.
  • FIG. 9 For example, as shown in FIG. 9, when there is a sheet S or a chip C between the ejector 141 and the RFID reader 60, the camera 53 cannot image the ejector 141.
  • FIG. by using the RFID reader 60 , it is possible to acquire the identification information of the ejector 141 from the RFID tag 47 and transmit it to the control section 80 .
  • the type of the ejector 41 is specified by comparing the image data GD2 of the ejector 41 and the registered image.
  • means for identifying the type of ejector 41 from the image data GD2 is not limited to this.
  • the ejector 41 may have an identifier 46 at a position that does not overlap the pin 41a.
  • FIG. 12 shows the correspondence between the type and outer diameter R2 of the ejector 41 stored in the storage unit 85 and the identifier 46. As shown in FIG.
  • the type of the ejector 41 is recorded in the identifier 46. Although a two-dimensional code is used as the identifier 46 in the example of FIG.
  • the calculation unit 86 identifies the type of the ejector 41 from the identifier 46 reflected in the image data GD2, and acquires the outer diameter R2 corresponding to the type of the ejector 41 from the storage unit 85. FIG.
  • the information to be pre-stored in the storage unit 85 is, as shown in FIG. Images (image information) are not required. Character information generally has a smaller amount of information than image information. Therefore, even if the storage capacity of the storage unit 85 is small, the information of the ejector 41 can be stored as character information.
  • the information recorded in the identifier 46 may be the outer diameter R2 in addition to the type of the ejector 41 or instead of the type of the ejector 41.
  • the calculation unit 86 acquires the outer diameter R2 by reading the identifier 46 .
  • the storage unit 85 may not store the type of the ejector 41 and the value of the outer diameter R2.
  • the outer diameter R2 may be directly calculated from the image data GD2.
  • FIG. 13 schematically shows a case where the upper surface of the ejector 41 is entirely within the field of view 53a of the camera 53.
  • the outer diameter R2 can be calculated by recognizing the outer edge 41b of the ejector 41 with the image processing unit 84 in the image data GD2 showing the inside of the visual field range 53a.
  • the upper surface of the ejector 41 may not fit inside the visual field range 53a.
  • points B1 and B2 on the outer edge 41b are recognized from the respective image data GD2 at the 0° position and the 180° position on the circular outer edge 41b, and the distance between the two points is obtained.
  • a diameter R2 can be calculated.
  • the outer diameter R2 of the ejector 41 can be obtained without comparing the image data GD2 with the registered image or reading the identifier 46. As a result, even if there is no registered image corresponding to the ejector 41 on a one-to-one basis in the storage unit 85, or if the reading of the identifier 46 fails, the outer diameter R2 can be obtained based on the image data GD2.
  • the component mounting apparatus 10 may have a mounting head for mounting the chip C on the mounting surface M1 in addition to the suction head 51 .
  • the suction head 51 picks up the chip C from the pallet 20 and then transfers the chip C to the mounting head.
  • the calculation unit 86 acquires the inner diameter R1 based on the identifier 25 of the pallet 20 captured by the camera 53 .
  • the inner diameter R1 may be obtained by other means as well.
  • the pallet 20 may have an RFID tag, and by reading the RFID tag with an RFID reader, the computing unit 86 may acquire the inner diameter R1.
  • the image data GD1 of the identifier 25 and the image data GD2 of the ejector 41 are obtained using the camera 53, respectively.
  • the camera that images the identifier 25 and the camera that images the ejector 41 may be different cameras.
  • the RFID tag 47 is attached to the side surface of the ejector 41 , but it may be attached to the upper surface or the lower surface of the ejector 41 . Alternatively, it may be embedded inside the ejector 41 .
  • the identification information recorded in the RFID tag 47 may be only the "ejector type" of the ejector 141.
  • the storage unit 85 stores the "ejector type” and "outer diameter R2" shown in FIG. , is read from the storage unit 85 and acquired.
  • the control unit 80 identifies the type of the palette 20 by performing image recognition on the image data GD1 of the identifier 25 .
  • the process of recognizing the image data GD1 may be omitted.
  • the dimension of the inner diameter R1 of the support ring 23 may be stored in advance in the storage unit 85, and the moving range of the ejector 41 may be restricted using the data.
  • an acquisition unit such as the camera 53 is used to acquire identification information or an image of the pallet 20, and the acquired identification information
  • the size of the inner diameter R1 of the support ring 23 may be obtained by determining the type from the image. Then, the movement range of the ejector 41 may be restricted using the acquired inner diameter R1.
  • the component pick-up devices 13 and 113 hold the pallet 20 on which the sheet S is stretched, and pick up the chips C from the sheet S.
  • the pallet 20 has a structure in which a support ring 23 is attached to a pallet body 26. - ⁇
  • the component pick-up device in the present disclosure is not limited to holding the pallet 20.
  • the component pick-up device may have a structure that directly holds the support ring 23 on which the sheet S is stretched and picks up the chip C from the sheet S.
  • the pallet 20 (pallet body 26) may be eliminated and the support ring 23 may be directly assembled to the component pick-up device.
  • a component pick-up device of this type has a mechanism for directly holding the support ring 23 .
  • the mechanism for directly holding the support ring 23 a known mechanism can be used.
  • the support ring 23 may be assembled to the pallet body 26 via connecting members.
  • the pallet 20 has a configuration in which the pallet body 26, the connecting member, and the support ring 23 are connected in order from bottom to top.
  • a locking portion 21 may be provided on this connecting member.
  • a plurality of locking portions 21 are provided so as to surround the support ring 23 , and the expand ring 24 is fixed to the plurality of locking portions 21 , similarly to the contents of ⁇ Description of the Pallet> of the first embodiment.
  • the expand ring 24 is fixed near the upper surface of the pallet body 26 by the connecting member (locking portion 21). The distance between the chips C attached to the sheet S is increased through the connecting member (locking portion 21).
  • the support ring 23 described so far is one of the constituent elements of the pallet 20 .
  • the support ring 23 may also be a component of the component pick-up device.
  • the component pickup device includes, for example, a transport mechanism that transports the expand ring 24 toward the support ring 23, a holding mechanism that holds the expand ring 24 transported by the transport mechanism, and the expand ring 24 held by the holding mechanism. and a stretching mechanism for stretching the sheet S by. From another point of view, it can be said that the component pick-up device may have an auto-expanding mechanism.
  • the camera 53 and the RFID reader 60 are exemplified as the acquisition unit.
  • the acquisition unit for example, a laser displacement gauge that acquires the shape and dimensions of an object (ejector 41, pallet 20, etc.) using laser light may be used.
  • the outer diameter R2 (the diameter of the ejector 41 when viewed from above) is used as the information about the ejector 41 stored in the storage unit 85 .
  • the information of the ejector 41 may be data including the dimension in the height direction (Z direction) in addition to the outer diameter R2.
  • the support ring 23 is attached to the pallet body 26 so as to be vertically movable.
  • the support ring 23 may be fixed relative to the pallet body 26 .
  • the support ring 23 may be fixed to the pallet body 26 by screwing or fitting.
  • the support ring 23 is fixed by any method so as to protrude upward from the upper surface of the pallet body.
  • the component pickup device 13 may have a mechanism for vertically moving the expand ring 24 with respect to the pallet body 26 .
  • the expansion process is performed as follows. First, the expand ring 24 to which the sheet S is attached is placed above the support ring 23 and lowered toward the pallet body 26 . After the sheet S contacts the opening on the upper surface of the support ring 23, the expand ring 24 is further lowered to approach the pallet body 26 and is locked by the retractable locking portion 21. - ⁇ At this time, the sheet S is stretched by being pulled obliquely downward from the opening edge of the upper surface of the support ring 23, and the expansion process is performed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de prélèvement de composant 13 conçu pour positionner une bague de support 23 comportant un trou traversant 22 qui la traverse dans la direction verticale et pour prélever un composant C à partir d'une feuille de fixation de composant S qui est étirée sur un côté de surface supérieure de la bague de support 23 de façon à recouvrir le trou traversant 22. Le dispositif de prélèvement de composant 13 comprend un éjecteur 41 qui se déplace à l'intérieur du trou traversant 22 de la bague de support 23 et qui pousse le composant C vers le haut depuis le dessous de la feuille de fixation de composant S, une tête de mandrin 51 qui serre et prélève le composant C qui a été poussé vers le haut par l'éjecteur 41, une unité d'acquisition 53 qui acquiert des informations concernant l'éjecteur 41 ou une image de ce dernier, et une unité de commande 80. L'unité de commande 80 acquiert des dimensions de l'éjecteur 41 sur la base des informations concernant l'éjecteur 41 ou l'image de ce dernier, acquises par l'unité d'acquisition 53 et, sur la base des dimensions acquises de l'éjecteur 41 et des dimensions du trou traversant 22, commande le déplacement de l'éjecteur 41 à l'intérieur du trou traversant 22 de façon à éviter le contact de l'éjecteur 41 avec la bague de support 23.
PCT/JP2021/021405 2021-06-04 2021-06-04 Dispositif de prélèvement de composant, dispositif de montage de composant WO2022254703A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202180098046.XA CN117581344A (zh) 2021-06-04 2021-06-04 元件拾取装置、元件安装装置
KR1020237035021A KR20230156402A (ko) 2021-06-04 2021-06-04 부품 픽업 장치, 부품 실장 장치
DE112021007233.1T DE112021007233T5 (de) 2021-06-04 2021-06-04 Bauelementaufnahmevorrichtung, Bestückungsautomat
JP2023525321A JPWO2022254703A1 (fr) 2021-06-04 2021-06-04
PCT/JP2021/021405 WO2022254703A1 (fr) 2021-06-04 2021-06-04 Dispositif de prélèvement de composant, dispositif de montage de composant
TW110144365A TWI793882B (zh) 2021-06-04 2021-11-29 零件拾取裝置、零件安裝裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/021405 WO2022254703A1 (fr) 2021-06-04 2021-06-04 Dispositif de prélèvement de composant, dispositif de montage de composant

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WO2022254703A1 true WO2022254703A1 (fr) 2022-12-08

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JP (1) JPWO2022254703A1 (fr)
KR (1) KR20230156402A (fr)
CN (1) CN117581344A (fr)
DE (1) DE112021007233T5 (fr)
TW (1) TWI793882B (fr)
WO (1) WO2022254703A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230301A (ja) * 2000-02-17 2001-08-24 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ装置
JP2012222054A (ja) * 2011-04-05 2012-11-12 Fuji Mach Mfg Co Ltd ダイ位置判定システム。
WO2015059749A1 (fr) * 2013-10-21 2015-04-30 富士機械製造株式会社 Dispositif de ramassage et pot de poussée vers le haut

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251986A (ja) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd ウエーハの分離検出方法および分離検出装置
JP5730537B2 (ja) 2010-11-03 2015-06-10 富士機械製造株式会社 ダイ供給システム
JP5936847B2 (ja) * 2011-11-18 2016-06-22 富士機械製造株式会社 ウエハ関連データ管理方法及びウエハ関連データ作成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230301A (ja) * 2000-02-17 2001-08-24 Matsushita Electric Ind Co Ltd 半導体チップのピックアップ装置
JP2012222054A (ja) * 2011-04-05 2012-11-12 Fuji Mach Mfg Co Ltd ダイ位置判定システム。
WO2015059749A1 (fr) * 2013-10-21 2015-04-30 富士機械製造株式会社 Dispositif de ramassage et pot de poussée vers le haut

Also Published As

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CN117581344A (zh) 2024-02-20
TW202249586A (zh) 2022-12-16
DE112021007233T5 (de) 2024-01-11
JPWO2022254703A1 (fr) 2022-12-08
KR20230156402A (ko) 2023-11-14
TWI793882B (zh) 2023-02-21

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