WO2022220289A1 - インクジェット用及びエアキャビティ形成用硬化性組成物、電子部品、及び電子部品の製造方法 - Google Patents

インクジェット用及びエアキャビティ形成用硬化性組成物、電子部品、及び電子部品の製造方法 Download PDF

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Publication number
WO2022220289A1
WO2022220289A1 PCT/JP2022/017861 JP2022017861W WO2022220289A1 WO 2022220289 A1 WO2022220289 A1 WO 2022220289A1 JP 2022017861 W JP2022017861 W JP 2022017861W WO 2022220289 A1 WO2022220289 A1 WO 2022220289A1
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Prior art keywords
compound
curable composition
weight
meth
thermosetting
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PCT/JP2022/017861
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English (en)
French (fr)
Japanese (ja)
Inventor
悠介 藤田
貴志 渡邉
満 谷川
佳史 杉沢
智也 田中
孝徳 井上
大地 濱田
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2023514684A priority Critical patent/JPWO2022220289A1/ja
Priority to US18/279,446 priority patent/US12610853B2/en
Priority to MX2023010085A priority patent/MX2023010085A/es
Priority to CN202280028402.5A priority patent/CN117223097A/zh
Priority to KR1020237021288A priority patent/KR20230172453A/ko
Publication of WO2022220289A1 publication Critical patent/WO2022220289A1/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/008—Sequential or multiple printing, e.g. on previously printed background; Mirror printing; Recto-verso printing; using a combination of different printing techniques; Printing of patterns visible in reflection and by transparency; by superposing printed artifacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to a curable composition for inkjet and for forming an air cavity, which is applied by using an inkjet device.
  • the present invention also relates to an electronic component using the curable composition and a method for producing the electronic component.
  • the communication filter has an air cavity (space) made of the RDL layer and metal.
  • air cavities are formed using sheet materials such as photosensitive polyimide resin sheets and epoxy resin sheets (for example, Patent Document 1 below).
  • the manufacturing cost of the conventional air cavity forming method using sheet material is high, and the manufacturing process is complicated. Further, in the conventional method of forming an air cavity using a sheet material, when the peripheral portion of the filter structure is molded with resin, the resin may penetrate the sheet material and enter the air cavity. In order to improve the reliability of the communication filter, it is necessary that the resin does not enter the air cavity. Therefore, better sealing performance is required. If the air cavity can be well formed by a method other than the method using the sheet material, it contributes to the reduction of the manufacturing cost and the simplification of the manufacturing process.
  • a method of forming an air cavity by applying a curable composition to a predetermined region using an inkjet device and curing the applied curable composition is conceivable.
  • the first member and the second An air cavity can be formed by the member and the cured product layer.
  • the properties of the curable composition for inkjet used for air cavity applications include the ability to increase the aspect ratio of the cured product layer, the ability to increase the adhesive strength between the first and second members and the cured product layer, and A performance that can improve the sealing property is required.
  • An object of the present invention is to provide a curable composition for inkjet and air cavity formation, which can form a cured product layer with a large aspect ratio and can improve adhesiveness and sealing properties.
  • Another object of the present invention is to provide an electronic component using the curable composition and a method for producing the electronic component.
  • a photocurable compound having a (meth)acryloyl group or a vinyl group and no cyclic ether group, and a heat-curable compound having no (meth)acryloyl group and having a cyclic ether group The content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition for inkjet and air cavity formation, and the illuminance is 2000 mW/cm 2 with light having a wavelength of 365 nm.
  • the viscosity of the B-staged product at 40 ° C. is 2.5 ⁇ 10 2 Pa s or more 3
  • a curable composition for inkjet and air cavity formation (hereinafter sometimes abbreviated as “curable composition”) having a viscosity of 0 ⁇ 10 6 Pa ⁇ s or less is provided.
  • the photocurable compound is a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and a (meth)acryloyl group and a second photocurable compound having two or more vinyl groups in total.
  • the first photocurable compound is a photocurable compound having one (meth) acryloyl group
  • the second photocurable compound is , a photocurable compound having two or more (meth)acryloyl groups.
  • the curable composition according to the present invention does not contain or contains a photo- and thermosetting compound having a (meth) acryloyl group and a cyclic ether group, the photo- and thermosetting compound
  • the photo- and thermosetting compound When not included, in 100% by weight of the photocurable compound, the content of the second photocurable compound is 5% by weight or more and 25% by weight or less, and when the photocurable and thermosetting compounds are included
  • the content of the second photocurable compound is 4% by weight or more and 20% by weight or less in 100% by weight of the total content of the photocurable compound and the photo-curable and thermosetting compounds.
  • the curable composition contains a thermosetting agent.
  • thermosetting agent contains an amine compound.
  • a broad aspect of the present invention comprising a first member, a second member, and a bonding portion bonding the top surface of the first member and the side surface or bottom surface of the second member,
  • An air cavity is formed by the first member, the second member, and the bonding portion, and the bonding portion is a cured product of the above-described curable composition for inkjet and for forming an air cavity.
  • An electronic component is provided.
  • the ratio of the height of the bonding portion to the width of the bonding portion is 1.0 or more.
  • a coating step of forming a curable composition layer by applying the curable composition described above using an inkjet device on the surface of the first member, and irradiating with light A photocuring step of forming a B-stage compound layer by proceeding with curing of the curable composition layer, and a thermosetting step of thermally curing the B-stage compound layer by heating, wherein the coating step and the light A method for producing an electronic component, wherein in the curing step, coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-stage compound layer in contact with the side surface or the lower surface of the second member.
  • the curable composition for inkjet and air cavity formation according to the present invention comprises a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group, and a (meth)acryloyl group. and a thermosetting compound having a cyclic ether group.
  • the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition for ink jetting and air cavity formation according to the present invention.
  • the curable composition for inkjet and air cavity formation is irradiated with light having a wavelength of 365 nm so that the illuminance is 2000 mW/cm 2 to obtain a B-staged product.
  • the viscosity of the B-staged product at 40° C. is 2.5 ⁇ 10 2 Pa ⁇ s or more and 3.0 ⁇ 10 6 Pa ⁇ s or less. Since the curable composition for inkjet and for forming an air cavity according to the present invention has the above configuration, it is possible to form a cured product layer having a large aspect ratio, and to improve adhesion and sealing properties. be able to.
  • FIG. 1 is a cross-sectional view schematically showing an electronic component obtained by using the curable composition for inkjet and air cavity formation according to the first embodiment of the present invention.
  • 2A to 2C are cross-sectional views for explaining each step of the method of manufacturing the electronic component shown in FIG.
  • 3D to 3G are cross-sectional views for explaining each step of the method of manufacturing the electronic component shown in FIG.
  • curable composition for inkjet and air cavity formation The curable composition for inkjet and for forming an air cavity (hereinafter sometimes abbreviated as "curable composition") according to the present invention is applied and used using an inkjet device.
  • the curable composition according to the present invention is different from a curable composition applied by screen printing and is different from a curable composition applied by a dispenser.
  • the curable composition according to the present invention includes a photocurable compound having a (meth)acryloyl group or a vinyl group and having no cyclic ether group, and a (meth)acryloyl group and having a cyclic ether group. and a thermosetting compound.
  • the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition according to the present invention.
  • photocurable compound having a (meth)acryloyl group or vinyl group and no cyclic ether group may be referred to as "(A) photocurable compound”.
  • thermosetting compound having no (meth)acryloyl group and having a cyclic ether group may be referred to as "(B) thermosetting compound”.
  • the curable composition according to the present invention contains (A) a photocurable compound and (B) a thermosetting compound, and in 100% by weight of the curable composition according to the present invention, (B) thermosetting
  • the content of the active compound is 5% by weight or more.
  • the curable composition according to the present invention when the curable composition was irradiated with light having a wavelength of 365 nm so that the illuminance was 2000 mW / cm 2 to obtain a B-staged product, the B-staged product was heated to 40 ° C. is 2.5 ⁇ 10 2 Pa ⁇ s or more and 3.0 ⁇ 10 6 Pa ⁇ s or less.
  • the curable composition according to the present invention has the above configuration, it is possible to form a cured product layer with a large aspect ratio, and to improve adhesion and sealing properties.
  • the curable composition according to the present invention can form a cured product layer having a high ratio of height to width. Since the curable composition according to the present invention can form a cured product layer having a large aspect ratio, the distance between the members to be bonded (the distance between the first member and the second member) is set to the desired distance. can be controlled.
  • the curable composition according to the present invention can further increase the adhesive strength between the member to be adhered (the first member and the second member) and the cured product of the curable composition (bonded portion).
  • the air cavity can be formed satisfactorily.
  • the electronic component in which the air cavity is formed using the curable composition according to the present invention even when the reflow process is performed, separation between the first and second members and the adhesive portion is less likely to occur.
  • the curable composition according to the present invention may or may not contain a photocurable and thermosetting compound having a (meth)acryloyl group and a cyclic ether group.
  • thermosetting compound having a (meth)acryloyl group and a cyclic ether group may be referred to as "(C) photo- and thermosetting compound”.
  • the curable composition is a photo- and thermo-curable composition because it contains (A) a photo-curable compound and (B) a thermo-curable compound.
  • the curable composition is preferably cured by heating after being cured by irradiation with light.
  • the curable composition for inkjet and air cavity formation is irradiated with light having a wavelength of 365 nm at an illuminance of 2000 mW/cm 2 to obtain a B-stage product.
  • the B-staged product has a viscosity at 40° C. of 2.5 ⁇ 10 2 Pa ⁇ s or more and 3.0 ⁇ 10 6 Pa ⁇ s or less. If the B-staged product has a viscosity of less than 2.5 ⁇ 10 2 Pa ⁇ s at 40° C., it may be difficult to form a cured product layer with a large aspect ratio or to improve sealing properties. be. If the B-staged product has a viscosity of more than 3.0 ⁇ 10 6 at 40° C., it may be difficult to improve the adhesiveness or the sealing property.
  • the viscosity of the B-staged product at 40° C. is preferably 3.0 ⁇ 10 3 Pa.s or more, more preferably 4.0 ⁇ 10 3 Pa.s or more, and still more preferably 5.0 ⁇ 10 3 Pa. ⁇ s or more, more preferably 7.5 ⁇ 10 3 Pa ⁇ s or more, particularly preferably 1.0 ⁇ 10 4 Pa ⁇ s or more, most preferably 2.0 ⁇ 10 4 Pa ⁇ s or more.
  • the viscosity of the B-staged product at 40° C. is preferably 1.0 ⁇ 10 6 Pa ⁇ s or less, more preferably 3.0 ⁇ 10 5 Pa ⁇ s or less, still more preferably 1.0 ⁇ 10 5 Pa ⁇ s or less. s or less.
  • the viscosity of the B-staged product at 40°C may be 7.5 ⁇ 10 3 Pa ⁇ s or less, or may be 6.5 ⁇ 10 3 Pa ⁇ s or less.
  • the B-stage product for measuring the viscosity at 40° C. is irradiated with light having an integrated light amount of 20000 mJ/cm 2 so that the illuminance at a wavelength of 365 nm is 2000 mW/cm 2 . It is obtained by irradiating a cavity-forming curable composition.
  • the viscosity of the B-staged product at 40 ° C. is measured using a viscoelasticity measuring device (for example, "Viscoelasticity measuring device ARES" manufactured by TA Instruments) at 40 ° C., measuring plate: parallel with a diameter of 8 mm Measured under conditions of a plate and a frequency of 1 Hz.
  • a viscoelasticity measuring device for example, "Viscoelasticity measuring device ARES" manufactured by TA Instruments
  • measuring plate parallel with a diameter of 8 mm Measured under conditions of a plate and a frequency of 1 Hz.
  • the viscosity of the B-staged product means complex viscosity ( ⁇ *).
  • a method of adjusting the viscosity of the B-staged product at 40 ° C. within a preferable range for example, (A) a method of appropriately selecting the type of photocurable compound, and the first photocurable compound described later and Examples thereof include a method of adjusting the content of the second photocurable compound, which will be described later.
  • (meth)acryloyl means one or both of “acryloyl” and “methacryloyl”
  • (meth)acrylate means one or both of "acrylate” and “methacrylate”. means both.
  • the CH 2 ⁇ CH group possessed by the (meth)acryloyl group is not included in the vinyl group.
  • the curable composition contains (A) a photocurable compound.
  • the photocurable compound is a photocurable compound having a (meth)acryloyl group or a vinyl group and no cyclic ether group.
  • the photocurable compound may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. .
  • a (meth)acryloyl group and a vinyl group are photocurable functional groups.
  • the photocurable compound does not have an epoxy group (cyclic ether group), for example.
  • As for a photocurable compound only 1 type may be used and 2 or more types may be used together.
  • the photocurable compound may contain a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group.
  • it contains a second photocurable compound having two or more (meth)acryloyl groups and vinyl groups in total.
  • the first photocurable compound has one (meth)acryloyl group and no vinyl group, or has no (meth)acryloyl group and one vinyl group.
  • the second photocurable compound may have a total of two (meth)acryloyl groups and vinyl groups, three groups, or three or more groups.
  • the photocurable compound comprises a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group; ) a second photocurable compound having a total of two or more acryloyl groups and vinyl groups.
  • first photocurable compound and the second photocurable compound may be used alone, or two or more of them may be used in combination.
  • the photocurable compound preferably has a (meth)acryloyl group.
  • the photocurable compound is preferably a (meth)acrylate compound.
  • the first photocurable compound has one (meth)acryloyl group.
  • the second photocurable compound is preferably a photocurable compound having two or more (meth)acryloyl groups. That is, the first photocurable compound is preferably a monofunctional (meth)acrylate compound, and the second photocurable compound is preferably a polyfunctional (meth)acrylate compound.
  • Examples of the monofunctional (meth)acrylate compound that is the first photocurable compound include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n -butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3 - hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate ) acrylate, phenyl (meth) acrylate
  • the second photocurable compound may be a bifunctional (meth)acrylate compound or a trifunctional (meth)acrylate compound.
  • the second photocurable compound may be a tri- or higher functional (meth)acrylate compound or a tetra- or higher functional (meth)acrylate compound.
  • the second photocurable compound may be a (meth)acrylate compound having two (meth)acryloyl groups, or may be a (meth)acrylate compound having three (meth)acryloyl groups.
  • the second photocurable compound may be a (meth)acrylate compound having 3 or more (meth)acryloyl groups, or a (meth)acrylate compound having 4 or more (meth)acryloyl groups. good.
  • the second photocurable compound may be a (meth)acrylate compound having 10 or less (meth)acryloyl groups.
  • bifunctional (meth)acrylate compound examples include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1, 10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol (meth)acrylate, ethoxylated cyclohexanemethanol Di(meth)acrylate, ethoxylated bisphenol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol diol (Meth)acrylates, 2-ethyl-2
  • trifunctional (meth)acrylate compound examples include, for example, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth) ) acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid alkylene oxide-modified tri(meth)acrylate, dipentaerythritol tri(meth)acrylate propionate, tri( (Meth)acryloyloxyethyl)isocyanurate, sorbitol tri(meth)acrylate and the like.
  • tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate. is mentioned.
  • pentafunctional (meth)acrylate compounds examples include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.
  • hexafunctional (meth)acrylate compounds include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.
  • Examples of (A) photocurable compounds having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide. is mentioned.
  • the content of (A) the photocurable compound is preferably 2% by weight or more, more preferably 5% by weight or more, still more preferably 10% by weight or more, and particularly preferably 15% by weight. % or more.
  • the content of (A) the photocurable compound is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% by weight or less, and still more preferably 60% by weight. % by weight or less, more preferably 50% by weight or less, and particularly preferably 40% by weight or less.
  • the content of the first photocurable compound is preferably 2% by weight or more, more preferably 5% by weight or more, still more preferably 10% by weight or more, preferably 55% by weight. % or less, more preferably 45 wt % or less, and still more preferably 35 wt % or less.
  • the content of the first photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the first photocurable compound in 100% by weight of the curable composition is preferably 5% by weight. Above, more preferably 10% by weight or more, still more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, still more preferably 35% by weight or less.
  • the content of the first photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the first photocurable compound in 100% by weight of the curable composition is preferably 2% by weight or more. , more preferably 5% by weight or more, still more preferably 10% by weight or more, preferably 65% by weight or less, more preferably 60% by weight or less, and still more preferably 55% by weight or less.
  • the content of the first photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the second photocurable compound in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 3% by weight or more, and preferably 25% by weight. % or less, more preferably 15 wt % or less, still more preferably 10 wt % or less.
  • the content of the second photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the second photocurable compound in 100% by weight of the curable composition is preferably 5% by weight. Above, more preferably 6% by weight or more, still more preferably 7% by weight or more, preferably 25% by weight or less, more preferably 20% by weight or less, still more preferably 15% by weight or less.
  • the content of the second photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the second photocurable compound in 100% by weight of the curable composition is preferably 4% by weight or more. , more preferably 5% by weight or more, still more preferably 6% by weight or more, preferably 20% by weight or less, more preferably 18% by weight or less, still more preferably 16% by weight or less.
  • the content of the second photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the total content of the first photocurable compound and the second photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, More preferably 15% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less.
  • the total content is at least the lower limit and at most the upper limit, the effects of the present invention can be exhibited more effectively.
  • the first photocurable compound and the second photocurable compound in 100% by weight of the curable composition, is preferably 10% by weight or more, more preferably 15% by weight or more, and still more preferably 20% by weight or more.
  • the first photocurable compound and the second photocurable compound in 100% by weight of the curable composition, is preferably 80% by weight or less, more preferably 70% by weight or less, and still more preferably 60% by weight or less.
  • the total content is at least the lower limit and at most the upper limit, the effects of the present invention can be exhibited more effectively.
  • the curable composition contains (C) a photocurable compound and a thermosetting compound, in 100% by weight of the curable composition, the first photocurable compound and the second photocurable compound
  • the total content is preferably 5% by weight or more, more preferably 10% by weight or more, and still more preferably 15% by weight or more.
  • the curable composition contains (C) a photocurable compound and a thermosetting compound, in 100% by weight of the curable composition, the first photocurable compound and the second photocurable compound
  • the total content is preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is at least the lower limit and at most the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the first photocurable compound is preferably 25% by weight or more, more preferably 30% by weight or more, still more preferably 35% by weight or more, preferably It is 90% by weight or less, more preferably 80% by weight or less, and even more preferably 75% by weight or less.
  • the content of the first photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the second photocurable compound in 100% by weight of the photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, preferably It is 60% by weight or less, more preferably 55% by weight or less, and even more preferably 50% by weight or less.
  • the content of the second photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the content of the second photocurable compound in 100% by weight of the (A) photocurable compound is preferably 5 % by weight or more, more preferably 10% by weight or more, preferably 25% by weight or less, and more preferably 20% by weight or less.
  • the content of the second photocurable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be exhibited more effectively.
  • the total content of (A) the photocurable compound and (C) the photocurable compound and the thermosetting compound is 100% by weight.
  • the content of the second photocurable compound is preferably 4% by weight or more, more preferably 10% by weight or more, preferably 20% by weight or less, and more preferably 15% by weight or less.
  • the curable composition contains (B) a thermosetting compound.
  • the thermosetting compound is a thermosetting compound that does not have a (meth)acryloyl group and has a cyclic ether group.
  • a cyclic ether group is a thermosetting functional group.
  • the thermosetting compound only one type may be used, or two or more types may be used in combination.
  • thermosetting compound examples include an epoxy group and the like.
  • thermosetting compound may have only one type of cyclic ether group, or may have two or more types.
  • the cyclic ether group of the thermosetting compound (B) is preferably an epoxy group.
  • the thermosetting compound preferably has an epoxy group.
  • the thermosetting compound is preferably an epoxy compound.
  • thermosetting compound may contain a first thermosetting compound having one cyclic ether group, and may contain a second thermosetting compound having two or more cyclic ether groups. good.
  • the thermosetting compound may contain an epoxy compound having one epoxy group (monofunctional epoxy compound), and may contain an epoxy compound having two or more epoxy groups (polyfunctional epoxy compound). You can Each of the first thermosetting compound and the second thermosetting compound may be used alone, or two or more thereof may be used in combination.
  • thermosetting compound (B) preferably contains an epoxy compound having two or more epoxy groups, and an epoxy compound having two or more epoxy groups. It is more preferable to have
  • thermosetting compound (B) preferably contains an epoxy compound having two epoxy groups, and is an epoxy compound having two epoxy groups. is more preferred.
  • epoxy compounds examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, and naphthalene type epoxy compounds.
  • fluorene type epoxy compound, phenol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, dicyclopentadiene type epoxy compound, anthracene type epoxy compound, epoxy compound having adamantane skeleton, epoxy compound having tricyclodecane skeleton, naphthylene ether type Epoxy compounds, epoxy compounds having a triazine core in the skeleton, and the like are included.
  • the content of the thermosetting compound (B) is preferably 10% by weight or more, more preferably 15% by weight or more, still more preferably 20% by weight or more, preferably 50% by weight. Below, more preferably 40% by weight or less, still more preferably 35% by weight or less.
  • the content of the thermosetting compound is at least the above lower limit and below the above upper limit, the effect of the present invention can be more effectively exhibited, and the cured product of the member to be bonded and the curable composition ( The bonding strength with the bonding portion) can be further increased.
  • the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, and still more preferably is at least 17% by weight, particularly preferably at least 20% by weight, most preferably at least 30% by weight.
  • the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably is 65% by weight or less.
  • the curable composition may or may not contain (C) a photocurable compound and a thermosetting compound.
  • Photo- and thermosetting compound is a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group. From the viewpoint of further increasing the adhesive strength between the member to be bonded and the cured product (bonded portion) of the curable composition, the curable composition preferably contains (C) a light and thermosetting compound.
  • a (meth)acryloyl group is a photocurable functional group
  • a cyclic ether group is a thermosetting functional group.
  • As for the light and thermosetting compounds only one type may be used, or two or more types may be used in combination.
  • the photocurable and thermosetting compound may have one (meth)acryloyl group, or may have two or more.
  • Examples of the cyclic ether group possessed by the photocurable and thermosetting compound include an epoxy group and the like.
  • the photocurable and thermosetting compound may have only one type of cyclic ether group, or may have two or more types.
  • the cyclic ether group of is preferably an epoxy group.
  • the photocurable and thermosetting compound preferably has a (meth)acryloyl group and an epoxy group.
  • the photocurable and thermosetting compound may have one cyclic ether group, two cyclic ether groups, or two or more cyclic ether groups.
  • the photocurable and thermosetting compound may have one epoxy group, two epoxy groups, or two or more epoxy groups.
  • Photo- and thermosetting compounds include glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, and the like.
  • the photocurable and thermosetting compound preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether. More preferably, (C) the photo- and thermosetting compound comprises 4-hydroxybutyl acrylate glycidyl ether. In this case, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be adhered and the cured product (bonded portion) of the curable composition can be further increased.
  • the content of (C) the light and thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% by weight. % by weight or less, more preferably 60% by weight or less.
  • the content of the light and thermosetting compound is at least the above lower limit and below the above upper limit, the effect of the present invention can be more effectively exhibited, and the member to be bonded and the curable composition are cured. It is possible to further increase the adhesive strength with an object (adhesion portion).
  • the total content of (A) the photocurable compound and (C) the photocurable and thermosetting compound is preferably 15% by weight or more, more preferably 20% by weight or more, More preferably 30% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% by weight or less.
  • the total content is equal to or more than the lower limit and equal to or less than the upper limit, the effect of the present invention can be exhibited more effectively, and the bonding target member and the cured product (bonded portion) of the curable composition Adhesive strength can be further increased.
  • the total content of (B) the thermosetting compound and (C) the light and thermosetting compound is preferably 17% by weight or more, more preferably 20% by weight or more, More preferably 25% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less.
  • the total content is equal to or more than the lower limit and equal to or less than the upper limit, the effect of the present invention can be exhibited more effectively, and the bonding target member and the cured product (bonded portion) of the curable composition Adhesive strength can be further increased.
  • the curable composition preferably contains a photopolymerization initiator. Only one kind of the photopolymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • photopolymerization initiator examples include photoradical polymerization initiators and photocationic polymerization initiators.
  • the photopolymerization initiator is preferably a radical photopolymerization initiator.
  • the photoradical polymerization initiator is a compound that generates radicals upon exposure to light and initiates a radical polymerization reaction.
  • the radical photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; Acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]- 2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl )-butanone-1,
  • Anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropyl Thioxanthone compounds such as thioxanthone; Ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Acylphos such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide Fin oxide compounds; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H- Oxime ester compounds
  • a photopolymerization initiation aid may be used together with the photoradical polymerization initiator.
  • the photopolymerization initiation aid include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine and triethanolamine.
  • Photopolymerization initiation aids other than these may be used. Only one type of the photopolymerization initiation aid may be used, or two or more types may be used in combination.
  • a titanocene compound such as CGI-784 (manufactured by Ciba Specialty Chemicals) that absorbs in the visible light region may be used to promote the photoreaction.
  • photocationic polymerization initiator examples include sulfonium salts, iodonium salts, metallocene compounds and benzoin tosylate. Only one kind of the photocationic polymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, still more preferably 1% by weight or more, preferably 30% by weight. % by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less.
  • the curable composition preferably contains a thermosetting agent. Only one kind of the thermosetting agent may be used, or two or more kinds thereof may be used in combination.
  • thermosetting agent examples include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds and acid anhydrides.
  • a modified polyamine compound such as an amine-epoxy adduct may be used as the thermosetting agent.
  • Thermosetting agents other than these may be used.
  • the amine compound means a compound having one or more primary to tertiary amino groups.
  • examples of the amine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives.
  • amine compound examples include epoxy compound-added polyamine (reaction product of epoxy compound and polyamine), Michael-added polyamine (reaction product of ⁇ , ⁇ -unsaturated ketone and polyamine), Mannich-added polyamine (condensation of polyamine with formalin and phenol adducts), thiourea-added polyamines (reaction products of thiourea and polyamines), and ketone-blocked polyamines (reaction products of ketone compounds and polyamines [ketimine]).
  • epoxy compound-added polyamine reaction product of epoxy compound and polyamine
  • Michael-added polyamine reaction product of ⁇ , ⁇ -unsaturated ketone and polyamine
  • Mannich-added polyamine condensation of polyamine with formalin and phenol adducts
  • thiourea-added polyamines reaction products of thiourea and polyamines
  • ketone-blocked polyamines reaction products of ketone compounds and polyamines [ketimine]
  • aliphatic polyamines examples include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.
  • alicyclic polyamine examples include mensenediamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adducts, bis(4-amino-3-methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane and the like.
  • aromatic polyamine examples include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4 -diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[( 4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-dia
  • hydrazide examples include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.
  • guanidine derivative examples include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanidide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, ⁇ , ⁇ -hexamethylenebis[ ⁇ -(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, diethylcyanoacetylguanidine, and the like.
  • phenol compounds include polyhydric phenol compounds.
  • examples of the polyhydric phenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, A xylylene skeleton-containing phenol novolac resin, a dicyclopentadiene skeleton-containing phenol novolac resin, a fluorene skeleton-containing phenol novolac resin, and the like are included.
  • Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, dodecyl succinic anhydride, chlorendic anhydride, pyromellitic anhydride, Examples include benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.
  • thermosetting agent is preferably a thermosetting agent other than an acid anhydride.
  • Acid anhydrides are relatively volatile compounds. Therefore, by using a thermosetting agent other than an acid anhydride, it is possible to suppress contamination of electronic parts due to volatilization of the thermosetting agent. Moreover, by using a thermosetting agent other than an acid anhydride, it is possible to further increase the adhesive strength between the member to be adhered and the cured product of the curable composition (adhesion portion).
  • the thermosetting agent preferably contains an amine compound, and is preferably an amine compound.
  • the amine compound is preferably an aromatic amine compound.
  • the adhesive strength between the member to be bonded and the cured product of the curable composition (bonded portion) can be further increased.
  • the content of the thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, still more preferably 10% by weight or more, preferably 40% by weight or less, and more It is preferably 30% by weight or less, more preferably 25% by weight or less.
  • the curable composition may or may not contain a curing accelerator. Only one kind of the curing accelerator may be used, or two or more kinds thereof may be used in combination.
  • curing accelerator examples include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organic metal salts, phosphorus compounds and urea compounds.
  • the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 10% by weight or less, more preferably 5% by weight. % or less.
  • the curable composition may or may not contain a solvent. Only one kind of the solvent may be used, or two or more kinds thereof may be used in combination.
  • Examples of the solvent include water and organic solvents.
  • the solvent is preferably an organic solvent.
  • organic solvent examples include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol, and methyl carbitol.
  • butyl carbitol propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether and other glycol ethers, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol Acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, esters such as propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum solvents such as petroleum ether and naphtha. mentioned.
  • the smaller the content of the solvent in the curable composition the better.
  • the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight. 5% by weight or less. Most preferably, the curable composition does not contain the solvent.
  • the curable composition may contain components other than the components described above.
  • the above-mentioned other components are not particularly limited, but include adhesion aids such as coupling agents, fillers, leveling agents, antifoaming agents, polymerization inhibitors, and the like.
  • the viscosity of the curable composition at 25° C. and 10 rpm is preferably 3 mPa ⁇ s or more, more preferably 5 mPa ⁇ s or more, still more preferably 10 mPa ⁇ s or more, still more preferably 160 mPa ⁇ s or more, preferably 2000 mPa. ⁇ s or less, more preferably 1600 mPa ⁇ s or less, and still more preferably 1500 mPa ⁇ s or less.
  • the viscosity of the curable composition at 25 ° C. and 10 rpm is 160 mPa s or more, 1600 mPa ⁇ s or less is particularly preferable.
  • the above viscosity is measured at 25°C using an E-type viscometer (for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
  • E-type viscometer for example, "TVE22L” manufactured by Toki Sangyo Co., Ltd.
  • the height of the curable composition is It is preferable to be able to form a B-staged material having a ratio of width to width (height/width) (aspect ratio) of 1.0 or more.
  • the curable composition is preferably capable of forming a B-staged product in which the ratio (height/width) is 1.5 or more, and the ratio (height/width) is 2.0 or more.
  • the curable composition is capable of forming a B-staged product in which the ratio (height/width) is 1.0 or more, a cured product layer having a large ratio (height/width) (aspect ratio) is formed. can be formed, and the adhesion and sealing properties can be further enhanced.
  • the ratio (height/width) may be 100 or less, 50 or less, 10 or less, or 5.0 or less.
  • a B-staged product for measuring the above ratio (height/width) can be formed by the following method.
  • the curable composition is applied to form a curable composition layer (application step).
  • the curable composition layer is irradiated with light having an integrated light amount of 200 mJ/cm 2 so that the illuminance at a wavelength of 365 nm is 2000 mW/cm 2 , and the curable composition layer is cured to proceed with the B-staged product (B staged layer) is formed (photocuring step).
  • coating and the photocuring step coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-stage compound (B-stage compound layer).
  • a cured product layer having a high ratio of height to width can be formed.
  • the curable composition according to the present invention can be suitably used to form a cured product layer having a height to width ratio (height/width) (aspect ratio) of 1.0 or more (height to the width (height/width) (aspect ratio) of 1.0 or more).
  • the ratio (height/width) of the cured product layer is preferably 1.5 or more, more preferably 2.0 or more, still more preferably 2.5 or more, and may be 100 or less, or 50 or less. , 10 or less, or 5.0 or less.
  • the curable composition can be used to bond the first member and the second member, and to form an air cavity.
  • An electronic component having an air cavity can be produced using the curable composition.
  • the curable composition is preferably a curable composition used for bonding the upper surface of the first member and the side surface or the lower surface of the second member, and the upper surface of the first member and the side surface of the second member.
  • the curable composition may be a curable composition used for bonding the upper surface of the first member and the side surfaces and upper surface of the second member.
  • An electronic component according to the present invention comprises a first member, a second member, and a bonding portion bonding an upper surface of the first member and a side surface or a lower surface of the second member, An air cavity is formed by the first member, the second member, and the bonding portion.
  • the adhesive portion is a cured product of the above-described curable composition for inkjet and air cavity formation.
  • the method for manufacturing the electronic component described above include the following steps (1) to (3).
  • the coating and photocuring are repeated in the thickness direction of the curable composition layer, thereby contacting the side surface or the lower surface of the second member. It is preferred to form a B-staged layer.
  • FIG. 1 is a cross-sectional view schematically showing an electronic component obtained using the curable composition for inkjet and air cavity formation according to the first embodiment of the present invention.
  • the electronic component 10 shown in FIG. 1 includes a first member 1, a second member 2, an adhesive portion 3, solder balls 41, a resin sheet 42, connection terminals 43, and a molded resin portion 44. .
  • the adhesion portion 3 is a cured product of the curable composition described above.
  • the adhesion portion 3 is a light and heat cured product of the curable composition described above.
  • the bonding portion 3 bonds the top surface of the first member 1 and the side and top surfaces of the second member 2 .
  • the adhesive portion 3 is arranged on the upper surface of the first member 1 .
  • the bonding portion 3 is arranged on the side surface of the second member 2 and arranged on the upper surface of the second member 2 .
  • the bonding portion 3 is arranged on a part of the upper surface of the first member 1 and is arranged on a part of the side surface and the entire upper surface of the second member 2 .
  • the adhesive portion 3 is not arranged on the lower surface of the second member 2 .
  • An air cavity R is formed by the first member 1 , the second member 2 and the bonding portion 3 .
  • the mold resin portion 44 is arranged on the outer surface of the bonding portion 3 .
  • the first member 1 is a circuit board and the second member 2 is a semiconductor chip.
  • Electronic component 10 is a communication filter.
  • the adhesive portion may or may not be arranged on the upper surface of the second member. Further, in the electronic component, the adhesive portion may or may not be arranged on the lower surface of the second member. In the electronic component, the adhesive portion may be arranged on the lower surface of the second member and not arranged on the side surface.
  • FIG. 1 An example of a method for manufacturing the electronic component shown in FIG. 1 will be described with reference to FIGS. 2(a) to (c) and FIGS. 3(d) to (g).
  • a curable composition is applied onto the surface of the first member 1 using an inkjet device to form a curable composition layer 3A (application step).
  • a curable composition is applied to the upper surface of the first member 1 to form a curable composition layer 3A.
  • a curable composition is discharged from the discharge section 51 of the inkjet device.
  • the curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device, and the curing of the curable composition layer 3A is advanced to obtain a B-stage product.
  • a layer 3B is formed (photocuring step).
  • the B-staged material layer 3B is a pre-cured material layer of a curable composition.
  • the entire applied curable composition may be irradiated with light to form a B-stage compound layer.
  • the B-staged material layer may be formed by irradiating the applied curable composition with light every time a plurality of drops of the curable composition are applied.
  • the B-staged material layer may be formed by irradiating the applied curable composition with light every time one drop of the curable composition is applied.
  • the photo-curing step it is determined whether or not to repeat the coating step and the photo-curing step.
  • the curable composition is coated on the surface side opposite to the first member side of the formed B-stage compound layer.
  • FIGS. 2(c) and 3(d) are diagrams showing the second coating process and the second photocuring process, respectively.
  • a curable composition is applied to the surface of the B-stage compound layer 3B opposite to the first member 1 side, and the surface of the B-stage compound layer 3B is A curable composition layer 3A is formed thereon.
  • the applied curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to form the B-stage compound layer 3B.
  • the coating step and the photocuring step are performed in the thickness direction of the curable composition layer in FIGS. ) are performed twice.
  • the thickness of the B-stage compound layer can be increased, and the ratio of the B-stage compound layer (height ( thickness)/width) (aspect ratio) can be increased.
  • Each of the coating step and the photocuring step may be performed twice or more, or may be performed three times or more.
  • coating and photocuring step coating and photocuring are repeated to form a B-stage compound layer 3B in contact with the side surface of the second member 2, as shown in FIG. 3(e).
  • a B-stage compound layer 3B is formed in contact with the side surface and the upper surface of the second member 2. As shown in FIG.
  • the B-stage compound layer 3B is thermally cured by heating (thermal curing step).
  • the B-stage compound layer 3B is thermally cured.
  • the adhesion part 3 is formed.
  • the adhesive part 3 is a photo- and thermosetting material layer of a curable composition.
  • Ultraviolet rays are preferably irradiated in the photo-curing step.
  • the illuminance and irradiation time of the ultraviolet rays in the photocuring step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition.
  • the UV illuminance in the photocuring step may be, for example, 1000 mW/cm 2 or more, 5000 mW/cm 2 or more, 10000 mW/cm 2 or less, or 8000 mW/cm 2 or less.
  • the UV irradiation time in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less. good too.
  • the heating temperature and heating time in the thermosetting step can be appropriately changed according to the composition of the curable composition and the thickness of the B-staged material layer.
  • the heating temperature in the thermosetting step may be, for example, 100° C. or higher, 120° C. or higher, 250° C. or lower, or 200° C. or lower.
  • the heating time in the thermosetting step may be, for example, 5 minutes or longer, 30 minutes or longer, 600 minutes or shorter, or 300 minutes or shorter.
  • the ratio of the height of the bonding portion to the width of the bonding portion is preferably 1.0 or more, more preferably 1.5 or more, still more preferably 2.0 or more, and particularly preferably 2. .5 or more.
  • the upper limit of the ratio (height/width) is not particularly limited.
  • the ratio (height/width) of the bonding portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, the ratio (height/width) is preferably 5.0 or less.
  • the width, height, shape, etc. of the above-mentioned adhesive portion can be changed as appropriate.
  • the width of the bonding portion is preferably the width of the bonding portion at the contact surface between the surface of the first member and the bonding portion.
  • the width of the bonding portion may be 50 ⁇ m or more, 100 ⁇ m or more, 150 ⁇ m or more, and 250 ⁇ m or less. , 230 ⁇ m or less, or 200 ⁇ m or less.
  • the height of the adhesive portion is preferably the distance from the contact surface between the surface of the first member and the adhesive portion to the maximum height position of the adhesive portion.
  • the distance from the contact surface between the surface of the first member and the bonding portion to the maximum height position of the bonding portion may be 100 ⁇ m or more, 200 ⁇ m or more, or 300 ⁇ m or more. 500 ⁇ m or less, 450 ⁇ m or less, or 400 ⁇ m or less.
  • a circuit board or the like is mentioned as the first member.
  • Examples of the second member include a semiconductor chip.
  • ((A) photocurable compound) Monofunctional (meth)acrylate compound 1: 2-ethylhexyl acrylate ("AEH” manufactured by Nippon Shokubai Co., Ltd.) Monofunctional (meth)acrylate compound 2: isobornyl acrylate (“IBOA” manufactured by Nippon Shokubai Co., Ltd.) Bifunctional (meth)acrylate compound 1: ethoxylated bisphenol diacrylate A ("ABE-300” manufactured by Shin-Nakamura Chemical Co., Ltd.) Bifunctional (meth)acrylate compound 2: tricyclodecanedimethanol diacrylate (“IRR-214K” manufactured by Daicel-Ornex) Bifunctional (meth)acrylate compound 3: Polyester-based urethane acrylate ("UA4400” manufactured by Shin-Nakamura Chemical Co., Ltd.) Trifunctional (meth)acrylate compound: trimethylolpropane triacrylate (“TMPTA” manufactured by Daicel Allnex) Hexafunctional (meth
  • Bifunctional epoxy compound 1 Bisphenol A type epoxy compound ("YD127” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
  • Bifunctional epoxy compound 2 glycidylamine type epoxy compound ("JER630” manufactured by Mitsubishi Chemical Corporation)
  • Bifunctional epoxy compound 3 Bisphenol F type epoxy compound (“YDF-170” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
  • Bifunctional epoxy compound 4 dicyclopentadiene dimethanol diglycidyl ether (ADEKA "EP-4088S”)
  • Photoinitiator 1 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one (manufactured by BASF "Irgacure379")
  • Photoinitiator 2 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone (manufactured by BASF "Irgacure369")
  • Heat curing agent heat curing agent 1: 1,3-bis(3-aminophenoxy)benzene ("APBN” manufactured by Mitsui Chemicals, Inc.)
  • Thermosetting agent 2 4,4'-diaminodiphenyl ether ("4,4'-DADPE” manufactured by Mitsui Chemicals Fine Co., Ltd.)
  • Examples 1 to 22 and Comparative Examples 1 to 5 The components shown in Tables 1 to 5 were blended in the amounts shown in Tables 1 to 5 and uniformly mixed to obtain a curable composition for inkjet and air cavity formation (curable composition).
  • Viscosity of B-stage product at 40° C the illuminance at a wavelength of 365 nm measured with an illuminometer (“UIT-201” manufactured by Ushio Inc.) was 2000 mW/cm 2 . Light was irradiated for 10 seconds using an exposure apparatus (ultra-high pressure mercury lamp, "JL-4300-3" manufactured by ORC Manufacturing Co., Ltd.) adjusted so as to have a cumulative light intensity of 20,000 mJ/cm 2 . The viscosity of the obtained B-staged product at 40 ° C.
  • Viscoelasticity measuring device ARES manufactured by TA Instruments
  • a semiconductor wafer (thickness: 0.7 mm) was prepared.
  • the resulting curable composition was applied onto the surface of this semiconductor wafer using an inkjet device to form a curable composition layer (application step).
  • the curable composition layer was irradiated with light to progress curing of the curable composition layer to form a B-stage compound layer (photocuring step).
  • the light irradiation in the photo-curing step was performed using a UV-LED lamp with a main wavelength of 365 nm under the conditions of 2000 mW/cm 2 ⁇ 0.1 seconds (accumulated light quantity 200 mJ/cm 2 ).
  • a B-staged layer with an aspect ratio of 2.5 means a B-staged layer with a height of 250 ⁇ m and a width of 100 ⁇ m.
  • a B-stage compound layer having an aspect ratio of 2.5 or more can be formed
  • a B-stage compound layer having an aspect ratio of 2.0 or more and less than 2.5 can be formed
  • a silicon bare chip that looks like a semiconductor chip (length 3 mm x width 3 mm x thickness 750 ⁇ m) is placed using a die bonder, and pressurized at 40 ° C. and 0.1 MPa for 1 second, A laminate (1) of a silicon wafer, a B-stage compound layer, and a silicon bare chip was obtained. Next, the laminate (1) was placed in an oven at 170° C. and heated for 1 hour to thermally cure the B-stage compound layer. In this way, a laminate (2) of the silicon wafer, the bonding portion (light and thermosetting material layers of the curable composition), and the silicon bare chip was obtained. Using a die shear strength measuring device ("Dage series 4000" manufactured by Dage), the die shear strength of the laminate (2) was measured at a test temperature of 260°C.
  • Dage series 4000 manufactured by Dage
  • Die shear strength at 260° C. is 20 N or more
  • Die shear strength at 260 ° C. is 11 N or more and less than 20 N
  • Die shear strength at 260 ° C. is less than 11 N
  • a structure was prepared in which electronic components (semiconductor chips) of 1 mm length ⁇ 1 mm width ⁇ 0.25 mm thickness were mounted at 40 locations in 4 rows ⁇ 10 columns on a BGA substrate (0.3 mm thick, organic substrate). A commercially available solder resist is applied to the surface of the structure.
  • the BGA substrate corresponds to the first member described below
  • the electronic component corresponds to the second member described below.
  • the resulting curable composition was applied onto the surface of the first member using an inkjet device to form a curable composition layer (application step).
  • the curable composition layer was irradiated with light to progress curing of the curable composition layer to form a B-stage compound layer (photocuring step).
  • the light irradiation in the photo-curing step was performed under the conditions of 2000 mW/cm 2 ⁇ 0.1 seconds using a UV-LED lamp with a main wavelength of 365 nm.
  • the coating step and the photocuring step were repeated in the thickness direction of the curable composition layer to form a B-stage compound layer in contact with the side surface of the second member.
  • a laminated structure including the first member, the second member, and the B-stage compound layer was obtained.
  • the obtained laminated structure was placed in an oven at 170° C. and heated for 1 hour to thermally cure the B-stage compound layer (thermal curing step).
  • a laminate structure including the first member, the second member, and the adhesive portion was obtained.
  • a resin was placed outside the adhesive portion to form a mold resin portion under conditions of 150° C., 3 MPa, and 300 seconds to obtain an electronic component for evaluation.
  • Moisture absorption reflow test and mold test The obtained electronic component for evaluation was allowed to stand for 168 hours under conditions of 85° C. and 85 RH% humidity to absorb moisture. Then, the evaluation electronic component was passed through a solder reflow oven (preheating 150° C. ⁇ 100 seconds, reflow [maximum temperature 260° C.]) for 5 cycles. Next, the electronic component for evaluation was observed using an ultrasonic inspection imaging device ("mi-scope hyper II" manufactured by Hitachi Kenki Finetech Co., Ltd.), and the mold resin entered the air cavity of the electronic component for evaluation. It was confirmed whether or not Sealability (moisture absorption reflow test and mold test) was evaluated according to the following criteria.
  • ⁇ Determination Criteria for Sealability (Moisture Absorption Reflow Test and Mold Test)> ⁇ : Out of 40 electronic components for evaluation, the number of electronic components for evaluation in which the mold resin entered the air cavity was 0. ⁇ : Among 40 electronic components for evaluation, the mold resin entered the air cavity. 1 or more and 10 or less of the electronic components for evaluation were defective. ⁇ : The number of electronic components for evaluation in which the mold resin had entered the air cavity was 11 or more among the 40 electronic components for evaluation. be

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PCT/JP2022/017861 2021-04-15 2022-04-14 インクジェット用及びエアキャビティ形成用硬化性組成物、電子部品、及び電子部品の製造方法 Ceased WO2022220289A1 (ja)

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MX2023010085A MX2023010085A (es) 2021-04-15 2022-04-14 Composicion curable para la formacion de cavidades de aire e inyeccion de tinta, componente electronico y metodo para fabricar un componente electronico.
CN202280028402.5A CN117223097A (zh) 2021-04-15 2022-04-14 喷墨用及气腔形成用固化性组合物、电子部件及电子部件的制造方法
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050688A1 (ja) * 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
JP2014237814A (ja) * 2013-05-09 2014-12-18 積水化学工業株式会社 インクジェット用硬化性組成物及びインクジェット塗布装置
JP2018067676A (ja) * 2016-10-21 2018-04-26 デクセリアルズ株式会社 半導体装置の製造方法
JP2018074566A (ja) * 2016-08-25 2018-05-10 ゼネラル・エレクトリック・カンパニイ 埋め込みｒｆフィルタパッケージ構造およびその製造方法

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JP2010278971A (ja) 2009-06-01 2010-12-09 Murata Mfg Co Ltd 弾性波装置
JP5992962B2 (ja) 2013-07-02 2016-09-14 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050688A1 (ja) * 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
JP2014237814A (ja) * 2013-05-09 2014-12-18 積水化学工業株式会社 インクジェット用硬化性組成物及びインクジェット塗布装置
JP2018074566A (ja) * 2016-08-25 2018-05-10 ゼネラル・エレクトリック・カンパニイ 埋め込みｒｆフィルタパッケージ構造およびその製造方法
JP2018067676A (ja) * 2016-10-21 2018-04-26 デクセリアルズ株式会社 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024195693A1 (ja) * 2023-03-23 2024-09-26 株式会社Adeka 組成物、接着剤、硬化物の製造方法及び硬化物

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