WO2022206646A1 - 电源芯片检测电路、电源芯片检测方法、装置和电子设备 - Google Patents

电源芯片检测电路、电源芯片检测方法、装置和电子设备 Download PDF

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Publication number
WO2022206646A1
WO2022206646A1 PCT/CN2022/083238 CN2022083238W WO2022206646A1 WO 2022206646 A1 WO2022206646 A1 WO 2022206646A1 CN 2022083238 W CN2022083238 W CN 2022083238W WO 2022206646 A1 WO2022206646 A1 WO 2022206646A1
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Prior art keywords
voltage
signal
power chip
component
conversion unit
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PCT/CN2022/083238
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English (en)
French (fr)
Inventor
祝文祥
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/40—Testing power supplies
    • G01R31/42—AC power supplies

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  • the present application belongs to the field of electronic technology, and in particular relates to a power chip detection circuit, a power chip detection method, device and electronic equipment.
  • the power chip is a power device. When the power chip fails, it will have a great impact on the safe operation of electronic equipment.
  • whether the power supply chip is faulty is determined mainly by reading the data of the register in the power supply chip, so as to take corresponding measures to avoid the power supply chip running in a fault state.
  • it is impossible to determine whether the chip is faulty through the data in the register which may cause the power chip to continue to operate in a faulty state, jeopardizing the safety of electronic equipment.
  • the purpose of the embodiments of the present application is to provide a power chip detection circuit, a power chip detection method, an apparatus, and an electronic device, which can solve the problem that it is impossible to determine whether the chip is faulty through the data in the register.
  • an embodiment of the present application provides a power chip detection circuit, the power chip has switch pins, and includes a connected voltage isolation unit and a voltage conversion unit;
  • the voltage isolation unit is connected to the switch pin, and is used to obtain the switch voltage signal on the switch pin, isolate the DC component in the switch voltage signal, and output the switch voltage to the voltage conversion unit AC component in the signal;
  • the voltage conversion unit is used for converting the AC component and outputting a signal to indicate whether the power supply chip is faulty.
  • an embodiment of the present application provides a power supply chip detection method, which is applied to the power supply chip detection circuit described in the first aspect, wherein the power supply chip has switch pins, and the method includes:
  • the voltage isolation unit obtains the switch voltage signal on the switch pin
  • the voltage isolation unit isolates the DC component in the switching voltage signal, and outputs the AC component in the switching voltage signal to the voltage conversion unit;
  • the voltage conversion unit converts the AC component, and outputs a signal to indicate whether the power supply chip is faulty.
  • an embodiment of the present application provides a power chip detection method, which is applied to the power chip detection circuit described in the first aspect, and the method includes:
  • the signal it is determined whether the power chip is faulty.
  • an embodiment of the present application provides a power chip detection device, which is applied to the power chip detection circuit described in the first aspect, and the device includes:
  • the acquisition module is used to acquire the signal output by the power chip detection circuit
  • a judging module configured to determine whether the power chip is faulty according to the signal.
  • an embodiment of the present application provides an electronic device, including the power chip detection circuit according to the first aspect, and the power chip detection device according to the fourth aspect.
  • the power supply chip detection circuit includes a voltage isolation unit and a voltage conversion unit, and the voltage isolation unit can obtain the switch voltage signal on the switch pin in the power supply chip, and isolate the DC component in the switch voltage signal to obtain the switch voltage
  • the AC component in the signal, the voltage conversion unit can convert the AC component into a signal indicating whether the power chip is faulty.
  • the AC component in the switching voltage signal is converted into a signal that can indicate whether the power chip is faulty through the power chip detection circuit, and whether the power chip is faulty can be accurately determined according to the signal, thereby solving the problem of inability to determine whether the power chip is faulty.
  • FIG. 1 is a schematic diagram of a circuit structure of a power supply chip provided by an embodiment of the present application
  • FIG. 2 is a schematic waveform diagram of a switching voltage signal provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a power chip detection circuit provided by an embodiment of the present application.
  • FIG. 4 is a circuit schematic diagram of a power chip detection circuit provided by an embodiment of the present application.
  • FIG. 5 is an application schematic diagram of a power chip detection circuit provided by an embodiment of the present application.
  • Fig. 6 is the simulation result schematic diagram of the circuit schematic diagram shown in Fig. 4;
  • FIG. 7 is an application schematic diagram of another power chip detection circuit provided by an embodiment of the present application.
  • FIG. 8 is a flowchart of steps of a power chip detection method provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a power chip detection device provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of an electronic device provided according to an exemplary embodiment
  • FIG. 12 is a schematic diagram of a hardware structure of an electronic device according to an exemplary embodiment.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • FIG. 1 is a schematic diagram of the circuit structure of a power supply chip provided by an embodiment of the present application.
  • Direct Current-Direct Current (DC-DC) type circuit structure such as charge pump (charge pump) type and step-down (BUCK) type power chip.
  • the power chip may include a first switch element 101 , a second switch element 102 , an energy storage element 103 and a filter element 104 .
  • FIG. 1 is a schematic diagram of the circuit structure of a power supply chip provided by an embodiment of the present application.
  • DC-DC Direct Current-Direct Current
  • the power chip may include a first switch element 101 , a second switch element 102 , an energy storage element 103 and a filter element 104 .
  • the first switching element 101 and the second switching element 102 may be N-type metal oxide semiconductor field effect transistors (N-Metal-Oxide-Semiconductor, NMOS), the energy storage element 103 may be an inductor, a filter element 104 may be a capacitor.
  • the first switching element 101, the energy storage element 103 and the filter element 104 are connected in series to form a first current branch; one end of the second switching element 102 is connected to the connection point between the first switching element 101 and the energy storage element 103, the first Two switching elements 102 , energy storage elements 103 and filter elements 104 are connected in series to form a second current branch.
  • first switching element 101 not connected to the energy storage element 103 is used to connect the positive pole of the input voltage
  • the second switching element 102 is not connected to the energy storage element 103 and one end of the first switching element 101 and the filter element 104 are not connected to the energy storage element 103
  • One end is connected to the negative pole of the input voltage
  • the connection point between the energy storage element 103 and the filter element 104 is connected to the load.
  • the connection points among the first switch element 101 , the second switch element 102 and the energy storage element 103 constitute the switch pins of the power chip. It should be noted that the specific types of the first switch element, the second switch element, the energy storage element and the filter element can be set according to requirements, which are not limited in this implementation.
  • FIG. 2 is a schematic waveform diagram of a switching voltage signal provided by an embodiment of the present application.
  • the abscissa is the time axis
  • the ordinate is the voltage axis.
  • the power chip switches alternately between the first state and the second state, and the switching voltage signal switches between high level and low level, forming a square wave as shown in Figure 2.
  • the maximum value of the square wave is 5V, and the minimum value is 5V.
  • the value is 0V.
  • this embodiment provides a power chip detection circuit, a power chip detection method, an apparatus and an electronic device.
  • the power chip detection circuit provided by the embodiment of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.
  • FIG. 3 is a schematic structural diagram of a power chip detection circuit provided by an embodiment of the present application.
  • the power chip detection circuit is used to detect a power chip with switch pins, and may include: a connected voltage isolation unit and a voltage conversion unit.
  • the voltage isolation unit is connected to the switch pin, and is used to obtain the switch voltage signal on the switch pin, as well as the DC component in the isolation switch voltage signal, and output the AC component in the switch voltage signal to the voltage conversion unit; the voltage conversion unit uses It converts the AC component and outputs a signal to indicate whether the power chip fails.
  • the voltage isolation unit is used to collect the switch voltage signal on the switch pin, and isolate the DC component in the switch voltage signal to obtain the AC component in the switch voltage signal.
  • the voltage conversion power supply is used to convert the AC component in the switching voltage signal to obtain a signal that can indicate whether the power supply chip is faulty.
  • the voltage isolation unit includes an isolation capacitor and a branch resistor connected in series;
  • the end of the isolation capacitor not connected to the branch resistor is used to connect the switch pin, and the end of the branch resistor not connected to the isolation capacitor is grounded;
  • connection point between the isolation capacitor and the branch resistor is connected to the voltage conversion unit to output the AC component to the voltage conversion unit.
  • FIG. 4 is a circuit schematic diagram of a power chip detection circuit provided by an embodiment of the present application.
  • the power chip detection circuit 200 includes a voltage isolation unit and a voltage conversion unit, and the voltage isolation unit includes a series-connected isolation capacitor 201 and The branch resistor 202, the isolation capacitor 201 is not connected to the branch resistor 202 and one end forms the input end of the voltage isolation unit, which is used to connect the switch pin to collect the switch voltage signal on the switch pin, and the other end of the isolation capacitor 201 is connected to the branch circuit
  • the resistor 202 and the isolation capacitor 201 are used to isolate the DC component in the switch voltage signal.
  • the branch resistor 202 is used to provide a current branch for the AC component in the switching voltage signal, and the connection point between the isolation capacitor 201 and the branch resistor 202 constitutes the voltage isolation unit.
  • the output terminal is used to output the AC component in the switching voltage signal.
  • the specific structure of the voltage isolation unit can be flexibly set according to requirements, which is not limited in this embodiment.
  • FIG. 5 is a schematic diagram of the application of a power chip detection circuit provided by an embodiment of the present application.
  • the switching voltage signal is a square wave, and the switching voltage signal can be decomposed into a DC component and a waveform. AC component.
  • the isolation capacitor 201 and the branch resistor 202 form a current branch. One end of the isolation capacitor 201 is connected to the switch pin.
  • the isolation capacitor 201 can isolate the DC component in the switch voltage signal, so that the AC component in the switch voltage signal passes through the isolation capacitor 201 and the branch.
  • the current branch formed by the circuit resistor 202 is output, and at this time, the AC component in the switching voltage signal can be collected at the connection point between the isolation capacitor 201 and the branch resistor 202 .
  • the circuit structure of the voltage isolation unit is simple, the structure of the power chip detection circuit can be simplified, and the cost of the power chip detection circuit can be reduced.
  • the voltage conversion unit includes a reverse blocking element and a voltage stabilizing capacitor connected in series;
  • One end of the reverse blocking element not connected to the voltage stabilization capacitor is connected to the voltage isolation unit, and one end of the voltage stabilization capacitor not connected to the reverse blocking element is grounded;
  • the reverse blocking element is used to turn off when the AC component is negative, and turn on when the AC component is positive to output DC at the connection point between the reverse blocking element and the stabilizing capacitor voltage signal.
  • the positive voltage in the AC component can be intercepted by a reverse blocking element, and the positive voltage in the AC component can be regulated by a voltage stabilizing capacitor to obtain a DC voltage signal that can indicate whether the power chip is faulty.
  • the reverse blocking element can be the diode 203 shown in FIG. 4 and FIG. 5
  • the anode of the diode 203 constitutes the input end of the voltage conversion unit, and is used for connecting the output end of the voltage isolation unit to receive the output of the voltage isolation unit. the AC component.
  • the cathode of the diode 203 is connected to the voltage-stabilizing capacitor 204, and one end of the voltage-stabilizing capacitor 204 not connected to the diode 203 is grounded.
  • the connection point between the diode 203 and the voltage-stabilizing capacitor 204 constitutes the output end of the voltage conversion unit for outputting a stable DC voltage signal.
  • the diode 203 can be turned on when the AC component is positive, and output the positive voltage in the AC component to the stabilizing capacitor 204; Voltage interception.
  • the positive voltage in the AC component is input to the stabilizing capacitor, and under the action of the stabilizing capacitor, a stable DC voltage signal is obtained.
  • the reverse blocking element may also be an electronic element such as a triode or a DC switch, and the specific type of the reverse blocking element is not limited in this embodiment.
  • the voltage conversion unit is composed of a reverse blocking element and a voltage stabilizing capacitor, a voltage conversion unit with a simple structure can be obtained, thereby simplifying the circuit structure of the power chip detection circuit and reducing the cost of the power chip detection circuit.
  • the voltage conversion unit is further connected to the controller to output a DC voltage signal to the controller, so that the controller determines that the power supply chip is faulty when the DC voltage signal exceeds a preset voltage range.
  • the input end of the controller 205 can be connected to the connection point between the diode 203 and the stabilizing capacitor 204 to receive the regulated DC voltage signal. After receiving the DC voltage signal, the controller 205 can determine whether the DC voltage signal is within the preset voltage range, and determine whether the power chip is faulty.
  • FIG. 6 is a schematic diagram of the simulation result of the circuit schematic diagram shown in FIG. 4 .
  • the voltage source 300 in FIG. 4 is an analog switch voltage signal
  • the voltage shown in the first coordinate system 601 is the waveform of the analog switch voltage signal.
  • the voltage shown in the second coordinate system 602 is a schematic waveform diagram of the AC component output by the voltage isolation unit
  • the voltage shown in the third coordinate system 603 is a schematic waveform diagram of the DC voltage signal output by the voltage conversion unit.
  • the abscissa is the time axis
  • the ordinate is the voltage axis.
  • the switching voltage signal is a square wave of 5V shown in the first coordinate system.
  • an AC voltage with an amplitude of 3V shown in the second coordinate system is obtained, That is, the AC component in the switching voltage signal; after the AC component passes through the voltage conversion unit, a DC voltage signal of 2.4V shown in the third coordinate system is obtained.
  • the power chip fails, for example, the first switching element in Figure 1 is broken down, a square wave with an amplitude of less than 5V will appear in the switching voltage signal, resulting in a low DC voltage signal output by the voltage conversion unit, less than 2.4V .
  • a square wave with an amplitude higher than 5V may appear in the switching voltage signal, causing the DC voltage signal output by the voltage conversion unit to be higher than 2.4V.
  • the preset voltage range is set to 2-5V
  • the controller receives a DC voltage signal less than 2V or greater than 5V
  • the DC voltage signal is greater than or equal to 2V and less than or equal to 5V
  • the specific value of the preset voltage range can be set according to requirements, which is not limited in this embodiment. It should be noted that when the power chip stops working, the switching voltage signal is 0V, and the DC voltage signal is 0V at this time. Therefore, when the DC voltage signal received by the controller is 0V, it can be determined that the power chip has stopped working.
  • the controller controls the power chip to stop working, if the received DC voltage signal is greater than 0V or less than 0V, it means that the power chip is still working, and it can be determined that the power chip is not controlled by the controller at this time, malfunction. On the contrary, when the controller controls the operation of the power chip, if the received DC voltage signal is 0V, it can be determined that the power chip stops working and a fault occurs.
  • the electronic device determines that the power supply chip is faulty, certain measures can be taken to protect the electronic device. For example, when the power chip fails, the electronic device can output notification information through the display screen or output sound information through the speaker to notify the user of the failure of the power chip. Alternatively, the electronic device can directly shut down the faulty power chip, as well as other chips connected to the power chip, to protect the electronic device. In some cases, the electronic device may also restart the electronic device or turn off the electronic device to protect the electronic device.
  • the preset voltage range can be determined according to the DC voltage signal output by the power chip detection circuit when the power chip does not fail.
  • the voltage V1 output by the voltage isolation unit is related to the capacity C1 of the isolation capacitor and the resistance value R1 of the branch resistor, as well as the voltage V, duty cycle D and frequency f of the switching voltage signal .
  • the differential of the voltage V to the time t multiplied by the capacity C1 of the isolation capacitor is equal to the current i flowing through the isolation capacitor.
  • the specific calculation formula is as follows:
  • the voltage V1 can be calculated by the following formula:
  • the voltage V1 can be calculated by the following formula:
  • ⁇ V represents the voltage per unit time
  • ⁇ t represents the unit time.
  • V1 is proportional to R1, C1, f, V, and inversely proportional to D
  • the voltage V1 can be determined by parameters R1, C1, f, V and D.
  • the parameters R1, C1, f, V and D in different states can be counted, and the voltage V1 in different states can be determined.
  • the voltage V1 and the coefficient of the voltage conversion unit it can be determined that when the power chip does not fail, the DC voltage signal output by the power chip detection circuit in different states, and further according to the DC voltage signal when no failure occurs, it can be determined.
  • Preset voltage range For example, if the power chip does not fail, the minimum DC voltage signal output by the power chip detection circuit is 2V and the maximum DC voltage signal is 5V, then the preset voltage range can be determined to be 2-5V.
  • the power chip detection circuit includes a voltage isolation unit and a voltage conversion unit.
  • the voltage isolation unit can obtain the switch voltage signal on the switch pin in the power chip, and isolate the DC component in the switch voltage signal,
  • the AC component in the switching voltage signal is obtained, and the voltage conversion unit can convert the AC component into a signal indicating whether the power chip is faulty.
  • the AC component in the switching voltage signal is converted into a signal that can indicate whether the power chip is faulty through the power chip detection circuit, and whether the power chip is faulty can be accurately determined through the signal, thereby solving the problem of inability to determine whether the power chip is faulty.
  • the voltage conversion unit includes a rectifier, the input end of the rectifier is connected to the output end of the voltage isolation unit, and the rectifier is used for rectifying the AC component and outputting the DC voltage signal.
  • the voltage conversion unit may include a rectifier. As shown in Figures 4 and 5, the input terminal of the rectifier can be connected to the junction between the isolation capacitor and the branch resistor to receive the AC component of the switching voltage signal. After rectifying the AC component, the rectifier outputs a DC voltage signal that can indicate whether the power chip is faulty.
  • the specific structure and type of the rectifier can be set as required, which is not limited in this embodiment.
  • the AC component in the switching voltage signal is rectified by the rectifier, which can make the obtained DC voltage signal more accurate, so as to more accurately determine whether the power supply chip is faulty.
  • the voltage conversion unit includes a voltage conversion subunit and a voltage comparison subunit;
  • the voltage conversion subunit is used to convert the AC component and output the DC voltage
  • the input end of the voltage comparison subunit is connected with the voltage conversion subunit to receive the DC voltage; the voltage comparison subunit is used for connecting to the controller, and when the comparison determines that the DC voltage exceeds the preset voltage range, it outputs a fault signal to the controller , so that the controller determines that the power chip is faulty when it receives the fault signal.
  • the voltage comparison subunit may be a comparator 206 , and one input end of the comparator 206 is connected to a diode 203 .
  • the connection point between the stabilizing capacitor 204 and the stabilizing capacitor 204 is used to receive the DC voltage, and the other input terminal of the comparator is used to connect the voltage value within the preset range.
  • the output terminal of the comparator 206 can be connected to the input terminal of the controller 205. After receiving the DC voltage, the comparator 206 can compare the DC voltage with the voltage value within the preset range.
  • the controller 205 outputs a high-level signal, which is a fault signal.
  • the controller After the controller receives the high-level signal, it can determine that the power chip is faulty. On the contrary, when the DC voltage is within the preset voltage range, the comparator 206 can output a low-level signal to the controller 205, and the controller can determine that the power chip is normal when receiving the low-level signal.
  • the voltage comparison subunit compares the DC voltage with the voltage value within the preset range to determine whether the power chip is faulty, and when the power chip fails, a fault signal is sent to the controller to notify the controller that the power chip is faulty.
  • the process of collecting high-level signals by the controller is faster than that of collecting analog voltages. Therefore, the method of sending a fault signal to the controller can make the controller determine whether the power chip is faulty more quickly than the method of sending a DC voltage to the controller.
  • FIG. 8 is a flowchart of steps of a power chip detection method provided by an embodiment of the present application, which is applied to the power chip detection circuit as described above, and the method may include:
  • Step 801 The voltage isolation unit acquires the switch voltage signal on the switch pin.
  • Step 802 The voltage isolation unit isolates the DC component in the switch voltage signal, and outputs the AC component in the switch voltage signal to the voltage conversion unit.
  • Step 803 The voltage conversion unit converts the AC component, and outputs a signal to indicate whether the power supply chip is faulty.
  • the voltage conversion unit includes a reverse blocking element and a voltage stabilizing capacitor connected in series;
  • step 803 can be implemented as follows:
  • the reverse blocking element intercepts the positive voltage in the AC component
  • the voltage-stabilizing capacitor stabilizes the positive voltage in the AC component and outputs a DC voltage signal.
  • the voltage conversion unit includes a rectifier
  • step 803 can be implemented as follows:
  • the rectifier rectifies the AC component and outputs a DC voltage signal.
  • the voltage conversion unit includes a connected voltage conversion subunit and a voltage comparison subunit;
  • step 803 can be implemented as follows:
  • the voltage conversion subunit converts the AC component and outputs the DC voltage
  • a fault signal is output to the controller, so that the controller determines that the power chip is faulty when receiving the fault signal.
  • the switch voltage signal on the switch pin is obtained, the DC component in the switch voltage signal is isolated, and the AC component in the switch voltage signal is output to the voltage conversion unit, and the AC component is analyzed by the voltage conversion unit. Converts and outputs a signal to indicate whether the power chip is faulty.
  • the AC component in the switching voltage signal is converted by the power chip detection circuit into a signal that can indicate whether the power chip is faulty, so that it can be accurately determined whether the power chip is faulty, thereby solving the problem that it is impossible to determine whether the power chip is faulty.
  • FIG. 9 is a flowchart of steps of another power chip detection method provided by an embodiment of the present application, which is applied to the power chip detection circuit described in the above-mentioned embodiment, and the method may include:
  • Step 901 Obtain a signal output by a power chip detection circuit.
  • Step 902 according to the signal, determine whether the power chip is faulty.
  • step 901 and step 902 can be performed by the controller 205 shown in FIG. 5 and FIG. 7 , the controller 205 can obtain the signal output by the power chip detection circuit 200, and determine whether the power chip is faulty according to the signal.
  • the controller can acquire the signal output by the power chip detection circuit, and determine whether the power chip fails according to the signal.
  • the AC component in the switching voltage signal is converted by the power chip detection circuit into a signal that can indicate whether the power chip is faulty, so that it can be accurately determined whether the power chip is faulty, thereby solving the problem that it is impossible to determine whether the power chip is faulty.
  • the execution body may be a power chip detection device, or a control module in the power chip detection device for executing the power chip detection method.
  • the power chip detection method provided by the embodiment of the present application is described by taking the power chip detection method performed by the power chip detection device as an example.
  • FIG. 10 is a schematic structural diagram of a power chip detection device provided by an embodiment of the present application.
  • the device 1000 may include:
  • an acquisition module 1001 configured to acquire a signal output by a power chip detection circuit
  • the judging module 1002 is configured to determine whether the power chip is faulty according to the signal.
  • the controller can obtain the signal output by the power chip detection circuit, and determine whether the power chip fails according to the signal.
  • the AC component in the switching voltage signal is converted by the power chip detection circuit into a signal that can indicate whether the power chip is faulty, so that it can be accurately determined whether the power chip is faulty, thereby solving the problem that it is impossible to determine whether the power chip is faulty.
  • the electronic device 1100 includes a processor 1101 and a memory 1102 , which are stored on the memory 1102 and can be accessed in the The program or instruction running on the processor 1101, when the program or instruction is executed by the processor 1101, implements each process of the above embodiment of the power chip detection method, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.
  • the electronic devices in the embodiments of the present application include the aforementioned mobile electronic devices and non-mobile electronic devices.
  • FIG. 12 is a schematic diagram of a hardware structure of an electronic device according to an exemplary embodiment.
  • the electronic device 1200 includes but is not limited to: a radio frequency unit 1201, a network module 1202, an audio output unit 1203, an input unit 1204, a sensor 1205, a display unit 1206, a user input unit 1207, an interface unit 1208, a memory 1209, and a processor 1210, etc. part.
  • the electronic device 1200 may also include a power supply (such as a battery) for supplying power to various components, and the power supply may be logically connected to the processor 1210 through a power management system, so as to manage charging, discharging, and power management through the power management system. consumption management and other functions.
  • a power supply such as a battery
  • the structure of the electronic device shown in FIG. 12 does not constitute a limitation on the electronic device.
  • the electronic device may include more or less components than the one shown, or combine some components, or arrange different components, which will not be repeated here. .
  • the processor 1210 is used to obtain the signal output by the power chip detection circuit
  • the signal it is determined whether the power chip is faulty.
  • the signal output by the power chip detection circuit is obtained, and whether the power chip is faulty is determined according to the signal.
  • the AC component in the switching voltage signal is converted by the power chip detection circuit into a signal that can indicate whether the power chip is faulty, so that it can be accurately determined whether the power chip is faulty, thereby solving the problem that it is impossible to determine whether the power chip is faulty.
  • the electronic device receives a first input of an application program icon, and displays a message preview window corresponding to the application program icon in response to the first input.
  • the message preview window includes target content in at least one notification message received by the application to which the application icon belongs.
  • the user can operate the application icon to display the message preview window corresponding to the application, and preview the notification messages received by the application through the message preview window, which can avoid looking for notification messages in the notification bar. , to avoid wasting time.
  • the input unit 1204 may include a graphics processor (Graphics Processing Unit, GPU) 12041 and a microphone 12042. Such as camera) to obtain still pictures or video image data for processing.
  • the display unit 1206 may include a display panel 12061, which may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like.
  • the user input unit 1207 includes a touch panel 12071 and other input devices 12072 .
  • the touch panel 12071 is also called a touch screen.
  • the touch panel 12071 may include two parts, a touch detection device and a touch controller.
  • Other input devices 12072 may include, but are not limited to, physical keyboards, function keys (such as volume control keys, switch keys, etc.), trackballs, mice, and joysticks, which will not be repeated here.
  • Memory 1209 may be used to store software programs as well as various data, including but not limited to application programs and operating systems.
  • the processor 1210 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the like, and the modem processor mainly processes wireless communication. It can be understood that, the above-mentioned modulation and demodulation processor may not be integrated into the processor 1210.
  • Embodiments of the present application further provide a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, each process of the above-mentioned embodiment of the power chip detection method is implemented, and can achieve The same technical effect, in order to avoid repetition, will not be repeated here.
  • the processor is the processor in the electronic device described in the foregoing embodiments.
  • the readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a magnetic disk or an optical disk, and the like.
  • An embodiment of the present application further provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run a program or an instruction to implement the above embodiment of the power chip detection method and can achieve the same technical effect, in order to avoid repetition, it will not be repeated here.
  • the chip mentioned in the embodiments of the present application may also be referred to as a system-on-chip, a system-on-chip, a system-on-a-chip, or a system-on-a-chip, or the like.

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Abstract

一种电源芯片检测电路（200）、电源芯片检测方法、装置（1000）和电子设备（1100），属于电源检测技术领域。该电源芯片检测电路（200）包括电压隔离单元和电压转换单元，电压隔离单元可以获取电源芯片中开关引脚上的开关电压信号，并隔离开关电压信号中的直流分量，得到开关电压信号中的交流分量，电压转换单元可以将交流分量转换为可以指示电源芯片是否故障的信号。

Description

电源芯片检测电路、电源芯片检测方法、装置和电子设备
相关申请的交叉引用
本申请要求于2021年03月31日提交的申请号为202110352831.5，发明名称为“电源芯片检测电路、电源芯片检测方法、装置和电子设备”的中国专利申请的优先权，其通过引用方式全部并入本申请。
技术领域
本申请属于电子技术领域，具体涉及一种电源芯片检测电路、电源芯片检测方法、装置和电子设备。
背景技术
随着电子技术的发展，手机、笔记本电脑和可穿戴设备等电子设备的功能越来越复杂，电子设备中的电源芯片越来越多。电源芯片为功率器件，电源芯片发生故障时，会对电子设备的安全运行产生较大的影响。
在先技术中，主要通过读取电源芯片中寄存器的数据来确定电源芯片是否发生故障，以采取相应措施，避免电源芯片在故障状态下运行。但是，在一些情况下，通过寄存器中的数据无法确定芯片是否发生故障，此时可能会导致电源芯片在故障状态下继续运行，危害电子设备的安全。
发明内容
本申请实施例的目的是提供一种电源芯片检测电路、电源芯片检测方法、装置和电子设备，能够解决无法通过寄存器中的数据确定芯片是否故障的问题。
第一方面，本申请实施例提供了一种电源芯片检测电路，所述电源芯片具有开关引脚，包括连接的电压隔离单元和电压转换单元；
所述电压隔离单元与所述开关引脚连接，用于获取所述开关引脚上的开关电压信号，以及隔离所述开关电压信号中的直流分量，向所述电压转换单元输出所述开关电压信号中的交流分量；
所述电压转换单元用于对所述交流分量进行转换，输出信号，以指示所述电源芯片是否发生故障。
第二方面，本申请实施例提供了一种电源芯片检测方法，应用于第一方面所述的电源芯片检测电路，所述电源芯片具有开关引脚，所述方法包括：
电压隔离单元获取所述开关引脚上的开关电压信号；
所述电压隔离单元隔离所述开关电压信号中的直流分量，并向电压转换单元输出所述开关电压信号中的交流分量；
所述电压转换单元对所述交流分量进行转换，输出信号，以指示所述电源芯片是否发生故障。
第三方面，本申请实施例提供了一种电源芯片检测方法，应用于第一方面所述的电源芯片检测电路，所述方法包括：
获取电源芯片检测电路输出的信号；
根据所述信号，确定所述电源芯片是否发生故障。
第四方面，本申请实施例提供了一种电源芯片检测装置，应用于第一方面所述的电源芯片检测电路，所述装置包括：
获取模块，用于获取电源芯片检测电路输出的信号；
判断模块，用于根据所述信号，确定所述电源芯片是否发生故障。
第五方面，本申请实施例提供了一种电子设备，包括第一方面所述的电源芯片检测电路，以及第四方面所述的电源芯片检测装置。
在本申请实施例中，电源芯片检测电路包括电压隔离单元和电压转换单元，电压隔离单元可以获取电源芯片中开关引脚上的开关电压信号，并隔离开关电压信号中的直流分量，得到开关电压信号中的交流分量，电压转换单元可以将交流分量转换为指示电源芯片是否故障的信号。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，根据信号可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
附图说明
图1是本申请实施例提供的一种电源芯片的电路结构示意图；
图2是本申请实施例提供的一种开关电压信号的波形示意图；
图3是本申请实施例提供的一种电源芯片检测电路的结构示意图；
图4是本申请实施例提供的一种电源芯片检测电路的电路原理图；
图5是本申请实施例提供的一种电源芯片检测电路的应用示意图；
图6是图4所示电路原理图的仿真结果示意图；
图7是本申请实施例提供的另一种电源芯片检测电路的应用示意图；
图8是本申请实施例提供的一种电源芯片检测方法的步骤流程图；
图9是本申请实施例提供的另一种电源芯片检测方法的步骤流程图；
图10是本申请实施例提供的一种电源芯片检测装置的结构示意图；
图11是根据一示例性实施例提供的一种电子设备的结构示意图；
图12是根据一示例性实施例提供的一种电子设备的硬件结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
为了便于理解本申请的技术方案，首先对本申请涉及的电源芯片进行简单介绍，如图1所示，图1是本申请实施例提供的一种电源芯片的电路结构示意图，电源芯片的拓扑结构为直流转直流(Direct Current-Direct Current，DC-DC)型电路结构，例如电荷泵(charge pump)型和 降压(BUCK)型电源芯片。电源芯片可以包括第一开关元件101、第二开关元件102、储能元件103和滤波元件104。如图1所示，第一开关元件101和第二开关元件102可以为N型金属氧化物半导体场效应晶体管(N-Metal-Oxide-Semiconductor，NMOS)，储能元件103可以为电感，滤波元件104可以为电容。第一开关元件101、储能元件103和滤波元件104依次串联，组成第一电流支路；第二开关元件102的一端连接于第一开关元件101与储能元件103之间的连接点，第二开关元件102、储能元件103和滤波元件104串联，组成第二电流支路。第一开关元件101未连接储能元件103的一端用于连接输入电压的正极，第二开关元件102未连接储能元件103和第一开关元件101的一端与滤波元件104未连接储能元件103的一端连接，用于连接输入电压的负极，储能元件103和滤波元件104之间的连接点连接负载。其中，第一开关元件101、第二开关元件102和储能元件103三者之间的连接点构成电源芯片的开关引脚。需要说明的是，第一开关元件、第二开关元件、储能元件和滤波元件的具体类型可以根据需求设置，本实施对此不做限制。
如图2所示，图2是本申请实施例提供的一种开关电压信号的波形示意图，图2中横坐标为时间轴，纵坐标为电压轴。电源芯片在工作过程中，在第一状态下，第一开关元件101导通，第二开关元件102断开，此时输入电压给储能元件103充电，并为负载供电，开关引脚上的开关电压信号为高电平。在第二状态下，第一开关元件101断开，第二开关元件102导通，此时由储能元件103给负载供电，开关引脚上的开关电压信号为低电平。电源芯片在第一状态与第二状态之间交替切换，开关电压信号在在高电平与低电平之间切换，形成如图2所示的方波，方波的最大值为5V，最小值为0V。
在电子设备的使用过程中，电源芯片的损坏会影响电子设备的安全运行。例如，用于给电子设备充电的电源芯片在充电过程中，电网中的浪涌电流会进入电源芯片，击穿图1所示的NMOS管。此时，在完成充电之后，NMOS管会持续导通，产生大量热量，导致电源芯温度过高，危害电子设备的安全。并且，当NMOS管被击穿之后，在充电过程中，会在电子设备的充电端口产生倒灌电压，腐蚀充电端口。
现有技术中，主要通过读取电源芯片中寄存器的数据来确定电源芯片是否故，而上述故障的出现，无法通过读取寄存器中的数据确定，导致电子设备无法确定电源芯片故障，从而无法采取保护措施保护电子设备。
为了解决无法确定电源芯片是否故障的问题，本实施例提供一种电源芯片检测电路、电源芯片检测方法、装置和电子设备。下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电源芯片检测电路进行详细地说明。
参照图3，图3是本申请实施例提供的一种电源芯片检测电路的结构示意图，电源芯片检测电路用于对具有开关引脚的电源芯片进行检测，可以包括：连接的电压隔离单元和电压转换单元。
其中，电压隔离单元与开关引脚连接，用于获取开关引脚上的开关电压信号，以及隔离开关电压信号中的直流分量，向电压转换单元输出开关电压信号中的交流分量；电压转换单元用于对交流分量进行转换，输出信号，以指示电源芯片是否发生故障。
本实施例中，电压隔离单元用于采集开关引脚上的开关电压信号，并隔离开关电压信号中的直流分量，得到开关电压信号中的交流分量。电压转换电源用于对开关电压信号中的交流分量进行转换，得到可以指示电源芯片是否发生故障的信号。
可选地，电压隔离单元包括串联的隔离电容和支路电阻；
隔离电容未连接支路电阻的一端用于连接开关引脚，支路电阻未连接隔离电容的一端接地；
隔离电容与支路电阻之间的连接点连接电压转换单元，以向电压转换单元输出交流分量。
在一种实施例中，可以通过电容隔离开关电压信号中的直流分量。如图4所示，图4是本申请实施例提供的一种电源芯片检测电路的电路原理图，电源芯片检测电路200包括电压隔离单元和电压转换单元，电压隔离单元包括串联的隔离电容201和支路电阻202，隔离电容201未连接支路电阻202一端构成电压隔离单元的输入端，用于连接开关引脚，以采集开关引脚上的开关电压信号，隔离电容201的另一端连接支路电 阻202，隔离电容201用于隔离开关电压信号中的直流分量。支路电阻202未连接隔离电容201的一端接地，支路电阻202用于为开关电压信号中的交流分量提供电流支路，隔离电容201与支路电阻202之间的连接点构成电压隔离单元的输出端，用于输出开关电压信号中的交流分量。其中，电压隔离单元的具体结构可以根据需求灵活设置，本实施例对此不做限制。
示例性地，如图5所示，图5是本申请实施例提供的一种电源芯片检测电路的应用示意图，结合图2，开关电压信号为方波，开关电压信号可以波形分解为直流分量和交流分量。隔离电容201和支路电阻202组成电流支路，隔离电容201的一端连接开关引脚，隔离电容201可以隔离开关电压信号中的直流分量，使开关电压信号中的交流分量通过隔离电容201和支路电阻202组成的电流支路输出，此时在隔离电容201与支路电阻202之间的连接点上，可以采集到开关电压信号中的交流分量。
实际应用中，当采用电容和电阻串联而成的电流支路作为电压隔离单元时，电压隔离单元的电路结构简单，可以简化电源芯片检测电路的结构，并且可以降低电源芯片检测电路的成本。
可选地，电压转换单元包括串联的反向阻断元件和稳压电容；
反向阻断元件未连接稳压电容的一端连接电压隔离单元，稳压电容未连接反向阻断元件的一端接地；
反向阻断元件用于在交流分量为负值的情况下断开，以及在交流分量为正值的情况下导通，以在反向阻断元件与稳压电容之间的连接点输出直流电压信号。
本实施例中，可以通过反向阻断元件截取交流分量中的正电压，通过稳压电容对交流分量中的正电压进行稳压处理，得到可以指示电源芯片是否故障的直流电压信号。
可选地，反向阻断元件可以为图4和图5所示的二极管203，二极管203的阳极构成电压转换单元的输入端，用于连接电压隔离单元的输出端，以接收电压隔离单元输出的交流分量。二极管203的阴极与稳压电容204连接，稳压电容204未连接二极管203的一端接地。二极管203 与稳压电容204之间的连接点构成电压转换单元的输出端，用于输出稳定的直流电压信号。在图5所示的电路中，二极管203可以在交流分量为正值时导通，向稳压电容204输出交流分量中的正电压，反之在交流分量为负值时截止，实现对交流分量中正电压的截取。交流分量中的正电压输入稳压电容，在稳压电容的作用下，得到稳定的直流电压信号。其中，反向阻断元件也可以为三极管或直流开关等电子元件，本实施例对反向阻断元件的具体类型不做限制。
实际应用中，电压转换单元由反向阻断元件和稳压电容组成时，可以得到结构简单的电压转换单元，从而可以简化电源芯片检测电路的电路结构，并降低电源芯片检测电路的成本。
在一种实施例中，电压转换单元还用于连接控制器，以向控制器输出直流电压信号，使控制器在直流电压信号超出预设电压范围的情况下，确定电源芯片发生故障。如图5所示，控制器205的输入端可以连接二极管203和稳压电容204之间的连接点，以接收稳压得到的直流电压信号。控制器205在接收到直流电压信号之后，可以确定直流电压信号是否位于预设电压范围之内，确定电源芯片是否故障。
如图6所示，图6是图4所示电路原理图的仿真结果示意图，图4中的电压源300为模拟开关电压信号，第一坐标系601所示的电压为模拟开关电压信号的波形示意图，第二坐标系602所示的电压为电压隔离单元输出的交流分量的波形示意图，第三坐标系603所示的电压为电压转换单元输出的直流电压信号的波形示意图。在第一坐标系、第二坐标系和第三坐标系中，横坐标均为时间轴，纵坐标均为电压轴。其中，当电源芯片未发生故障时，开关电压信号为第一坐标系所示的5V的方波，开关电压信号经过电压隔离单元之后，得到第二坐标系所示的振幅为3V的交流电压，即开关电压信号中的交流分量；交流分量经过电压转换单元后，得到第三坐标系所示的2.4V的直流电压信号。而当电源芯片故障时，例如图1中的第一开关元件被击穿，此时开关电压信号中会出现振幅小于5V的方波，导致电压转换单元输出的直流电压信号较低，小于2.4V。或者，开关电压信号中会出现振幅高于5V的方波，导致电压转换单元输出的直流电压信号高于2.4V。
结合上述举例，若设置预设电压范围为2-5V，当控制器接收到小于2V或大于5V的直流电压信号时，可以确定电源芯片已损坏，为故障芯片。反之，若直流电压信号大于或等于2V、且小于或等于5V，则可以确定电源芯片未发生故障。其中，预设电压范围的具体数值可以根据需求设置，本实施例对此不做限制。需要说明的，电源芯片停止工作时，开关电压信号为0V，此时直流电压信号为0V。因此，当控制器接收到的直流电压信号为0V时，可以确定电源芯片已经停止工作。
在一种实施例中，控制器在控制电源芯片停止工作之后，若接收到的直流电压信号大于0V或小于0V，则说明电源芯片仍在工作，此时可以确定电源芯片不受控制器控制，发生故障。相反的，控制器在控制电源芯片工作时，若接收到的直流电压信号为0V，可以确定电源芯片停止工作，发生故障。
实际应用中，电子设备在确定电源芯片故障时，可以采取一定措施，对电子设备进行保护。例如，在电源芯片故障时，电子设备可以通过显示屏输出通知信息或者通过扬声器输出声音信息，通知用户电源芯片故障。或者，电子设备可以直接关闭故障的电源芯片，以及与电源芯片连接的其他芯片，保护电子设备。在一些情况下，电子设备还可以重启电子设备或关闭电子设备，以保护电子设备。
本实施例中，可以根据电源芯片未发生故障时，电源芯片检测电路输出的直流电压信号，确定预设电压范围。在图4所示的电路原理图中，电压隔离单元输出的电压V1与隔离电容的容量C1和支路电阻的阻值R1，以及与开关电压信号的电压V、占空比D和频率f相关。具体的，电压V对时间t的微分乘以隔离电容的容量C1等于流过隔离电容的电流i，具体计算公式如下：
Figure PCTCN2022083238-appb-000001
进一步的，根据电压、电阻和电流三者之间的关系，电压V1可以通过如下公式计算：
Figure PCTCN2022083238-appb-000002
进一步的，当开关电压信号的频率f较大时，电压V1可以通过如下公式计算：
Figure PCTCN2022083238-appb-000003
其中，ΔV表示单位时间内的电压，Δt表示单位时间。由上述公式可知，V1与R1、C1、f、V成正比，与D成反比，通过参数R1、C1、f、V和D，可以确定电压V1。在电源芯片未发生故障时，统计不同状态下的参数R1、C1、f、V和D，可以确定不同状态下的电压V1。进一步的，根据电压V1和电压转换单元的系数，可以确定电源芯片未发生故障时，电源芯片检测电路在不同状态下输出的直流电压信号，进一步的根据未发生故障时的直流电压信号，可以确定预设电压范围。例如，若电源芯片在未发生故障时，电源芯片检测电路输出的最小直流电压信号为2V，最大直流电压信号为5V，则可以确定预设电压范围为2-5V。
综上所述，本实施例中，电源芯片检测电路包括电压隔离单元和电压转换单元，电压隔离单元可以获取电源芯片中开关引脚上的开关电压信号，并隔离开关电压信号中的直流分量，得到开关电压信号中的交流分量，电压转换单元可以将交流分量转换为指示电源芯片是否发生故障的信号。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，通过信号可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
可选地，电压转换单元包括整流器，整流器的输入端连接电压隔离单元的输出端，整流器用于对交流分量进行整流，输出直流电压信号。
在一种实施例中，电压转换单元可以包括整流器。如图4和图5所示，整流器的输入端可以连接隔离电容和支路电阻之间的连接点，以接收开关电压信号中的交流分量。整流器在对交流分量进行整流之后，输出可以指示电源芯片是否故障的直流电压信号。其中，整流器的具体结构和类型可以根据需求设置，本实施例对此不做限制。
实际应用中，通过整流器对开关电压信号中的交流分量进行整流，可以使得到的直流电压信号更准确，从而可以更准确的确定电源芯片是 否故障。
可选地，电压转换单元包括电压转换子单元和电压比较子单元；
电压转换子单元用于对交流分量进行转换，输出直流电压；
电压比较子单元的输入端与电压转换子单元连接，以接收直流电压；电压比较子单元用于连接控制器，以及在比较确定直流电压超出预设电压范围的情况下，向控制器输出故障信号，以使控制器在接收到故障信号的情况下，确定电源芯片发生故障。
示例性地，如图7所示，图7是本申请实施例提供的另一种电源芯片检测电路的应用示意图，电压比较子单元可以为比较器206，比较器206的一个输入端连接二极管203和稳压电容204之间的连接点，以接收直流电压，比较器的另一个输入端用于连接预设范围内的电压值。比较器206的输出端可以连接控制器205的输入端，比较器206在接收到直流电压之后，可以比较直流电压与预设范围内的电压值，若直流电压不在预设电压范围内，则向控制器205输出高电平信号，高电平信号即故障信号。控制器在接收到高电平信号之后，可以确定电源芯片故障。相反的，当直流电压在预设电压范围之内时，比较器206可以向控制器205输出低电平信号，控制器在接收到低电平信号时，可以确定电源芯片正常。
实际应用中，通过电压比较子单元比较直流电压和预设范围内的电压值，确定电源芯片是否故障，并在电源芯片故障时向控制器发送故障信号，通知控制器电源芯片故障。控制器采集高电平信号的过程比采集模拟电压的速度快，因此向控制器发送故障信号的方式相对于向控制器发送直流电压的方式，可以更加快速的使控制器确定电源芯片是否故障。
参照图8，图8是本申请实施例提供的一种电源芯片检测方法的步骤流程图，应用于如上所述的电源芯片检测电路，该方法可以包括：
步骤801、电压隔离单元获取开关引脚上的开关电压信号。
步骤802、电压隔离单元隔离开关电压信号中的直流分量，并向电压转换单元输出开关电压信号中的交流分量。
步骤803、电压转换单元对交流分量进行转换，输出信号，以指示电 源芯片是否发生故障。
可选地，电压转换单元包括串联的反向阻断元件和稳压电容；
相应的，步骤803可以通过如下方式实现：
反向阻断元件截取交流分量中的正电压；
稳压电容对交流分量中的正电压进行稳压，输出直流电压信号。
可选地，电压转换单元包括整流器；
相应的，步骤803可以通过如下方式实现：
整流器对交流分量进行整流，输出直流电压信号。
可选地，电压转换单元包括连接的电压转换子单元和电压比较子单元；
相应的，步骤803可以通过如下方式实现：
电压转换子单元对交流分量进行转换，输出直流电压；
在通过电压比较子单元比较确定直流电压超出预设电压范围的情况下，向控制器输出故障信号，以使控制器在接收到故障信号的情况下，确定电源芯片发生故障。
其中，对电源芯片检测方法的理解可参考上述举例中的电源芯片检测电路，本实施例对此不做赘述。
综上所述，本实施例中，获取开关引脚上的开关电压信号，隔离开关电压信号中的直流分量，并向电压转换单元输出开关电压信号中的交流分量，通过电压转换单元对交流分量进行转换，输出信号，以指示电源芯片是否发生故障。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
参照图9，图9是本申请实施例提供的另一种电源芯片检测方法的步骤流程图，应用于上述实施例所述的电源芯片检测电路，该方法可以包括：
步骤901、获取电源芯片检测电路输出的信号。
步骤902、根据信号，确定电源芯片是否发生故障。
其中，步骤901和步骤902可以由图5和图7所示的控制器205执行，控制器205可以获取电源芯片检测电路200输出的信号，根据信号 确定电源芯片是否故障。
综上所述，本实施例中，控制器可以获取电源芯片检测电路输出的信号，根据信号确定电源芯片是否发生故障。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
需要说明的是，本申请实施例提供的电源芯片检测方法，执行主体可以为通电源芯片检测装置，或者该电源芯片检测装置中的用于执行电源芯片检测方法的控制模块。本申请实施例中以电源芯片检测装置执行电源芯片检测方法为例，说明本申请实施例提供的电源芯片检测装置。
参照图10，图10是本申请实施例提供的一种电源芯片检测装置的结构示意图，该装置1000可以包括：
获取模块1001，用于获取电源芯片检测电路输出的信号；
判断模块1002，用于根据信号，确定电源芯片是否发生故障。
综上所述，本实施例中，控制器可以获取电源芯片检测电路输出的信号，根据信号确定电源芯片是否发生故障。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
可选地，如图11所示，图11是根据一示例性实施例提供的一种电子设备的结构示意图，电子设备1100包括处理器1101，存储器1102，存储在存储器1102上并可在所述处理器1101上运行的程序或指令，该程序或指令被处理器1101执行时实现上述电源芯片检测方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
需要说明的是，本申请实施例中的电子设备包括上述所述的移动电子设备和非移动电子设备。
图12是根据一示例性实施例提供的一种电子设备的硬件结构示意图。
该电子设备1200包括但不限于：射频单元1201、网络模块1202、音频输出单元1203、输入单元1204、传感器1205、显示单元1206、用 户输入单元1207、接口单元1208、存储器1209、以及处理器1210等部件。
本领域技术人员可以理解，电子设备1200还可以包括给各个部件供电的电源(比如电池)，电源可以通过电源管理系统与处理器1210逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。图12中示出的电子设备结构并不构成对电子设备的限定，电子设备可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置，在此不再赘述。
其中，处理器1210，用于获取电源芯片检测电路输出的信号；
根据信号，确定电源芯片是否发生故障。
综上所述，本实施例中，获取电源芯片检测电路输出的信号，根据信号确定电源芯片是否发生故障。通过电源芯片检测电路将开关电压信号中的交流分量转换为可以指示电源芯片是否故障的信号，可以准确确定电源芯片是否发生故障，从而可以解决无法确定电源芯片是否故障的问题。
在本发明实施例中，电子设备接收对应用程序图标的第一输入，响应于第一输入，显示与应用程序图标对应的消息预览窗口。消息预览窗口中包括应用程序图标所属应用程序接收的至少一个通知消息中的目标内容。当通知栏中显示的通知消息较多时，用户可以操作应用程序图标，显示与应用程序对应的消息预览窗口，通过消息预览窗口预览应用程序接收到的通知消息，可以避免在通知栏中查找通知消息，避免浪费时间。
应理解的是，本申请实施例中，输入单元1204可以包括图形处理器(Graphics Processing Unit，GPU)12041和麦克风12042，图形处理器12041对在视频捕获模式或图像捕获模式中由图像捕获装置(如摄像头)获得的静态图片或视频的图像数据进行处理。显示单元1206可包括显示面板12061，可以采用液晶显示器、有机发光二极管等形式来配置显示面板12061。用户输入单元1207包括触控面板12071以及其他输入设备12072。触控面板12071，也称为触摸屏。触控面板12071可包括触摸检测装置和触摸控制器两个部分。其他输入设备12072可以包括但不限于 物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆，在此不再赘述。存储器1209可用于存储软件程序以及各种数据，包括但不限于应用程序和操作系统。处理器1210可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器1210中。
本申请实施例还提供一种可读存储介质，所述可读存储介质上存储有程序或指令，该程序或指令被处理器执行时实现上述电源芯片检测方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
其中，所述处理器为上述实施例中所述的电子设备中的处理器。所述可读存储介质，包括计算机可读存储介质，如计算机只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等。
本申请实施例另提供了一种芯片，所述芯片包括处理器和通信接口，所述通信接口和所述处理器耦合，所述处理器用于运行程序或指令，实现上述电源芯片检测方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
应理解，本申请实施例提到的芯片还可以称为系统级芯片、系统芯片、芯片系统或片上系统芯片等。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另 外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以计算机软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (13)

  1. 一种电源芯片检测电路，所述电源芯片具有开关引脚，包括连接的电压隔离单元和电压转换单元；
    所述电压隔离单元与所述开关引脚连接，用于获取所述开关引脚上的开关电压信号，以及隔离所述开关电压信号中的直流分量，向所述电压转换单元输出所述开关电压信号中的交流分量；
    所述电压转换单元用于对所述交流分量进行转换，输出信号，以指示所述电源芯片是否发生故障。
  2. 根据权利要求1所述的电源芯片检测电路，其中，所述电压隔离单元包括串联的隔离电容和支路电阻；
    所述隔离电容未连接所述支路电阻的一端用于连接所述开关引脚，所述支路电阻未连接所述隔离电容的一端接地；
    所述隔离电容与所述支路电阻之间的连接点连接所述电压转换单元，以向所述电压转换单元输出所述交流分量。
  3. 根据权利要求1所述的电源芯片检测电路，其中，所述电压转换单元包括串联的反向阻断元件和稳压电容；
    所述反向阻断元件未连接所述稳压电容的一端连接所述电压隔离单元，所述稳压电容未连接所述反向阻断元件的一端接地；
    所述反向阻断元件用于在所述交流分量为负值的情况下断开，以及在所述交流分量为正值的情况下导通，以在所述反向阻断元件与所述稳压电容之间的连接点输出直流电压信号。
  4. 根据权利要求1所述的电源芯片检测电路，其中，所述电压转换单元包括整流器，所述整流器的输入端连接所述电压隔离单元的输出端，所述整流器用于对所述交流分量进行整流，输出直流电压信号。
  5. 根据权利要求1所述的电源芯片检测电路，其中，所述电压转换单元包括电压转换子单元和电压比较子单元；
    所述电压转换子单元用于对所述交流分量进行转换，输出直流电压；
    所述电压比较子单元的输入端与所述电压转换子单元连接，以接收所述直流电压；所述电压比较子单元用于连接控制器，以及在比较确定 所述直流电压超出预设电压范围的情况下，向所述控制器输出故障信号，以使所述控制器在接收到所述故障信号的情况下，确定所述电源芯片发生故障。
  6. 根据权利要求3或4所述的电源芯片检测电路，其中，所述电压转换单元还用于连接控制器，以向所述控制器输出所述直流电压信号，使所述控制器在所述直流电压信号超出预设电压范围的情况下，确定所述电源芯片发生故障。
  7. 一种电源芯片检测方法，应用于如权利要求1-6任一项所述的电源芯片检测电路，所述电源芯片具有开关引脚，所述方法包括：
    电压隔离单元获取所述开关引脚上的开关电压信号；
    所述电压隔离单元隔离所述开关电压信号中的直流分量，并向电压转换单元输出所述开关电压信号中的交流分量；
    所述电压转换单元对所述交流分量进行转换，输出信号，以指示所述电源芯片是否发生故障。
  8. 根据权利要求7所述的方法，其中，所述电压转换单元包括串联的反向阻断元件和稳压电容；
    所述电压转换单元对所述交流分量进行转换，输出信号，包括：
    所述反向阻断元件截取所述交流分量中的正电压；
    所述稳压电容对所述交流分量中的正电压进行稳压，输出直流电压信号。
  9. 根据权利要求7所述的方法，其中，所述电压转换单元包括整流器；
    所述电压转换单元对所述交流分量进行转换，输出信号，包括：
    所述整流器对所述交流分量进行整流，输出直流电压信号。
  10. 根据权利要去7-9中任一项所述的方法，其中，所述电压转换单元包括连接的电压转换子单元和电压比较子单元；
    所述电压转换单元对所述交流分量进行转换，输出信号，包括：
    所述电压转换子单元对所述交流分量进行转换，输出直流电压；
    在通过所述电压比较子单元比较确定所述直流电压超出预设电压范围的情况下，向所述控制器输出故障信号，以使所述控制器在接收到所 述故障信号的情况下，确定所述电源芯片发生故障。
  11. 一种电源芯片检测方法，应用于如权利要求1-6任一项所述的电源芯片检测电路，所述方法包括：
    获取电源芯片检测电路输出的信号；
    根据所述信号，确定所述电源芯片是否发生故障。
  12. 一种电源芯片检测装置，应用于如权利要求1-6任一项所述的电源芯片检测电路，所述装置包括：
    获取模块，用于获取电源芯片检测电路输出的信号；
    判断模块，用于根据所述信号，确定所述电源芯片是否发生故障。
  13. 一种电子设备，包括如权利要求1-6中任一项所述的电源芯片检测电路，或如权利要求12中所述的电源芯片检测装置。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116168458A (zh) * 2023-02-07 2023-05-26 南京新城现代有轨电车有限公司 一种用于轨道交通afc系统的检测模拟系统
CN116224041A (zh) * 2023-04-26 2023-06-06 深蓝汽车科技有限公司 一种检测多个电源芯片的方法、装置、电子设备及介质
CN116539924A (zh) * 2023-03-30 2023-08-04 摩尔线程智能科技(北京)有限责任公司 芯片测试底板、系统及方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113075534B (zh) * 2021-03-31 2023-07-14 维沃移动通信有限公司 电源芯片检测电路、电源芯片检测方法、装置和电子设备
CN114791559A (zh) * 2022-04-28 2022-07-26 浪潮(山东)计算机科技有限公司 一种电源管理芯片的测试方法、系统及相关组件
CN114995254B (zh) * 2022-06-24 2025-03-21 北京小马智卡科技有限公司 隔离电路和车辆

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228407A (ja) * 2001-02-02 2002-08-14 Omron Corp フェイルセーフ機能付き近接センサ
JP2006349640A (ja) * 2005-06-20 2006-12-28 Fuji Xerox Co Ltd 故障診断装置および方法
CN1908680A (zh) * 2005-08-05 2007-02-07 鸿富锦精密工业（深圳）有限公司 浪涌电流测试电路
JP2009303427A (ja) * 2008-06-16 2009-12-24 Mitsutoyo Corp モータ駆動装置
CN203396920U (zh) * 2013-07-23 2014-01-15 浙江海洋学院 手持式交流串入直流回路监测报警装置
CN203595753U (zh) * 2013-11-15 2014-05-14 新乡市景弘电气有限公司 一种直流电源的交流分量检测装置
CN103869262A (zh) * 2014-03-24 2014-06-18 上海航天电子通讯设备研究所 一种运载火箭二次电源的测量装置
CN104090245A (zh) * 2014-04-03 2014-10-08 大连科海测控技术有限公司 一种直流供电系统交流电混入的检测装置
CN204287447U (zh) * 2014-12-11 2015-04-22 深圳市金威源科技股份有限公司 一种交直流输入检测电路
CN106707196A (zh) * 2017-02-20 2017-05-24 广西电网有限责任公司北海供电局 一种便携移动式交流窜入故障检测定位装置
CN206945928U (zh) * 2017-02-20 2018-01-30 广西电网有限责任公司北海供电局 一种便携移动式交流窜入故障检测定位装置
CN113075534A (zh) * 2021-03-31 2021-07-06 维沃移动通信有限公司 电源芯片检测电路、电源芯片检测方法、装置和电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202178715U (zh) * 2011-08-03 2012-03-28 深圳市富满电子有限公司南山分公司 一种ac-dc电源转换芯片及电源转换电路
CN202975143U (zh) * 2012-12-21 2013-06-05 常熟开关制造有限公司(原常熟开关厂） 一种自动转换开关电器的检测电路

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228407A (ja) * 2001-02-02 2002-08-14 Omron Corp フェイルセーフ機能付き近接センサ
JP2006349640A (ja) * 2005-06-20 2006-12-28 Fuji Xerox Co Ltd 故障診断装置および方法
CN1908680A (zh) * 2005-08-05 2007-02-07 鸿富锦精密工业（深圳）有限公司 浪涌电流测试电路
JP2009303427A (ja) * 2008-06-16 2009-12-24 Mitsutoyo Corp モータ駆動装置
CN203396920U (zh) * 2013-07-23 2014-01-15 浙江海洋学院 手持式交流串入直流回路监测报警装置
CN203595753U (zh) * 2013-11-15 2014-05-14 新乡市景弘电气有限公司 一种直流电源的交流分量检测装置
CN103869262A (zh) * 2014-03-24 2014-06-18 上海航天电子通讯设备研究所 一种运载火箭二次电源的测量装置
CN104090245A (zh) * 2014-04-03 2014-10-08 大连科海测控技术有限公司 一种直流供电系统交流电混入的检测装置
CN204287447U (zh) * 2014-12-11 2015-04-22 深圳市金威源科技股份有限公司 一种交直流输入检测电路
CN106707196A (zh) * 2017-02-20 2017-05-24 广西电网有限责任公司北海供电局 一种便携移动式交流窜入故障检测定位装置
CN206945928U (zh) * 2017-02-20 2018-01-30 广西电网有限责任公司北海供电局 一种便携移动式交流窜入故障检测定位装置
CN113075534A (zh) * 2021-03-31 2021-07-06 维沃移动通信有限公司 电源芯片检测电路、电源芯片检测方法、装置和电子设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116168458A (zh) * 2023-02-07 2023-05-26 南京新城现代有轨电车有限公司 一种用于轨道交通afc系统的检测模拟系统
CN116539924A (zh) * 2023-03-30 2023-08-04 摩尔线程智能科技(北京)有限责任公司 芯片测试底板、系统及方法
CN116224041A (zh) * 2023-04-26 2023-06-06 深蓝汽车科技有限公司 一种检测多个电源芯片的方法、装置、电子设备及介质

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